Method for manufacturing substrate of semiconductor integrated circuit using diamond particles or zirconia particles

Abstract

To solve a problem of difficulty in mass-producing (crystallizing) diamond or zirconia having a required size and shape for a substrate of an integrated circuit although the diamond or zirconia is known as a material capable of controlling larger electric power than silicon that is a main material of the substrate of a semiconductor integrated circuit.SOLUTION: The problem is solved by achieving a required size and shape by using two processing methods of resin bonding processing for solidifying a chip of diamond or zirconia of fine particles with resin and high temperature sintering processing for performing sintering at high temperature after press molding, rather than crystallizing the diamond and zirconia to a size and shape required for a substrate of an integrated circuit.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to an application technology of powder particle solidification and bonding technology. [Background technology]

[0002] Molding processing technology used in permanent magnets, etc. Summary of the Invention [Problem to be solved by the invention]

[0003] The material used for the substrate of semiconductor integrated circuits is mainly silicon, but because there are restrictions on the amount of power (current, voltage) that can be controlled (that the material can withstand), it could not be used in integrated circuits for devices that require large amounts of power. Diamond is known as a material that can control a larger amount of power, but there is a problem that it is difficult to mass-produce (crystallize) diamond in the size and shape required for integrated circuit substrates.

[0004] It is difficult to mass-produce (crystallize) diamonds of the size and shape required for integrated circuit substrates, but fine-grained artificial diamond (industrial diamond) chips are mass-produced (crystallized). These fine-grained artificial diamond chips are used, among other things, to harden the blades of cutting machines such as diamond cutters and shield machines. These fine grain artificial diamond chips are used as material. There is a type of permanent magnet called a bonded magnet, in which magnetic powder is solidified (glued and bonded) with resin. Similarly, the problem is solved by a processing method in which artificial diamond chips are bonded together with resin instead of magnetic powder (resin bonding processing). (Unlike permanent magnets, the substrates of semiconductor integrated circuits require the flow of electricity, so the resin that holds the microparticles together is a conductive polymer that allows electricity to flow.) Additionally, there is a type of permanent magnet called a sintered magnet, which is made by molding magnetic powder in a molding machine (press machine) and then sintering it at high temperatures (bonding it by heat treatment). Similarly, the problem is solved by using artificial diamond chips, instead of magnetic powder, in a processing method in which they are press-molded and then sintered at high temperatures (high-temperature sintering processing). (Sintering, which involves baking at high temperatures, is a process that bonds materials together at temperatures where they do not melt, rather than melting and compounding them.) Even if zirconia (zirconium dioxide) is used instead of diamond using these two processing methods, the problem can be solved because a similarly large amount of power can be controlled.

Claims

1. It is known that using diamond, a carbon allotrope, as a substrate for semiconductor integrated circuits allows for the control of much greater amounts of power (current, voltage) (i.e., is durable against large amounts of power) than the silicon that is currently the predominant material used. If this were used as a substrate material, it would be possible to control transportation and equipment that requires large amounts of electricity; however, it has not been put to practical use because it is difficult to mass-produce artificial diamonds of the size and shape required for integrated circuit substrates (crystallization to the size and shape required for substrates). Although it is difficult to manufacture (crystallize) large artificial diamonds, artificial diamond (industrial diamond) chips (fine particles) used to harden the blades of cutting machines such as diamond cutters and shield machines are mass-produced. This artificial diamond chip is used as the material. This is one of the methods for manufacturing permanent magnets, in which magnetic powder is solidified with resin into the required size and shape to create a bonded magnet. With this manufacturing method, instead of magnetic powder, a required amount of artificial diamond chips (fine particles) is collected and solidified with resin into the required size and shape to create the substrate for the integrated circuit. (Unlike permanent magnets, the substrates of semiconductor integrated circuits require the flow of electricity, so the resin that holds the microparticles together is a conductive polymer that allows electricity to flow.)

2. 2. The method according to claim 1, wherein the material used is an imitation diamond (cubic zirconia, zirconium dioxide) chip instead of an artificial diamond chip.

3. Sintered magnets are a method of manufacturing permanent magnets in which magnetic powder is molded into the required size and shape using a molding machine (press) and then sintered at high temperature to harden the magnet. With this manufacturing method, instead of magnetic powder, a required amount of artificial diamond chips (fine particles) is collected, molded into the required size and shape using a molding machine, and then baked at high temperature to form the substrate for the integrated circuit. (Sintering, which involves baking at high temperatures, is a processing method that does not melt and synthesize materials, but rather bonds and solidifies fine particles at a temperature that does not melt them.)

4. The method according to claim 3, wherein the material used is an imitation diamond (cubic zirconia, zirconium dioxide) chip instead of an artificial diamond chip.

5. A part, device, equipment, a substrate for a semiconductor integrated circuit, a transportation vehicle, a defense equipment, an artificial satellite, a planetary probe, or jewelry, which uses the method according to claim 1, claim 2, claim 3, or claim 4.

6. Services or businesses using the parts, devices, facilities, semiconductor integrated circuit boards, transportation means, defense equipment, artificial satellites, planetary probes, and jewelry described in claim 5.