Dielectric composition and electronic component
JP2025028618APending Publication Date: 2025-03-03TDK CORP
Patent Information
- Application Number
- JP2023133537
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-08-18
- Publication Date
- 2025-03-03
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Figure 2025028618000001_ABST
Abstract
To provide a dielectric composition capable of suppressing cracking due to thermal shock or the like.SOLUTION: There is provided a dielectric composition comprising main phase particles and segregated particles, wherein at least a part of the segregated particles are Ba-Mg-Si-O segregated particles containing Ba, Mg, Si and O and when the total of metal elements and Si in the Ba-Mg-Si-O segregated particles is defined as 100 pts.mol, the total of Ba, Mg and Si in the Ba-Mg-Si-O segregated particles is 70 pts.mol or more.SELECTED DRAWING: Figure 2
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Citation Information
Patent Citations
Ceramic capacitor and its manufacture
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