Imprint device, imprint method, and method for manufacturing article

Abstract

To provide an imprint device that can prevent a reduction in throughput.SOLUTION: An imprint device uses a mold having a pattern part to sequentially cure and form patterns of an imprint material in a plurality of shot areas on a substrate, and the imprint device has: an alignment measuring unit that detects marks formed on the substrate and marks provided on the mold to measure the relative position between the substrate and the mold; an alignment illumination unit that includes a light quantity adjustment mechanism adjusting the quantity of light radiated from a light source, and illuminates the marks on the mold and substrate so that the alignment measuring unit can detect the marks; and a control unit that controls the light quantity adjustment mechanism to start the adjustment, so as to satisfy an illumination condition when the alignment illumination unit illuminates the shot areas in which the patterns are formed next, after the imprint material is cured in a state where the positions of the mold and substrate are adjusted on the basis of a result of measurement performed by the alignment measuring unit.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an imprint apparatus, an imprint method, and a method for manufacturing an article. [Background technology]

[0002] The imprinting technique is a technique that can form a pattern on a curable composition supplied on a substrate using a mold. The imprinting technique has been proposed as one of the lithography techniques for mass production of semiconductor devices, magnetic storage media, and the like. An imprinting apparatus using this imprinting technique forms a pattern on a curable composition supplied on a substrate using a mold. The imprinting apparatus cures the curable composition while the mold and the curable composition are in contact with each other, and forms a pattern of the curable composition on the substrate by separating the mold from the cured curable composition.

[0003] In an imprinting apparatus, when the mold and the curable composition are brought into contact with each other, it is necessary to accurately align the mold and the substrate. In an imprinting apparatus, for example, a die-by-die alignment method is adopted as an alignment method. The die-by-die alignment method is a method of performing alignment by detecting an alignment mark formed in a shot area of ​​the substrate and an alignment mark formed on the mold. Such techniques for aligning the mold and the substrate have been proposed in the past.

[0004] The accuracy of detecting an alignment mark is affected by the illumination conditions when illuminating the alignment mark. Patent Document 1 proposes a method of optimizing the illumination conditions when detecting alignment marks in multiple shot areas. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-57511 Summary of the Invention [Problem to be solved by the invention]

[0006] However, when imprinting multiple shot areas as described in Patent Document 1, if illumination conditions such as wavelength and light intensity are changed to suit each shot area, it takes time to change the illumination conditions, which results in a problem of reduced throughput.

[0007] Therefore, an object of the present invention is to provide an imprint apparatus capable of suppressing a decrease in throughput. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, an imprinting apparatus as one aspect of the present invention is an imprinting apparatus that uses a mold having a pattern portion to sequentially harden and form a pattern of an imprinting material in a plurality of shot areas on a substrate, and is characterized in having an alignment measurement unit that measures the relative position of the substrate and the mold by detecting a mark formed on the substrate and a mark provided on the mold, an alignment illumination unit that is provided with a light amount adjustment mechanism that adjusts the amount of light irradiated from a light source and illuminates the marks on the mold and the substrate in a state that can be detected by the alignment measurement unit, and a control unit that controls to start adjusting the light amount adjustment mechanism so that the illumination conditions are the same when the alignment illumination unit illuminates the shot area in which the next pattern is to be formed after the imprinting material is hardened in a state in which the position of the mold and the substrate is adjusted based on the measurement results of the alignment measurement unit. Effect of the Invention

[0009] According to the present invention, it is possible to provide an imprint apparatus capable of suppressing a decrease in throughput. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 illustrates an imprint apparatus according to an embodiment. [Diagram 2] 1A and 1B are diagrams showing examples of alignment marks according to an embodiment. [Diagram 3] 4 is a flowchart showing an imprint process of the imprint apparatus according to the embodiment. [Figure 4] 4 is a flowchart showing an imprint process of the imprint apparatus according to the embodiment. [Diagram 5] 1A and 1B are diagrams showing examples of arrangements of a substrate and shot areas. [Figure 6] 10 is a flowchart illustrating an example of a process for setting optimal illumination conditions for correctly capturing an image of an alignment mark. [Figure 7] FIG. 2 is a schematic diagram for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same members or elements are given the same reference numerals, and duplicated descriptions are omitted or simplified. In the following drawings, the Z axis is taken parallel to the optical axis of the optical system 112 with respect to the imprint material R on the substrate W, and the X axis and the Y axis are taken perpendicular to each other in a plane perpendicular to the Z axis.

[0012] <Example 1> FIG. 1 is a diagram illustrating an imprint apparatus 100 of this embodiment. The imprint apparatus 100 of this embodiment will be described below with reference to FIG. 1. In this embodiment, as an example, an example will be described in which the present invention is applied to an ultraviolet light curing type imprint apparatus that cures an imprint material (resin, resist) R by irradiating it with UV light (ultraviolet light). However, the present invention is not limited to this, and can also be applied to an imprint apparatus that cures the imprint material R by irradiating it with light in another wavelength range, or an imprint apparatus that cures a resin by another energy (for example, heat).

[0013] The substrate W is, for example, a single crystal silicon substrate or an SOI (Silicon on Insulator) substrate, and the surface to be processed is coated with an imprint material R that is patterned by a pattern portion formed on a mold M. The substrate W may also be various substrates such as a gallium arsenide wafer, a composite adhesive wafer, a glass wafer containing quartz as a material, a liquid crystal panel substrate, a reticle, etc. The outer shape may also be not only circular but also rectangular, and in that case, the outer shape of the substrate chuck 162 may also be shaped to match the outer shape of the substrate W.

[0014] The mold (original) M has a rectangular outer peripheral shape, and has a pattern portion (mesa portion) with a three-dimensional pattern (a concave-convex pattern to be transferred to the substrate W, such as a circuit pattern) formed on a surface (pattern surface) facing the surface of the substrate W. The mold M is made of a material that can transmit irradiation light such as ultraviolet light, for example, quartz. The mold M may also have a cavity that is circular in plan view and has a certain depth on the surface that is irradiated with the irradiation light. The mold M can be transported by a transport mechanism (not shown). The transport mechanism includes, for example, a transport robot having a chuck such as a vacuum chuck.

[0015] The imprint material R is a photocurable resin that has the property of being cured by exposure to irradiation light such as ultraviolet light, and is appropriately selected depending on various conditions such as the semiconductor device manufacturing process. The photocurable resin contains at least a polymerizable compound and a photopolymerization initiator, and may contain a non-polymerizable compound or a solvent as necessary. When the imprint material R is applied (coated) on the substrate W, it may be applied in the form of a film on the substrate W by a spin coater or a slit coater.

[0016] The imprint apparatus 100 of this embodiment is configured to sequentially form a pattern of the imprint material R in a plurality of shot areas (pattern formation areas, imprint areas) of the substrate W by repeating an imprint shot cycle. Here, one imprint shot cycle is a cycle in which a pattern of the imprint material R is formed in one shot area of ​​the substrate W by hardening the imprint material R while pressing the mold M against the imprint material R. This series of processes is also referred to as an imprint process. This imprint process will be described below.

[0017] First, after the mold M and the substrate W are positioned in a predetermined positional relationship, the mold chuck 132 is moved in the -Z direction to bring the pattern portion of the mold M into contact with the imprint material R in the shot area (contact process). Next, the imprint material R is hardened while the pattern portion of the mold M is in contact with the imprint material R (hardening process). Next, the pattern portion of the mold M is separated from the imprint material R in the shot area (release process). By performing this series of processes, a pattern of the imprint material can be formed on the substrate W. This imprint process is performed for each shot area on the substrate W where a pattern is to be formed. The imprint process described above may also include a process (coating process) of applying (supplying) the imprint material R onto the shot area of ​​the substrate W before the contact process.

[0018] The imprint apparatus 100 of this embodiment has a light irradiation mechanism 120, a mold operation mechanism 130, a mold shape correction mechanism 140, an alignment illumination mechanism 150, a substrate drive unit 160, an alignment mechanism 170, and a control unit CNT.

[0019] The light irradiation mechanism 120 irradiates the imprint material (resist) R with ultraviolet light through the mold M to harden the imprint material R. The light irradiation mechanism 120 includes a light source unit 110 and an optical system 112.

[0020] The light source unit 110 may include, for example, a light source such as a halogen lamp that generates ultraviolet light (e.g., i-rays and g-rays) and an elliptical mirror that collects the light generated by the light source. The optical system 112 has a lens, a half mirror HM, a mirror 114, and the like for irradiating the imprint material R on the shot area with light for hardening the imprint material R. The optical system 112 may include an optical integrator for uniformly illuminating the mold M. The light whose range is defined by the aperture is incident on the imprint material R on the substrate W via the imaging system and the mold M. The shot whole area observation scope 190 is a scope for observing the entire shot, and is used to check the state of the imprint and the progress of imprinting and filling.

[0021] The mold operation mechanism 130 has a mold chuck (mold holding portion) 132 that holds the mold M, a mold driving mechanism 134 that drives the mold M by driving the mold chuck 132, and a base 136 that supports the mold driving mechanism 134.

[0022] The mold driving mechanism 134 includes a positioning mechanism that controls the position of the mold M with respect to six axes, and a mechanism that presses the mold M against the substrate W or the imprint material R thereon, and separates the mold M from the hardened imprint material R. Here, the six axes refer to the X-axis, Y-axis, and Z-axis in an XYZ coordinate system in which the support surface (the surface that supports the substrate W) of the mold chuck 132 is the XY plane and the direction perpendicular to that is the Z-axis, as well as rotation around each of these axes.

[0023] The mold shape correction mechanism 140 can be mounted on the mold chuck 132. The mold shape correction mechanism 140 can correct the shape of the mold M by applying pressure to the mold M from the outer circumferential direction using a cylinder operated by a fluid such as air or oil. Alternatively, the mold shape correction mechanism 140 includes a temperature control unit that controls the temperature of the mold M, and corrects the shape of the mold M by controlling the temperature of the mold M. The substrate W can be deformed (for example, expanded or contracted) by undergoing a process such as heat treatment. The mold shape correction mechanism 140 corrects the shape of the mold M in accordance with such deformation of the substrate W so that the overlay error falls within an allowable range.

[0024] The coating mechanism 180 sequentially coats (supplies) the imprint material R in the region of the substrate W where imprinting is to be performed. Alternatively, the imprint material R may be applied to the entire surface of the substrate W all at once. The imprint material R may be applied using the coating mechanism 180 configured within the imprint apparatus 100, but the imprint material R may also be applied all at once by an external device. In this case, the substrate W on whose entire surface the imprint material R has been applied is transported into the imprint apparatus. The coating mechanism 180 may include, for example, a tank that contains resin, a nozzle that ejects the resin supplied from the tank through a supply path onto the substrate, a valve provided in the supply path, and a supply amount control unit.

[0025] The gas supply mechanism 200 is a mechanism that supplies a gas such as helium into the space of the mold operation mechanism 130 to promote filling with the imprint material R. The amount of gas that flows in is optimized in advance in accordance with the imprint shot cycle.

[0026] The substrate driving unit 160 has, for example, a substrate chuck 162 that holds the substrate W, a substrate stage 164 that drives the substrate W by driving the substrate chuck 162, and a stage driving mechanism (not shown). The stage driving mechanism may include a positioning mechanism that controls the position of the substrate W by controlling the position of the substrate stage 164 about the above-mentioned six axes. Furthermore, the substrate chuck 162 holds the substrate W by means of a vacuum suction pad or the like.

[0027] FIG. 2 is a diagram illustrating alignment marks formed on the mold M and the substrate W. In FIG. 2, the alignment mark AMM is an alignment mark of the mold M. The alignment mark AMW is an alignment mark of the substrate W. The alignment mark AMM on the mold M and the alignment mark AMW on the substrate W are configured so as not to completely overlap each other, and it is possible to measure the relative position of the alignment mark AMM and the alignment mark AMW of the substrate W by transmitting through the mold M. In addition, by measuring the positions of the alignment marks AMM and AMW (alignment marks AM) within the field of view of the alignment scope 172, it is also possible to measure the relative position between the alignment scope 172 and the alignment mark AMM or AMW. In addition, each alignment mark shown in FIG. 2 shows the alignment mark when viewed from the +Z axis direction to the -Z axis direction. In addition, the alignment mark is not limited to the form shown in FIG. 2, and may be a form that detects moire fringes generated by using a diffraction grating as the alignment mark.

[0028] The alignment illumination mechanism (alignment illumination unit) 150 is an illumination mechanism that illuminates an alignment mark AM on the substrate W so that it can be detected by an alignment scope 172 described below. The alignment illumination mechanism 150 has a light source 152, a light amount adjustment mechanism 154, a half mirror 156, an adjustment unit (not shown), etc. The light source 152 is composed of, for example, a laser diode capable of emitting light (alignment light), etc.

[0029] The light amount adjustment mechanism 154 adjusts the amount of light emitted from the light source 152. The light amount adjustment mechanism 154 in this embodiment has a plurality of regions with different transmittances, and is a mechanism capable of continuously changing the transmittance. By adjusting the transmittance by driving the light amount adjustment mechanism 154, it is possible to set an illumination condition that is also a condition under which an alignment scope 172 described later can perform measurement in an optimal state. Examples of the light amount adjustment mechanism 154 include a continuously variable ND filter capable of changing the transmittance according to the position through which light passes, and a liquid crystal ND filter capable of electrically controlling the transmittance by an applied voltage or the like. The half mirror 156 combines the optical axis with the alignment mechanism 170. The adjustment unit (not shown) can adjust (change) the illumination conditions (light amount, wavelength, and shape of illumination light) of the alignment marks of the mold M and the substrate W by including a wavelength filter, a neutral density filter, a filter for changing the shape of the illumination area, a light beam shaping unit, and the like. The adjustment unit also functions as an illumination means (adjustment means) for adjusting the illumination conditions.

[0030] The alignment mechanism (alignment detection system) 170 can include, for example, an alignment scope (alignment measurement unit) 172 and an alignment stage mechanism 174. The alignment mechanism 170 is a mechanism that uses the alignment scope 172 to measure the relative position between a mark provided on the mold M and a mark provided on the substrate W. Although only one alignment mechanism 170 is shown in FIG. 1, this is just one example, and a plurality of alignment mechanisms 170 are mounted on the imprint apparatus 100.

[0031] The alignment scope 172 may include an imaging element and an automatic adjustment scope (AAS) that aligns the mold M and the shot area of ​​the substrate W. The alignment scope 172 measures the relative position between the substrate W and the mold M by detecting an alignment mark AMM formed on the mold M and an alignment mark AMW formed on the substrate W via the mold M.

[0032] In one example, the alignment scope 172 repeatedly captures and acquires images of the mark AM at a set accumulation time, and then transmits the acquired images to the control unit CNT. Specifically, the alignment light emitted from the light source 152 of the alignment illumination mechanism 150 is reflected by the half mirror 156, passes through the mold M, and illuminates the alignment mark AM. Then, the alignment light reflected by the alignment mark AM forms an optical image on the imaging surface of the imaging element of the alignment scope 172, and this optical image can be captured by the imaging element. The alignment scope 172 outputs the image obtained by imaging to the control unit CNT. Then, the control unit CNT calculates the relative positions of the alignment marks of the mold M and the substrate W based on the image. Furthermore, the control unit CNT measures the difference (coordinates, rotation, magnification, base component, etc.) of the pattern shapes of the mold M and the substrate W based on the measurement result of the relative positions of the alignment marks. Then, the control unit CNT calculates the drive amount to be instructed to the substrate driving unit 160 based on the measurement result.

[0033] The calculation of the relative positions of the alignment marks may be performed by an image processing device (not shown) or the like. The image processing device may be configured integrally with other parts of the imprint apparatus 100 (in a common housing). Furthermore, it may be configured separately from other parts of the imprint apparatus 100 (in a different housing), or it may be installed in a location separate from the imprint apparatus 100 and controlled remotely.

[0034] The control unit CNT includes a CPU, a memory (storage unit), and the like, and is configured by at least one computer. The control unit CNT is connected to each component of the imprint apparatus 100 via a line. The control unit CNT also performs overall control of the adjustment of operations of each component of the entire imprint apparatus 100 according to a program (computer program) stored in the memory. The control unit CNT may be configured integrally with other parts of the imprint apparatus 100 (in a common housing). Furthermore, the control unit CNT may be configured separately from other parts of the imprint apparatus 100 (in a different housing), or may be installed in a location separate from the imprint apparatus 100 and controlled remotely.

[0035] Although not shown, the imprint apparatus 100 also includes a surface plate and a vibration isolator (damper). The surface plate supports the entire imprint apparatus 100 and forms a reference plane when the substrate stage 164 moves. The vibration isolator removes vibrations from the floor and supports the surface plate.

[0036] The operation (processing) of the imprint apparatus 100 in this embodiment will be described below with reference to Figs. 3 to 6. Figs. 3 and 4 are flowcharts showing the imprint processing of the imprint apparatus 100 in this embodiment. Fig. 5 is a diagram showing an example of an arrangement of the substrate W and the shot areas. S in Fig. 5 indicates the shot area. A plurality of shot areas S are formed on the substrate W, and a plurality of alignment marks AMW are formed in each shot area S. Fig. 6 is an example of a flowchart showing a method of setting optimal illumination conditions for correctly capturing an image of the alignment marks AM.

[0037] Each of the following processes is realized by executing a program stored in the memory by the control unit CNT of the imprint apparatus 100. Moreover, by adding an S to the beginning of each process (step), the notation of the process (step) is omitted.

[0038] First, in S1002, the mold M is transported to the mold chuck 132 and its position is determined. Thereafter, the mold M is held by the mold chuck 132. Next, in S1004, the substrate W is transported into the apparatus by a transport mechanism (not shown) and placed (loaded) on the substrate chuck 162. Thereafter, it is held by the substrate chuck 162. Here, it is assumed that, for example, at least one layer of patterns has already been formed on the substrate W together with the alignment marks AMW.

[0039] Next, in S1006, the control unit CNT controls the light amount adjustment mechanism 154 and starts driving to change the transmittance so that the illumination conditions are those that the alignment mechanism 170 illuminates. When changing the transmittance, the optimal illumination conditions for correctly capturing an image of the alignment mark AM are investigated in advance. The investigation of the optimal illumination conditions will be described below. First, using an adjustment substrate (first substrate), the illumination conditions of the alignment marks of the mold and substrate that are optimal for die-by-die alignment are acquired in a plurality of shot areas. When acquiring, the illumination conditions of the alignment marks of the mold and substrate are adjusted and acquired as the optimal illumination conditions. The shot area where the optimal illumination conditions are acquired is set as the measurement shot area (first shot area).

[0040] Then, after the optimum illumination conditions are acquired, imprint processing is performed on the measurement shot areas. Also, the shot areas for which the illumination conditions are not obtained are set as approximate shot areas (second shot areas). The illumination conditions of the approximate shots are derived and acquired as approximate illumination conditions by using a function (for example, by function approximation) from the optimum illumination conditions adjusted for the multiple measurement shot areas. Then, imprint processing including a step of performing die-by-die alignment based on the derived approximate illumination conditions is performed on the approximate shot areas.

[0041] After the imprint process of the adjustment substrate is completed, the product substrate (second substrate) is subjected to the imprint process including a step of performing die-by-die alignment based on the acquired illumination conditions (optimum illumination conditions, approximate illumination conditions). Here, the product substrate is the substrate W in this embodiment. It is preferable that the substrate W is a product substrate, but the adjustment substrate may be used as it is. The illumination conditions of the alignment marks of the mold M and the substrate W mainly depend on the reflection characteristics and shape of the alignment mark AMM provided on the substrate W. Therefore, the product substrate is prepared so that these are the same (or approximately the same) as the adjustment substrate. In addition, other conditions such as uneven coating of the flattening film applied to the substrate W are also the same (or approximately the same). The adjustment substrate may be prepared separately from the product substrate, or the two substrates may be selected from the same lot. That is, the first substrate in the same lot may be used as the adjustment substrate, and the second substrate may be used as the product substrate.

[0042] Setting of optimal illumination conditions will be described below with reference to Fig. 6. Each process below is realized by the control unit CNT of the imprint apparatus 100 executing a program stored in the memory. Also, by adding an S to the beginning of each process (step), the notation of the process (step) is omitted.

[0043] First, in S2002, the control unit CNT controls a transport device (not shown) to carry in a substrate for adjustment. Next, in S2004, the control unit CNT controls the application mechanism 180 to supply the imprint material R onto the carried-in substrate for adjustment and onto the alignment marks AMW formed in each of the measurement shot areas of the substrate for adjustment. The control unit CNT controls the mold driving mechanism 134 or the substrate stage 164 to move the substrate for adjustment to which the imprint material R has been supplied, to directly below the mold M.

[0044] Next, in S2006, the control unit CNT controls the mold driving mechanism 134 to bring the imprint material R supplied onto the adjustment substrate and the alignment mark AMW of the adjustment substrate into contact with the mold M and the alignment mark AMM of the mold M. At this time, the mold M may be deformed into a convex shape with respect to the adjustment substrate to bring it into contact with the imprint material. Next, in S2008, the control unit CNT controls the mold driving mechanism 134 or the substrate stage 164 to maintain contact between the mold M and the imprint material R. Then, the imprint material R is filled into the pattern portion of the mold M (the concave portion of the concave-convex pattern) so that the alignment scope 172 can observe the respective alignment marks or moiré fringes.

[0045] Next, in S2010, the illumination conditions of the alignment marks of the mold M and the adjustment substrate are optimized, and then the illumination conditions are adjusted to obtain the optimal illumination conditions (first illumination step). The control unit CNT compares the alignment mark that is made observable in S2008 with a predetermined alignment mark or the shape of the moire fringes with a predetermined moire fringe shape, and controls the adjustment unit (not shown) based on the comparison result. Then, the alignment marks AMM and the alignment marks AMW are illuminated, and the illumination conditions (light amount, wavelength, template for pattern matching, etc.) are adjusted. Note that, for example, an image sensor may be used to adjust the pattern of the mold and the pattern of the alignment marks of the substrate by the imaging period (accumulation time) to adjust the illumination conditions. Also, while adjusting the illumination conditions in the first illumination step, the alignment marks AMM and the alignment marks AMW are aligned (first alignment step) for each of the multiple shot areas. Note that, when the illumination conditions are set using the moire fringes, the contrast of the moire fringes is affected by the light amount and wavelength, so the illumination conditions are adjusted so that the contrast is higher. The control unit CNT compares the alignment mark observed under the adjusted illumination conditions with a predetermined alignment mark or the shape of the moire fringes with a predetermined moire fringe shape.

[0046] Next, in S2012, the control unit CNT judges whether the illumination condition adjusted in S2010 is within a predetermined threshold range. If the illumination condition adjusted in S2010 is within the predetermined threshold range, it acquires it as the optimal illumination condition and proceeds to S2014. On the other hand, if the illumination condition adjusted in S2010 is not within the predetermined threshold range, it returns to S2010, adjusts the illumination condition until the comparison result is within the predetermined threshold range, and repeats the above comparison process.

[0047] The illumination conditions (optimum illumination conditions) when the comparison result falls within a predetermined threshold range are recorded in a recording medium such as a memory, etc. Also, the illumination conditions may be stored in a storage medium such as a secondary storage device connected to the imprint apparatus 100 by wire or wirelessly.

[0048] The optimal illumination conditions are different for each shot area, and are therefore obtained for each shot area. Here, the measurement shot areas for which the optimal illumination conditions are obtained do not need to be all the shot areas on the substrate, and may be limited to the number necessary to derive the approximate illumination conditions in S2020, which will be described later. For example, only the shots at the center of the substrate and the periphery of the substrate may be selected as the measurement shot areas. The selection of the measurement shot areas may be selected in advance, or may be dynamically changed according to the obtained optimal illumination conditions. For example, when the difference in the optimal illumination conditions between two adjacent measurement shot areas is greater than a predetermined threshold value, the shot area at the position sandwiched between the two shots may be dynamically controlled to be a new measurement shot area. All the shot areas on the substrate may be the measurement shot areas for which the optimal illumination conditions are obtained.

[0049] Next, in S2014, the control unit CNT controls the light irradiation mechanism 120 to irradiate the imprint material R with ultraviolet light while the pattern portion of the mold M is in contact with the imprint material R, thereby hardening the imprint material R. Next, in S2016, the control unit CNT controls the mold driving mechanism 134 or the substrate stage 164 to peel the mold M from the hardened imprint material R. Next, in S2018, the control unit CNT judges whether or not the imprint process is completed for all measurement shot areas on the adjustment substrate. If the result of the judgment is that the process is not completed, the process returns to S2004, and the process from S2004 to S2016 is performed for the next measurement shot area. On the other hand, if the process is completed, the process proceeds to S2020.

[0050] Next, in S2020, the control unit CNT first reads out the optimal illumination conditions adjusted in the first illumination process for the multiple measurement shot areas and stored in a storage medium such as a memory or a secondary storage device. Next, approximate illumination conditions for an approximate shot area that is different from the multiple measurement shot areas are derived by function approximation (derivation process). High-order or low-order approximation may be used for the function approximation. Then, the derived approximate illumination conditions are stored in a storage medium such as a memory. In addition, the derived approximate illumination conditions may be stored in a storage medium such as a secondary storage device that is connected to the imprint apparatus 100 by wire or wirelessly. Note that the measurement shot area that is the first shot area and the approximate shot area that is the second shot area are shot areas within the same substrate.

[0051] Next, in S2022, the process is the same as that in S2004, and therefore the description thereof will be omitted. Next, in S2024, the control unit CNT reads (acquires) the approximate illumination conditions derived in S2020 from a storage medium such as a memory or a secondary storage device, and controls the adjustment unit to set the approximate illumination conditions for illuminating the alignment marks of the mold and the substrate. This setting may be performed before S2030, which performs die-by-die alignment, which will be described later. In addition, this may be performed simultaneously or in conjunction with the process of S2026, or simultaneously or in conjunction with the process of S2028, which will be described later. Next, the process proceeds to S2026, and then to S2028, but since S2026 and S2028 are the same as the processes of S2006 and S2008, respectively, the description thereof will be omitted.

[0052] Next, in S2030, the control unit CNT obtains the relative position between the alignment mark AMM of the mold and the alignment mark AMW of the substrate based on the detection result obtained by the alignment scope 172. In order to obtain this relative position, first, the pattern portion of the mold M is brought into contact with the imprint material R supplied onto the approximate shot area. Next, based on the derived approximate illumination conditions, the alignment mark AMM and the alignment mark AMW are illuminated (second illumination step). Then, the substrate stage 164 or the mold driving mechanism 134, the mold shape correction mechanism 140, etc. are controlled to perform die-by-die alignment and perform alignment (second alignment step). At this time, since the approximate illumination conditions of the approximate shot area have been derived in advance in S2020 and the setting of the approximate illumination conditions has been completed in S2024, it is not necessary to repeatedly adjust the illumination conditions of the alignment marks of the mold and the substrate in this S2030. This leads to an improvement in throughput and can improve productivity.

[0053] Next, the process proceeds to S2032, and then to S2034. However, since S2032 and S2034 are the same as the processes of S2014 and S2016, respectively, the description will be omitted. Next, in S2036, the control unit CNT judges whether or not the imprint process has been completed for all the shot areas on the adjustment substrate. If the result of the judgment is that the imprint process has not been completed for all the shot areas on the adjustment substrate, the process returns to S2022 and repeats the same process. On the other hand, if the imprint process has been completed for all the shot areas on the adjustment substrate, the process proceeds to S2038. Finally, in S2038, the control unit CNT controls a transport device (not shown) to transport the adjustment substrate out.

[0054] Based on the illumination conditions (optimum illumination conditions, approximate illumination conditions) obtained by the investigation described above, the control unit CNT can adjust the transmittance according to the shot area where a pattern will be formed by driving the light amount adjustment mechanism 154. For example, even if the area where a pattern will be formed is the first area on the substrate W where a pattern will be formed, the control unit CNT can adjust the transmittance by driving the light amount adjustment mechanism so that measurement can be performed by the alignment scope 172 in an appropriate state (optimum state).

[0055] Here, the light amount adjustment mechanism 154 uses a filter such as a continuously variable ND filter that can continuously change the transmittance, but when such a filter is used, it takes several hundred msec to complete the drive to change the transmittance. Therefore, in S1006, the control unit CNT drives the light amount adjustment mechanism 154 to start the transmittance change adjustment, but in S1006, the control unit CNT moves to the next step S1008 without waiting for the adjustment to be completed. In other words, the drive to change the transmittance is completed after S1008.

[0056] Next, in S1008, the control unit CNT controls the application mechanism 180 to supply (apply) the imprint material R to the shot region where the pattern is to be formed. As described above, the imprint material R may be supplied in advance to the entire surface of the substrate W using an external device. In that case, the process of S1008 is not necessary.

[0057] Next, in S1010, the control unit CNT drives the alignment stage mechanism 174 to move the alignment scope 172 to the position of the alignment mark AMM on the mold M.

[0058] Next, in S1012, the control unit CNT controls the mold operation mechanism 130 to lower the mold M (move in the -Z direction) and press (impress) the pattern portion of the mold M against the imprint material R on the shot region. At this time, the pattern portion of the mold M is kept in contact with the imprint material R, and the imprint material R is filled into the pattern portion of the mold M. The load when pressing the pattern portion of the mold M against the imprint material R can be controlled, for example, using a load sensor built into the mold driving mechanism 134. Note that the control unit CNT may control the substrate driving unit 160 to raise the substrate W (move in the +Z direction) instead of moving the mold M, and bring the pattern portion of the mold M into contact with the imprint material R on the shot region.

[0059] Next, in S1014, the control unit CNT controls the alignment mechanism 170 to start alignment measurement. In this embodiment, the alignment measurement is performed according to the die-by-die alignment method. Specifically, the control unit CNT controls the alignment mechanism 170 to capture an image of the alignment mark AM with the alignment scope 172 to obtain an image. Then, based on the obtained image, the control unit CNT measures the relative positions of the alignment marks of the mold M and the substrate W. Then, the control unit CNT also measures the difference (coordinates, rotation, magnification, pedestal component, etc.) between the shot shapes of the mold M and the substrate W based on the measurement result of the relative positions of the alignment marks.

[0060] Next, in S1016, the control unit CNT aligns the alignment mark AMM of the mold M with the alignment mark AMW of the substrate W. At this time, the control unit CNT may align the alignment by controlling the substrate driving unit 160 to move the substrate W. Also, the control unit CNT may align the alignment by controlling the mold operation mechanism 130 to move the mold M. Note that, the control unit CNT may align the alignment by controlling both the substrate driving unit 160 and the mold operation mechanism 130 to move the substrate W and the mold M. Also, in S1016, the control unit CNT controls the mold shape correction mechanism 140 to correct the shape of the mold M. Note that, the correction of the mold M in S1016 may be performed, for example, by setting a threshold value for the deformation amount of the substrate W, when the threshold value is equal to or greater than a predetermined amount at the time of S1016. In this case, a sensor capable of measuring the deformation amount of the mold M may be disposed in the mold chuck 132 or the mold shape correction mechanism 140.

[0061] Next, in S1018, the control unit CNT judges whether the light amount of the image captured by the alignment scope 172 in S1014 is equal to or greater than a predetermined threshold. In other words, the control unit CNT judges whether the light amount of the image captured by the alignment scope 172 in S1014 is outside a preset tolerance. If the result of the judgment is equal to or greater than the predetermined threshold, the control unit CNT advances to S1020 since the light amount of the image is outside the preset tolerance. On the other hand, if the result of the judgment is less than the predetermined threshold, the control unit CNT advances to S1022 since the light amount of the image is within the preset tolerance. Note that, if the result of the judgment is less than the predetermined threshold, the control unit CNT does not adjust the light amount of the light irradiated from the light source 152 at least before the imprint material R is cured. That is, the light amount adjustment mechanism 154 is not driven to adjust the transmittance until the imprint material R is cured in S1030 described later.

[0062] Next, in S1020, the control unit CNT controls the light amount adjustment mechanism 154 so that the light amount falls within the tolerance range, and starts driving to change the transmittance. That is, in S1020, the control unit CNT adjusts the amount of light irradiated from the light source 152 based on the light amount of the image captured by the alignment scope 172. Note that in S1020, similarly to S1006, the control unit CNT drives the light amount adjustment mechanism 154 to start the transmittance change adjustment, but proceeds to the next step S1022 without waiting for the adjustment to be completed. That is, the drive to change the transmittance is completed after S1022.

[0063] Next, in S1022, the control unit CNT judges whether the difference in the shot shape between the mold M and the substrate W is equal to or greater than a predetermined threshold. In other words, the control unit CNT judges whether the difference in the shot shape between the mold M and the substrate W is outside a preset tolerance. If the result of the judgment is less than the predetermined threshold, the difference in the shot shape between the mold M and the substrate W is within the preset tolerance, and the process proceeds to S1024. On the other hand, if the difference is equal to or greater than the predetermined threshold, the difference in the shot shape between the mold M and the substrate W is outside the preset tolerance, and the process returns to S1014 and performs the same process as above. Note that, when returning from S1022 to S1014, the mold shape correction is performed until the difference in the shot shape between the mold M and the substrate W is within the preset tolerance. The judgment in S1022 is performed because there is a possibility that a correction error occurs due to a driving error of the mold shape correction mechanism 140 when the mold shape correction mechanism 140 corrects the shape of the mold M.

[0064] Next, in S1024, it is determined whether or not the drive to change the transmittance of the light amount adjustment mechanism 154 has been completed. If the result of the determination is that the drive to change the transmittance of the light amount adjustment mechanism 154 has been completed, the process proceeds to S1028. On the other hand, if the drive to change the transmittance of the light amount adjustment mechanism 154 has not been completed, the process proceeds to S1026. As described above, the light amount adjustment mechanism 154 can continuously adjust the transmittance. Therefore, even if the drive to change the transmittance has not been completed, it is possible to start alignment measurement in S1014, and it is possible to proceed to the subsequent steps (steps after S1014) even during the drive to change the transmittance. Here, if the drive to change the transmittance has not been completed before the curing process of the imprint material R, it may affect the final overlay, so in this step, it is determined whether or not the drive to change the transmittance has been completed.

[0065] Next, in S1026, the control unit CNT issues an error. That is, it notifies the user of the error. The error notification may be, for example, a message indicating that the adjustment of the transmittance has not been completed in the shot area in which the error was issued, on the display of an information terminal such as a PC operated by the user. Also, for example, a layout showing the arrangement of the substrate W and the shot areas as shown in FIG. 5 may be displayed on a display or the like, and the location of the shot area in which the error was issued may be displayed to the user. At this time, the color of the shot area in which the error was issued may be changed from that of the shot areas in which the error was not issued, or may be hatched or may be blinked. Furthermore, the control unit CNT records information on the shot area in which the imprint process was being performed at the time the error was issued in a recording medium such as a memory. In this way, by issuing an error and recording the issued error, the user can check in which shot area the error was issued, for example, after the imprint process is completed in all the shot areas.

[0066] Next, in S1028, the control unit CNT controls the alignment mechanism 170 to end the alignment measurement. Next, in S1030, the control unit CNT controls the light irradiation mechanism 120 to irradiate the imprint material R with ultraviolet light while the pattern portion of the mold M is in contact with the imprint material R, thereby hardening the imprint material R. The hardening process of the imprint material R is started in a state where alignment measurement is performed and alignment control is performed to correct positional deviation. After the pattern portion of the mold M is brought into contact with the imprint material R in S1012, the state in which the pattern portion of the mold M is in contact with the imprint material R is maintained until the timing of release in S1034, which will be described later.

[0067] Next, in S1032, the control unit CNT drives the light amount adjustment mechanism 154 to adjust the transmittance so that the illumination condition of the alignment mechanism 170 is set in the shot area where the next pattern is to be formed. Specifically, after the imprint material R is cured in a state where the mold M and the substrate W are aligned (position adjustment) based on the result of the alignment measurement, the control unit CNT drives the light amount adjustment mechanism 154 to adjust the transmittance. Here, when starting the adjustment of the transmittance, the control unit CNT drives the light amount adjustment mechanism 154 toward the target transmittance in the shot area where the next pattern is to be formed. The target transmittance is determined based on the illumination conditions (optimum illumination conditions, approximate illumination conditions) previously investigated as described above, and is the transmittance targeted in the shot area where the next pattern is to be formed. Note that in S1032, similarly to S1006 and S1020, the control unit CNT drives the light amount adjustment mechanism 154 to start the transmittance change adjustment, but proceeds to the next step S1034 without waiting for the completion of the adjustment. That is, the transmittance change driving is completed after S1034.

[0068] Next, in S1034, the control unit CNT controls the mold operation mechanism 130 to raise (move in the +Z direction) the mold M, thereby separating (releasing) the pattern portion of the mold M from the imprint material R. Note that the control unit CNT may control the substrate driving unit 160 to lower (move in the -Z direction) the substrate W instead of moving the mold M, thereby separating the pattern portion of the mold M from the imprint material R.

[0069] As described above, in S1032, the adjustment of the transmittance is started so as to achieve the illumination conditions for the alignment mechanism 170 to illuminate the shot region where the next pattern is to be formed. That is, before the start of S1034, based on the result of the alignment measurement, in a state in which the mold M and the substrate W are aligned, the imprint material is cured, and then the transmittance is adjusted by the light amount adjustment mechanism 154 before separation (mold release process) between the mold M and the substrate W is completed.

[0070] Next, in S1036, it is determined whether or not imprint processing has been completed for all shot areas of the substrate W. If the result of the determination is that imprint processing has not been completed for all shot areas of the substrate W, the process returns to S1008, and the same process as described above is performed for the next shot area to be imprint processed. On the other hand, if imprint processing has been completed for all shot areas, the process proceeds to step 1038. Next, in S1038, the substrate W is unloaded from the substrate chuck 162 by a transport mechanism (not shown).

[0071] As described above, in the process of this embodiment, the control unit CNT drives the light amount adjustment mechanism 154 to adjust the transmittance in S1006 and S1032. Note that, depending on the determination result, the control unit CNT also adjusts the transmittance in S1020. In other words, in this embodiment, the control unit CNT drives the light amount adjustment mechanism 154 to adjust the transmittance at least at any one of the following times: before forming a pattern in the shot area, after the alignment measurement is completed, and after the imprint material R is cured.

[0072] In this embodiment, in S1024, it is determined whether or not the drive to change the transmittance of the light amount adjustment mechanism 154 has been completed, and an error is issued if the drive to change the transmittance has not been completed. Here, if the drive to change the transmittance has not been completed, an error may not be issued, and the process may return to S1014 and restart the alignment measurement. In this case, S1014 to S1024 may be repeated until the drive to change the transmittance of the light amount adjustment mechanism 154 has been completed. Note that if the drive to change the transmittance has not been completed, an error may be issued, and the process may return to S1014 and restart the alignment measurement.

[0073] Incidentally, the drive time to the desired light amount can be shortened by using the drive to change the transmittance of the light amount adjustment mechanism 154 in a region with low transmittance. Therefore, when the drive to change the transmittance of the light amount adjustment mechanism 154 is used in a region with low transmittance, it is preferable to increase the intensity of the light source 152 of the alignment illumination mechanism 150 as much as possible. That is, when adjusting the amount of light irradiated from the light source 152 using a region with low transmittance in the light amount adjustment mechanism 154, the control unit CNT increases the intensity of the light irradiated from the light source 152. By increasing the intensity of the light source 152, the light amount adjustment mechanism 154 can be used in a region with low transmittance.

[0074] In addition, in S1022, the process proceeds to the next step (S1024) when the difference between the shot shapes of the mold M and the substrate W (residual difference between the shot and the shape) is within a preset tolerance. However, the process is not limited to this, and the process may proceed to the next step when a preset time has elapsed since the start of alignment.

[0075] As described above, according to the imprint apparatus 100 of this embodiment, by changing the transmittance based on the illumination conditions for each shot area that have been investigated in advance, it becomes possible to perform measurement and photography using the alignment scope 172 in an appropriate (optimal) state. This not only prevents a decrease in throughput, but also provides an imprint apparatus 100 that can perform accurate imprinting because the inflow amount of gas, such as helium, that promotes filling is not changed for each shot.

[0076] <Example of article manufacturing method> The method for manufacturing an article according to this embodiment is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. The method for manufacturing an article according to this embodiment includes a step of forming a pattern on a composition applied to a substrate using the above-mentioned imprint apparatus 100 (a step of processing the substrate), and a step of processing the substrate on which the pattern has been formed in this step. Furthermore, this manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, composition peeling, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0077] The pattern of the cured material formed using the imprint apparatus 100 is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, molds, etc. Examples of electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGAs. Examples of molds include molds for substrate processing such as imprinting.

[0078] The pattern of the cured product may be used as it is as at least a part of a component of the article, or may be used temporarily as a composition mask, which is removed after etching or ion implantation is performed in a substrate processing step.

[0079] Next, a specific method for manufacturing an article will be described with reference to Fig. 7. As shown in Fig. 7(A), a substrate 1z such as a silicon substrate having a workpiece 2z such as an insulator formed on its surface is prepared, and then a composition 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which the composition 3z in the form of multiple droplets is applied onto the substrate 1z is shown.

[0080] As shown in FIG. 7(B), the mold 4z is placed so that the side on which the concave-convex pattern is formed faces the composition 3z on the substrate 1z. As shown in FIG. 7(C), the substrate 1z to which the composition 3z is applied is brought into contact with the mold 4z, and pressure is applied (contact step). The composition 3z fills the gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the composition 3z is cured (curing step). At this time, in this embodiment, it is possible to irradiate the composition with light at an irradiation amount that results in an optimal degree of photopolymerization based on the spectral sensitivity characteristics acquired within the device.

[0081] As shown in Fig. 7(D), after the composition 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the composition 3z is formed on the substrate 1z (pattern formation step, molding step). In this cured product pattern, the concave portions of the mold 4z correspond to the convex portions of the cured product, and the convex portions of the mold 4z correspond to the concave portions of the cured product, that is, the concave-convex pattern of the mold 4z is transferred to the composition 3z.

[0082] As shown in FIG. 7(E), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin portion remains is removed, forming a groove 5z. As shown in FIG. 7(F), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing. Note that, although an example of using a mold for transferring a circuit pattern provided with a concave-convex pattern as the mold 4z has been described, it may also be a flat template having a flat portion without a concave-convex pattern.

[0083] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the present invention. In addition, the above-described embodiments may be combined to carry out the present invention.

[0084] The disclosure of this embodiment includes the following configurations and methods.

[0085] (Configuration 1) An imprinting apparatus that uses a mold having a pattern portion to sequentially harden and form a pattern of an imprinting material in a plurality of shot areas on a substrate, comprising: an alignment measurement unit that measures a relative position between the substrate and the mold by detecting a mark formed on the substrate and a mark provided on the mold; an alignment illumination unit that includes a light amount adjustment mechanism that adjusts the amount of light emitted from a light source and illuminates the marks on the mold and the substrate so that they can be detected by the alignment measurement unit; and a control unit that controls the light amount adjustment mechanism to start adjusting the light amount adjustment mechanism so as to achieve illumination conditions when the alignment illumination unit illuminates a shot area in which a next pattern is to be formed, after the imprint material is cured in a state in which the position of the mold and the substrate is adjusted based on a measurement result of the alignment measurement unit. 1. An imprint apparatus comprising:

[0086] (Configuration 2) The imprint apparatus described in configuration 1, characterized in that after hardening the imprint material while adjusting the positions of the mold and the substrate based on the measurement results of the alignment measurement unit, and before separation of the mold and the substrate is completed, the control unit starts adjusting the light intensity adjustment mechanism so as to achieve illumination conditions when the alignment illumination unit illuminates a shot area in which the next pattern is to be formed.

[0087] (Configuration 3) The light amount adjustment mechanism is capable of continuously adjusting the transmittance, 2. The imprint apparatus according to claim 1, wherein the control unit adjusts the transmittance by driving the light amount adjustment mechanism to set the illumination conditions.

[0088] (Configuration 4) The imprinting apparatus described in configuration 3, characterized in that the control unit drives the light amount adjustment mechanism to achieve a target transmittance in the shot area in which the next pattern is to be formed after hardening the imprinting material.

[0089] (Configuration 5) The imprint apparatus described in configuration 3 or 4, characterized in that the control unit drives the light amount adjustment mechanism to adjust the transmittance at any one of the following times: before forming a pattern in the shot area, after measurement by the alignment measurement unit is completed, or after the imprint material is hardened.

[0090] (Configuration 6) The imprint apparatus described in any one of configurations 3 to 5, characterized in that when forming a pattern for the first of the multiple shot areas, the control unit drives the light amount adjustment mechanism to adjust the transmittance so that the alignment measurement unit can measure in an appropriate condition.

[0091] (Configuration 7) The imprinting apparatus of any one of configurations 3 to 6, characterized in that the control unit notifies an error if the adjustment of the transmittance is not completed before the imprinting material is hardened.

[0092] (Configuration 8) the alignment measurement unit has an alignment scope that captures images of the marks on the mold and the substrate and acquires images; The imprint apparatus of any one of configurations 1 to 7, characterized in that when the control unit drives the light intensity adjustment mechanism after measuring the relative position with the alignment measurement unit, the control unit adjusts the amount of light irradiated from the light source based on the light amount of the image captured by the alignment scope.

[0093] (Configuration 9) The imprinting apparatus described in configuration 8, characterized in that the control unit does not adjust the amount of light irradiated from the light source, at least before the imprinting material hardens, when the amount of light of the image is greater than or equal to a threshold value.

[0094] (Configuration 10) the light amount adjustment mechanism has a plurality of regions with different transmittances, The imprint apparatus described in any one of configurations 1 to 9, characterized in that the control unit increases the intensity of the light irradiated from the light source when adjusting the amount of light irradiated from the light source using a low transmittance area in the light amount adjustment mechanism.

[0095] (Configuration 11) 11. The imprint apparatus according to any one of configurations 1 to 10, wherein the light amount adjustment mechanism is a continuously variable ND filter.

[0096] (Configuration 12) 11. The imprint apparatus according to any one of configurations 1 to 10, wherein the light amount adjustment mechanism is a liquid crystal ND filter.

[0097] (Configuration 13) 1. An imprinting method for forming a pattern of an imprint material in a plurality of shot areas on a substrate by sequentially curing the imprint material using a mold having a pattern portion, comprising: a measuring step of measuring a relative position between the substrate and the mold by detecting a mark formed on the substrate and a mark provided on the mold; an illumination step of illuminating the marks on the mold and the substrate in a state that can be detected in the measurement step, using a light amount adjustment mechanism that adjusts the amount of light emitted from a light source; and a control process of controlling the light amount adjustment mechanism to start adjusting the light amount so as to achieve an illumination condition when illuminating a shot area in which a next pattern is to be formed in the illumination process after the imprint material is cured in a state in which the position of the mold and the substrate is adjusted based on a measurement result in the measurement process. 1. An imprint method comprising:

[0098] (Configuration 14) A pattern forming step of forming a concave-convex pattern on the substrate using the imprint apparatus according to configuration 1; a processing step of processing the substrate on which the pattern has been formed in the pattern forming step; manufacturing an article from the substrate processed in the processing step; A method for producing an article, comprising:

[0099] Furthermore, a computer program that realizes part or all of the control in each of the above-described embodiments may be supplied to the imprint apparatus 100 or the like via a network or various storage media. Then, a computer (or a CPU, MPU, or the like) in the imprint apparatus 100 or the like may read and execute the program. In this case, the program and the storage medium on which the program is stored constitute the present invention. [Explanation of symbols]

[0100] 100 Imprinting device 120 Light irradiation mechanism 140 type shape correction mechanism 150 Alignment lighting mechanism 160 Board drive unit 170 Alignment mechanism M type R Imprint material W substrate

Claims

1. An imprinting apparatus that uses a mold having a pattern portion to sequentially harden and form a pattern of an imprinting material in a plurality of shot areas on a substrate, comprising: an alignment measurement unit that measures a relative position between the substrate and the mold by detecting a mark formed on the substrate and a mark provided on the mold; an alignment illumination unit that includes a light amount adjustment mechanism that adjusts the amount of light emitted from a light source and illuminates the marks on the mold and the substrate so that they can be detected by the alignment measurement unit; and a control unit that controls the light amount adjustment mechanism to start adjusting the light amount adjustment mechanism so as to achieve illumination conditions when the alignment illumination unit illuminates a shot area in which a next pattern is to be formed, after the imprint material is cured in a state in which the position of the mold and the substrate is adjusted based on a measurement result of the alignment measurement unit.

1. An imprint apparatus comprising:

2. The imprint apparatus of claim 1, wherein the control unit starts adjusting the light intensity adjustment mechanism so as to achieve illumination conditions when the alignment illumination unit illuminates a shot area in which a next pattern is to be formed, after hardening the imprint material while adjusting the positions of the mold and the substrate based on the measurement results of the alignment measurement unit, and before separation of the mold and the substrate is completed.

3. The light amount adjustment mechanism is capable of continuously adjusting the transmittance, The imprint apparatus according to claim 1 , wherein the control unit sets the illumination conditions by adjusting the transmittance by driving the light amount adjustment mechanism.

4. The imprint apparatus according to claim 3 , wherein the control unit drives the light amount adjustment mechanism to achieve a target transmittance of a shot area in which a next pattern is to be formed after hardening the imprint material.

5. The imprint apparatus according to claim 3, characterized in that the control unit drives the light amount adjustment mechanism to adjust the transmittance at any one of the following times: before forming a pattern in the shot area, after measurement by the alignment measurement unit is completed, or after hardening the imprint material.

6. The imprint apparatus according to claim 3, wherein the control unit drives the light amount adjustment mechanism to adjust the transmittance so that the alignment measurement unit can perform measurement in an appropriate condition when forming a pattern first among the multiple shot areas.

7. The imprint apparatus according to claim 3 , wherein the control unit notifies an error if the adjustment of the transmittance is not completed before the imprint material is cured.

8. the alignment measurement unit has an alignment scope that captures images of the marks on the mold and the substrate and acquires images; The imprint apparatus according to claim 1, characterized in that when the control unit drives the light amount adjustment mechanism after measuring the relative position with the alignment measurement unit, the control unit adjusts the amount of light irradiated from the light source based on the light amount of the image captured by the alignment scope.

9. The imprinting apparatus according to claim 8, characterized in that when the light amount of the image is equal to or greater than a threshold value, the control unit does not adjust the amount of light irradiated from the light source, at least before the imprinting material hardens.

10. the light amount adjustment mechanism has a plurality of regions with different transmittances, The imprint apparatus according to claim 1, characterized in that the control unit increases the intensity of the light irradiated from the light source when adjusting the amount of light irradiated from the light source using an area with low transmittance in the light amount adjustment mechanism.

11. 11. The imprint apparatus according to claim 1, wherein the light amount adjustment mechanism is a continuously variable ND filter.

12. 11. The imprint apparatus according to claim 1, wherein the light amount adjustment mechanism is a liquid crystal ND filter.

13. 1. An imprinting method for forming a pattern of an imprint material in a plurality of shot areas on a substrate by sequentially curing the imprint material using a mold having a pattern portion, comprising: a measuring step of measuring a relative position between the substrate and the mold by detecting a mark formed on the substrate and a mark provided on the mold; an illumination step of illuminating the marks on the mold and the substrate in a state that can be detected in the measurement step, using a light amount adjustment mechanism that adjusts the amount of light emitted from a light source; and a control process of controlling the light amount adjustment mechanism to start adjusting the light amount so as to achieve an illumination condition when illuminating a shot area in which a next pattern is to be formed in the illumination process after the imprint material is cured in a state in which the position of the mold and the substrate is adjusted based on a measurement result in the measurement process.

1. An imprint method comprising:

14. a pattern forming step of forming a concave-convex pattern on the substrate using the imprint apparatus according to claim 1; a processing step of processing the substrate on which the pattern has been formed in the pattern forming step; manufacturing an article from the substrate processed in the processing step; A method for producing an article, comprising:

Images