Peeling device, peeling system and peeling method
JP2025007600APending Publication Date: 2025-01-17TOKYO ELECTRON LTD
Patent Information
- Application Number
- JP2023109111
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-07-03
- Publication Date
- 2025-01-17
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Figure 2025007600000001_ABST
Abstract
To provide a peeling device, a peeling system, and a peeling method that reduce the occurrence of substrate cracks.SOLUTION: A peeling device 5 includes a notch 90, a first holding unit 50, a second holding unit 70, a detection unit 525, and a control unit. The notch is made by inserting a sharp member 91a into the side of the polymerized substrates T to which a first substrate W1 and a second substrate W2 are joined, which is located at the most starting point of peeling. The first holding unit that suctionally holds the first substrate among the polymerized substrates includes a starting point side suction unit 52A and a starting point side lifting mechanism 60A. The starting point side suction unit sucks the peripheral edge of the outer periphery of the first substrate that is located at the most starting point of peeling. The starting point side lifting mechanism raises and lowers the starting point side suction unit. The second holding unit sucks and holds the second substrate among the polymerized substrates. The detection unit detects the suction of the first substrate by the starting point side suction unit. The control unit executes the notch process, the suction process, the first movement process, the second movement process, and the stop process.SELECTED DRAWING: Figure 3
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Citation Information
Patent Citations
Peeling device, peeling system, and peeling method
JP2015207776A