Polyimide film

JP2024122944A5Pending Publication Date: 2026-07-01SUMITOMO CHEM CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SUMITOMO CHEM CO LTD
Filing Date
2024-05-09
Publication Date
2026-07-01

AI Technical Summary

Technical Problem

Polyimide films used in flexible printed circuit boards face challenges in achieving high puncture strength while maintaining appropriate dielectric properties, particularly for high-speed communication applications like 5G.

Method used

A laminated film structure with specific relationships between the thickness and transmittance of polyimide resin-containing layers, utilizing a combination of polyimide resins with controlled structural units and layer configurations to enhance puncture strength and reduce dielectric loss.

Benefits of technology

The laminated film achieves high puncture strength and low dielectric loss, suitable for high-speed communication applications by optimizing the interaction and orientation of polyimide resin molecules, thereby improving mechanical and dielectric properties.

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Patent Text Reader

Abstract

To provide a polyimide laminate film having high puncture strength, a laminate sheet including the laminate film, and a flexible printed circuit board.SOLUTION: A laminate film comprises three or more polyimide resin-containing layers. When a thickness of a laminate (L) comprises two of the polyimide resin-containing layers constituting the laminate film that are in the most distant positional relation to each other and layers located between the two polyimide resin-containing layers is defined as T (μm), a total light transmittance of the laminate (L) is defined as Tt (%), and a diffused light transmittance of the laminate (L) is defined as Td (%), a value of Formula (I): Tt / (T×(Td)1 / 2) is less than 0.300.SELECTED DRAWING: None
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