Strain measurement method

JP2025030347APending Publication Date: 2025-03-07MITSUBISHI HEAVY IND LTD
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Patent Information

Application Number
JP2023135564
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-08-23
Publication Date
2025-03-07

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Abstract

To provide a strain measurement method capable of accurately measuring a physical amount of strain generated in high temperature environment even if the strain has a small scale.SOLUTION: A strain measurement method includes: an oxide layer formation step of heating a measurement object and thereby forming an oxide layer on the surface of the measurement object; an oxide layer first imaging step of imaging a first image of the oxide layer; a high temperature environment use step of using the measurement object in environment at a temperature higher than an ambient temperature, after the oxide layer first imaging step; an oxide layer second imaging step of imaging a second image of the oxide layer after the high temperature use step; and a strain measurement step of measuring a physical amount relating to the strain of the measurement object, on the basis of the first image of the oxide layer imaged by the oxide layer first imaging step and the second image of the oxide layer imaged by the oxide layer second imaging step.SELECTED DRAWING: Figure 1
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