Game machine

Abstract

To provide a game machine capable of enhancing heat radiation performance while suppressing deterioration in fitting strength of a heat generation component.SOLUTION: A base plate 43 on which an LED driver (heat generation component) 75 and LEDs 72, 73, etc. are mounted is disposed between a first member and a second member. In the base plate 43, the LED driver 75 is disposed on a first surface side opposed to the first member, and the LEDs 72, 73, etc. are disposed on a second surface side opposed to the second member respectively. A distance between the second member and the base plate 43 is made greater than a distance between the first member and the base plate 43. In the LED driver 75, a conductor part 151 on the reverse surface side is bonded to a solid ground pattern (copper foil part) 136 on the first surface side. On the base plate 43, a predetermined number of through holes 140a in which copper foil is applied to the inner surface are provided in a region corresponding to the conductor part 151 of the LED driver 75. The plate thickness of the base plate 43, and the diameter and the predetermined number of the through holes 140a are set so that the surface area of the internal surface of the through hole 140a is greater than a hole area of the through hole 140a.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to gaming machines such as pachinko machines and slot machines. [Background technology]

[0002] In various gaming machines such as pachinko machines, various boards including a control board such as a main control board are mounted. Some of these boards are equipped with heat-generating components such as an LED board with an LED driver (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-80581 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a board on which such heat-generating components are mounted, it is necessary to increase the surface area by appropriately arranging through-holes, etc., to efficiently dissipate heat. Here, in order to efficiently dissipate heat, it is conceivable to arrange the through-holes within the adhesive region for fixing the heat-generating components to the board, but in this case, the adhesive area is reduced by the hole area of ​​the through-hole, which reduces the attachment strength of the heat-generating components. The present invention has been made in consideration of the above circumstances, and has an object to provide an amusement machine that can improve heat dissipation while suppressing a decrease in the mounting strength of heat-generating components. [Means for solving the problem]

[0005] The present invention relates to an amusement machine in which a substrate having a heat generating component and an LED mounted thereon is disposed between a first member and a second member, and the substrate is provided with a plurality of types of vias for conducting between different wiring layers, the plurality of types of vias including signal conducting vias for conducting a signal wiring path and power conducting vias for conducting a power wiring path, the diameter of the power conducting vias being larger than the diameter of the signal conducting vias, the substrate is provided with the heat generating component on a first surface side facing the first member and the LED on a second surface side facing the second member, and a bonding between the second member and the substrate is provided. the distance between the first member and the substrate is greater than the distance between the first member and the substrate, the heat-generating component has a conductor portion on the back surface of the heat-generating component bonded to the copper foil portion on the first surface side, the substrate has a predetermined number of through holes with copper foil on their inner surfaces in an area corresponding to the conductor portion of the heat-generating component, the thickness of the substrate, the diameter of the through holes and the predetermined number are set so that the surface area of ​​the inner surface of the through holes is greater than the aperture area of ​​the through holes, and the diameter of the through holes is approximately the same as the diameter of the power supply conduction vias. Effect of the Invention

[0006] According to the present invention, it is possible to improve heat dissipation while suppressing a decrease in the mounting strength of the heat-generating component. [Brief description of the drawings]

[0007] [Figure 1] 1 is an overall front view of a pachinko machine according to one embodiment of the present invention. [Diagram 2] 2 is a back view of the front door of the pachinko machine and a front view of the inner frame. [Diagram 3] This is a diagram showing the arrangement of LED boards, etc. on the front door of the pachinko machine. [Figure 4] This is a wiring diagram for the third LED board of the same pachinko machine. [Diagram 5] FIG. 11 is a diagram showing the wiring patterns of each wiring layer in the third LED substrate of the pachinko machine. [Figure 6] 13 is a side cross-sectional view of the third LED board and its surroundings of the pachinko machine. FIG. [Figure 7] FIG. 2 is a partially enlarged view of the wiring pattern on the third LED board of the pachinko machine. [Figure 8] 13A and 13B are a front view and a side cross-sectional view of the LED driver mounting portion on the third LED board of the pachinko machine. [Figure 9] This figure shows various setting values ​​related to the LED driver mounting portion on the third LED board of the pachinko machine and various calculation values ​​based on those values. [Figure 10] 13 is a diagram showing the shape of a recess in a third LED board of the pachinko machine and the wiring pattern in the vicinity of the recess. FIG. [Figure 11] 13 is a diagram showing the state of the third LED board of the pachinko machine before being separated from the discarded board. FIG. BEST MODE FOR CARRYING OUT THEINVENTION

[0008] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Figures 1 to 11 show an embodiment in which the present invention is applied to a pachinko machine. In Figures 1 and 2, a gaming machine main body 1 has a rectangular outer frame 2 and an inner frame 4 pivotally attached to the front of the outer frame 2 by a hinge 3 on one of the left and right sides, for example the left side, so as to be freely opened and closed.

[0009] On the front side of the inner frame 4, a game board mounting frame 6 for mounting a game board 5 is arranged on its upper side, and a launching means 7, a lower speaker 10, etc. are arranged on the lower side, and a front door 8 covering the front sides of these is pivotally attached so as to be freely opened and closed by a hinge 9 on the same side as the hinge 3.

[0010] 2, the launching means 7 includes a support plate 11 made of sheet metal, a launching rail 12 attached to the front of the support plate 11, a ball holding section 13 attached to the front of the support plate 11 and holding the game balls to be launched on the launching rail 12, a striking hammer 15 supported on the front of the support plate 11 so as to be swingable around a drive shaft 14 in the front-rear direction, and a launching drive means 16 such as a rotary solenoid attached to the back side of the support plate 11 and driving the striking hammer 15 in the striking direction via the drive shaft 14. When the launch handle 17 on the front door 8 side is operated, the launching drive means 16 continuously drives the striking hammer 15 in the striking direction (clockwise) according to the amount of operation. As a result, the game balls supplied one by one on the launching rail 12 are launched along the launching rail 12 toward the play area 5a of the game board 5.

[0011] The game board 5 is attached to the game board mounting frame 6, for example from the front side, and is fixed so as to be freely attached and detached by one or more fixing devices 18. A guide rail 21 for guiding the game ball launched by the launching means 7 is attached in a ring shape to the front side, and various game components such as a central display unit 22, a normal pattern starting means 23, a special pattern starting means 24, a big prize means 25, a normal prize means 26, etc. are arranged in the game area 5a inside the guide rail 21.

[0012] The central display unit 22 is provided with an image display means 27 such as a liquid crystal type, as well as a normal symbol display means 28, a special symbol display means 29, a normal reserved number display means 30, etc. The image display means 27 constitutes a performance symbol display means 31, a special reserved number display means 32, etc.

[0013] The normal pattern display means 28 is composed of two light-emitting elements (e.g., LEDs) corresponding to two types of normal patterns, for example, "○" and "X". When the normal pattern starting means 23, consisting of a passing gate or the like, detects a gaming ball, the two light-emitting elements flash alternately for a predetermined period of time. When the winning judgment random number value contained in the normal random number information acquired when the normal pattern starting means 23 detects the gaming ball matches a predetermined winning judgment value, the light-emitting element on the "○" side corresponding to the winning state lights up, and otherwise the light-emitting element on the "X" side corresponding to the losing state lights up, and the flashing ends.

[0014] The normal random number information acquired when the normal symbol starting means 23 detects a game ball is reserved and stored up to a predetermined upper limit of reserved number, for example, 4 pieces, and each time a normal symbol can be changed, one piece is consumed and the normal symbol is changed. The number of stored normal random number information (hereinafter, normal reserved number) is notified to the player by, for example, the number of light-emitting elements by the normal reserved number display means 30, which has the same number of light-emitting elements as the upper limit of reserved number.

[0015] The special symbol start means 24 is for starting the symbol variation by the special symbol display means 29, and is provided with, for example, two upper and lower start winning means 24a, 24b, and is disposed below the central display unit 22. The upper start winning means 24a is a non-opening / closing type winning means that does not have an opening / closing means or the like. The lower start winning means 24b is an opening / closing type winning means that can be switched by the opening / closing means 33 between a closed state in which the game ball cannot enter (or is difficult to enter) and an open state in which the game ball can enter (or is easier to enter than in the closed state), and is opened from the closed state to the open state for a predetermined time when the stopped symbol after the variation of the normal symbol display means 28 becomes a winning state and a normal profit state occurs.

[0016] The special pattern display means 29 is composed of a display means such as a 7-segment type capable of variably displaying one or more special patterns, for example one special pattern, and variably displays the special pattern for a predetermined period of time on the condition that the special pattern starting means 24 detects a game ball, i.e., the game ball enters either of the two upper and lower starting winning means 24a, 24b, and if the jackpot determination random number value contained in the special random number information obtained when the ball enters the starting winning means 24a, 24b matches a predetermined jackpot determination value, it stops in a predetermined jackpot mode (specific mode), and in other cases it stops in, for example, a miss mode.

[0017] The special random number information acquired when the special symbol starting means 24 detects a game ball is stored up to a predetermined upper limit of reserved numbers, for example, four, and each time the special symbol display means 29 becomes capable of changing the pattern, one is consumed to change the special symbol. The number of stored special random number information (hereinafter, special reserved number) is notified to the player by the special reserved number display means 32, for example, by the number of reserved display images X displayed.

[0018] The performance pattern display means 31 displays the performance patterns in a changing manner in parallel with the changing display of the special patterns by the special pattern display means 29, and is configured to be able to change and display one or more performance patterns, for example three performance patterns in the left and right direction, on the display screen 27a of the image display means 27 together with various performance images, and when the special pattern start means 24 detects a game ball, that is, when the game ball wins in either of the two upper and lower start winning means 24a, 24b, it starts changing the performance patterns according to one of a plurality of types of change patterns approximately simultaneously with the start of the special pattern change, and stops the performance patterns in a predetermined order such as left, right, center, etc., so that they finally stop approximately simultaneously with the stop of the special pattern change.

[0019] The big winning means 25 is an opening / closing type winning means equipped with an opening / closing plate 25a that can be switched between an open state where the game ball can enter and a closed state where the game ball cannot enter, and when the special pattern after the change in the special pattern display means 29 becomes a big win state and a special profit state occurs, the opening / closing plate 25a opens forward according to a predetermined opening pattern, allowing the game ball that falls onto it to enter the winning state.

[0020] The front door 8 is provided with a door base 35 made of, for example, resin, in which a window hole 34 corresponding to the front side of the game area 5a is formed. In the door base 35, for example, a pair of upper first speakers 36a, 36b and an air blowing effect means 37 are arranged near the upper side of the window hole 34, and a pair of upper second speakers 38a, 38b are arranged near the lower side of the window hole 34. The air blowing effect means 37 is for performing an air blowing effect of blowing air toward a player sitting in front of the gaming machine main body 1, and includes an air blowing means 37a such as a sirocco fan operated by a motor (drive means), and is arranged adjacent to the right upper first speaker 36b on the upper right end side of the door base 35 so that the air blowing port 37b faces diagonally downward and forward.

[0021] 3, a plurality of (six in this example) LED boards 41-46 are arranged around the window hole 34 on the front side of the door base 35. That is, the first LED board 41 is arranged at the lower left of the window hole 34, the second LED board 42 is arranged at the upper left of the window hole 34, the third LED board 43 is arranged at approximately the center in the left-right direction on the upper side of the window hole 34, the fourth LED board 44 is arranged at the lower right of the window hole 34, the fifth LED board 45 is arranged above it, and the sixth LED board 46 is arranged near the air blowing performance means 37 at the upper right part of the window hole 34.

[0022] The first LED board 41 and the second LED board 42 are arranged along the window hole 34 between the left upper second speaker 38a and the upper first speaker 36a, and the third LED board 43 is arranged between the left and right upper first speakers 36a, 36b. The fourth LED board 44 and the fifth LED board 45 are arranged along the window hole 34 between the right upper second speaker 38b and the air blowing performance means 37, and the sixth LED board 46 is arranged, for example, on the outer periphery of the air blowing port 37b of the air blowing performance means 37.

[0023] As shown in Figure 1, an upper tray 47 for storing game balls to be supplied to the launching means 7 is located on the lower front side of the door base 35, for example toward the left, and further below the upper tray 47, a lower tray 48 for storing surplus balls when the upper tray 47 is full is located on the left end, and a launch handle 17 is located on the right end.

[0024] Additionally, an upper decorative cover 49 that substantially covers the periphery of the window hole 34 from the front side, and a lower decorative cover 50 that substantially covers the upper tray 47, the lower tray 48, etc. from the front side are attached to the front side of the door base 35. At least the portion of the upper decorative cover 49 that corresponds to the front sides of the first to sixth LED boards 41 to 46 is a light-emitting lens portion having translucency. On the lower decorative cover 50, a performance button 51 that can be operated by the player is disposed approximately in the center in the left-right direction on the front side of the upper tray 47, and a ball lending operation unit 52 is disposed to the side of the button.

[0025] 2, a glass unit 53 that substantially covers the window hole 34 from the rear side is detachably attached to the rear side of the door base 35, and a ball feeding means 54, a lower tray guide means 55, a front door relay board 56, etc. are arranged below the glass unit 53. The ball feeding means 54 supplies the game balls in the upper tray 47 one by one onto the launching rail 12, and is arranged corresponding to the front side of the launching means 7, and operates in synchronization with the launching operation by the launching means 7. The lower tray guide means 55 guides surplus balls when the upper tray 47 is full and foul balls that have been launched by the launching means 7 but have returned without reaching the game area 5a to the lower tray 48, and is arranged, for example, adjacent to the ball feeding means 54 on the hinge 9 side. In addition, the front door relay board 56 serves as a relay between the performance control board etc. arranged on the back side of the game board 5 and various performance means such as the first to sixth LED boards 41 to 46 on the front door 8 side, speakers 10, 36a, 36b, 38a, 38b, and air blowing performance means 37, and is arranged between the door base 35 and the lower tray guide means 55 behind it.

[0026] Next, among the various game components provided on the front door 8, particularly the wiring relating to the first to sixth LED boards 41 to 46, the upper first speakers 36a, 36b, the upper second speakers 38a, 38b, and the air blowing effect means 37 will be described.

[0027] As shown in Fig. 3, the wiring paths of the first to sixth LED boards 41 to 46 branch out to the left and right along the window hole 34 from a front door relay board 56 arranged on the lower side of the front door 8, with the first to third LED boards 41 to 43 forming a left wiring path 57 on the left side of the window hole 34, and the fourth to sixth LED boards 44 to 46 forming a right wiring path 58 on the right side of the window hole 34. In addition, the drive wiring paths of the upper first speakers 36a and 36b are provided on the left wiring path 57, and the drive wiring path of the air blowing performance means 37 is provided on the right wiring path 58. The upper second speakers 38a and 38b are independent from the left and right wiring paths 57 and 58, and are connected from the front door relay board 56 via harnesses 59a and 59b.

[0028] The first to third LED boards 41 to 43 constituting the left wiring path 57 are connected in series via harnesses 61 and 62, and the first LED board 41 on the most upstream side is connected to the front door relay board 56 via a harness 60. In the left wiring path 57, a through-path wiring path is provided in the first LED board 41 and the second LED board 42, and a circuit unit including LEDs 71 to 74 arranged on the third LED board 43 and an LED driver 75 that drives them is connected to the downstream side of the through-path wiring path. In addition, the first LED board 41 and the second LED board 42 are also provided with respective circuit units including LEDs 76 to 79, 80 to 83 and LED drivers 84 to 85, 86 to 87 that drive them, and are each connected to a through-path wiring path. In addition, a portion of the drive wiring paths for the upper first speakers 36a, 36b is provided on the first to third LED boards 41-43, and the third LED board 43 on the most downstream side is connected to the upper first speakers 36a, 36b via harnesses 63, 64, respectively.

[0029] The fourth to sixth LED boards 44 to 46 constituting the right wiring path 58 are connected in series via harnesses 66 and 67, and the fourth LED board 44 on the most upstream side is connected to the front door relay board 56 via a harness 65. In the right wiring path 58, a through-path wiring path is provided in the fourth LED board 44 and the fifth LED board 45, and a circuit part including LEDs 91, 92, etc. arranged on the sixth LED board 46 and an LED driver (not shown) for driving them is connected to the downstream side of the through-path wiring path. The fourth LED board 44 is also provided with a circuit part including LEDs 93 to 96 and an LED driver 97 for driving them, and is connected to the through-path wiring path. The fifth LED board 45 is also provided with LEDs 101 to 104, which are driven by the LED driver 97 on the fourth LED board 44. In addition, a part of the drive wiring path of the air blowing effect means 37 is provided on the fourth and fifth LED boards 44 and 45 , and the fifth LED board 45 and the air blowing means 37 a of the air blowing effect means 37 are connected via a harness 68 .

[0030] Next, among the first to sixth LED boards 41 to 46, the third LED board 43 will be taken as an example to describe heat dissipation measures for the LED driver, which is an example of a heat-generating component, and measures against burrs on the board.

[0031] First, a circuit configuration of the third LED board 43 will be described. As shown in Fig. 3 etc., the third LED board 43 includes a horizontally elongated, generally rectangular board body 111 having wiring layers on both the front and rear sides. This board body 111 is provided with an upstream connector 112, a pair of speaker connectors 113, 114, an LED driver 75, LEDs 71 to 74, protective resistors 115, 116, etc., as shown in Fig. 4.

[0032] The upstream connector 112 is connected to the downstream connector on the second LED board 42 side by the harness 62, and has the same terminal configuration as the downstream connector, including an LED power supply terminal 121, an LED driver power supply terminal 122, a signal terminal 123, a clock terminal 124, ground terminals 125a, 125b, and speaker terminals 126a to 126d, with a total of 10 terminals arranged in two rows of, for example, five each. Two terminals on each end of the two rows in the terminal arrangement direction, totaling four terminals, are the speaker terminals 126a to 126d.

[0033] The speaker connectors 113, 114 are connected to the upper first speakers 36a, 36b by harnesses 63, 64. The speaker connector 113 is provided with speaker terminals 131a, 131b, and the speaker connector 114 is provided with speaker terminals 131c, 131d. The speaker terminals 131a, 131b of the speaker connector 113 are connected to the speaker terminals 126a, 126b of the upstream connector 112 via speaker drive wiring paths 132a, 132b, and the speaker terminals 131c, 131d of the speaker connector 114 are connected to the speaker terminals 126c, 126d of the upstream connector 112 via speaker drive wiring paths 132c, 132d.

[0034] 5 shows a specific wiring pattern for each wiring layer of the third LED board 43. In the third LED board 43, the LEDs 71 to 74 and the like are arranged on a first wiring layer 141a (FIG. 5(a)) on the front side, and the upstream connector 112, speaker connectors 113 and 114, an LED driver 75, protective resistors 115 and 116 and the like are arranged on a second wiring layer 141b (FIG. 5(b)) on the rear side.

[0035] The upstream connector 112 is disposed on one of the left and right ends of the second wiring layer 141b so that the terminal arrangement is in the left-right direction, and the speaker connectors 113, 114 are disposed on both the left and right ends of the second wiring layer 141b so that the terminal arrangement is in the up-down direction. Speaker drive wiring paths 132a, 132b are connected to speaker terminals 126a, 126b at one end of the upstream connector 112 from the outside in the terminal arrangement direction (left-right direction here), and speaker drive wiring paths 132c, 132d are connected to speaker terminals 126c, 126d at the other end of the upstream connector 112 from the outside in the terminal arrangement direction (left-right direction here).

[0036] Speaker drive wiring paths 132a, 132b are connected to speaker terminals 131a, 131b of speaker connector 113 from the outside in the terminal arrangement direction (here, the up-down direction), and speaker drive wiring paths 132c, 132d are connected to speaker terminals 131c, 131d of speaker connector 114 from the outside in the terminal arrangement direction (here, the up-down direction). Note that, for example, almost the entire speaker drive wiring paths 132a-132d are provided on the same first wiring layer 141a side as LEDs 71-74, except for predetermined ranges near both end sides, i.e., connection portions to connectors 112-114.

[0037] The LED driver 75 is disposed at approximately the center of the second wiring layer 141b, and protective resistors 115, 116 are disposed on both the left and right sides of the LED driver 75, respectively connected to the RGB terminals of the LED driver 75. The LED driver power supply terminal 122, the signal terminal 123, and the clock terminal 124 of the upstream connector 112 are connected to the LED driver 75 by wiring paths 133-135 for the LED driver power supply, the signal, and the clock. The wiring paths 133-135 for the LED driver power supply, the signal, and the clock are disposed almost entirely on the second wiring layer 141b side, except for a part of a bypass portion that is bypassed to the first wiring layer 141a side through the via 140. The via 140 is a through-hole type via in which copper foil is applied to the inner surface of the through hole.

[0038] The second wiring layer 141b is provided with one or more solid ground patterns 136. The solid ground pattern 136, together with a solid ground pattern 137 on the first wiring layer 141a side, constitutes a ground wiring path 138, and is connected to the ground terminals 125a and 125b of the upstream connector 112 and the ground terminal of the LED driver 75 through, for example, vias 140, the solid ground pattern 137, etc.

[0039] A part of the solid ground pattern 136 is disposed between the LED driver 75 and the substrate body 111. A predetermined number of vias 140 (hereinafter referred to as through holes 140a) connecting the solid ground pattern 136 and the solid ground pattern 137 on the first wiring layer 141a side are disposed within the arrangement area of ​​the LED driver 75.

[0040] The LEDs 71 to 74 are arranged in a zigzag pattern in the longitudinal direction of the first wiring layer 141a, with the left LEDs 71 and 72 and the right LEDs 73 and 74 being connected in series by an inter-LED wiring path 142. The anode electrodes of the LEDs 72 and 73 are connected to the LED power supply terminal 121 of the upstream connector 112 through an LED power supply wiring path 143 that straddles the second wiring layer 141b side through a via 140, and the cathode electrodes of the LEDs 71 and 74 are connected to the protective resistors 115 and 116 through a cathode side wiring path 144 that straddles the second wiring layer 141b side across the via 140.

[0041] As shown in FIG. 6 and other figures, the third LED board 43 is attached to the front side of the door base (first member) 35 with the first wiring layer 141a on which the LEDs 71 to 74 are arranged facing forward, and its front side is covered by the upper decorative cover (second member) 49 that constitutes a light-emitting lens. That is, the front side (second surface) on which the first wiring layer 141a is formed faces the upper decorative cover (second member) 49, and the back side (first surface) on which the second wiring layer 141b is formed faces the door base (first member) 35. The relationship between the distance L1 between the third LED board 43 and the door base (first member) 35 on its rear side and the distance L2 between the third LED board 43 and the upper decorative cover (second member) 49 on its front side is L1. <L2となっている。

[0042] Next, a configuration regarding heat dissipation measures for the LED driver 75 will be described. As shown in FIG. 8, the LED driver (heat-generating component) 75 has a rectangular conductor pad (conductor portion) 151 made of copper foil or other conductor on its back surface, and this conductor pad 151 is fixed to the board body 111 by bonding (soldering) to the solid ground pattern (copper foil portion) 136 on the second wiring layer (first surface) 141b side. In this embodiment, as shown in FIG. 8 and FIG. 9(a), the board body 111 has a thickness T of 1 mm, the conductor pad 151 has a vertical dimension X of 5.3 mm, a horizontal dimension Y of 5.3 mm, and an area S of 28.09 mm2. In addition, the solid ground pattern 137 is arranged on the opposite first wiring layer 141a at least in an area corresponding to the conductor pad (conductor portion) 151 of the LED driver 75 (here, an area including an area corresponding to the LED driver 75, which is a heat-generating component) (FIG. 5(a)).

[0043] Furthermore, in the substrate body 111, a predetermined number of through holes 140a are arranged in a matrix in an area corresponding to the conductor pad 151. The through holes 140a have copper foil applied to their inner surfaces, and the through holes 140a electrically connect the solid ground pattern 136 on the second wiring layer 141b side to the solid ground pattern 137 on the first wiring layer 141a side. In this embodiment, as shown in Fig. 8 and Fig. 9(a), nine through holes 140a having a diameter φ=0.6 mm are arranged in a 3 × 3 matrix at equal intervals vertically and horizontally within the square area of ​​the conductor pad 151, and the hole interval Ls of the through holes 140a is larger than the diameter φ of the through holes 140a (here, 1.2 mm).

[0044] By providing such a through hole 140a in the area corresponding to the conductor pad 151 of the LED driver 75, which is a heat-generating component, heat can be dissipated from the inner surface of the through hole 140a, and heat from the LED driver 75 located on the rear side, which is close in distance (L1) to the opposing surface (door base 35), can be dissipated more efficiently by escaping to the front side, which has a larger distance (L2) to the opposing surface (upper decorative cover 49).

[0045] In addition, the third LED substrate 43 of this embodiment is provided with three types of through holes: a signal conduction via (through hole) for conducting a signal wiring path between different wiring layers, a power supply conduction via (through hole) for conducting a power supply wiring path between different wiring layers, and a heat dissipation through hole mainly for the purpose of heat dissipation. The above-mentioned through hole 140a is a heat dissipation through hole that also serves as a power supply conduction via. In the third LED substrate 43 of this embodiment, as shown in FIG. 7, the relationship between the diameter φ of the heat dissipation through hole such as the through hole 140a, the diameter φ1 of the signal conduction via such as the via 140b, and the diameter φ2 of the power supply conduction via such as the via 140c is φ1<φ≒φ2.

[0046] Here, when the through-hole 140a is provided within the region of the conductor pad 151, the adhesion area of ​​the LED driver 75 to the substrate body 111 is reduced by the hole area of ​​the through-hole 140a, and the adhesive strength is reduced accordingly. On the other hand, since the copper foil is formed on the inner surface of the through-hole 140a, the heat dissipation area is increased by the surface integral of the inner surface, and the amount of heat dissipation is increased. Therefore, the larger the diameter φ of the through-hole 140a, the higher the heat dissipation effect, but on the other hand, the adhesive strength of the LED driver 75 is reduced.

[0047] Therefore, in this embodiment, the thickness T (mm) of the substrate body 111 and the diameter φ and number n of the through holes 140a within the area of ​​the conductor pad 151 are set so that the copper foil increase rate Ri (%), which is the ratio of the surface area S1 of the through hole 140a to the area S of the conductor pad 151, is greater than the porosity Rs (%), which is the ratio of the hole area S2 of the through hole 140a to the area S of the conductor pad 151.

[0048] Specifically, as shown in FIG. 9B, the surface area S1 (mm2) of the inner surface of the through-hole 140a = φπTn = 16.956, the hole area S2 (mm2) of the through-hole 140a = (φ / 2)2πn = 2.543, the porosity Rs (%) = (S2 / S) × 100 = 9.05, and the copper foil increase rate (%) = Ri (%) = (S1 / S) × 100 = 60.36. <Riとなっている。

[0049] This can be rephrased as meaning that the rate of increase in the heat dissipation effect due to the formation of the through-hole 140a is greater than the rate of decrease in the adhesive strength due to the formation of the through-hole 140a. That is, by providing the through-hole 140a, the adhesive strength of the LED driver 75 is somewhat sacrificed, but the heat dissipation effect can be increased even more. In this embodiment, as described above, since the hole pitch Ls of the through-hole 140a is made larger than the diameter φ of the through-hole 140a (Fig. 8(b)), it is possible to secure a certain adhesive strength while providing the through-hole 140a.

[0050] Here, the fact that Rs < Ri means that, that is, S1 > S2. Therefore, as shown in Fig. 9(b), the net increase Sni (mm2) in the copper foil area due to the formation of the through-hole 140a = S1 - S2 = 14.413, that is, Sni > 0.

[0051] Also in this embodiment, as shown in Fig. 9(b), the total copper foil area Sa (mm2) = S + Sni = 42.503, and the copper foil net increase rate Rni (%) = (Sa / S) × 100 = 151.31.

[0052] Subsequently, countermeasures against burrs on the third LED substrate 43 will be described. As shown in Fig. 5, one or more, here four, recesses 161 are formed on the outer periphery of the third LED substrate 43. As shown in Fig. 10, burrs 162 formed by separating the substrate body 111 from the scrap substrate 163 (Fig. 11) remain in the recesses 161. The depth of the recess 161 (hereinafter referred to as the recess depth D) is greater than the protruding length of the burr 162 (hereinafter referred to as the burr length L). In this way, by allowing the burr 162 to remain in the recess 161 and setting D > L, the burr 162 will not protrude outside the outer edge of the substrate body 111 without deburring, and it becomes possible to simplify the manufacturing process by omitting the deburring process.

[0053] 11 shows a state before the substrate body 111 of the third LED substrate 43 is separated from the sacrificial substrate (adjacent portion) 163. A slit 164 of a substantially constant width (hereinafter referred to as slit width W) is formed between the substrate body 111 and the sacrificial substrate 163. The slit 164 is composed of a bent slit portion 164a that forms the recess 161, and a general slit portion 164b that forms the outer shape of the substrate body 111 excluding the recess 161.

[0054] The bent slit portion 164a is formed by a pair of bent portions 165, 165 that bend from the general slit portion 164b toward the substrate body 111, and an intermediate portion 166 formed between the pair of bent portions 165, 165. The intermediate portion 166 is formed in a substantially straight line and is missing at one or more locations (two locations in this case), and the missing portions serve as a connecting portion 167 that connects the substrate body 111 and the discarded substrate 163. Here, the length of the connecting portion 167 is equal to the slit width W. Also, since the burr 162 is the remaining portion after the connecting portion 167 is cut at approximately the center, the burr length L is approximately half the slit width W (L ≒ W / 2).

[0055] Also, the intermediate portion 166 is shifted toward the substrate body 111 by the recess depth D with respect to the general slit portion 164b, but in this embodiment, the relationship between the recess depth D and the slit width W is D=W. Therefore, in this embodiment, L≈W / 2=D / 2, and the recess depth D is approximately twice the burr length L.

[0056] The recess depth D and the burr length L become approximately the same (D ≒ L) when the recess depth D is 1 / 2 the slit width W (D = W / 2). Therefore, in order to make the recess depth D larger than the burr length L (D > L), it is sufficient to set the recess depth D to be larger than 1 / 2 the slit width W (D > W / 2).

[0057] Further, the bent portion 165 is bent at a predetermined angle from the general slit portion 164b toward the substrate body 111, and in this embodiment, the bent angle is smaller than 90 degrees (about 60 degrees here). That is, the recess 161 in this embodiment is formed so as to become wider from the inside (the substrate body 111 side) toward the outside.

[0058] In the third LED substrate 43 of this embodiment, both the first wiring layer 141a and the second wiring layer 141b have an area along the outer periphery where no copper foil is provided (hereinafter referred to as an outer periphery margin 171), but the width (the distance between the outer edge and the inner edge) of this outer periphery margin 171 differs between the recess 161 and other portions. That is, as shown in Fig. 10, the outer periphery margin 171a corresponding to the recess 161 is formed within a range of a substantially constant width WSa along the outer periphery (excluding the burrs 162), and the outer periphery margin 171b corresponding to the portion other than the recess 161 is formed within a range of a substantially constant width WSb along the outer periphery, with the relationship therebetween being WSa>WSb.

[0059] 10, the ground wiring path 138 is disposed inside the outer peripheral margin 171, and the signal and clock wiring paths 134, 135 are disposed further inside the ground wiring path 138. In this manner, in the third LED substrate 43 of this embodiment, the outer peripheral margin 171a where no copper foil is provided is formed within the range of WSa (first distance) from the outer peripheral edge in the portion of the recess 161, and the ground wiring path 138 is disposed inside the outer peripheral margin 171a, i.e., at a position at least WSa (first distance) away from the outer peripheral edge, and the signal wiring path 134 and the like are disposed further inside the outer peripheral margin 171a (i.e., at a position at least a second distance longer than WSa (first distance) from the outer peripheral edge). In addition, in the portion other than the recess 161, an outer margin 171b is formed in which no copper foil is provided within a range of WSb (less than a first distance) from the outer peripheral edge, and the ground wiring path 138 is arranged inside the margin 171b, i.e., at a position WSb shorter than WSa from the outer peripheral edge (a position less than the first distance), and the signal wiring path 134 etc. are arranged further inside that (i.e., a position less than a second distance from the outer peripheral edge).

[0060] With this configuration, even if a manufacturing error occurs and the recess 161 is formed displaced from its original position, the possibility of the ground wiring path 138, the signal wiring path 134, etc. being scraped off can be eliminated, and the wiring layer can be efficiently utilized. Also, resistance to vibration and impact when the connecting portion 167 is folded and broken in the manufacturing process can be improved. Note that, since the influence of vibration and impact when folding and breaking the connecting portion 167 is small at a position away from the recess 161, the peripheral margin 171 is made small to ensure the area of ​​the copper foil pattern.

[0061] As described above, the pachinko machine of this embodiment has a third LED board (board) 43 on which an LED driver (heat-generating component) 75 is mounted, and the LED driver 75 arranged on the first surface of the third LED board 43 has a conductor portion 151 provided on its back surface bonded to the copper foil portion on the first surface side, and nine (a predetermined number) through holes 140a with copper foil on the inner surface are provided in an area corresponding to the conductor portion 151 of the LED driver 75, and the plate thickness T of the third LED board 43, the diameter φ of the through hole 140a, and the predetermined number n are set so that the ratio Ri of the surface area S1 of the inner surface of the through hole 140a to the area S of the conductor portion 151 is larger than the ratio Rs of the hole area S2 of the through hole 140a to the area S of the conductor portion 151. This makes it possible to enhance heat dissipation while suppressing a decrease in the mounting strength of the LED driver (heat-generating component) 75.

[0062] In addition, nine (a predetermined number) through holes 140a are arranged in a matrix at equal intervals vertically and horizontally, and the interval Ls between the through holes 140a is set to be larger than the diameter φ of the through holes 140a. This makes it possible to ensure a certain level of adhesive strength even when the through holes 140a are provided.

[0063] Moreover, a solid ground pattern 137 is arranged on at least a region corresponding to the conductor portion 151 on the second surface opposite to the first surface of the third LED substrate 43. This makes it possible to efficiently dissipate heat conducted via the through holes 140a on the second surface side via the solid ground pattern 137.

[0064] Also, the LED driver (heat-generating member) 75 is arranged on the back surface (first surface) side facing the door base (first member) 35, and the LEDs 71 to 74 are arranged on the front surface (second surface) side facing the upper decorative cover (second member) 49, and the distance L2 between the upper decorative cover 49 and the third LED board 43 is set to be greater than the distance L1 between the door base 35 and the third LED board 43. This allows the heat from the LED driver 75 arranged on the back surface (first surface) side, which is close in distance (L1) to the opposing surface (door base 35), to escape to the front surface (second surface) side, which has a larger distance (L2) to the opposing surface (upper decorative cover 49), making it possible to dissipate heat more efficiently.

[0065] In addition, one or more recesses 161 are provided on the outer periphery of the third LED substrate 43, and burrs 162 created by cutting the connecting portions 167 remain in the recesses 161, and the depth D of the recesses 161 is made larger than the protruding length L of the burrs 162. Therefore, the burr removal process can be omitted, thereby making the manufacturing process more efficient.

[0066] Furthermore, no copper foil is provided within a first distance WSa from the outer periphery of the recess 161, the ground wiring path 138 is disposed at a position at least the first distance WSa away from the outer periphery of the recess 161, the signal wiring path 134 is disposed at a position at least a second distance away from the outer periphery of the recess 161 that is longer than the first distance WSa, and for the portion of the outer periphery of the third LED substrate 43 other than the recess 161, the ground wiring path 138 is disposed at a position less than the first distance WSa from the outer periphery, and the signal wiring path 134 is disposed at a position less than the second distance from the outer periphery. This makes it possible to eliminate the possibility that the ground wiring path 138, the signal wiring path 134, etc. will be scraped off even if a manufacturing error occurs and the recess 161 is formed deviated from its original position, and allows the wiring layer to be used efficiently.

[0067] Although the embodiment of the present invention has been described above in detail, the present invention is not limited to this embodiment, and various modifications are possible within the scope of the present invention. For example, in the embodiment, the relationship between the diameter φ of the heat dissipation through hole, the diameter φ1 of the signal conduction via, and the diameter φ2 of the power conduction via is φ1<φ≒φ2, but the relationship is not limited to this, and may be, for example, φ1≒φ<φ2, or φ1≒φ≒φ2. In addition, when the diameter of the heat dissipation through hole is made different for each heat-generating component, φ1≒φa<φb≒φ2 may be satisfied, where φa is the diameter of the heat dissipation through hole corresponding to the heat-generating component A, and φb is the diameter of the heat dissipation through hole corresponding to the heat-generating component B.

[0068] In the embodiment, the heat-generating component 75 and its conductor portion 151 are square, and the heat dissipation through holes 140a are arranged in a matrix (3 x 3) with the same number of vertical and horizontal holes within the area corresponding to the square conductor portion 151. However, if the heat-generating component and / or its conductor portion is rectangular and not square, the heat dissipation through holes may be arranged in a matrix (e.g. 3 x 5) with different numbers of vertical and horizontal holes.

[0069] 10, the minimum width of the ground wiring path 138 inside the peripheral margin 171 in the portion other than the recess 161 is made smaller than the minimum width of the ground wiring path 138 inside the peripheral margin 171 in the portion of the recess 161, but the two may be approximately the same. Also, in the example of Fig. 10, the ground wiring path 138 is disposed between the peripheral margin 171 and the signal wiring path 134, etc., but the signal wiring path, etc. may be disposed inside the peripheral margin 171 without the ground wiring path in between.

[0070] Furthermore, although the embodiment shows an example in which the present invention is applied to a pachinko machine, the present invention can be similarly implemented in various gaming machines such as an arrange ball machine and a slot machine. [Explanation of symbols]

[0071] 35 Door base (first part) 43 3rd LED board (board) 49 Upper decorative cover (second part) 71 LED 72 LED 73 LED 74 LED 75 LED driver (heat generating component) 140a through hole 151 Conductor

Claims

[Claim 1] A substrate having a heat generating component and an LED mounted thereon is disposed between the first member and the second member; The substrate is provided with a plurality of types of vias for conducting between different wiring layers. In the gaming machine, the plurality of types of vias include signal conducting vias for conducting a signal wiring path and power supply conducting vias for conducting a power supply wiring path, a diameter of the power supply conducting via is larger than a diameter of the signal conducting via; The heat generating component is disposed on a first surface side of the substrate facing the first member, and the LED is disposed on a second surface side of the substrate facing the second member, A distance between the second member and the substrate is set to be greater than a distance between the first member and the substrate; the heat generating component has a conductor portion provided on a back surface of the heat generating component bonded to the copper foil portion on the first surface side, a predetermined number of through holes, the inner surfaces of which are coated with copper foil, are provided in the substrate in an area corresponding to the conductor portion of the heat generating component; a thickness of the substrate, a diameter of the through holes, and the predetermined number of the through holes are set so that a surface area of ​​an inner surface of the through holes is larger than a hole area of ​​the through holes; The diameter of the through hole is set to be approximately the same as the diameter of the power supply conductive via. A gaming machine characterized by:

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