Substrate separation device, and substrate processing device

Abstract

To provide a substrate separation device in which separation of a bonded substrate is prevented from being disturbed, and a substrate processing device.SOLUTION: A substrate separation device 1 comprises: a first holder 110 which holds a first surface Sa2 of a bonded substrate S; a second holder 120 which holds a second surface Sb2 at the opposite side; and a nozzle 30 which discharges fluid toward an outer periphery of the rotating bonded substrate S. The first holder 110 includes a first contact area CA1 which is brought into contact with the first surface Sa2 when the bonded substrate S is held. The second holder 120 includes: a second contact area CA2 which is brought into contact with the second surface Sb2 when the bonded substrate S is held; and a second non-contact area NA2 which is not brought into contact. The first holder 110 and the second holder 120 are disposed in such a manner that the first contact area CA1 and the second non-contact area NA2 are opposed when the bonded substrate S is held therebetween.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a substrate separating apparatus and a substrate processing apparatus. [Background technology]

[0002] In the manufacturing process of three-dimensional semiconductor devices, a technique is used to bond two substrates together and then separate them, allowing a layer formed on one substrate to be transferred to the other substrate, forming a uniform thin film.

[0003] One technique proposed for separating such substrates involves sandwiching and holding the opposing surfaces of a bonded substrate, which is made by bonding two substrates together, between a pair of holders, and then supplying high-pressure water (a water jet) from a nozzle toward the outer periphery of the bonded substrate while rotating, thereby utilizing the wedge effect of the fluid to separate the bonded substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 11-005064 Summary of the Invention [Problem to be solved by the invention]

[0005] When a water jet is supplied from a nozzle to the outer periphery of a rotating bonded substrate, the water penetrates between the two substrates, causing them to separate from the outer periphery toward the center. However, because the substrates are held in a sandwiched manner, the contact points of the holder with the substrate restrict the displacement of the substrate in the direction of separation. For this reason, even if the two substrates attempt to separate, the progress of the separation may be impeded by the holders in contact with each substrate.

[0006] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a substrate separating device and a substrate processing device that are not hindered from separating bonded substrates. [Means for solving the problem]

[0007] An embodiment of the present invention includes a first holder that holds a first surface of a bonded substrate formed by bonding a pair of substrates together, a second holder that holds a second surface of the bonded substrate opposite the first surface, a rotation drive unit that rotates the first holder and the second holder that hold the bonded substrate between them, and a nozzle that separates the bonded substrate by ejecting a fluid toward the outer periphery of the rotating bonded substrate, wherein the first holder has a first contact area that contacts the first surface when the bonded substrate is held, and the second holder has a second contact area that contacts the second surface when the bonded substrate is held and a second non-contact area that does not contact the second surface, and the first holder and the second holder are arranged such that the first contact area and the second non-contact area face each other when the bonded substrate is held between them.

[0008] A substrate processing apparatus according to an embodiment includes the substrate separating apparatus and a surface processing apparatus for processing a surface of the separated substrate. Effect of the Invention

[0009] According to the embodiment of the present invention, separation of the bonded substrates is not impeded. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a side view showing the substrate separating apparatus according to the embodiment. [Diagram 2] FIG. 4 is an axial cross-sectional view showing a first holder and a second holder holding a bonded substrate. [Diagram 3] FIG. 4 is a bottom perspective view showing a first holding body of the embodiment. [Figure 4] FIG. 4 is a bottom view of the first holder of FIG. 3. [Diagram 5] FIG. 4 is a top perspective view showing a second holding body of the embodiment. [Figure 6] FIG. 6 is a top view of the second holder of FIG. 5. [Figure 7] 13 is a plan view showing the bonded substrate and the positioning unit when the bonded substrate is carried in; FIG. [Figure 8] 11 is a plan view showing the bonded substrate and the positioning portion when the bonded substrate is positioned before a separation step. FIG. [Figure 9] 11A to 11C are plan views showing displacement of the nozzle to a standby position, a separation start position, and a central separation position. [Figure 10] 11 is a plan view showing the bonded substrates, the positioning portion, and the nozzle during separation of the bonded substrates. FIG. [Figure 11] 11 is a plan view showing the bonded substrates, the positioning portion, and the nozzle when the bonded substrates are separated from each other at the center. FIG. [Figure 12] 4 is a flowchart showing a procedure for separating the bonded substrates of the embodiment. [Figure 13] 4A to 4C are explanatory views showing a process from carrying in a bonded substrate to a separation process according to an embodiment. [Figure 14] 1 is a plan view showing a substrate processing apparatus including a substrate separating apparatus according to an embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The substrate separating apparatus of the embodiment will be described with reference to the drawings. The drawings are schematic diagrams, and the sizes, ratios, etc. of each part are exaggerated for ease of understanding. As shown in FIG. 1, the substrate separating apparatus 1 is an apparatus for separating a bonded substrate S by discharging a fluid from a nozzle 30. In FIG. 1, the gripping part 210 and the placement part 220 in the foreground are omitted. In the following description, the direction along the rotation axis of the bonded substrate S is the Z direction, the direction in which the nozzle 30 discharges the fluid in a plane perpendicular to the Z direction is the Y direction, and the direction perpendicular to the Y direction is the X direction. The rotation plane of the bonded substrate S is parallel to the XY plane. In this embodiment, the Z direction is the vertical direction, and the XY direction is the horizontal direction, but the installation direction of the substrate separating apparatus 1 is not limited to this.

[0012] [Laminated board] The bonded substrate S is a circular substrate formed by bonding a first substrate Sa and a second substrate Sb together. The first substrate Sa has a bonding surface Sa1 and a surface Sa2 on the opposite side. The second substrate Sb has a bonding surface Sb1 and a surface Sb2 on the opposite side. That is, the bonded substrate S is a pair of circular surfaces, and has a first surface Sa2 and a second surface Sb2 on the opposite side to the bonded surfaces of the first substrate Sa and the second substrate Sb. Hereinafter, the surface Sa2 is referred to as the first surface of the bonded substrate S, and the surface Sb2 is referred to as the second surface of the bonded substrate S. The first substrate Sa is, for example, a substrate having a porous layer formed on the surface of a semiconductor wafer, and a single crystal Si layer formed thereon.

[0013] The second substrate Sb is, for example, a substrate in which a single crystal Si layer is formed on the surface of a semiconductor wafer. The first substrate Sa and the second substrate Sb are bonded together via an insulating layer formed on the first substrate Sa or the second substrate Sb to form a bonded substrate S. In the following description, even if the first substrate Sa and the second substrate Sb are separated from each other, the bonded substrate S is still called a bonded substrate S as long as the bonded surfaces Sa1 and Sb1 are overlapped with each other.

[0014] [Substrate separation equipment] The substrate separating apparatus 1 separates the first substrate Sa of the bonded substrate S from the porous layer, and forms multiple single crystal Si layers on the second substrate Sb. As shown in FIG. 1, the substrate separating apparatus 1 has a holding unit 10, a positioning unit 20, a nozzle 30, a nozzle driving unit 40, and a control device 100.

[0015] [Holding part] The holding unit 10 holds and rotates both sides (Sa2 and Sb2) of the bonded substrate S. The holding unit 10 has a first holding mechanism 11 and a second holding mechanism 12.

[0016] (First holding mechanism) The first holding mechanism 11 has a first holding body 110 and a support mechanism 113 .

[0017] <First Holder> As shown in Figs. 1 and 2, the first holder 110 holds one surface (first surface Sa2) of the bonded substrate S. Also, as shown in Figs. 3 and 4, the first holder 110 has a first contact area CA1 and a first non-contact area NA1. The first contact area CA1 is an area that comes into contact with the first surface Sa2 when the first holder 110 holds the bonded substrate S. The first non-contact area NA1 is an area that does not come into contact with the first surface Sa2 when the first holder 110 holds the bonded substrate S.

[0018] Such a first holding body 110 is composed of a base portion 111 and a support portion 112. The base portion 111 is a circular plate having a diameter smaller than that of the bonded substrate S. In other words, the first holding body 110 has a smaller diameter than the bonded substrate S. When the first holding body 110 holds the bonded substrate S, the central axis Ct of the first holding body 110, i.e., the central axis of the base portion 111, coincides with the central axis Cs of the first surface Sa2 of the bonded substrate S (see FIG. 8). In this embodiment, the central axes Ct and Cs are vertical, and the bonded substrate S is held in the horizontal direction.

[0019] The base portion 111 has a first opposing portion 111a, a first groove 111b, a first suction port 111c, and an air passage 111d. The first opposing portion 111a faces the first surface Sa2 of the bonded substrate S. In this embodiment, the first opposing portion 111a is the bottom surface of the first holder 110, and faces the first surface Sa2 from above.

[0020] The first groove 111b is a groove formed in the first opposing portion 111a in a direction along the first surface Sa2. Along the first surface Sa2 means that it extends linearly in a direction parallel to the first surface Sa2 in contact with the first opposing portion 111a. In this embodiment, the first groove 111b has a circular portion and a cross-shaped portion. The circular portion is coaxial with the bonded substrate S. That is, the center of the circular portion coincides with the center of the bonded substrate S in a held state. The cross-shaped portion is provided within the circular portion so as to communicate with the circular portion.

[0021] Thus, in the first opposing portion 111a, the portion where the first groove 111b is formed is the first non-contact area NA1, and the remaining portion is the first contact area CA1. In this embodiment, as shown in Figures 3 and 4, the first contact area CA1 has an annular portion along the outer edge of the first holding body 110 and four sector-shaped portions that divide the inside of the annular portion. The surfaces that constitute the first contact area CA1 are flush with each other.

[0022] The first contact area CA1 does not face the central axis Cs of the first surface Sa2 when holding the bonded substrate S. In other words, the area corresponding to the central axis Cs of the first surface Sa2 is the center of the cross-shaped portion and is part of the first non-contact area NA1.

[0023] As shown in Fig. 2 and Fig. 4, the first suction port 111c is provided in the first groove 111b and sucks the first surface Sa2 by negative pressure. The first suction port 111c in this embodiment is provided at the center of the cross-shaped portion of the first groove 111b, that is, at a position corresponding to the central axis Cs of the bonded substrate S. The ventilation path 111d is a path provided to penetrate the first holding body 110, one end of which is connected to the first suction port 111c and the other end of which is connected to the exhaust device 13 via a pipe. This allows the first holding body 110 to suck and hold the first surface Sa2 by negative pressure.

[0024] The support portion 112 is a circular plate having a diameter smaller than that of the base portion 111. The support portion 112 is provided coaxially with the base portion 111 on the side opposite to the first opposing portion 111a of the base portion 111. The support portion 112 is attached to and supported by a support mechanism 113, which will be described later. The ventilation path 111d is provided so as to penetrate continuously into the support portion 112 as well.

[0025] <Support mechanism> As shown in FIG. 1, the support mechanism 113 rotatably supports the first holding body 110 such that its central axis Ct is the center of rotation. The support mechanism 113 has a support shaft 113a in the Z direction, and the support portion 112 of the first holding body 110 is coaxially connected to this support shaft 113a. In this embodiment, the support shaft 113a is connected to a drive source that rotates the second holding body 120 described later via a pulley and a timing belt, and rotates in synchronization with the second holding body 120. In this embodiment, the support portion 112 supported by the support shaft 113a of the first holding body 110 faces up, and the first opposing portion 111a on the opposite side faces down (see FIG. 2).

[0026] (Second holding mechanism) The second holding mechanism 12 has a second holding body 120, a rotation drive unit 123, and an attachment / detachment drive unit .

[0027] <Second Holder> As shown in Figs. 1 and 2, the second holder 120 holds the other surface (second surface Sb2) of the bonded substrate S. Also, as shown in Figs. 5 and 6, the second holder 120 has a second contact area CA2 and a second non-contact area NA2. The second contact area CA2 is an area that comes into contact with the second surface Sb2 when the second holder 120 holds the bonded substrate S. The second non-contact area NA2 is an area that does not come into contact with the second surface Sb2 when the second holder 120 holds the bonded substrate S.

[0028] Such a second holding body 120 is composed of a base portion 121 and a support portion 122. The base portion 121 is a circular plate having a diameter smaller than that of the bonded substrate S. In other words, the second holding body 120 has a smaller diameter than the bonded substrate S. However, the second holding body 120 has a larger diameter than the first holding body 110. More specifically, the base portion 121 of the second holding body 120 has a larger diameter than the base portion 111 of the first holding body 110. When the second holding body 120 holds the bonded substrate S, the central axis Ct of the second holding body 120, i.e., the central axis of the base portion 111, coincides with the central axis Cs of the second surface Sb2 of the bonded substrate S (see FIG. 8).

[0029] The base portion 121 has a second opposing portion 121a, an annular protruding portion 121b, a central protruding portion 121c, a second groove 121d, a second suction port 121e, and an air passage 121f. The second opposing portion 121a faces the second surface Sb2 of the bonded substrate S. In this embodiment, the second opposing portion 121a is the upper surface of the second holding body 120, and faces the second surface Sb2 from below.

[0030] As shown in Figs. 5 and 6, the annular protrusion 121b is an annular portion protruding from the second opposing portion 121a toward the second surface Sb2. The annular protrusion 121b of this embodiment is provided along the outer edge of the second opposing portion 121a and has a cylindrical shape coaxial with the second holding body 120. The central protrusion 121c is a columnar portion protruding from the center of the second opposing portion 121a toward the second surface Sb2. The central protrusion 121c of this embodiment has a cylindrical shape coaxial with the second holding body 120. The outer diameter of the central protrusion 121c is smaller than the inner diameter of the annular protrusion 121b.

[0031] The second groove 121d is a groove formed in the annular protrusion 121b in a direction along the second surface Sb2. Along the second surface Sb2 means that the second groove 121d extends linearly in a direction parallel to the second surface Sb2 that is in contact with the annular protrusion 121b. In this embodiment, the second groove 121d is a groove formed in a circular shape coaxial with the annular protrusion 121b on the surface of the annular protrusion 121b that faces the second surface Sb2.

[0032] In the second facing portion 121a, the area where the annular protrusion 121b and the central protrusion 121c are not formed and the area where the second groove 121d is formed are the second non-contact area NA2. The surface of the annular protrusion 121b and the central protrusion 121c facing the second surface Sb2, other than the second non-contact area NA2, is the second contact area CA2. In this embodiment, the second contact area CA2 is the upper surface of the annular protrusion 121b other than the second groove 121d and the upper surface of the central protrusion 121c. The surfaces constituting the second contact area CA2 are flush with each other. In addition, the two annular recessed areas (recesses) shown in FIG. 2, FIG. 4, and FIG. 5 are the second non-contact area NA2.

[0033] A part of the second contact area CA2 faces the central axis Cs of the second surface Sb2 when the bonded substrate S is held. The second contact area CA2 corresponding to the central axis Cs of the second surface Sb2 faces the center of the cross-shaped portion of the first non-contact area NA1.

[0034] As shown in Fig. 2 and Fig. 6, the second suction port 121e is provided in the second groove 121d and sucks the second surface Sb2 by negative pressure. In this embodiment, four second suction ports 121e are provided at equal intervals on the bottom of the second groove 121d. The ventilation path 121f is a path provided to penetrate the second holder 120, and a plurality of paths, one end of which is connected to each second suction port 121e, join at the central axis Ct of the second holder 120 and are connected to the exhaust device 13 via a pipe. This allows the second holder 120 to suck and hold the second surface Sb2 by negative pressure.

[0035] The support part 122 is a circular plate having a diameter smaller than that of the base part 121. The support part 122 is provided coaxially with the base part 121 on the side opposite to the second opposing part 121a of the base part 121. The support part 122 is attached to and supported by a rotation drive part 123 described later. The ventilation path 121f is provided so as to penetrate continuously into the support part 122 as well.

[0036] <Rotation drive unit> The rotation drive unit 123 rotates the bonded substrate S. The rotation drive unit 123 has a drive shaft 123a in the Z direction, and the support unit 112 of the second holding body 120 is coaxially connected to this drive shaft 123a. The rotation drive unit 123 has a motor as a drive source that rotates the second holding body 120. The drive shaft 123a is the shaft of the motor, and the second holding body 120 rotates about the central axis Ct when the motor is operated.

[0037] In this embodiment, the surface of the second holding body 120 attached to the drive shaft 123a faces down, and the second opposing part 121a on the opposite side faces up and faces the first holding body 110. In other words, the first holding body 110 and the second holding body 120 are disposed facing each other with a space between them so that their central axes of rotation Ct coincide with each other.

[0038] <Detachable drive unit> The attachment / detachment driving unit 124 causes the holding unit 10 to hold the bonded substrate S. The attachment / detachment driving unit 124 moves the second holding body 120 in a direction approaching or separating from the first holding body 110. The attachment / detachment driving unit 124 has a cylinder as a driving source. The bonded substrate S is inserted between the first holding body 110 and the second holding body 120, which are separated from each other, and the attachment / detachment driving unit 124 moves the second holding body 120 closer to the first holding body 110, so that the bonded substrate S can be sandwiched and held between the first holding body 110 and the second holding body 120.

[0039] (Relationship between the position and size of the contact area and non-contact area) The positions and sizes of the first contact area CA1 and first non-contact area NA1 in the first holding body 110 and the second contact area CA2 and second non-contact area NA2 in the second holding body 120 have the following relationship.

[0040] (1) When the first holding body 110 and the second holding body 120 sandwich and hold the bonded substrate S, the first contact area CA1 and the second non-contact area NA2 face each other. In this embodiment, as shown in FIG. 1, the outer diameter of the second holding body 120 is larger than that of the first holding body 110. The outer diameter of the first holding body 110 is smaller than the inner diameter of the annular protrusion 121b. Therefore, the first contact area CA1 of the first holding body 110 is entirely contained inside the second contact area CA2 on the upper surface of the annular protrusion 121b. Furthermore, the outer diameter of the central protrusion 121c is smaller than the width of the first groove 111b in either direction at the center of the first holding body 110. Therefore, the second contact area CA2 on the upper surface of the central protrusion 121c is sized to be contained within the first groove 111b in a plan view. In this manner, the first contact area CA1 and the second contact area CA2 do not have an overlapping portion in the axial direction.

[0041] (2) In the diameter direction of the bonded substrate S, the length of contact of the second contact area CA2 with the second surface Sb2 is shorter than the length of contact of the first holding body 110 with the first surface Sa2. In this embodiment, as shown in FIG. 2, the sum of the length obtained by subtracting the width of the second groove 121d in the radial direction from the width of the annular protrusion 121b and the diameter of the central protrusion 121c is shorter than the length obtained by subtracting the width of the circular part of the first groove 111b in the radial direction and the width of the central part of the cross part of the first groove 111b in the radial direction from the length of the first contact area CA1 in the radial direction. Note that the length of contact of the first contact area CA1 with the first surface Sa2 mentioned here is not the length along the straight part of the cross part of the first groove 111b, but the length in the direction not including this straight part.

[0042] (3) At least a part of the second contact area CA2 faces the central axis Cs of the second surface Sb2 when the bonded substrate S is held, and the first contact area CA1 does not face the central axis Cs of the first surface Sa2 when the bonded substrate S is held. In this embodiment, as shown in FIG. 1, the second contact area CA2 on the upper surface of the central protrusion 121c faces the central portion of the first groove 111b, that is, the first non-contact area NA1. As a result, in the center of the bonded substrate S, only the second contact area CA2 contacts the second surface Sb2, and the first contact area CA1 does not contact the first surface Sa2.

[0043] (4) A part of the second contact area CA2 is located outside the outermost periphery of the first contact area CA1 in a plan view. In this embodiment, in the second contact area CA2, the upper surface of the annular protrusion 121b is located outside the outermost periphery of the first holding body 110.

[0044] (5) The outermost periphery of the second contact area CA2 is located inside the outermost periphery of the bonded substrate S in a plan view. In this embodiment, the outer diameter of the second holding body 120 is smaller than the outer diameter of the bonded substrate S.

[0045] (6) A part of the second contact area CA2 is located outside the outermost periphery of the first contact area CA1 with a gap in the diameter direction of the bonded substrate S. In the present embodiment, as described above, the upper surface of the annular protrusion 121b of the second contact area CA2 is located outside the outermost periphery of the first holding body 110, so that there is a gap in the diameter direction between the inner periphery of the second contact area CA2 and the outermost periphery of the first contact area CA1.

[0046] [Positioning part] The positioning unit 20 positions the central axis Cs of the bonded substrate S to the central axis Ct determined by the holding unit 10 (see FIGS. 7 and 8). That is, the central axis Cs of the bonded substrate S disposed between the first holding body 110 and the second holding body 120 is aligned with the central axis Ct of the first holding body 110 and the second holding body 120. The positioning unit 20 has a gripping unit 210, a placing unit 220, an axial direction driving unit 230, and an opening / closing driving unit 240 (see FIG. 1).

[0047] (gripping part) The gripping parts 210 grip the outer periphery of the bonded substrate S. The outer periphery of the bonded substrate S is a side surface along the outer edge of the circumference. A plurality of gripping parts 210 are arranged at equal intervals at positions surrounding the holding part 10, that is, at positions along the outer periphery of the bonded substrate S held by the holding part 10. The gripping parts 210 in this embodiment are four upright pins.

[0048] (Placement section) The mounting part 220 is where the bonded substrate S is placed. The mounting part 220 has a mounting surface that supports the bonded substrate S, and has the gripping parts 210 attached thereto. Four mounting parts 220 are provided in one-to-one correspondence with the gripping parts 210. In this embodiment, the surface of the bonded substrate S that is held by the second holding mechanism 12, that is, the second surface Sb2 of the second substrate Sb, is placed on the mounting part 220.

[0049] (Axial drive section) The axial driving unit 230 moves the gripping unit 210 and the placing unit 220 in an axial direction parallel to the rotation axis of the holding unit 10. The axial driving unit 230 has a support unit 231, a biasing unit 232, and an absorbing unit 233. The support unit 231 is an upright member that supports the gripping unit 210 and the placing unit 220 at its tip. The biasing unit 232 is provided so as to be movable in the axial direction by a driving mechanism such as a cam rotated by a cylinder. The absorbing unit 233 is interposed between the biasing unit 232 and the support unit 231, and transmits the movement of the biasing unit 232 to the support unit 231 and absorbs vibrations of the bonded substrate S. The absorbing unit 233 may be, for example, a compression spring, a leaf spring, an elastic body of rubber or resin, a cylinder, or the like, as long as it can absorb vibrations.

[0050] The opening / closing drive unit 240 moves the gripping unit 210 and the placement unit 220 between a closed position where the gripping unit 210 contacts the outer periphery of the bonded substrate S and an open position where the gripping unit 210 is separated from the outer periphery of the bonded substrate S. The position of the gripping unit 210 is set so that the central axis Cs of the bonded substrate S is positioned on the central axis Ct by the closed position. The opening / closing drive unit 240 has an arm 241 that moves in the radial direction of the bonded substrate S (centripetal direction and centrifugal direction with respect to the central axis Ct) by a drive mechanism such as a cam rotated by a cylinder (not shown). A support unit 231 is connected to the arm 241 so as to be axially movable.

[0051] [nozzle] The nozzle 30 separates the bonded substrate S into the substrate Sa and the substrate Sb by ejecting a fluid toward the outer periphery of the rotating bonded substrate S. The nozzle 30 of the present embodiment ejects a fluid toward the outer periphery of the bonded substrate S which is held by the holding unit 10 and rotates.

[0052] The nozzle 30 of this embodiment is a jetting device that realizes water jet processing, which sprays water (water jet), which is a high-pressure fluid, onto an object to perform processing. The nozzle 30 is connected to a supply device 31, which includes a pump for supplying high-pressure water, via piping, valves, and the like. The nozzle 30 is configured to be able to discharge high-pressure fluid, has a very small hole diameter (0.1 to 1 mm), and the thickness of the tip of the nozzle 30 is thick enough to withstand high-pressure water (1 to 5 cm). As shown in FIG. 9, the outlet at the tip of the nozzle 30 is provided in a direction toward the outer periphery of the bonded substrate S, and the axis of the nozzle 30 is parallel to the rotation plane of the bonded substrate S.

[0053] [Nozzle drive unit] 9 to 11, the nozzle driving unit 40 changes the ejection direction of the fluid from the nozzle 30 between a first direction along a tangent to the outer periphery of the bonded substrate S and a second direction toward the central axis Cs of the bonded substrate S. The nozzle driving unit 40 of this embodiment can move the nozzle 30 in a direction along the outer periphery of the bonded substrate S. The nozzle driving unit 40 has a contact / separation mechanism 41 and a position adjustment mechanism 42.

[0054] (approach / separate mechanism) The contact / separation mechanism 41 reciprocates the nozzle 30 in the radial direction of the bonded substrate S, in a direction to contact and separate from the outer periphery of the bonded substrate S. The contact / separation mechanism 41 of the present embodiment moves the nozzle 30 along the Y direction. The contact / separation mechanism 41 can be, for example, a ball screw mechanism driven by a servo motor.

[0055] (position adjustment mechanism) The position adjustment mechanism 42 moves the nozzle 30 between a separation start position (see FIG. 9) along a tangent to the outer periphery of the bonded substrate S held and rotated by the holding unit 10, and a central separation position (see FIG. 11) toward the central axis Cs of the bonded substrate S. That is, the nozzle 30 moves along the X direction by the position adjustment mechanism 42. For example, a ball screw mechanism driven by a servo motor can be used as the position adjustment mechanism 42.

[0056] As shown in FIG. 9, the nozzle 30 can move from the separation start position [a] to the central separation position [b] in an arc trajectory by the contact / separation mechanism 41 and the position adjustment mechanism 42. As a result, the fluid discharged from the nozzle 30 is sprayed toward a partial region of the outer periphery of the bonded substrate S shown by Ra in FIG. 9. This partial region is a region including an arc with a central angle of 90 degrees on the outer periphery of the bonded substrate S. Since the bonded substrate S rotates at least during the separation of the outer periphery, even if the fluid is discharged to a partial region of the outer periphery, the discharged fluid can reach the entire periphery. Then, as the bonded substrate S is separated, the fluid also reaches the center of the bonded substrate S from the gap between the first substrate Sa and the second substrate Sb. Before the start of separation of the bonded substrate S and after completion of separation, the nozzle 30 is moved to a standby position [c] separated from the outer periphery of the bonded substrate S by the contact / separation mechanism 41 and the position adjustment mechanism 42.

[0057] The distance d between the outlet of the nozzle 30 positioned in the first direction and the outer periphery of the bonded substrate S is the same as the distance d between the outlet of the nozzle 30 positioned in the second direction and the outer periphery of the bonded substrate S. This allows the outlet of the nozzle 30 in the first direction and the outlet of the nozzle 30 in the second direction to be as close as possible to the outer periphery of the bonded substrate S.

[0058] [Control device] The control device 100 is a device that controls the substrate separating device 1, and controls the operations of the holding unit 10, the positioning unit 20, the nozzle 30, and the nozzle driving unit 40. The control device 100 can be realized, for example, by a dedicated electronic circuit or a computer that operates according to a predetermined program.

[0059] More specifically, the control device 100 controls the rotation and movement of the second holder 120 by controlling the rotation drive unit 123 and the attachment / detachment drive unit 124. The control device 100 also controls the movement of the gripper 210 and the placement unit 220 by controlling the axial drive unit 230 and the opening / closing drive unit 240. Furthermore, the control device 100 controls the ejection of fluid from the nozzle 30 and the movement of the nozzle 30 by controlling the supply device 31, the contact / separation mechanism 41, and the position adjustment mechanism 42.

[0060] [Operation] The operation of the substrate separating apparatus 1 as described above will be described with reference to the flowchart of FIG. 12 and the explanatory diagram of FIG. 13 in addition to the above-mentioned FIGS. 1 to 11. Ph1 in FIG. 13 is a fixed reference position of the lower surface of the first holding body 110, and Ph2 is a transfer position which is the position of the lower surface of the placing part 220 when the placing part 220 transfers the bonded substrate S between the robot arm M. Ps1 is a separation position which is the height position of the lower surface of the second substrate Sb when the bonded substrate S is sandwiched between the first holding body 110 and the second holding body 120 and separated by ejecting a fluid from the nozzle 30 while rotating the bonded substrate S. Ps2 is a receiving position which is the position of the upper surface of the placing part 220 when the positioning part 20 receives the bonded substrate S from the holding part 10.

[0061] First, the second holding body 120 is at a position separated from the first holding body 110 (FIG. 13(A)). The gripping part 210 and the placement part 220 are at the delivery position Ph2 and at the open position. The robot arm M of the transport device carries in the bonded substrate S, and places the bonded substrate S on the placement part 220 as shown in FIG. 7 (FIG. 13(B), step S101). The gripping part 210 rises to raise the bonded substrate S (FIG. 13(C)), and the second holding body 120 rises to contact the lower surface of the second substrate Sb, and raises the bonded substrate S to be slightly separated from the placement part 220 (FIG. 13(D), step S102).

[0062] As shown in FIG. 8, the gripping portion 210 moves to the closed position and grips the outer periphery of the bonded substrate S, thereby positioning the central axis Cs of the bonded substrate S to the central axis Ct (FIG. 13(E), step S103). Thereafter, the gripping portion 210 moves to the open position (FIG. 13(F)), and retreats together with the placement portion 220 to the delivery position Ph2 (FIG. 13(G), step S104). Then, the second holding body 120 rises, brings the bonded substrate S into contact with the first holding body 110, sandwiches and holds it, positions the bonded substrate S at the separation position Ps1, and holds it by suction using the negative pressure of the suction hole (FIG. 13(H), step S105).

[0063] In this state, the second holder 120 rotates, thereby rotating the bonded substrate S together with the first holder 110 (rotation step: step S106). Then, as shown in Fig. 9, the nozzle 30 moves from the standby position [c] to the separation start position [a] (step S107) and ejects the fluid toward the outer periphery of the bonded substrate S (separation step: step S108). This starts separation of the bonded substrate S (step S109).

[0064] As shown in FIG. 10, the nozzle 30 moves so as to follow the separated region (shown by hatching in the figure) (displacement step: step S110). Here, as described above, the first contact region CA1 faces the second non-contact region NA2. That is, in the region where the first holder 110 is in contact with the first substrate Sa, the second holder 120 is not in contact with the second substrate Sb. For this reason, there is a margin for the fluid discharged from the nozzle 30 to enter between the first substrate Sa and the second substrate Sb, causing the second substrate Sb to displace in a direction to separate from the first substrate Sa.

[0065] Also, a part of the second contact area CA2 is outside the outermost edge of the first contact area CA1. That is, in the area where the second holder 120 is in contact with the second substrate Sb, the first holder 110 is not in contact with the first substrate Sa. Therefore, there is a margin for the first substrate Sa to be displaced in a direction to separate from the second substrate Sb. Therefore, when the bonded substrate S tries to separate, there is no portion from both the first substrate Sa and the second substrate Sb that restricts the separation, and the substrate S can be displaced to at least one of them, which facilitates separation by the wedge effect.

[0066] 11, when the nozzle 30 moves to the central separation position [b] and separates the bonded substrate S to a position corresponding to the central axis Cs, the second contact area CA2 is in contact with the second surface Sb2, so that the bonded substrate S is prevented from cracking or chipping due to the impact caused by the rapid separation. When the bonding surface Sa1 and the bonding surface Sb1 at the position corresponding to the central axis Cs are separated (YES in step S111), the discharge of the fluid from the nozzle 30 stops (step S112). The rotation of the bonded substrate S stops due to the stop of the rotation of the first holder 110 and the second holder 120 (step S113).

[0067] Thereafter, the negative pressure in the first holding body 110 and the second holding body 120 is released, the second holding body 120 descends to transfer the bonded substrate S to the mounting section 220, and the robot arm M of the transport device lifts up the bonded substrate S from the underside of the bonded substrate S, and the robot arm M carries the bonded substrate S away (see Figures 13(B) and (A), step S114).

[0068] [effect] (1) The substrate separating apparatus 1 of the present embodiment includes a first holder 110 that holds a first surface Sa2 of a bonded substrate S formed by bonding a pair of substrates (Sa, Sb), a second holder 120 that holds a second surface Sb2 opposite the first surface Sa2 of the bonded substrate S, a rotation drive unit 123 that rotates the first holder 110 and the second holder 120 that hold the bonded substrate S in between, and a nozzle 30 that separates the bonded substrate S by ejecting a fluid toward the outer periphery of the rotating bonded substrate S.

[0069] The first holding body 110 has a first contact area CA1 that contacts the first surface Sa2 when it holds the bonded substrate S, and the second holding body 120 has a second contact area CA2 that contacts the second surface Sb2 when it holds the bonded substrate S, and a second non-contact area NA2 that does not contact the second surface Sb2, and the first holding body 110 and the second holding body 120 are arranged such that the first contact area CA1 and the second non-contact area NA2 face each other when they hold the bonded substrate S between them.

[0070] For this reason, it is possible to form a state in which at least one of the first holder 110 and the second holder 120 is not in contact with the bonded substrate S within the first surface Sa2 and the second surface Sb2 of the bonded substrate S. Therefore, when the bonded substrate S is separated by the ejection of the fluid from the nozzle 30, a gap is generated in which at least one of the first substrate Sa and the second substrate Sb is not restrained. This creates a space for the fluid to enter when the bonded substrate S is separated, so that the separation is not hindered and can proceed well until complete separation.

[0071] (2) The first holding body 110 and the second holding body 120 are arranged to hold the first surface Sa2 on the upper side and the second surface Sb2 on the lower side, and in the diameter direction of the bonded substrate S, the length over which the second holding body 120 is in contact with the second surface Sb2 is shorter than the length over which the first holding body 110 is in contact with the first surface Sa2.

[0072] For this reason, in the diameter direction of the bonded substrate S, the area where the lower second holder 120 contacts the bonded substrate S is smaller than the area where the upper first holder 110 contacts the bonded substrate S. In this way, it is possible to ensure a large second non-contact area NA2 on the second holder 120 side where gravity is applied. Therefore, in addition to the wedge effect of the fluid, the gravity of the fluid supplied between the first substrate Sa and the second substrate Sb also makes it easier for a gap to be generated between the first substrate Sa and the second substrate Sb, allowing for good separation.

[0073] (3) The first holding body 110 and the second holding body 120 are arranged to hold the first surface Sa2 on the upper side and the second surface Sb2 on the lower side, and at least a portion of the second contact area CA2 faces the central axis Cs of the second surface Sb2 when the bonded substrate S is held, and the first contact area CA1 does not face the central axis Cs of the first surface Sa2 when the bonded substrate S is held.

[0074] Therefore, in the process of separation proceeding from the outer periphery to the center of the bonded substrate S, the second contact area CA2 is in contact with the second surface Sb2 at the center of the bonded substrate S, so that the separation is prevented from progressing rapidly, and the occurrence of cracks and chips can be prevented. In other words, as the separation proceeds, the unseparated area becomes smaller, and finally, a narrow area including the points corresponding to the central axes Cs and Ct remains. If there is no part to support this narrow area, an impact is applied when the narrow area is separated, and there is a risk of cracks and chips. To prevent this, the second contact area CA2 that supports the center is provided at a position that does not face the first contact area CA1.

[0075] (4) The first holding body 110 and the second holding body 120 are arranged to hold the first surface Sa2 on the upper side and the second surface Sb2 on the lower side, and when the first holding body 110 and the second holding body 120 sandwich and hold the bonded substrate S, a portion of the second contact area CA2 is located outside the outermost periphery of the first contact area CA1 in a planar view.

[0076] Therefore, the second contact area CA2 of the second holder 120 contacts the second surface Sb2 near the outer periphery of the bonded substrate S. This allows the second holder 120 to support the outer periphery of the bonded substrate S on the lower side where gravity is applied, and prevents the bonded substrate S from warping so as to sag downward. This makes it possible to suppress fluctuations in the height of the outer periphery of the bonded substrate S, and prevents the height position of the outer periphery of the bonded substrate S from shifting from the position where the nozzle 30 ejects the fluid.

[0077] (5) The outermost periphery of the second contact area CA2 is located inside the outermost periphery of the bonded substrate S in a plan view. Therefore, when separation of the bonded substrate S progresses, the outer periphery of the bonded substrate S does not hinder the upper first substrate Sa from being separated by the first holding body 110, and does not hinder the lower second substrate Sb from being separated by the second holding body 120. In this way, the outer periphery of the bonded substrate S becomes easy to separate and open, which makes it easier for a fluid to enter between the first substrate Sa and the second substrate Sb.

[0078] (6) When the first holding body 110 and the second holding body 120 sandwich and hold the bonded substrate S, a portion of the second contact area CA2 is on the outside, with a gap in the diameter direction of the bonded substrate S, between the first contact area CA1 and the outermost periphery of the first contact area CA1.

[0079] The first contact area CA1 and the second contact area CA2 apply pressure in opposing directions across the bonded substrate S, but there is a gap between them in the diameter direction, and they do not face each other. Therefore, even if the first contact area CA1 and the second contact area CA2 apply strong pressure, the gap provides a margin to prevent cracking or chipping of the bonded substrate S. In addition, such a gap makes it easier for fluid to enter between the first substrate Sa and the second substrate Sb, facilitating separation.

[0080] (7) A first groove 111b is formed in the first contact area CA1 along the first surface Sa2, and a second groove 121d is formed in the second contact area CA2 along the second surface Sb2. The first groove 111b is provided with a first suction port 111c that attracts the first surface Sa2 by negative pressure, and the second groove 121d is provided with a second suction port 121e that attracts the second surface Sb2 by negative pressure.

[0081] For this reason, a suction force can be applied via the first groove 111b along the first surface Sa2 and the second groove 121d along the second surface Sb2, so that the bonded substrate S can be uniformly adsorbed along the surface. This makes it possible to prevent the bonded substrate S from shifting with respect to the first holding body 110 and the second holding body 120 during separation of the bonded substrate S.

[0082] (8) The second holding body 120 has an annular protrusion 121b having a diameter larger than the outermost circumference of the first holding body 110, a cylindrical shape coaxial with the held bonded substrate S, and protruding toward the second surface Sb2, and a central protrusion 121c having a diameter smaller than the inner diameter of the annular protrusion 121b, a cylindrical shape coaxial with the held bonded substrate S, and protruding toward the second surface Sb2, and a second contact area CA2 is provided on the surface of the annular protrusion 121b and the central protrusion 121c facing the second surface Sb2.

[0083] Therefore, at the outer periphery of the bonded substrate S, the first holder 110 is not in contact with the upper first substrate Sa, thereby not hindering separation, and at the center of the bonded substrate S, the second contact area CA2 is in contact with the second surface Sb2, thereby preventing separation from progressing too rapidly and preventing the occurrence of cracks or chips.

[0084] [Variations] The present embodiment can also be modified as follows. (1) As in the above embodiment, it is preferable that the first contact area CA1 and the second contact area CA2 do not have a portion that overlaps in the axial direction. However, the first contact area CA1 and a portion of the second contact area CA2 may overlap in the axial direction. For example, a portion of the second contact area CA2 of the central protrusion 121c may have a portion that overlaps with the first contact area CA1 in the axial direction. However, this does not include a case where a groove formed in the second contact area CA2 faces the first contact area CA1, resulting in most of the first contact area CA1 and the second contact area CA2 overlapping in the axial direction.

[0085] (2) In the above embodiment, the first holder 110 is disposed on top and the second holder 120 is disposed on the bottom. However, the second holder 120 may be disposed to hold the bonded substrate S from above and the first holder 110 may be disposed to hold the bonded substrate S from below.

[0086] (3) The shapes and sizes of the first contact area CA1, the first non-contact area NA1, the second contact area CA2, the second non-contact area NA2, the first groove 111b, and the second groove 121d are not limited to those exemplified in the above embodiments.

[0087] (4) The axis of rotation of the bonded substrate S by the holding unit 10 is not limited to the vertical direction. In other words, the direction of the bonded substrate S held by the holding unit 10 is not limited to the horizontal direction. For example, the holding unit 10 may be configured so that the bonded substrate S rotates about an axis in the horizontal direction, and the nozzle 30 may be configured to eject fluid in the vertical direction relative to the outer periphery of the bonded substrate S.

[0088] (5) Rotation drive unit 123 may be configured to rotate either first holding body 110 or second holding body 120, or may be configured to rotate both. Attachment / detachment drive unit 124 may be configured to move either first holding body 110 or second holding body 120, or may be configured to move both.

[0089] (6) The nozzle 30 may be moved based on the progress of separation of the bonded substrate S determined in advance by an experiment or a simulation. In this case, the control device 100 controls the nozzle driving unit 40 so that the nozzle 30 moves after a certain time has elapsed.

[0090] (7) A displacement detection unit may be provided that detects a change in the position of the surface of the bonded substrate S when the nozzle 30 ejects the fluid. The displacement detection unit detects a change in the position of the surface due to separation of the rotating bonded substrate S. As the separation progresses, the first substrate Sa and the second substrate Sb separate, and their respective ends become warped. By detecting the change in the position of the surface of the bonded substrate S, the displacement detection unit can detect the separation status of the bonded substrate S.

[0091] The displacement detection unit may be a sensor that detects the position of the surface of the bonded substrate S in a non-contact manner, for example, a laser displacement sensor. The control device 100 moves the nozzle 30 by controlling the nozzle driving unit 40 in response to the change in position due to separation of the surface of the bonded substrate S detected by the displacement detection unit.

[0092] This allows the discharge direction of the fluid from the nozzle 30 to be changed in accordance with the separation portion moving from the outer periphery of the bonded substrate S toward the central axis Cs, thereby preventing the nozzle 30 from moving leaving unseparated portions and reducing separation defects. Also, the discharge direction of the nozzle 30 can be changed and discharge can be stopped according to the progress of separation, eliminating waste of fluid.

[0093] The detection of the change in position by the displacement detection unit is more accurate when detecting both surfaces of the bonded substrate S. However, since the positions of both surfaces of the bonded substrate S change during separation, the device may be simplified by being configured to detect the change in either one of the surfaces.

[0094] (8) In order for the positioning unit 20 to position the bonded substrate S, the number of positions at which the positioning unit 20 contacts the outer periphery may be three or more. In other words, since the multiple gripping units 210 are only required to be able to position the central axis Cs of the circular bonded substrate S, three or more gripping units 210 may be sufficient.

[0095] (9) The substrate separating device 1 can be configured as a part of a substrate processing apparatus 2, as shown in Fig. 14. For example, the substrate processing apparatus 2 can be a single-wafer processing apparatus including the substrate separating device 1 and a plurality of chambers 1a housing a surface processing apparatus 3 for processing the surfaces of the separated first substrate Sa and second substrate Sb, and processing the bonded substrates S housed in a cassette (FOUP) 1b and transported in a previous process one by one in each chamber 1a.

[0096] The surface treatment device 3 is, for example, a cleaning device that cleans the surfaces of the first substrate Sa and the second substrate Sb after separation with a cleaning liquid. The bonded substrates S are taken out one by one from the cassette 1b by the transport robot 1c, temporarily placed in the buffer unit 1d, and then transported to each chamber 1a by the transport robot 1e, where they are separated and cleaned. The surface treatment device 3 cleans the surfaces of the separated first substrate Sa and second substrate Sb with a cleaning liquid.

[0097] [Other embodiments] The present invention is not limited to the above-described embodiment, but includes other embodiments shown above. The present invention also includes a combination of all or any of the above-described embodiment and other embodiments. Furthermore, various omissions, substitutions, and modifications can be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention. [Explanation of symbols]

[0098] 1 Substrate separation device 1a Chamber 1b Cassette 1c Transport robot 1d Buffer Unit 1e Transport robot 2. Substrate Processing Equipment 3 Surface treatment equipment 10 Holding part 11 First retention mechanism 12 Second Retention Mechanism 13 Exhaust system 20 Positioning section 30 Nozzles 31 Feeding device 40 Nozzle drive unit 41 Approach / separation mechanism 42 Position adjustment mechanism 50, 50A, 50B Displacement detection unit 60 Fluid removal section 61, 61A, 61B Removal nozzle 62 Air supply system 100 Control device 110 First holder 111 Base part 111a first opposing portion 111b First Groove 111c First suction port 111d Ventilation passage 112 Connection 113 Support mechanism 113a Support shaft 120 Second Holder 121 Base 121a second opposing portion 121b Annular protrusion 121c Central protrusion 121d Second Groove 121e Second suction port 121f Ventilation passage 122 Connection 123 Rotation drive unit 123a Drive shaft 124 Detachable drive unit 210 Gripping part 220 Placement section 230 Axial Drive 231 Pillar section 232 Pressurizing part 233 Absorption section 240 Opening and closing drive unit 241 Arm CA1 - the first contact area CA2 Second contact area NA1 First non-contact area NA2 Second non-contact area

Claims

1. a first holder that holds a first surface of a bonded substrate formed by bonding a pair of substrates together; a second holder that holds a second surface of the bonded substrate opposite to the first surface; a rotation drive unit that rotates the first holder and the second holder that sandwich and hold the bonded substrate; a nozzle for discharging a fluid toward an outer periphery of the rotating bonded substrate to separate the bonded substrate; having the first holder has a first contact area that comes into contact with the first surface when the first holder holds the bonded substrate, the second holder has a second contact region that contacts the second surface when the second holder holds the bonded substrate, and a second non-contact region that does not contact the second surface; a first holding body and a second holding body arranged so that, when the first holding body and the second holding body sandwich and hold the bonded substrate, the first contact area and the second non-contact area face each other.

2. the first holding body and the second holding body are arranged to hold the first surface as an upper side and the second surface as a lower side, 2. The substrate separation apparatus according to claim 1, wherein a length over which the second holder contacts the second surface in a diameter direction of the bonded substrate is shorter than a length over which the first holder contacts the first surface.

3. the first holding body and the second holding body are arranged to hold the first surface as an upper side and the second surface as a lower side, At least a part of the second contact region faces a central axis of the second surface when the bonded substrate is held, 2. The substrate separating apparatus according to claim 1, wherein the first contact area does not face a central axis of the first surface when the bonded substrate is held.

4. the first holding body and the second holding body are arranged to hold the first surface as an upper side and the second surface as a lower side, 2. The substrate separation apparatus according to claim 1, wherein when the first holding body and the second holding body sandwich and hold the bonded substrate, a portion of the second contact area is located outside an outermost periphery of the first contact area in a plan view.

5. 5. The substrate separating apparatus according to claim 4, wherein an outermost periphery of the second contact region is located inside an outermost periphery of the bonded substrates in a plan view.

6. When the first holder and the second holder sandwich and hold the bonded substrate, 2. The substrate separation apparatus according to claim 1, wherein a part of the second contact area is located outside an outermost periphery of the first contact area with a gap therebetween in a diameter direction of the bonded substrates.

7. The first contact region has a first groove formed along the first surface; The second contact region has a second groove formed along the second surface; a first suction port that sucks the first surface by negative pressure is provided in the first groove; 2. The substrate separating apparatus according to claim 1, wherein the second groove is provided with a second suction port for sucking the second surface by negative pressure.

8. The second holder is a cylindrical annular protrusion having a diameter larger than the outermost circumference of the first holder, coaxial with the bonded substrate held by the first holder, and protruding toward the second surface; A central protrusion having a diameter smaller than the inner diameter of the annular protrusion, a cylindrical shape coaxial with the bonded substrate being held, and protruding toward the second surface; having 2. The substrate separating apparatus according to claim 1, wherein the annular protrusion and the central protrusion are provided with the second contact area on a surface facing the second surface.

9. A substrate separating apparatus according to any one of claims 1 to 8, a surface treatment device for treating a surface of the separated substrate; A substrate processing apparatus comprising:

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