Resin composition

Abstract

To provide a resin composition that makes it possible to obtain a cured product having excellent laminate, dielectric, and adhesion properties; a resin sheet containing the resin composition; a printed wiring board having an insulating layer formed using the resin composition; and a semiconductor device.SOLUTION: A resin composition contains (A) a maleimide compound having a biphenyl structure, (B) a liquid or semisolid curing agent and (C) a high molecular weight component.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin composition. The present invention further relates to a resin sheet, a printed wiring board, and a semiconductor device obtained by using the resin composition. [Background technology]

[0002] 2. Description of the Related Art A known manufacturing technique for printed wiring boards is a build-up method in which insulating layers and conductor layers are alternately stacked.

[0003] As an insulating material for a printed wiring board used in such an insulating layer, for example, Patent Document 1 discloses a resin composition. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-053092 A DISCLOSURE OF THEINVENTION [Problem to be solved by the invention]

[0005] In recent years, there has been a demand for further improvements in the dielectric properties of insulating layers, such as the dielectric constant and dielectric loss tangent, as well as further improvements in adhesion, including peel strength and copper foil peel strength, between insulating layers and conductor layers formed by plating.

[0006] In general, when a maleimide compound is contained in a resin composition, the dielectric properties become excellent, but since maleimide compounds usually have a high softening point, when a maleimide compound is contained in a resin composition, the resin composition and its cured product become brittle. Also, when a resin sheet containing a resin composition containing a maleimide compound is laminated on a substrate having an uneven surface to form an insulating layer, the surface of the insulating layer opposite to the substrate may follow the unevenness of the substrate, reducing the flatness of the insulating layer and resulting in poor lamination properties.

[0007] An object of the present invention is to provide a resin composition which is excellent in lamination properties and which can give a cured product which is excellent in dielectric properties and adhesion; a resin sheet containing the resin composition; and a printed wiring board and a semiconductor device which are provided with an insulating layer formed using the resin composition. [Means for solving the problem]

[0008] As a result of intensive investigations into the above-mentioned problems, the present inventors have found that the above-mentioned problems can be solved by incorporating a specific maleimide compound, a liquid or semi-solid curing agent, and a high molecular weight component, and have thus completed the present invention.

[0009] That is, the present invention includes the following. [1] (A) a maleimide compound having a biphenyl structure, (B) a liquid or semi-solid hardener, and (C) A resin composition comprising a high molecular weight component. [2] The resin composition according to [1], wherein the component (A) is represented by the following formula (A-3): [ka] In formula (A-3), R 3 and R 8 represents a maleimide group, and R 4 , R 5 , R 6 and R 7 each independently represents a hydrogen atom, an alkyl group, or an aryl group; R 9 and R 10 each independently represents a substituent. a1 and b1 each independently represents an integer of 0 to 4, m1 and m2 each independently represents an integer of 1 to 10, and n represents an integer of 1 to 100. [3] The resin composition according to [1] or [2], wherein the content of component (A) is 10% by mass or more and 40% by mass or less, when the total amount of non-volatile components in the resin composition is 100% by mass. [4] The resin composition according to any one of [1] to [3], wherein the component (B) is at least one selected from the group consisting of an amine-based non-solid curing agent, a (meth)acrylic-based non-solid curing agent, an allyl-based non-solid curing agent, a maleimide-based non-solid curing agent, and a butadiene-based non-solid curing agent. [5] The resin composition according to [4], wherein the component (B) is at least one of an allyl-based non-solid curing agent and a maleimide-based non-solid curing agent. [6] The resin composition according to any one of [1] to [5], wherein the content of component (B) is 0.1% by mass or more and 15% by mass or less, when the total amount of non-volatile components in the resin composition is 100% by mass. [7] The resin composition according to any one of [1] to [6], wherein the component (C) is a thermoplastic resin. [8] The resin composition according to [7], wherein the thermoplastic resin is at least one selected from the group consisting of polyimide resins, polycarbonate resins, and phenoxy resins. [9] The resin composition according to any one of [1] to [8], wherein the content of component (C) is 0.5% by mass or more and 10% by mass or less, when the total amount of non-volatile components in the resin composition is 100% by mass.

[10] The resin composition according to any one of [1] to [9], further comprising (D) an inorganic filler.

[11] The resin composition according to

[10] , wherein the content of the (D) component is 50 mass% or more, relative to 100 mass% of the non-volatile components in the resin composition.

[12] The resin composition according to any one of [1] to

[11] , which is for forming an insulating layer.

[13] The resin composition according to any one of [1] to

[12] , which is for forming an insulating layer for forming a conductor layer.

[14] A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition layer comprising the resin composition according to any one of [1] to

[13] .

[15] A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of [1] to

[13] .

[16] A semiconductor device comprising the printed wiring board according to

[15] . Effect of the Invention

[0010] According to the present invention, it is possible to provide a resin composition which is capable of giving a cured product having excellent lamination properties, dielectric properties, and adhesion; a resin sheet containing the resin composition; a printed wiring board having an insulating layer formed using the resin composition, and a semiconductor device. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic side view showing an example of two test tubes used to determine whether a thermosetting resin is in a liquid state, a semi-solid state, or a solid state. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The present invention will be described in detail below with reference to preferred embodiments. However, the present invention is not limited to the following embodiments and examples, and can be modified and implemented as desired without departing from the scope of the claims of the present invention and their equivalents.

[0013] [Resin composition] The resin composition of the present invention contains (A) a maleimide compound having a biphenyl structure, (B) a liquid or semi-solid curing agent (hereinafter, the liquid or semi-solid curing agent is appropriately referred to as a "non-solid curing agent"), and (C) a high molecular weight component. In the present invention, by containing the components (A) to (C), a cured product having excellent lamination properties, dielectric properties, and adhesion can be obtained.

[0014] The resin composition may further contain optional components in combination with the components (A) to (C). Examples of the optional components include an inorganic filler (D), a curing agent (E), a curing accelerator (F), an epoxy resin (G), a polymerization initiator (H), and other additives (I). Each component contained in the resin composition will be described in detail below.

[0015] <(A) Maleimide compound having a biphenyl structure> The resin composition contains, as component (A), a maleimide compound having a biphenyl-type structure. By including component (A) in the resin composition, it becomes possible to obtain a cured product with excellent dielectric properties. Component (A) may be used alone or in combination of two or more.

[0016] Component (A) is a compound containing a maleimide group represented by the following formula (A-1) in the molecule. Further, from the viewpoint of obtaining a cured product with excellent dielectric properties, component (A) has a biphenyl-type structure. The biphenyl-type structure is a structure represented by the following formula (A-2).

Chemical formula

Chemical formula

[0017] R 1 and R 2 Examples of the substituents represented by include a halogen atom, -OH, -O-C 1-10 alkyl group, -N(C 1-10 alkyl group)2, C 1-10 alkyl group, C 6-10 aryl group, -NH2, -CN, -C(O)O-C 1-10 alkyl group, -COOH, -C(O)H, -NO2, etc. Here, the term "C x-y " (x and y are positive integers and x < y) means that the number of carbon atoms of the organic group described immediately after this term is x to y. For example, the expression "C 1-10 alkyl group" indicates an alkyl group having 1 to 10 carbon atoms. These substituents may be bonded to each other to form a ring, and the ring structure includes a spiro ring and a condensed ring.

[0018] The above-mentioned substituents may further have a substituent (hereinafter, sometimes referred to as a "secondary substituent"). Unless otherwise specified, the secondary substituent may be the same as the above-mentioned substituent.

[0019] a and b each independently represent an integer of 0 to 4, preferably an integer of 0 to 3, more preferably 0 or 1, and even more preferably 0.

[0020] From the viewpoint of obtaining a cured product with excellent dielectric properties, it is preferable that both ends of the component (A) be maleimide groups.

[0021] From the viewpoint of obtaining a cured product with excellent dielectric properties, the (A) component preferably has either an aliphatic hydrocarbon group or an aromatic hydrocarbon group in addition to the biphenyl structure, and more preferably has both an aliphatic hydrocarbon group and an aromatic hydrocarbon group. The term "aromatic hydrocarbon group" means a hydrocarbon group containing an aromatic ring. However, the aromatic hydrocarbon group does not necessarily have to be composed of only aromatic rings, and may contain a chain structure or an alicyclic hydrocarbon group as a part thereof, and the aromatic ring may be any one of a monocyclic, polycyclic, and heterocyclic ring.

[0022] The aliphatic hydrocarbon group is preferably a divalent aliphatic hydrocarbon group, more preferably a divalent saturated aliphatic hydrocarbon group, and further preferably an alkylene group. The alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, further preferably an alkylene group having 1 to 3 carbon atoms, and particularly preferably a methylene group.

[0023] The aromatic hydrocarbon group is preferably a divalent aromatic hydrocarbon group, more preferably an arylene group or an aralkylene group, and even more preferably an arylene group. The arylene group is preferably an arylene group having 6 to 30 carbon atoms, more preferably an arylene group having 6 to 20 carbon atoms, and even more preferably an arylene group having 6 to 10 carbon atoms. Examples of such an arylene group include a phenylene group, a naphthylene group, an anthracenylene group, and a biphenylene group. The aralkylene group is preferably an aralkylene group having 7 to 30 carbon atoms, more preferably an aralkylene group having 7 to 20 carbon atoms, and even more preferably an aralkylene group having 7 to 15 carbon atoms. Examples of such an aralkylene group include a benzylene group and a group having a biphenylene-methylene structure. Among these, a phenylene group, a benzylene group, and a group having a biphenylene-methylene structure are preferred, and a phenylene group is more preferred.

[0024] From the viewpoint of obtaining a cured product with excellent dielectric properties, the number of maleimide groups per molecule in component (A) is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more, and is preferably 10 or less, more preferably 6 or less, and even more preferably 3 or less.

[0025] In order to prominently obtain the desired effects of the present invention, it is preferred that the nitrogen atom of the maleimide group in component (A) be directly bonded to the aromatic hydrocarbon group, where the term "directly" means that there is no other group between the nitrogen atom of the maleimide group and the aromatic hydrocarbon group.

[0026] The component (A) preferably has a structure represented by the following formula (A-3), for example. [ka] In formula (A-3), R 3 and R 8 represents a maleimide group, and R 4 , R 5 , R 6 and R 7each independently represents a hydrogen atom, an alkyl group, or an aryl group; R 9 and R 10 each independently represents a substituent. a1 and b1 each independently represents an integer of 0 to 4, m1 and m2 each independently represents an integer of 1 to 10, and n represents an integer of 1 to 100.

[0027] R 4 , R 5 , R 6 and R 7 each independently represents a hydrogen atom, an alkyl group, or an aryl group, and is preferably a hydrogen atom.

[0028] R 4 , R 5 , R 6 and R 7 The alkyl group in is preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, and further preferably an alkyl group having 1 to 3 carbon atoms. The alkyl group may be linear, branched, or cyclic. Examples of such alkyl groups include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, and an isopropyl group.

[0029] R 4 , R 5 , R 6 and R 7 The aryl group in is preferably an aryl group having 6 to 20 carbon atoms, more preferably an aryl group having 6 to 15 carbon atoms, and further preferably an aryl group having 6 to 10 carbon atoms. The aryl group may be a single ring or a condensed ring. Examples of such aryl groups include a phenyl group, a naphthyl group, and an anthracenyl group.

[0030] R 4 , R 5 , R 6 and R 7 The alkyl group and the aryl group in the formula (A-2) may have a substituent. 1 is the same as:

[0031] R 9 and R 10 each independently represents a substituent, and R in formula (A-2) 1 and R 2 is the same as:

[0032] a1 and b1 each independently represent an integer of 0 to 4 and are the same as a and b in formula (A-2).

[0033] m1 and m2 each independently represent an integer of 1 to 10, preferably 1 to 6, more preferably 1 to 3, even more preferably 1 or 2, and still more preferably 1.

[0034] n represents an integer of 1 to 100, preferably 1 to 50, more preferably 1 to 20, and further preferably 1 to 5.

[0035] R 3 and R 8 R represents a maleimide group, and the maleimide group is directly bonded to an aromatic hydrocarbon group. 3 and R 8 The maleimide group represented by is bonded to an aromatic hydrocarbon group (CH2) m1 or (CH2) m2 Based on the above, it is preferably directly bonded to any one of the ortho, meta, and para positions, and more preferably directly bonded to the para position.

[0036] The component (A) preferably has a structure represented by formula (A-4). [ka] In formula (A-4), R 11 and R 16 represents a maleimide group, and R 12 , R 13 , R 14 and R 15 each independently represents a hydrogen atom, an alkyl group, or an aryl group. m3 and m4 each independently represent an integer of 1 to 10, and n1 represents an integer of 1 to 100.

[0037] R 11 and R 16 represents a maleimide group, and R in formula (A-3) 3 , R 8 is the same as:

[0038] R 12 , R 13 , R 14 and R 15 each independently represents a hydrogen atom, an alkyl group, or an aryl group; 4 , R 5 , R 6 and R 7 is the same as:

[0039] m3 and m4 each independently represent an integer of 1 to 10 and are the same as m1 and m2 in formula (A-3).

[0040] n1 represents an integer of 1 to 100 and is the same as n in formula (A-3).

[0041] The component (A) preferably has a structure represented by formula (A-5). [ka] In formula (A-5), R 17 and R 18 represents a maleimide group. n2 represents an integer of 1 to 100.

[0042] R 17 and R 18 represents a maleimide group, and R in formula (A-3) 3 , R 8 is the same as:

[0043] n2 represents an integer of 1 to 100 and is the same as n in formula (A-3).

[0044] The component (A) may be a commercially available product, such as "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.

[0045] From the viewpoint of obtaining a cured product having excellent dielectric properties, the content of the (A) component is preferably 10% by mass or more, more preferably 20% by mass or more, and even more preferably 25% by mass or more, and is preferably 40% by mass or less, more preferably 35% by mass or less, and even more preferably 30% by mass or less, when the nonvolatile components in the resin composition are taken as 100% by mass. In the present invention, the content of each component in the resin composition is the value when the nonvolatile components in the resin composition are taken as 100% by mass, unless otherwise specified.

[0046] <(B) Liquid or semi-solid hardener> The resin composition contains a liquid or semi-solid curing agent (B) as the component (B). By including the component (B) in the resin composition, it becomes possible to improve lamination properties, and it becomes possible to obtain a cured product with excellent adhesion. The component (B) may be used alone or in combination of two or more kinds.

[0047] Here, the determination of liquid, semi-solid, and solid is made in accordance with the "Method of Confirming Liquid State" in Appendix 2 of the Ministerial Ordinance on the Testing and Properties of Hazardous Materials (Ministry of Home Affairs Ordinance No. 1 of 1989). The specific determination method is as follows.

[0048] (1) Equipment Thermostatic water bath: Use a container equipped with an agitator, heater, thermometer, and automatic temperature controller (capable of controlling temperature to within ±0.1°C) and with a depth of 150 mm or more. In assessing the thermosetting resins used in the examples described below, a combination of a low-temperature constant temperature water bath (model BU300) and an input type thermostat Thermomate (model BF500), all manufactured by Yamato Scientific Co., Ltd., was used. Approximately 22 liters of tap water was placed into the low-temperature constant temperature water bath (model BU300), the Thermomate (model BF500) attached to it was turned on and set to the set temperature (20°C or 60°C), and the water temperature was fine-tuned using the Thermomate (model BF500) to within ±0.1°C of the set temperature; however, any device capable of similar adjustments can be used.

[0049] Test tube: The test tubes used are cylindrical, flat-bottomed transparent glass tubes with an inner diameter of 30 mm and a height of 120 mm, as shown in Fig. 1, with marked lines 11A and 12B at heights of 55 mm and 85 mm from the bottom of the tube, respectively, and a test tube 10a for liquid determination, with the mouth of the test tube sealed with a rubber stopper 13a, and a test tube 10b for temperature measurement, with the mouth of the test tube sealed with a rubber stopper 13b of the same size and marked lines with a hole in the center for inserting and supporting a thermometer, and a thermometer 14 inserted into the rubber stopper 13b. Hereinafter, the marked line at a height of 55 mm from the bottom of the tube will be referred to as "line A", and the marked line at a height of 85 mm from the bottom of the tube will be referred to as "line B". As the thermometer 14, a thermometer for measuring the freezing point (SOP-58 scale range 0 to 100°C) as specified in JIS B7410 (1982) "Glass thermometer for testing petroleum products" is used, but any thermometer that can measure temperatures in the range of 0 to 100°C will do.

[0050] (2) Test procedure The sample that has been left for 24 hours or more under atmospheric pressure at a temperature of 60±5°C is poured into the liquid determination test tube 10a shown in Figure 1(a) and the temperature measurement test tube 10b shown in Figure 1(b) up to the 11A line. The two test tubes 10a and 10b are placed upright in a low-temperature constant temperature water bath so that the 12B line is below the water surface. The thermometer is placed so that its bottom end is 30 mm below the 11A line. After the sample temperature reaches the set temperature ±0.1° C., maintain the state for 10 minutes. After 10 minutes, remove the liquid state determination test tube 10a from the low-temperature constant temperature water bath and immediately lay it horizontally on a horizontal test table. Use a stopwatch to measure and record the time it takes for the tip of the liquid level in the test tube to move from line 11A to line 12B.

[0051] Similarly, for samples that have been left for 24 hours or more under atmospheric pressure at a temperature of 20±5°C, the test is carried out in the same manner as for samples that have been left for 24 hours or more under atmospheric pressure at a temperature of 60±5°C, and the time it takes for the tip of the liquid level in the test tube to move from line 11A to line 12B is measured and recorded with a stopwatch.

[0052] At 20°C, a liquid is determined to be in a state where the measurement time is within 90 seconds. A sample that has a measured time of more than 90 seconds at 20°C and 90 seconds or less at 60°C is judged to be semi-solid. At 60°C, a specimen that lasts for more than 90 seconds is considered to be in a solid state.

[0053] As the component (B), a liquid or semi-solid agent having the function of curing the component (A) can be used. As such a non-solid curing agent, for example, at least one selected from an allyl-based non-solid curing agent, a maleimide-based non-solid curing agent, a (meth)acrylic-based non-solid curing agent, an amine-based non-solid curing agent, and a butadiene-based non-solid curing agent is preferable, and at least one of an allyl-based non-solid curing agent and a maleimide-based non-solid curing agent is more preferable.

[0054] The allyl-based non-solid curing agent is a liquid or semi-solid compound having at least one allyl group in the molecule. The allyl group reacts with the maleimide group in the (A) component and has the function of curing the (A) component. The allyl-based non-solid curing agent preferably has one or more allyl groups per molecule, more preferably has two or more allyl groups. There is no particular lower limit, but it can be preferably 10 or less, more preferably 5 or less.

[0055] In addition, from the viewpoint of obtaining the desired effect of the present invention significantly, the allyl-based non-solid curing agent preferably has, in addition to the allyl group, any one of a benzoxazine ring, a phenol ring, an epoxy group, and a carboxylic acid derivative having a cyclic structure, and from the viewpoint of obtaining the desired effect of the present invention more significantly, it is more preferable that the allyl-based non-solid curing agent has a benzoxazine ring.

[0056] In the allyl-based non-solid curing agent having a benzoxazine ring, from the viewpoint of significantly obtaining the desired effects of the present invention, the allyl group is preferably bonded to either a nitrogen atom constituting the benzoxazine ring or a carbon atom constituting the benzoxazine ring, and more preferably bonded to a carbon atom.

[0057] The allyl-based non-solid curing agent having a benzoxazine ring is preferably, for example, an allyl-based non-solid curing agent having a benzoxazine ring represented by the following formula (B-1). [ka] In formula (B-1), R 20 , and R 21 represents an allyl group, and R 22 represents a q-valent group, where q represents an integer of 1 to 4, p1 represents an integer of 0 to 4, and p2 represents an integer of 0 to 2.

[0058] R 22 The q-valent group represented by R is preferably an allyl group, a q-valent aromatic hydrocarbon group, a q-valent aliphatic hydrocarbon group, an oxygen atom, or a q-valent group consisting of a combination thereof. 22 When R has an allyl group, the allyl group may be a substituent of either a q-valent aromatic hydrocarbon group or a q-valent aliphatic hydrocarbon group. For example, when q is 2, R 22 is preferably an arylene group, an alkylene group, an oxygen atom, or a group consisting of a combination of two or more of these divalent groups, more preferably an arylene group or a group consisting of a combination of two or more of these divalent groups, and even more preferably a group consisting of a combination of two or more of these divalent groups.

[0059] R 22 The arylene group in is preferably an arylene group having 6 to 20 carbon atoms, more preferably an arylene group having 6 to 15 carbon atoms, and further preferably an arylene group having 6 to 12 carbon atoms. Specific examples of the arylene group include a phenylene group, a naphthylene group, an anthracenylene group, and a biphenylene group, and the phenylene group is preferred.

[0060] R 22The alkylene group in is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, and further preferably an alkylene group having 1 to 3 carbon atoms. Specific examples of the alkylene group include a methylene group, an ethylene group, and a propylene group, and a methylene group is preferred.

[0061] R 22 Examples of the group consisting of a combination of two or more types of divalent groups in the above formula include a group in which one or more arylene groups are bonded to one or more oxygen atoms; a group in which one or more arylene groups are bonded to one or more alkylene groups, such as a group having an arylene-alkylene-arylene structure; a group in which one or more alkylene groups are bonded to one or more oxygen atoms; a group in which one or more arylene groups, one or more alkylene groups, and one or more oxygen atoms are bonded to one or more oxygen atoms; and the like. Of these, a group in which one or more arylene groups are bonded to one or more oxygen atoms and a group in which one or more arylene groups are bonded to one or more alkylene groups are preferred.

[0062] q represents an integer of 1 to 4, preferably an integer of 1 to 3, and more preferably 1 or 2.

[0063] p1 represents an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 0 or 1, and further preferably 1. p2 represents an integer of 0 to 2, preferably 0 or 1, and further preferably 0.

[0064] Examples of the allyl-based non-solid curing agent having a phenol ring include a cresol resin containing an allyl group, a novolac-type phenol resin containing an allyl group, a cresol novolac resin containing an allyl group, etc. Among them, the allyl-based non-solid curing agent having a phenol ring is preferably an allyl-based non-solid curing agent having a phenol ring represented by the following formula (B-2). [ka] In formula (B-2), R 23 , R 24 , and R 25each independently represents an allyl group, each s1 independently represents an integer of 0 to 4, each s2 independently represents an integer of 0 to 3, and r independently represents an integer of 0 to 3.

[0065] R 23 ~R 25 each independently represents an allyl group. In formula (B-2), the number of allyl groups is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more, and is preferably 25 or less, more preferably 10 or less, and even more preferably 5 or less.

[0066] Each s1 independently represents an integer of 0 to 4, preferably an integer of 1 to 3, and more preferably an integer of 1 to 2.

[0067] Each s2 independently represents an integer of 0 to 3, preferably an integer of 1 to 3, and more preferably an integer of 1 to 2.

[0068] r represents an integer of 0 to 3, preferably an integer of 0 to 2, and more preferably an integer of 1 to 2.

[0069] The allyl-based non-solid curing agent having an epoxy group preferably contains two or more epoxy groups in one molecule. The allyl-based non-solid curing agent having an epoxy group preferably has an aromatic structure, and when two or more allyl-based non-solid curing agents having an epoxy group are used, it is more preferable that at least one of them has an aromatic structure. The aromatic structure is a chemical structure generally defined as aromatic, and also includes polycyclic aromatics and aromatic heterocycles. The allyl-based non-solid curing agent having an epoxy group preferably has a bisphenol structure, and examples of the bisphenol structure include bisphenol A type, bisphenol F type, bisphenol AF type, etc., and among them, bisphenol A type is preferable from the viewpoint of obtaining the effect of the present invention remarkably.

[0070] As the allyl-based non-solid curing agent having a carboxylic acid derivative having a cyclic structure, an allyl carboxylate having a cyclic structure is preferred. The cyclic structure may be either a cyclic group containing an alicyclic structure or a cyclic group containing an aromatic ring structure. In addition, the cyclic group may have a ring skeleton constituted by heteroatoms other than carbon atoms. Examples of heteroatoms include oxygen atoms, sulfur atoms, and nitrogen atoms, and nitrogen atoms are preferred. The ring may have one heteroatom or two or more heteroatoms. The carboxylic acid derivative having a cyclic structure has improved compatibility and dispersibility with resin varnish due to the network structure of the cyclic structure, which results in improved lamination properties and makes it possible to obtain a cured product with excellent adhesion.

[0071] Examples of carboxylic acids having a cyclic structure include isocyanuric acid, diphenic acid, phthalic acid, cyclohexanedicarboxylic acid, etc. Examples of allyl-based non-solid curing agents having a carboxylic acid derivative having a cyclic structure include allyl isocyanurate, diallyl isocyanurate, triallyl isocyanurate, diallyl diphenate, allyl diphenate, ortho-diallyl phthalate, meth-diallyl phthalate, para-diallyl phthalate, allyl cyclohexanedicarboxylate, diallyl cyclohexanedicarboxylate, etc.

[0072] The allyl-based non-solid curing agent can be a commercially available product. Examples of commercially available products include "MEH-8000H" and "MEH-8005" (allyl-based non-solid curing agent having a phenol ring) manufactured by Meiwa Kasei Co., Ltd.; "RE-810NM" (allyl-based non-solid curing agent having an epoxy group) manufactured by Nippon Kayaku Co., Ltd.; "ALP-d" (allyl-based non-solid curing agent having a benzoxazine ring) manufactured by Shikoku Kasei Kogyo Co., Ltd.; "L-DAIC" (allyl-based non-solid curing agent having an isocyanuric ring) manufactured by Shikoku Kasei Kogyo Co., Ltd.; "TAIC" (allyl-based non-solid curing agent having an isocyanuric ring (triallyl isocyanurate) manufactured by Nippon Kasei Co., Ltd.; "MDAC" (allyl-based non-solid curing agent having a cyclohexanedicarboxylic acid derivative) manufactured by Osaka Soda Co., Ltd.; "DAD" (diallyl diphenate) manufactured by Nissho Techno Fine Chemical Co., Ltd.; and "Daiso DAP Monomer" (ortho-diallyl phthalate) manufactured by Osaka Soda Co., Ltd.

[0073] From the viewpoint of significantly obtaining the desired effects of the present invention, the allyl group equivalent of the allyl-based non-solid curing agent is preferably 20 g / eq. to 1000 g / eq., more preferably 50 g / eq. to 500 g / eq., and further preferably 100 g / eq. to 300 g / eq. The allyl group equivalent is the mass of the allyl-based non-solid curing agent containing one equivalent of an allyl group.

[0074] A maleimide-based non-solid curing agent is a liquid or semi-solid compound having at least one maleimide group in the molecule, except for those that fall under component (A).

[0075] The maleimide-based non-solid curing agent preferably contains at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.

[0076] The number of carbon atoms of the alkyl group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less. The alkyl group may be linear, branched, or cyclic, and linear is preferred. Examples of such alkyl groups include pentyl, hexyl, heptyl, octyl, nonyl, and decyl groups. The alkyl group having 5 or more carbon atoms may be a substituent of an alkylene group having 5 or more carbon atoms.

[0077] The number of carbon atoms of the alkylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less. The alkylene group may be linear, branched, or cyclic, and linear is preferred. Here, the cyclic alkylene group is a concept that includes the case where it is composed of only a cyclic alkylene group and the case where it contains both a linear alkylene group and a cyclic alkylene group. Examples of such alkylene groups include pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tridecylene, heptadecylene, hexatriacontylene, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

[0078] From the viewpoint of significantly achieving the effects of the present invention, the maleimide-based non-solid curing agent preferably contains both an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.

[0079] The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms may be bonded to each other to form a ring, and the ring structure also includes a spiro ring and a condensed ring. Examples of the ring formed by bonding to each other include a cyclohexane ring.

[0080] The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms preferably have no substituent, but may have a substituent. Examples of the substituent include R 1 The substituents are the same as those represented by the formula (I).

[0081] In the maleimide-based non-solid curing agent, the alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms are preferably directly bonded to the nitrogen atom of the maleimide group.

[0082] The number of maleimide groups per molecule of the maleimide-based non-solid curing agent may be 1, but is preferably 2 or more, and is preferably 10 or less, more preferably 6 or less, and particularly preferably 3 or less. By using a maleimide-based non-solid curing agent having 2 or more maleimide groups per molecule, the effects of the present invention can be significantly obtained.

[0083] The maleimide-based non-solid curing agent is preferably a maleimide-based non-solid curing agent represented by the following general formula (B-3). [ka] In formula (B-3), M represents an alkylene group having 5 or more carbon atoms which may have a substituent, and L represents a single bond or a divalent linking group.

[0084] M represents an alkylene group having 5 or more carbon atoms which may have a substituent. The alkylene group of M is the same as the alkylene group having 5 or more carbon atoms described above. The substituent of M is R 1 The substituent is preferably an alkyl group having 5 or more carbon atoms.

[0085] L represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group, an alkenylene group, an alkynylene group, an arylene group, -C(=O)-, -C(=O)-O-, -NR 0 -(R 0is a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, an oxygen atom, a sulfur atom, or C(=O)NR 0 -, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, and a group consisting of a combination of two or more of these divalent groups. The alkylene group, alkenylene group, alkynylene group, arylene group, divalent group derived from phthalimide, divalent group derived from pyromellitic diimide, and a group consisting of a combination of two or more of these divalent groups may have an alkyl group having 5 or more carbon atoms as a substituent. The divalent group derived from phthalimide represents a divalent group derived from phthalimide, specifically a group represented by general formula (A). The divalent group derived from pyromellitic diimide represents a divalent group derived from pyromellitic diimide, specifically a group represented by general formula (B). In the formula, "*" represents a bond. [ka]

[0086] The alkylene group as the divalent linking group in L is preferably an alkylene group having 1 to 50 carbon atoms, more preferably an alkylene group having 1 to 45 carbon atoms, and particularly preferably an alkylene group having 1 to 40 carbon atoms. This alkylene group may be linear, branched, or cyclic. Examples of such alkylene groups include a methylethylene group, a cyclohexylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, an undecylene group, a dodecylene group, a tridecylene group, a heptadecylene group, a hexatriacontylene group, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

[0087] The alkenylene group as the divalent linking group in L is preferably an alkenylene group having 2 to 20 carbon atoms, more preferably an alkenylene group having 2 to 15 carbon atoms, and particularly preferably an alkenylene group having 2 to 10 carbon atoms. This alkenylene group may be linear, branched, or cyclic. Examples of such alkenylene groups include a methylethylenylene group, a cyclohexenylene group, a pentenylene group, a hexenylene group, a heptenylene group, and an octenylene group.

[0088] The alkynylene group as the divalent linking group in L is preferably an alkynylene group having 2 to 20 carbon atoms, more preferably an alkynylene group having 2 to 15 carbon atoms, and particularly preferably an alkynylene group having 2 to 10 carbon atoms. This alkynylene group may be linear, branched, or cyclic. Examples of such alkynylene groups include a methylethynylene group, a cyclohexynylene group, a pentynylene group, a hexynylene group, a heptynylene group, and an octynylene group.

[0089] The arylene group as the divalent linking group in L is preferably an arylene group having 6 to 24 carbon atoms, more preferably an arylene group having 6 to 18 carbon atoms, still more preferably an arylene group having 6 to 14 carbon atoms, and even more preferably an arylene group having 6 to 10 carbon atoms. Examples of the arylene group include a phenylene group, a naphthylene group, and an anthracenylene group.

[0090] The alkylene group, alkenylene group, alkynylene group, and arylene group, which are the divalent linking groups in L, may have a substituent. Examples of the substituent include R 1 and preferably an alkyl group having 5 or more carbon atoms.

[0091] Examples of the group consisting of a combination of two or more divalent groups in L include a divalent group consisting of a combination of an alkylene group, a divalent group derived from phthalimide, and an oxygen atom; a divalent group consisting of a combination of a divalent group derived from phthalimide, an oxygen atom, an arylene group, and an alkylene group; a divalent group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; and the like. The group consisting of a combination of two or more divalent groups may form a ring such as a condensed ring by the combination of the respective groups. In addition, the group consisting of a combination of two or more divalent groups may be a repeating unit having a repeating unit number of 1 to 10.

[0092] Among them, L in the general formula (B-3) is preferably an oxygen atom, an arylene group having 6 to 24 carbon atoms which may have a substituent, an alkylene group having 1 to 50 carbon atoms which may have a substituent, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, or a divalent group consisting of a combination of two or more of these groups. Among them, L is more preferably an alkylene group; a divalent group having a structure of an alkylene group-a divalent group derived from phthalimide-oxygen atom-a divalent group derived from phthalimide; a divalent group having a structure of an alkylene group-a divalent group derived from phthalimide-oxygen atom-arylene group-alkylene group-arylene group-oxygen atom-a divalent group derived from phthalimide; or a divalent group having a structure of an alkylene-a divalent group derived from pyromellitic diimide.

[0093] The maleimide-based non-solid curing agent represented by general formula (B-3) is preferably a maleimide-based non-solid curing agent represented by general formula (B-4). [ka] In general formula (B-4), M 1 each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, each A independently represents an alkylene group having 5 or more carbon atoms which may have a substituent or a divalent group having an aromatic ring which may have a substituent, and t represents an integer of 1 to 10.

[0094] M 1 Each of M independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. 1 is the same as M in general formula (B-3).

[0095] Each A independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, or a divalent group having an aromatic ring which may have a substituent. The alkylene group in A may be any of linear, branched, and cyclic, and among them, a cyclic alkylene group having 5 or more carbon atoms which may have a substituent is preferred. The number of carbon atoms of the alkylene group is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and even more preferably 40 or less. Examples of such alkylene groups include a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

[0096] Examples of the aromatic ring in the divalent group having an aromatic ring represented by A include a benzene ring, a naphthalene ring, an anthracene ring, a phthalimide ring, a pyromellitic diimide ring, and an aromatic heterocycle, and the like are mentioned, with a benzene ring, a phthalimide ring, and a pyromellitic diimide ring being preferred. That is, the divalent group having an aromatic ring is preferably a divalent group having a benzene ring which may have a substituent, a divalent group having a phthalimide ring which may have a substituent, or a divalent group having a pyromellitic diimide ring which may have a substituent. Examples of the divalent group having an aromatic ring include a group consisting of a combination of a divalent group derived from phthalimide and an oxygen atom; a group consisting of a combination of a divalent group derived from phthalimide, an oxygen atom, an arylene group, and an alkylene group; a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; a divalent group derived from pyromellitic diimide; a group consisting of a combination of a divalent group derived from phthalimide and an alkylene group; and the like. The arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in general formula (B-3).

[0097] The alkylene group and the divalent group having an aromatic ring represented by A may have a substituent. Examples of the substituent include R 1 The substituents are the same as those represented by the formula (I).

[0098] Specific examples of the group represented by A include the following groups: In the formula, "*" represents a bond. [ka] [ka]

[0099] The maleimide-based non-solid curing agent represented by general formula (B-3) is preferably any one of a maleimide-based non-solid curing agent represented by general formula (B-5) and a maleimide-based non-solid curing agent represented by general formula (B-6). [ka] In general formula (B-5), M 2 and M 3 each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent; R 30 each independently represents an oxygen atom, an arylene group, an alkylene group, or a divalent group consisting of a combination of two or more of these groups. t1 represents an integer of 1 to 10. In general formula (B-6), M 4 , M 6 and M 7 each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent; M 5 each independently represents a divalent group having an aromatic ring which may have a substituent; R 31 and R 32 each independently represents an alkyl group having 5 or more carbon atoms. t2 represents an integer of 0 to 10, and u1 and u2 each independently represent an integer of 0 to 4.

[0100] M 2 and M 3 Each of M independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. 2 and M 3 is the same as the alkylene group having 5 or more carbon atoms represented by M in general formula (B-3), and a hexatriacontylene group is preferred.

[0101] R 30 R each independently represents an oxygen atom, an arylene group, an alkylene group, or a group consisting of a combination of two or more of these divalent groups. The arylene group and the alkylene group are the same as the arylene group and the alkylene group in the divalent linking group represented by L in the general formula (B-3). 30 is preferably an oxygen atom or a group formed from a combination of two or more divalent groups.

[0102] R 30In the formula, examples of the group consisting of a combination of two or more divalent groups include a combination of an oxygen atom, an arylene group, and an alkylene group. Specific examples of the group consisting of a combination of two or more divalent groups include the following groups. In the formula, "*" represents a bond. [ka]

[0103] M 4 , M 6 and M 7 Each of M independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. 4 , M 6 and M 7 is the same as the alkylene group having 5 or more carbon atoms which may have a substituent represented by M in general formula (B-3), and is preferably a hexylene group, a heptylene group, an octylene group, a nonylene group, or a decylene group, and more preferably an octylene group.

[0104] M 5 Each of M independently represents a divalent group having an aromatic ring which may have a substituent. 5 is the same as the divalent group having an aromatic ring which may have a substituent represented by A in general formula (B-4), and is preferably a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide; a group consisting of a combination of a divalent group derived from phthalimide and an alkylene group, and more preferably a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide. The arylene group and alkylene group are the same as the arylene group and alkylene group in the divalent linking group represented by L in general formula (B-3).

[0105] M 5 Specific examples of the group represented by the formula include the following groups: In the formula, "*" represents a bond. [ka]

[0106] R31 and R 32 R each independently represents an alkyl group having 5 or more carbon atoms. 31 and R 32 is the same as the above-mentioned alkyl group having 5 or more carbon atoms, and is preferably a hexyl group, a heptyl group, an octyl group, a nonyl group, or a decyl group, and more preferably a hexyl group or an octyl group.

[0107] Each of u1 and u2 independently represents an integer of 1 to 15, and an integer of 1 to 10 is preferable.

[0108] Specific examples of the maleimide-based non-solid curing agent include the following compounds (1) to (3). However, the maleimide-based non-solid curing agent is not limited to these specific examples. In the formula, v represents an integer of 1 to 10. [ka] [ka]

[0109] Specific examples of maleimide-based non-solid curing agents include "BMI1500" (compound of formula (1)), "BMI1700" (compound of formula (2)), and "BMI689" (compound of formula (3)), all manufactured by Designer Molecules.

[0110] From the viewpoint of significantly obtaining the desired effects of the present invention, the maleimide group equivalent of the maleimide-based non-solid curing agent is preferably 50 g / eq. to 2000 g / eq., more preferably 100 g / eq. to 1000 g / eq., and further preferably 150 g / eq. to 500 g / eq. The maleimide group equivalent is the mass of the maleimide-based non-solid curing agent containing one equivalent of maleimide group.

[0111] The (meth)acrylic non-solid curing agent is a liquid or semi-solid curing agent that includes an acryloyl group, a methacryloyl group, and a combination thereof. In order to significantly obtain the desired effects of the present invention, the (meth)acrylic non-solid curing agent preferably has two or more (meth)acryloyl groups per molecule. The term "(meth)acryloyl group" includes an acryloyl group, a methacryloyl group, and a combination thereof.

[0112] The (meth)acrylic non-solid curing agent preferably has a cyclic structure from the viewpoint of significantly obtaining the desired effect of the present invention. The cyclic structure is preferably a divalent cyclic group. The divalent cyclic group may be either a cyclic group containing an alicyclic structure or a cyclic group containing an aromatic ring structure. Among them, from the viewpoint of significantly obtaining the desired effect of the present invention, a cyclic group containing an alicyclic structure is preferable.

[0113] From the viewpoint of significantly obtaining the desired effects of the present invention, the divalent cyclic group is preferably a 3-membered or larger ring, more preferably a 4-membered or larger ring, and even more preferably a 5-membered or larger ring, and is preferably a 20-membered or smaller ring, more preferably a 15-membered or smaller ring, and even more preferably a 10-membered or smaller ring. In addition, the divalent cyclic group may be a monocyclic structure or a polycyclic structure.

[0114] The ring in the divalent cyclic group may have a ring skeleton constituted by a heteroatom other than carbon atoms. Examples of the heteroatom include an oxygen atom, a sulfur atom, and a nitrogen atom, and an oxygen atom is preferred. The ring may have one or more heteroatoms.

[0115] Specific examples of the divalent cyclic group include the following divalent groups (i) to (xi). Among them, the divalent cyclic group is preferably (x) or (xi). [ka]

[0116] The divalent cyclic group may have a substituent, such as a halogen atom, an alkyl group, an alkoxy group, an aryl group, an arylalkyl group, a silyl group, an acyl group, an acyloxy group, a carboxy group, a sulfo group, a cyano group, a nitro group, a hydroxy group, a mercapto group, or an oxo group, and an alkyl group is preferred.

[0117] The (meth)acryloyl group may be directly bonded to the divalent cyclic group, or may be bonded via a divalent linking group. Examples of the divalent linking group include an alkylene group, an alkenylene group, an arylene group, a heteroarylene group, -C(=O)O-, -O-, -NHC(=O)-, -NC(=O)N-, -NHC(=O)O-, -C(=O)-, -S-, -SO-, -NH-, and the like, and may be a group in which a plurality of these are combined. The alkylene group is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, and even more preferably an alkylene group having 1 to 5 carbon atoms or an alkylene group having 1 to 4 carbon atoms. The alkylene group may be linear, branched, or cyclic. Examples of such alkylene groups include methylene, ethylene, propylene, butylene, pentylene, hexylene, and 1,1-dimethylethylene groups, and are preferably methylene, ethylene, or 1,1-dimethylethylene. As the alkenylene group, an alkenylene group having 2 to 10 carbon atoms is preferred, an alkenylene group having 2 to 6 carbon atoms is more preferred, and an alkenylene group having 2 to 5 carbon atoms is even more preferred. As the arylene group or heteroarylene group, an arylene group or heteroarylene group having 6 to 20 carbon atoms is preferred, and an arylene group or heteroarylene group having 6 to 10 carbon atoms is more preferred. As the divalent linking group, an alkylene group is preferred, and among them, a methylene group or a 1,1-dimethylethylene group is preferred.

[0118] The (meth)acrylic non-solid curing agent is preferably represented by the following formula (B-7). [ka] (In formula (B-7), R33 and R 36 each independently represents an acryloyl group or a methacryloyl group, R 34 and R 35 each independently represents a divalent linking group. Ring D represents a divalent cyclic group.

[0119] R 33 and R 36 each independently represents an acryloyl group or a methacryloyl group, and an acryloyl group is preferred.

[0120] R 34 and R 35 each independently represents a divalent linking group. The divalent linking group is the same as the divalent linking group which may have a (meth)acryloyl group bonded thereto.

[0121] Ring D represents a divalent cyclic group. Ring D is the same as the divalent cyclic group described above. Ring D may have a substituent. The substituent is the same as the substituent that the divalent cyclic group may have.

[0122] Specific examples of the (meth)acrylic non-solid curing agent include the following, but the present invention is not limited thereto. [ka]

[0123] As the (meth)acrylic non-solid curing agent, commercially available products may be used, and examples thereof include "A-DOG" manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" manufactured by Kyoeisha Chemical Co., Ltd., "NPDGA", "FM-400", "R-687", "THE-330", "PET-30", and "DPHA" manufactured by Nippon Kayaku Co., Ltd., and "NK Ester DCP" manufactured by Shin-Nakamura Chemical Co., Ltd.

[0124] From the viewpoint of significantly obtaining the desired effects of the present invention, the (meth)acryloyl group equivalent of the (meth)acrylic non-solid curing agent is preferably 30 g / eq. to 400 g / eq., more preferably 50 g / eq. to 300 g / eq., and even more preferably 75 g / eq. to 200 g / eq. The (meth)acryloyl group equivalent is the mass of the (meth)acrylic non-solid curing agent containing one equivalent of a (meth)acryloyl group.

[0125] As the amine-based non-solid curing agent, a liquid or semi-solid amine-based curing agent can be used. In addition, as the amine-based non-solid curing agent, a curing agent having one or more amino groups in one molecule can be used, for example, aliphatic amines, polyether amines, alicyclic amines, aromatic amines, etc. can be used, and among them, aromatic amines are preferred from the viewpoint of achieving the desired effect of the present invention. As the amine-based non-solid curing agent, primary amines or secondary amines are preferred, and primary amines are more preferred.

[0126] Specific examples of amine-based non-solid curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-methylenedi-2,6-xylidine, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 2,2-bis(4-aminophenyl)propane, etc. Commercially available amine-based resins may be used, such as "KAYABOND C-200S", "KAYAHARD AA", "KAYAHARD AB", and "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure W" and "jER Cure W" manufactured by Mitsubishi Chemical Corporation.

[0127] The butadiene-based non-solid curing agent is a liquid or semi-solid compound having at least one butadiene skeleton in the molecule. The polybutadiene structure may be included in the main chain or in the side chain. The polybutadiene structure may be partially or entirely hydrogenated. As the butadiene-based non-solid curing agent, one or more resins selected from the group consisting of hydrogenated polybutadiene skeleton-containing resin, hydroxyl group-containing butadiene resin, phenolic hydroxyl group-containing butadiene resin, carboxyl group-containing butadiene resin, acid anhydride group-containing butadiene resin, epoxy group-containing butadiene resin, isocyanate group-containing butadiene resin, and urethane group-containing butadiene resin are more preferable.

[0128] Specific examples of butadiene-based non-solid curing agents include "JP-100" manufactured by Nippon Soda Co., Ltd., and "Ricon100", "Ricon150", "Ricon130MA8", "Ricon130MA13", "Ricon130MA20", "Ricon131MA5", "Ricon131MA10", "Ricon131MA17", "Ricon131MA20", and "Ricon 184MA6" manufactured by CRAY VALLEY.

[0129] The content of the (B) component, from the viewpoint of improving lamination properties and obtaining a cured product with excellent adhesion, is preferably 0.1 mass % or more, more preferably 0.5 mass % or more, and even more preferably 1 mass % or more, and is preferably 15 mass % or less, more preferably 10 mass % or less, and even more preferably 5.5 mass % or less, based on 100 mass % of the non-volatile components in the resin composition.

[0130] If the content of the nonvolatile components in the resin composition of component (B) taken as 100% by mass is b1, and the content of the nonvolatile components in the resin composition of component (A) taken as 100% by mass is a1, a1 / b1 is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more or 4 or more, and is preferably 30 or less, more preferably 25 or less, even more preferably 20 or less, 15 or less, or 10 or less. By setting a1 / b1 within this range, it becomes possible to obtain the effects of the present invention significantly.

[0131] <(C) High molecular weight component> The resin composition contains a high molecular weight component as component (C). By including component (C) in the resin composition, the stress of the resin composition is alleviated, and as a result, it becomes possible to obtain a cured product with excellent dielectric properties. The component (C) may be used alone or in combination of two or more types.

[0132] From the viewpoint of obtaining a cured product with excellent dielectric properties, the weight average molecular weight (Mn) of component (C) is preferably at least 5000, more preferably at least 8000, particularly preferably at least 10000, and is preferably at most 100000, more preferably at most 80000, particularly preferably at most 50000. The weight average molecular weight of component (C) is a polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography (GPC).

[0133] As the component (C), those having a high weight average molecular weight can be used. Examples of such components include thermoplastic resins such as polyimide resins, polycarbonate resins, phenoxy resins, polyvinyl acetal resins, polyolefin resins, polyamideimide resins, polyetherimide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, polyetheretherketone resins, polystyrene resins, and polyester resins. Among them, from the viewpoint of obtaining a cured product having excellent dielectric properties, it is preferable that the component (C) is at least one selected from polyimide resins, polycarbonate resins, and phenoxy resins.

[0134] The polyimide resin may be a resin having an imide structure, and generally includes those obtained by an imidization reaction between a diamine compound and an acid anhydride.

[0135] The diamine compound for preparing the polyimide resin is not particularly limited, but examples thereof include aliphatic diamine compounds and aromatic diamine compounds.

[0136] Examples of the aliphatic diamine compound include linear aliphatic diamine compounds such as 1,2-ethylenediamine, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane, 1,6-hexamethylenediamine, 1,5-diaminopentane, and 1,10-diaminodecane; branched aliphatic diamine compounds such as 1,2-diamino-2-methylpropane, 2,3-diamino-2,3-butane, and 2-methyl-1,5-diaminopentane; alicyclic diamine compounds such as 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,4-diaminocyclohexane, and 4,4'-methylenebis(cyclohexylamine); and dimer acid diamines (hereinafter also referred to as "dimer diamines"). The dimer acid diamine refers to a diamine compound obtained by substituting two terminal carboxylic acid groups (-COOH) of a dimer acid with an aminomethyl group (-CH2-NH2) or an amino group (-NH2). Dimer acid is a known compound obtained by dimerizing an unsaturated fatty acid (preferably one having 11 to 22 carbon atoms, particularly preferably one having 18 carbon atoms), and its industrial production process is almost standardized in the industry.

[0137] Examples of the aromatic diamine compound include a phenylenediamine compound, a naphthalenediamine compound, and a dianiline compound.

[0138] The phenylenediamine compound means a compound consisting of a benzene ring having two amino groups, and further, the benzene ring here may have 1 to 3 optional substituents. The substituents here are not particularly limited. Specific examples of the phenylenediamine compound include 1,4-phenylenediamine, 1,2-phenylenediamine, 1,3-phenylenediamine, 2,4-diaminotoluene, 2,6-diaminotoluene, 3,5-diaminobiphenyl, and 2,4,5,6-tetrafluoro-1,3-phenylenediamine.

[0139] The naphthalene diamine compound means a compound consisting of a naphthalene ring having two amino groups, and the naphthalene ring here may have 1 to 3 optional substituents. The substituents here are not particularly limited. Specific examples of the naphthalene diamine compound include 1,5-diaminonaphthalene, 1,8-diaminonaphthalene, 2,6-diaminonaphthalene, and 2,3-diaminonaphthalene.

[0140] The dianiline compound means a compound containing two aniline structures in the molecule, and further, each of the two benzene rings in the two aniline structures may further have 1 to 3 optional substituents. The substituents here are not particularly limited. The two aniline structures in the dianiline compound may be bonded via a direct bond and / or one or two linker structures having 1 to 100 skeletal atoms selected from carbon atoms, oxygen atoms, sulfur atoms, and nitrogen atoms. The dianiline compound also includes one in which two aniline structures are bonded by two bonds.

[0141] Specific examples of the "linker structure" in the dianiline compound include -NHCO-, -CONH-, -OCO-, -COO-, -CH2-, -CH2CH2-, -CH2CH2CH2-, -CH2CH2CH2CH2-, -CH2CH2CH2CH2CH2-, -CH(CH3)-, -C(CH3)2-, -C(CF3)2-, -CH=CH-, -O-, -S-, -CO-, -SO2-, -NH-, -Ph-, -Ph-Ph-, -C(CH3)2-Ph-C(CH3)2-, -O-Ph-O-, -O-Ph-Ph-O-, -O-Ph-SO2-Ph-O-, -O-Ph-C(CH3)2-Ph-O-, -C(CH3)2-Ph-C(CH3)2-,

[0142] [ka]

[0143] In this specification, "Ph" represents a 1,4-phenylene group, a 1,3-phenylene group, or a 1,2-phenylene group.

[0144] In one embodiment, the dianiline compound specifically includes 4,4'-diamino-2,2'-ditrifluoromethyl-1,1'-biphenyl, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, 4-aminophenyl 4-aminobenzoate, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 2,2-bis(4-aminophenyl)propane, 4,4'-(hexafluoroisopropylidene)dianiline, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane,

[0036] 4,4'-(9-fluorenylidene)dianiline, 2,2-bis(3-methyl-4-aminophenyl)propane, 2,2-bis(3-methyl-4-aminophenyl)benzene, 4,4'-diamino-3,3'-dimethyl-1,1'-biphenyl, 4,4'-diamino-2,2'-dimethyl-1,1'-biphenyl, 9,9'-bis(3-methyl-4-aminophenyl)fluorene, 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindane, and the like.

[0145] The diamine compound may be a commercially available product or may be synthesized by a known method. The diamine compound may be used alone or in combination of two or more kinds.

[0146] The acid anhydride for preparing the polyimide resin is not particularly limited, but in a preferred embodiment, it is an aromatic tetracarboxylic dianhydride. Examples of the aromatic tetracarboxylic dianhydride include benzenetetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, anthracenetetracarboxylic dianhydride, and diphthalic dianhydride, and diphthalic dianhydride is preferred.

[0147] Benzenetetracarboxylic dianhydride means a dianhydride of benzene having four carboxy groups, and further, the benzene ring here may have 1 to 3 optional substituents. Here, the substituents include halogen atoms, cyano groups, and -X 33 -R 33 (The same definition as in the following formula (1B)) is preferable. Specific examples of the benzenetetracarboxylic dianhydride include pyromellitic dianhydride and 1,2,3,4-benzenetetracarboxylic dianhydride.

[0148] Naphthalenetetracarboxylic dianhydride means a dianhydride of naphthalene having four carboxy groups, and further, the naphthalene ring here may have 1 to 3 optional substituents, where the substituents are halogen atoms, cyano groups, and -X 33 -R 33 (The same definition as in the following formula (1B)) is preferable. Specific examples of the naphthalenetetracarboxylic dianhydride include 1,4,5,8-naphthalenetetracarboxylic dianhydride and 2,3,6,7-naphthalenetetracarboxylic dianhydride.

[0149] Anthracenetetracarboxylic dianhydride means a dianhydride of anthracene having four carboxy groups, and further, the anthracene ring here may have 1 to 3 optional substituents. Here, the substituents include halogen atoms, cyano groups, and -X 33 -R 33(The same definition as in the following formula (1B)) is preferable. Specific examples of the anthracenetetracarboxylic dianhydride include 2,3,6,7-anthracenetetracarboxylic dianhydride.

[0150] Diphthalic dianhydride means a compound containing two phthalic anhydrides in the molecule, and further, each of the two benzene rings in the two phthalic anhydrides may have one to three optional substituents. Here, the substituents include halogen atoms, cyano groups, and -X 33 -R 33 (same as the definition in the following formula (1B)). Two phthalic anhydrides in the diphthalic dianhydride may be bonded directly or via a linker structure having 1 to 100 skeletal atoms selected from carbon atoms, oxygen atoms, sulfur atoms, and nitrogen atoms.

[0151] As the diphthalic dianhydride, for example, a compound represented by the formula (1B):

[0152] [ka]

[0153] [In the formula, R 31 and R 32 each independently represents a halogen atom, a cyano group, a nitro group, or -X 33 -R 33 indicates, X 33 each independently represents a single bond, -NR 33’ -, -O-, -S-, -CO-, -SO2-, -NR 33’ CO-, -CONR 33’ -, -OCO-, or -COO-; R 33 each independently represents a substituted or unsubstituted alkyl group, or a substituted or unsubstituted alkenyl group, R 33’ each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted alkenyl group, Y represents a single bond or a linker structure having 1 to 100 skeletal atoms selected from a carbon atom, an oxygen atom, a sulfur atom, and a nitrogen atom, n10 and m10 each independently represent an integer of 0 to 3. Examples of the compound include compounds represented by the following formula:

[0154] Y is preferably a linker structure having 1 to 100 skeletal atoms selected from a carbon atom, an oxygen atom, a sulfur atom, and a nitrogen atom. n and m are preferably 0.

[0155] The "linker structure" in Y has 1 to 100 skeletal atoms selected from carbon atoms, oxygen atoms, sulfur atoms, and nitrogen atoms. The "linker structure" is preferably -[A1-Ph] a10 -A1-[Ph-A1] b10 - (wherein, A1 each independently represents a single bond, -(substituted or unsubstituted alkylene group)-, -O-, -S-, -CO-, -SO2-, -CONH-, -NHCO-, -COO-, or -OCO-, and a10 and b10 each independently represent an integer of 0 to 2 (preferably 0 or 1).) is a divalent group represented by the formula.

[0156] Specific examples of the "linker structure" in Y include -CH-, -CHCH-, -CHCHCHCH-, -CHCHCHCHCH-, -CHCHCHCHCHCH-, -CH(CH)-, -C(CH)-, -O-, -CO-, -SO-, -Ph-, -O-Ph-O-, -O-Ph-SO-Ph-O-, -O-Ph-C(CH)-Ph-O-, etc. In the present specification, "Ph" represents a 1,4-phenylene group, a 1,3-phenylene group, or a 1,2-phenylene group.

[0157] Specific examples of diphthalic dianhydrides include 4,4'-oxydiphthalic anhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-diphenyl ether tetracarboxylic dianhydride, 3,3',4,4'-diphenyl sulfone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 2,2',3,3'-biphenyl tetracarboxylic dianhydride, 2, 3,3',4'-Biphenyltetracarboxylic dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 2,3,3',4'-diphenylethertetracarboxylic dianhydride, 2,3,3',4'-diphenylsulfonetetracarboxylic dianhydride, 2,2'-bis(3,4-dicarboxyphenoxyphenyl)sulfone dianhydride, methylene-4,4'-diphthalic dianhydride, 1,1-ethynylidene-4 ,4'-Diphthalic dianhydride, 2,2-Propylidene-4,4'-diphthalic dianhydride, 1,2-Ethylene-4,4'-diphthalic dianhydride, 1,3-Trimethylene-4,4'-diphthalic dianhydride, 1,4-Tetramethylene-4,4'-diphthalic dianhydride, 1,5-Pentamethylene-4,4'-diphthalic dianhydride, 1,3-Bis(3,4-dicarboxyphenyl)benzene dianhydride, 1,4-Bis(3,4-dicarboxyphenyl)benzene dianhydride Examples of such anhydrides include 1,3-bis(3,4-dicarboxyphenyl)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, and 4,4'-(4,4'-isopropylidenediphenoxy)bisphthalic dianhydride.

[0158] The acid anhydride may be a commercially available product, or may be synthesized by a known method or a method similar thereto. The acid anhydride may be used alone or in combination of two or more kinds.

[0159] The polyimide resin may be a commercially available product, such as "Rikacoat SN20" and "Rikacoat PN20" manufactured by New Japan Chemical Co., Ltd.

[0160] Polycarbonate resins are resins having a carbonate structure. Examples of such resins include carbonate resins having no reactive group, hydroxyl group-containing carbonate resins, phenolic hydroxyl group-containing carbonate resins, carboxyl group-containing carbonate resins, acid anhydride group-containing carbonate resins, isocyanate group-containing carbonate resins, urethane group-containing carbonate resins, and epoxy group-containing carbonate resins. The reactive group here refers to a functional group that can react with other components, such as a hydroxyl group, a phenolic hydroxyl group, a carboxyl group, an acid anhydride group, an isocyanate group, a urethane group, and an epoxy group.

[0161] Commercially available carbonate resins can be used, including "FPC0220" and "FPC2136" manufactured by Mitsubishi Gas Chemical Co., "T6002" and "T6001" (polycarbonate diols) manufactured by Asahi Kasei Chemicals Corporation, and "C-1090", "C-2090", and "C-3090" (polycarbonate diols) manufactured by Kuraray Co., Ltd.

[0162] Examples of the phenoxy resin include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. The phenoxy resin is preferably a phenoxy resin having a weight average molecular weight of 30,000 or more.

[0163] Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both of which are phenoxy resins containing a bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol S skeleton); "YX6954" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol acetophenone skeleton); "FX280" and "FX293" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YL7500BH30", "YX6954BH30", "YX7553", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", and "YL7482" manufactured by Mitsubishi Chemical Corporation.

[0164] The polyamide-imide resin is a resin having an amide-imide structure. From the viewpoint of compatibility with other components in the resin composition, it is preferable to use a polyamide-imide resin having an alicyclic structure in the molecular structure, a polyamide-imide resin having a siloxane structure described in JP-A-05-112760, a polyamide-imide resin having a bulky branched chain structure, a polyamide-imide resin made from an asymmetric monomer, a polyamide-imide resin having a multi-branched structure, or the like.

[0165] Among these, from the viewpoint that the polyamideimide resin has an isocyanuric ring structure, which improves compatibility and dispersibility with resin varnish, (i) polyamideimide resins having an isocyanuric ring structure in their molecular structure (i.e., polyamideimide resins having an isocyanuric ring structure and an imide skeleton or an amide skeleton), (ii) polyamideimide resins having an isocyanuric ring structure and an alicyclic structure in their molecular structure (i.e., polyamideimide resins having an isocyanuric ring structure, an alicyclic structure, and an imide skeleton or an amide skeleton), and (iii) polyamideimide resins having repeating units containing an isocyanuric ring structure and an alicyclic structure (i.e., polyamideimide resins having repeating units containing an isocyanuric ring structure, an alicyclic structure, and an imide skeleton or an amide skeleton).

[0166] A preferred embodiment of the polyamideimide resins (i) to (iii) includes (1) a carboxylic acid group-containing branched polyamideimide obtained by reacting an isocyanuric ring-containing polyisocyanate compound derived from an alicyclic diisocyanate with an acid anhydride of a polycarboxylic acid having three or more carboxyl groups (hereinafter, the compound may be referred to as "(compound C-1)"); (2) a carboxylic acid group-containing branched polymerizable polyamideimide obtained by reacting a compound having one epoxy group and one or more radically polymerizable unsaturated groups with compound (C-1) (hereinafter, the compound may be referred to as "compound (C-2)"); or (3) a carboxylic acid group-containing branched polymerizable polyamideimide obtained by reacting a compound having one hydroxyl group and one or more radically polymerizable unsaturated groups with a remaining isocyanate group in the synthesis process of compound (C-1) (hereinafter, the compound may be referred to as "compound (C-3)").

[0167] Specific examples of the compound (C-1) include compounds represented by the following general formula (I): The repeating unit in the compound represented by the general formula (I) is referred to as repeating unit (I-1). [ka] (In the formula, w represents 0 to 15.)

[0168] An example of the compound (C-2) is a compound (II) having a structure (I-2) in which GMA (glycidyl methacrylate) is added to any part of the carboxyl groups and / or terminal carboxyl groups of the repeating unit (I-1) in the general formula (I). [ka] (In the formula, R represents a residue in formula (I).)

[0169] The ratio of GMA modification of carboxyl groups is preferably 0.3 mol% or more, more preferably 0.5 mol% or more, even more preferably 0.7 mol% or more, or 0.9 mol% or more, based on the number of moles of carboxyl groups in compound (C-1). The upper limit is preferably 50 mol% or less, more preferably 40 mol% or less, even more preferably 30 mol% or less, or 20 mol% or less.

[0170] An example of the compound (C-3) is a compound (III) having a structure (I-3) in which any part of the repeating unit (I-1) and / or the terminal imide group in the above formula (I) is an isocyanate residue to which a hydroxyl group of pentaerythritol triacrylate is added. [ka] (In the formula, R' represents a residue in formula (I).)

[0171] The amount of pentaerythritol triacrylate added is preferably 40 mol% or less, more preferably 38 mol% or less, and even more preferably 35 mol% or less, based on the number of moles of isocyanate groups in the polyisocyanate at the time of charging. On the other hand, from the viewpoint of fully obtaining the effect of the addition, the amount of pentaerythritol triacrylate added is preferably 0.3 mol% or more, more preferably 3 mol% or more, and even more preferably 5 mol% or more, based on the number of moles of isocyanate groups in the polyisocyanate at the time of charging.

[0172] The polyamide-imide resin can be synthesized by various known methods. For the synthesis method of the polyamide-imide resin, for example, the description in paragraphs 0020 to 0030 of WO 2010 / 074197 can be referred to, the contents of which are incorporated herein by reference.

[0173] The polyamide-imide resin may be a commercially available product, such as modified polyamide-imide such as "UNIDIC V-8000" manufactured by DIC Corporation, "Viromax HR11NN" and "Viromax HR16NN" manufactured by Toyobo Co., Ltd., and "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imide) manufactured by Hitachi Chemical Co., Ltd.

[0174] As the polystyrene resin, any elastomer containing a repeating unit (styrene unit) having a structure obtained by polymerizing styrene can be used. The polystyrene resin may be a copolymer containing any repeating unit different from the styrene unit in combination with the styrene unit, or may be a hydrogenated polystyrene resin.

[0175] Examples of the optional repeating unit include a repeating unit (conjugated diene unit) having a structure obtained by polymerizing a conjugated diene, and a repeating unit (hydrogenated conjugated diene unit) having a structure obtained by hydrogenating the same. Examples of the conjugated diene include aliphatic conjugated dienes such as butadiene, isoprene, 2,3-dimethylbutadiene, 1,3-pentadiene, and 1,3-hexadiene; and halogenated aliphatic conjugated dienes such as chloroprene. As the conjugated diene, an aliphatic conjugated diene is preferable, and butadiene is more preferable, from the viewpoint of obtaining the effects of the present invention significantly. The conjugated diene may be used alone or in combination of two or more kinds. The polystyrene resin may be a random copolymer or a block copolymer.

[0176] Examples of polystyrene resins include styrene-butadiene-styrene block copolymers (SBS), styrene-isoprene-styrene block copolymers (SIS), styrene-ethylene-butylene-styrene block copolymers (SEBS), styrene-ethylene-propylene-styrene block copolymers (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymers (SEEPS), styrene-butadiene-butylene-styrene block copolymers (SBBS), styrene-butadiene diblock copolymers, hydrogenated styrene-butadiene block copolymers, hydrogenated styrene-isoprene block copolymers, hydrogenated styrene-butadiene random copolymers, styrene-maleic anhydride copolymers, etc. Among these, styrene-maleic anhydride copolymers are preferred as polystyrene resins.

[0177] Specific examples of polystyrene resins include "EF-40" manufactured by CRAY VALLEY and "H1043" manufactured by Asahi Kasei Corporation.

[0178] From the viewpoint of compatibility with other components in the resin composition, the polyester resin preferably has a fluorene structure in its molecular structure, and preferably has, in addition to the fluorene structure, a structural unit derived from a diol and a structural unit derived from a dicarboxylic acid.

[0179] A specific example of the polyester resin is "OKP4HT" manufactured by Osaka Gas Chemicals Co., Ltd.

[0180] Specific examples of polysulfone resins include polysulfones "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

[0181] Examples of polyvinyl acetal resins include polyvinyl formal resins and polyvinyl butyral resins, and polyvinyl butyral resins are preferred. Specific examples of polyvinyl acetal resins include S-LEC BH series, BX series (e.g., BX-5Z), KS series (e.g., KS-1), BL series, and BM series manufactured by Sekisui Chemical Co., Ltd.

[0182] A specific example of the polyethersulfone resin is "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

[0183] A specific example of the polyphenylene ether resin is the oligophenylene ether-styrene resin "OPE-2St 1200" manufactured by Mitsubishi Gas Chemical Company.

[0184] From the viewpoint of obtaining a cured product with excellent dielectric properties, the content of component (C) is preferably 0.5% by mass or more, more preferably 1% by mass or more, and even more preferably 1.5% by mass or more, and is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less, based on 100% by mass of non-volatile components in the resin composition.

[0185] If the content of the nonvolatile components in the resin composition of component (C) taken as 100% by mass is c1, and the content of the nonvolatile components in the resin composition of component (A) taken as 100% by mass is a1, a1 / c1 is preferably 2 or more, more preferably 5 or more, even more preferably 10 or more or 12 or more, and is preferably 50 or less, more preferably 30 or less, even more preferably 20 or less or 15 or less. By setting a1 / c1 within this range, it becomes possible to obtain the effects of the present invention significantly.

[0186] <(D) Inorganic filler> In addition to the above-mentioned components, the resin composition may further contain an inorganic filler as component (D) as an optional component.

[0187] As the material of the inorganic filler, an inorganic compound is used. Examples of the material of the inorganic filler include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Moreover, as the silica, spherical silica is preferable. (D) The inorganic filler may be used alone or in combination of two or more types.

[0188] Examples of commercially available products of component (D) include "UFP-30" manufactured by Denka Company; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumitomo Metal Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "Silfill NSS-3N", "Silfill NSS-4N", and "Silfill NSS-5N" manufactured by Tokuyama Corporation; and "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Admatechs Co., Ltd.

[0189] The specific surface area of ​​component (D) is preferably 1 m 2 / g or more, more preferably 2m 2 / g or more, particularly preferably 3m 2 / g or more. There is no particular upper limit, but it is preferably 60m 2 / g or less, 50m 2 / g or less or 40m 2The specific surface area is determined by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountec Co., Ltd.) according to the BET method, and calculating the specific surface area using the BET multipoint method.

[0190] From the viewpoint of significantly obtaining the desired effects of the present invention, the average particle size of component (D) is preferably 0.01 μm or more, more preferably 0.05 μm or more, and particularly preferably 0.1 μm or more, and is preferably 5 μm or less, more preferably 2 μm or less, and even more preferably 1 μm or less.

[0191] The average particle size of component (D) can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, a particle size distribution of the inorganic filler is created on a volume basis using a laser diffraction / scattering particle size distribution measuring device, and the median diameter is used as the average particle size. The measurement sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture by ultrasonic waves for 10 minutes. The measurement sample is measured using a laser diffraction particle size distribution measuring device with blue and red light wavelengths as the light source, and the particle size distribution of component (D) on a volume basis is measured using a flow cell method, and the average particle size can be calculated as the median diameter from the particle size distribution obtained. An example of a laser diffraction particle size distribution measuring device is the "LA-960" manufactured by Horiba, Ltd.

[0192] From the viewpoint of improving moisture resistance and dispersibility, it is preferable that the (D) component is treated with a surface treatment agent. Examples of the surface treatment agent include vinylsilane coupling agents, (meth)acrylic coupling agents, fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, and titanate coupling agents. Among them, from the viewpoint of obtaining the effects of the present invention remarkably, vinylsilane coupling agents, (meth)acrylic coupling agents, and aminosilane coupling agents are preferred. Moreover, the surface treatment agent may be used alone or in any combination of two or more types.

[0193] Commercially available surface treatment agents include, for example, Shin-Etsu Chemical Co., Ltd.'s "KBM1003" (vinyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM503" (3-methacryloxypropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), ... Examples of such silane coupling agents include Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane).

[0194] The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100 parts by mass of the inorganic filler is preferably surface-treated with 0.2 parts by mass to 5 parts by mass of the surface treatment agent, more preferably 0.2 parts by mass to 3 parts by mass, and even more preferably 0.3 parts by mass to 2 parts by mass.

[0195] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of suppressing an increase in the melt viscosity of the resin varnish and the melt viscosity in the form of a sheet, it is more preferable that the content is 1 mg / m 2 Less than 0.8 mg / m is preferred. 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0196] The amount of carbon per unit surface area of ​​the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. The carbon analyzer that can be used is the "EMIA-320V" manufactured by Horiba, Ltd.

[0197] From the viewpoint of reducing the dielectric properties, the content of the (D) component is preferably 50% by mass or more, more preferably 55% by mass or more, and even more preferably 60% by mass or more, when the non-volatile components in the resin composition are taken as 100% by mass, and is preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 70% by mass or less.

[0198] <(E) Hardener> The resin composition may further contain a curing agent as an optional component (E) in addition to the above-mentioned components. However, component (E) does not include those that fall under component (B). Component (E) is a curing agent that has been determined to be solid in a test conducted in accordance with the "Method of Confirming Liquid State" in Appendix 2 of the Ministerial Ordinance on the Testing and Properties of Hazardous Materials (Ministry of Home Affairs Ordinance No. 1 of 1989). Therefore, component (E) is a solid curing agent. The test method is as described above.

[0199] Examples of the (E) component include active ester-based curing agents, phenol-based curing agents, naphthol-based curing agents, benzoxazine-based curing agents, cyanate ester-based curing agents, carbodiimide-based curing agents, amine-based curing agents, acid anhydride-based curing agents, etc. The (E) component may be used alone or in combination of two or more types.

[0200] As the active ester curing agent, a compound having one or more active ester groups in one molecule can be used. Among them, as the active ester curing agent, a compound having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, is preferred. The active ester curing agent is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferred.

[0201] Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid.

[0202] Examples of phenol compounds or naphthol compounds include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, phenol novolac, etc. Here, the term "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0203] Preferred specific examples of the active ester curing agent include an active ester curing agent containing a dicyclopentadiene-type diphenol structure, an active ester curing agent containing a naphthalene structure, an active ester curing agent containing an acetylated product of phenol novolac, and an active ester curing agent containing a benzoylated product of phenol novolac. Among them, an active ester curing agent containing a naphthalene structure and an active ester curing agent containing a dicyclopentadiene-type diphenol structure are more preferred. The "dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

[0204] Commercially available active ester curing agents include "EXB9451", "EXB9460", "EXB9460S", "HPC8000-65T", "HPC8000H-65TM", "EXB8000L-65TM", and "EXB8150-65T" (manufactured by DIC Corporation) as active ester curing agents containing a dicyclopentadiene-type diphenol structure; "EXB9416-70BK" (manufactured by DIC Corporation) as an active ester curing agent containing a naphthalene structure; and an active ester curing agent containing an acetylated product of phenol novolac. Examples of such curing agents include "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester-based curing agent containing a benzoyl derivative of phenol novolac, "YLH1026" (manufactured by Mitsubishi Chemical Corporation); "DC808" (manufactured by Mitsubishi Chemical Corporation) as an active ester-based curing agent which is an acetylated derivative of phenol novolac; and "YLH1026" (manufactured by Mitsubishi Chemical Corporation), "YLH1030" (manufactured by Mitsubishi Chemical Corporation), and "YLH1048" (manufactured by Mitsubishi Chemical Corporation) as active ester-based curing agents which are benzoyl derivatives of phenol novolac.

[0205] As the phenol-based curing agent and naphthol-based curing agent, those having a novolak structure are preferred from the viewpoint of heat resistance and water resistance, and from the viewpoint of adhesion to the conductor layer, nitrogen-containing phenol-based curing agents are preferred, and triazine skeleton-containing phenol-based curing agents are more preferred.

[0206] Specific examples of phenol-based curing agents and naphthol-based curing agents include, for example, "MEH-7700", "MEH-7810", and "MEH-7851" manufactured by Meiwa Chemical Industry Co., Ltd.; "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V", and "SN375" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; and "TD-2090", "LA-7052", "LA-7054", "LA-1356", "LA-3018-50P", and "EXB-9500" manufactured by DIC Corporation.

[0207] Specific examples of benzoxazine-based curing agents include "ODA-BOZ" manufactured by JFE Chemical Corporation, "HFB2006M" manufactured by Showa Polymer Co., Ltd., and "Pd" and "Fa" manufactured by Shikoku Chemical Industry Co., Ltd.

[0208] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, 4,4'-methylenebis(2,6-dimethylphenylcyanate), hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, and bis(4-cyanatephenyl)thioether; polyfunctional cyanate resins derived from phenol novolac, cresol novolac, and the like; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester-based curing agents include "PT60" (phenol novolac type multifunctional cyanate ester resin), "ULL-950S" (multifunctional cyanate ester resin), "BA230" and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate is converted to triazine to form a trimer), all of which are manufactured by Lonza Japan.

[0209] Specific examples of carbodiimide-based curing agents include "V-03" and "V-07" manufactured by Nisshinbo Chemical Inc.

[0210] The amine-based curing agent may be a curing agent having one or more amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, aromatic amines, etc., and among them, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. The amine-based curing agent is preferably a primary amine or a secondary amine, and more preferably a primary amine. Specific examples of amine-based curing agents include 4,4'-diaminodiphenylmethane, diphenyldiaminosulfone, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, and bis(4-(3-aminophenoxy)phenyl)sulfone. As the amine-based curing agent, a commercially available product may be used, for example, "KAYABOND C-100" manufactured by Nippon Kayaku Co., Ltd.

[0211] Examples of the acid anhydride curing agent include a curing agent having one or more acid anhydride groups in one molecule. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of acid anhydrides include anhydrides, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric acid anhydrides such as styrene-maleic acid resin, which is a copolymer of styrene and maleic acid.

[0212] From the viewpoint of significantly obtaining the desired effects of the present invention, the content of the (E) component is preferably 0.1 mass% or more, more preferably 0.3 mass% or more, and even more preferably 0.5 mass% or more, relative to 100 mass% of the non-volatile components in the resin composition, and is preferably 5 mass% or less, more preferably 4 mass% or less, and even more preferably 3 mass% or less.

[0213] <(F) Curing accelerator> In addition to the above-mentioned components, the resin composition may further contain, as an optional component, a curing accelerator as component (F).

[0214] Examples of the component (F) include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, etc. The component (F) may be used alone or in combination of two or more types.

[0215] Examples of the phosphorus-based curing accelerator include triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, and the like, with triphenylphosphine and tetrabutylphosphonium decanoate being preferred.

[0216] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene, with 4-dimethylaminopyridine and 1,8-diazabicyclo(5,4,0)-undecene being preferred.

[0217] Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2, 4-Diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-furan Examples of the imidazole compounds include imidazole compounds such as 2-ethyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds and epoxy resins. Of these, 2-ethyl-4-methylimidazole and 1-benzyl-2-phenylimidazole are preferred.

[0218] As the imidazole-based curing accelerator, a commercially available product may be used, for example, "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0219] Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, and 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene. Examples of such biguanide include o-[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide. Of these, dicyandiamide and 1,5,7-triazabicyclo[4.4.0]dec-5-ene are preferred.

[0220] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0221] From the viewpoint of significantly obtaining the desired effects of the present invention, the content of the (F) component, relative to 100 mass% of the non-volatile components in the resin composition, is preferably 0.001 mass% or more, more preferably 0.005 mass% or more, even more preferably 0.01 mass% or more, and is preferably 0.5 mass% or less, more preferably 0.3 mass% or less, even more preferably 0.1 mass% or less.

[0222] <(G) Epoxy resin> In addition to the above-mentioned components, the resin composition may further contain an optional component (G) which is an epoxy resin, provided that component (G) does not include those which fall under component (B).

[0223] Examples of the (G) component include bixylenol type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AF type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol novolac type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, glycidylamine type epoxy resins, glycidyl ester type epoxy resins, cresol novolac type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, naphthylene ether type epoxy resins, trimethylol type epoxy resins, tetraphenylethane type epoxy resins, etc. The (G) component may be used alone or in combination of two or more.

[0224] The resin composition preferably contains, as component (G), an epoxy resin having two or more epoxy groups in one molecule. From the viewpoint of significantly obtaining the desired effects of the present invention, the ratio of the epoxy resin having two or more epoxy groups in one molecule to 100% by mass of the non-volatile components of component (G) is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0225] The component (G) includes an epoxy resin that is liquid at a temperature of 20° C. (hereinafter sometimes referred to as a "liquid epoxy resin") and an epoxy resin that is solid at a temperature of 20° C. (hereinafter sometimes referred to as a "solid epoxy resin"). The resin composition may contain only a liquid epoxy resin as the component (G), only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin, but from the viewpoint of significantly obtaining the desired effects of the present invention, it is preferable to contain only a liquid epoxy resin.

[0226] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0227] As the liquid epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin having an ester skeleton, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin, glycidyl amine type epoxy resin, and epoxy resin having a butadiene structure are preferred, and bisphenol A type epoxy resin and bisphenol F type epoxy resin are more preferred.

[0228] Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "jER828EL", "825", and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "630" and "630LSD" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation. epoxy resin); "ZX1059" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd. (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin); "EX-721" manufactured by Nagase ChemteX Corporation (glycidyl ester type epoxy resin); "Celloxide 2021P" manufactured by Daicel Corporation (alicyclic epoxy resin having an ester skeleton); "PB-3600" manufactured by Daicel Corporation (epoxy resin having a butadiene structure); "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd. may be used alone or in combination of two or more types.

[0229] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferable, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferable.

[0230] As the solid epoxy resin, bixylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl type epoxy resin, naphthylene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, and tetraphenylethane type epoxy resin are preferred, and naphthalene type epoxy resin is more preferred.

[0231] Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200HH", "HP-7200H", and "HP-7200" (dicyclopentadiene type epoxy resins) manufactured by DIC Corporation. anthradiene type epoxy resins); "EXA-7311", "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", and "HP6000" (naphthylene ether type epoxy resins) manufactured by DIC; "EPPN-502H" (trisphenol type epoxy resins) manufactured by Nippon Kayaku; "NC7000L" (naphthol novolac type epoxy resins) manufactured by Nippon Kayaku; "NC3000H", "NC3000", and "NC 3000L, "NC3100" (biphenyl type epoxy resin); "ESN475V" (naphthol type epoxy resin) manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.; "ESN485" (naphthol novolac type epoxy resin) manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd.; "YX4000H", "YX4000", "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX4000HK" (bixylenol type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX8" manufactured by Mitsubishi Chemical Co., Ltd. Examples of epoxy resins include "800" (anthracene type epoxy resin), "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals, "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical, "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical, "jER1010" (solid bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical, and "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical. These may be used alone or in combination of two or more.

[0232] When a liquid epoxy resin and a solid epoxy resin are used in combination as the (G) component, the ratio of the amounts thereof (liquid epoxy resin:solid epoxy resin) is preferably 1:1 to 1:20, more preferably 1:1.5 to 1:15, and particularly preferably 1:2 to 1:10, by mass. When the ratio of the liquid epoxy resin to the solid epoxy resin is within such a range, the desired effects of the present invention can be significantly obtained. Furthermore, when used in the form of a resin sheet, appropriate adhesion is usually obtained. Furthermore, when used in the form of a resin sheet, sufficient flexibility is usually obtained, and handling is improved. Furthermore, a cured product having sufficient breaking strength can usually be obtained.

[0233] The epoxy equivalent of the (G) component is preferably 50 g / eq. to 5000 g / eq., more preferably 50 g / eq. to 3000 g / eq., even more preferably 80 g / eq. to 2000 g / eq., and even more preferably 110 g / eq. to 1000 g / eq. When it is in this range, the crosslink density of the cured product of the resin composition is sufficient, and an insulating layer with small surface roughness can be obtained. The epoxy equivalent is the mass of an epoxy resin containing one equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0234] From the viewpoint of significantly obtaining the desired effects of the present invention, the weight average molecular weight (Mw) of the component (G) is preferably from 100 to 5000, more preferably from 250 to 3000, and even more preferably from 400 to 1500. The weight average molecular weight of the component (G) can be measured by the same method as for the weight average molecular weight of the component (C).

[0235] From the viewpoint of significantly obtaining the desired effects of the present invention, the content of the (G) component, relative to 100 mass% of the non-volatile components in the resin composition, is preferably 0.1 mass% or more, more preferably 0.3 mass% or more, even more preferably 0.5 mass% or more, and is preferably 5 mass% or less, more preferably 3 mass% or less, and particularly preferably 2 mass% or less.

[0236] <(H) Polymerization initiator> In addition to the above-mentioned components, the resin composition may further contain, as an optional component, a polymerization initiator as component (H). The component (H) may be used alone or in combination of two or more types.

[0237] Examples of component (H) include peroxides such as t-butylcumyl peroxide, t-butyl peroxyacetate, α,α'-di(t-butylperoxy)diisopropylbenzene, t-butyl peroxylaurate, t-butylperoxy-2-ethylhexanoate, t-butylperoxyneodecanoate, and t-butyl peroxybenzoate.

[0238] Commercially available products of component (H) include, for example, NOF Corporation's “Perbutyl C”, “Perbutyl A”, “Perbutyl P”, “Perbutyl L”, “Perbutyl O”, “Perbutyl ND”, “Perbutyl Z”, “Percumyl P”, and “Percumyl D”.

[0239] From the viewpoint of significantly obtaining the desired effects of the present invention, the content of the (H) component, relative to 100 mass% of the non-volatile components in the resin composition, is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, even more preferably 0.1 mass% or more, and is preferably 1 mass% or less, more preferably 0.5 mass% or less, even more preferably 0.3 mass% or less.

[0240] <(I) Other additives> The resin composition may further contain other additives as optional components in addition to the above-mentioned components. Examples of such additives include resin additives such as thickeners, defoamers, leveling agents, and adhesion promoters. These additives may be used alone or in combination of two or more. The content of each additive can be appropriately set by a person skilled in the art.

[0241] The method for preparing the resin composition of the present invention is not particularly limited, and examples thereof include a method in which the blending components are mixed and dispersed using a rotary mixer or the like, with the addition of a solvent or the like as necessary.

[0242] <Physical properties and applications of resin compositions> The resin composition contains (A) a maleimide compound having a biphenyl structure, (B) a liquid or semi-solid curing agent, and (C) a high molecular weight component. This allows a cured product with excellent lamination properties, dielectric properties, and adhesion to be obtained. As already mentioned above, when a maleimide compound is added to a resin composition, the resin composition generally has excellent dielectric properties, but the maleimide compound usually has a high softening point, so the resin composition and its cured product become brittle. However, by adding (B) a liquid or semi-solid curing agent, the viscosity of the resin composition before curing increases, and as a result, the brittleness can be improved. Furthermore, by adding (C) a high molecular weight component, the stress in the cured product is alleviated, and the brittleness of the cured product can also be improved.

[0243] The resin composition is thermally cured at 100°C for 30 minutes and then at 180°C for 30 minutes to produce a cured product that exhibits excellent peel strength between the resin composition and a conductor layer (plated conductor layer) formed by plating. Thus, the cured product provides an insulating layer that exhibits excellent peel strength between the resin composition and the plated conductor layer. The peel strength is preferably 0.3 kgf / cm or more, more preferably 0.4 kgf / cm or more, and even more preferably 0.45 kgf / cm or more. The upper limit of the peel strength may be 10 kgf / cm or less. The peel strength of the plated conductor layer can be measured according to the method described in the Examples below.

[0244] The cured product obtained by thermally curing the resin composition at 200°C for 90 minutes exhibits excellent copper foil peel strength. Therefore, the cured product provides an insulating layer having excellent copper foil peel strength. The copper foil peel strength is preferably 0.3 kgf / cm or more, more preferably 0.4 kgf / cm or more, and even more preferably 0.5 kgf / cm or more. The upper limit of the copper foil peel strength may be 10 kgf / cm or less. The copper foil peel strength can be measured according to the method described in the examples below.

[0245] The cured product obtained by thermally curing the resin composition at 200°C for 90 minutes exhibits the characteristic of a low dielectric constant. Thus, the cured product provides an insulating layer with a low dielectric constant. The dielectric constant is preferably 4 or less, more preferably 3.5 or less, and even more preferably 3 or less. The lower limit of the dielectric constant may be 0.001 or more. The dielectric constant can be measured according to the method described in the examples below.

[0246] The cured product obtained by thermally curing the resin composition at 200°C for 90 minutes exhibits the characteristic of a low dielectric loss tangent. Thus, the cured product provides an insulating layer with a low dielectric loss tangent. The dielectric loss tangent is preferably 0.005 or less, more preferably 0.004 or less, and even more preferably 0.003 or less. The lower limit of the dielectric loss tangent may be 0.0001 or more. The dielectric loss tangent can be measured according to the method described in the examples below.

[0247] The resin composition exhibits excellent lamination properties. Specifically, the resin composition is laminated on a glass cloth-based epoxy resin double-sided copper-clad laminate conductor having a comb-shaped conductor pattern with a conductor thickness of 35 μm, and then heat-cured at 100° C. for 30 minutes and then at 180° C. for 30 minutes to form an insulating layer. The unevenness difference between the conductor and other parts of the insulating layer is determined by a non-contact surface roughness meter (WYKO NT3300 manufactured by Beco Instruments) in VSI mode with a 10x lens, and the measurement range is 1.2 mm×0.91 mm. At this time, usually, no voids are generated after lamination, and the unevenness difference between the conductor and other parts is less than 5 μm. Details of the evaluation of lamination properties can be measured according to the method described in the examples below.

[0248] The resin composition of the present invention has excellent lamination properties, can reduce dielectric properties, and can provide an insulating layer with excellent adhesion. Therefore, the resin composition of the present invention can be suitably used as a resin composition for insulating purposes. Specifically, it can be suitably used as a resin composition for forming an insulating layer (resin composition for forming an insulating layer) for forming a conductor layer (including a rewiring layer) formed on an insulating layer.

[0249] Furthermore, in the multilayer printed wiring board described below, the resin composition can be suitably used as a resin composition for forming an insulating layer of a multilayer printed wiring board (resin composition for forming an insulating layer of a multilayer printed wiring board) and a resin composition for forming an interlayer insulating layer of a printed wiring board (resin composition for forming an interlayer insulating layer of a printed wiring board).

[0250] In addition, for example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition of the present invention can be suitably used as a resin composition for a rewiring formation layer (resin composition for forming a rewiring formation layer) as an insulating layer for forming a rewiring layer, and as a resin composition for sealing a semiconductor chip (resin composition for sealing a semiconductor chip). When a semiconductor chip package is manufactured, a rewiring layer may be further formed on the sealing layer. (1) A step of laminating a temporary fixing film onto a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A process of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0251] [Resin sheet] The resin sheet of the present invention includes a support and a resin composition layer formed from the resin composition of the present invention provided on the support.

[0252] The thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, and even more preferably 30 μm or less, from the viewpoint of making the printed wiring board thinner and being able to provide a cured product with excellent insulation even if the cured product of the resin composition is a thin film. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 5 μm or more.

[0253] Examples of the support include films made of plastic materials, metal foils, and release papers, with films made of plastic materials and metal foils being preferred.

[0254] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0255] When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, etc., and copper foil is preferred. As the copper foil, a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0256] The surface of the support to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment.

[0257] In addition, as the support, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. The release agent used in the release layer of the support with a release layer may be, for example, one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. The support with a release layer may be a commercially available product, for example, "SK-1", "AL-5", and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Unipeel" manufactured by Unitika Limited, which are PET films having a release layer mainly composed of an alkyd resin-based release agent.

[0258] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the total thickness of the support with a release layer is in the above range.

[0259] In one embodiment, the resin sheet may further include other layers as necessary. Examples of such other layers include a protective film equivalent to the support provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dirt and the like to the surface of the resin composition layer and scratches can be suppressed.

[0260] The resin sheet can be produced, for example, by preparing a resin varnish by dissolving a resin composition in an organic solvent, applying this resin varnish onto a support using a die coater or the like, and then drying the same to form a resin composition layer.

[0261] Examples of organic solvents include ketones such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetates such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitols such as cellosolve and butyl carbitol; aromatic hydrocarbons such as toluene and xylene; and amide solvents such as dimethylformamide, dimethylacetamide (DMAc), and N-methylpyrrolidone. The organic solvents may be used alone or in combination of two or more.

[0262] Drying may be performed by a known method such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is performed so that the content of organic solvent in the resin composition layer becomes 10 mass % or less, preferably 5 mass % or less. Although it varies depending on the boiling point of the organic solvent in the resin varnish, for example, when a resin varnish containing 30 mass % to 60 mass % of organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0263] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0264] [Printed wiring board] The printed wiring board of the present invention includes an insulating layer formed from a cured product of the resin composition of the present invention.

[0265] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate so that a resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of thermally curing the resin composition layer to form an insulating layer

[0266] The "inner layer substrate" used in step (I) is a member that becomes the substrate of a printed wiring board, and examples thereof include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. The substrate may have a conductor layer on one or both sides, and the conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be called an "inner layer circuit substrate". In addition, an intermediate product on which an insulating layer and / or a conductor layer is to be further formed during the manufacture of a printed wiring board is also included in the "inner layer substrate" of the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0267] The lamination of the inner layer substrate and the resin sheet can be carried out, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of the member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as the "thermocompression bonding member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). It is preferable to press the thermocompression member not directly onto the resin sheet, but via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the surface irregularities of the inner layer substrate.

[0268] The lamination of the inner layer substrate and the resin sheet may be performed by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably in the range of 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. The lamination is preferably performed under reduced pressure conditions of 26.7hPa or less.

[0269] The lamination can be performed by a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch type vacuum pressure laminator.

[0270] After lamination, the laminated resin sheet may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for the lamination. The smoothing treatment may be performed using a commercially available laminator. The lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0271] The support may be removed between step (I) and step (II) or after step (II).

[0272] In step (II), the resin composition layer is thermally cured to form an insulating layer. The conditions for thermally curing the resin composition layer are not particularly limited, and conditions that are usually employed when forming an insulating layer for a printed wiring board may be used.

[0273] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, etc., but the curing temperature is preferably 120° C. to 240° C., more preferably 150° C. to 220° C., and even more preferably 170° C. to 210° C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0274] Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50° C. or more and less than 120° C. (preferably 60° C. or more and 115° C. or less, more preferably 70° C. or more and 110° C. or less) for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes).

[0275] In manufacturing a printed wiring board, the steps of (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer may be further carried out. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art for use in manufacturing printed wiring boards. When the support is removed after step (II), the support may be removed between step (II) and step (III), between step (III) and step (IV), or between step (IV) and step (V). In addition, the formation of the insulating layer and the conductor layer in steps (II) to (V) may be repeated to form a multilayer wiring board, as necessary.

[0276] Step (III) is a step of drilling holes in the insulating layer, which allows holes such as via holes and through holes to be formed in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, etc., depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be appropriately determined depending on the design of the printed wiring board.

[0277] Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smears are also removed. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions that are usually used when forming an insulating layer of a printed wiring board can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order. The swelling liquid used in the roughening treatment is not particularly limited, but includes an alkaline solution, a surfactant solution, and the like, and is preferably an alkaline solution, and as the alkaline solution, a sodium hydroxide solution and a potassium hydroxide solution are more preferable. Examples of commercially available swelling liquids include "Swelling Dip Securigans P", "Swelling Dip Securigans SBU", and "Swelling Dip Securigant P" manufactured by Atotech Japan. The swelling treatment using a swelling liquid is not particularly limited, but can be performed, for example, by immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40°C to 80°C for 5 to 15 minutes. The oxidizing agent used in the roughening treatment is not particularly limited, but examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment using an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. In addition, the concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securiganth P" manufactured by Atotech Japan. The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available product is, for example, "Reduction Solution Securiganth P" manufactured by Atotech Japan. Treatment with a neutralizing solution can be performed by immersing the surface that has been roughened with an oxidizing agent in the neutralizing solution at 30°C to 80°C for 1 to 30 minutes.From the viewpoint of workability etc., a method in which the object that has been subjected to roughening treatment with an oxidizing agent is immersed in a neutralizing solution at 40° C. to 70° C. for 5 minutes to 20 minutes is preferred.

[0278] In one embodiment, the arithmetic mean roughness (Ra) of the insulating layer surface after the roughening treatment is preferably 300 nm or less, more preferably 250 nm or less, and even more preferably 200 nm or less. There is no particular limit to the lower limit, but it is preferably 30 nm or more, more preferably 40 nm or more, and even more preferably 50 nm or more. The arithmetic mean roughness (Ra) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0279] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. The conductor layer may be a single metal layer or an alloy layer, and examples of the alloy layer include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy and copper-titanium alloy). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, and the like, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0280] The conductor layer may be a single-layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different kinds of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel-chromium alloy.

[0281] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, and preferably 5 μm to 30 μm.

[0282] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer by a conventionally known technique such as a semi-additive method or a full-additive method, and from the viewpoint of ease of production, it is preferable to form the conductor layer by the semi-additive method. An example of forming the conductor layer by the semi-additive method will be described below.

[0283] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer to expose a part of the plating seed layer corresponding to a desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like to form a conductor layer having a desired wiring pattern.

[0284] [Semiconductor Devices] The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured by using the printed wiring board of the present invention.

[0285] Examples of the semiconductor device include various semiconductor devices used in electric appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft).

[0286] The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) on a conductive portion of a printed wiring board. The "conductive portion" refers to a portion of a printed wiring board that transmits an electric signal, and the portion may be either on the surface or embedded. The semiconductor chip is not particularly limited as long as it is an electric circuit element made of semiconductor material.

[0287] The method of mounting a semiconductor chip when manufacturing a semiconductor device is not particularly limited as long as the semiconductor chip functions effectively, but specific examples include a wire bonding mounting method, a flip chip mounting method, a bumpless buildup layer (BBUL) mounting method, an anisotropic conductive film (ACF) mounting method, a non-conductive film (NCF) mounting method, etc. Here, the "bumpless buildup layer (BBUL) mounting method" refers to "a mounting method in which a semiconductor chip is directly embedded in a recess in a printed wiring board and the semiconductor chip is connected to the wiring on the printed wiring board." EXAMPLES

[0288] The present invention will be described in more detail below using examples, but the present invention is not limited to these examples. In the following description, unless otherwise specified, "parts" and "%" mean "parts by mass" and "% by mass", respectively.

[0289] <(B) Determination of the liquid and semi-solid states of liquid or semi-solid hardeners> (B) The liquid, semi-solid, and solid state of the liquid or semi-solid hardener was determined in accordance with the "Method of Confirming Liquid State" in Appendix 2 of the Ministerial Ordinance on the Testing and Properties of Hazardous Materials (Ministry of Home Affairs Ordinance No. 1 of 1989). The "Method of Confirming Liquid State" was performed as described above. The results are shown below. "jER Cure W" manufactured by Mitsubishi Chemical Corporation: liquid "KAYAHARD AA" manufactured by Nippon Kayaku Co., Ltd.: liquid "MEH-8000H" manufactured by Meiwa Kasei: liquid "NK Ester DCP" manufactured by Shin-Nakamura Chemical Co., Ltd.: liquid "NK Ester A-DOG" manufactured by Shin-Nakamura Chemical Industry Co., Ltd.: liquid "RE-810NM" manufactured by Nippon Kayaku Co., Ltd.: liquid "BMI689" Designer Molecules: Liquid "Ricon100" by CRAY VALLEY: Liquid "Ricon130MA13" CRAY VALLEY: Liquid "Ricon150" by CRAY VALLEY: Liquid "JP-100" manufactured by Nippon Soda Co., Ltd.: liquid "ALP-d" manufactured by Shikoku Kasei Corporation: liquid "L-DAIC" manufactured by Shikoku Kasei Corporation: liquid "TAIC" manufactured by Nippon Kasei Co., Ltd.: Liquid "Daiso DAP Monomer" manufactured by Osaka Soda Co., Ltd.: liquid "MDAC" Osaka Soda Co., Ltd.: Liquid "DAD" manufactured by Nisshoku Techno Fine Chemical Co., Ltd.: liquid

[0290] [Synthesis example: Synthesis of polyimide resin] A 500 mL separable flask equipped with a water content receiver connected to a reflux condenser, a nitrogen inlet tube, and a stirrer was prepared. 20.3 g of 4,4'-oxydiphthalic anhydride (ODPA), 200 g of γ-butyrolactone, 20 g of toluene, and 29.6 g of 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindane were added to this flask, and the mixture was stirred at 45°C for 2 hours under a nitrogen stream to carry out a reaction. Next, the reaction solution was heated and maintained at about 160°C, while the condensed water was azeotropically removed together with toluene under a nitrogen stream. It was confirmed that a predetermined amount of water had accumulated in the water content receiver, and that no water was flowing out. After confirmation, the reaction solution was further heated and stirred at 200°C for 1 hour. The mixture was then cooled to obtain a polyimide solution (non-volatile content 20% by mass) containing a polyimide resin having a 1,1,3-trimethylindane skeleton. The obtained polyimide resin had a repeating unit represented by the following formula (X1) and a repeating unit represented by the following formula (X2). The weight average molecular weight of the polyimide resin was 12,000.

[0291] [ka]

[0292] [ka]

[0293] [Example 1. Preparation of resin composition 1] 180 parts of biphenylaralkyl-type maleimide resin ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., maleimide group equivalent: 275 g / eq, MEK / toluene mixed solution with 70% non-volatile content) and 10 parts of polycarbonate resin ("FPC2136" manufactured by Mitsubishi Gas Chemical Co., Ltd., weight average molecular weight 30000) were dissolved in 30 parts of toluene and 30 parts of MEK while stirring and heating. After the obtained solution was cooled to room temperature, 18 parts of an amine-based non-solid curing agent ("jER Cure W" manufactured by Mitsubishi Chemical Co., Ltd.) and 300 parts of an inorganic filler (spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm) surface-treated with a vinyl-based coupling agent ("KBM1003" manufactured by Shin-Etsu Chemical Co., Ltd.) were mixed into the solution and uniformly dispersed in a high-speed rotating mixer to obtain a resin composition 1.

[0294] MIR-3000-70MT is a compound represented by the following structural formula: In the formula, e1 represents an integer of 1 to 100. [ka]

[0295] [Example 2. Preparation of resin composition 2] In Example 1, 1) 18 parts of amine-based non-solid hardener ("jER Cure W" manufactured by Mitsubishi Chemical Corporation) was replaced with 25 parts of amine-based non-solid hardener ("KAYAHARD AA" manufactured by Nippon Kayaku Co., Ltd.), 2) 10 parts of polycarbonate resin (Mitsubishi Gas Chemical Company, Inc. "FPC2136", weight average molecular weight 30,000) was replaced with 50 parts of varnish containing 20% ​​by mass of the polyimide resin obtained in Synthesis Example. Resin composition 2 was obtained in the same manner as in Example 1 except for the above.

[0296] [Example 3. Preparation of resin composition 3] In Example 1, 1) 18 parts of an amine-based non-solid hardener ("jER Cure W" manufactured by Mitsubishi Chemical Corporation) was replaced with 20 parts of an allyl group-containing phenolic resin (an allyl-based non-solid hardener having a phenol ring, "MEH-8000H" manufactured by Meiwa Chemical Industry Co., Ltd., phenol equivalent 240). 2) 10 parts of polycarbonate resin ("FPC2136" manufactured by Mitsubishi Gas Chemical Co., Ltd., weight average molecular weight 30,000) was replaced with 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Co., Ltd., a 1:1 solution of MEK and cyclohexanone with a solid content of 30% by mass, weight average molecular weight 35,000); 3) Furthermore, 0.5 parts of a polymerization initiator ("Perbutyl C" manufactured by NOF Corporation) was used. Resin composition 3 was obtained in the same manner as in Example 1 except for the above.

[0297] [Example 4. Preparation of resin composition 4] In Example 3, 1) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a solid content of 30% by mass, weight average molecular weight of 35,000) was replaced with 50 parts of varnish containing 20% ​​by mass of the polyimide resin obtained in the synthesis example. 2) Furthermore, 10 parts of a carbodiimide-based curing agent ("V-03" manufactured by Nisshinbo Chemical Co., Ltd., active group equivalent of about 216, toluene solution with solid content of 50% by mass) was used. Resin composition 4 was obtained in the same manner as in Example 3 except for the above.

[0298] [Example 5. Preparation of resin composition 5] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, "MEH-8000H" manufactured by Meiwa Chemical Industry Co., Ltd., phenol equivalent 240) was replaced with 13 parts of bifunctional methacrylate ((meth)acrylic non-solid hardener, "NK Ester DCP" manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight 332). 2) 33.3 parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", a 1:1 solution of MEK and cyclohexanone with a solid content of 30% by mass, weight average molecular weight of 35,000) was replaced with 25 parts of polyamideimide resin (DIC Corporation's "Unidic V-8000", weight average molecular weight of 11,000, ethyl diglycol acetate solution with a non-volatile content of 40% by mass). 3) 300 parts of inorganic filler (spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm) surface-treated with a vinyl coupling agent (Shin-Etsu Chemical's "KBM1003")) was changed to 300 parts of inorganic filler (spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm) surface-treated with a methacrylic coupling agent (Shin-Etsu Chemical's "KBM503")). Resin composition 5 was obtained in the same manner as in Example 3 except for the above.

[0299] Unidic V-8000 is a compound represented by the following structural formula: In the formula, e2 represents an integer of 0 to 15. [ka]

[0300] [Example 6. Preparation of resin composition 6] In Example 5, 1) 13 parts of bifunctional methacrylate ((meth)acrylic non-solid curing agent, Shin-Nakamura Chemical Co., Ltd.'s "NK Ester DCP", molecular weight 332) was replaced with 13 parts of bifunctional acrylate ((meth)acrylic non-solid curing agent, Shin-Nakamura Chemical Co., Ltd.'s "NK Ester A-DOG", molecular weight 326); 2) 25 parts of polyamideimide resin (DIC Corporation's "Unidic V-8000", weight average molecular weight 11,000, 40% by mass of non-volatile components in an ethyl diglycol acetate solution) was changed to 10 parts of an acid anhydride group-containing vinyl resin (polystyrene resin, CRAY VALLEY Corporation's "EF-40", weight average molecular weight 11,000). Resin composition 6 was obtained in the same manner as in Example 5 except for the above.

[0301] EF-40 is a compound represented by the following structural formula: In the formula, e3 represents an integer of 8 to 12, and e4 represents an integer of 1 to 8. [ka]

[0302] [Example 7. Preparation of resin composition 7] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid curing agent having a phenol ring, Meiwa Kasei's "MEH-8000H", phenol equivalent 240) was replaced with 13 parts of an allyl non-solid curing agent having an epoxy group (Nippon Kayaku's "RE-810NM", epoxy equivalent 220). 2) In addition, 2 parts of a hardening accelerator (2.5% solids solution of 2P4MZ (2-phenyl-4-methylimidazole) in MEK) was used. Resin composition 7 was obtained in the same manner as in Example 3 except for the above.

[0303] RE-810NM is a compound represented by the following structural formula: e5 represents an integer of 0 to 5. [ka]

[0304] [Example 8. Preparation of resin composition 8] In Example 7, 1) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a solid content of 30% by mass, weight average molecular weight of 35,000) was replaced with 10 parts of hydrogenated styrene-based thermoplastic elastomer ("H1043" manufactured by Asahi Kasei Corporation, weight average molecular weight of 35,000). 2) Furthermore, 10 parts of an active ester curing agent (DIC Corporation's "HPC-8000-65T", active group equivalent 223, toluene solution with solid content of 65% by mass) was used. 3) Change 2 parts of the hardening accelerator (2.5% solids solution of 2P4MZ in MEK) to 2 parts of the hardening accelerator (2.5% solids solution of 1B2PZ (1-benzyl-2-phenylimidazole) in MEK), 4) 300 parts of inorganic filler (spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm) surface-treated with a vinyl coupling agent (Shin-Etsu Chemical's "KBM1003")) was changed to 300 parts of inorganic filler (spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm) surface-treated with a phenylaminosilane coupling agent (Shin-Etsu Chemical's "KBM573")). Resin composition 8 was obtained in the same manner as in Example 7 except for the above.

[0305] [Example 9. Preparation of resin composition 9] In Example 5, 1) 13 parts of bifunctional methacrylate ((meth)acrylic non-solid curing agent, Shin-Nakamura Chemical Co., Ltd.'s "NK Ester DCP", molecular weight 332) was replaced with 13 parts of liquid bismaleimide (maleimide non-solid curing agent, Designer Molecules' "BMI689", maleimide group equivalent 345), 2) 25 parts of polyamideimide resin (DIC Corporation's "Unidic V-8000", weight average molecular weight 11,000, ethyl diglycol acetate solution with 40% by mass of non-volatile components) was changed to 10 parts of polyester resin (Osaka Gas Chemicals Co., Ltd.'s "OKP4HT", weight average molecular weight 50,000). Resin composition 9 was obtained in the same manner as in Example 5 except for the above.

[0306] BMI689 is a compound represented by the following structural formula: [ka]

[0307] [Example 10. Preparation of resin composition 10] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, Meiwa Chemical Industries, Ltd.'s "MEH-8000H", phenol equivalent 240) was replaced with 13 parts of liquid styrene-butadiene polymer (butadiene non-solid hardener, Cray Valley's "Ricon100", styrene content 25%, Mn approx. 4500), 2) 33.3 parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with solid content of 30 mass %) was changed to 10 parts of hydrogenated styrene-based thermoplastic elastomer (Asahi Kasei Corporation's "H1043", weight average molecular weight 35,000). A resin composition 10 was obtained in the same manner as in Example 3 except for the above.

[0308] [Example 11. Preparation of resin composition 11] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent 240) was replaced with 13 parts of acid anhydride group-containing liquid butadiene polymer (butadiene non-solid hardener, "Ricon130MA13" manufactured by CRAY VALLEY Co., Ltd., acid anhydride equivalent 732, Mn approx. 2900), 2) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with solid content of 30 mass %) was changed to 10 parts of an acid anhydride group-containing vinyl resin ("EF-40" manufactured by CRAY VALLEY Corporation, weight average molecular weight 11,000). Resin composition 11 was obtained in the same manner as in Example 3 except for the above.

[0309] [Example 12. Preparation of resin composition 12] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, Meiwa Chemical Industries, Ltd.'s "MEH-8000H", phenol equivalent 240) was replaced with 13 parts of liquid butadiene polymer (butadiene non-solid hardener, Cray Valley's "Ricon150", Mn approx. 3900), 2) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with solid content of 30% by mass) was replaced with 50 parts of varnish containing 20% ​​by mass of the polyimide resin obtained in Synthesis Example. Resin composition 12 was obtained in the same manner as in Example 3 except for the above points.

[0310] [Example 13. Preparation of resin composition 13] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent 240) was replaced with 13 parts of epoxidized polybutadiene (butadiene non-solid hardener, "JP-100" manufactured by Nippon Soda Co., Ltd., epoxy equivalent 210, Mn approx. 1300), 2) 33.3 parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with a solid content of 30% by mass) was replaced with 25 parts of polyamideimide resin (DIC Corporation's "Unidic V-8000", weight average molecular weight 11,000, ethyl diglycol acetate solution with a non-volatile content of 40% by mass); 3) In addition, 2 parts of a hardening accelerator (a MEK solution containing 2.5% solids of 1B2PZ) was used. Resin composition 13 was obtained in the same manner as in Example 3 except for the above.

[0311] [Example 14. Preparation of resin composition 14] In Example 7, 1) 13 parts of an allyl-based non-solid curing agent having an epoxy group ("RE-810NM" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 220) was replaced with 13 parts of an epoxidized polybutadiene (butadiene-based non-solid curing agent, "JP-100" manufactured by Nippon Soda Co., Ltd., epoxy equivalent 210, Mn approx. 1300), 2) In addition, 3 parts of a benzoxazine-based curing agent ("ODA-BOZ" manufactured by JFE Chemical Corporation) was used. 3) 300 parts of inorganic filler (spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm) surface-treated with a vinyl coupling agent (Shin-Etsu Chemical's "KBM1003")) was changed to 300 parts of inorganic filler (spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm) surface-treated with a phenylaminosilane coupling agent (Shin-Etsu Chemical's "KBM573")). Resin composition 14 was obtained in the same manner as in Example 7 except for the above.

[0312] [Example 15. Preparation of resin composition 15] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent 240) was replaced with 5 parts of bifunctional acrylate ((meth)acrylic non-solid hardener, "NK Ester A-DOG" manufactured by Shin-Nakamura Chemical Co., Ltd., molecular weight 326), 2) 33.3 parts of phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30", weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with a solid content of 30 mass%) was replaced with 10 parts of polycarbonate resin (Mitsubishi Gas Chemical Company's "FPC2136", weight average molecular weight 30,000); 3) Furthermore, 20 parts of a MEK solution containing 50% solids of 4,4-Diaminodiphenylmethane was used. Resin composition 15 was obtained in the same manner as in Example 3 except for the above.

[0313] [Example 16. Preparation of resin composition 16] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid curing agent having a phenol ring, Meiwa Chemical Industry Co., Ltd.'s "MEH-8000H", phenol equivalent 240) was replaced with 20 parts of an allyl non-solid curing agent having a benzoxazine ring (Shikoku Chemical Industry Co., Ltd.'s "ALP-d", MEK solution with a solid content of 65%). 2) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with solid content of 30 mass %) was changed to 10 parts of polyester resin ("OKP4HT" manufactured by Osaka Gas Chemicals Co., Ltd., weight average molecular weight 50,000). Resin composition 16 was obtained in the same manner as in Example 3 except for the above.

[0314] ALP-d is a compound represented by the following structural formula: [ka]

[0315] [Example 17. Preparation of resin composition 17] In Example 8, 1) 13 parts of an allyl-based non-solid curing agent having an epoxy group ("RE-810NM" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 220) was replaced with 20 parts of an allyl-based non-solid curing agent having a benzoxazine ring ("ALP-d" manufactured by Shikoku Kasei Corporation, MEK solution with a solid content of 65%). 2) 10 parts of hydrogenated styrene-based thermoplastic elastomer (Asahi Kasei Corporation's "H1043", weight average molecular weight 35,000) was replaced with 25 parts of polyamide-imide resin (DIC Corporation's "Unidic V-8000", weight average molecular weight 11,000, ethyl diglycol acetate solution with non-volatile components of 40% by mass). 3) 10 parts of an active ester curing agent (DIC Corporation's "HPC-8000-65T", active group equivalent 223, toluene solution with solid content of 65% by mass) was changed to 5 parts of bisphenol A type epoxy resin (Mitsubishi Chemical Corporation's "828US", epoxy equivalent approximately 180). Resin composition 17 was obtained in the same manner as in Example 8 except for the above.

[0316] [Example 18. Preparation of resin composition 18] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, Meiwa Chemical Industry Co., Ltd.'s "MEH-8000H", phenol equivalent 240) was replaced with 13 parts of an allyl non-solid hardener having an isocyanuric ring (Shikoku Chemical Industry Co., Ltd.'s "L-DAIC"); 2) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with solid content of 30 mass %) was changed to 10 parts of polyester resin ("OKP4HT" manufactured by Osaka Gas Chemicals Co., Ltd., weight average molecular weight 50,000). Resin composition 18 was obtained in the same manner as in Example 3 except for the above.

[0317] [Example 19. Preparation of resin composition 19] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid curing agent having a phenol ring, "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent 240) was replaced with 13 parts of allyl non-solid curing agent having an isocyanuric ring (triallyl isocyanurate, "TAIC" manufactured by Nippon Kasei Co., Ltd., molecular weight 249), 2) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with solid content of 30 mass %) was changed to 10 parts of polycarbonate resin ("FPC2136" manufactured by Mitsubishi Gas Chemical Company, weight average molecular weight 30,000). Resin composition 19 was obtained in the same manner as in Example 3 except for the above.

[0318] [Example 20. Preparation of resin composition 20] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent 240) was replaced with 13 parts of allyl non-solid hardener (ortho-diallyl phthalate, "Daiso DAP Monomer" manufactured by Osaka Soda Co., Ltd., molecular weight 246), 2) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with solid content of 30% by mass) was replaced with 50 parts of varnish containing 20% ​​by mass of the polyimide resin obtained in Synthesis Example. A resin composition 20 was obtained in the same manner as in Example 3 except for the above points.

[0319] [Example 21. Preparation of resin composition 21] In Example 3, 1) 20 parts of allyl group-containing phenolic resin (allylic non-solid hardener having a phenol ring, "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd., phenol equivalent 240) was replaced with 13 parts of diallyl cyclohexanedicarboxylate (allylic non-solid hardener, "MDAC" manufactured by Osaka Soda Co., Ltd., molecular weight 252), 2) 33.3 parts of phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 35,000, 1:1 solution of MEK and cyclohexanone with solid content of 30 mass %) was changed to 10 parts of polyester resin ("OKP4HT" manufactured by Osaka Gas Chemical Co., Ltd., weight average molecular weight 50,000). Resin composition 21 was obtained in the same manner as in Example 3 except for the above.

[0320] [Example 22. Preparation of resin composition 22] Biphenylaralkyl-type maleimide resin (Nippon Kayaku Co., Ltd. "MIR-3000-70MT", maleimide group equivalent: 275 g / eq, MEK / toluene mixed solution with 70% non-volatile content) 180 parts, phenoxy resin (Mitsubishi Chemical Co., Ltd. "YX7553BH30", weight average molecular weight 35000, 1:1 solution of MEK and cyclohexanone with 30% solid content by mass) 33.3 parts, toluene 20 parts, MEK 20 parts, cyclohexanedicarboxylate diallyl (Osaka Soda Co., Ltd. "MDAC", molecular weight 252) 13 parts, bisphenol A type epoxy resin (Mitsubishi Chemical Co., Ltd. "828US", epoxy equivalent approximately 180) 5 parts, triazine skeleton-containing phenolic hardener (DIC Corporation "LA-3018-50P", 2-methoxy 2-methyl-2-propanediol with hydroxyl group equivalent approximately 151 and 50% solid content) A resin composition 22 was obtained by uniformly dispersing 3 parts of a cyclopropanol solution, 5 parts of an active ester curing agent (DIC Corporation's "HPC-8000-65T", active group equivalent 223, toluene solution with a solid content of 65% by mass), 0.5 parts of a polymerization initiator (NOF Corporation's "Perbutyl C"), 2 parts of a curing accelerator (1B2PZ MEK solution with a solid content of 2.5%), 150 parts of an inorganic filler (spherical silica (Admatechs Co., Ltd.'s "SO-C2", average particle size 0.5 μm) surface-treated with a vinyl coupling agent (Shin-Etsu Chemical Co., Ltd.'s "KBM1003"), and 150 parts of an inorganic filler (spherical silica (Admatechs Co., Ltd.'s "SO-C2", average particle size 0.5 μm) surface-treated with a phenylaminosilane coupling agent (Shin-Etsu Chemical Co., Ltd.'s "KBM573")) with a high-speed rotating mixer.

[0321] [Example 23. Preparation of resin composition 23] In Example 9, 1) 13 parts of liquid bismaleimide (maleimide-based non-solid curing agent, Designer Molecules' "BMI689", maleimide group equivalent 345) was replaced with 13 parts of diallyl diphenate (allyl-based non-solid curing agent, Nisshoku Techno Fine Chemical's "DAD", molecular weight 322). 2) 10 parts of polyester resin ("OKP4HT" manufactured by Osaka Gas Chemicals, weight average molecular weight 50,000) was changed to 10 parts of polycarbonate resin ("FPC2136" manufactured by Mitsubishi Gas Chemicals, weight average molecular weight 30,000). Resin composition 23 was obtained in the same manner as in Example 9 except for the above.

[0322] [Comparative Example 1. Preparation of Comparative Resin Composition 1] In Example 3, 20 parts of the allyl group-containing phenolic resin ("MEH-8000H" manufactured by Meiwa Chemical Industry Co., Ltd., phenol equivalent weight 240) was not used. Comparative resin composition 1 was obtained in the same manner as in Example 3 except for the above.

[0323] [Comparative Example 2. Preparation of Comparative Resin Composition 2] In Example 11, 10 parts of the acid anhydride group-containing vinyl resin (CRAY VALLEY's "EF-40", weight average molecular weight 11,000) was not used. Comparative resin composition 2 was obtained in the same manner as in Example 11 except for the above.

[0324] [Comparative Example 3. Preparation of Comparative Resin Composition 3] In Example 2, 180 parts of biphenylaralkyl-type maleimide resin ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., maleimide group equivalent: 275 g / eq, MEK / toluene mixed solution with 70% non-volatile content) was changed to 126 parts of polyphenylmethanemaleimide ("BMI2300" manufactured by Daiwa Kasei Kogyo Co., Ltd.). Comparative resin composition 3 was obtained in the same manner as in Example 2 except for the above.

[0325] BMI2300 is a compound represented by the following structural formula: n10 represents an integer of 1 to 10. [ka]

[0326] [Preparation of resin sheet] As a support, a polyethylene terephthalate film ("Lumirror R80" manufactured by Toray Industries, Inc., thickness 38 μm, softening point 130° C.) that had been subjected to a release treatment with an alkyd resin-based release agent ("AL-5" manufactured by Lintec Corporation) was prepared.

[0327] Resin compositions 1 to 23 and comparative resin compositions 1 to 3 were each uniformly applied onto a support by a die coater so that the thickness of the resin composition layer after drying was 40 μm, and dried at 70° C. to 95° C. for 4 minutes to form a resin composition layer on the support. Next, the rough surface of a polypropylene film (Oji F-Tex Co., Ltd. "Alphan MA-411", thickness 15 μm) was attached as a protective film to the surface of the resin composition layer that was not bonded to the support. This resulted in a resin sheet A having a support, a resin composition layer, and a protective film in this order.

[0328] [Measurement of peel strength of plated conductor layer] (1) Preparation of inner layer board Both sides of a glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with an inner layer circuit formed were etched 1 μm with a microetching agent (Mec "CZ8101") to roughen the copper surface.

[0329] (2) Lamination of resin sheet The protective film was peeled off from the resin sheet A to expose the resin composition layer. Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., 2-stage build-up laminator "CVP700"), the resin composition layer was laminated on both sides of the inner layer substrate so that it was in contact with the inner layer substrate. The lamination was performed by reducing the pressure for 30 seconds to adjust the air pressure to 13 hPa or less, and then pressing at 120°C and a pressure of 0.74 MPa for 30 seconds. Next, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds.

[0330] (3) Thermal curing of the resin composition layer Thereafter, the inner layer substrate laminated with the resin sheet was placed in an oven at 100° C. and heated for 30 minutes, and then transferred to an oven at 180° C. and heated for 30 minutes to thermally cure the resin composition layer and form an insulating layer. Thereafter, the support was peeled off to obtain a cured substrate A having the insulating layer, the inner layer substrate, and the insulating layer in this order.

[0331] (4) Roughening treatment A desmear treatment was carried out as a roughening treatment on the cured substrate A. The desmear treatment was the following wet desmear treatment. (Wet desmear treatment) The cured substrate A was immersed in a swelling liquid (Atotech Japan's "Swelling Dip Securigant P", an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 5 minutes, then immersed in an oxidizing agent solution (Atotech Japan's "Concentrate Compact CP", an aqueous solution of potassium permanganate at approximately 6% and sodium hydroxide at approximately 4%) at 80°C for 15 minutes, and then immersed in a neutralizing liquid (Atotech Japan's "Reduction Solution Securigant P", an aqueous sulfuric acid solution) at 40°C for 5 minutes, and then dried at 80°C for 15 minutes.

[0332] (5) Formation of the conductor layer A conductor layer was formed on the roughened surface of the insulating layer according to the semi-additive method. That is, the substrate after the roughening treatment was immersed in an electroless plating solution containing PdCl2 at 40°C for 5 minutes, and then immersed in an electroless copper plating solution at 25°C for 20 minutes. Next, an annealing treatment was performed by heating at 150°C for 30 minutes, and then an etching resist was formed and a pattern was formed by etching. Then, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 30 μm, and an annealing treatment was performed at 200°C for 60 minutes. The obtained substrate is called "evaluation substrate B".

[0333] <Measurement of peel strength of plated conductor layer> The peel strength of the insulating layer and the conductor layer was measured in accordance with the Japanese Industrial Standard (JIS C6481). Specifically, a cut was made in the conductor layer of evaluation board B, measuring 10 mm wide and 100 mm long, and one end of the cut was peeled off and held with a gripper. The load (kgf / cm) was measured when 35 mm was peeled off vertically at a speed of 50 mm / min at room temperature, and the peel strength was calculated. A tensile tester (TSE's "AC-50C-SL") was used for the measurement.

[0334] [Measurement of copper foil peel strength] (1) Copper foil preparation The shiny side of Mitsui Mining & Smelting Co., Ltd.'s "3EC-III" (electrolytic copper foil, 35 μm) was etched by 1 μm with a micro-etching agent (Mec Co., Ltd.'s "CZ8101") to roughen the copper surface, and then an anti-rust treatment (CL8300) was applied. Furthermore, it was heated in an oven at 130°C for 30 minutes. This copper foil is called CZ copper foil.

[0335] (2) Preparation of inner layer board Both sides of a glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with an inner layer circuit formed were etched 1 μm with a microetching agent (Mec "CZ8101") to roughen the copper surface.

[0336] (3) Laminating copper foil and forming an insulating layer The protective film was peeled off from the resin sheet A to expose the resin composition layer. Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., 2-stage build-up laminator "CVP700"), the resin composition layer was laminated on both sides of the inner layer substrate so that the resin composition layer was in contact with the inner layer substrate. The lamination was performed by reducing the pressure for 30 seconds to adjust the air pressure to 13 hPa or less, and then pressing at 120°C and a pressure of 0.74 MPa for 30 seconds. Then, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds. The treated surface of the CZ copper foil was laminated on the resin composition layer under the same conditions as above. Then, the resin composition layer was cured under a curing condition of 200°C and 90 minutes to form an insulating layer, thereby producing sample A.

[0337] <Measurement of copper foil peel strength (copper foil adhesion)> The prepared sample A was cut into small pieces of 150 x 30 mm. A cutter was used to make a 10 mm wide and 100 mm long cut in the copper foil part of the small piece, and one end of the copper foil was peeled off and gripped with a gripper. The load (kgf / cm) when 35 mm was peeled off vertically at a speed of 50 mm / min at room temperature was measured to determine the peel strength. A tensile tester (TSE "AC-50C-SL") was used for the measurement. The measurement was performed in accordance with the Japanese Industrial Standard (JIS C6481).

[0338] [Measurement of dielectric properties (dielectric constant, dielectric tangent)] The protective film was peeled off from the resin sheet A produced in the examples and comparative examples, and the resin composition layer was thermally cured by heating at 200°C for 90 minutes, and then the support was peeled off. The obtained cured product was referred to as "evaluation cured product C". The evaluation cured product C was cut into a test piece having a width of 2 mm and a length of 80 mm. The dielectric constant and dielectric loss tangent of the test piece were measured at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C by a cavity resonance perturbation method using an Agilent Technologies "HP8362B". Measurements were performed on three test pieces, and the average values ​​were calculated. The cured product C for evaluation of Comparative Example 2, which did not use the component (C), was brittle and difficult to handle, and therefore the dielectric properties of Comparative Example 2 could not be measured.

[0339] [Evaluation of lamination properties] (1) Preparation of inner layer board A glass cloth-based epoxy resin double-sided copper-clad laminate (substrate thickness 0.8 mm, Panasonic "R1515A") with a comb-shaped conductor pattern of 35 μm thick and L (line: wiring width) / S (space: gap width) = 160 μm / 160 μm was etched on both sides with a microetching agent (Mec "CZ8101") to roughen the copper surface by 1 μm.

[0340] (2) Lamination of resin sheet The protective film was peeled off from the resin sheet A to expose the resin composition layer. Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., 2-stage build-up laminator "CVP700"), the resin composition layer was laminated on both sides of the glass cloth substrate epoxy resin double-sided copper-clad laminate so that the resin composition layer was in contact with the glass cloth substrate epoxy resin double-sided copper-clad laminate. The lamination was performed by reducing the pressure for 30 seconds to adjust the air pressure to 13 hPa or less, and then pressing at 120°C and a pressure of 0.74 MPa for 30 seconds. Next, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds.

[0341] (3) Thermal curing of the resin composition layer Thereafter, the glass cloth-based epoxy resin double-sided copper-clad laminate on which the resin sheet was laminated was placed in a 100°C oven and heated for 30 minutes, and then transferred to a 180°C oven and heated for 30 minutes to thermally cure the resin composition layer and form an insulating layer. Thereafter, the support was peeled off to obtain a cured substrate D having the insulating layer, the glass cloth-based epoxy resin double-sided copper-clad laminate, and the insulating layer in this order.

[0342] (4) Lamination evaluation The value of the unevenness difference (Rt: maximum peak-to-valley) between the conductor and other parts of the insulating layer of the cured substrate D was obtained using a non-contact surface roughness meter (WYKO NT3300 manufactured by Beco Instruments) in VSI mode with a 10x lens, measuring a range of 1.2mm x 0.91mm. Note that the evaluation was made as follows: "○" indicates that no voids were generated after lamination and the unevenness difference between the conductor and other parts was less than 5μm; "△" indicates that no voids were generated after lamination but the unevenness difference between the conductor and other parts was 5μm or more; and "×" indicates that voids were generated after lamination.

[0343] [Table 1]

[0344] [Table 2]

[0345] [Table 3]

[0346] In Examples 1 to 23, it was confirmed that even when components (D) to (H) were not contained, the results were similar to those of the above Examples, although to different degrees.

Claims

1. (A) a maleimide compound having a biphenyl structure, (B) a liquid or semi-solid curing agent, and (C) a high molecular weight component having a weight average molecular weight of 8000 or more, the content of the nonvolatile components in the resin composition of the component (B) taken as 100% by mass is defined as b1, and the content of the nonvolatile components in the resin composition of the component (A) taken as 100% by mass is defined as a1, a1 / b1 is 2 or more, A resin composition, wherein the component (B) is at least one selected from an amine-based non-solid curing agent, a (meth)acrylic-based non-solid curing agent, an allyl-based non-solid curing agent having a benzoxazine ring represented by the following formula (B-1), an allyl-based non-solid curing agent having a carboxylic acid derivative having a cyclic structure, a maleimide-based non-solid curing agent represented by the following general formula (B-6), and a butadiene-based non-solid curing agent (excluding those containing an amino-modified siloxane compound having an aromatic azomethine group in the molecular structure). 【Chemistry 1】 (In formula (B-1), R 20 and R 21 represent an allyl group, R22 represents a q-valent group, q represents an integer of 1 to 4, p1 represents an integer of 1 to 4, and p2 represents an integer of 0 to 2.) 【Chemistry 2】 (In general formula (B-6), M 4 , M 6 and M 7 each independently represent an alkylene group having 5 or more carbon atoms which may have a substituent, M 5 each independently represent a divalent group having an aromatic ring which may have a substituent, R 31 and R 32 each independently represent an alkyl group having 5 or more carbon atoms, t2 represents an integer of 0 to 10, and u1 and u2 each independently represent an integer of 0 to 4.)

2. (A) a maleimide compound having a biphenyl type structure, (B) a liquid or semi-solid curing agent, and (C) a high molecular weight component having a weight average molecular weight of 8000 or more, the content of the non-volatile components in the resin composition of the component (B) taken as 100 mass% is defined as b1, and the content of the non-volatile components in the resin composition of the component (A) taken as 100 mass% is defined as a1, a1 / b1 is 2 or more, The resin composition, wherein the component (B) is at least one selected from the group consisting of a (meth)acrylic non-solid curing agent, an allyl-based non-solid curing agent having a benzoxazine ring represented by the following formula (B-1), an allyl-based non-solid curing agent having a carboxylic acid derivative having a cyclic structure, a maleimide-based non-solid curing agent represented by the following general formula (B-6), and a butadiene-based non-solid curing agent. 【Chemistry 3】 (In formula (B-1), R 20 and R 21 represent an allyl group, R22 represents a q-valent group, q represents an integer of 1 to 4, p1 represents an integer of 1 to 4, and p2 represents an integer of 0 to 2.) 【Chemistry 4】 (In general formula (B-6), M 4 , M 6 and M 7 each independently represent an alkylene group having 5 or more carbon atoms which may have a substituent, M 5 each independently represent a divalent group having an aromatic ring which may have a substituent, R 31 and R 32 each independently represent an alkyl group having 5 or more carbon atoms, t2 represents an integer of 0 to 10, and u1 and u2 each independently represent an integer of 0 to 4.)

3. (A) a maleimide compound having a biphenyl type structure, (B) a liquid or semi-solid curing agent, and (C) a high molecular weight component, the content of the non-volatile components in the resin composition of the component (B) taken as 100 mass% is defined as b1, and the content of the non-volatile components in the resin composition of the component (A) taken as 100 mass% is defined as a1, a1 / b1 is 2 or more, A resin composition, in which the component (B) is at least one selected from an amine-based non-solid curing agent, a (meth)acrylic-based non-solid curing agent, a maleimide-based non-solid curing agent represented by the following general formula (B-6), and a butadiene-based non-solid curing agent (however, excluding those containing an amino-modified siloxane compound having an aromatic azomethine group in the molecular structure, and excluding those containing an allyl compound). 【Chemistry 5】 (In general formula (B-6), M 4 , M 6 and M 7 each independently represent an alkylene group having 5 or more carbon atoms which may have a substituent, M 5 each independently represent a divalent group having an aromatic ring which may have a substituent, R 31 and R 32 each independently represent an alkyl group having 5 or more carbon atoms, t2 represents an integer of 0 to 10, and u1 and u2 each independently represent an integer of 0 to 4.)

4. (A) a maleimide compound having a biphenyl type structure, (B) a liquid or semi-solid curing agent, and (C) a high molecular weight component, A resin composition in which a1 / b1 is 2 or more, where b1 is the content of non-volatile components in the resin composition of component (B) taken as 100% by mass, and a1 is the content of non-volatile components in the resin composition of component (A) taken as 100% by mass (however, excluding those containing an amino-modified siloxane compound having an aromatic azomethine group in its molecular structure, excluding those containing an allyl compound, and excluding those containing one or more cyanate ester compounds selected from the group consisting of naphthol aralkyl-type cyanate ester compounds, xylene resin-type cyanate ester compounds, trisphenolmethane-type cyanate ester compounds, and adamantane skeleton-type cyanate ester compounds).

5. (A) a maleimide compound having a biphenyl type structure, (B) a liquid or semi-solid curing agent, and (C) a high molecular weight component, the content of the nonvolatile components in the resin composition of the component (B) taken as 100% by mass is defined as b1, and the content of the nonvolatile components in the resin composition of the component (A) taken as 100% by mass is defined as a1, a1 / b1 is 2 or more, A resin composition, in which the component (B) is at least one selected from an amine-based non-solid curing agent, a (meth)acrylic-based non-solid curing agent, an allyl-based non-solid curing agent having a benzoxazine ring represented by the following formula (B-1), an allyl-based non-solid curing agent having a carboxylic acid derivative having a cyclic structure, a maleimide-based non-solid curing agent represented by the following general formula (B-6), and a butadiene-based non-solid curing agent (however, excluding those containing an amino-modified siloxane compound having an aromatic azomethine group in the molecular structure, and excluding those containing a modified polyphenylene ether compound terminally modified with a substituent having a carbon-carbon unsaturated double bond). 【Chemistry 6】 (In formula (B-1), R 20 and R 21 represent an allyl group, R22 represents a q-valent group, q represents an integer of 1 to 4, p1 represents an integer of 1 to 4, and p2 represents an integer of 0 to 2.) 【Chemistry 7】 (In general formula (B-6), M 4 , M 6 and M 7 each independently represent an alkylene group having 5 or more carbon atoms which may have a substituent, M 5 each independently represent a divalent group having an aromatic ring which may have a substituent, R 31 and R 32 each independently represent an alkyl group having 5 or more carbon atoms, t2 represents an integer of 0 to 10, and u1 and u2 each independently represent an integer of 0 to 4.)

6. (A) a maleimide compound having a biphenyl type structure, (B) a liquid or semi-solid curing agent, and (C) a high molecular weight component, the content of the non-volatile components in the resin composition of the component (B) taken as 100 mass% is defined as b1, and the content of the non-volatile components in the resin composition of the component (A) taken as 100 mass% is defined as a1, a1 / b1 is 2 or more, A resin composition, in which the component (B) is at least one selected from the group consisting of a (meth)acrylic non-solid curing agent, an allyl-based non-solid curing agent having a benzoxazine ring represented by the following formula (B-1), an allyl-based non-solid curing agent having a carboxylic acid derivative having a cyclic structure, a maleimide-based non-solid curing agent represented by the following general formula (B-6), and a butadiene-based non-solid curing agent (excluding those containing a modified polyphenylene ether compound terminally modified with a substituent having a carbon-carbon unsaturated double bond). 【Chemistry 8】 (In formula (B-1), R 20 and R 21 represent an allyl group, R22 represents a q-valent group, q represents an integer of 1 to 4, p1 represents an integer of 1 to 4, and p2 represents an integer of 0 to 2.) 【Chemistry 9】 (In general formula (B-6), M 4 , M 6 and M 7 each independently represent an alkylene group having 5 or more carbon atoms which may have a substituent, M 5 each independently represent a divalent group having an aromatic ring which may have a substituent, R 31 and R 32 each independently represent an alkyl group having 5 or more carbon atoms, t2 represents an integer of 0 to 10, and u1 and u2 each independently represent an integer of 0 to 4.)

7. A resin composition described in any one of claims 1 to 6, wherein a1 / b1 is 30 or less.

8. A resin composition described in any one of claims 1 to 7, wherein the component (A) is represented by the following formula (A-3). 【Chemistry 10】 In formula (A-3), R 3 and R 8 represent a maleimide group, R 4 , R 5 , R 6 and R 7 each independently represent a hydrogen atom, an alkyl group or an aryl group, R 9 and R 10 each independently represent a substituent, a1 and b1 each independently represent an integer of 0 to 4, m1 and m2 each independently represent an integer of 1 to 10, and n represents an integer of 1 to 100.

9. A resin composition described in any one of claims 1 to 8, wherein the content of component (A) is 10 mass% or more and 40 mass% or less, when the non-volatile components in the resin composition are 100 mass%.

10. A resin composition described in any one of claims 1 to 9, wherein the content of component (B) is 0.1 mass% or more and 15 mass% or less, when the non-volatile components in the resin composition are 100 mass%.

11. A resin composition described in any one of claims 1 to 10, wherein component (C) is a thermoplastic resin.

12. The resin composition described in claim 11, wherein the thermoplastic resin is at least one selected from a polyimide resin, a polycarbonate resin, and a phenoxy resin.

13. A resin composition described in any one of claims 1 to 12, wherein the content of component (C) is 0.5 mass% or more and 10 mass% or less, when the non-volatile components in the resin composition are 100 mass%.

14. A resin composition described in any one of claims 1 to 13, further comprising (D) an inorganic filler.

15. A resin composition as described in claim 14, wherein the content of component (D) is 50 mass% or more when the non-volatile components in the resin composition are 100 mass%.

16. A resin composition described in any one of claims 1 to 15, for forming an insulating layer.

17. A resin composition described in any one of claims 1 to 16, which is for forming an insulating layer to form a conductor layer.

18. A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition comprising the resin composition according to any one of claims 1 to 17.

19. A printed wiring board comprising an insulating layer formed from a cured product of the resin composition described in any one of claims 1 to 17.

20. A semiconductor device comprising the printed wiring board described in claim 19.

Images