Vibration device

JP2024179827A5Pending Publication Date: 2026-05-25SEIKO EPSON CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SEIKO EPSON CORP
Filing Date
2023-06-16
Publication Date
2026-05-25

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Abstract

To provide a vibration device having a vibration element with a high Q-value.SOLUTION: A vibration device 1 includes: a base 10; a vibration unit 22; and a vibration element 20 having a thin part 23 thinner than the vibration unit 22 and a supporting unit 24 connected to the vibration unit 22 by the thin part 23, the vibration element being joined to the base 10 by a metal bump 27 in the supporting unit 24. When the thickness of the vibration unit 22 is denoted by t1 and the length from a surface 23s of the thin part 23 to a surface 22s of the vibration unit 22 is denoted by h1, the relation of 0.01≤h1 / t1≤0.156 is satisfied.SELECTED DRAWING: Figure 4
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