Substrate processing device

Abstract

To efficiently suppress the generation of particles caused by providing a notch on a plate.SOLUTION: A substrate processing device according to one embodiment includes: a substrate holding part having a plate which is positioned below a substrate and multiple substrate gripping members which are provided at a peripheral part of the plate, and in which the plate has multiple notches in the peripheral part; a rotation drive part which rotates the substrate holding part; multiple lift pins which support the peripheral part of the substrate from below and can move up / down; multiple sliding members which are provided in a slidable manner in the horizontal direction on the plate, and each of which can move between a closed position where the notches in the plate are closed, and an open position that allows the lift pins to move up / down through the notches; and multiple operation members which are provided below the plate in a manner of being able to move up / down, can be engaged with each of the sliding members, and slide the sliding members in the horizontal direction by moving up / down in a state of being engaged with the sliding members.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus. [Background technology]

[0002] In the manufacturing process of semiconductor devices, a brush process is performed in which the back surface (the surface on which devices are not formed) of a substrate such as a semiconductor wafer is turned upward and the back surface is polished or cleaned using a brush. An example of a processing unit for performing such a brush process is described in Patent Document 1.

[0003] The processing unit of Patent Document 1 includes a spin chuck that holds a substrate in a horizontal position and rotates it around a vertical axis. To prevent liquid supplied to the back surface of the substrate during processing from flowing around to the front surface of the substrate (the surface on which devices are formed), the spin chuck has a disk-shaped member (plate) that is slightly larger than the substrate and is positioned below the substrate, and nitrogen gas is supplied between the substrate and the disk-shaped member. When the substrate is transferred between the arm of the substrate transport mechanism and the spin chuck, three lift pins (substrate elevating members) lift the substrate while supporting the peripheral portion of the substrate from below. To allow the lift pins to rise, a notch is provided on the peripheral portion of the disk-shaped member. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-183310 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique capable of efficiently suppressing generation of particles caused by providing a notch in a plate. [Means for solving the problem]

[0006] According to one embodiment of the present disclosure, there is provided a substrate holding unit for holding a substrate in a horizontal position, the substrate holding unit including: a plate located below the substrate when the substrate holding unit holds the substrate; and a plurality of substrate gripping members provided on a peripheral portion of the plate and for holding the substrate, the plate having a plurality of notches on the peripheral portion; the substrate holding unit; a rotation drive unit for rotating the substrate holding unit about a vertical axis; a plurality of lift pins configured to be able to support the peripheral portion of the substrate from below and capable of ascending and descending through the notches of the plate; A substrate processing apparatus is provided comprising: a plurality of slidably arranged sliding members, each of which is movable between a closed position in which it at least partially closes each of the cutout portions of the plate and an open position in which it opens each of the cutout portions of the plate to allow a lift pin to rise and fall through the cutout portions; and a plurality of operating members which are arranged to be raised and lowered below the plate of the substrate holding unit and are engageable with each of the sliding members, the operating members raising and lowering while engaged with the sliding members to slide the sliding members horizontally. Effect of the Invention

[0007] According to the above-described embodiment of the present disclosure, generation of particles caused by providing the notches in the plate can be efficiently suppressed. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic cross-sectional view of a substrate processing system according to an embodiment of the substrate processing apparatus. [Diagram 2] 2 is a schematic vertical sectional view showing an example of the configuration of a processing unit included in the substrate processing system of FIG. 1. [Diagram 3] 3 is a schematic perspective view showing an example of the configuration of a portion of the peripheral portion of a plate of a spin chuck of the processing unit shown in FIG. 2. [Figure 4]4 is a schematic cross-sectional view showing a cross section IV-IV in FIG. 2, which shows a configuration example of a guide member for a slider provided on the plate shown in FIG. 3. [Figure 5A] 4 is a schematic diagram for explaining the function and effect of the inclined surface of the peripheral edge of the plate of the spin chuck and the inclined surface of the slider of FIG. 3. [Figure 5B] 4 is a schematic diagram for explaining the function and effect of the inclined surface of the peripheral edge of the plate of the spin chuck and the inclined surface of the slider of FIG. 3. [Figure 5C] 4 is a schematic diagram for explaining the function and effect of the inclined surface of the peripheral edge of the plate of the spin chuck and the inclined surface of the slider of FIG. 3. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] An embodiment of the present disclosure will now be described with reference to the accompanying drawings.

[0010] A schematic configuration of a substrate processing system 1 (an example of a liquid processing apparatus) according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a diagram showing a schematic configuration of the substrate processing system 1 according to an embodiment. In the following, to clarify the positional relationship, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other are defined, and the positive direction of the Z-axis is defined as the vertical upward direction.

[0011] 1, the substrate processing system 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are provided adjacent to each other.

[0012] The carry-in / out station 2 includes a carrier placement section 11 and a transport section 12. On the carrier placement section 11, a plurality of carriers C are placed, each of which horizontally accommodates a plurality of substrates, in this embodiment, semiconductor wafers W (hereinafter referred to as wafers W).

[0013] The transfer section 12 is provided adjacent to the carrier placement section 11, and includes therein a substrate transfer device 13 and a transfer section 14. The substrate transfer device 13 includes a wafer holding mechanism that holds the wafer W. The substrate transfer device 13 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the carrier C and the transfer section 14 using the wafer holding mechanism.

[0014] The processing station 3 is provided adjacent to the transport section 12. The processing station 3 includes a transport section 15 and a plurality of processing units 16. The plurality of processing units 16 are provided side by side on both sides of the transport section 15.

[0015] The transfer section 15 includes a substrate transfer device 17 therein. The substrate transfer device 17 includes a wafer holding mechanism that holds the wafer W. The substrate transfer device 17 is capable of moving in the horizontal and vertical directions and rotating about a vertical axis, and transfers the wafer W between the delivery section 14 and the processing unit 16 using the wafer holding mechanism.

[0016] The processing unit 16 performs substrate processing on the wafer W transferred by the substrate transfer device 17. The processing unit 16 performs processing on the wafer W, such as brush processing and cleaning processing.

[0017] The substrate processing system 1 includes a control device 4. The control device 4 is, for example, a computer, and includes a control calculation unit 18 and a storage unit 19. The storage unit 19 stores programs for controlling various processes executed in the substrate processing system 1. The control calculation unit 18 controls the operation of the substrate processing system 1 by reading out and executing the programs stored in the storage unit 19.

[0018] Such a program may be recorded in a computer-readable storage medium and installed from that storage medium into the storage unit 19 of the control device 4. Examples of computer-readable storage media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.

[0019] In the substrate processing system 1 configured as described above, first, the substrate transfer device 13 in the loading / unloading station 2 removes the wafer W from the carrier C placed on the carrier placement section 11, and places the removed wafer W on the transfer section 14. The wafer W placed on the transfer section 14 is then removed from the transfer section 14 by the substrate transfer device 17 in the processing station 3, and carried into the processing unit 16.

[0020] The wafer W carried into the processing unit 16 is subjected to substrate processing by the processing unit 16, and then carried out of the processing unit 16 by the substrate transfer device 17 and placed on the delivery section 14. Then, the processed wafer W placed on the delivery section 14 is returned to the carrier C of the carrier placement section 11 by the substrate transfer device 13.

[0021] When the processing unit 16 is a brush processing unit that brushes the back surface of the wafer W, a reverser (not shown) for turning over the wafer W is provided. In this case, the reverser can be provided instead of the processing unit 16 at some of the positions where the processing units 16 are installed in FIG. 1. Alternatively, the reverser may be provided above or below the transfer section 14. In this case, a transfer device that transfers the wafer W between the reverser and the transfer section 14 may be provided in addition to the substrate transfer devices 13 and 17. The reverser turns over the wafer W, for example, immediately before the wafer W is carried into the processing unit 16 (brush processing unit) and immediately after the wafer W is carried out from the processing unit 16 (brush processing unit).

[0022] Next, the configuration of the processing unit 16 will be described with reference to Fig. 2 to Fig. 4. As shown in Fig. 2, the processing unit 16 includes a spin chuck (substrate holding and rotating mechanism) 100 configured to hold a wafer W (substrate) in a horizontal position and rotate it about a vertical axis. The spin chuck 100 includes a substrate holding part 110, a rotation shaft 130, and a rotation drive part 140. The rotation drive part 140 is formed of, for example, an electric motor.

[0023] The substrate holding unit 110 has a disk-shaped plate 111 and a plurality of, for example, three (only one is shown in FIG. 1) chuck members 112 (substrate gripping members) attached to the peripheral edge of the plate 111. The three chuck members 112 are provided at positions that divide the peripheral edge of the plate 111 into thirds in the circumferential direction.

[0024] Each chuck member 112 of the substrate holding portion 110 is capable of rotating around a rotation axis 113 provided on the peripheral portion of the plate 111 between a gripping position (position shown in FIG. 2) for gripping the wafer W and a release position for releasing the wafer W (see arrow S1 in FIG. 2).

[0025] 2 and 3, an inclined surface 117 that becomes higher toward the periphery of plate 111 is provided on the peripheral portion of the upper surface of plate 111. In this embodiment, a region of the upper surface of plate 111 that is radially inward of inclined surface 117 is a horizontal surface 119. A wafer W is temporarily placed on inclined surface 117 when the wafer W is transferred between spin chuck 100 and a substrate holding arm of an external substrate transfer device (substrate transfer device 17 shown in FIG. 1 in this embodiment).

[0026] With the wafer W placed on the inclined surface 117 of the plate 111, the chuck member 112 is rotated from the release position to the gripping position, whereby the gripping claws 114 of the chuck member 112 engage with the vicinity of the APEX (outer periphery) of the wafer W and lift the wafer W from the inclined surface 117 to grip the wafer W. At this time, a small gap G (for example, a gap of about 0.5 mm measured in the vertical direction) is formed between the inclined surface 117 and the periphery of the lower surface of the wafer W.

[0027] By rotating the chuck member 112 gripping the wafer W from the gripping position to the release position, the gripping jaws 114 of the chuck member 112 separate from the wafer W, and the wafer W falls onto the inclined surface 117 and is supported by the inclined surface 117.

[0028] The chuck member 112 is biased toward the gripping position by a spring 115 (e.g., a torsion coil spring) shown diagrammatically by a dashed line in Fig. 2. Therefore, after the wafer W is gripped by the gripping jaws 114 of the chuck member 112, the wafer W remains gripped by the chuck member 112 even if no external force (other than that from the spring 115) is applied to the chuck member 112.

[0029] The chuck member 112 has a pushed-up portion 116 on the opposite side to the gripping jaws 114 with respect to the rotation shaft 113. By pushing the pushed-up portion 116 upward with the chuck operating member 210, the chuck member 112 can be rotated to move the gripping jaws 114 to a release position where they are separated from the wafer W.

[0030] In order to enable the chuck member 112 to grip the wafer W on the inclined surface 117, the surface of the inclined surface 117 is cut out to a minimum extent in accordance with the shape of the chuck member 112. Compared to the cutout 118 described below, this cutout has almost no adverse effect on the flow of the inert gas described below.

[0031] A gas supply path 131 extends inside a rotation shaft 130 of the spin chuck 100. The upper end of the gas supply path 131 serves as a gas outlet 132 that ejects an inert gas (e.g., nitrogen gas) toward a space S between the lower surface of the wafer W held by the substrate holding part 110 and the upper surface of the plate 111. The gas outlet 132 may be formed so that a vector indicating the direction of the main flow of gas ejected therefrom has a component toward the periphery of the plate 111, or may be configured to eject gas directly upward.

[0032] The lower end of the gas supply path 131 is connected to an inert gas source 134 via a gas supply control mechanism 133. The gas supply control mechanism 133 includes devices such as an on-off valve, a flow control valve, and a flow meter, and can start and stop gas discharge from the gas discharge port 132 and control the gas discharge flow rate. The inert gas source 134 is, for example, a factory utility provided in a semiconductor manufacturing factory.

[0033] When the spin chuck 100 holds and rotates the wafer W to process the wafer W, an inert gas is supplied from the gas outlet 132. The inert gas flows through the space S between the wafer W and the plate 111 toward the periphery of the wafer W, passes through the gap G between the periphery of the wafer W and the periphery of the plate 111, and flows out of the space S.

[0034] The gas supply passage 131, the gas discharge port 132, the gas supply control mechanism 133, etc. form a gas supply section.

[0035] 5A, when the flow of the inert gas approaches the gap G, it is redirected by the inclined surface 117 toward the peripheral portion of the lower surface of the wafer W. Therefore, even if liquid, such as DIW (pure water), supplied to the upper surface of the wafer W attempts to flow around to the lower surface of the wafer W, such flow is prevented by the flow of the inert gas. Furthermore, by providing the inclined surface 117, the height direction distance of the space S becomes smaller as the flow approaches the gap G (i.e., the flow path area of ​​the inert gas decreases), so that the flow rate of the inert gas increases as the flow approaches the gap G, thereby promoting the above-mentioned effect of preventing flow around.

[0036] The processing unit 16 includes a plurality of lift pins 300, three in this embodiment. The lift pins 300 mediate the transfer of the wafer W between an arm of an external transfer device (the arm of the substrate transfer device 17 shown in FIG. 1 in this embodiment) and the spin chuck 100. The three lift pins 300 are disposed at approximately midpoints between adjacent chuck members 112 in the circumferential direction of the plate 111 in a plan view.

[0037] A head 301 of each lift pin 300 (substrate lifting member) has a shape suitable for holding the peripheral portion of a wafer W. In this embodiment, the head 301 has an upward supporting surface 302 that supports the peripheral portion of the lower surface of the wafer W, and a position restricting surface 303 that faces inward in the radial direction of the wafer W for restricting the radial position of an APEX of the wafer W. The supporting surface 302 supports, for example, a region corresponding to an edge exclusion of a surface (here, a downward surface) of the wafer W on which devices are formed.

[0038] The lower ends of the three lift pins 300 are attached to, for example, a ring-shaped lift body 304. The lift body 304 can be raised and lowered by a lift mechanism consisting of a linear actuator 305 such as an air cylinder, and with this lifting operation, the lift pins 300 can be raised and lowered in the vertical direction between a raised position (a wafer transfer position shown by a chain line in FIG. 2) and a lowered position (a standby position shown by a solid line in FIG. 2).

[0039] As can be seen from the raised position of lift pin 300 shown in FIG. 2, the actual length of lift pin 300 is longer than shown by the solid line, and lift body 304 and linear actuator 305 are actually lower than the positions shown, but are shown in the positions shown for convenience in creating the drawing.

[0040] Since heads 301 of lift pins 300 engage with the peripheral edge of wafer W, they must be provided so as to pass through the peripheral edge of plate 111. For this reason, notches 118 are provided on the peripheral edge of plate 111 to allow lift pins 300 to pass in the vertical direction. In other words, inclined surface 117 provided on the peripheral edge of the upper surface of plate 111 is discontinuous at notches 118. Note that notches 118 are clearly shown in FIG. 3.

[0041] If this notch 118 is left as it is (i.e., if there is no slider 120 described later), the inert gas will flow downward at the notch 118 as shown in Fig. 5C, and as a result, there will be almost no flow of inert gas along the peripheral portion of the underside of the wafer W. This makes it impossible to prevent the flow of liquid that tries to flow from the upper surface to the underside of the wafer W. If the liquid that has flowed to the underside dries, particles will be generated.

[0042] In order to solve the above problem, a slider (sliding member) 120, which is a closing block body capable of closing at least a portion of the cutout 118 located directly below the wafer W, is provided on the plate 111. The slider 120 can slide horizontally in the radial direction of the plate 111 between a closed position in which the slider 120 at least partially closes the cutout 118 and an open position in which the slider 120 opens the cutout 118 to allow the lift pins 300 to pass therethrough.

[0043] The top surface of the slider 120 has a horizontal surface 123 on the inside (the center side of the plate 111) and an inclined surface (edge ​​inclined surface) 124 on the outside (the peripheral edge side of the plate 111). The horizontal surface 123 is at the same height as a horizontal surface 119 which is located closer to the center than the inclined surface 117 of the plate 111.

[0044] 3, the inclined surface 124 is inclined so that the height increases toward the outside (the peripheral edge side of the plate 111). When the slider 120 is in the closed position, the inclined surface 124 of the slider 120 is generally flush with the inclined surface (peripheral edge inclined surface) 117 of the plate 111. In other words, when viewed in the circumferential direction of the plate 111, the inclined surface 124 of the slider 120 is generally continuous with the inclined surface 117 of the plate 111.

[0045] As shown diagrammatically in Fig. 5B, the inclined surface 124 of the slider 120 in the closed position, like the inclined surface 117 of the plate 111 (see Fig. 5A), can divert the inert gas flowing horizontally between the plate 111 and the wafer W toward the lower surface of the wafer W. This can prevent the inert gas from flowing downward at the notch 118, and as a result, can prevent the liquid from flowing from the upper surface to the lower surface of the wafer W.

[0046] When the wafer W is gripped by the chuck member 112 of the spin chuck 100, a tip 1241 (see FIG. 3) of the inclined surface 124 of the slider 120 in the closed position is positioned almost directly below the peripheral edge We of the wafer W. The position of the peripheral edge We is indicated by a dashed line in the perspective view of FIG. 3. At this time, it is preferable that the distance GS (see FIG. 3) between the peripheral edge We of the wafer W and the tip 1241 of the inclined surface 124 of the slider 120 measured in the vertical direction is a small value, for example, about 0.5 mm or less.

[0047] The leading edge (periphery) 1171 (see FIG. 3) of the inclined surface 117 of the plate 111 is located radially outward of the leading edge 1241 of the inclined surface 124 of the slider 120 in the closed position because the inclined surface 117 is used to temporarily place the wafer W on it. The leading edge 1241 may be aligned with the leading edge 1171, but in that case, the above-mentioned distance GS must be increased. On the other hand, the leading edge 1171 of the inclined surface 117 may be aligned with the peripheral edge We of the wafer W in a plan view, but in that case, for example, a means for transferring the wafer W directly to the chuck member 112 without the inclined surface 117 temporarily placing the wafer W on it is required. Therefore, the arrangement shown in FIG. 3 is currently considered to be the most preferable arrangement.

[0048] Considering the flow of inert gas near the peripheral portion of the lower surface of the wafer, it is preferable that the slider 120 has an inclined surface 124. However, an embodiment in which the upper surface of the slider 120 is a horizontal surface is also possible. As long as the slider 120 in the closed position covers the notch 118 directly below the wafer W, the downward flow of inert gas as shown in FIG. 5C is reduced, making it possible to prevent the liquid from flowing from the upper surface of the wafer W to the lower surface. If the slider 120 does not have an inclined surface 124, there is also an advantage that it is not necessary to expose the slit 125, which will be described later, on the upper surface 119 of the plate 111.

[0049] Next, a moving mechanism of the slider 120 will be described. As shown in Fig. 2, a guide member 121 that guides the slider 120 horizontally in the radial direction of the plate 111 is provided on the plate 111 of the substrate holding part 110. The guide member 121 is immovable relative to the plate 111. As long as the slider 120 can smoothly slide horizontally in the radial direction of the plate 111, the configuration of the guide member 121 is arbitrary.

[0050] The slider 120 has a surface facing inward in the radial direction of the plate 111, and the guide member 121 has a surface facing outward in the radial direction of the plate 111, with a spring (compression spring) 122 provided between these opposing surfaces. The slider 120 is biased toward the closed position by this spring 122. Therefore, when no external force is applied to the slider 120 (from any source other than the spring 122), the slider 120 is located at the closed position.

[0051] The slider 120 is provided with an inclined surface 126 (operated inclined surface) that is inclined (facing diagonally downward) with respect to the horizontal plane. The inclined surface 126 is inclined so as to become higher as it approaches the outside of the slider 120 (as it approaches the outer periphery of the plate 111). For example, by moving the head of a slider operating member 220 in the form of a pin extending in the vertical direction upward while sliding it in contact with the inclined surface 123, the slider 120 guided by the guide member 121 slides toward the open position against the biasing force of the spring 122 (see arrow S2 in FIG. 2).

[0052] As shown in FIG. 2 and FIG. 3, a slit 125 is provided on the upper surface of the plate 111 to allow the slider 120 to move between the closed position and the open position. There is a possibility that the inert gas may escape below the plate 111 from a portion of the slit 125 where the slider 120 is not present. Also, in order to allow the slider 120 to move smoothly, the width of the slit 125 is slightly larger than the width of the slider 120. Therefore, there is a possibility that the inert gas may escape below the plate 111 through a gap between the side wall of the slit 125 and the side wall of the slider 120. In order to make such an event less likely to occur, as shown in FIG. 4, a guide member 121 may be provided so as to surround the slider 120. Alternatively, the width of a lower portion 127 of the slider 120 below the slit 125 may be larger than the width of an upper portion 128 of the slider 120 in the slit 125. Although the shape shown in FIG. 4 does not strictly match that shown in FIG. 2, it should be understood that FIG. 4 is merely a schematic diagram.

[0053] Instead of the notch 118 in the form of a recess extending from the periphery of the plate 111 toward the center, a notch in the form of a hole (the outline of which is shown by the dashed line 119A in FIG. 3) through which the lift pin 300 can pass and which vertically penetrates the periphery may be provided in the periphery of the plate 111. Such a notch in the form of a hole does not open on the periphery of the plate 111. It is clear that such a hole can also be opened and closed by a slider similar to that described above.

[0054] Next, structures provided around the spin chuck 100 will be described with reference to Fig. 2. Around the spin chuck 100, a liquid receiving cup 150 is provided to receive and collect liquid scattered from the wafer W held by the substrate holding part 110. In the illustrated example, the liquid receiving cup 150 has an outer cup body 151 and an inner cup body 152, and liquid flows down through a passage 153 between the outer cup body 151 and the inner cup body 152. As is well known in the technical field of semiconductor manufacturing equipment, one or more movable cup bodies may be further provided between the outer cup body 151 and the inner cup body 152 to form multiple passages between two adjacent cup bodies, and liquid may be discharged from a passage selected according to the type of liquid to be supplied to the wafer W.

[0055] The upper end of the inner cup body 152, which is the innermost cup body, is disposed close to the plate 111 and is arranged so that liquid scattered from the wafer W is unlikely to enter the space directly below the plate 111. The processing unit 16 is provided with various actuators (air cylinders, motors) and associated electric circuits. In order to reliably protect these actuators, electric circuits, etc. from a contaminated atmosphere including mist of the processing liquid (liquid supplied to the wafer W), a partition member 160 is provided below the plate 111. The actuators, electric circuits, etc. are provided below the partition member 160.

[0056] The partition member 160 is formed, for example, in a disk shape as a whole, and a downwardly hanging side peripheral portion 167 is provided along the entire outer periphery of the disk shape. A hole is provided in the center of the partition member 160, through which the rotation shaft 130 of the spin chuck 100 passes.

[0057] The partition member 160 is provided with three holes 161 through which the three lift pins 300 pass. A movable lid 162 that closes the holes 161 when the lift pins 300 are in the lowered position is attached to the partition member 160. The movable lid 162 has a generally cylindrical base 163 and a lid body 164 that extends radially outward from the base 163. The base 163 is attached rotatably around an axis 165 provided in the partition member 160.

[0058] A groove 166 is formed on the outer peripheral surface of the base 163, which extends obliquely on the outer peripheral surface. The groove 166 is formed so that the larger the angle θ on the outer peripheral surface, the larger the height h. A lid operating member 230 for rotating the movable lid 162 is engaged with this groove 166. By moving the lid operating member 230 up and down, the base 163 and the lid main body 164 rotate around the shaft 165 (see the arrow S3 in FIG. 2). With this rotation, the lid main body 164 moves between a closed position where the hole 161 is closed and an open position where the hole 161 is opened to allow the lift pin 300 to pass through the hole 161. In other words, the base 163 with the groove 166 and the lid operating member 230 constitute a cylindrical cam mechanism. Here, the hole 161 is opened when the lid operating member 230 is in the raised position, and the hole 161 is closed when the lid operating member 230 is in the lowered position. By closing the hole 161, the intrusion of the contaminated atmosphere into the area below the partition member 160 can be more reliably prevented.

[0059] The above-mentioned three operation members (chuck operation member 210, slider operation member 220, and lid operation member 230) are supported by a single lifting member 240. These operation members 210, 220, and 230 may be integrally molded with the lifting member 240, or may be formed separately from the lifting member 240 and then fixed to the lifting member 240. The chuck operation member 210 may be the upper surface of the lifting member 240 itself, or may be a protrusion extending upward from the upper surface of the lifting member 240.

[0060] The lifting member 240 has, for example, a generally disk-shaped shape overall. A hole through which the rotation shaft 130 of the spin chuck 100 passes is provided in the center of the lifting member 240. A gap is provided between the holes in the centers of the lifting member 240 and the partition member 160 and the rotation shaft 130 of the spin chuck 100, so that the lifting member 240 and the partition member 160 do not rotate even when the rotation shaft 130 of the spin chuck 100 rotates.

[0061] The lifting member 240 can be raised and lowered by a lifting mechanism consisting of a linear actuator 241 such as an air cylinder. One or more rods 242 extend downward from the lower surface of the lifting member 240 and penetrate the partition member 160. The lower end of the rod 242 is connected to one disk-shaped lifting body 243, and this lifting body 243 is raised and lowered by the linear actuator 241.

[0062] The linear actuator 241 is provided below the partition member 160. By raising and lowering the lifting member 240, the chuck operation member 210, the slider operation member 220, and the lid operation member 230 can be raised and lowered simultaneously.

[0063] When the lifting member 240 is raised, the chuck operating member 210 raises the pushed portion 116 of the chuck member 112, and the chuck member 112 moves to the release position. The slider operating member 220 also contacts the inclined surface 123 of the slider 120 and pushes the inclined surface 123 upward, and the slider 120 moves to the release position. Furthermore, the lid operating member 230 rotates the movable lid 162, and the lid main body 164 moves to the open position. This allows the lift pin 300 to be freely raised and lowered between the raised position and the lowered position.

[0064] When the lifting member 240 is lowered, the chuck operating member 210 moves away from the pushed portion 116 of the chuck member 112, and the chuck member 112 moves to the gripping position. Also, the slider operating member 220 moves away from the inclined surface 123 of the slider 120, and the slider 120 moves to the closed position. Furthermore, the lid operating member 230 rotates the movable lid 162, and the lid main body 164 moves to the closed position.

[0065] Next, the processing of one wafer W performed in the processing unit 16 will be described.

[0066] The arm of the substrate transfer device 17 holding the unprocessed wafer W is inserted into the processing unit 16 and is made to wait at the transfer position (the position directly above the spin chuck 100). The lifting member 240 is also raised so that the lift pins 300 can freely rise and fall between the raised and lowered positions. Next, the lift pins 300 are raised and the wafer W is removed from the arm of the substrate transfer device 17. Next, the arm of the substrate transfer device 17 is made to retract from the processing unit 16.

[0067] Next, the lift pins 300 supporting the wafer W are lowered to the lowered position. When the wafer W rests on the inclined surface 117 during the lowering of the lift pins 300, the wafer W is released from the lift pins 300. Next, the lifting member 240 is moved to the lowered position, whereby the chuck member 112 moves to the gripping position to grip the wafer W, and accordingly the wafer W is slightly released from the inclined surface 117. In addition, the slider 120 and the lid main body 164 move to the closed position. This completes preparations for processing the wafer W.

[0068] Here, the processing performed on the wafer W is a brush processing performed on the back surface (the surface on which devices are formed) of the wafer W. In this case, the wafer W is turned over by a reverser before being carried into the processing unit 16, and therefore the wafer W is held by the spin chuck 100 with the back surface of the wafer W facing upward. With the wafer W rotated by the spin chuck 100, for example, a brush cleaning process, a two-fluid cleaning process, a rinsing process, and a drying process are sequentially performed.

[0069] In the brush cleaning process, the two-fluid cleaning process, and the rinsing process, the processing is performed in a state where a liquid (e.g., DIW) is supplied to the back surface (upward surface (upper surface)) of the wafer W. In the brush cleaning process, a rotating brush 401 moves between the center and the periphery of the wafer W while being pressed against the upper surface of the rotating wafer W. At this time, a liquid (e.g., DIW) is supplied to the wafer W from a liquid discharge structure built into the brush 401. In the two-fluid cleaning process, a nozzle 402 that discharges two fluids including a cleaning liquid (e.g., DIW) and a gas (e.g., nitrogen gas) toward the upper surface of the rotating wafer W moves back and forth between a position above the center of the wafer W and a position above the periphery. In the rinsing process, a rinsing liquid (e.g., DIW) is supplied to the center of the upper surface of the rotating wafer W from the nozzle 402 (which may be a different nozzle).

[0070] In order to prevent the liquid supplied to the upper surface of the wafer W from flowing around to the lower surface of the wafer W and contaminating the lower surface of the wafer W (the surface on which devices are formed), an inert gas is supplied from gas discharge ports 132 into space S between the upper surface of plate 110 and the lower surface of wafer W. As described above with reference to Figures 5A to 5C, the effect of preventing the liquid from flowing around by the inert gas is exerted over the entire periphery of the wafer W by slider 120 in the closed position.

[0071] The drying step is performed by rotating the wafer W at high speed without supplying any liquid to the upper surface of the wafer W. When the drying step is completed, a series of processing steps for one wafer W is completed.

[0072] When the processing of the wafer W is completed, the lifting member 240 is moved to the raised position. Accordingly, the chuck member 112 is moved to the released position, and the wafer W that was held by the chuck member 112 falls onto the inclined surface 117 of the plate 110. In addition, the slider 120 and the lid body 164 are moved to the released position. Next, the lift pins 300 are raised, and the wafer W is lifted from the inclined surface 117 by the lift pins 300. The lift pins 300 supporting the wafer W are then raised to the raised position. Next, the arm of the empty substrate transfer device 17 is positioned at the transfer position in the processing unit 16, and in this state, the lift pins 300 are lowered to transfer the wafer W to the arm of the substrate transfer device 17. Next, the arm of the substrate transfer device 17 holding the wafer W leaves the processing unit 16.

[0073] According to the above embodiment, the slider 120 at least partially covers the cutout 118 of the plate 110 while the wafer W is being processed, thereby preventing the underside of the wafer W from being contaminated by liquid seeping around the underside of the wafer W in the vicinity of the cutout 118.

[0074] Moreover, the slider 120 moves to the open position against the elastic force of the spring 122 by moving the slider operating member 220 upward, and moves to the closed position by the elastic force of the spring 122 by moving the slider operating member 220 downward, and is fixed at the closed position. Therefore, when the spin chuck 100 is rotating, there is no need to apply an external force (other than the spring force) to the slider 120 to fix the slider 120 at the closed position.

[0075] Moreover, the chuck member 112 moves to the release position against the elastic force of the spring 115 by moving the chuck operating member 210 upward, and moves to the gripping position by the elastic force of the spring 115 by moving the chuck operating member 210 downward. Therefore, when the spin chuck 100 is rotating, it is not necessary to apply an external force (other than the spring force) to the chuck member 112 to fix the chuck member 112 at the gripping position.

[0076] The slider 120 and the chuck member 112 are located at positions suitable for attaching and detaching the wafer W to and from the spin chuck 100 by positioning the operation members 220 and 210 at the raised positions. The slider 120 and the chuck member 112 are located at positions suitable for rotating the wafer W by the spin chuck 100 and processing it by positioning the operation members 220 and 210 at the lowered positions. Therefore, by integrating the slider operation member 220 and the chuck operation member 210 with one lifting member 240, the slider 120 and the chuck member 112 can be simultaneously moved toward desired positions by a single lifting drive mechanism (here, the linear actuator 241). Therefore, the number of parts of the processing unit 16 can be reduced, and the manufacturing cost of the processing unit 16 can be reduced.

[0077] The lid body 164 is moved to the open position by moving the lid operation member 230 to the raised position, and moved to the closed position by moving the lid operation member 230 to the lowered position. That is, the lid body 164, in addition to the slider 120 and the chuck member 112, is also located at a position suitable for attaching and detaching the wafer W to and from the spin chuck 100 by positioning the operation member (lid operation member 230) at the raised position, and is located at a position suitable for rotating the wafer W by the spin chuck 100 and processing it by positioning the operation member (lid operation member 230) at the lowered position. Therefore, by integrating the lid operation member 230 with one lifting member 240, the slider 120, the chuck member 112, and the lid body 164 can be simultaneously moved to the desired position by a single lifting drive mechanism (here, the linear actuator 241). This allows the number of parts of the processing unit 16 to be reduced, and the manufacturing cost of the processing unit 16 to be reduced.

[0078] In the above embodiment, the chuck operation member 210, the slider operation member 220, and the lid operation member 230 are all integrated with a single lifting member 240 and are raised and lowered together with the lifting member 240. This configuration is most preferable from the viewpoint of reducing the number of parts and manufacturing costs of the processing unit 16, but is not limited to this. That is, a modified embodiment is also possible in which two of the chuck operation member 210, the slider operation member 220, and the lid operation member 230 are integrated with the lifting member 240, and the remaining one is not integrated with the lifting member 240 and is driven by a separate driving source. For example, a modified embodiment is also possible in which the slider operation member 220 and the lid operation member 230, which are closely related to the lifting and lowering of the lift pins 300, are integrated with the lifting member 240, and the chuck operation member 210 is not integrated with the lifting member 240 and is driven by a separate driving source. In this case as well, the number of parts of the processing unit 16 can be reduced, and the effect of lowering the manufacturing cost of the processing unit 16 can be obtained.

[0079] The processing unit 16 according to the above embodiment is suitable for processing the back surface of the wafer W with the back surface of the wafer W facing upward, but it is also possible to process the front surface of the wafer W with the front surface of the wafer W facing upward. The processing performed in the processing unit 16 is not limited to the brush processing described above, and may be a chemical processing (chemical cleaning processing, etching processing). Whatever processing is performed, the effect of the liquid flowing from the upper surface to the lower surface of the wafer W by the slider 120 can be obtained.

[0080] The embodiments disclosed herein should be considered as illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0081] The substrate to be processed is not limited to a semiconductor wafer, but may be any of various substrates used in the field of semiconductor device manufacturing, such as a glass substrate or a ceramic substrate. [Explanation of symbols]

[0082] W substrate (wafer) 110 Board holding part 111 Plate 112 Substrate gripping member (chuck member) 118 Cutout (cutout) 120 Closing member (slider) 130 Rotation drive unit 220 Operating member (slider operating member) 300 Lift Pin

Claims

1. a substrate holding unit that holds a substrate in a horizontal position, the substrate holding unit having a plate that is positioned below the substrate when the substrate holding unit is holding the substrate, and a plurality of substrate gripping members that are provided on the peripheral edge of the plate and hold the substrate, the plate having a plurality of notches on the peripheral edge; a rotation drive unit that rotates the substrate holder around a vertical axis; a plurality of lift pins configured to support a peripheral edge portion of the substrate from below and capable of moving up and down through the cutout portion of the plate; a plurality of sliding members provided on the plate of the substrate holding unit so as to be slidable in a horizontal direction, each of the sliding members being movable between a closed position in which the sliding members at least partially close a respective one of the notches of the plate and an open position in which the sliding members open a respective one of the notches of the plate to allow lift pins to move up and down through the notches; a plurality of operating members provided below the plate of the substrate holding unit in a manner that allows them to be raised and lowered, and engageable with each of the sliding members, the operating members moving up and down while engaged with the sliding members to slide the sliding members in a horizontal direction; A substrate processing apparatus comprising:

2. 2. The substrate processing apparatus according to claim 1, wherein each of the sliding members is attached to the plate via a guide structure that guides the sliding member horizontally, and has an inclined operated surface that is inclined with respect to a horizontal plane, and the sliding member moves horizontally by raising and lowering the operating member while sliding it along the inclined operated surface with the operating member in contact with the inclined operated surface.

3. The substrate processing apparatus according to claim 1 , wherein the sliding member is spring-biased toward the closed position.

4. 2. The substrate processing apparatus according to claim 1, further comprising: a lifting body provided below the plate, the lifting body carrying the plurality of operating members for the sliding members; and a lifting drive unit that raises and lowers the lifting body between an elevated position and a lowered position, wherein the plurality of operating members for the sliding members are raised and lowered together with the lifting body.

5. 5. The substrate processing apparatus according to claim 4, further comprising a partition member provided below the lifting body and isolating a space in which at least an actuator for lifting and lowering the lift pins and the rotation drive unit are provided from a space in which the lifting body is provided.

6. the partition member is provided with a plurality of through holes through which the lift pins can pass, and a cover member that is movable between a closed position that closes each of the through holes and an open position that opens the through holes, The substrate processing apparatus of claim 5 , wherein the lift pins, when in the lowered position, are located below the lid member, which is in the closed position, and the lid member is opened when the lift pins rise from the lowered position.

7. The substrate processing apparatus according to claim 6, wherein the cover member is moved between a closed position in which each of the through holes is closed and an open position in which each of the through holes is opened by being operated by an operating member for the cover member carried on the lifting body.

8. the lid member has a cylindrical base portion having a groove formed on an outer peripheral surface thereof and rotatable about a rotation axis extending in a vertical direction, and a lid main body attached to the base portion; The cover operating member engages with a groove in the cylindrical base, 8. The substrate processing apparatus of claim 7, wherein the groove in the base and the operating member for the lid member form a cylindrical cam mechanism, and by moving the lifting body toward a lowered position, the base rotates and the lid body closes the through hole, and by moving the lifting body toward an upper position, the base rotates and the lid body opens the through hole.

9. a substrate gripping member of the substrate holding unit is pivotally attached to a peripheral edge of the plate and is movable between a gripping position for gripping the substrate and a release position for releasing the substrate; the gripping member has a gripping portion that grips a peripheral edge portion of the substrate and an operated portion that moves the gripping portion, the lifting body has an operating member for an operated portion that can push up the operated portion of the gripping member, and the operating member for the operated portion is made up of a member carried on the lifting body or the lifting body itself, The substrate processing apparatus of claim 8 , wherein the substrate gripping member is positioned at the gripping position by positioning the lifting body at a lowered position, and the substrate gripping member is positioned at the release position by positioning the lifting body at an elevated position.

10. 10. The substrate processing apparatus of claim 1, further comprising a gas supply unit that supplies gas to a space between an underside of the substrate held by the substrate holding unit and an upper surface of the plate of the substrate holding unit, wherein the gas supplied to the space flows through the space between the upper surface of the plate and the underside of the substrate, and then flows out of the space through a gap between a peripheral portion of the plate and a peripheral portion of the substrate.

11. a peripheral portion of the upper surface of the plate has a peripheral inclined surface that becomes higher as it approaches the periphery of the plate, and the peripheral inclined surface of the plate turns the gas flowing horizontally through the space toward the lower surface of the substrate; 11. The substrate processing apparatus according to claim 10, wherein an end inclined surface is provided at an end of an upper surface of each of the sliding members, and the end inclined surface is provided so that the end inclined surface of the sliding member is continuous with the peripheral inclined surface of the plate when viewed in the circumferential direction of the plate when the sliding members are in the closed position.

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