Substrate processing method, storage medium, and substrate processing device
The method addresses pattern collapse in substrate processing by replacing liquid in recesses with a solid reinforcing material and reducing molecular bonds, allowing for stable drying without pattern distortion.
JP2024170630AActive Publication Date: 2024-12-10TOKYO ELECTRON LTD
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Patent Information
- Application Number
- JP2024158388
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2020-08-20
- Filing Date
- 2024-09-12
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2041-08-10
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Figure 2024170630000001_ABST
Abstract
To provide a substrate processing method and a substrate processing device that are effective in suppressing pattern collapse of uneven patterns.SOLUTION: The substrate processing method includes replacing a liquid in a recess of a substrate on which an uneven surface pattern is formed with a reinforcement material in a solid state and applying a low molecular weight processing to the substrate to reduce the number of bonds between molecules in the reinforcement material while maintaining the reinforcement material in a solid state.SELECTED DRAWING: Figure 8
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Citation Information
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