Flame-resistant partially aromatic polyamide

Abstract

JPEG2024532603000005.jpg56156 The present invention relates to an essentially flame-retardant partially aromatic polyamide comprising polyamide units AB / AC / AE / DB / DC / DE / F, characterized in that in addition to the polyamide unit AC at least one further polyamide unit is selected from the group consisting of the polyamide units AB, AE, DB, DC, DE and F, and the monomer units A, B, C, D, E and F are derived from the following molecules present in the polyamide X in amide-linked form: A: aliphatic diamines; B: aromatic phosphorus-free dicarboxylic acids; C: phosphorus-containing aromatic dicarboxylic acids according to formulae (1), (2) and / or (3); D: diamines with aromatic structural units; E: aliphatic dicarboxylic acids; F: aminocarboxylic acids, lactams. The present invention also relates to flame-resistant molding compounds based on the flame-retardant polyamides and to molded articles formed from the polyamides or polyamide molding compounds according to the invention.

Description

[Technical field]

[0001] The present invention relates to essentially flame-resistant partially aromatic polyamides based on aliphatic diamines, partially phosphorus-containing aromatic dicarboxylic acids, and optionally other polyamide-forming components. The present invention also relates to flame-retardant molding compounds based on essentially flame-resistant partially aromatic polyamides. The polyamides and the molding compounds produced therewith have good flame retardancy and exhibit good mechanical properties. These molding compounds are particularly suitable for the production of thin-walled molded parts for the electrical and electronics industry, such as housings, housing components or connectors. Furthermore, the present invention relates to the use of the polyamides and polyamide molding compounds according to the invention for the production of molded parts, in particular components for the electrical and electronics industry and the automotive industry. [Background technology]

[0002] Some applications have high demands on plastics as far as their flame retardancy is concerned, which is absolutely essential for their use in electrical or electronic devices, in particular because of the risk of short circuits.

[0003] In addition to plastics that are flame retardant per se (= inherently flame resistant) and plastics coated with flame retardants, plastics that contain reactive flame retardants, i.e. the flame retardant is a component of the plastic and chemically bonds to it during polymerization, are also used. The incorporation of flame retardant additives is another variant of flame retardant plastic interlocking. Common additives are nitrogen-based compounds such as melamine and urea, brominated polystyrene and organophosphorus compounds.

[0004] Another essential requirement for plastics is good mechanical properties, which can be further improved, among other things, by fiber reinforcement. The latest technological advances in the field of polyamides show several examples of glass-fiber-reinforced flame-retardant molding compounds. Achieving the flame-resistant class UL 94 V0 is a particular challenge for glass-fiber-reinforced polyamide molding compounds.

[0005] It is also important that the flame retardant polyamides and polyamide molding compounds are easily processable, for example in injection molding machines, melt spinning and extrusion systems, and in particular that the flame retardant does not cause corrosion problems for system components.

[0006] EP 1 613 698 A1 refers to halogen-free, flame-retardant molding compounds based on partially aromatic, partially crystalline polyamides containing salts of phosphinic acids as flame retardants. These molding compounds are suitable for the production of thin-walled molded parts for the electrical and electronics industry due to their dimensional stability at high temperatures and good fire behavior. However, the particulate flame retardants used lead to a decrease in the mechanical properties, especially with regard to stress at break, elongation at break, impact and notched impact properties, a deterioration in the surface quality, and corrosion of the system components used in production and processing.

[0007] Chinese Patent No. 101 735 455 A describes a method for preparing aromatic polyoxadiazoles from terephthalic acid, hydrazine, and modified isophthalic acid in a solvent, and flame-resistant, high-temperature resistant fibers wet-spun therefrom. The modified isophthalic acid has chlorine, bromine or diphenylphosphine oxide or diphenylphosphine sulfide substituents.

[0008] U.S. Patent No. 4,837,394 relates to electrostatic toner particles based on polyester resins as monomers and containing, inter alia, dimethyl isophthalic acid esters with phosphonium substituents. The quaternary phosphonium groups act as charge carriers in the toner particles. Since the charge carriers are uniformly distributed, 10 -9 ~10 -4 A very low content of quaternary phosphonium groups, in the mol / g range, is sufficient to realize the electrostatographic imaging process, however, it does not provide sufficient flame retardancy.

[0009] No. 3,108,991 discloses linear polyamides based on bis(aminoalkyl)alkylphosphines and aliphatic or aromatic dicarboxylic acids, as well as aliphatic diamines and bis(carboxyalkyl)alkylphosphine oxides. The polyamides described are soluble in cold or hot water and have a low softening temperature.

[0010] US Patent No. 2,646,420 relates to oriented fibers based on linear condensation polymers containing phosphorus in the polymer chain. In addition to good dyeability, the fibers also exhibit good mechanical properties, especially high early strength and good elasticity. In the examples, bis(carboxyphenyl)methylphosphine oxide is used as the phosphorus-containing monomer, which is condensed with various glycols or decanediamines.

[0011] The field of textile fibers is also covered by U.S. Patent No. 4,032,517B, which includes copolyamides containing 0.5-7.5% by weight of phosphorus as an integral part of the polymer chain. Bis(carboxyethyl)alkylphosphine oxides, polycondensed with hexanediamine and adipic acid, are recommended as phosphorus-containing dicarboxylic acids. The fibers must be permanently antistatic, moisture-controlling and flame-resistant.

[0012] WO 2018 071790 A1 discloses flame-retardant polyamides containing phosphorus in the polymer chain. The phosphorus-containing monomer used, bis(4-methoxy-carbonylphenoxy)phenylphosphine oxide, is prepared from methyl hydroxybenzoate and phenylphosphonic dichloride. The exchange reaction of this phosphorus-containing dicarboxylic acid with m-xylylenediamine (MXDA) is described. Such polyamides containing 5% by weight of phosphorus-containing dicarboxylic acid have increased LOI values ​​compared to MXD6 and achieve classification V0 on 3.2 mm thick test specimens in the UL94 flammability test.

[0013] Japanese Patent No. 11286545A describes phosphorus-containing copolyamides with high glass transition temperatures that can be produced by polycondensation in inert solvents at temperatures between 50 and 200 °C. 2,5-dicarboxyphenylphosphonic acid, 3,5-dicarboxyphenylphosphinic acid and their derivatives are called phosphorus-bearing monomers. Copolyamides based on certain dicarboxyphenylphosphinic acids and the diamine 4,4'-oxydianiline, and isophthalic acid as a further dicarboxylic acid, have glass transition temperatures in the range of 240 to 276 °C. Therefore, these polyamides cannot be polycondensed in the melt.

[0014] The inherently flame retardant polyamides described above in the latest technological advances and containing phosphorus in the polymer chain have poor chemical resistance, are largely soluble even in cold or hot water, contain "weak" CP or COP bonds in the polymer chain, generally have low softening temperatures, especially low glass transition temperatures and therefore rather poor dimensional stability under heat. [Prior art documents] [Patent documents]

[0015] [Patent Document 1] European Patent No. 1 613 698 A1 [Patent Document 2] China Patent No. 101 735 455 A [Patent Document 3] U.S. Patent No. 4,837,394 [Patent Document 4] U.S. Patent No. 3,108,991 [Patent Document 5] U.S. Patent No. 2,646,420 [Patent Document 6] U.S. Patent No. 4,032,517B [Patent Document 7] International Publication No. 2018 071790A1 [Patent Document 8] Japanese Patent No. 11286545A Summary of the Invention

[0016] One of the tasks of the present invention is to avoid these disadvantages known from the latest technical progress and to provide essentially flame-retardant partially aromatic polyamides and polyamide moulding compounds produced therefrom, so as to be characterised by good mechanical and thermal properties, good surface quality, high temperature resistance and good flame retardancy.The polyamides and polyamide moulding compounds according to the invention preferably have a fire classification according to UL 94 of V0 for test specimens with a thickness of 0.35-3.2 mm, in particular 0.5 mm.

[0017] According to the invention, this problem is solved by a polyamide X having polyamide units AB / AC / AE / DB / DC / DE / F according to claim 1, where in addition to the polyamide unit AC at least one further polyamide unit is selected from the group consisting of the polyamide units AB, AE, DB, DC, DE and F and the monomer units A, B, C, D, E and F are derived from the following molecules which have amide bonds in the polyamide X: A: Aliphatic diamine; B: Aromatic phosphorus-free dicarboxylic acids; C: phosphorus-containing aromatic dicarboxylic acid according to formula 1, 2 and / or 3 [ka] (wherein each of the substituents R1, R2 is independently C1-C8-alkyl or aryl, and each of the substituents R3, R4, R5 is independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O); D: diamines having aromatic structural units; E: Aliphatic dicarboxylic acid F: α,ω-aminocarboxylic acids, lactams.

[0018] This means that in addition to the polyamide unit AC, at least one more polyamide unit must be present in the polyamide X according to the invention, i.e. at least two polyamide units must be present, for example in combination with units AB and AC or AC and F, the remaining polyamide units being therefore optional.

[0019] The aromatic dicarboxylic acids of component B differ from the dicarboxylic acids of component C in particular in that they do not contain phosphorus.

[0020] The aforementioned polyamide units, such as the polyamide units AC or AB, are repeat units in polyamide X. Thus, in the simplest case, polyamide X is a copolyamide having at least two different repeat units, such as the polyamide units AC and AB. In this example, in addition to an aliphatic diamine A, two different aromatic dicarboxylic acids B and C are used to prepare polyamide X.

[0021] This object is also achieved by a process according to the invention for the preparation of polyamides as claimed in claim 9.

[0022] The problem is further solved by providing a polyamide moulding compound FM according to claim 10, which comprises the above-mentioned polyamide X, at least one filler and / or at least one additive and / or at least one polyamide Y different from polyamide X.

[0023] The problem is further solved by a molded part according to claim 13, which is at least formed using polyamide X or forming compound FM.

[0024] This problem is finally solved by the use of polyamide X according to the invention and by the use of a polyamide moulding compound FM according to claim 15 of the invention. Definition of Terms

[0025] According to the present invention, the term "polyamide" (abbreviation PA) is understood to be a generic term including homopolyamides and copolyamides, regardless of their molar mass weight or viscosity. The general term polyamide therefore includes homopolyamides and copolyamides with higher molecular weights, in addition to polyamide precondensates with lower molecular weights. The notations and abbreviations selected for polyamides and their monomers correspond to those defined in ISO standard 16396-1 (2015(D)). The abbreviations used therein are used in the following strings as synonyms of the IUPAC names of the monomers. Specifically, the following abbreviations for the monomers are used: T or TPS for terephthalic acid, I or IPS for isophthalic acid, MACM for bis(4-amino-3-methyl-cyclohexyl)methane (also known as 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, CAS number 6864-37-5), PACM for bis(4-aminocyclohexyl)methane (also known as 4,4'-diaminodicyclohexylmethane, CAS number 1761-71-3), TMDC for bis(4-amino-3,5-dimethylcyclohexyl)methane (also known as 3,3',5,5'-tetramethyl-4,4'-diaminodicyclohexylmethane, CAS number 65962-45-0). The abbreviation HMDA is used below for 1,6-hexanediamine (also known as hexamethylenediamine).

[0026] In comparison with partially crystalline polyamides, amorphous polyamides exhibit no or a very low, almost undetectable heat of fusion. In differential scanning calorimetry (DSC) according to ISO 11357 (2013), amorphous polyamides preferably exhibit a heat of fusion of less than 3 J / g, particularly preferably 0 to 1 J / g, at a heating rate of 20 K / min. Amorphous polyamides do not have a melting point due to their amorphous nature.

[0027] In addition to the glass transition temperature, the partially crystalline polyamide has a pronounced melting point and in differential scanning calorimetry (DSC) according to ISO 11357 (2013) preferably exhibits a heat of fusion of at least 15 J / g, preferably at least 20 J / g, particularly preferably in the range from 25 to 80 J / g, at a heating rate of 20 K / min.

[0028] For the polyamide X according to the invention, the dicarboxylic acid and diamine components used and any lactam / aminocarboxylic acid or monofunctional regulator monomers build up repeat units and / or end groups in the form of amides derived from the respective monomers as a result of condensation. These usually constitute at least 95 mol %, in particular at least 99 mol %, of all repeat units and end groups present in the polyamide. Furthermore, the polyamide can also have small amounts of other repeat units that may result from decomposition or side reactions of the monomers, for example diamines. Polyamide X

[0029] The polyamide according to the invention is a polyamide X having the polyamide units AB / AC / AE / DB / DC / DE / F, where in addition to the polyamide unit AC there must be at least one further polyamide unit selected from the group consisting of the polyamide units AB, AE, DB, DC, DE and F. This means that the polyamide unit not corresponding to AC and at least one other polyamide unit are optional, in the simplest case polyamide X only comprises two polyamide units. The monomer units A, B, C, D, E and F are derived from the following difunctional molecules, monomers, which are amide-linked in polyamide X:

[0030] Possible monomers for preparing polyamide X include components A, B, C, D, E and F: A aliphatic diamines, preferably aliphatic diamines having 6 to 12 C atoms; B aromatic phosphorus-free dicarboxylic acids, preferably isophthalic acid, terephthalic acid or mixtures thereof; C phosphorus-containing aromatic dicarboxylic acids according to formula 1, 2 and / or 3, in which each of the substituents R1, R2 is independently C1-C8-alkyl or aryl, and each of the substituents R3, R4, R5 is independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O; D diamines having aromatic structural units; E aliphatic dicarboxylic acids, preferably acyclic aliphatic dicarboxylic acids having 6 to 18 carbon atoms; F α,ω-Amino carboxylic acid, lactam.

[0031] The preferred molar ratio of total diamines used and total dicarboxylic acids present in polyamide X is from 1.06:1 to 1:1.06, particularly preferably from 1.03:1 to 1:1.03, particularly preferably a molar ratio of 1.01:1:1.01 in polyamide X.

[0032] According to a preferred embodiment, the aliphatic diamine A is selected from the group consisting of 2-methyl-1,5-pentanediamine, hexanediamine, in particular 1,6-hexanediamine, 2,2,4-trimethyl-1,6-hexamethylenediamine, 2,4,4-trimethyl-1,6-hexamethylenediamine, nonanediamine, in particular 1,9-nonanediamine, 2-methyl-1,8-octanediamine, 1,10-decanediamine, 1,11-undecanediamine, 1,12-dodecanediamine, 1,3-diamine, 1,4-diamine, 1,5-diamine, 1,6-diamine, 1,7-diamine, 1,8-diamine, 1,9-diamine, 1,8-diamine, 1,9-diamine, 1,10-diamine, 1,11-diamine, 1,12-diamine, 1,3-diamine, 1,4-diamine, 1,5-diamine, 1,6-diamine, 1,7-diamine, 1,8-diamine, 1,9 ... Aliphatic diamines A are selected from the group consisting of 1,6-hexanediamine, 2-methyl-1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,3-bis(aminomethyl)cyclohexane (BAC), 1,4-bis(aminomethyl)cyclohexane, bis-(4-amino-3-methylcyclohexyl)methane (MACM), bis(4-aminocyclohexyl)methane (PACM), bis-(4-amino-3,5-dimethylcyclohexyl)methane (TMDC), and mixtures thereof. Aliphatic diamines A are particularly preferred, selected from the group consisting of diamines having 6 to 12 carbon atoms, in particular 1,6-hexanediamine, 2-methyl-1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,3-bis(aminomethyl)cyclohexane, and mixtures thereof.

[0033] As component B, aromatic phosphorus-free dicarboxylic acids are preferably used, which are selected from the group consisting of terephthalic acid, isophthalic acid, 1,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 3,3'-diphenyldicarboxylic acid, 4,4'-diphenyletherdicarboxylic acid, 4,4'-diphenylmethanedicarboxylic acid, 4,4'-diphenylsulfonedicarboxylic acid, 4,4'-diphenyl-isopropylidenedicarboxylic acid, 1,2-bis(phenoxy)ethane-4,4'-dicarboxylic acid, 2,5-anthracene-dicarboxylic acid, 4,4'-p-terphenylenedicarboxylic acid and 2,5-pyridinecarboxylic acid. Particular preference is given to aromatic dicarboxylic acids B selected as terephthalic acid or a mixture of isophthalic acid and terephthalic acid.

[0034] According to a further preferred embodiment, the phosphorus-containing aromatic dicarboxylic acid C is selected from the group consisting of 3,5-dicarboxyphenyl diphenylphosphine oxide, 3,5-dicarboxyphenyl dimethylphosphine oxide, 3,5-dicarboxyphenyl diethylphosphine oxide, 2,4-dicarboxyphenyl diphenylphosphine oxide, 2,4-dicarboxyphenyl dimethylphosphine oxide, 2,4-dicarboxyphenyl diethylphosphine oxide, particularly preferably selected as 3,5-dicarboxyphenyl diphenylphosphine oxide. 3,5-dicarboxyphenyl diphenylphosphine oxide is a dicarboxylic acid according to formula 1, in which the substituents R1 and R2 are phenyl and the substituents R3, R4 and R5 are hydrogen.

[0035] A further preferred embodiment of the present invention provides that the diamine D is selected from the group consisting of m-xylylenediamine (MXDA), p-xylylenediamine (PXDA) and mixtures thereof. Particularly preferred is a diamine D selected as m-xylylenediamine.

[0036] A further preferred embodiment of the present invention provides that the aliphatic dicarboxylic acid E is selected from the group consisting of cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid, adipic acid, 1,7-heptanedioic acid, 1,8-octanedioic acid, 1,9-nonanedioic acid, 1,10-decanedioic acid, 1,11-undecanedioic acid, 1,12-dodecanedioic acid, 1,13-tridecanedioic acid, 1,14-tetradecanedioic acid, 1,15-pentadecanedioic acid, 1,16-hexadecanedioic acid, 1,17-heptadecanedioic acid, 1,18-octadecanedioic acid, and mixtures thereof. Particular preference is given to dicarboxylic acids having 6 to 18 carbon atoms, in particular aliphatic dicarboxylic acids E selected from the group consisting of adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid and mixtures thereof.

[0037] According to a further preferred embodiment of the invention, the α,ω-aminocarboxylic acid or lactam F is selected from the group consisting of caprolactam, undecanolactam, laurinlactam, α,ω-aminocaproic acid, α,ω-aminoheptanoic acid, α,ω-aminooctanoic acid, α,ω-aminononanoic acid, α,ω-aminodecanoic acid, α,ω-aminoundecanoic acid (AUA) and α,ω-aminododecanoic acid (ADA), particularly preferred are α,ω-aminoundecanoic acid, caprolactam and laurinlactam and mixtures thereof.

[0038] Furthermore, polyamide X may contain at least one monofunctional carboxylic acid G1 or monofunctional amine G2 polymerized as monofunctional regulator G. Monofunctional regulator G is used for the final capping of the polyamide produced according to the invention. All monocarboxylic acids G1 that can react with at least a portion of the available amino groups under the reaction conditions of the polyamide condensation are in principle suitable. Suitable monocarboxylic acids G1 are aliphatic monocarboxylic acids, cycloaliphatic monocarboxylic acids and aromatic monocarboxylic acids. These include formic acid, acetic acid, propionic acid, n-, iso- or tertiary butyric acid, valeric acid, trimethylacetic acid, caproic acid, oenanthoic acid, caprylic acid, pelargonic acid, capric acid, undecanoic acid, lauric acid, tridecanoic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, cyclohexanecarboxylic acid, benzoic acid, methylbenzoic acid, α-naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, phenylacetic acid, oleic acid, ricinoleic acid, linoleic acid, linolenic acid, erucic acid, acrylic acid, methacrylic acid and mixtures thereof. Particularly preferred are monocarboxylic acids G1 selected from acetic acid, propionic acid, benzoic acid, stearic acid and mixtures thereof. In a particular embodiment, the aliphatic polyamide (X) contains only polymerized benzoic acid as monocarboxylic acid G1.

[0039] The polyamide X may contain at least one polymerized monoamine G2. The monoamine G2 is used as a final capping of the polyamide produced according to the invention. All monoamines capable of reacting with at least a portion of the available carboxylic acid groups under the reaction conditions of the polyamide condensation are in principle suitable. Aliphatic monoamines are the preferred monoamines G2. These include methylamine, ethylamine, propylamine, butylamine, hexylamine, heptylamine, octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine, dibutylamine, cyclohexylamine, dicyclohexylamine and mixtures thereof.

[0040] The polyamide X preferably has a content of polyamide units AC of 1 to 99 mol%, preferably 10 to 90 mol%, particularly preferably 10 to 60 mol%, and a content of at least one further polyamide unit of 1 to 99 mol%, preferably 10 to 90 mol%, particularly preferably 40 to 90 mol%, based on the sum of the polyamide units AC and the at least one further polyamide unit AB, AE, DB, DC, DE, F, respectively.

[0041] It is furthermore preferred that for the polyamide X, with respect to the components A to F, at least one of the following selection groups is selected, particularly preferably the selection groups of the components A, B and C or A, B, C and E are selected, particularly preferably all of the selection groups are selected simultaneously: A: an aliphatic diamine A selected from the group consisting of 1,6-hexanediamine, 2-methyl-1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,12-dodecanediamine, and 1,3-bis(aminomethyl)cyclohexane (BAC); B: the aromatic non-phosphorus-containing dicarboxylic acid is selected from the group consisting of terephthalic acid, isophthalic acid, and mixtures thereof; C: the phosphorus-containing aromatic dicarboxylic acid C is selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyldimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, 2,4-dicarboxyphenyldiphenylphosphine oxide, 2,4-dicarboxyphenyldimethylphosphine oxide, 2,4-dicarboxyphenyldiethylphosphine oxide, particularly preferably selected as 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyl-dimethylphosphine oxide or 3,5-dicarboxyphenyldiethylphosphine oxide; D: the diamine having an aromatic structural unit is selected from the group consisting of m-xylylenediamine, p-xylylenediamine and mixtures thereof; E: the aliphatic dicarboxylic acid is selected from the group consisting of adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid, and mixtures thereof; F: α,ω-aminocarboxylic acid or lactam F is selected from the group consisting of α,ω-aminoundecanoic acid, caprolactam and laurinlactam, and mixtures thereof.

[0042] In a preferred embodiment, polyamide X is a polyamide having at least one further polyamide unit selected from the group consisting of AB, AE and F, where the content of polyamide units AC is from 1 to 99 mol%, preferably from 10 to 90 mol%, particularly preferably from 10 to 60 mol% and the sum of the content of polyamide units AB, AE and F is from 1 to 99 mol%, preferably from 10 to 90 mol%, particularly preferably from 40 to 90 mol%, based on the sum of the polyamide units AB, AC, AE and F, respectively.

[0043] Another preferred polyamide is polyamide X containing at least polyamide units AB and AC, in which the content of polyamide units AB is 1 to 99 mol%, preferably 10 to 90 mol%, more preferably 40 to 90 mol%, and the content of polyamide units AC is 1 to 99 mol%, preferably 10 to 90 mol%, more preferably 10 to 60 mol%, based on the total of polyamide units AB and AC, respectively.

[0044] Another preferred polyamide is polyamide X comprising at least polyamide units AB, AC and AE, in which the content of polyamide units AC is 1 to 99 mol%, preferably 10 to 90 mol%, more preferably 10 to 60 mol%, and the content of polyamide units AB or AB and AE is 1 to 99 mol%, preferably 10 to 90 mol%, more preferably 40 to 90 mol%, based on the total of polyamide units AB, AC and AE, respectively.

[0045] In a preferred embodiment, polyamide X is a polyamide comprising at least polyamide units AB and AC, the monomer units A, B and C being preferably derived in polyamide X from the following molecules which are amide-linked: A: an acyclic aliphatic diamine selected from the group consisting of 1,6-hexanediamine, 1,10-decanediamine, and 1,3-bis(aminomethyl)cyclohexane (BAC); B: the aromatic non-phosphorus-containing dicarboxylic acid is selected from the group consisting of terephthalic acid, isophthalic acid, and mixtures thereof; C: The phosphorus-containing aromatic dicarboxylic acid is selected from the group consisting of 3,5-dicarboxyphenyl diphenyl phosphine oxide, 3,5-dicarboxyphenyl dimethyl phosphine oxide, 3,5-dicarboxyphenyl diethyl phosphine oxide, 2,4-dicarboxyphenyl diphenyl phosphine oxide, 2,4-dicarboxyphenyl dimethyl phosphine oxide, and 2,4-dicarboxyphenyl diethyl phosphine oxide.

[0046] Preference is also given to polyamides X in which the aromatic dicarboxylic acid B is selected from the group consisting of terephthalic acid or a mixture of terephthalic acid and isophthalic acid.

[0047] Another preferred option is a polyamide X in which the polyamide unit AB is selected from the group consisting of the polyamide units 6I, 6T, 8I, 8T, 9I, 9T, 10I, 10T, 12I, 12T, 6T / 6I, 9T / 9I, 10T / 10I, 12T / 12I, 6T / 10T, 6T / 9T, 6T / 8T, BACI, BACT, BACT / BACI, BACT / 6T, BACT / 10T and / or the polyamide unit AE is selected from the group consisting of the polyamide units 66, 610, 611, 612, 614, 616, 618, 106, 1010, 1011, 1012, 1014, 1016, 1018, BAC6, BAC10, BAC11, BAC12, BAC14, BAC16.

[0048] Another preferred option is a polyamide X comprising at least polyamide units AB and AC, the polyamide units AB being (a1) 60 to 100 parts by weight, preferably 60 to 80 parts by weight, particularly preferably 67 parts by weight, of polyamide units AB derived from terephthalic acid in combination with hexamethylenediamine, 1,3-bis(aminomethyl)cyclohexane and / or 1,10-decanediamine, (a2) from 0 to 40 parts by weight, preferably from 20 to 40 parts by weight, particularly preferably 33 parts by weight, of polyamide units AB derived from isophthalic acid in combination with hexamethylenediamine, 1,3-bis(aminomethyl)cyclohexane and / or 1,10-decanediamine, The parts by weight of components (a1) and (a2) together equal 100 parts by weight based on the polyamide unit AB.

[0049] Particular preference is given to polyamides X which, in addition to components A to F, may also contain a monofunctional regulator G as further component.

[0050] It is also preferred if the polyamide X consists only of the polyamide units AC and AB and / or AE. In this case, the polyamide X is therefore of the AB / AC, AC / AE or AB / AC / AE system and may also contain a monofunctional regulator G as another component. The content of the polyamide units AC is preferably 1-99 mol%, particularly preferably 10-90 mol%, particularly preferably 10-60 mol%, and the content of the polyamide units AB and / or AE is preferably 1-99 mol%, particularly preferably 10-90 mol%, particularly preferably 10-40 mol%, based on the sum of the polyamide units AB, AC and AE, respectively.

[0051] Particularly preferred are polyamides X which contain only polyamide units AB and AC or only polyamide units AC and AE.

[0052] Another particularly preferred option is a polyamide X comprising only polyamide units AB and AC, in which the aliphatic diamine A is selected as 1,6-hexanediamine, 1,10-decanediamine and mixtures thereof, the aromatic dicarboxylic acid B is selected from terephthalic acid or mixtures of terephthalic acid and isophthalic acid, and the phosphorus-containing aromatic dicarboxylic acid C is selected from 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyl-dimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide and mixtures thereof.

[0053] Polyamide X is preferably a partially crystalline polyamide having a melting enthalpy of at least 15 J / g, particularly preferably at least 20 J / g.

[0054] The polyamide X in the form of a precondensate preferably has a solution viscosity η in the range from 1.08 to 1.39, particularly preferably in the range from 1.10 to 1.35 and in particular in the range from 1.12 to 1.30, determined according to ISO 307:2007 at 20° C. using a solution of 0.5 g of polymer granules in 100 ml of m-cresol. rel has.

[0055] The polyamide X of high molecular weight, or in the form of a precondensate, preferably has a solution viscosity η in the range of 1.40 to 2.50, preferably in the range of 1.45 to 2.20, in particular in the range of 1.50 to 2.00, determined according to ISO 307:2007 using a solution of 0.5 g of polymer granules in 100 ml of m-cresol at 20° C. rel has.

[0056] Polyamide X preferably has a phosphorus content of at least 1.0% by weight, more preferably in the range of 1.5 to 7% by weight, more preferably in the range of 1.7 to 4.0% by weight.

[0057] The polyamides according to the invention have good flame retardancy, preferably a flame retardancy classification of V0 determined according to UL 94 ("Tests for Flammability of Plastic Materials for Parts in Devices and Applications" of Underwriters Laboratories) on test specimens with the dimensions 127x12.7x0.35 mm, 127x12.7x0.5 mm, 127x12.7x0.75 mm, 127x12.7x1.5 mm and 127x12.7x3.0 mm, previously conditioned for 48 hours in a reference climate of 23°C and 50% relative humidity or stored for 7 days at 70°C in a convection oven.

[0058] The preparation of polyamide X preferably comprises a polycondensation reaction between at least one aromatic phosphorus-free dicarboxylic acid B and / or aliphatic dicarboxylic acid E, at least one phosphorus-containing aromatic dicarboxylic acid C according to formula 1, 2 and / or 3, in which each of the substituents R1, R2 is independently C1-C8-alkyl or aryl and each of the substituents R3, R4, R5 is independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O, and at least one aliphatic diamine A and, if necessary, further monomers D and F, optionally in the presence of monofunctional regulators G and / or auxiliary materials for the process.

[0059] Preferred auxiliary materials for the process are inorganic and organic stabilizers, catalysts and antifoaming agents.Phosphorus compounds such as phosphoric acid, phosphorous acid, hypophosphorous acid, phenylphosphonic acid, phenylphosphinic acid and / or their salts with monovalent to trivalent cations, such as Na, K, Mg, Ca, Zn or Al, and / or their esters, such as triphenylphosphate, triphenylphosphite or tris-(nonylphenyl)-phosphite, are preferred catalysts.Hypophosphorous acids and their salts, such as sodium hypophosphite, are particularly preferred as catalysts.

[0060] Starting from the monomers A to F, the polyamide X can be polycondensed in a pressure vessel to high molecular weight polymers having preferred number-average molar masses (Mn) of more than 3000 g / mol, particularly preferably in the range from 4000 to 20,000 g / mol, or to so-called precondensates having lower number-average molar masses (Mn), preferably less than 3000 g / mol, particularly preferably in the range from 800 to 2500 g / mol. The precondensates can be converted at a later stage by solid-phase and / or molten material postcondensation into high molecular weight polymers having preferred number-average molar masses (Mn) of more than 3000 g / mol, particularly preferably more than 4000 g / mol, in particular in the range from 4000 to 20,000 g / mol.

[0061] The process for the preparation of polyamide X comprising at least polyamide units AC and at least one further polyamide unit AB, AE, DB, DC, DE or F is preferably carried out in a pressure vessel, in which components A, C and at least one further component B, D, E, F, and optionally a monofunctional regulator G and auxiliary materials for the process and water are mixed, followed by a pressure stage at 240° C. to 330° C., followed by development at 240° C. to 320° C., followed by degassing at 240° C. to 320° C., discharging the polyamide in strand or powder form, cooling, granulating the strands and drying the granules or powder.

[0062] Depending on their melting point or glass transition temperature, the precondensates can be postcondensed in the solid phase at temperatures ranging from 150 to 300°C. The postcondensation of the molten material is preferably carried out in an extruder at temperatures of 300 to 400°C. Preferably, mixtures of two or more different precondensates can also be converted into high molecular weight polyamides using postcondensation. The precondensates of polyamide X according to the invention can also be postcondensed together with another precondensate not containing polyamide units AC to form high molecular weight polyamide X.

[0063] In addition, the invention also encompasses the provision of a polyamide molding compound FM comprising a polyamide X and at least one filler and / or at least one additive and / or at least one polyamide Y different from polyamide X.

[0064] Polyamide Y is preferably selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6 / 12, polyamide 6I, polyamide 9T, polyamide 10T, polyamide 6T / 6I, polyamide 6T / 66, polyamide 6T / 10T or mixtures thereof. Polyamide 6T / 6I, 6T / 66, 6T / 10T and mixtures thereof are particularly preferred as polyamide Y.

[0065] In a preferred embodiment, the polyamide molding compound FM contains or preferably consists of the following components, components S, T and X together representing 100% by weight: 25-99.99% by weight of polyamide X 0-70 wt. % of at least one filler T; 0.01-50 wt. % of at least one additive S other than X and T.

[0066] In a particularly preferred embodiment of the invention, the polyamide molding compound FM contains or preferably consists of the following components, components P, S and T together making up 100% by weight: 25 to 100% by weight of a polymer mixture P, 20 to 80% by weight of polyamide X and 20-80% by weight of a polyamide Y different from polyamide X, preferably a polyamide Y selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6 / 12, polyamide 6I, polyamide 9T, polyamide 10T, polyamide 6T / 6I, polyamide 6T / 66, polyamide 6T / 10T or mixtures thereof, a polymer mixture P, in which the sum of X and Y is 100% by weight of the polymer mixture P; 0-70 wt. % of at least one filler T; 0-50 wt. % of at least one additive S other than X, Y and T.

[0067] Polymer mixtures P containing only components X and Y are particularly preferred.

[0068] Polyamide Y is a polyamide that does not contain polyamide units AC and DC, i.e. does not contain component C. Polyamide Y preferably comprises at least one of the polyamide units AB, AE, DB, DE, F. In a preferred embodiment, polyamide Y contains only polyamide units AE and / or F, i.e. is an aliphatic polyamide. In this case, it is particularly preferred if polyamide Y is selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6 / 12, polyamide 6I, polyamide 9T, polyamide 10T, polyamide 6T / 6I, polyamide 6T / 66, polyamide 6T / 10T or mixtures thereof.

[0069] The polyamide molding compound FM according to the invention contains or preferably consists only of the components X and S or X, T and S or P or P and S or P, T and S, with the proviso that the sum of the components X, T, S or P, T, S is 100% by weight. The specific ranges of the amounts of the individual components X, T, S or P, T, S are to be understood as allowing the selection of any amount for each of the individual components within the specific ranges, as long as the strict content requirements indicating that the sum of all the components X, T, S or P, T, S is 100% by weight are met.

[0070] The phosphorus content of the polymer mixture is preferably in the range of 0.8 to 6.0% by weight, particularly preferably in the range of 1.2 to 4.5% by weight, and particularly preferably in the range of 1.5 to 3.5% by weight.

[0071] Component T is a filler with a weight percentage of 0-70% in the polyamide molding compound FM. The fillers can be present in fibrous and particulate form, individually or as a mixture. Component T can therefore contain fibrous fillers (reinforcing agents) or particulate fillers, or even a mixture of reinforcing agents and particulate fillers.

[0072] According to a preferred embodiment of the invention, component T is present in the polyamide moulding compound FM in an amount of 10 to 60% by weight, more preferably 20 to 55% by weight and particularly preferably 25 to 50% by weight, these amounts referring to the sum of components X, T, S or the sum of components P, T, S or to the total weight of the polyamide moulding compound FM.

[0073] It is particularly preferred if component T consists exclusively of reinforcing agents selected from the group consisting of glass fibres, carbon fibres, boron fibres, aramid fibres, basalt fibres and mixtures thereof. According to a preferred embodiment of the polyamide moulding compound according to the invention, component T is formed entirely from glass fibres.

[0074] The glass fibers used have a cross-sectional area that is either annular (or synonymously circular) or non-annular (or synonymously flat), and in the latter case the dimensional ratio between the primary and secondary cross-sectional axes is at least 2, preferably in the range of 2 to 6.

[0075] The reinforcement with glass fibres can be carried out using short fibres (for example chopped glass with a length of 2-50 mm) or continuous fibres (long glass or rovings). In a preferred embodiment, the glass fibres used according to the invention are short glass fibres with a diameter in the range of 6-20 μm, preferably 9-12 μm. The glass fibres are in the form of chopped glass with a length of 2-50 mm. E and / or S glass fibres are in particular used according to the invention. However, all other types of glass fibres can also be used, for example A, C, D, M, R glass fibres, or any mixtures thereof, or mixtures with E and / or S glass fibres. The usual sizing for polyamides can be used, such as sizings of various aminosilanes, high temperature stable sizings being preferred.

[0076] In the case of flat glass fibres, i.e. glass fibres with a non-circular cross-sectional area, preference is given to those having a dimensional ratio of the primary cross-sectional axis to the secondary cross-sectional axis perpendicular thereto, i.e. a ratio of at least 2, preferably 2.5 to 4.5, in particular 3 to 4. These so-called flat glass fibres have a constricted cross-sectional area that is elliptical, oblong, oval (so-called cocoon fibres), polygonal, rectangular or nearly rectangular. Another characteristic feature of the flat glass fibres used is that the length of the primary cross-sectional axis is preferably in the range of 6 to 40 μm, in particular in the range of 15 to 30 μm, and the length of the secondary cross-sectional axis is in the range of 3 to 20 μm, in particular in the range of 4 to 10 μm.

[0077] A mixture of glass fibres with circular and non-circular cross-sections can also be used to reinforce the moulding compounds according to the invention, with the proportion of flat glass fibres preferably predominating, i.e. more than 50% by weight of the total mass of fibres. The glass fibres can be provided with a sizing suitable for thermoplastics, in particular polyamides, which contains adhesion promoters based on amino or epoxy silane compounds.

[0078] The flat glass fibres of component T are preferably selected as E-glass fibres according to ASTM D578-00, with a non-circular cross section, with a composition of 52-62% silicon dioxide, 12-16% aluminium oxide, 16-25% calcium oxide, 0-10% borax, 0-5% magnesium oxide, 0-2% alkali oxide, 0-1.5% titanium dioxide and 0-0.3% iron oxide. The glass fibres of component (T) are flat E-glass fibres, preferably with a tensile strength of 2.54-2.62 g / cm. 3 It has a density of 0.01, a tensile modulus of 70-75 GPa, a tensile strength of 3000-3500 MPa and an elongation at break of 4.5-4.8%. The mechanical properties were determined for a single fiber with a diameter of 10 μm and a length of 12.7 mm at 23 °C and a relative humidity of 50%.

[0079] Component T may also optionally contain other granular fillers in surface-treated form selected from the following group: kaolin, calcined kaolin, aluminum oxide, hydrated magnesium silicate, talc, mica, silicates, quartz, wollastonite, amorphous silica, magnesium carbonate, magnesium hydroxide, chalk, lime, feldspar, solid or hollow glass beads or ground glass, in particular ground glass fibres and mixtures of the members of this group. Microglass beads with an average diameter in the range of 5 to 100 μm are particularly preferred as fillers, as they tend to impart isotropy to the moulded parts and thus allow the production of moulded parts with low warpage.

[0080] According to a preferred embodiment of the present invention, component T consists exclusively of glass fillers selected from the group comprising glass fibres, crushed glass fibres, glass particles, glass flakes, glass spheres, hollow glass spheres or combinations thereof. If glass spheres or glass particles are selected as component T, their average diameter is between 0.3 and 100 μm, preferably between 0.7 and 30 μm, particularly preferably between 1 and 10 μm.

[0081] Another preferred embodiment of the invention provides that the glass type of component T is selected from the group consisting of E-glass, ECR-glass, S-glass, A-glass, AR-glass and R-glass, in particular E- and S-glass, and mixtures of these glass types.

[0082] According to a preferred embodiment, the component T is a high-strength glass fiber or a so-called S-glass fiber, which is preferably based on the ternary system silicon dioxide-aluminum oxide-magnesium oxide or the quaternary system silicon dioxide-aluminum oxide-magnesium oxide-calcium oxide, with a preferred composition of 58-70% by weight silicon dioxide (SiO2), 15-30% by weight aluminum oxide (Al2O3), 5-15% by weight magnesium oxide (MgO), 0-10% by weight calcium oxide (CaO), 0-2% by weight other oxides, such as zirconium dioxide (ZrO2), boron oxide (B2O3), titanium dioxide (TiO2), iron oxide (Fe2O3), sodium oxide, potassium oxide and lithium oxide (Li2O).

[0083] It is particularly preferred if the high-strength glass fibres have the following composition: 62-66% by weight silicon dioxide (SiO2), 22-27% by weight aluminium oxide (Al2O3), 8-12% by weight magnesium oxide (MgO), 0-5% by weight calcium oxide (CaO), 0-1% by weight other oxides such as zirconium dioxide (ZrO2), boron oxide (B2O3), titanium dioxide (TiO2), iron oxide (Fe2O3), sodium oxide, potassium oxide and lithium oxide (Li2O).

[0084] High strength glass fibres (S-glass fibres) are preferably characterised by a tensile strength of at least 3700 MPa, preferably at least 3800 or 4000 MPa, and / or an elongation at break of at least 4.8%, preferably at least 4.9 or 5.0%, and / or a tensile modulus of more than 75 GPa, preferably more than 78 or 80 GPa, these glass properties being determined on a single fibre (initial single fibre) having a diameter of 10 μm and a length of 12.7 mm at a temperature of 23° C. and a relative humidity of 50%.

[0085] The polyamide moulding compound FM according to the invention contains as component S 0-50% by weight of at least one additive different from components X, T and Y.

[0086] According to a preferred embodiment, the polyamide moulding compound FM according to the invention contains 0.01 to 50% by weight or 0.01 to 30% by weight, particularly preferably 0.02 to 20% by weight, of at least one additive as component S, these amounts referring to the sum of components X, T, S or to the sum of components P, T, S or to the total weight of the polyamide moulding compound FM.

[0087] According to a preferred embodiment, component S is selected from the group consisting of lubricants, heat stabilizers, processing stabilizers, processing aids, viscosity modifiers, oxidation retardants, agents preventing thermal and UV degradation, UV screening agents, anti-friction and release agents, colorants, in particular dyes, inorganic pigments, organic pigments, plasticizers, flame retardants, impact strength modifiers and mixtures thereof.

[0088] The polyamide molding compound FM can also contain flame retardants as additives to improve the flame retardancy, the flame retardant additives being preferably halogen-free. Preferred flame retardant additives are phosphinates and / or diphosphinates, which are preferably selected from the group of synergists, in particular nitrogen-containing synergists and / or nitrogen- and phosphorus-containing flame retardants, preferably melamine or condensation products of melamine, such as, with particular preference, Melem, Melam, Melon, solidification products of melamine and polyphosphoric acid, such as, for example, melamine polyphosphate, solidification products of condensation products of melamine and polyphosphoric acid or mixtures thereof. Among the phosphinates, aluminum, calcium or zinc salts of alkyl or dialkyl phosphinic acids, in particular aluminum diethylphosphinate, are particularly preferred.

[0089] In a further embodiment, the synergist is preferably selected as an oxygen-, nitrogen- or sulfur-containing metal compound. Preferred metals include aluminum, calcium, magnesium, barium, sodium, potassium and zinc. Suitable compounds are selected from the group of oxides, hydroxides, carbonates, silicates, borates, phosphates, stannates, alkoxides, carboxylates and combinations or mixtures of these compounds, such as oxide-hydroxides or oxide-hydroxide-carbonates. Examples of this include magnesium oxide, calcium oxide, aluminum oxide, zinc oxide, barium carbonate, magnesium hydroxide, aluminum hydroxide, boehmite, pseudoboehmite, dihydrotalcite, hydrocalumite, calcium hydroxide, calcium hydroxyapatite, tin oxide hydrate, zinc hydroxide, zinc borate, zinc sulfide, zinc phosphate, sodium carbonate, calcium carbonate, calcium phosphate, magnesium carbonate, basic zinc silicate, zinc stannate. It is also possible to use systems such as calcium stearate, zinc stearate, magnesium stearate, barium stearate, potassium palmitate, magnesium behenate, etc.

[0090] Phosphinic acids suitable for the preparation of the phosphinic salts according to the invention are, for example, dimethylphosphinic acid, ethylmethylphosphinic acid, diethylphosphinic acid, methyl-n-propylphosphinic acid, methane-di(methylphosphinic acid), ethane-1,2-di(methylphosphinic acid), hexane-1,6-di(methylphosphinic acid), benzene-1,4-di(methylphosphinic acid), methylphenylphosphinic acid, diphenylphosphinic acid. The phosphinic salts can be prepared, for example, by reacting phosphinic acids with metal carbonates, metal hydroxides or metal oxides in aqueous solution, whereby essentially monomeric phosphinic salts and, depending on the reaction conditions, possibly also polymeric phosphinic salts are formed.

[0091] Preferably, the content of these halogen-free flame-retardant additives in component S is at most 10% by weight, particularly preferably at most 5% by weight, in each case based on the total molding compound FM; particularly preferably, the molding compound FM does not contain any flame-retardant additives S.

[0092] According to a particularly preferred embodiment, the polyamide molding compound FM contains at least one lubricant as component S, preferably in a proportion of 0 to 2% by weight, particularly preferably 0.01 to 2.0% by weight, particularly preferably 0.01 to 1.5% by weight, most preferably 0.02 to 1.0% by weight, based on the total weight of component X, T, S or P, T, S or molding compound FM, respectively. Preferred options here include alkali salts, alkaline salts, alkaline earth salts, esters or amides of fatty acids having 10 to 44 C atoms, preferably 14 to 44 C atoms, with the metal ions Na, Mg, Ca and Al being preferred, with Ca or Mg being particularly preferred. Particularly preferred metal salts include Ca stearate and Ca montanate as well as Al stearate. The fatty acids can be monovalent or divalent. Examples of this include pelargonic acid, palmitic acid, lauric acid, margaric acid, dodecanedioic acid, behenic acid and particularly preferred stearic acid, capric acid and montanic acid (mixtures of fatty acids having 30 to 40 C atoms).

[0093] Aliphatic alcohols, which may be monohydric to tetrahydric, are also preferred as lubricants. These alcohols are preferably selected from the group consisting of n-butanol, n-octanol, stearyl alcohol, ethylene glycol, propylene glycol, neopentyl glycol, glycerol, pentaerythritol and mixtures thereof, with glycerol and pentaerythritol being preferred.

[0094] Additionally, aliphatic amines, which may be mono- to tri-functional, are preferred lubricants. Preferred amines are selected from the group consisting of stearylamine, ethylenediamine, propylenediamine, hexamethylenediamine, di(6-aminohexyl)amine and mixtures thereof, with ethylenediamine and hexamethylenediamine being particularly preferred.

[0095] Preferred esters or amides of fatty acids are selected from the group consisting of glycerol distearate, glycerol tristearate, ethylenediamine distearate, glycerol monopalmitate, glycerol trilaurate, glycerol monobehenate, pentaerythritol tetrastearate and mixtures thereof.Furthermore, white oil or silicone oil can be used alternatively or additionally.

[0096] According to a further preferred embodiment, the polyamide moulding compound FM contains as component S at least one heat stabilizer, which is preferably present in a proportion of 0 to 3% by weight, particularly preferably 0.02 to 2.0% by weight, based on the total weight of components X, T, S or P, T, S or the moulding compound FM, respectively.

[0097] According to a preferred embodiment, the heat stabilizer is selected from the group consisting of: Compounds of monovalent or divalent copper, for example salts of monovalent or divalent copper with inorganic or organic acids or monovalent or divalent phenols, oxides of monovalent or divalent copper or complex compounds of copper salts with ammonia, amines, amides, lactams, cyanides or phosphines, preferably hydrohalic acids, Cu(I) or Cu(II) salts of hydrocyanic acid or copper salts of aliphatic carboxylic acids. Particularly preferred compounds include the monovalent copper compounds CuCl, CuBr, CuI, CuCN and Cu2O, as well as the divalent copper compounds CuCl2, CuSO4, CuO, copper(II) acetate or copper(II) stearate. Advantageously, the copper compounds are used in combination with other metal halides, in particular alkali metal halides, for example Nal, KI, NaBr, KBr or ammonium halides, the molar ratio of metal halide to copper halide being 0.5 to 20, preferably 1 to 10, particularly preferably 3 to 7. Lanthanide compounds selected from the group consisting of acetates, fluorides, chlorides, bromides, iodides, oxide halides, sulfates, nitrates, phosphates, chromates, perchlorates, oxalates, sulfur, monochalcogenides, carbonates, hydroxides, oxides, trifluoromethanesulfonates, acetylacetonates, alcoholates, 2-ethylhexanoates of lanthanides lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium, as well as hydrates of the above salts and mixtures of the above compounds. Cerium or lanthanum compounds are particularly preferred, the use of lanthanum(III) hydroxide, lanthanum(III) oxide hydroxide and cerium tetrahydroxide being particularly preferred here. Furthermore, the cations of the lanthanide compounds are preferably in the oxidation state +III or +IV. The lanthanide compounds are preferably used in combination with alkali metal halides, alkaline earth metal halides and / or copper compounds as mentioned above. stabilizers based on secondary aromatic amines, which are preferably present in an amount of 0.2 to 2, preferably 0.2 to 1.5% by weight, stabilizers based on sterically hindered phenols, which are preferably present in an amount of 0.1 to 1.5, preferably 0.2 to 1.0% by weight, Phosphites and phosphonites, as well as A mixture of the above stabilizers.

[0098] Particularly preferred examples of stabilizers based on secondary aromatic amines which can be used according to the invention are the adduct of phenylenediamine with acetone (Naugard A), the adduct of phenylenediamine with linolene, Naugard 445, N,N'-dinaphthyl-p-phenylenediamine, N-phenyl-N'-cyclohexyl-p-phenylenediamine, or mixtures of two or more of these.

[0099] In principle, all compounds having a phenol structure with at least one sterically demanding group on the phenol ring are suitable as sterically hindered phenols.Preferred examples of stabilizers based on sterically hindered phenols that can be used according to the present invention are N,N'-hexamethylene-bis-3-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionamide, bis-(3,3-bis-(4'-hydroxy-3'-tert-butylphenyl)-butanoic acid)-glycol ester, 2,1'-thioethyl bis-(3-(3,5-di-tert-butyl-4-hydroxyphenyl)-propionate, 4-4'-butylidene-bis-(3-methyl-6-tert.butylphenol), triethylene glycol 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate or mixtures of two or more of these stabilizers.

[0100] Preferred phosphites and phosphonites are triphenyl phosphite, diphenyl alkyl phosphites, phenyl dialkyl phosphites, tris(nonylphenyl) phosphite, trilauryl phosphite, trioctadecyl phosphite, distearyl pentaerythritol diphosphite, tris(2,4-di-tert-butylphenyl) phosphite, diisodecyl pentaerythritol diphosphite, bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl)-pentaerythritol diphosphite, diisodecyloxypentaerythritol diphosphite, bis(2,4-di-tert-butyl-6-methylphenyl)-pentaerythritol diphosphite, These are taerythritol diphosphite, bis(2,4,6-tris-(tert-butylphenyl))pentaerythritol diphosphite, tristearyl sorbitol triphosphite, tetrakis(2,4-di-tert-butylphenyl)-4,4'-biphenylene diphosphonite, 6-isooctyloxy-2,4,8,10-tetra-tert-butyl-12H-dibenzo-[d,g]-1,3,2-dioxaphosphocin, 6-fluoro-2,4,8,10-tetra-tert-butyl-12-methyl-dibenzo[d,g]-1,3,2-dioxaphosphocin, bis(2,4-di-tert-butyl-6-methylphenyl)methyl phosphite and bis(2,4-di-tert-butyl-6-methylphenyl)ethyl phosphite. In particular, tris[2-tert-butyl-4-thio(2'-methyl-4'-hydroxy-5'-tert-butyl)-phenyl-5-methyl]phenyl phosphite and tris(2,4-di-tert-butylphenyl) phosphite (Irgafos 168) are preferred.

[0101] A preferred embodiment of the heat stabilizer consists of a combination of organic heat stabilizers (especially Irgafos 168 and Irganox 1010), bisphenol A-based epoxides (especially Epikote 1001) and copper stabilizers based on CuI and KI. Commercially available stabilizer mixtures consisting of organic stabilizers and epoxides are, for example, Irgatec NC66 or Recylobyk 4371. Heat stabilization based only on CuI and KI is particularly preferred.

[0102] Examples of oxidation retarders and heat stabilizers include phosphites and other amines (e.g. TAD), hydroquinone, various substituted representatives of these groups, and mixtures thereof, in concentrations of up to 1% by weight based on the total weight of component X, T, S or P, T, S or molding compound FM.

[0103] Various substituted resorcinols, salicylates, benzotriazoles and benzophenones are mentioned as UV stabilizers, which are generally used in amounts up to 2% by weight, based on the weight of the polyamide molding compound FM.

[0104] Inorganic pigments such as titanium dioxide, barium sulfate, zinc oxide, ultramarine, iron oxide and carbon black and / or graphite, as well as organic pigments such as phthalocyanines, quinacridones, perylenes, and dyes such as nigrosine and anthraquinone, may be added as colorants.

[0105] Component S may also contain an impact modifier, preferably selected from the group consisting of polyolefins, polyolefin copolymers, styrene copolymers, styrene block copolymers, ionic ethylene copolymers which may be partially neutralized by metal ions, and mixtures thereof. Preferably, the impact modifier is functionalized. Preferably, the polyamide molding compound FM contains 0 to 35% by weight, particularly preferably 5 to 20% by weight, of impact modifier.

[0106] According to a preferred embodiment of the invention, the impact strength modifiers of component S are functionalized by copolymerization and / or grafting. For this purpose, compounds selected from the group consisting of unsaturated carboxylic acids, unsaturated carboxylic acid derivatives and mixtures thereof, and / or unsaturated glycidyl compounds are particularly preferably used. These are particularly preferably selected from the group consisting of unsaturated carboxylic acid esters, in particular acrylic acid esters and / or methacrylic acid esters, unsaturated carboxylic acid anhydrides, in particular maleic anhydride, glycidyl acrylic acid, glycidyl methacrylic acid, α-ethyl acrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, aconitic acid, tetrahydrophthalic acid, butenyl succinic acid and mixtures thereof.

[0107] If the functionalization of the impact modifiers is carried out by copolymerization, the weight proportion of each individual compound used for the functionalization is preferably in the range from 3 to 25% by weight, particularly preferably from 4 to 20% by weight, particularly preferably from 4.5 to 15% by weight, in each case based on the total weight of the functionalized impact modifier S.

[0108] If the impact modifiers are functionalized by grafting, the weight proportion of each individual compound used for functionalization is preferably in the range from 0.3 to 2.5% by weight, particularly preferably from 0.4 to 2.0% by weight and particularly preferably from 0.5 to 1.9% by weight, in each case based on the total weight of the functionalized impact modifier S.

[0109] The impact strength modifiers preferably selected are polyolefins or polyolefin copolymers from the group consisting of polyethylene, polypropylene, polybutylene, ethylene-α-olefin copolymers, propylene-α-olefin copolymers, ethylene-propylene copolymers, ethylene-propylene-diene copolymers and mixtures thereof, the α-olefins preferably having 3 to 18 carbon atoms. The α-olefins are particularly preferably selected from the group consisting of propene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene and mixtures thereof. Among the ethylene-α-olefin copolymers, ethylene-propylene copolymers, ethylene-1-butene copolymers, ethylene-propylene-1-butene copolymers are preferred.

[0110] The styrene copolymer is preferably a styrene copolymer having a comonomer selected from the group consisting of butadiene, isoprene, acrylates and mixtures thereof. The styrene block copolymer is preferably selected from the group consisting of styrene-butadiene-styrene triblock copolymer (SBS), styrene-isoprene-styrene triblock copolymer (SIS), styrene-ethylene / butylene-styrene triblock copolymer (SEBS), styrene-ethylene / polypropylene-styrene triblock copolymer (SEPS) and mixtures thereof.

[0111] Styrene-ethylene / butylene-styrene triblock copolymers are linear triblock copolymers consisting of one ethylene / butylene block and two styrene blocks.Styrene-ethylene / propylene-styrene triblock copolymers are linear triblock copolymers consisting of one ethylene / propylene block and two styrene blocks.

[0112] The styrene content in the styrene-ethylene / butylene-styrene triblock copolymer or the styrene-ethylene / polypropylene-styrene triblock copolymer is preferably 20 to 45% by weight, more preferably 25 to 40% by weight, and most preferably 25 to 35% by weight.

[0113] The ionic ethylene copolymer is preferably composed of monomers selected from the group consisting of ethylene, propylene, butylene, acrylic acid, acrylates, methacrylic acid, methacrylates and mixtures thereof, the acid groups of which are partially neutralized with metal ions, particularly preferred are ethylene-methacrylic acid copolymers or ethylene-methacrylic acid-acrylate copolymers in which the acid groups are partially neutralized with metal ions. The metal ions used for neutralization are preferably sodium, zinc, potassium, lithium, magnesium ions and mixtures thereof, particularly preferred are sodium, zinc and magnesium ions.

[0114] Furthermore, the present invention comprises molded parts made from the polyamide X or polyamide molding compound FM according to the invention or comprising at least one region or coating of polyamide X or polyamide molding compound FM, preferably produced by injection molding, injection blow molding, injection compression molding, pultrusion, melt spinning, extrusion or blow molding.

[0115] Preferably, these moulded parts are fibres, films, profiles, tubes, containers, semi-finished products, finished parts or hollow parts, housings, housing parts, frames, protective housings, covers or cladding elements, in particular electrical products, electronic equipment, electro-optical devices, electro-optical components, connectors, fans, in particular fan wheels, office automation equipment, household appliances, parts for the automotive sector, in particular cylinder head covers, engine covers, housings for intercoolers, flaps for intercoolers, suction pipes, suction manifolds, connectors, gear wheels, fan wheels, intercoolers, headlamp housings, reflectors. connectors, adaptive headlight regulators, gear wheels, plug connections, connectors, including those for petrol, diesel, urea and compressed air lines, parts for electric vehicles, profiles, foils or layers of multilayer foils, electronic components, housings for electronic components, tools, nozzles and pipe fittings for connecting hoses or tubes, electric or electronic components, circuit boards, parts of circuit boards, housing parts, films, circuits in particular in the form of switches, distributors, relays, resistors, capacitors, coils, lamps, diodes, LEDs, transistors, connectors, regulators, memories and / or sensors.

[0116] Finally, the invention also comprises the use of a polyamide X according to any one of claims 1 to 8 or a polyamide moulding compound FM according to any one of claims 10 to 12 for the production of the aforementioned moulded parts, in particular in the form of fibres, films, profiles, tubes, containers, semi-finished products, finished parts or hollow parts, and for coating moulded parts. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0117] Measurement method: Relative viscosity (solution viscosity η rel ) The relative viscosity was measured at 20 °C according to ISO 307 (2007). For this purpose, 0.5 g of polymer granules were dissolved in 100 ml of m-cresol. The calculation of the relative viscosity (RV) according to RV = t / t0 was based on section 11 of the standard.

[0118] Melting point Tm and fusion enthalpy ΔHm The melting point and enthalpy of fusion of the granules were determined according to ISO 11357-3 (2013). DSC (differential scanning calorimetry) measurements were performed at a heating rate of 20 K / min.

[0119] Glass transition temperature Tg The glass transition temperature Tg was determined on the granules using differential scanning calorimetry (DSC) according to ISO 11357-2 (2013). After the second heating, the specimens were quenched in dry ice. The glass transition temperature (Tg) was determined during the third heating, which was performed at a heating rate of 20 K / min. The "half-height" method was used to determine the center of the glass transition region, which was identified as the glass transition temperature.

[0120] End groups (amino and carboxy end groups) The amino (NH2) and acid (COOH) end group concentrations are determined by potentiometric titration. For amino end groups, 0.2-1.0 g of polyamide is dissolved in a mixture of 50 ml of m-cresol and 25 ml of isopropanol at 50-90 ° C and titrated with 0.05 molar perchloric acid solution after addition of aminocaproic acid. To determine COOH end groups, 0.2-1.0 g of the test piece to be determined is dissolved in benzyl alcohol or a mixture of o-cresol and benzyl alcohol at 100 ° C depending on the solubility and titrated with 0.1 molar tetra-n-butylammonium hydroxide solution after addition of benzoic acid.

[0121] Number-average and weight-average molar masses (Mn, Mw) The number-average and weight-average molar masses of the polyamides were determined by gel permeation chromatography (GPC) using a universal poly(methyl methacrylate) calibration. GPC analysis was performed by dissolving 2-4 mg of polyamide granules in 1 ml of hexafluoroisopropanol (HFIP) and passing the solution through an Agilent 1260 Infinity II high-temperature GPC system equipped with a triple detector (refractive index detector, viscometer and light scattering detector). Measurements were performed using a PL HFIP gel (9 μm particle size) two-column system under the following measurement conditions: column temperature 40 °C, HFIP containing 20 mmol of sodium trifluoroacetate as solvent, flow rate 1 ml / min, injection volume 100 μl.

[0122] Preparation of test specimens and UL 94 testing (flame retardant classification) Flammability was tested on 127 x 12.7 x 0.5 mm specimens by longitudinal flame test according to UL-94 VB in accordance with IEC 60695-11-10. Specimens were prepared using a compression molding process (Lindenberg heated press, 320-330 °C). Specimens were conditioned for 48 h in a standard climate of 23 °C and 50% relative humidity prior to the flame test. EXAMPLES

[0123] The polyamides PA-1-NK, PA-2-NK, PA-3-NK and PA-4-NK were polycondensed in two steps: first, a low molecular weight precondensate (VK) was produced from diamines and dicarboxylic acids in the presence of water, which was then converted to a high molecular weight polyamide (NK) by postcondensation of the solid phase and molten material, alone or in a mixture with another precondensate.

[0124] Examples PA-1-VK to PA-4-VK The diamine (component A) and the dicarboxylic acid (components B, C, E) were charged into a 200 ml autoclave with 15% by weight of water relative to the total batch, the individual quantities being selected according to the composition shown in Table 1 so as to obtain a total batch of approximately 100 g. The batch was heated to a temperature of 260° C. and then maintained at this temperature for 2.5 hours during the pressure stage. The low molecular weight polycondensate formed was then removed from the autoclave with steam through an opening. The precondensate was dried at 110° C. and 30 mbar vacuum for 24 hours before being subjected to postcondensation.

[0125] Examples PA-1-NK to PA-4-NK For examples PA-1-NK, PA-2-NK and PA-3-NK, the respective precondensates alone (PA-1-VK, PA-2-VK, PA-3-VK) and for example PA-4-NK, a mixture of two polyamide precondensates (PA-4-VK and PA-5-VK in a weight ratio of 1:1) were post-condensed in two stages as described below.

[0126] In a first stage, the precondensate was postcondensed in the solid phase in a Binder VDL53 vacuum oven at 200 °C and 30 mbar for a period of 24-120 h, and then further polycondensed in a microcompounder (Xplore MC 15HT) at 300-330 °C in a second stage. The microextruder is equipped with two valves and a heating channel that allows the material to be fed back to the top end of the microextruder. Despite the short screw length, residence times of several minutes can be achieved thanks to this closed-loop operation. The average residence time in the examples was 5 min, the screw speed was 50 rpm, the screw torque was 40 Nm, the cylinder temperature was 330 °C and the temperature of the extruded melt was 322 °C. The polyamide was transferred to a metal tank and cooled to ambient temperature in an air atmosphere. The polymer test specimens were then granulated (Hellweg M50 / 80) and the granules were dried at 110 °C under reduced pressure (30 mbar) for 24 h. [Table 1]

Claims

1. A polyamide X comprising polyamide units AB / AC / AE / DB / DC / DE / F, wherein in addition to the polyamide unit AC, at least one further polyamide unit is selected from the group consisting of polyamide units AB, AE, DB, DC, DE and F, and the monomer units A, B, C, D, E and F are the following molecules present in amide-bonded form in the polyamide X: A: an aliphatic diamine; B: an aromatic phosphorus-containing dicarboxylic acid; C: a phosphorus-containing aromatic dicarboxylic acid according to formula 1, 2 and / or 3, wherein each of the substituents R1, R2 is independently C1-C8-alkyl or aryl, and each of the substituents R3, R4, R5 is independently H, alkyl, aryl, F, Cl, Br or P(R1)(R2)O; 【Chemical 1】 D: a diamine having an aromatic structural unit; E: an aliphatic dicarboxylic acid F: an α,ω-aminocarboxylic acid, lactam characterized in that it is derived from. Polyamide X.

2. Based on the sum of each of the polyamide unit AC and the at least one further polyamide unit, the content of the polyamide unit AC is 1 to 99 mol%, preferably 10 to 90 mol%, more preferably 10 to 60 mol%, The polyamide according to claim 1, characterized in that the content of the at least one further polyamide unit is 1 to 99 mol%, preferably 10 to 90 mol%, more preferably 40 to 90 mol%.

3. At least one of the following selection groups is selected for components A to F, preferably the selection group for components A, B and C or A, B, C and E is selected, particularly preferably all the selection groups are selected simultaneously, a polyamide characterized in that A: the aliphatic diamine is selected from the group consisting of 1,6-hexanediamine, 1,8-octanediamine, 2-methyl-1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,12-dodecanediamine, 1,3-diaminocyclohexane, 1,4-diaminocyclohexanediamine, isophoronediamine, 1,3-bis-(aminomethyl)cyclohexane, 1,4-bis-(aminomethyl)cyclohexane, preferably selected as 1,6-hexanediamine or 1,10-decanediamine; B: the aromatic phosphorus-free dicarboxylic acid is selected from the group consisting of terephthalic acid, isophthalic acid, and mixtures thereof; C: the phosphorus-containing aromatic dicarboxylic acid is selected from the group consisting of 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyl-dimethylphosphine oxide, 3,5-dicarboxyphenyldiethylphosphine oxide, 2,4-dicarboxy-phenyldiphenylphosphine oxide, 2,4-dicarboxyphenyldimethylphosphine oxide, 2,4-dicarboxyphenyldiethylphosphine oxide, preferably selected from 3,5-dicarboxyphenyldiphenylphosphine oxide, 3,5-dicarboxyphenyl-dimethylphosphine oxide or 3,5-dicarboxyphenyldiethylphosphine oxide, more preferably selected from 3,5-dicarboxyphenyldiphenylphosphine oxide; D: the diamine having the aromatic structural unit is selected from the group consisting of m-xylylenediamine, p-xylylenediamine, and mixtures thereof; E: the aliphatic dicarboxylic acid is selected from the group consisting of adipic acid, 1,10-decanedioic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1,16-hexadecanedioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid, and mixtures thereof; F: the α,ω-aminocarboxylic acid or lactam F is selected from the group consisting of α,ω-aminoundecanoic acid, caprolactam, laurin lactam, and mixtures thereof, the polyamide according to claim 1.

4. The at least one additional polyamide unit is selected from the group of AB, AE, and F, and based on the total of the polyamide units AB, AC, AE, and F respectively, the content of the polyamide unit AC is 1 to 99 mol%, preferably 10 to 90 mol%, particularly preferably 10 to 60 mol%, and the total content of the polyamide units AB, AE, and F is 1 to 99 mol%, preferably 10 to 90 mol%, particularly preferably 40 to 90 mol%, the polyamide according to claim 1.

5. The polyamide according to claim 1, wherein the aromatic dicarboxylic acid B is selected from the group consisting of terephthalic acid or a mixture of terephthalic acid and isophthalic acid.

6. The polyamide unit AB is selected from the group consisting of polyamide units 6I, 6T, 8I, 8T, 9I, 9T, 10I, 10T, 12I, 12T, 6T / 6I, 9T / 9I, 10T / 10I, 12T / 12I, 6T / 10T, 6T / 9T, 6T / 8T, BACI, BACT, BACT / BACI, BACT / 6T, BACT / 10T; or the polyamide unit AB is a1 Polyamide unit AB derived from terephthalic acid combined with 60 to 100 parts by weight, preferably 55 to 85 parts by weight, particularly preferably 60 to 80 parts by weight of hexamethylenediamine, 1,3-bis(aminomethyl)cyclohexane and / or 1,10-decanediamine; a2 Polyamide unit AB derived from isophthalic acid combined with 0 to 40 parts by weight, preferably 15 to 45 parts by weight, more preferably 20 to 40 parts by weight of hexamethylenediamine, 1,3-bis(aminomethyl)cyclohexane and / or 1,10-decanediamine, characterized in that the total parts by weight of components a1 and a2 account for 100 parts by weight, and / or the polyamide unit AE is selected from the group consisting of polyamide units 66, 610, 611, 612, 614, 616, 618, 106, 1010, 1011, 1012, 1014, 1016, 1018, BAC6, BAC10, BAC11, BAC12, BAC14, BAC16, the polyamide according to claim 1.

7. The polyamide X consists only of the polyamide units AB, AC and AE, preferably consisting only of the polyamide units AB and AC or AC and AE, the polyamide according to claim 1.

8. The polyamide X in the form of a prepolymer has a solution viscosity η in the range of 1.08 to 1.39, particularly preferably in the range of 1.10 to 1.35, especially in the range of 1.12 to 1.30, determined using a solution of 0.5 g of polymer granules in 100 ml of m-cresol at 20 °C in accordance with ISO 307:2007 ｒｅｌ and / or The high molecular weight or post-condensed form of said polyamide X has a solution viscosity η in the range of 1.40 to 2.50, particularly preferably in the range of 1.45 to 2.20, especially 1.50 to 2.00, determined using a solution of 0.5 g of polymer granules in 100 ml of m-cresol at 20 °C in accordance with ISO 307:2007 ｒｅｌ and has and / or the polyamide X has a flame retardant classification V0 determined according to UL94 in test pieces of dimensions 127x12.7x0.35 mm, 127x12.7x0.5 mm, 127x12.7x0.75 mm, 127x12.7x1.5 mm, and 127x12.7x3.0 mm that have been pre-conditioned at 23°C in a standard climate of 50% relative humidity for 48 hours or stored in a convection oven at 70°C for 7 days, characterized in that The polyamide according to claim 1.

9. A method for producing the polyamide according to claim 1, comprising polycondensing between at least one aromatic dicarboxylic acid B and / or one aliphatic dicarboxylic acid E, at least one phosphorus-containing aromatic dicarboxylic acid C according to formula 1 and / or formula 2, wherein the substituents R1 and R2 are each independently C1-C8-alkyl or aryl, and the substituents R3, R4, and R5 are each independently H, alkyl, aryl, F, Cl, Br, or P(R1)(R2)O, at least one aliphatic diamine A, and optionally further monomers D and F, probably in the presence of a monofunctional regulator G and / or a process aid.

10. A polyamide molding compound FM comprising the polyamide X according to claim 1, and at least one filler and / or at least one additive, and / or at least one polyamide Y other than polyamide X.

11. The following components: 25 to 99.99% by weight of polyamide X 0 to 70% by weight of at least one filler T; 0.01 to 50% by weight of at least one additive S other than X and T; characterized by containing or preferably consisting of these, wherein the components S, T, and X together amount to 100% by weight, the polyamide molding compound FM according to claim 10.

12. The polyamide molding compound FM according to claim 10, comprising the following components: 25 to 100% by weight of a polymer mixture P, 20 to 80% by weight of polyamide X and 20 to 80% by weight of a polyamide Y different from polyamide X, preferably selected from the group consisting of polyamide 6, polyamide 66, polyamide 610, polyamide 612, polyamide 614, polyamide 616, polyamide 1010, polyamide 1012, polyamide 1014, polyamide 1016, polyamide 11, polyamide 12, polyamide 6 / 12, polyamide 6I, polyamide 9T, polyamide 10T, polyamide 6T / 6I, polyamide 6T / 66, polyamide 6T / 10T, or mixtures thereof, containing or preferably including these, wherein the total of X and Y is 100% by weight of the polymer mixture P; 0 to 70% by weight of at least one filler T; 0 to 50% by weight of at least one additive S other than X, Y, and T; characterized by containing or preferably consisting of these, and the component P, S, and T together amount to 100% by weight, polyamide molding compound FM.

13. A molded part comprising at least one region or coating of the polyamide X according to claim 1, preferably produced by injection molding, injection blow molding, injection compression molding, draw molding, melt spinning, extrusion, or blow molding.

14. A molded part comprising at least one region or coating of the polyamide molding compound according to claim 10, preferably produced by injection molding, injection blow molding, injection compression molding, draw molding, melt spinning, extrusion, or blow molding.

15. Fibers, films, profiles, tubes, containers, semi-finished products, finished parts or hollow parts, housings, housing parts, frames, protective housings, covers or cladding elements, especially for electrical products, electronic devices, electro-optical devices, electro-optical components, connectors, fans, especially fan wheels, office automation devices, household appliances, parts for the automotive sector, especially cylinder head covers, engine covers, housings for intercoolers, flaps for intercoolers, suction pipes, suction manifolds, connectors, gear wheels, fan wheels, intercoolers, headlamp housings, reflectors, adaptive headlamp adjustment devices, gear wheels, plug connections, connectors, for gasoline, diesel, urea, and compressed air lines, parts for electric vehicles, profiles, films or layers of multilayer films, electronic components, housings for electronic components, tools, nozzles, and pipe fittings for connecting hoses or tubes, electrical or electronic components, circuit boards, parts of circuit boards, housing parts, films, especially in the form of switches, distributors, relays, resistors, capacitors, coils, lamps, diodes, LEDs, transistors, connectors, regulators, memories, and / or sensors, characterized in being selected from the group consisting of, the molded part according to claim 13 or 14.

16. Use of the polyamide X according to claim 1 for producing the molded part according to claim 13, especially for fibers, films, profiles, tubes, containers, semi-finished products, finished parts or hollow parts, and for coating the molded part. Use of the polyamide molding compound FM according to claim 10 for producing the molded parts according to claim 14, in particular fibers, films, profiled materials, tubes, containers, semi-finished products, finished parts or hollow parts, and for coating the molded parts.

Images