Solvent-less epoxy resin coating film waterproof material for floor slab, and waterproof construction method

JP2025030237APending Publication Date: 2025-03-07NIHON TOKUSHU TORYO CO LTD
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Patent Information

Application Number
JP2023135350
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-08-23
Publication Date
2025-03-07
Patent Text Reader

Abstract

To develop a coating film waterproof material for a floor slab excellent in a coating work environment, quickly forming a coating film after coating, excellent in water resistance and high in waterproof reliability, and a method for constructing the same.SOLUTION: A solvent-less epoxy resin coating film waterproof material for floor slab is cured at room temperature by compounding a solvent-free epoxy resin with a polyamine and a thiol. The waterproof method for the floor slab forms a required waterproof film thickness by one coating of the solvent-free epoxy resin coating film waterproof material. The floor slab is made of either metal or concrete.SELECTED DRAWING: None
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