Manufacturing method of printed wiring board

Abstract

To provide a manufacturing method for manufacturing a printed wiring board of which the productivity is high and the production cost is low.SOLUTION: A manufacturing method of a printed wiring board includes: forming a resin insulation layer 150U on a core substrate 30; forming a pad 158p for loading an electronic component 90 on the resin insulation layer 150U; forming a solder resist layer 70U including an opening 71U for exposing the pad 158p on the resin insulation layer 150U and the pad 158U; forming a solder bump 76U on the pad 158p which is exposed by the opening 71U; forming a dam 102 for preventing an underfill material 100 from flowing on the solder resist layer 70U; loading the electronic component 90 on the solder bump 76U after forming the dam 102; and filling a gap between the electronic component 90 and the solder resist layer 70U with the underfill material 100. The dam 102 is formed by discharging a dam material.SELECTED DRAWING: Figure 1

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