Light-emitting device and method for manufacturing the same

Abstract

To reduce leakage current between a first electrode (anode) and a second electrode (cathode) by ensuring the thickness of an organic layer of a light-emitting device.SOLUTION: A light-emitting device of the present disclosure has a first element and a second element on a substrate. The first element and the second element each have a reflecting part, a first insulating layer, a first electrode, an organic layer including a luminous layer, and a second electrode, in this order from a side of the substrate. The first insulating layer has a recess between the reflecting part of the first element and the reflecting part of the second element. A conductor is arranged in the recess.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The technology of the present disclosure relates to a light emitting device and a manufacturing method thereof. [Background technology]

[0002] Organic devices having an organic functional layer containing an organic compound, such as an organic light-emitting element having an organic electroluminescence (hereinafter, organic EL) film, are known. Patent Document 1 describes a light-emitting device having a configuration in which light emitted from an organic light-emitting element passes through a color filter to obtain a desired light emission color for each of the B, G, and R pixels. In this light-emitting device, an optical resonance structure is constructed between a power line functioning as a reflector for each of the B, G, and R pixels and a counter electrode, and light emission with enhanced brightness is obtained at a resonance wavelength corresponding to each of the B, G, and R light emission colors. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-72282 Summary of the Invention [Problem to be solved by the invention]

[0004] In the light-emitting device described in Patent Document 1, a step occurs between the reflective sections of adjacent organic light-emitting elements due to the reflective sections. This step makes the organic layer thinner, and the distance between the first electrode (anode) and the second electrode (cathode) becomes shorter, which causes leakage current and reduces the luminous efficiency of the organic light-emitting element. In addition, an insulating layer must be formed precisely above this step as an optical adjustment layer, so the step is flattened by a method such as CMP (Chemical Mechanical Polishing). It is not suitable to flatten it.

[0005] The technique of the present disclosure has been made in view of the above, and aims to ensure the thickness of the organic layers in a light-emitting device and reduce leakage current between a first electrode (anode) and a second electrode (cathode). [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, the light-emitting device according to the present disclosure includes a light-emitting device having a first element and a second element on a substrate, each of the first element and the second element having a reflective portion, a first insulating layer, a first electrode, an organic layer including a light-emitting layer, and a second electrode, in this order from the substrate side, the first insulating layer having a recess between the reflective portion of the first element and the reflective portion of the second element, and a conductor arranged in the recess. The light-emitting device according to the present disclosure also includes a light-emitting device having a first element and a second element on a substrate, each of the first element and the second element having a reflective portion, a first insulating layer, a first electrode, an organic layer including an emitting layer, and a second electrode, in this order from the substrate side, the first insulating layer having a recess between the reflective portion of the first element and the reflective portion of the second element, and a third insulating layer being disposed in a region overlapping with the recess when viewed in a plane of the substrate. A light-emitting device according to the present disclosure includes a first element and a second element on a substrate, each of the first element and the second element having a reflective portion, a first insulating layer, a first electrode, an organic layer including a light-emitting layer, and a second electrode, in this order from the substrate side, a connection portion electrically connected to the first electrode is disposed between the reflective portion of the first element and the reflective portion of the second element, and a recess is formed in the first electrode. Includes a light device.

[0007] In addition, in order to achieve the above-mentioned object, a manufacturing method for a light-emitting device according to the present disclosure includes a manufacturing method for a light-emitting device characterized by having a step of forming a reflective portion of a first element and a reflective portion of a second element on a substrate; a step of forming a first insulating layer of the first element and a second insulating layer of the second element, and forming the first insulating layer of the first element or the second insulating layer of the second element between the reflective portion of the first element and the reflective portion of the second element; a step of forming a first electrode of the first element and a first electrode of the second element; and a step of forming a conductor in the first insulating layer of the first element or the first insulating layer of the second element between the reflective portion of the first element and the reflective portion of the second element. Effect of the Invention

[0008] According to the technique of the present disclosure, it is possible to ensure the thickness of the organic layers in the light-emitting device and reduce the leakage current between the first electrode (anode) and the second electrode (cathode). [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view showing an example of a light emitting device according to a first embodiment. [Diagram 2] FIG. 1 is a plan view showing an example of a light emitting device according to a first embodiment; [Figure 3A] 1 is a diagram showing a manufacturing process of an example of a light emitting device according to a first embodiment; [Figure 3B] FIG. 3B is a diagram showing a manufacturing process of the light emitting device performed after FIG. 3A. [Figure 3C] FIG. 3B shows a manufacturing process of the light emitting device performed after FIG. [Figure 3D] FIG. 3C shows a manufacturing process of the light emitting device performed after FIG. [Figure 3E] FIG. 3D shows a manufacturing process of the light emitting device performed after FIG. [Figure 3F] FIG. 3B is a diagram showing a manufacturing process of the light emitting device performed after FIG. 3E. [Figure 3G] FIG. 3F shows a manufacturing process of the light emitting device performed after FIG. [Figure 3H]FIG. 3C is a diagram showing a manufacturing process of the light emitting device performed after FIG. 3G. [Figure 3I] FIG. 3C is a diagram showing a manufacturing process of the light emitting device performed after FIG. 3H. [Figure 4] FIG. 11 is a cross-sectional view showing an example of a light emitting device according to a second embodiment. [Diagram 5] FIG. 11 is a plan view showing an example of a light emitting device according to a second embodiment. [Figure 6] FIG. 11 is a cross-sectional view showing an example of a light-emitting device according to a third embodiment. [Figure 7] FIG. 13 is a cross-sectional view showing an example of a light emitting device according to a fourth embodiment. [Figure 8] FIG. 13 is a plan view showing an example of a light emitting device according to a fourth embodiment. [Figure 9] FIG. 13 is a cross-sectional view showing an example of a light emitting device according to a fifth embodiment. [Figure 10] FIG. 13 is a cross-sectional view showing an example of a light-emitting device according to a sixth embodiment. [Figure 11] FIG. 13 is a plan view showing an example of a light emitting device according to a sixth embodiment. [Figure 12] FIG. 13 is a cross-sectional view showing an example of a light emitting device according to a seventh embodiment. [Figure 13] FIG. 13 is a cross-sectional view showing an example of a light-emitting device according to an eighth embodiment. [Figure 14] FIG. 13 is a plan view showing an example of a light emitting device according to an eighth embodiment. [Figure 15] FIG. 13 is a cross-sectional view showing an example of a light-emitting device according to a ninth embodiment. [Figure 16] FIG. 13 is a plan view showing an example of a light emitting device according to a ninth embodiment. [Figure 17] FIG. 1 is a diagram illustrating an example of a display device according to an embodiment. [Figure 18] FIG. 1 illustrates an example of an imaging device and an electronic device according to an embodiment. [Figure 19] FIG. 1 is a diagram illustrating an example of a display device according to an embodiment. [Figure 20] FIG. 1 is a diagram showing an example of a vehicle having a lighting device and a lamp according to an embodiment; [Figure 21] FIG. 1 is a diagram illustrating an example of a wearable device according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Note that the present disclosure is not limited to the following embodiment, and can be modified as appropriate without departing from the gist of the present disclosure. In addition, in the drawings described below, parts having the same functions are given the same reference numerals, and the description thereof will be the same as that of the drawings described below. Explanations may be omitted or abbreviated.

[0011] First Embodiment FIG. 1 is a schematic cross-sectional view of a light-emitting device 1 according to a first embodiment. As shown in FIG. 1, a wiring layer (drive circuit layer) 101 is provided on the upper side, which is the first direction side, of a substrate 100, and a first planarization layer 102 is provided on the wiring layer 101. A plurality of organic light-emitting elements 10 and 20 are provided on the first planarization layer 102. Each of the organic light-emitting elements 10 and 20 has a reflecting portion 104, a first insulating layer 105 as an optical adjustment layer, a first electrode 110 as an anode, a second insulating layer 120, an organic layer 130 including a light-emitting layer, and a second electrode 140 as a cathode, in this order from the substrate side. The wiring layer 101 and the reflecting portion 104 are electrically connected to the wiring layer 101 via a first conductive plug 103. The organic light-emitting element 10 is an example of a first element, and the organic light-emitting element 20 is an example of a second element.

[0012] In addition, a part of the reflective portion 104 and a part of the first electrode 110 are electrically connected. The organic layer 130 has a light-emitting layer, which is common to the multiple organic light-emitting elements 10, 20. The organic layer 130 also includes at least an organic light-emitting material layer. The organic layer 130 may further include, for example, a charge transport layer, a charge injection layer, a charge generation layer, etc. The organic layer 130 is formed as a common layer for the multiple organic light-emitting elements 10, 20 without being patterned for each of the organic light-emitting elements 10, 20.

[0013] Further, the first insulating layer 105 is disposed so as to cover the reflective portion 104. The first insulating layer 105 is disposed between the reflective portions 104, and the first insulating layer 105 has a step portion 180 which is a recess caused by the thickness of the reflective portion 104. Furthermore, a conductor 110a formed of the same material as the first electrode 110 is disposed between the adjacent reflective portions 104 on the upper side of the first insulating layer 105. In this manner, in the step portion 180 formed between the adjacent reflective portions 104, the step portion 180 can be reduced by disposing the conductor 110a on the upper side of the first insulating layer. Then, by reducing the step portion 180, it is possible to suppress the organic layer 130 from becoming thin, and it is possible to reduce the leakage current between the first electrode (anode) and the second electrode (cathode) via the charge transport layer, the charge injection layer, or the charge generation layer.

[0014] In Fig. 1, the above-mentioned components of the organic light-emitting elements 10 and 20 are protected by a moisture-proof layer 150 provided on the second electrode 140. In addition, a second planarization layer 160 and a color filter layer 170 are provided on the moisture-proof layer 150. The organic layer 130 may be laminated in a plurality of layers for each of a plurality of luminescent colors, and for example, the organic layer 130 is configured to emit white light. The white light emitted from the organic layer 130 of the organic light-emitting elements 10 and 20 is separated into red light, green light, or blue light by transmitting through the color filter layer 170, and is then emitted from the organic light-emitting elements 10 and 20.

[0015] FIG. 2 shows an example of a planar configuration diagram of the first electrode 110 and the conductor 110a between adjacent reflectors 104 in the light-emitting device 1 according to this embodiment. FIG. 1 is a schematic cross-sectional diagram of the light-emitting device 1 taken along line A-A' in FIG. 2. The reflector 104 is disposed on the first planarization layer 102. The reflector 104 may have, for example, a hexagonal shape in a plan view of the substrate 100, but may have another polygonal shape or a shape other than a polygon. The first electrode 110 is disposed on the reflector 104 for each of the organic light-emitting elements 10 and 20. The first electrode 110 may have, for example, a circular shape in a plan view of the substrate 100, but may have a polygonal shape. The conductor 110a may be disposed between adjacent reflectors 104, but may be disposed only in a part of the region between the reflectors 104 in a plan view of the substrate 100, or may be disposed so as to overlap with the reflector 104. Furthermore, when the first electrode 110 is electrically insulated for each of the organic light emitting elements 10 and 20, the conductor 110a and the first electrode 110 may be connected.

[0016] Next, a method for manufacturing the light emitting device 1 of this embodiment will be described with reference to Figures 3A to 3I. First, as shown in Figure 3A, transistors and capacitors of a driving circuit including a pixel driving circuit are arranged by a known MOS process on a substrate 100, which is, for example, a silicon substrate doped with impurities, to form a wiring layer 101. Next, an insulating film such as an oxide film (SiOx) or an oxynitride film (SiON) is formed on the wiring layer 101 by, for example, a plasma CVD method, a high density plasma method, or a combination of these manufacturing methods, and a first planarization layer 102 is formed by planarizing the surface including the pixel region by a CMP method.

[0017] Next, a plurality of openings are formed at predetermined positions by photolithography and dry etching in the first planarization layer 102. For example, tungsten (W) is placed in each opening, and excess portions are removed by CMP or etch-back to form first conductive plugs 103 made of a conductive material (tungsten).

[0018] Next, as shown in FIG. 3B, an AlCu film (for example, an Al film with 0.5 (atm%) of Cu added) is formed on the first planarization layer 102 by, for example, a sputtering method. After that, the AlCu film is patterned by photolithography and dry etching or wet etching to form a plurality of reflective portions 104. Next, as shown in FIG. 3C, a first insulating layer 105 made of a SiO2 film is formed by, for example, a plasma CVD method. Here, in a plan view of the substrate 100, the center portion of the reflective portion 104 may be removed by photolithography and dry etching, and the first insulating layer 105 may be further laminated. This allows the thickness of the first insulating layer 105 to be adjusted according to the emission color for each of the organic light-emitting elements 10 and 20.

[0019] Next, as shown in FIG. 3D, an opening (contact hole) 105a is formed in the first insulating layer 105 by photolithography and dry etching. Then, as shown in FIG. 3E, a first electrode 110 made of an ITO film or an IZO film is formed by, for example, sputtering. Then, as shown in FIG. 3F, a plurality of first electrodes 110 are formed by patterning the first electrode 110 by photolithography and dry etching. In addition, a conductor 110a made of the same material as the first electrode 110 is formed between the reflective portions 104 by patterning. By forming the conductor 110a between the reflective portions 104, the step of the step portion 180 occurring between the adjacent reflective portions 104 can be reduced. In addition, when forming the first electrode 110, the first insulating layer 105 may be over-etched by dry etching, increasing the step between the adjacent reflective films, but by forming the conductor 110a, such a possibility can be reduced.

[0020] Moreover, the manufacturing method of the light emitting device 1 of this embodiment differs from the manufacturing method of the conventional light emitting device in that the conductor 110a is formed on the upper side of the first insulating layer 105 by patterning. Therefore, according to this embodiment, it is possible to reduce the step without worrying about a decrease in manufacturing efficiency due to an increase in the number of steps from the conventional manufacturing method of the light emitting device. Furthermore, by reducing the step of the step portion 180 between the adjacent reflective portions 104, it is possible to ensure the thickness of the organic layer 130 and reduce the occurrence of leakage current between the first electrode 110 and the second electrode 140.

[0021] Next, as shown in FIG. 3G, a second insulating layer 120 made of a SiO2 film or a Si3N4 film is formed by, for example, a plasma CVD method so as to cover the multiple first electrodes 110, the conductors 110a, and the first insulating layer 105. The second insulating layer 120 is formed so as to cover the ends of the first electrodes 110 of the organic light-emitting elements 10 and the ends of the first electrodes 110 of the organic light-emitting elements 20. Next, as shown in FIG. 3H, the second insulating layer 120 is patterned by a photolithography method and a dry etching method to form an opening 120a in the second insulating layer 120. Then, as shown in FIG. 3I, an organic layer 130 is formed by sequentially stacking an organic layer having a lower resistance than an emitting layer, such as a hole injection layer or a hole transport layer, an emitting layer, and an electron transport layer, as organic materials constituting the organic light-emitting element, for example, by a vacuum deposition method. Examples of the vacuum deposition method that can be used include a rotary deposition method, a line deposition method, and a transfer deposition method. The organic layer 130 may be a hole injection layer, a hole transport layer, an emitting layer, a charge generation layer, an emitting layer, and an electron transport layer.

[0022] Then, the second electrode 140 is formed by a vacuum deposition method without exposing the substrate 100 and each layer formed on the substrate 100 to the atmosphere from the reduced pressure atmosphere. Next, the moisture-proof layer 150 is formed so as to cover the second electrode 140, for example, by a plasma CVD method, a sputtering method, an ALD method, or a combination of these methods. The deposition temperature of the moisture-proof layer 150 is preferably equal to or lower than the decomposition temperature of the organic material constituting the organic layer 130, for example, equal to or lower than 120°C. Then, a transparent second planarization layer 160 having flatness is formed on the moisture-proof layer 150. Then, for example, a material of a red filter is applied on the second planarization layer 160, and patterned by photolithography to form a red filter. Next, similar to the formation of the red filter, a green filter and a blue filter are sequentially formed, thereby forming a color filter layer 170 on the second planarization layer 160. The second planarization layer 160 is disposed for the purpose of improving the adhesion between the moisture-proof layer 150 and the color filter layer 170, and is not essential for implementing this embodiment. Then, the terminal extraction pad portion in the display device is patterned into a predetermined shape by photolithography and dry etching.

[0023] Furthermore, in the light emitting device 1 of the present embodiment, if the optical path length from the upper surface of the first electrode 110 to the light emitting position of the light emitting layer in the organic layer 130 is L, then the following formula (1) holds. L = (2m-1) × (λ / 4) (1) Here, m is an integer. The optical distance of the organic layer 130 can be optimized so as to satisfy the above formula (1). Here, λ may be the dominant wavelength of the light emitted by the light-emitting layer. For example, when an organic light-emitting element having the light-emitting layer is used in a blue pixel, λ may be the blue light-emitting wavelength. The dominant wavelength λ may be the wavelength emitted from the organic light-emitting element and extracted to the outside of the organic light-emitting element. The dominant wavelength λ may be the maximum peak wavelength of the light-emitting material of the light-emitting layer. If the wavelength λ satisfies formula (1), the light emitted by the light-emitting layer is intensified, but the light emitted by the light-emitting layer can also be intensified by using a wavelength λ within a range of values ​​shifted by ±λ / 8. That is, in this embodiment, a wavelength λ that satisfies the following formula (2) may be adopted. L=(2m-1)×(λ / 4)±λ / 8 ···(2)

[0024] As described above, according to the light emitting device 1 of the present embodiment, the thickness of the organic layer 130 can be ensured and the leakage current between the first electrode 110 and the second electrode 140 can be reduced.

[0025] <Second embodiment> Next, a light emitting device according to a second embodiment will be described. In the following description, the same components as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0026] FIG. 4 shows a schematic cross-sectional view of the light-emitting device 2 according to the present embodiment. In FIG. 4, the substrate 100, wiring layer 101, organic layer 130, second electrode 140, moisture-proof layer 150, second planarization layer 160, and color filter layer 170 of the light-emitting device 2 are omitted. In addition, FIG. 5 shows an example of a plan configuration diagram of adjacent reflectors 104, first electrodes 110, and conductors 210a in the light-emitting device 2 according to the present embodiment. In FIG. 5, other components constituting the light-emitting device 2 are omitted because they are similar to those of the light-emitting device 1 according to the first embodiment.

[0027] In the light emitting device 1 of the first embodiment, as shown in FIG. 2, the conductors 110a are adjacent to each other in the reflecting portion 1. 5, in the light emitting device 2 of the present embodiment, the conductor 210a is disposed between the adjacent reflective portions 104 and so as to overlap with the reflective portions 104 in a plan view of the substrate 100. This makes it possible to process each layer formed by patterning using photolithography more finely on the same plane in the manufacturing method of the light emitting device described with reference to FIGS. 3A to 3I.

[0028] <Third embodiment> Next, a light emitting device according to a third embodiment will be described. In the following description, the same components as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0029] Fig. 6 shows an example of a plan view of the adjacent reflector 104, first electrode 110, and conductor 310a in the light emitting device 3 according to this embodiment. Note that other components constituting the light emitting device 3 are omitted in Fig. 6 because they are similar to those of the light emitting device 1 according to the first embodiment.

[0030] The light emitting device 3 of this embodiment has organic light emitting elements 10, 20, and 30. The organic light emitting element 30 is a third element having a reflecting portion 104, a first insulating layer 105 as an optical adjustment layer, a first electrode 110 as an anode, a second insulating layer 120, an organic layer 130 including a light emitting layer, and a second electrode 140 as a cathode, in this order from the substrate side. As shown in FIG. 6, the organic light emitting elements 10, 20, and 30 are arranged so that a triangle is formed when the centers O1, O2, and O3 of the reflecting portions 104 of the organic light emitting elements 10, 20, and 30 are connected by line segments in a plan view of the substrate 100. Then, a conductor 310a is arranged at the position of the center of gravity G1 of this triangle in a plan view of the substrate 100.

[0031] Between adjacent reflectors 104, the area facing the organic light-emitting elements tends to be larger than other areas between adjacent reflectors 104, and as a result, the step of the step portion formed between the reflectors 104 may also be larger. Therefore, in this embodiment, as shown in FIG. 6, the conductor 310a is formed in a region facing the organic light-emitting elements between the reflectors 104 and overlapping with the center of gravity G1 of the triangle. Therefore, the region overlapping with the center of gravity G1 of the triangle is a region in contact with the three reflectors 104 of the organic light-emitting elements 10, 20, and 30, and is not a region in contact with only two of the reflectors 104 of the organic light-emitting elements 10, 20, and 30. By forming the conductor 310a in such a region, in the light-emitting device 3, the step of the step portion formed between the reflectors 104 can be effectively reduced, and the aperture of the pixel using the organic light-emitting elements can be prevented from being reduced.

[0032] <Fourth embodiment> Next, a light emitting device according to a fourth embodiment will be described. In the following description, the same components as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0033] Fig. 7 shows a schematic cross-sectional view of the light-emitting device 4 according to the present embodiment. In Fig. 7, the substrate 100, wiring layer 101, organic layer 130, second electrode 140, moisture-proof layer 150, second planarization layer 160, and color filter layer 170 of the light-emitting device 4 are omitted. Fig. 8 shows an example of a plan configuration diagram of adjacent reflectors 104 and first electrodes 410 in the light-emitting device 4 according to the present embodiment. In Fig. 8, other components constituting the light-emitting device 4 are omitted because they are similar to those of the light-emitting device 1 according to the first embodiment.

[0034] In this embodiment, as an example, the first electrode 110 of the organic light-emitting element 20 is formed continuously between the reflective portion 104 of the organic light-emitting element 20 and the reflective portion 104 of the adjacent organic light-emitting element 10. The adjacent first electrodes 110 are patterned so as to be electrically insulated between the adjacent reflective portions 104 or at positions overlapping with the reflective portions 104 in a plan view.

[0035] FIG. 7 is a plan view showing a part of the reflective portion 104 and the first electrode 110. The first electrode 110 covering the vertex where the organic light-emitting elements are gathered between the adjacent reflective portions 104 and the circular first electrode 110 in the reflective portion 104 are continuously formed. On the other hand, the adjacent first electrodes 110 are patterned so as to be electrically insulated. This eliminates the need to leave a space between the first electrode 110 and the conductor 110a as shown in Example 3 (FIG. 5). As a result, the step of the step portion 480 formed between the reflective portions 104 can be effectively reduced, and the aperture of the pixel using the organic light-emitting elements can be prevented from being reduced.

[0036] <Fifth embodiment> Next, a light emitting device according to embodiment 5 will be described. In the following description, the same components as those in embodiment 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0037] Fig. 9 shows a schematic cross-sectional view of the light-emitting device 5 according to this embodiment. Note that in Fig. 9, the substrate 100, the wiring layer 101, the organic layer 130, the second electrode 140, the moisture-proof layer 150, the second planarization layer 160, and the color filter layer 170 of the light-emitting device 5 are omitted.

[0038] The light emitting device 5 according to this embodiment is manufactured using the manufacturing method described with reference to Fig. 3A to Fig. 3I. In the light emitting device 5, as shown in Fig. 9, a gap 200 is formed between adjacent reflecting portions 104 when the first insulating layer 105 is formed. Also, a first electrode 110 is formed in a region overlapping with the gap 500 in a plan view of the substrate 100, that is, in a region above the gap 500 in Fig. 9.

[0039] This makes it possible to protect the first insulating layer 105 above the void 500 when forming the first electrode 110, without reducing the first insulating layer 105 by etching. As a result, in the light emitting device 5, the step of the step portion 580 formed between the reflective portions 104 can be effectively reduced. Note that, in place of the first electrode 110, a conductor 110a may be formed in the region overlapping with the void 500 in a plan view of the substrate 100.

[0040] Sixth Embodiment Next, a light emitting device according to a sixth embodiment will be described. In the following description, the same components as those in the fifth embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0041] Fig. 10 shows a schematic cross-sectional view of the light-emitting device 6 according to this embodiment. Note that the substrate 100, the wiring layer 101, the organic layer 130, the second electrode 140, the moisture-proof layer 150, the second planarization layer 160, and the color filter layer 170 of the light-emitting device 6 are omitted in Fig. 9.

[0042] The light emitting device 6 according to this embodiment is manufactured using the manufacturing method described with reference to Figures 3A to 3I. In the light emitting device 6, a first electrode 110 is formed between adjacent reflective portions 104 as shown in Figure 10. Furthermore, a groove 610 for reducing leakage current between adjacent organic light emitting elements 10, 20 is formed in the second insulating layer 120 by photolithography and dry etching.

[0043] 11A shows an example of a plan view of adjacent reflectors 104, a first electrode 110, and a groove 610 in a light-emitting device 6 according to this embodiment. Note that other components constituting the light-emitting device 6 are omitted in FIG. 11 because they are similar to those of the light-emitting device 5 according to the fifth embodiment. As shown in FIG. 11, in a plan view of the substrate 100, the groove 610 is disposed between adjacent reflectors 104 and in a region overlapping with the first electrode 110.

[0044] This makes it possible to reduce the step between adjacent reflecting portions 104. This improves the processability of the groove 610, effectively reduces the step of the step portion 680 formed between the reflective portions 104, and reduces the leakage current between the plurality of organic light-emitting elements. In addition, it is expected to have the effect of suppressing the reduction of the aperture of the pixel using the plurality of organic light-emitting elements in the light-emitting device 6.

[0045] FIG. 11B shows an example of a plan view of the adjacent reflecting portion 104, the first electrode 110, and the groove 611 in a modified example of the light-emitting device 6. Note that components other than the reflecting portion 104, the first electrode 110, and the groove 611 in this modified example are the same as those of the light-emitting device 6, and therefore illustration and description are omitted. As shown in FIG. 11B, the groove 611 is formed, for example, in a region overlapping with the reflecting portion 104 of each organic light-emitting element in a plan view of the substrate 100. Note that, in a plan view of the substrate 100, a conductor 110a may be formed instead of the first electrode 110 in a region overlapping with the void 200. The arrangement of the grooves may be a combination of the arrangements shown in FIG. 11A and FIG. 11B. Furthermore, a groove may be formed in a region overlapping with the first electrode 110 or the conductor 110a in a plan view of the substrate 100.

[0046] Seventh embodiment Next, a light emitting device according to a sixth embodiment will be described. In the following description, the same components as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0047] Fig. 12 is a schematic cross-sectional view of a light emitting device 7 according to this embodiment. Note that in Fig. 12, the substrate 100 and the wiring layer 101 of the light emitting device 7 are omitted.

[0048] As shown in FIG. 12, in each of the organic light-emitting elements 10 and 20, a third planarization layer 720 is disposed on the color filter layer 170, and a light-transmitting microlens 730 is disposed on the third planarization layer 720. As an example, the microlens 730 is a convex lens that collects non-directional light and is disposed in an area that overlaps with the color filter layer 170 in a planar view of the substrate 100. The microlens 730 may be a so-called spherical lens or a so-called aspherical lens. In addition, examples of the material of the microlens 730 include materials that are light-transmitting and insulating. Specifically, examples of the material of the microlens 730 include silicon-based inorganic materials such as silicon oxide, and resin materials such as acrylic resin.

[0049] Like the light emitting device 1 of the first embodiment, the light emitting device 7 of this embodiment can reduce the step of the step portion 780 between the adjacent reflecting portions 104. This allows the second planarization layer 160 to be made thinner, shortening the distance from the organic layer 130 including the light emitting layer to the microlens 730, and improving the viewing angle characteristics of the light emitting device 7.

[0050] Eighth embodiment Next, a light emitting device according to an eighth embodiment will be described. In the following description, the same components as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0051] Fig. 13 shows a schematic cross-sectional view of a light-emitting device 8 according to this embodiment. Note that in Fig. 13, the substrate 100, the wiring layer 101, the organic layer 130, the second electrode 140, the moisture-proof layer 150, the second planarization layer 160, and the color filter layer 170 of the light-emitting device 8 are omitted.

[0052] As shown in FIG. 13, in the light emitting device 8, between adjacent reflecting portions 104, wiring 804a, which is a connection portion for connecting the first electrode 110 and the first conductive plug 103, is formed by patterning. Moreover, FIG. 14 shows an example of a plan configuration diagram of the reflecting portion 104, the first electrode 110, and the wiring 804a in the light emitting device 8 according to this embodiment. Note that in FIG. 14, other components constituting the light emitting device 8 are the same as those of the light emitting device 1 according to the first embodiment. Since the above is the same as that shown in FIG.

[0053] 14, the reflective portion 104 is provided as a common reflective portion for a plurality of organic light-emitting elements. The reflective portion 104 is not divided between the organic light-emitting elements, but is disposed across a plurality of pixels in the pixel array region of the light-emitting device 8. In addition, a first electrode 110 is formed in a region overlapping with the wiring 804a in a plan view of the substrate 100, that is, in a region above the wiring 804a in FIG.

[0054] This reduces the step of step portion 880 formed in the region above wiring 804a and ensures the thickness of organic layer 130, thereby reducing leakage current between first electrode 110 and second electrode 140. Note that, in a plan view of substrate 100, conductor 110a may be formed instead of first electrode 110 in the region overlapping wiring 804a.

[0055] <Ninth embodiment> Next, a light emitting device according to a ninth embodiment will be described. In the following description, the same components as those in the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0056] Fig. 15A shows a schematic cross-sectional view of a light-emitting device 9 according to this embodiment. Note that in Fig. 15A, the substrate 100, the wiring layer 101, the organic layer 130, the second electrode 140, the moisture-proof layer 150, the second planarization layer 160, and the color filter layer 170 of the light-emitting device 9 are omitted.

[0057] 15A, in the light emitting device 9, a third insulating layer 940 is formed between adjacent reflecting portions 104. The third insulating layer 940 is formed by depositing an insulating layer and patterning it by photolithography and dry etching.

[0058] FIG. 16 is a plan view showing a part of the reflector 104, the first electrode 110, and the third insulating layer 940 in the light-emitting device 9. The area of ​​the region facing the plurality of organic light-emitting elements is likely to be larger than other regions between the adjacent reflectors 104, and as a result, the step of the step portion formed between the reflectors 104 may also be larger. Therefore, in this embodiment, as shown in FIG. 16, the third insulating layer 940 is formed in the region facing the plurality of organic light-emitting elements between the reflectors 104. By forming the third insulating layer 940 in this way, in the light-emitting device 9, the step of the step portion 980 formed between the reflectors 104 can be effectively reduced, and the aperture of the pixel using the plurality of organic light-emitting elements can be prevented from being reduced.

[0059] In Fig. 15A, the third insulating layer 940 is formed on the first planarizing layer 102. However, as shown in Fig. 15B, the third insulating layer 940 may be formed on the first insulating layer 105 after the first insulating layer 105 is formed (Fig. 15B), or may be formed on the second insulating layer 120 after the second insulating layer 120 is formed (Fig. 15C).

[0060] [Structure of organic light-emitting element] The organic light-emitting element used in the light-emitting device of this embodiment is provided by forming an insulating layer, a lower electrode, a functional layer including a light-emitting layer, and an upper electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the upper electrode. When a color filter is provided, a planarizing layer may be provided between the protective layer. The planarizing layer may be made of acrylic resin or the like. The same applies when a planarizing layer is provided between the color filter and the microlens.

[0061] [substrate] The material of the substrate constituting the organic light-emitting element may be at least one of quartz, glass, silicon, resin, and metal. In addition, a switching element such as a transistor may be provided on the substrate. The device may have an element and wiring, and an insulating layer on top of them. Any material can be used for the insulating layer, as long as it is possible to form a contact hole so that wiring can be formed between the first electrode and the insulating layer, and insulation from wiring that is not connected can be ensured. For example, resin such as polyimide, silicon oxide, silicon nitride, etc. can be used.

[0062] [electrode] A pair of electrodes can be used for the organic light-emitting element. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode, and the other is the cathode. It can also be said that the electrode that supplies holes to the light-emitting layer is the anode, and the electrode that supplies electrons is the cathode.

[0063] The material constituting the anode should have as large a work function as possible. For example, a metal such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, or tungsten, or a mixture containing these metals, can be used for the anode. Alternatively, an alloy combining these metals, or a metal oxide such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), or indium zinc oxide can be used for the anode. Also, a conductive polymer such as polyaniline, polypyrrole, or polythiophene can be used for the anode.

[0064] Any of these electrode materials may be used alone, or two or more of these materials may be used in combination. The anode may be composed of a single layer or multiple layers.

[0065] When the electrode of the organic light-emitting element is configured as a reflective electrode, the electrode material may be, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or an alloy or laminate thereof. The above materials may function as a reflective film without serving as an electrode. When used as a transparent electrode, a transparent conductive layer of oxide such as indium tin oxide (ITO) or indium zinc oxide may be used, but is not limited to these. Photolithography technology may be used to form the electrode.

[0066] On the other hand, the material for the cathode should have a small work function. Examples of the material include alkali metals such as lithium, alkaline earth metals such as calcium, aluminum, titanium, manganese, silver, lead, chromium, and other metals or mixtures containing these metals. Alternatively, alloys combining these metals can be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, zinc-silver, and the like can be used. Metal oxides such as indium tin oxide (ITO) can also be used. These electrode materials may be used alone or in combination of two or more types. The cathode may have a single layer structure or a multi-layer structure. Among these, it is preferable to use silver, and it is even more preferable to use a silver alloy to reduce the aggregation of silver. As long as the aggregation of silver can be reduced, the ratio of the alloy is not important. For example, the ratio of silver to other metals may be 1:1, 3:1, and the like.

[0067] The cathode may be a top emission element using an oxide conductive layer such as ITO, or a bottom emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but it is more preferable to use a direct current or alternating current sputtering method, etc., since the film coverage is good and the resistance can be easily reduced.

[0068] [Pixel isolation layer] The pixel isolation layer is formed of a silicon nitride (SiN) film, a silicon oxynitride (SiON) film, or a silicon oxide (SiO) film formed by using a chemical vapor deposition method (CVD method). In order to increase the resistance of the organic compound layer in the in-plane direction, it is preferable that the organic compound layer, particularly the hole transport layer, is formed thinly on the sidewall of the pixel separation layer. Specifically, the thickness of the sidewall can be made thin by increasing the taper angle of the sidewall of the pixel separation layer or the thickness of the pixel separation layer to increase vignetting during deposition.

[0069] On the other hand, it is preferable to adjust the sidewall taper angle and film thickness of the pixel separation layer to such an extent that no voids are formed in the protective layer formed thereon. Since no voids are formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, deterioration in reliability such as the occurrence of dark spots and poor conduction of the second electrode can be reduced.

[0070] According to the above embodiment, even if the taper angle of the sidewall of the pixel separation layer is not steep, it is possible to effectively suppress charge leakage to adjacent pixels. As a result of the study by the present inventors, it was found that the charge leakage can be sufficiently reduced if the taper angle is in the range of 60 degrees or more and 90 degrees or less. The thickness of the pixel separation layer is preferably 10 nm or more and 150 nm or less. In addition, the same effect can be obtained even if the pixel electrode is composed only of a pixel electrode without a pixel separation layer. However, in this case, it is preferable to make the thickness of the pixel electrode half or less of the organic layer, or to make the edge of the pixel electrode forward tapered by less than 60 degrees, since this reduces short circuits of the organic light-emitting element.

[0071] [Organic compound layer] The organic compound layer of the organic light-emitting element may be formed as a single layer or multiple layers. When multiple layers are included, they may be called hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, or electron injection layer depending on their functions. The organic compound layer is mainly composed of organic compounds, but may also contain inorganic atoms or inorganic compounds. For example, it may contain copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, or the like. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0072] [Protective layer] In the organic light-emitting element of the above embodiment, a protective layer may be provided on the second electrode. For example, by bonding glass provided with a moisture absorbent on the second electrode, it is possible to reduce the intrusion of water and the like into the organic compound layer and reduce the occurrence of display defects. In another embodiment, a passivation film such as silicon nitride may be provided on the cathode to reduce the intrusion of water and the like into the organic compound layer. For example, after forming the cathode, the cathode may be transported to another chamber without breaking the vacuum, and a silicon nitride film having a thickness of 2 μm may be formed by the CVD method to serve as a protective layer. A protective layer may be provided using an atomic deposition method (ALD method) after the film formation by the CVD method. The material of the film formed by the ALD method is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed by the CVD method on the film formed by the ALD method. The film formed by the ALD method may have a smaller thickness than the film formed by the CVD method. Specifically, it may be 50% or less, or even 10% or less.

[0073] [Color Filter] In the organic light-emitting element of the above embodiment, a color filter may be provided on the protective layer. For example, a color filter that takes into account the size of the organic light-emitting element may be provided on another substrate and then bonded to the substrate on which the organic light-emitting element is provided, or a color filter may be patterned on the protective layer described above using a photolithography technique. The color filter may be made of a polymer.

[0074] [Planarization layer] In the organic light-emitting device of the above embodiment, a planarization layer is provided between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing unevenness of the layer below. When the purpose is not limited, the planarization layer may be called a resin layer. The planarization layer may be composed of an organic compound, and may be a low molecular weight or a high molecular weight, but is preferably a high molecular weight.

[0075] The planarization layer may be provided above and below the color filter, and may be made of the same or different materials.Specific examples of the materials include polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0076] [Microlens] The organic light-emitting element of the above embodiment may have an optical member such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be intended to increase the amount of light extracted from the organic light-emitting element and control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the tangent and the hemisphere are the vertices of the microlens. The vertex of the microlens can be determined in the same manner in any cross-sectional view. That is, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the tangent and the semicircle are the vertices of the microlens.

[0077] It is also possible to define the midpoint of the microlens. In the cross section of the microlens, a line segment is imaginary from a point where an arc shape ends to a point where another arc shape ends, and the midpoint of the line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0078] The microlens has a first surface having a convex portion and a second surface opposite to the first surface. It is preferable that the second surface is disposed closer to the functional layer than the first surface. To achieve such a configuration, it is necessary to form a microlens on the light-emitting element. When the functional layer is an organic layer, it is preferable to avoid processes that result in high temperatures in the manufacturing process. In addition, when the second surface is disposed closer to the functional layer than the first surface, it is preferable that the glass transition temperatures of all organic compounds constituting the organic layer are 100°C or higher, and more preferably 130°C or higher.

[0079] [Opposite substrate] The organic light-emitting device of the above embodiment may have an opposing substrate on the planarization layer. The opposing substrate is called an opposing substrate because it is provided at a position corresponding to the above-mentioned substrate. The constituent material of the opposing substrate may be the same as that of the above-mentioned substrate. When the above-mentioned substrate is the first substrate, the opposing substrate can be the second substrate.

[0080] [Organic layer] The functional layers including the light-emitting layer constituting the organic light-emitting device of the above embodiment (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) are formed by the method shown below.

[0081] The organic compound layer constituting the organic light-emitting element of the above embodiment can be formed by a dry process such as a vacuum deposition method, an ionization deposition method, a sputtering method, a plasma method, etc. Also, instead of a dry process, a wet process can be used in which a layer is formed by dissolving the compound in an appropriate solvent and applying a known coating method (e.g., spin coating, dipping, casting method, LB method, inkjet method, etc.).

[0082] Here, when the layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur, and the layer has excellent stability over time. In addition, when the layer is formed by a coating method, it is necessary to combine it with a suitable binder resin. A film can also be formed.

[0083] Examples of binder resins include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, urea resin, etc. Furthermore, these binder resins may be used alone as homopolymers or copolymers, or may be used in combination of two or more types. Furthermore, known additives such as plasticizers, antioxidants, and ultraviolet absorbers may be used in combination as necessary.

[0084] [Pixel circuit] The light-emitting device of the above embodiment may have a pixel circuit connected to the organic light-emitting element. The pixel circuit may be an active matrix type that controls the emission of the first organic light-emitting element and the second organic light-emitting element independently. The active matrix type circuit may be voltage programming or current programming. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have an organic light-emitting element, a transistor that controls the emission brightness of the organic light-emitting element, a transistor that controls the emission timing, a capacitance that holds the gate voltage of the transistor that controls the emission brightness, and a transistor for connecting to GND without passing through the light-emitting element.

[0085] The light emitting device has a display region and a peripheral region arranged around the display region. The display region has a pixel circuit, and the peripheral region has a display control circuit. The mobility of a transistor constituting the pixel circuit may be smaller than the mobility of a transistor constituting the display control circuit. The slope of the current-voltage characteristic of the transistor constituting the pixel circuit may be smaller than the slope of the current-voltage characteristic of the transistor constituting the display control circuit. The slope of the current-voltage characteristic can be measured by the so-called Vg-Ig characteristic. The transistor constituting the pixel circuit is a transistor connected to a light emitting element such as a first organic light emitting element.

[0086] [Pixels] The organic light-emitting element of the above embodiment has a plurality of pixels. The pixels have sub-pixels that emit different colors from each other. The sub-pixels may have, for example, RGB emission colors. The pixels emit light in an area also called a pixel aperture. This area is the same as the first area. The pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc. The distance between the sub-pixels may be 10 μm or less, or more specifically, it may be 8 μm, 7.4 μm, 6.4 μm.

[0087] The pixels may have a known arrangement in a plan view. For example, the arrangement may be a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the sub-pixels in a plan view may be any known shape. For example, a rectangle, a quadrangle such as a diamond, or a hexagon. Note that the shape of the sub-pixel is considered to be included in the rectangle if it is, for example, close to a rectangle. Therefore, the shape of the sub-pixel may be a shape that is close to any of the known shapes described above. A pixel may be configured by combining the shape of the sub-pixels and the pixel arrangement.

[0088] [Applications of organic light-emitting devices] The organic light-emitting element according to the above embodiment can be used as a component of a display device or a lighting device. Other uses of the organic light-emitting element include an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, and a light-emitting device having a white light source and a color filter.

[0089] The display device has an image input section for inputting image information from an area CCD, a linear CCD, a memory card, etc., and has an information processing section for processing the input information, and displays the input image. Alternatively, the image information processing device may display the image on a display unit.

[0090] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of the touch panel function may be an infrared type, a capacitance type, a resistive film type, or an electromagnetic induction type, and is not particularly limited. The display device may be used in the display unit of a multifunction printer.

[0091] Next, Fig. 17 shows a schematic diagram illustrating an example of a display device using the light-emitting device according to the above embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. Flexible printed circuits FPC1002 and 1004 are connected to the touch panel 1003 and the display panel 1005. A transistor is printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, and may be provided in a different position even if the display device is a portable device.

[0092] The display device 1000 may have a color filter having red, green, and blue colors. The color filters may be arranged in a delta arrangement of the red, green, and blue colors. The display device 1000 may be used in a display unit of a mobile terminal. In this case, the display device 1000 may have both a display function and an operation function. Examples of the mobile terminal include mobile phones such as smartphones, tablets, and head-mounted displays.

[0093] Moreover, the display device 1000 may be used as a display unit of an imaging device having an optical unit with a plurality of lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the imaging element. Moreover, the display unit may be a display unit exposed to the outside of the imaging device, or a display unit disposed within a viewfinder. The imaging device may be a digital camera or a digital video camera.

[0094] Next, Fig. 18A shows a schematic diagram illustrating an example of an imaging device using the light-emitting device according to the above embodiment. The imaging device 1100 may have a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may have the above-mentioned display device. In this case, the display device may display not only an image to be captured, but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject will be blocked by an obstruction, and the like.

[0095] Since the timing suitable for imaging is short, it is better to display information as soon as possible. Therefore, it is preferable to configure a display device with a fast response speed using the organic light-emitting element of the above embodiment. The display device using the organic light-emitting element of the above embodiment can be used more preferably than these devices, such as liquid crystal display devices, which require a high display speed.

[0096] The imaging device 1100 has an optical section (not shown). The optical section has a plurality of lenses, which form an image on an imaging element housed in a housing 1104. The focus of the plurality of lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically. The imaging device may be called a photoelectric conversion device. The photoelectric conversion device can include an imaging method that does not capture images sequentially, but detects the difference from the previous image, cuts out an image from an image that is always recorded, and the like.

[0097] FIG. 18B is a schematic diagram showing an example of an electronic device using the light-emitting device according to the embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit may be a biometric recognition unit that recognizes a fingerprint to unlock the device. An electronic device having a communication unit may be called a communication device. The electronic device 1200 may further have a camera function by including a lens and an image sensor. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smartphone and a notebook computer.

[0098] Next, FIG. 19A shows a schematic diagram illustrating an example of a display device using the light-emitting device according to the embodiment. FIG. 19A shows a display device 1300 such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The organic light-emitting element according to the embodiment may be used in the display unit 1302. The display device 1300 also has a frame 1301 and a base 1303 that supports the display unit 1302. The base 1303 is not limited to the form shown in FIG. 19A. The lower side of the frame 1301 may also serve as the base. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0099] FIG. 19B is a schematic diagram showing another example of a display device using the light-emitting device according to the embodiment. The display device 1310 in FIG. 19B is configured to be bendable, and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 may have the organic light-emitting element according to the embodiment. The first display unit 1311 and the second display unit 1312 may be one display unit without a joint. The first display unit 1311 and the second display unit 1312 can be separated at the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or the first display unit and the second display unit may display one image.

[0100] Next, FIG. 20A shows a schematic diagram illustrating an example of an illumination device using the light-emitting device according to the above embodiment. The illumination device 1400 may have a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusion unit 1405. The light source has an organic light-emitting element according to the above embodiment. The optical filter may be a filter that improves the color rendering of the light source. The light diffusion unit can effectively diffuse the light of the light source, such as for lighting up, and deliver the light over a wide range. The optical filter and the light diffusion unit may be provided on the light emission side of the illumination. If necessary, a cover may be provided on the outermost part.

[0101] The lighting device 1400 is, for example, a device that illuminates a room. The lighting device may emit white, neutral white, or any other color from blue to red. It may have a dimming circuit that dims them. The lighting device 1400 may have an organic light-emitting element according to the above embodiment and a power supply circuit connected thereto. The power supply circuit is a circuit that converts AC voltage to DC voltage. Moreover, white has a color temperature of 4200K, and neutral white has a color temperature of 5000K. Moreover, the lighting device 1400 may have a color filter. Moreover, the lighting device 1400 may have a heat dissipation unit. The heat dissipation unit dissipates heat inside the device to the outside of the device, and examples of the heat dissipation unit include metals with high specific heat and liquid silicon.

[0102] 20B is a schematic diagram of an automobile, which is an example of a moving body using the light emitting device according to the embodiment. The automobile has a tail lamp, which is an example of a lamp. The automobile 1500 has a tail lamp 1501, and may be configured to turn on the tail lamp when braking or the like is performed.

[0103] The tail lamp 1501 has an organic light-emitting element according to the embodiment described above. The tail lamp may have a protective member for protecting the organic light-emitting element. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but it is preferable that the protective member is made of polycarbonate or the like. The recarbonate may be mixed with a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like.

[0104] An automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window may be a transparent display as long as it is not a window for checking the front and rear of the automobile. The transparent display may have an organic light-emitting element according to the above embodiment. In this case, the constituent materials of the electrodes and the like of the organic light-emitting element are made of transparent materials.

[0105] Furthermore, the moving object using the light emitting device according to the above embodiment may be a ship, an aircraft, a drone, or the like. The moving object may have a body and a lamp provided on the body. The lamp may emit light to indicate the position of the body. The lamp has the organic light emitting element according to the above embodiment.

[0106] Furthermore, the display device using the light emitting device of the above embodiment can be applied to a system that can be attached as a wearable device such as smart glasses, HMD, smart contacts, etc. The image capturing and display device used in such application examples has an image capturing device capable of photoelectrically converting visible light, and a display device capable of emitting visible light.

[0107] 21A shows glasses 1600 (smart glasses) according to an application example of a display device using the light emitting device of the above embodiment. An imaging device 1602 such as a CMOS sensor or a SPAD is provided on the front side of a lens 1601 of the glasses 1600. In addition, any of the display devices described above is provided on the back side of the lens 1601.

[0108] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the display device according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light on the image capture device 1602.

[0109] FIG. 21B shows glasses 1610 (smart glasses) according to another application example of the display device using the light-emitting device of the above embodiment. The glasses 1610 have a control device 1612. The control device 1612 is equipped with an imaging device corresponding to the imaging device 1602 and a display device. An optical system for projecting light emitted by the display device in the control device 1612 is formed in the lens 1611, and an image is projected onto the lens 1611. The control device 1612 functions as a power source that supplies power to the imaging device and the display device, and controls the operation of the imaging device and the display device. The control device may have a line-of-sight detection unit that detects the line of sight of the wearer. Infrared light may be used to detect the line of sight. The infrared light emission unit emits infrared light toward the eyeball of a user gazing at a display image. An imaging unit having a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an image of the eyeball. By having a reduction means for reducing light from the infrared light emission unit to the display unit in a planar view, deterioration of image quality is reduced.

[0110] The gaze of the user with respect to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be applied to gaze detection using the image of the eyeball. As an example, a gaze detection method based on a Purkinje image formed by reflection of irradiated light on the cornea can be used.

[0111] More specifically, the gaze detection process is performed based on the pupil-corneal reflex method. Using the pupil-corneal reflex method, a gaze vector that indicates the direction (rotation angle) of the eyeball is calculated based on the pupil image and the Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0112] The display device having the organic light-emitting element according to the above embodiment may have an imaging device having a light-receiving element, and may control the display image of the display device based on information on the user's line of sight from the imaging device. .

[0113] Specifically, the display device determines a first field of view area to which the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received by the display device. In the display area of ​​the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0114] The display area may have a first display area and a second display area different from the first display area, and the display device may select an area with a high priority from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received by the display device. The display device may control the resolution of the area with a high priority to be higher than the resolution of areas other than the area with a high priority. In other words, the display device may lower the resolution of an area with a relatively low priority.

[0115] The display device may use AI (Artificial Intelligence) to determine the first field of view area or the area with high priority. The AI ​​may be a model configured to estimate the angle of the line of sight and the distance to an object at the end of the line of sight from an image of the eyeball, using an image of the eyeball and the direction in which the eyeball in the image was actually looking as teacher data. The AI ​​program may be included in the display device, the imaging device, or an external device. If the external device has the AI ​​program, the AI ​​program is transmitted from the external device to the display device via communication.

[0116] When the display device controls display based on visual recognition detection, the display device can be preferably applied to smart glasses further including an imaging device for capturing an image of the outside world. The smart glasses can display captured outside information in real time.

[0117] As described above, by using an apparatus using the light emitting device according to the above embodiment, it is possible to achieve a display with good image quality and stability even over a long period of time.

[0118] The disclosure of this embodiment includes the following configuration. (Configuration 1) A first element and a second element are provided on a substrate; each of the first element and the second element has a reflective portion, a first insulating layer, a first electrode, an organic layer including a light-emitting layer, and a second electrode in this order from the substrate side; the first insulating layer has a recess between the reflective portion of the first element and the reflective portion of the second element; A conductor is disposed in the recess. A light emitting device characterized by: (Configuration 2) The light-emitting device according to configuration 1, wherein the organic layer is embedded in the recess. (Configuration 3) 3. The light emitting device according to claim 1, wherein the conductor is electrically insulated from the first electrode. (Configuration 4) 4. The light-emitting device according to any one of configurations 1 to 3, wherein, in a planar view of the substrate, at least a portion of the conductor overlaps with the reflecting portion of the first element and the reflecting portion of the second element. (Configuration 5) a second insulating layer covering an end of the first electrode of the first element and an end of the first electrode of the second element; 5. The light emitting device according to any one of configurations 1 to 4, wherein the second insulating layer has a recess between the reflective portion of the first element and the reflective portion of the second element. (Configuration 6) 6. The light emitting device according to configuration 5, wherein the conductor is disposed between the first insulating layer and the second insulating layer. (Configuration 7) Further comprising a third element disposed on the substrate; the third element has, in this order from the substrate side, a reflective portion, a first insulating layer, a first electrode, an organic layer including a light-emitting layer, and a second electrode; the third element is arranged such that, in a plan view of the substrate, a triangle is formed when a line segment is connected through a center of the reflective portion of the first element, a center of the reflective portion of the second element, and a center of the reflective portion of the third element; In a plan view of the substrate, the conductor is disposed at the center of gravity of the triangle. 7. The light emitting device according to any one of configurations 1 to 6. (Configuration 8) The light-emitting device described in configuration 7, characterized in that, in a planar view of the substrate, the conductor is not arranged in an area that contacts only two of the reflective portion of the first element, the reflective portion of the second element, and the reflective portion of the third element. (Configuration 9) 9. The light-emitting device of any one of configurations 1 to 8, wherein a portion of the first electrode is disposed between the reflective portion of the first element and the reflective portion of the second element. (Configuration 10) 10. The light-emitting device of any one of configurations 1 to 9, wherein in the first insulating layer, an air gap is provided between the reflective portion of the first element and the reflective portion of the second element. (Configuration 11) the light-emitting layer emits white light; The first element and the second element have a color filter that transmits red light, blue light, or green light of the white light. 11. The light emitting device according to any one of configurations 1 to 10. (Configuration 12) the light-emitting layer generates non-directional light; The first element and the second element have microlenses that focus the non-directional light. 11. The light emitting device according to any one of configurations 1 to 10. (Configuration 13) The light-emitting device described in configuration 5 or 6, characterized in that a groove is formed in the second insulating layer between the reflective portion of the first element and the reflective portion of the second element in a region that overlaps with the first electrode or the conductor in a planar view of the substrate. (Configuration 14) The light-emitting device described in configuration 5 or 6, characterized in that a groove is formed in the second insulating layer in an area that overlaps with the reflective portion of the first element or the reflective portion of the second element in a planar view of the substrate. (Configuration 15) When the optical path length between the first electrode and the light-emitting layer is L, the following formula (1) holds: L=(2m-1)×(λ / 4)±(λ / 8) ···(1) where λ is the dominant wavelength of the light emitted by the light-emitting layer, and m is an integer. 15. The light emitting device according to any one of configurations 1 to 14. (Configuration 16) 16. The light emitting device of any one of configurations 1 to 15, wherein the conductor is made of the same material as the first electrode. (Configuration 17) A first element and a second element are provided on a substrate; each of the first element and the second element has a reflective portion, a first insulating layer, a first electrode, an organic layer including a light-emitting layer, and a second electrode in this order from the substrate side; the first insulating layer has a recess between the reflective portion of the first element and the reflective portion of the second element; A third insulating layer is disposed in a region overlapping with the recess in a plan view of the substrate. A light emitting device characterized by: (Configuration 18) A first element and a second element are provided on a substrate; each of the first element and the second element has a reflective portion, a first insulating layer, a first electrode, an organic layer including a light-emitting layer, and a second electrode in this order from the substrate side; a connection portion electrically connected to the first electrode is disposed between the reflection portion of the first element and the reflection portion of the second element; A recess is formed in the first electrode. A light emitting device characterized by: (Configuration 19) 19. The light emitting device of any one of configurations 1 to 18, wherein the first insulating layer is an optical adjustment layer. (Configuration 20) A display device having a plurality of pixels, At least one of the plurality of pixels comprises a light-emitting device according to any one of configurations 1 to 19 and a transistor connected to the light-emitting device. A display device comprising: (Configuration 21) An optical section having a plurality of lenses; an imaging element that receives light that has passed through the optical unit; a display unit that displays an image captured by the imaging element; having The display unit has the light-emitting device according to any one of configurations 1 to 19. A photoelectric conversion device comprising: (Configuration 22) A display unit having the light-emitting device according to any one of configurations 1 to 19; A housing provided with the display unit; A communication unit provided in the housing for communicating with an external device; 1. An electronic device comprising: (Configuration 23) A light source having the light emitting device according to any one of configurations 1 to 19; a light diffusing portion or an optical film that transmits light emitted by the light source; A lighting device comprising: (Configuration 24) A lighting fixture having the light-emitting device according to any one of configurations 1 to 19; An aircraft having the lighting device provided thereon; A moving object comprising: (Method 1) forming a reflective portion of a first element and a reflective portion of a second element on a substrate; forming a first insulating layer of the first element and a second insulating layer of the second element, and forming the first insulating layer of the first element or the second insulating layer of the second element between the reflective portion of the first element and the reflective portion of the second element; forming a first electrode of the first element and a first electrode of the second element; and forming a conductor in the first insulating layer of the first element or the first insulating layer of the second element between the reflective portion of the first element and the reflective portion of the second element. (Method 2) The method for manufacturing a light-emitting device described in Method 1, further comprising a step of forming a third insulating layer between the reflective portion of the first element and the reflective portion of the second element in a planar view of the substrate. [Explanation of symbols]

[0119] 100 substrate, 10, 20 organic light-emitting element, 104 reflecting portion, 105 first insulating layer, 110 first electrode, 110a conductor, 130 organic layer, 140 second electrode, 180 step portion

Claims

1. a first element and a second element on a substrate; each of the first element and the second element has a reflective portion, a first insulating layer, a first electrode, an organic layer including a light-emitting layer, and a second electrode in this order from the substrate side; the first insulating layer has a recess between the reflective portion of the first element and the reflective portion of the second element; A conductor is disposed in the recess. A light-emitting device characterized by:

2. The light-emitting device according to claim 1 , wherein the organic layer is embedded in the recess.

3. The light-emitting device according to claim 1 , wherein the conductor is electrically insulated from the first electrode.

4. 2. The light emitting device according to claim 1, wherein at least a portion of the conductor overlaps with the reflecting portion of the first element and the reflecting portion of the second element in a plan view of the substrate.

5. a second insulating layer covering an end of the first electrode of the first element and an end of the first electrode of the second element; 2. The light emitting device according to claim 1, wherein the second insulating layer has a recess between the reflective portion of the first element and the reflective portion of the second element.

6. The light-emitting device according to claim 5 , wherein the conductor is disposed between the first insulating layer and the second insulating layer.

7. further comprising a third element disposed on the substrate; the third element has a reflective portion, a first insulating layer, a first electrode, an organic layer including a light-emitting layer, and a second electrode in this order from the substrate side; The third element is, in a plan view of the substrate, the reflective portion of the first element, the reflecting portion of the second element and the reflecting portion of the third element are arranged such that a triangle is formed when a line segment is connected between the centers of the reflecting portions of the second element and the third element, In a plan view of the substrate, the conductor is disposed at the center of gravity of the triangle.

2. The light emitting device according to claim 1.

8. The light-emitting device according to claim 7, characterized in that, in a planar view of the substrate, the conductor is not arranged in an area that contacts only two of the reflecting portion of the first element, the reflecting portion of the second element, and the reflecting portion of the third element.

9. 2. The light-emitting device according to claim 1, wherein a portion of the first electrode is disposed between the reflecting portion of the first element and the reflecting portion of the second element.

10. 2. The light emitting device according to claim 1, wherein a gap is provided in the first insulating layer between the reflecting portion of the first element and the reflecting portion of the second element.

11. the light-emitting layer emits white light; The first element and the second element have a color filter that transmits red light, blue light, or green light of the white light.

2. The light emitting device according to claim 1.

12. the light-emitting layer generates non-directional light; The first element and the second element have microlenses that condense the non-directional light.

2. The light emitting device according to claim 1.

13. The light-emitting device according to claim 5, characterized in that a groove is formed in the second insulating layer between the reflective portion of the first element and the reflective portion of the second element in a region that overlaps with the first electrode or the conductor in a planar view of the substrate.

14. The light-emitting device according to claim 5 , wherein a groove is formed in the second insulating layer in an area that overlaps with the reflecting portion of the first element or the reflecting portion of the second element in a planar view of the substrate.

15. When the optical path length between the first electrode and the light-emitting layer is L, the following formula (1) holds: L=(2m-1)×(λ / 4)±(λ / 8)...(1) where λ is the dominant wavelength of the light emitted by the light-emitting layer, and m is an integer.

2. The light emitting device according to claim 1.

16. 2. The light emitting device according to claim 1, wherein the conductor is made of the same material as the first electrode.

17. The light emitting device according to claim 1 , wherein the first insulating layer is an optical adjustment layer.

18. A display device having a plurality of pixels, At least one of the plurality of pixels comprises a light-emitting device according to any one of claims 1 to 17 and a transistor connected to the light-emitting device. A display device characterized by:

19. an optical section having a plurality of lenses; an imaging element that receives light that has passed through the optical unit; a display unit that displays an image captured by the imaging element; and The display unit has a light-emitting device according to any one of claims 1 to 17. A photoelectric conversion device characterized by:

20. a display unit having the light-emitting device according to any one of claims 1 to 17; a housing provided with the display unit; a communication unit provided in the housing for communicating with an external device; An electronic device comprising:

21. a light source comprising the light emitting device according to any one of claims 1 to 17; a light diffusing portion or an optical film that transmits light emitted by the light source; A lighting device comprising:

22. A lamp having the light-emitting device according to any one of claims 1 to 17; an aircraft on which the lighting fixture is provided; A moving object characterized by having:

23. forming a reflective portion of a first element and a reflective portion of a second element on a substrate; forming a first insulating layer of the first element and a second insulating layer of the second element, and forming the first insulating layer of the first element or the second insulating layer of the second element between the reflective portion of the first element and the reflective portion of the second element; forming a first electrode of the first element and a first electrode of the second element; and forming a conductor in the first insulating layer of the first element or the first insulating layer of the second element between the reflective portion of the first element and the reflective portion of the second element.

24. 24. The method for manufacturing a light-emitting device according to claim 23, further comprising the step of forming a third insulating layer between the reflective portion of the first element and the reflective portion of the second element in a plan view of the substrate.

Images