Ultrasonic Probe Heat Dissipation

Abstract

The ultrasound imaging device has a housing having an exterior surface and an interior surface. The exterior surface is gripped by a user. The device has an array of acoustic elements that transmit ultrasonic energy and receive ultrasonic echoes. The array is at an end of the housing. The device includes a heat sink within the housing to receive heat generated by the array. The device includes a heat pipe within the housing to transfer heat from the end of the housing. The device includes a heat spreading material on the interior surface of the housing to dissipate heat. A distal portion of the heat pipe is in thermal contact with the heat sink and a proximal portion of the heat pipe is in thermal contact with a heat spreader material. The proximal and distal portions have flat profiles.

Description

[Technical field]

[0001] The present disclosure relates generally to dissipating heat from an ultrasonic probe, for example, a low resistance thermal path (e.g., within the housing of the ultrasonic probe) connecting a heat source with a large area heat spreader that maximizes heat transfer from the heat source. [Background technology]

[0002] Ultrasound imaging systems are widely used for medical imaging and measurements. For example, ultrasound imaging systems may be used to make measurements of organs, lesions, tumors, or other structures within a patient's anatomy. During an ultrasound imaging procedure, a user of the ultrasound imaging system places a probe in contact with the patient's body. An array of elements within the probe emits acoustic energy into the patient and receives reflected waves that are used to construct an image of the patient's anatomy. Many transducer arrays use piezoelectric materials to generate acoustic energy. While generating acoustic energy for transmission to the patient's anatomy, these piezoelectric transducers and materials within the acoustic path also generate heat, increasing the temperature within the probe. Summary of the Invention [Problem to be solved by the invention]

[0003] Although increasing the amplitude of the transmitted acoustic waves generally increases the quality of the ultrasound images acquired by the ultrasound system, increasing this amplitude also increases the heat generated, which can cause discomfort or physical harm to the patient if the temperature of the probe is not controlled.

[0004] Government regulations determine how much temperature rise is permitted within a medical ultrasound transducer. As a result, the power transmitted to the medical ultrasound transducer is often limited by the temperature rise. In addition, dissipation of heat from an ultrasound probe has proven difficult because it is often generated within and / or surrounded by materials that have low thermal conductivity.

[0005] U.S. Patent Application Publication No. 2016 / 0174939 discloses an ultrasonic probe having a heat absorbing backing layer, a heat spreader underneath the backing layer, and a heat pipe extending between the heat spreader and the heat sink to transfer heat to the outside of the ultrasonic probe.

[0006] US Patent Application Publication No. 2021 / 059645 discloses an ultrasound probe having a support structure that uses a thermally conductive material. [Means for solving the problem]

[0007] The invention is defined by the claims.

[0008] An embodiment of the present disclosure is a system, device, and method for efficiently dissipating heat from an ultrasonic transducer with a low resistance thermal path. As heat is generated by the transducer array, it can be absorbed and dissipated by a heat sink located behind the transducer array. The heat sink includes a set of fins that extend from the heat sink toward the transducer array. The characteristic heat sink fins are embedded within a highly attenuative acoustic back material. One end of one or more heat pipes also contacts the heat sink and extends along the length of the ultrasonic probe. Heat may be transferred from the heat sink to these heat pipes via a thermal interface material. At the other end of the heat pipes, the pipes are brought into contact with a heat spreader material that is bonded to the inner surface of the ultrasonic probe housing. Heat may pass from the heat pipes to the heat spreader material via an additional thermal interface material, such as a gap-filling paste. From the heat spreader material, the heat may then be dissipated to the ultrasonic probe housing and the surrounding environment.

[0009] The described low resistance thermal paths advantageously allow the transducer array of an ultrasound probe to emit higher power acoustic energy without exceeding regulatory limits on transducer face temperature, resulting in lower operating temperatures and increased radiant power of the probe. The increased radiant power allows the ultrasound system to generate higher quality ultrasound data, which can improve how useful the ultrasound data is to a physician making diagnostic and / or treatment decisions, and therefore the health of the patient.

[0010] In an exemplary aspect of the present disclosure, an ultrasound imaging device is provided, comprising: a housing having an exterior surface and an interior surface, the exterior surface configured to be gripped by a user; an array of acoustic elements configured to transmit ultrasonic energy and receive ultrasonic echoes associated with the ultrasonic energy, the array of acoustic elements being disposed at an end of the housing; and a heat sink disposed within the housing and configured to receive heat generated by the array of acoustic elements; a heat pipe disposed within the housing and configured to transfer the heat away from an end of the housing, the heat pipe comprising a proximal portion and a distal portion; a heat spreader material disposed on an interior surface of the housing and configured to dissipate the heat; having a distal portion of the heat pipe in thermal contact with the heat sink and a proximal portion of the heat pipe in thermal contact with the heat spreader material; The proximal and distal portions include a flattened profile.

[0011] In one aspect, the heat pipe comprises a bent shape. In one aspect, the heat spreader material comprises pyrolytic graphite. In one aspect, the device further comprises a conductive adhesive configured to adhere the heat spreader material to an inner surface of the housing. In one aspect, the device further comprises electronics in communication with the array of acoustic elements and disposed within the housing, the inner surface of the housing comprising a metallized portion forming a shield for the electronics against at least one of electromagnetic interference or radio frequency interference, the heat spreader material being in electrical communication with the metallized portion via the conductive adhesive, such that the heat spreader material comprises a portion of the shield. In one aspect, the heat sink comprises a body and a plurality of fins extending from the body, the plurality of fins being disposed between the array of acoustic elements and the body. In one aspect, the device further comprises an acoustic backing material disposed on a back surface of the array of acoustic elements, the plurality of fins being embedded within the acoustic backing material. In one aspect, the device further comprises a thermal interface material, the distal portion of the heat pipe is in thermal contact with the body of the heat sink, the thermal interface material being disposed between the distal portion of the heat pipe and the body of the heat sink. In one aspect, the device further includes a mounting bracket, a distal portion of the heat pipe in thermal contact with a body of the heat sink, the distal portion of the heat pipe coupled to the mounting bracket, and the mounting bracket coupled to the body of the heat sink. In one aspect, the body of the heat sink includes a curved portion, and the plurality of fins extend from the curved portion such that the plurality of fins include a curved profile. In one aspect, the heat pipe includes a central portion between a proximal portion and a distal portion, and the planarized profile of the proximal portion and the distal portion includes a larger surface area for thermal contact, and the central portion includes a non-planarized profile having a smaller surface area for thermal contact. In one aspect, the device is in communication with the array of acoustic elements, and further includes electronics disposed within the housing and a spacer disposed between the electronics and the heat pipe, and is configured to bias a proximal portion of the heat pipe closer to an inner surface of the housing than a central portion of the heat pipe. In one aspect, the device further includes a thermal interface material disposed between the proximal portion of the heat pipe and the inner surface of the housing.In one embodiment, the apparatus further includes an additional heat pipe, the housing having a first portion coupled to a second portion, a proximal portion of the heat pipe in thermal contact with an inner surface of the first portion of the housing, and a proximal portion of the additional heat pipe in thermal contact with an inner surface of the second portion of the housing.

[0012] In an exemplary aspect of the present disclosure, an ultrasound imaging device is provided that includes a housing having an exterior surface and an interior surface, the exterior surface configured to be gripped by a user, an array of acoustic elements configured to transmit ultrasonic energy and receive ultrasonic echoes associated with the ultrasonic energy, the array of acoustic elements disposed at an end of the housing, an acoustic backing material disposed on a backside of the array of acoustic elements, and a thermal pathway configured to evacuate heat generated by the array of acoustic elements away from the end of the housing and dissipate the heat across at least one of the interior surface of the housing or the exterior surface of the housing, the thermal pathway comprising a heat sink disposed within the housing. a thermal pathway having a heat sink, the heat sink including a body and fins extending from the body towards the array of acoustic elements, the fins being embedded in an acoustic backing material; a heat pipe with a bent shape that fits within the housing, the heat pipe having a proximal portion and a distal portion; and a heat spreader material disposed on an inner surface of the housing, the proximal portion of the heat pipe in thermal contact with the body of the heat sink and the distal portion of the heat pipe in thermal contact with the heat spreader material, the proximal and distal portions having a flat profile with a larger surface area for thermal contact.

[0013] Further aspects, features, and advantages of the present disclosure will become apparent from the following detailed description.

[0014] Exemplary embodiments of the present disclosure will now be described with reference to the accompanying drawings. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic perspective view of an ultrasound imaging system including a console and an ultrasound probe, according to an aspect of the present disclosure. [Diagram 2] FIG. 1 is a partially transparent perspective view of an ultrasound probe according to an aspect of the present disclosure. [Diagram 3] 1 is a schematic cross-sectional side view of an ultrasonic probe according to an aspect of the present disclosure. [Figure 4] 1 is a schematic cross-sectional front or rear view of a distal portion of an ultrasonic probe according to an aspect of the present disclosure. [Diagram 5] 1 is a schematic cross-sectional front or rear view of an ultrasonic probe according to an aspect of the present disclosure. [Figure 6] FIG. 2 is a schematic perspective view of a portion of an ultrasound probe housing according to an aspect of the present disclosure. [Figure 7] FIG. 1 is a schematic diagram of the thermal paths by which heat dissipates from an ultrasonic probe, according to aspects of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] For the purpose of facilitating understanding of the principles of the present disclosure, reference will now be made to the embodiments shown in the drawings and specific language will be used to describe the principles of the present disclosure. Nevertheless, it will be understood that no limitation to the scope of the present disclosure is intended. Any changes and further modifications to the described apparatus, as well as any further application of the principles of the present disclosure, as would normally occur to one skilled in the art to which the present disclosure pertains, are fully contemplated and included within the present disclosure. In particular, it is fully contemplated that features, components, and / or steps described with respect to one embodiment can be combined with features, components, and / or steps described with respect to other embodiments of the present disclosure. However, for the sake of brevity, multiple iterations of these combinations will not be described separately.

[0017] 1 is a schematic perspective view of an ultrasound imaging system 100 according to an embodiment of the present disclosure. The ultrasound imaging system 100 includes a console 102 and an ultrasound probe 108. The ultrasound imaging system 100 may be used to acquire and display ultrasound images of an anatomical structure. In some circumstances, the system 100 may include additional elements and / or may be implemented without one or more of the elements shown in FIG.

[0018] The ultrasound probe 108 is sized and shaped, structurally arranged, and / or otherwise configured to be placed on or near an anatomical structure of a subject's body to visualize the internal anatomical structure of the subject's body. The subject may be a human patient or an animal. The ultrasound probe 108 may be placed on the subject's body. In some embodiments, the ultrasound probe 108 is placed in close proximity to and / or in contact with the subject's body. For example, the ultrasound probe 108 may be placed directly on and / or adjacent to the subject's body. The view of the anatomical structure shown in the ultrasound image depends on the position and orientation of the ultrasound probe 108. To obtain ultrasound data of the anatomical structure, the ultrasound probe 108 may be appropriately positioned and oriented by a user, such as a physician, sonographer, and / or other medical personnel, such that the transducer array 112 emits ultrasound waves and receives ultrasound echoes from desired portions of the anatomical structure. The ultrasound probe 108 is portable and suitable for use in a medical environment. In some cases, the ultrasound probe 108 may be referred to as an ultrasound imaging device, a diagnostic imaging device, an external imaging device, a transthoracic echocardiography (TTE) probe, and / or combinations thereof.

[0019] The ultrasound probe 108 includes a housing 110 that is structurally arranged, sized, shaped, and / or otherwise configured for hand-holding by a user. The housing 110 may be referred to as a handle in some examples. A proximal portion 107 of the housing 110 may be referred to as a handle in some examples. The housing 110 encloses and protects various components of the imaging device 108, such as electronic circuitry 116 and the transducer array 112. Internal structures, such as a space frame for securing various components, may be disposed within the housing 110. In some embodiments, the housing 110 includes two or more portions that are joined together during manufacturing. The housing 110 may be formed from any suitable material, including plastic, polymer, composite, or combinations thereof.

[0020] The housing 110 and / or the ultrasonic probe 108 include a proximal portion 107 terminating at a proximal end 117 and a distal portion 105 terminating at a distal end 115. In some examples, the ultrasonic probe 108 can be described as having a proximal portion 107 and a distal portion 105. An imaging assembly of the ultrasonic probe 108 including a transducer array 112 is disposed in the distal portion 105. All or a portion of the imaging assembly of the ultrasonic probe 108 can define a distal end 115. The transducer array 112 can be directly or indirectly coupled to the housing 110. An operator of the ultrasonic probe 108 can contact the distal end 115 of the ultrasonic probe 108 against a patient's body such that the anatomical structures are elastically compressed. For example, the imaging assembly including the transducer array 112 can be disposed directly on or adjacent to the subject's body. In some examples, the distal portion 105 is placed in direct contact with the subject's body such that the transducer array 112 is adjacent to the subject's body.

[0021] The ultrasound probe 108 is configured to acquire ultrasound imaging data associated with any suitable anatomical structure of the patient. For example, the ultrasound probe 108 may be used to examine any number of anatomical locations and tissue types, including, but not limited to, organs including the liver, heart, kidneys, gallbladder, pancreas, lungs, ducts, intestines, brain, dural sac, nervous system structures including the spinal cord and peripheral nerves, urinary tract, and blood vessels, blood chambers or other parts of the heart, and / or valves in other systems of the body. The anatomical structure may be a blood vessel, such as an artery or vein, of the patient's vascular system, including the cardiovascular system, peripheral vascular system, neurovascular system, renal blood vessels, and / or any other suitable lumen in the body. In addition to natural structures, the ultrasound probe 108 may be used to examine artificial structures, such as, but not limited to, heart valves, stents, shunts, filters, and other devices.

[0022] The transducer array 112 is configured to emit ultrasonic signals and receive ultrasonic echo signals corresponding to the emitted ultrasonic signals. The echo signals are reflections of the ultrasonic signals from anatomical structures in the subject's body. The ultrasonic echo signals can be processed by electronics 116 in the ultrasonic probe 108 and / or console 102 to generate an ultrasonic image. The transducer array 112 is part of the imaging assembly of the ultrasonic probe 108 and includes an acoustic window / lens and matching material on the transmit side of the transducer array 112 and an acoustic backing material on the back side of the transducer array 112. The acoustic window and matching material have acoustic properties that facilitate the propagation of ultrasonic energy from the transmit side of the transducer array 112 in a desired direction (e.g., outward toward the patient's body). The backing material has acoustic properties that prevent or limit the propagation of ultrasonic energy from the back side of the transducer array 112 in an undesired direction (e.g., inward away from the patient's body).

[0023] The transducer array 112 can include any number of transducer elements. For example, the array can include between 1 and 10,000 acoustic elements, including values ​​such as 2 acoustic elements, 4 acoustic elements, 15 acoustic elements, 64 acoustic elements, 128 acoustic elements, 500 acoustic elements, 812 acoustic elements, 3,000 acoustic elements, 9,000 acoustic elements, and / or other values ​​greater and less. The transducer elements of the transducer array 112 can be arranged in any suitable configuration, such as a linear array, a planar array, a curved array, a curvilinear array, a circumferential array, an annular array, a phased array, a matrix array, a one-dimensional (1D) array, a 1.x-dimensional array (e.g., a 1.5D array), or a two-dimensional (2D) array. The array of transducer elements (e.g., arranged in one or more rows, one or more columns, and / or in one or more orientations) can be controlled and activated uniformly or independently. The transducer array 112 can be configured to acquire one-dimensional, two-dimensional, and / or three-dimensional images of the patient's anatomy. The ultrasound transducer elements can be piezoelectric / piezoresistive elements, piezoelectric micromachined ultrasound transducer (PMUT) elements, capacitive micromachined ultrasound transducer (CMUT) elements, and / or any other suitable type of ultrasound transducer elements.

[0024] The transducer array 112 is in communication with (e.g., electrically coupled to) the electronic circuitry 116. The electronic circuitry 116 may be any suitable passive or active electronic components, including integrated circuits (ICs), for controlling the transducer array 112 to acquire ultrasound image data and / or process the acquired ultrasound image data or one or more printed control boards (PCBs). For example, the electronic circuitry 116 may include one or more transducer control logic dies. The electronic circuitry 116 may include one or more application specific integrated circuits (ASICs). In some embodiments, one or more of the ICs may comprise a microbeamformer (μBF), an acquisition controller, a transceiver, a power circuit, a multiplexer circuit (MUX), etc. In some embodiments, the electronic circuitry 116 may include a processor, a memory, a gyroscope, and / or an accelerometer. The electronic circuitry 116 may include a PCB 270 as shown. Various electrical components 272 may be mounted on the PCB, including, but not limited to, resistors, capacitors, transistors, any of the aforementioned components, or any other electrical components. The electronic circuit 116, including the PCB 270 and electrical components 272, is disposed within the ultrasound probe 108 and is surrounded by the housing 110.

[0025] The ultrasonic probe 108 includes a cable 114 that provides signal communication between the console 102 and one or more components of the ultrasonic probe 108 (e.g., the transducer array 112 and / or the electronic circuitry 116). The cable 114 includes a number of electrical conductors 120 configured to carry electrical signals between the console 102 and the ultrasonic probe 108. The electrical conductors 120 may be bare wires surrounded by one or more layers of insulating material. The insulating material is typically a polymer-based composite, nylon, and / or polyvinyl chloride (PVC) synthetic plastic polymer. In some embodiments, the conductors may be coaxial. The coaxial structure may use a PTFE or expanded PTFE inner dielectric and a PET or PTFE outer dielectric. For example, electrical signals representing imaging data acquired by the transducer array 112 may be transmitted from the ultrasonic probe 108 to the console 102 via the electrical conductors 120. Control signals and / or power may be transmitted from the console 102 to the ultrasonic probe 108 via the electrical conductors 120. Cable 114 and / or electrical conductors 120 may provide any type of wired connection, such as any version of a proprietary connection, an Ethernet connection, a Universal Serial Bus (USB) connection, or any version of mini-USB.

[0026] The cable 114 may also include a conduit 118 that surrounds the conductors 120. The conduit 118 is formed as a tube and is used to protect and route the conductors 120 within the cable 114 of the ultrasound imaging device 108. The conduit 118 may be flexible and may be made from polymers, plastics, metals, fabrics, other suitable materials, and / or combinations thereof. The conduit 118 protects the conductors 120 by preventing direct exposure to outside elements. A distal portion 109 of the cable 114 is coupled to a proximal portion 107 of the housing 110 of the ultrasound probe 108.

[0027] The connector 124 is located at the proximal portion 113 of the cable 114. The connector 124 is configured to removably couple to the console 102. Signal communication between the ultrasound probe 108 and the console 102 is established when the connector 124 is received within the receptacle 103 of the console 102. In this regard, the ultrasound probe 108 may be electrically and / or mechanically coupled to the console 102. The console 102 may be referred to as a computer or computing device in some examples. The console 102 includes a user interface 104 and a display 106. The console 102 is configured to process ultrasound imaging data acquired by the ultrasound probe 108 to generate ultrasound images and output them to the display 106. A user may control various aspects of the acquisition of ultrasound imaging data by the ultrasound probe 108 and / or the display of ultrasound images by providing input at the user interface 104. The imaging device 108 and the display 106 may be communicatively coupled directly or indirectly to the console 102.

[0028] One or more image processing steps may be completed by the console 102 and / or the ultrasound probe 108. The console 102 and / or the ultrasound probe 108 may include one or more processors in communication with a memory. The processor may be an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a central processing unit (CPU), a digital signal processor (DSP), another hardware device, a firmware device, or any combination thereof configured to perform the operations described herein. In some embodiments, the memory is a random access memory (RAM). In other embodiments, the memory is a cache memory (e.g., a processor cache memory), a magnetoresistive RAM (MRAM), a read only memory (ROM), a field programmable gate array read only memory (PROM), an erasable field programmable gate array read only memory (EPROM), an electrically erasable field programmable gate array read only memory (EEPROM), a flash memory, a solid state memory device, a hard disk drive, other forms of volatile and non-volatile memory, or a combination of different types of memory. In some embodiments, the memory may include a non-transitory computer readable medium. The memory may store instructions, which may include instructions that, when executed by the processor, cause the processor to perform operations described herein.

[0029] 1, it is understood that the console 102 may be a mobile device (e.g., a smart phone, tablet, laptop, or personal digital assistant (PDA)) having an integrated processor, memory, and display. For example, a touch screen on a mobile device may be the user interface 104 and the display 106.

[0030] Figure 2 is a partially transparent perspective view of an ultrasonic probe 108 according to an aspect of the present disclosure. Figure 2 illustrates an exemplary embodiment of the transducer array 112, probe housing 110, and electronic circuitry 116 previously described with reference to Figure 1. Additionally, Figure 2 illustrates an acoustic backing material 210, a heat sink 220, a heat pipe 230, and a spacer 240.

[0031] As shown in FIG. 2, the transducer array 112 may be disposed in a distal portion 250 of the probe housing 110 near a distal end 255, which may be of any suitable type as described with reference to FIG. 1. The housing 110 also includes a proximal region 260 and a proximal end 265, as shown. The acoustic backing material 210 may be disposed proximal to the transducer array 112 and distal to the heat sink 220. One purpose of the acoustic backing material is to absorb acoustic energy generated by the transducer array 112 that may propagate in a proximal direction from the transducer array 112. Further features of the acoustic backing material 210 are described in more detail with reference to FIG. 3 below.

[0032] The probe housing 110 may include multiple portions. For example, as shown in Figure 2, the housing 110 may include two portions: a housing portion 110a, shown in Figure 2 as a partially transparent component, and a housing portion 110b, shown in Figure 2 as a solid component and disposed opposite portion 110a.

[0033] The heat sink 220 may be located proximate to the acoustic backing material 210. The heat sink 220 may be located within the housing 110 such that it is located near the transducer array 112. The purpose of the heat sink 220 is to absorb heat generated by the transducer array 112 and / or the backing material 210 and dissipate the heat to other portions of the probe 108, as discussed in more detail below. In some embodiments, the transducer array 112 may be constructed from piezoelectric crystals to generate acoustic energy. These piezoelectric crystals may also generate heat that may be transferred to the patient's body beyond regulatory limits for the allowable temperature of an ultrasound probe. The transducer array 112 may be a heat source within the probe 108. In many applications, the transducer array 112 itself may not be constructed of a thermally conductive material. In addition, other components within the probe, such as an acoustic lens or other materials for the transducer array 112, may be constructed of materials that are not thermally conductive (e.g., polymers or ceramics). Thus, the heat sink 220 may be constructed of a thermally conductive material to more efficiently dissipate heat from the transducer array 112 before the probe temperature reaches unacceptable levels.

[0034] In general, the heat pipe 230 transfers heat from a heat source, such as the transducer array 112 and / or the acoustic backing material 210, at the distal portion 250 and / or distal end 255 of the probe housing 110. The heat pipe 230 shown in FIG. 2 may include a distal portion 232 and a proximal portion 234. The heat pipe 230 may also be referred to as a heat pipe. The distal portion 232 of the heat pipe 230 is mechanically and thermally coupled to the heat sink 220. The proximal portion 234 of the heat pipe 230 is mechanically and thermally coupled to a heat spreader material within the housing 110, as described in more detail below. The purpose of the heat pipe 230 is to efficiently transfer heat from the heat sink 220 to the heat spreader material. As shown, the heat pipe 230 may be formed into a bent shape to make room for or avoid other components within the housing 110, such as the circuit 116, the PCB 270, or the electrical components 272. In some embodiments, the heat pipe 230 may be shaped to bend around one or more fastener structures, such as the screw receiver 280 or other methods, parts, or components within the housing 110 .

[0035] A spacer 240 may be disposed within the housing 110 near the proximal portion 234 of the heat pipe 230 and may urge the proximal portion 234 of the heat pipe 230 into contact with a heat spreader material that may be disposed on an inner surface of the housing 110. Further aspects of the spacer 240 and the heat spreader material are described in more detail below.

[0036] It is noted that the probe 108 may include any suitable number of heat pipes 230 in addition to the heat pipes 230 shown in FIG. 2. For example, one additional heat pipe 230 may be disposed within the probe 108 of a shape similar to the illustrated heat pipe 230. This additional heat pipe 230 may be disposed on the opposite side of the illustrated electronic circuit 116, as described in more detail with reference to FIG. 3. It will be apparent that in additional embodiments, the additional heat pipes 230 may be disposed in contact with both the heat sink 220 and the heat spreader material by modifying various shapes, arrangements, and / or configurations of the various components within the housing 108. Any heat pipes 230 shown or described may be of any suitable shape.

[0037] FIG. 3 is a schematic cross-sectional side view of an ultrasonic probe 108 according to an embodiment of the present disclosure. The view of the ultrasonic probe 108 in FIG. 3 is along a plane defined by the x-axis and the z-axis. FIG. 3 shows an acoustic backing material 210 and a heat sink 220 including a heat sink body 222 and heat sink fins 226. FIG. 3 further shows the transducer array 112, an acoustic lens 310, a heat pipe 230 extending within the interior of the probe housing 110, a spacer 240, a mounting bracket 320, and a machine screw 322. A coordinate system indicator 390 is also shown. The indicator 390 indicates the x-axis and the z-axis.

[0038] The acoustic backing material 210 may be disposed behind the transducer array 112 of the acoustic element. The acoustic backing material 210 may further be referred to as an absorbent material, an acoustic insulating material, or any other suitable term. The backing material 210 may be selected to absorb acoustic energy generated by the transducer array 112. In this manner, the backing material 210 may prevent acoustic energy from propagating in a proximal direction of the transducer array 112 and / or from being received by the transducer array 112 from a proximal direction, resulting in more accurate ultrasound data. The acoustic backing material may be comprised of any suitable material, including but not limited to an epoxy or thermoplastic resin, with or without fillers to enhance dissipation of ultrasonic energy. Because the acoustic backing material 210 is disposed directly adjacent to the transducer array 112 in some embodiments, the material 210 may conform to a similar shape to the transducer array 112, but may be any suitable shape or size. In some embodiments, heat may also be generated by the interaction between the acoustic waves and the acoustic backing material 210 such that the acoustic backing material 210 may be a source of heat within the probe 108 .

[0039] The backing material 210 is disposed distal to the heat sink 220 as shown. The heat sink 220 may further be referred to as a heat dissipator. The heat sink 220 may also be of any suitable shape or size. The heat sink 220 may be constructed from a thermally conductive material and may be a non-metal, metal, or metal alloy, such as silver, copper, gold, aluminum nitride, silicon carbide, aluminum, tungsten, graphite, zinc, other suitable materials, and / or combinations thereof. Given the high thermal conductivity of the heat sink 220, the heat sink can efficiently transfer heat from the transducer array 112 to the heat pipes 230.

[0040] In some embodiments, the heat sink 220 can include a body 222 and a number of fins 226. The heat sink body 222 has a proximal region 228 and a distal region 224. The fins 226 can extend from the distal region 224 of the body 222. The heat sink 220 can include any suitable number of fins 226. The fins 226 can also be of any suitable shape, pattern, length, or extend from the body 222 according to any suitable path. In some embodiments, the fins 226 can extend distally from the heat sink body 222 toward the transducer array 112. For example, the fins 226 can be disposed between the transducer array 112 and the heat sink body 222. The set of fins 226 of the heat sink 220 can be embedded within an acoustic backing material 210, as shown in FIG. 2. The acoustic backing material 210 can surround each of the fins 226 such that all outer points of the fins 226 are in contact with the acoustic backing material. In some embodiments, the acoustic backing material 210 may be a resin that is cast onto the fins 226 .

[0041] Since the effectiveness of the heat sink 220 depends on both the distance between the heat sink fins 226 and the transducer array and the length of the heat sink fins 226 themselves, the acoustic backing material 210 may be selected from a highly attenuative material. For example, the attenuation of the acoustic backing material 210 may be at least 15 dB / mm or greater. By using a highly attenuative material for the acoustic backing material 210, less material 210 is needed to adequately attenuate unwanted acoustic energy, and a thinner layer of material 210 between the transducer array 112 and the heat sink body may be used. A thinner layer of backing material 210 allows for shorter, and therefore more effective, heat sink fins 226. These shorter fins 226 reduce the thermal resistance between the heat source (e.g., the transducer array 112) and the body 222 of the heat sink 220. The fins 226 of the heat sink 220 may be spaced a distance from the transducer array 112. The fins 226 may be positioned very close to the transducer array 112 to optimize heat dissipation from the transducer array 112. For example, the distal ends of the fins 226 may be positioned within 1 mm or less of the transducer array 112.

[0042] 4, the body 222 of the heat sink 220 may include a curved top 224. The distal end of this curved top 224 may have substantially the same curvature as the transducer array 112 and acoustic lens 310 of the probe 108. FIG. 4 also shows fins 226 extending distally from the curved top 224 within the backing material 210.

[0043] FIG. 3 further illustrates the heat pipes 230. The heat pipes 230 may be configured to evacuate heat from the device 108. A cross section of a distal portion 232 of each heat pipe 230 is shown adjacent to a proximal region 228 of the heat sink body 222 and may be in physical and / or thermal contact with the heat sink 220. A thermal interface material 312 may be disposed between the distal portion 232 of the heat pipe 230 and the proximal region 228 of the heat sink 220. Similar to the heat sink 220, the heat pipes 230 may be constructed of a thermally conductive material. For example, the heat pipes 230 may be constructed of aluminum or copper with water or ammonia as the working fluid. Additionally, the heat pipes 230 may include various components and / or structures. For example, in some embodiments, the heat pipes 230 may each include an envelope that forms the exterior of the heat pipe 230 and is constructed of a highly thermally conductive material. The envelope may encapsulate the wick structure and the working fluid. A wick structure may be attached to the inner wall of the envelope to absorb and distribute the working fluid along the heat pipe. The wick may be constructed of any suitable material and may be a porous metal structure including, but not limited to, copper, aluminum, or other materials. The working fluid in the heat pipe 230 may be distilled water. In other embodiments, the working fluid may alternatively be ammonia, nitrogen, acetone, methanol, methylamine, pentane, propylene, or any other suitable working fluid.

[0044] The heat pipe 230 may be shaped such that the distal region 232 of the heat pipe 230 is physically and / or thermally coupled to the proximal portion 228 of the heat sink 220, as shown in FIG. 3. Additional features and aspects of the shape and positioning of the heat pipe 230 are described in more detail with reference to FIGS. 4 and 5. However, as shown in FIG. 3, the distal portion 232 of the heat pipe 230 may be in physical contact with the proximal portion 228 of the heat sink 220 by a mounting bracket 320. The mounting bracket 320 may be shaped to allow space for the heat pipe 230 to extend proximate to the heat sink body 222. Thus, the heat pipe 230 may be brought into contact with the heat sink 220, and then the mounting bracket 320 may be placed over the heat pipe and secured to the heat sink 220 via one or more machine screws 322. The heat sink 220 may include one or more threaded holes into which one or more machine screws 322 may be received to place the mounting bracket 320 in firm contact with the heat pipes 230 and / or heat sink 220 and secure or couple the heat pipes 230 to the heat sink 220. The mounting bracket 320 may be constructed of the same material as the heat sink 220 and / or heat pipes 230, or may be constructed of a different material.

[0045] In some embodiments, the heat pipe 230 may additionally or alternatively be coupled to the heat sink 220 via soldering or thermally conductive epoxy. In some embodiments, the bracket 320 may be omitted. The heat pipe 230 may be mechanically and thermally coupled to the heat sink 220 and / or the bracket 320. In such embodiments, the soldering or thermally conductive epoxy may completely surround the outer surface of the distal portion 232 of the heat pipe 230 or may contact only a portion of the heat pipe 230. In some embodiments, a thermal interface material may also be disposed between the heat pipe 230 and the heat sink 220, as described in more detail with reference to FIG. 4.

[0046] At their proximal portions 234, the heat pipes 230 may be pushed outward or away from the centerline or central longitudinal axis of the probe 108 by spacers 240, shown in FIG. 3. For example, in some embodiments, the proximal regions 234 of the heat pipes 230 may be gradually angled outward toward the housing 110 as the heat pipes 230 extend away from the heat sink 220. The spacers 240 may place the proximal portions 234 of the heat pipes 230 in physical and / or thermal contact with the inner surface of the housing 110 and / or the heat spreader material on the inner surface of the housing 110. The spacers 240 may include an inner surface 242 disposed to face the centerline of the probe 108 and an outer surface 244 facing the exterior of the probe 108. The spacers 240 may be positioned such that the heat pipes 230 are positioned away from the PCB 270 and the electronic components 272 as shown. In this manner, the inner surface 242 of the spacer 240 may be in physical contact with the PCB 270 and the electronic components 272 mounted to the PCB 270. The outer surface 244 of the spacer 240 may be in physical contact with the heat pipes 230. In this manner, the spacer 240 separates the heat pipes 230 from the PCB 270 and the electronic components 272.

[0047] FIG. 4 is a schematic cross-sectional front or rear view of an ultrasonic probe 108 according to an embodiment of the present disclosure. FIG. 4 is described in conjunction with FIG. 5, which is a schematic cross-sectional front or rear view of an ultrasonic probe 108 according to an embodiment of the present disclosure. The views of the ultrasonic probe 108 in FIG. 4 and FIG. 5 are along a plane defined by the x-axis and y-axis. FIG. 4 shows a distal region 250 of the probe 108, showing, among other components, an acoustic lens 310, a transducer array 112, an acoustic backing material 210, a heat sink 220, a thermal interface material 312, a heat pipe 230 having several different regions, a screw receiver 280, a mounting bracket 320, a machine screw 322, a circuit 116 including a PCB 270 and an electronic component 272, and a housing 110.

[0048] As shown in FIG. 4, the body 222 of the heat sink 220 has a proximal region 228 and a distal or curved region 224. The fins 226 may extend from the distal region 224 of the curved region 224 into the acoustic backing material 210 and may form a curved profile as indicated by the curved dashed line in FIG. 4. In other embodiments, the transducer array 112 may not form a curved profile. For example, as discussed with reference to FIG. 1, the transducer array 112 may be linear or planar. In such embodiments, the heat sink 220 and heat sink fins 226 may not be curved, but may be located near the transducer array 112 and may have a linear or planar profile.

[0049] The thermal interface material 312 may be disposed between the proximal portion 228 of the heat sink 220 and the distal outer surface of the heat pipe 230 as shown. This thermal interface material 312 may also be referred to as a film. The material 312 may be a silicon-based material or any other suitable material. In some embodiments, the thermal interface material may include commercially available materials such as 3M Tape 8810, Berquist HF300P-0.004-00-10.5 / 250, or other materials. In some embodiments, the material 312 may be a cured-in-place material. The material 312 may be a die-cut graphite sheet. The material 312 may be flexible and may ensure that the heat sink 220 and the heat pipe 230 are brought into good thermal contact. The material 312 may also minimize air gaps between the surface of the heat sink 220 and the heat pipe 230. With respect to the heat sink 220, the thermal interface material 312 may be disposed on the opposite side of the heat sink 220 as the fins 226 of the heat sink 220.

[0050] As shown in FIG. 4, the heat pipe 230 may include regions 432, 434, 436, and 438. The distal portion 232 of the heat pipe 230 between regions 432 and 434 may extend along the surface of the heat sink 220. Along this distal portion 232, the heat pipe 230 may be flattened in profile to maximize the surface area of ​​the heat pipe 230 in contact with the heat sink 220 and / or the thermal interface material 312 to optimize heat transfer at this transition point. As shown in FIG. 3, the cross-sectional shape of the heat pipe 230 along this portion between regions 432 and 434 may be elliptical with flat top and bottom surfaces. In other embodiments, the cross-sectional shape may be different.

[0051] In region 434, heat pipe 230 may curve away from heat sink 220. Heat pipe 230 may then curve around other components, such as circuit 116, or other structures or components within probe 108. Along this curve or central portion 233 between region 434 and region 436, heat pipe 230 may not be flattened. The cross-sectional shape of heat pipe 230 may be substantially circular from region 434 to region 436. Also, the cross-sectional shape may be different. Because the cross-sectional shape of heat pipe 230 is circular in central region 233, the surface area of ​​central portion 233 is smaller than the surface area of ​​heat pipe 230 in either distal region 232 or proximal region 234.

[0052] 5 along the proximal portion 234 of the heat pipe from region 436 to region 438 to region 532 shown in FIG. 5 may have a similar flattened profile as the distal region 232 extending from region 432 to region 434. For example, the cross-sectional shape of the heat pipe 230 from region 436 to region 532 (FIG. 5) may be a similar shape to the cross-sectional shape from region 432 to region 434, such as an oval with flat top and bottom surfaces, or any other suitable shape. This flattening from region 436 to region 532 (FIG. 5) may maximize the surface area of ​​the heat pipe 230 that is brought into contact with the heat spreader material and / or the inner wall of the housing 110 to optimize heat transfer at this junction.

[0053] The probe housing 110 may include an inner surface 610 and an outer surface 620, as shown in Figures 5 and 6. The heat spreader material 550 shown in Figure 5 may be bonded to the inner surface 610 of the housing 110. Figure 5 also includes a coordinate system indicator 490, again indicating the x-axis and the y-axis. In some embodiments, the housing 110 may include two structures (e.g., two halves), portion 110a and portion 110b, joined together as described with reference to Figure 2, similar to the housing portion 110b shown in Figure 6. The housing 110 may fully or partially encapsulate one or more of the components discussed herein. The heat spreader material 550 may be bonded to the inner surface of each housing portion that together form the housing 110. In this manner, one of the heat pipes 230 shown in FIG. 3 may be in physical and / or thermal contact with one heat spreader material 550 of one housing structure, and the other heat pipe 230 of FIG. 3 may be in physical and / or thermal contact with the other heat spreader material 550 of the other housing structure.

[0054] The heat spreader material 550 may be configured to efficiently dissipate heat. The element 550 may be constructed of a thermally conductive material, such as a pyrolytic graphite sheet. The element 550 may also be constructed of any other suitable material, such as copper, aluminum, including, for example, aluminum 1100, or other materials with high thermal conductivity, other suitable planar thermally conductive materials, and / or combinations thereof. The heat spreader material 550 may also be referred to as a heat spreader, a heat sink, a heat spreader material, or any other suitable term. The heat spreader material 550 may be laminated to an inner surface of the housing 110. For example, an adhesive may be disposed on one side of the heat spreader material 550 that is disposed in contact with the inner surface 610 of the housing portions 110a and / or 110b. The element 550 may be any suitable size or shape. The element 550 may follow the inner contour of the housing 110. Element 550 may be configured to be as large as possible or to contact the largest surface area of ​​the interior surface of housing 110 as possible to optimize heat transfer from element 550 to housing 110 and then to the external environment.

[0055] The thermal interface material 520 may be disposed between the proximal region 234 of the heat pipe 230 and the heat spreader material 550 with which the pipe 230 is in physical and / or thermal contact. In some embodiments, this thermal interface material 520 is thermally conductive and facilitates heat transfer between the heat pipe 230 and the heat spreader material 500, similar to the way that the thermal interface material 312 described with reference to FIG. 4 facilitates heat transfer between the distal portion 232 of the heat pipe 230 and the proximal portion 228 of the heat sink 220. In some embodiments, the thermal interface material 520 may be substantially similar to the thermal interface material 312. In other embodiments, the thermal interface material 520 may be different from the thermal interface material 312. The thermal interface material 520 and / or 312 may be referred to as a gap fill paste, a thermal interface paste, a gap fill material, a fill material, an interface material, or any other suitable term.

[0056] In some embodiments, the thermal interface material 520 can be a gap-filling paste applied between the proximal portion 234 of the heat pipe 230 (e.g., region 438 to region 532 of the pipe 230) and the heat spreader material 550. The thermal interface material 520 can be thermally conductive. In some embodiments, the material 520 can have adhesive properties to secure the proximal portion 234 of the heat pipe 230 to the heat spreader material 550. In some embodiments, after the spacer 240 is placed adjacent to the heat pipe 230 during assembly and before the housing structures 110a and 110b are seated together to enclose the internal components, the spacer 240 can bias the proximal region 234 of the heat pipe 230 outwardly so that it protrudes outwardly along the z-axis further than the housing 110 allows. As a result, the act of seating the two structures 110a and 110b of the housing 110 on the assembly pushes the proximal region 234 of the heat pipe inward along the z-axis, compressing the spacer 240 and thus applying pressure to the heat pipe 230 to form a secure contact with the heat spreader 550. As the spacer 240 brings the proximal region 234 of the heat pipe 230 into closer contact with the heat spreader material 550, the thermal interface paste 520 flows and displaces, resulting in a larger area where the proximal region 234 of the heat pipe 230 can come into contact with the pyrolyzed heat spreader 550. One purpose of the thermal interface material 520 may be to fill any voids between the heat pipe 230 and the spreader 550 to maximize heat transfer. Any suitable amount of thermal interface material 520 may be placed between the pipe 230 and the spreader 550. In some embodiments, approximately 3 to 4 mm of thermal interface material is disposed between the proximal portion 234 of the pipe 230 and the heat spreader 550 .

[0057] FIG. 5 further illustrates the spacer 240 mentioned above. As shown in FIG. 3, one spacer 240 may be disposed inside the proximal portion 234 of each of the heat pipes 230. In this manner, a single heat pipe may be disposed between one spacer 240 and one heat spreader 550. In some embodiments, the spacer 240 may include two separate structures. The thickness of the spacer 240 may be minimum at the distal region 242 of the spacer 240 and may increase in thickness extending in the proximal direction such that the spacer is maximum thickness at the proximal region 244 of the spacer 240. In this manner, the spacer 240 may form a wedge-shaped structure. In either configuration, the spacer 240 may bias the proximal portion 234 of the heat pipe 230 closer to the inner surface of the housing 110 than the central portion 233 of the heat pipe 230. The central portion 233 may also be referred to as the curved portion.

[0058] FIG. 6 is a schematic perspective view of a portion of an ultrasonic probe housing 110 according to an embodiment of the present disclosure. FIG. 6 shows one structure that may be included in the housing 110 of the probe 108 or may be half of a structure forming the housing 110. Shown adhered to the inner surface of the housing 110 is a heat spreader material 550. As previously mentioned, the heat spreader material 550 may be laminated to the inner surface of the housing 110 or adhered by any other suitable means. The spreader 550 may be configured to maximize the contact surface area between the spreader 550 and the inner surface of the housing 110, and therefore may extend as far along the inner surface of the housing 110 as possible. The outer surface of the housing 110 shown may be configured to be gripped by a user of the ultrasonic system 100.

[0059] The heat spreader film 550 may be die cut from bulk pyrolytic graphite sheet (PGS) with an integral pressure sensitive adhesive (PSA) on one side and a protective PET film laminated to the other side. The shape and relief cuts of the heat spreader 550 may be configured to maximize surface area contact with the inner surface of the transducer housing 110. One heat spreader 550 may be applied to the inner surface of both the left and right housing halves 110 to eliminate or minimize wrinkles while maximizing the wetted area to the housing 110.

[0060] To supplement the EMI RFI shielding of the transducer probe 108, the PGS sheet of the heat spreader 550 may be connected to an electrical shield potential by metallizing the inner surface of the transducer housing using conductive paint or metal plating and utilizing a conductive PSA adhesive on the PGS film. The housing 110 may form an electrical and / or magnetic shield for the electronics 116 in the probe 108. This shield may include various conductive components disposed along the inner or outer surface of the housing 110. This shield may prevent various electromagnetic or high frequency signals from altering the performance of various components in the probe 108. In some embodiments, the PGS sheet of the heat spreader 550 may be integrated into or may be a component of this shield. In some embodiments, the heat spreader may be a die-formed metal foil.

[0061] In some embodiments, the heat spreader material 550 may be attached to the inner surface of the housing 110 utilizing a conductive PSA adhesive that allows the PGS to be part of the EMI RFI shielding circuit. In other embodiments, the heat spreader material 550 may not be attached with a conductive PSA adhesive. Rather, a thin, soft, non-conductive adhesive may be used. The thin non-conductive adhesive may still allow electrical contact between the PGS sheet and the conductive coating and / or plating on the inner surface of the housing (part of the EMI RFI shielding circuit) when the PGS film is sufficiently wetted to the housing. The inner surface of the housing 110 may further include a metallized portion that forms a shield for the electronics 116 in the probe 108 against electromagnetic and / or radio frequency interference. The heat spreader 550 may be in electrical communication with this metallized portion of the housing 110. This may be done with a conductive adhesive or by any other suitable means. When the heat spreader 550 is adhered to the housing 110, the heat spreader 550 may form part of the electromagnetic shield. In some embodiments, the heat spreader material 550 may be a single sheet of material, or may be multiple sheets of material, several of which may fully or partially overlap to form the heat spreader material 550.

[0062] 7 is a schematic diagram of a thermal path 700 by which heat may dissipate from an ultrasonic probe 108, according to an embodiment of the present disclosure. It is noted that any of the components or steps along the thermal path 700 described may be varied and / or combined with other steps.

[0063] Heat may be generated by the transducer array 112, the matching layer, the acoustic lens 310, the acoustic backing material 210, or various other components within the probe 108. The heat generated by the transducer array 112 may be partially absorbed by the acoustic backing material 210, which is disposed directly behind the transducer array 112. The heat generated by the transducer array may then be transferred to the fins 226 of the heat sink 220. The heat may then pass through the heat sink 220 and through the thermal interface material 312 to the heat pipes 230, which are in physical and / or thermal contact with the heat sink 220. The heat may then pass through the heat pipes to the heat spreader material 550. The heat may pass through the thermal interface material 520. The heat may also, or alternatively, pass through a layer of thermal interface material, as previously described with reference to FIG. 5. The heat may then be transferred from the heat spreader material 550 to the interior and / or exterior surfaces of the probe housing 110 and from there to the surrounding environment. In this manner, heat is dissipated from the distal surface of the ultrasonic probe 108, often keeping the temperature of surfaces that may be in physical contact with the patient's skin within any regulatory temperature limits.

[0064] Those skilled in the art will recognize that the above-described devices, systems, and methods can be modified in various ways. Thus, those skilled in the art will appreciate that the embodiments encompassed by the present disclosure are not limited to the specific exemplary embodiments described above. In that regard, while exemplary embodiments have been shown and described, a wide range of modifications, changes, and substitutions are contemplated in the foregoing disclosure. It is understood that such variations can be made to the foregoing without departing from the scope of the claims.

Claims

1. 1. An ultrasound imaging device, comprising: a housing having an exterior surface and an interior surface, the exterior surface configured to be gripped by a user; an array of acoustic elements configured to transmit ultrasonic energy and receive ultrasonic echoes associated with the ultrasonic energy, the array of acoustic elements being disposed at an end of the housing; and a heat sink disposed within the housing and configured to receive heat generated by the array of acoustic elements; a heat pipe disposed within the housing and configured to transfer the heat away from an end of the housing, the heat pipe comprising a proximal portion and a distal portion; a heat spreader material disposed on an interior surface of the housing and configured to dissipate the heat; having a distal portion of the heat pipe in thermal contact with the heat sink and a proximal portion of the heat pipe in thermal contact with the heat spreader material; the heat pipe comprises a central portion between the proximal portion and the distal portion, the proximal portion and the distal portion having a planarized cross-sectional profile with a larger surface area for thermal contact, and the central portion having a non-planarized cross-sectional profile with a smaller surface area for thermal contact. Ultrasound imaging device.

2. The apparatus of claim 1 , wherein the heat pipe has a bent shape.

3. 3. The apparatus of claim 1 or 2, wherein the heat spreader material comprises pyrolytic graphite.

4. 4. The apparatus of claim 1, further comprising a conductive adhesive configured to adhere the heat spreader material to an inner surface of the housing.

5. and electronics disposed within the housing in communication with the array of acoustic elements. an inner surface of the housing comprising a metallized portion forming a shield for the electronic device against at least one of electromagnetic interference or radio frequency interference; the heat spreader material is in electrical communication with the metallization via the conductive adhesive such that the heat spreader material comprises a portion of the shield; 5. Apparatus according to any one of claims 1 to 4.

6. 6. The apparatus of claim 1 , wherein the heat sink comprises a body and a number of fins extending from the body, the number of fins being positioned between the array of acoustic elements and the body.

7. 7. The apparatus of claim 6, further comprising an acoustic backing material disposed on a back surface of the array of acoustic elements, the plurality of fins being embedded within the acoustic backing material.

8. Further comprising a thermal interface material; a distal portion of the heat pipe in thermal contact with a body of the heat sink; the thermal interface material is disposed between a distal portion of the heat pipe and a body of the heat sink; 8. Apparatus according to claim 6 or 7.

9. Further comprising a mounting bracket; a distal portion of the heat pipe in thermal contact with a body of the heat sink; a distal portion of the heat pipe is coupled to the mounting bracket; the mounting bracket is coupled to the body of the heat sink; 9. Apparatus according to any one of claims 6 to 8.

10. the body of the heat sink comprises a curved portion; the plurality of fins extend from the curved portion such that the plurality of fins have a curved profile.

10. Apparatus according to any one of claims 6 to 9.

11. electronics disposed within the housing in communication with the array of acoustic elements; a spacer disposed between the electronic device and the heat pipe and configured to bias a proximal portion of the heat pipe closer to an inner surface of the housing than a central portion of the heat pipe; 11. The apparatus of claim 1 , further comprising:

12. 12. The apparatus of claim 1, further comprising a thermal interface material disposed between a proximal portion of the heat pipe and an inner surface of the housing.

13. Further comprising a further heat pipe; the housing comprises a first portion coupled to a second portion; a proximal portion of the heat pipe in thermal contact with an inner surface of the first portion of the housing; a proximal portion of the further heat pipe in thermal contact with an inner surface of a second portion of the housing; 13. Apparatus according to any one of the preceding claims.

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