Semiconductor module and method for manufacturing semiconductor module

Abstract

To provide a semiconductor module and a method for manufacturing the semiconductor module that facilitate the transmission of force between an output terminal of a semiconductor package and a top plate of a module case.SOLUTION: A semiconductor module includes a semiconductor chip package and a module case. The semiconductor chip package has an output terminal that is connected to a top plate of the module case. The output terminal and the top plate are connected to each other by applying a fastening force in a specified fastening direction. A gap is formed between the output terminal and the top plate in the fastening direction before applying the fastening force, and a shim is placed to adjust the gap to a target gap amount. In a method for manufacturing the semiconductor module, the shim for adjusting the gap is placed between the output terminal of the semiconductor chip package and the top plate of the module case, and then the fastening force is applied to the output terminal and the top plate to connect the output terminal and the top plate to each other.SELECTED DRAWING: Figure 3A

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