Next, the system
JP2024545807A5Pending Publication Date: 2025-11-05DDP SPECIALTY ELECTRONICS MATERIALS US LLC +1
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Patent Information
- Application Number
- JP2024527566
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-11-11
- Filing Date
- 2022-11-10
- Publication Date
- 2025-11-05
Abstract
Provided herein is a method for debonding bonded substrates.
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