Substrate processing apparatus and substrate processing method

Abstract

To suppress processing defects on the back surface of a substrate.SOLUTION: A substrate processing apparatus includes a rotating holding unit that rotates while holding a substrate, a back surface discharge nozzle that discharges a processing liquid onto the back surface of the substrate, and a camera that images an area of the back surface of the substrate, which includes a collision position of the processing liquid discharged onto the back surface of the substrate, the camera is fixed to a nozzle fixing member to which the back surface discharge nozzle is fixed, and the substrate held by the rotating holding unit moves relative to the camera.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] An embodiment of the present invention relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] As an apparatus for performing liquid processing on a substrate such as a semiconductor wafer, a substrate processing apparatus that ejects a processing liquid from a nozzle onto the front surface of the substrate while rotating the substrate is widely known. Here, cleanliness is required not only for the front surface of the substrate but also for the back surface of the substrate. For this reason, a substrate processing apparatus has been proposed in which a back surface processing nozzle is provided on a table facing the back surface of the substrate, and the back surface processing nozzle ejects the processing liquid onto the back surface of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-44159 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, it is difficult for a user to visually check the discharge status of the processing liquid discharged from the back surface processing nozzle onto the back surface of the substrate while the substrate is being held. For example, if the collision position between the processing liquid discharged from the back surface processing nozzle and the back surface of the substrate is not normal, particles on the back surface of the substrate cannot be removed, and the back surface of the substrate cannot be processed satisfactorily.

[0005] The present invention has been made to solve the above-mentioned problems, and its object is to provide a substrate processing apparatus and a substrate processing method that can suppress processing defects on the back surface of a substrate. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, a substrate processing apparatus according to one embodiment of the present invention comprises a rotating holding unit that rotates while holding a substrate, a back surface discharge nozzle that discharges a processing liquid onto a back surface of the substrate, and a camera that images an area of ​​the back surface of the substrate that includes a collision position of the processing liquid discharged onto the back surface of the substrate, wherein the camera is fixed to a nozzle fixing member to which the back surface discharge nozzle is fixed, and the substrate held by the rotating holding unit moves relative to the camera.

[0007] In addition, in order to solve the above-mentioned problems and achieve the object, a substrate processing method according to one embodiment of the present invention includes the steps of rotating a substrate while held by a rotating holding part, ejecting a processing liquid onto a back surface of the substrate by a back surface discharge nozzle, and capturing an image of an area of ​​the back surface of the substrate that includes a collision position of the processing liquid ejected onto the back surface of the substrate by a camera, wherein the camera is fixed to a nozzle fixing member to which the back surface discharge nozzle is fixed, and the substrate held by the rotating holding part moves relative to the camera. Effect of the Invention

[0008] According to one aspect of the present invention, it is possible to provide a substrate processing apparatus and a substrate processing method capable of suppressing processing defects on the back surface of a substrate. [Brief description of the drawings]

[0009] [Figure 1A] FIG. 1A is a diagram illustrating an example of a configuration of a substrate processing apparatus according to an embodiment. [Figure 1B] FIG. 1B is a plan view showing an example of a recess and a spin holder of the substrate processing apparatus. [Figure 1C] FIG. 1C is a diagram for explaining an example of a gas supply path to the gas discharge nozzle and a processing liquid supply path to the back surface discharge nozzle according to the embodiment. [Diagram 2] FIG. 2 is a diagram for explaining an example of the direction of the camera according to the embodiment. [Diagram 3]FIG. 3 is a flowchart showing an example of a flow of processes executed by the substrate processing apparatus according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] (Embodiment) Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1A is a diagram showing an example of a configuration of a substrate processing apparatus 1 according to an embodiment. Fig. 1B is a plan view showing an example of a recess 4f and a spin holder 2 of the substrate processing apparatus 1.

[0011] As shown in FIG. 1A, the substrate processing apparatus 1 processes the processing surface by ejecting processing liquids (chemical liquid and cleaning liquid) onto both surfaces (also referred to as the processing surface) of the substrate W while rotating the substrate W together with a rotating holder 2, which is a rotating body.

[0012] The substrate processing apparatus 1 includes a rotation holder 2, a rotation mechanism 3, a nozzle fixing member 4, a cup body 5, a surface discharge nozzle 6, a control unit 7, an input / output unit 8, and a storage unit 9.

[0013] The rotating holder 2 is configured to be rotatable about an axis R extending in the vertical direction (up-down direction) while holding the substrate W. As shown in FIG. 1A, the rotating holder 2 includes a rotating body 2a and a holder 2b, and rotates the substrate W held by the holder 2b. The rotating body 2a is, for example, a table that faces the substrate W held by the holder 2b with a gap therebetween. The table is a disk-shaped member with a through hole 2a1 formed in the center. This table has a circular surface with a diameter larger than that of the substrate W.

[0014] The rotating body 2a is made of a material that is resistant to the chemical solution. For example, when the substrate W to be processed in this embodiment is a silicon wafer on which an oxide film is formed, and a chemical solution using hydrofluoric acid for etching the oxide film is used as the chemical solution, the rotating body 2a is preferably made of a fluorine-based resin such as PTFE or PCTFE.

[0015] The holder 2b is parallel to and spaced from the rotating body 2a and holds the substrate W. The holder 2b is, for example, a holding pin.

[0016] The rotation mechanism 3 rotates the rotary holder 2, which holds the substrate W, about the axis R, thereby rotating the substrate W about the axis R. For example, the rotation mechanism 3 is a hollow motor. The hollow part of the hollow motor communicates with the through hole 2a1 formed in the rotary holder 2, and this hollow part is also a part that forms the through hole 2a1.

[0017] The nozzle fixing member 4 is provided on the axis R in a through hole 2a1 formed in the rotary holder 2. The nozzle fixing member 4 is a member formed with an inverted cone-shaped recess 4f whose diameter decreases in the direction from the substrate W toward the rotor 2a, and this recess 4f is open on the side facing the substrate W. As shown in Figures 1A and 1B, the recess 4f is circular in plan view with the rotation axis R of the substrate W as its center.

[0018] The nozzle fixing member 4 is provided with a backside discharge nozzle 4a, a camera 4b, and a light irradiation unit 4c. Since the nozzle fixing member 4 is provided on the axis R, the backside discharge nozzle 4a, the camera 4b, and the light irradiation unit 4c are located near the axis R. The position of the camera 4b is higher than the position of the nozzle hole of the backside discharge nozzle 4a. Since the nozzle fixing member 4 is fixed to the chamber 14, the backside discharge nozzle 4a, the camera 4b, and the light irradiation unit 4c are also fixed. Therefore, even if the rotation holding unit 2 is rotated by the rotation mechanism 3, the backside discharge nozzle 4a, the camera 4b, and the light irradiation unit 4c fixed to the nozzle fixing member 4 do not rotate.

[0019] For example, as shown in FIG. 1B, a plurality of (four in the example of FIG. 1B) back surface discharge nozzles 4a and gas discharge nozzles 4e are provided circumferentially on the wall surface (conical inclined surface 4g) of a recess 4f formed in a nozzle fixing member 4. The back surface discharge nozzle 4a discharges a processing liquid onto the back surface of the substrate W while the substrate W is held by the rotating holder 2 and rotates around the rotation axis R. For example, when etching is performed, the back surface discharge nozzle 4a discharges a chemical liquid such as hydrofluoric acid onto the rotation center or near the rotation center of the back surface of the substrate W. Also, when cleaning is performed, the back surface discharge nozzle 4a discharges a cleaning liquid such as pure water onto the rotation center or near the rotation center of the back surface of the substrate W. The back surface discharge nozzle 4a is connected to a liquid supply source 12c via a liquid supply pipe 12 as described later. The gas discharge nozzle 4e supplies a gas such as nitrogen gas onto the rotation center or near the rotation center of the back surface of the substrate W. The gas discharge nozzle 4e is connected to a gas supply source 11c via an air supply pipe 11 as described below.

[0020] 1C is a diagram for explaining an example of a gas supply path to the gas discharge nozzle 4e and a processing liquid supply path to the back surface discharge nozzle 4a according to the embodiment. As shown in FIG. 1C, the substrate processing apparatus 1 includes an air supply pipe 11, a flow rate control valve 11a, an on-off valve 11b, a gas supply source 11c, a liquid supply pipe 12, a flow rate control valve 12a, an on-off valve 12b, a liquid supply source 12c, and a drain pipe 13.

[0021] The gas supply pipe 11 is connected to a gas supply source 11c that supplies gas such as nitrogen gas to the gas discharge nozzle 4e via a flow rate control valve 11a and an on-off valve 11b. Therefore, when the on-off valve 11b is opened, gas is discharged from the gas discharge nozzle 4e, and when the on-off valve 11b is closed, the discharge of gas stops. The flow rate of the gas during discharge is set by the flow rate control valve 11a.

[0022] The liquid supply pipe 12 is connected to a liquid supply source 12c that supplies a processing liquid (chemical liquid or cleaning liquid) to the back surface discharge nozzle 4a via a flow rate adjustment valve 12a and an on-off valve 12b. Therefore, when the on-off valve 12b is opened, the processing liquid is discharged from the back surface discharge nozzle 4a, and when the on-off valve 12b is closed, the discharge of the processing liquid stops. The flow rate of the processing liquid during discharge is set by the flow rate adjustment valve 12a.

[0023] The flow rate adjusting valves 11a, 12a and the on-off valves 11b, 12b are controlled by a control unit .

[0024] The camera 4b is provided on a wall surface (a conical inclined surface 4g) of a recess 4f formed in the nozzle fixing member 4. The camera 4b captures at least an image of the rear surface of the substrate W so as to monitor the discharge status of the processing liquid. In this embodiment, the camera 4b captures (takes) an image of an area 4b1 including a position (collision position) where the processing liquid discharged from the rear surface discharge nozzle 4a collides with the rear surface of the substrate W, and acquires an image. That is, the camera 4b captures an image of an area 4b1 including a collision position of the processing liquid discharged on the rear surface of the substrate W, among the entire area of ​​the rear surface of the substrate W, and acquires an image. The camera 4b also acquires an image at least when the rear surface discharge nozzle 4a is discharging the processing liquid. More preferably, an image is acquired from the start of discharging the processing liquid to the end of discharging the processing liquid. The area 4b1 shown in FIG. 1A is an area including a portion of the outer periphery from the center of the substrate W. Here, while camera 4b is imaging area 4b1, substrate W rotates around rotation axis R, allowing camera 4b to image the entire area of ​​the back surface of substrate W, and as a result, image data depicting the entire area of ​​the back surface of substrate W can be generated.

[0025] In this embodiment, as described above, the substrate processing apparatus 1 includes a camera 4b for capturing an image of the back surface of the substrate W to be processed. In the conventional technology, the user can visually check the range 10 (see FIG. 1A) on the front surface side of the substrate W, but it is difficult to visually check the back surface of the substrate W. Therefore, the camera 4b of this embodiment is intended to capture an image of the back surface of the substrate W, which is usually difficult for the user to visually check. When processing the substrate W, the substrate processing apparatus 1 rotates the rotating holder 2 that holds the substrate W so that the processing liquid is uniformly distributed over the substrate W. If the camera 4b is installed on the rotating holder 2, the rotation of the rotating holder 2 also rotates the camera 4b and the cable connected to the camera 4b. For this reason, it is difficult to install the camera 4b on the rotating holder 2.

[0026] On the other hand, in this embodiment, the camera 4b is installed on the nozzle fixing member 4. The nozzle fixing member 4 remains stationary even when the rotation holder 2 rotates. Therefore, the camera 4b can capture an image of the rear surface of the substrate W rotating at high speed in a stationary state.

[0027] 2 is a diagram for explaining an example of the orientation of the camera 4b according to the embodiment. For example, the camera 4b is disposed so that the angle θ between the optical axis 4b2 and the rear surface of the substrate W is an acute angle. More preferably, as shown in FIG. 2, the optical axis 4b2 of the camera 4b passes through the intersection of the axis (rotation axis) R and the rear surface of the substrate W, and is disposed so that the angle θ between the optical axis 4b2 and the rear surface of the substrate W is an acute angle. Disposed in this manner, the camera 4b can capture an image of an area 4b1 including the center of the substrate W to a part of the outer periphery.

[0028] The camera 4b is provided at a position facing the nozzle hole of the gas discharge nozzle 4e in the recess 4f. Since the liquid is discharged from the nozzle hole of the back surface discharge nozzle 4a in a substantially straight line, it is considered that the position facing the nozzle hole of the back surface discharge nozzle 4a is most likely to have liquid attached thereto, but by providing the camera 4b at a position facing the nozzle hole of the gas discharge nozzle 4e that does not discharge liquid, it is possible to prevent liquid from adhering to the camera 4b.

[0029] The light irradiation unit 4c is, for example, a small light, and irradiates the rear surface of the substrate W with illumination light while the camera 4b is capturing an image. For example, the light irradiation unit 4c irradiates at least a position (collision position) where the processing liquid discharged from the rear surface discharge nozzle 4a collides with the rear surface of the substrate W with illumination light among the entire region of the rear surface of the substrate W. More preferably, the illumination light is irradiated to the entire imaging range of the camera 4b. In this embodiment, the light irradiation unit 4c irradiates a region 4b1 including a position (collision position) where the processing liquid discharged from the rear surface discharge nozzle 4a collides with the rear surface of the substrate W. As a result, image data in which the region 4b1 is clearly depicted is obtained.

[0030] In this embodiment, a chemical-resistant cover (e.g., transparent PVC, etc.) that has water-repellent properties and protects the imaging surface of camera 4b and the irradiation surface of light irradiation unit 4c is provided on the wall surface (conical slope 4g) of recess 4f formed in nozzle fixing member 4, the imaging surface of camera 4b, and the irradiation surface of light irradiation unit 4c. This makes it possible to protect the imaging surface of camera 4b and the irradiation surface of light irradiation unit 4c.

[0031] Further, a drain hole 4d forming a drainage section is formed at the bottom of the recess 4f formed in the nozzle fixing member 4. For example, one end of the drain hole 4d is open at the bottom of the recess 4f formed in the nozzle fixing member 4. One end of a drain pipe 13 (see FIG. 1C) is connected to the other end of the drain hole 4d. The other end of the drain pipe 13 is connected to a suction pump (not shown). A part of the processing liquid discharged from the rear surface discharge nozzle 4a and bounced off the rear surface of the substrate W drops into the nozzle fixing member 4. The processing liquid dropped into the nozzle fixing member 4 is guided to the drain hole 4d by the wall surface (conical slope 4g) of the recess 4f formed in the nozzle fixing member 4 and discharged from the drain pipe 13.

[0032] A cup body 5 is provided around the rotation holder 2. The cup body 5 is a cylindrical body that is bent so that the diameter of the upper part is generally narrower. A recovery port (not shown) for recovering the treatment liquid is provided on the bottom surface of the cup body 5.

[0033] Before the processing liquid is discharged onto the substrate W, the cup body 5 is positioned by a drive mechanism (not shown) at a position where it can receive the processing liquid scattered from the rotating substrate W, as shown in Fig. 1A. Then, after the spin drying of the substrate W is completed, the cup body 5 is lowered by the drive mechanism.

[0034] The cup body 5 receives various processing liquids scattered from the rotating substrate W from around the substrate W. The processing liquids received by the cup body 5 are discharged through a recovery port into a recovery path (not shown).

[0035] The front surface discharge nozzle 6 discharges a processing liquid onto the front surface of the substrate W while the substrate W is held by the rotary holder 2 and rotates about an axis R. For example, when etching is performed, the front surface discharge nozzle 6 discharges a chemical liquid onto or near the center of rotation of the front surface of the substrate W. When cleaning is performed, the front surface discharge nozzle 6 discharges a cleaning liquid such as pure water onto or near the center of rotation of the front surface of the substrate W.

[0036] The control unit 7 controls each part of the substrate processing apparatus 1. The control unit 7 has a processor that executes a program to realize various functions of the substrate processing apparatus 1, a memory that stores various information such as the program and operating conditions, and a drive circuit that drives each element. The control unit 7 controls the rotation holding unit 2, the rotation mechanism 3, the nozzle fixing member 4 (rear surface discharge nozzle 4a, camera 4b, light irradiation unit 4c, and gas discharge nozzle 4e), the cup body 5, the front surface discharge nozzle 6, the input / output unit 8, the memory unit 9, the flow rate adjustment valves 11a, 12a, and the opening / closing valves 11b, 12b. In addition, instructions from a user are input to the control unit 7 via the input / output unit 8.

[0037] The input / output unit 8 is configured, for example, by a touch panel. The input / output unit 8 is an input device for the user to operate the substrate processing apparatus 1 and input settings via the control unit 7. The input / output unit 8 is also an output device (display unit) for checking numerical values ​​indicating the state of the substrate processing apparatus 1 and various images. For example, the user can input an instruction to stop processing of the substrate W by operating the input / output unit 8. The user can also set various settings such as the number of rotations of the substrate W and the flow rate of the processing liquid discharged from the rear surface discharge nozzle 4a by operating the input / output unit 8. The display unit of the input / output unit 8 displays numerical values ​​and various images, allowing the user to check the state of the substrate processing apparatus 1. The input / output unit 8 may be realized by separately configuring an input device and an output device (display unit). For example, the input device may be configured by a keyboard, a mouse, a switch, or the like. The output device may be configured by a combination of a meter, a lamp, and a display. The storage unit 9 is, for example, various storage devices such as a HDD (Hard Disk Drive) and stores various data and information.

[0038] For example, the control unit 7 causes the display unit of the input / output unit 8 to display in real time moving images based on time-series image data (moving image data) obtained by the camera 4b. This allows the user to check the discharge status of the processing liquid in real time. If the collision position is not normal, the user adjusts the pressure of the supply source. Note that "if the collision position is not normal" here also includes a case where the discharged processing liquid does not land on the back surface of the substrate W. If the processing liquid does not spread to the outer periphery of the substrate W, the user adjusts the pressure of the supply source or the rotation speed of the substrate W.

[0039] In addition, in order to check the state of discharging the processing liquid onto the rear surface of the substrate W, a transparent substrate for visual confirmation may be held by the spin holder 2, and the user may visually check from above the spin holder 2. However, the transparent substrate for visual confirmation has a different thickness and material from the normal substrate W. For this reason, it is difficult to transport the transparent substrate for visual confirmation using a normal transport route and a normal robot. For this reason, it is considered that the user manually opens the chamber 14 (see FIG. 1A) of the substrate processing apparatus 1 and places the transparent substrate for visual confirmation in the chamber 14. However, when the chamber 14 is opened, the inside of the chamber 14 may be contaminated by particles or the like.

[0040] On the other hand, according to the present embodiment, the user can check the state of the processing liquid being discharged onto the rear surface of the substrate W, without opening the chamber 14. That is, according to the present embodiment, the user can check the state of the processing liquid being discharged onto the rear surface of the substrate W, while suppressing contamination inside the chamber 14.

[0041] In addition, after adjustment using the transparent substrate, the discharge state may change due to a pressure change in the processing liquid supply source. In this case, it is difficult for the user to notice the change in the discharge state of the processing liquid to the back surface of the transparent substrate. Therefore, the user will periodically open the chamber 14 to perform maintenance. However, as described above, opening the chamber 14 is not preferable because it may cause the inside of the chamber 14 to be contaminated by particles or the like. From this perspective, according to the present embodiment, the user can check the discharge state of the processing liquid to the back surface of the substrate W without opening the chamber 14, so that contamination of the inside of the chamber 14 due to maintenance can be suppressed.

[0042] For example, the control unit 7 stores, for a certain period of time, video data including an image when the processing liquid is being discharged, among the video data obtained by the camera 4b, in the storage unit 9. Thereby, if the user notices an abnormality in the substrate W after the processing of the substrate W is completed, the user can check the state of the processing liquid being discharged onto the back surface of the substrate W, which may be the cause of the abnormality in the substrate W, by displaying the video data stored in the storage unit 9 on the display unit of the input / output unit 8. Note that the user may check the substrates W one by one, or may check each lot after processing.

[0043] After a certain period of time has elapsed, the control unit 7 deletes the video data from the storage unit 9. This makes it possible to prevent the storage capacity of the storage unit 9 from being overloaded.

[0044] The operation of the substrate processing apparatus 1 according to the present embodiment will be described with reference to the flowchart of Fig. 3. Fig. 3 is a flowchart showing an example of a flow of processing performed by the substrate processing apparatus 1 according to the embodiment. Note that a substrate processing method for processing a substrate W according to the following procedure is also one aspect of this embodiment.

[0045] The camera 4b starts capturing an image (step S100). Then, the substrate W held by the hand of the transport robot is carried into the rotating holder 2, and the substrate W is supported by the holding pins of the holder 2b of the rotating holder 2, whereby the substrate W is held by the rotating holder 2 (step S101). Then, the cup body 5 is raised by the drive mechanism to the position shown in FIG. 1A (step S102).

[0046] Then, the substrate W starts to rotate about the axis R as the rotation axis (step S103). Then, the back surface discharge nozzle 4a starts to discharge the processing liquid (chemical liquid) onto the back surface of the substrate W, and the front surface discharge nozzle 6 starts to discharge the processing liquid (chemical liquid) onto the front surface of the substrate W (step S104). As a result, the camera 4b images an area 4b1 including a collision position of the chemical liquid discharged onto the back surface of the substrate W, out of the entire area of ​​the back surface of the substrate W. A moving image based on the moving image data obtained by the camera 4b is displayed on the display unit of the input / output unit 8.

[0047] In this state, the user checks the moving image displayed on the display unit of the input / output unit 8 to check the discharge status of the processing liquid (chemical liquid) onto the rear surface of the substrate W. If the discharge status is not normal (if the collision position is not normal or the chemical liquid has not spread to the outer periphery of the substrate W), the user inputs an instruction to stop processing (stop instruction) to the substrate processing apparatus 1 via the input / output unit 8. On the other hand, if the discharge status is normal, the user does not operate the input / output unit 8.

[0048] The control unit 7 judges whether or not a stop instruction has been received (step S105). If a stop instruction has been received (step S105: Yes), the back surface discharge nozzle 4a and the front surface discharge nozzle 6 stop discharging the processing liquid (chemical liquid) (step S116). Then, the substrate processing apparatus 1 executes the processes in steps S113 to S116 described below, stops the processes, and ends. After the processes are stopped, the user adjusts each part of the substrate processing apparatus 1 so that the discharge status of the chemical liquid becomes normal. For example, when the user determines that the collision position is not normal based on the moving image displayed on the display unit of the input / output unit 8, the user changes the pressure of the supply source of the chemical liquid. The pressure is changed by changing the flow rate of the chemical liquid set by the flow rate adjustment valve 12a. Furthermore, when the user determines that the chemical liquid has not spread to the outer periphery of the substrate W based on the moving image displayed on the display unit of the input / output unit 8, the user changes the pressure of the supply source or the rotation speed of the substrate W as described above. The rotation speed of the substrate W is changed by changing the output of the rotation mechanism 3.

[0049] On the other hand, if the stop command has not been received (step S105: No), the control unit 7 determines whether or not a predetermined time has elapsed since the discharge of the treatment liquid (chemical liquid) was started in step S104 (step S106). If the predetermined time has not elapsed (step S106: No), the control unit 7 returns to step S105 and performs the processes from step S105 onwards again.

[0050] On the other hand, if the predetermined time has elapsed (step S106: Yes), the back surface discharge nozzle 4a and the front surface discharge nozzle 6 stop discharging the processing liquid (chemical liquid) (step S107).

[0051] Then, the back surface discharge nozzle 4a starts discharging the processing liquid (cleaning liquid) onto the back surface of the substrate W, and the front surface discharge nozzle 6 starts discharging the processing liquid (cleaning liquid) onto the front surface of the substrate W (step S108). As a result, the camera 4b captures an image of an area 4b1, of the entire area of ​​the back surface of the substrate W, that includes a collision position of the cleaning liquid discharged onto the back surface of the substrate W. A moving image based on the moving image data obtained by the camera 4b is displayed on the display unit of the input / output unit 8.

[0052] In this state, the user checks the moving image displayed on the display unit of the input / output unit 8 to check the state of the cleaning liquid being discharged onto the rear surface of the substrate W. If the discharge state is not normal (if the collision position is not normal or the cleaning liquid has not spread to the outer periphery of the substrate W), the user inputs a stop instruction to the substrate processing apparatus 1 via the input / output unit 8. On the other hand, if the discharge state is normal, the user does not operate the input / output unit 8.

[0053] The control unit 7 judges whether or not a stop instruction has been received (step S109). If a stop instruction has been received (step S109: Yes), the back surface discharge nozzle 4a and the front surface discharge nozzle 6 stop discharging the processing liquid (cleaning liquid) (step S117). Then, the substrate processing apparatus 1 executes the processes in steps S113 to S116 described below, stops the processes, and ends. After the processes are stopped, the user adjusts each part of the substrate processing apparatus 1 so that the discharge status of the cleaning liquid becomes normal. For example, when the user determines that the collision position is not normal based on the moving image displayed on the display unit of the input / output unit 8, the user changes the pressure of the supply source of the cleaning liquid. Also, when the user determines that the cleaning liquid has not spread to the outer periphery of the substrate W, the user changes the pressure of the supply source or the rotation speed of the substrate W as described above. The method of adjusting each part of the substrate processing apparatus 1 is the same as the adjustment of the chemical liquid.

[0054] On the other hand, if the stop command has not been received (step S109: No), the control unit 7 determines whether or not a predetermined time has elapsed since the discharge of the cleaning liquid was started in step S108 (step S110). If the predetermined time has not elapsed (step S110: No), the control unit 7 returns to step S109 and performs the processes from step S109 onwards again.

[0055] On the other hand, if the predetermined time has elapsed (step S110: Yes), the back surface discharge nozzle 4a and the front surface discharge nozzle 6 stop discharging the processing liquid (cleaning liquid) (step S111).

[0056] Then, the gas discharge nozzle 4e supplies gas to the rotation center or the vicinity of the rotation center of the rear surface of the substrate W (step S112). At this time, since the substrate W continues to rotate, the cleaning liquid is shaken off by the rotation of the substrate W, and the cleaning liquid adhering to the entire rear surface of the substrate W is effectively removed by the flow of gas, thereby enabling spin drying. Thereafter, the gas discharge nozzle 4e stops supplying gas, and the substrate W stops rotating (step S113). Then, the cup body 5 is lowered by the driving mechanism (step S114).

[0057] Then, the substrate W is carried out from the substrate processing apparatus 1 by the hand of the transfer robot (step S115). Then, the camera 4b stops capturing images (step S116), and the process shown in FIG.

[0058] The substrate processing apparatus 1 according to the embodiment has been described above. The substrate processing apparatus 1 includes a rotating holder 2 that rotates while holding the substrate W, a back surface discharge nozzle 4a that discharges a processing liquid onto the back surface of the substrate W, and a camera 4b that captures an area 4b1 including a collision position of the processing liquid discharged onto the back surface of the substrate W among the areas on the back surface of the substrate W. The camera 4b is fixed to a nozzle fixing member 4 to which the back surface discharge nozzle 4a is fixed. In addition, the substrate W held by the rotating holder 2 rotates and moves relative to the fixed camera 4b. That is, the substrate W held by the rotating holder 2 moves relative to the camera 4b. According to this embodiment, the user can monitor the discharge status of the processing liquid discharged by the back surface discharge nozzle 4a in real time. As a result, processing defects on the back surface of the substrate W can be suppressed. In addition, since the back surface discharge nozzle 4a and the camera 4b are fixed to the rotating substrate W, it is possible to capture an image of a collision position of the processing liquid discharged onto the back surface of the substrate W from a fixed position and the spread of the processing liquid in the area around the collision position.

[0059] In this embodiment, the nozzle fixing member 4 is provided on the rotation axis R of the substrate W, and the back surface discharge nozzle 4a and the camera 4b are provided near the rotation axis R of the substrate W. This allows the processing liquid discharged near the rotation axis R of the back surface of the substrate W to process the entire back surface by the rotation of the substrate W, while monitoring the discharge status of the processing liquid in real time.

[0060] Moreover, in this embodiment, the nozzle fixing member 4 has a circular recess 4f centered on the rotation axis R of the substrate W in a plan view. The back surface discharge nozzle 4a and the camera 4b are provided on the inclined surface 4g of the recess 4f, and a liquid drainage hole 4d is provided on the bottom of the recess 4f. As a result, even if liquid discharged from the back surface discharge nozzle 4a and bounced off the back surface of the substrate W adheres to the camera 4b, the liquid can be discharged from the liquid drainage hole 4d provided on the bottom of the recess 4f, and liquid droplets can be prevented from remaining in the imaging field of the camera 4b.

[0061] In this embodiment, the optical axis 4b2 of the camera 4b is provided at an acute angle with respect to the rear surface of the substrate W. This expands the imaging range of the camera 4b, so that a wider area of ​​the rear surface of the substrate W can be monitored compared to when the angle between the optical axis 4b2 and the rear surface of the substrate W is a right angle. In this embodiment, the camera 4b is arranged so that the angle θ between the optical axis 4b2 of the camera 4b and the rear surface of the substrate W is an acute angle, so that the camera 4b images an area 4b1 including the center of the substrate W to a part of the outer periphery. This allows the processing liquid that has spread to the outer periphery of the substrate W to be monitored, so that processing defects on the entire rear surface of the substrate W can be suppressed. It is more preferable that the camera 4b is arranged so that the optical axis 4b2 of the camera 4b passes through the intersection between the rotation axis R of the substrate W and the rear surface of the substrate W and forms an acute angle θ with the rear surface of the substrate W. This allows the collision position of the processing liquid discharged on the rotation center part or near the rotation center part of the rear surface of the substrate W to be reliably imaged.

[0062] Moreover, in this embodiment, the nozzle fixing member 4 includes a light irradiation unit 4c that irradiates illumination light onto the rear surface of the substrate W. This makes it possible to image the rear surface of the substrate W with sufficient brightness to image the imaging area, even when imaging from the rear surface of the substrate W (the shadow of the substrate W).

[0063] In the above embodiment, the image data is monitored in real time by the display unit of the input / output unit 8 to determine the discharge status, but the present invention is not limited to this. For example, the substrate W to be processed may be managed by the Nth substrate in the ID number of the FOUP that contains the substrate W, or a number such as an ID engraved on the substrate W, or time data (the elapsed time from the start of production or the time of processing), and the image data acquired by the camera 4b may be linked to the number or time data and stored in the storage unit 9. When the processed substrate W is inspected and a processing defect is detected, the image data linked to the number of the substrate W with the processing defect can be confirmed to identify the cause of the processing defect.

[0064] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0065] 1. Substrate Processing Equipment 2 Rotational support part 4a Back discharge nozzle 4b Camera

Claims

1. A rotating holding part that rotates while holding the substrate, A back-side discharge nozzle for discharging processing liquid onto the back surface of the substrate, A camera that images the region on the back surface of the substrate, including the collision site of the processing liquid discharged onto the back surface of the substrate, Equipped with, The camera is fixed to the nozzle fixing member to which the rear discharge nozzle is fixed. Circuit board processing equipment.

2. The nozzle fixing member is provided on the rotation axis of the substrate, The substrate processing apparatus according to claim 1, wherein the back surface discharge nozzle and the camera are provided near the rotation axis of the substrate.

3. The nozzle fixing member has, in a plan view, a circular recess centered on the rotation axis of the substrate, The aforementioned back surface discharge nozzle and the camera are provided in the recess. The substrate processing apparatus according to claim 1, wherein a drainage hole is provided at the bottom of the recess.

4. The substrate processing apparatus according to claim 1, wherein the optical axis of the camera is positioned at an acute angle with respect to the back surface of the substrate.

5. The substrate processing apparatus according to claim 1, wherein the nozzle fixing member further comprises a light irradiation unit for irradiating illumination light onto the back surface of the substrate.

6. A process in which the substrate is held in place by a rotating holding part and rotated, The process involves discharging a processing liquid onto the back surface of the substrate using a back surface discharge nozzle, The process includes imaging a region of the back surface of the substrate, including the collision site of the processing liquid discharged onto the back surface of the substrate, using a camera. The camera is fixed to the nozzle fixing member to which the rear discharge nozzle is fixed. Substrate processing method.

Images