Signal transmission board and manufacturing method thereof
The signal transmission board addresses the challenge of substrate warpage and signal loss by using asymmetrical insulating layers with controlled thickness and modulus ratios to balance stress and impedance, enhancing both signal efficiency and structural integrity.
JP2024170672AActive Publication Date: 2024-12-10DAI NIPPON PRINTING CO LTD
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Patent Information
- Application Number
- JP2024162675
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-19
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2037-03-08
Smart Images
Figure 2024170672000001_ABST
Abstract
To provide a signal transmission board capable of improving transmission efficiency of signal while restraining warpage of a substrate, and to provide a manufacturing method thereof.SOLUTION: A signal transmission board includes a substrate 12 having a first face 13 and a second face 14 opposite to the first face 13, a first signal layer 331 located on the first face 13, a first insulation layer 36 located on the first signal layer 331, a first ground layer 351 located on the first insulation layer 36, a second signal layer 431 located on the second face 14, connected electrically with the first signal layer 331, and having a larger dimension than the first signal layer 331 in the width direction crossing the signal transmission direction, a second insulation layer 44 located above the second signal layer 431, and having a larger dimension than the first insulation layer 36 in the thickness direction crossing the first face 13 and a smaller degree of elasticity, and a second ground layer 451 located above the second insulation layer 44.SELECTED DRAWING: Figure 1
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Citation Information
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