Method of manufacturing sensor device

Abstract

To suppress the joining strength between a sensor element and a mounted member from lowering while preventing a manufacturing process from complicating.SOLUTION: A method of manufacturing a sensor device includes: in making up a sintered member 31, making up the sintered member 31 in a state in which a predetermined gap S is made up with a buried member-making member 32 placed at a side face 11b of a recess 11; after making up the sintered member 31, placing a mounted member 10 such that one side is positioned up in an up-down direction; performing heating processing to melt the buried member-making member 32 into a molten buried member 321, drawing the molten buried member 321 placed on one side 10a into the gap S within the recess 11 and cooling down the molten buried member 321 into solidification to make up a buried member placed between the side face 11b of the recess 11 and the sintered member 31; and in forming a base member 33, forming the base member 33 made of a material having higher wettability with the molten buried member 321 than the mounted member 10.SELECTED DRAWING: Figure 2D

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