Dielectric composition and electronic component

JP2025028618APending Publication Date: 2025-03-03TDK CORP
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Patent Information

Application Number
JP2023133537
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-08-18
Publication Date
2025-03-03

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Abstract

To provide a dielectric composition capable of suppressing cracking due to thermal shock or the like.SOLUTION: There is provided a dielectric composition comprising main phase particles and segregated particles, wherein at least a part of the segregated particles are Ba-Mg-Si-O segregated particles containing Ba, Mg, Si and O and when the total of metal elements and Si in the Ba-Mg-Si-O segregated particles is defined as 100 pts.mol, the total of Ba, Mg and Si in the Ba-Mg-Si-O segregated particles is 70 pts.mol or more.SELECTED DRAWING: Figure 2
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