Connection structure, manufacturing method thereof, connection material, and coated conductive particles
The use of coated conductive particles with diffusing metal atoms forms stable electrical connections by reducing and stabilizing conduction resistance, addressing the limitations of conventional particles.
JP2024175135AInactive Publication Date: 2024-12-17DEXERIALS CORP
Patent Information
- Application Number
- JP2024166460
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2019-05-01
- Filing Date
- 2024-09-25
- Publication Date
- 2024-12-17
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 2024175135000001_ABST
Abstract
To provide a connection structure, a manufacturing method thereof, a connection material, and coated conductive particles capable of lowering and stabilizing a conduction resistance value.SOLUTION: A connection structure includes a first electronic component 1 having a first terminal 1a, a second electronic component 2 having a second terminal 2a, and a cured film in which a connecting material is cured between the first electronic component 1 and the second electronic component 2, and in coated conductive particles 3 between the first terminal 1a and the second terminal 2a, metal atoms of a conductive layer are dispersed in metal of metal fine particles, and the metal of the first terminal and the metal atoms of the second terminal are diffused into the metal of the metal fine particles.SELECTED DRAWING: Figure 1
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Citation Information
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