Multilayer ceramic electronic component

Abstract

To provide a multilayer ceramic electronic component that is resistant to external shocks.SOLUTION: A multilayer ceramic electronic component 1000 includes a laminate 100 including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and a first external electrode 210, a second external electrode 220, a third external electrode 230, and a fourth external electrode 240 disposed outside the laminate, the plurality of internal electrodes include a plurality of first internal electrodes 310 connected to the first external electrode 210 and the second external electrode 220, and a plurality of second internal electrodes 320 connected to the third external electrode 230 and the fourth external electrode 240, and edges of a cross section of the laminate that intersect with the first direction may be curved.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a multilayer ceramic electronic component. [Background technology]

[0002] Electronic components that use ceramic materials include capacitors, inductors, piezoelectric elements, varistors, thermistors, etc. Among these ceramic electronic components, multilayer ceramic capacitors (MLCCs) have the advantages of being small yet high capacity, and easy to mount, and can be used in a variety of electronic devices.

[0003] For example, the multilayer ceramic capacitor can be mounted on the substrates of various electronic products such as visual devices such as liquid crystal display (LCD), plasma display panel (PDP), and organic light emitting diode (OLED), computers, personal portable terminals, and smartphones, and can be used as a chip-type capacitor that charges and discharges electricity.

[0004] Multilayer ceramic capacitors generally have a rectangular parallelepiped shape, and this structure includes corners, vertices, and other parts that are vulnerable to external impacts, which can lead to the problem of cracks or breakage. Summary of the Invention [Problem to be solved by the invention]

[0005] One aspect of the embodiment is to provide a multilayer ceramic electronic component that is resistant to external shocks.

[0006] However, the problems to be solved by the embodiments of the present invention are not limited to the above problems, and can be variously expanded within the scope of the technical ideas included in the present invention.

[0007] A multilayer ceramic electronic component according to an embodiment includes a laminate including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode disposed outside the laminate, the plurality of internal electrodes including a plurality of first internal electrodes connected to the first external electrode and the second external electrode, and a plurality of second internal electrodes connected to the third external electrode and the fourth external electrode, and edges of a cross section of the laminate that intersect with the first direction may be curved.

[0008] The laminate may include a first surface and a second surface that face each other in the first direction, and a third surface that connects the first surface and the second surface, and the third surface may be a curved surface.

[0009] Also, at least one of the boundary between the first surface and the third surface and the boundary between the second surface and the third surface may have a round shape.

[0010] The laminate may have a cylindrical or elliptical cylindrical shape.

[0011] Moreover, the first external electrode, the second external electrode, the third external electrode and the fourth external electrode can be disposed on the third surface of the laminate.

[0012] At least one of the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode may extend to a portion of at least one of the first surface and the second surface of the laminate.

[0013] Also, the first external electrode, the second external electrode, the third external electrode and the fourth external electrode may be disposed at equal intervals.

[0014] The laminate may have a structure in which the first internal electrode and the second internal electrode are laminated with the dielectric layer sandwiched therebetween.

[0015] Further, each of the first internal electrodes may include a first electrode body and a first lead portion and a second lead portion disposed at an edge of the first electrode body and spaced apart from each other, and each of the second internal electrodes may include a second electrode body and a third lead portion and a fourth lead portion disposed at an edge of the second electrode body and spaced apart from each other.

[0016] In addition, the first extension portion may be connected to the first external electrode, the second extension portion may be connected to the second external electrode, the third extension portion may be connected to the third external electrode, and the fourth extension portion may be connected to the fourth external electrode.

[0017] Moreover, the first drawer portion and the second drawer portion can be disposed at the same interval.

[0018] Moreover, the third drawer portion and the fourth drawer portion may be disposed at the same interval.

[0019] In addition, the first internal electrode may further include a fifth lead portion and a sixth lead portion disposed on an edge of the first electrode body and separated from the first lead portion and the second lead portion, and may further include a fifth external electrode connected to the fifth lead portion and a sixth external electrode connected to the sixth lead portion.

[0020] Also, when viewed from the first direction, the first electrode body and the second electrode body may have a circular or elliptical shape.

[0021] Furthermore, the first external electrode and the second external electrode each include a first metal layer connected to the multiple first internal electrodes, a second metal layer covering the first metal layer, and a third metal layer covering the second metal layer, and the third external electrode and the fourth external electrode each include a first metal layer connected to the multiple second internal electrodes, a second metal layer covering the first metal layer, and a third metal layer covering the second metal layer.

[0022] Moreover, the first metal layer may include copper (Cu), the second metal layer may include nickel (Ni), and the third metal layer may include tin (Sn).

[0023] According to the multilayer ceramic electronic component of the embodiment, the laminate can withstand an external impact. [Brief description of the drawings]

[0024] [Figure 1] 1 is a perspective view showing a multilayer ceramic electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view taken along line II-II' in FIG. [Diagram 3] FIG. 2 is a cross-sectional view taken along line III-III' in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV' in FIG. [Diagram 5] 3 is a cross-sectional view taken along line VV' in FIG. 2. [Figure 6] 2 is an exploded perspective view showing a schematic diagram of a laminated structure of internal electrodes in the multilayer ceramic electronic component of FIG. 1. [Figure 7] FIG. 1 is a perspective view illustrating a multilayer ceramic electronic component according to a comparative example. [Figure 8] FIG. 11 is a perspective view illustrating a multilayer ceramic electronic component according to another embodiment. [Figure 9] 9 is a cross-sectional view that illustrates a schematic view of a first internal electrode of the multilayer ceramic electronic component of FIG. 8. [Figure 10] 9 is a cross-sectional view that illustrates a schematic view of a second internal electrode of the multilayer ceramic electronic component of FIG. 8. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. In order to clearly explain the present invention in the drawings, parts that are not related to the description are omitted, and the same reference numerals are used throughout the specification to refer to the same or similar components. In addition, in the accompanying drawings, some components are exaggerated, omitted, or illustrated in a schematic manner, and the size of each component does not fully reflect the actual size.

[0026] The accompanying drawings are intended to facilitate understanding of the embodiments disclosed in this specification, and are not intended to limit the technical ideas disclosed in this specification. It should be understood that the accompanying drawings include all modifications, equivalents, or alternatives included in the idea and technical scope of the present invention.

[0027] Terms including ordinal numbers such as first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from another.

[0028] In addition, when a part such as a layer, film, region, or plate is said to be "on" or "above" another part, this includes not only the case where it is "directly above" the other part, but also the case where there is another part in between. Conversely, when a part is said to be "directly above" another part, it means that there is no other part in between. In addition, being "on" or "above" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "above" the direction opposite to gravity.

[0029] Throughout the specification, terms such as "comprise" or "have" are to be understood as specifying the presence of a feature, value, step, operation, component, part, or combination thereof described in the specification, but without precluding the possibility of the presence or addition of one or more other features, values, steps, operations, components, parts, or combinations thereof. Thus, when a part is described as "comprising" a certain element, this means that it can further include other elements, rather than excluding other elements, unless specifically stated to the contrary.

[0030] Also, throughout the specification, a reference to "in a plane" means a portion of the subject matter viewed from above, and a reference to "in cross section" means a portion of the subject matter viewed from the side along a vertical cut.

[0031] Furthermore, throughout the specification, when the term "connected" is used, this does not only mean that two or more components are directly connected, but also that two or more components are indirectly connected through other components, that are not only physically connected but also electrically connected, or that components are referred to by different names depending on their location or function but are integrated.

[0032] FIG. 1 is a perspective view generally showing a multilayer ceramic electronic component according to one embodiment, FIG. 2 is a cross-sectional view taken along line II-II' in FIG. 1, FIG. 3 is a cross-sectional view taken along line III-III' in FIG. 1, FIG. 4 is a cross-sectional view taken along line IV-IV' in FIG. 2, FIG. 5 is a cross-sectional view taken along line V-V' in FIG. 2, and FIG. 6 is an exploded perspective view generally showing the laminated structure of internal electrodes in the multilayer ceramic electronic component of FIG. 1.

[0033] 1, 2, 3, 4, 5 and 6, a multilayer ceramic electronic component 1000 according to this embodiment includes a multilayer body 100 and an external electrode 200. The multilayer ceramic electronic component 1000 includes a multilayer body 100 and an external electrode 200.

[0034] The laminate 100 includes a first surface (S1), a second surface (S2) and a third surface (S3).

[0035] The first surface (S1) and the second surface (S2) face each other in the stacking direction (z-axis direction), and the third surface (S3) is a curved surface connecting the first surface (S1) and the second surface (S2). Because the third surface (S3) is a curved surface, the edge of the cross section of the laminate 100 that intersects with the stacking direction (z-axis direction) can be a curved line.

[0036] For example, when viewed from the stacking direction (z-axis direction), the first surface (S1) and the second surface (S2) may be circular or elliptical. In this case, the laminate 100 may be cylindrical or elliptical. The boundary between the first surface (S1) and the third surface (S3) may be clearly defined, or may not be clearly defined if the edge of the first surface (S1) and the edge of the third surface (S3) form a curved surface. For example, referring to FIG. 2, the laminate 100 has a rectangular shape, but the apex is rounded, so the boundary between the first surface (S1) and the third surface (S3) is not clearly defined. This also applies to the boundary between the second surface (S2) and the third surface (S3). For example, the boundary between the first surface (S1) and the third surface (S3) and the boundary between the second surface (S2) and the third surface (S3) can be polished to create the round shape described above.

[0037] The laminate 100 may include multiple dielectric layers 110 stacked in a stacking direction (z-axis direction). The boundaries between the dielectric layers 110 may be unclear. For example, the boundaries between the dielectric layers 110 may be difficult to see without the use of a scanning electron microscope (SEM), and the multiple dielectric layers 110 may appear to be a monolithic structure.

[0038] The dielectric layer 110 may include a ceramic material with a high dielectric constant. For example, the ceramic material may include a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. These components may further include auxiliary components such as manganese (Mn) compounds, iron (Fe) compounds, chromium (Cr) compounds, cobalt (Co) compounds, and nickel (Ni) compounds. For example, the dielectric layer may include a ceramic material in which calcium (Ca), zirconium (Zr), etc. are partially dissolved in BaTiO3 (BaTiO3). 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, etc. As other examples, the dielectric layer may include TiO2, HfO2, Al2O3, AlN, AlScN, ZrO2, SiO2, MgO, Si3N4, etc.

[0039] The dielectric layer 110 may further include one or more of a ceramic additive, an organic solvent, a plasticizer, a binder, and a dispersant. The ceramic additive may be, for example, a transition metal oxide or carbide, a rare earth element, magnesium (Mg), or aluminum (Al), etc.

[0040] For example, the average thickness of the dielectric layer 110 may be 0.1 μm to 10 μm, but the present embodiment is not limited thereto.

[0041] The laminate 100 may include a plurality of internal electrodes 300 stacked in the stacking direction (z-axis direction). The plurality of internal electrodes 300 may include a plurality of first internal electrodes 310 and a plurality of second internal electrodes 320. The first internal electrodes 310 and the second internal electrodes 320 may be stacked alternately with the dielectric layer 110 interposed therebetween. Such a stacked structure may be repeated within the laminate 100, and the internal electrodes closest to the first surface (S1) and the second surface (S2) of the laminate 100 may be either the first internal electrode 310 or the second internal electrode 320.

[0042] The first internal electrode 310 and the second internal electrode 320 have different polarities and can be electrically insulated from each other by the dielectric layer 110 disposed therebetween.

[0043] The first internal electrode 310 may include a first electrode body 311 , a first lead portion 313 and a second lead portion 315 .

[0044] The first electrode body 311 is disposed on the surface of the dielectric layer 110 and is spaced apart from the edge of the dielectric layer 110 .

[0045] The edge of the first electrode body 311 may be curved, and may be circular or elliptical when viewed from the stacking direction (z-axis direction), but is not limited thereto.

[0046] The first extended portion 313 is disposed on the edge of the first electrode body 311 and contacts the edge of the dielectric layer 110. In other words, the first extended portion 313 is a portion that extends from the first electrode body 311 and contacts the edge of the dielectric layer 110. The portion of the first extended portion 313 that contacts the edge of the dielectric layer 110 constitutes the third surface (S3) of the laminate 100.

[0047] The second extended portion 315 is disposed on the edge of the first electrode body 311 and contacts the edge of the dielectric layer 110. In other words, the second extended portion 315 is a portion that extends from the first electrode body 311 and contacts the edge of the dielectric layer 110. The portion of the second extended portion 315 that contacts the edge of the dielectric layer 110 constitutes the third surface (S3) of the laminate 100.

[0048] The second lead portion 315 is spaced apart from the first lead portion 313. The first lead portion 313 and the second lead portion 315 may be disposed at the same interval. For example, if the first electrode body 311 is circular, the line segment connecting the first lead portion 313 and the second lead portion 315 may be the diameter of the circle. As another example, if the first electrode body 311 is elliptical, the line segment connecting the first lead portion 313 and the second lead portion 315 may be the major axis or minor axis of the ellipse.

[0049] The first lead portion 313 is electrically connected to the first external electrode 210 , and the second lead portion 315 is electrically connected to the second external electrode 220 .

[0050] Meanwhile, if necessary, one or more pairs of lead portions may be added to the first internal electrode 310, and a corresponding number of external electrodes may be further disposed on the third surface (S3) of the laminate 100.

[0051] The second internal electrode 320 may include a second electrode body 321 , a third lead portion 323 and a fourth lead portion 325 .

[0052] The second electrode body 321 is disposed on the surface of the dielectric layer 110 and is spaced apart from the edge of the dielectric layer 110 .

[0053] The edge of the second electrode body 321 may be curved, and may be circular or elliptical when viewed from the stacking direction (z-axis direction), but is not limited thereto.

[0054] The third extended portion 323 is disposed on the edge of the second electrode body 321 and contacts the edge of the dielectric layer 110. In other words, the third extended portion 323 is a portion that extends from the second electrode body 321 and contacts the edge of the dielectric layer 110. The portion of the third extended portion 323 that contacts the edge of the dielectric layer 110 constitutes the third surface (S3) of the laminate 100.

[0055] The fourth extension portion 325 is disposed at an end of the second electrode body 321 and contacts an end of the dielectric layer 110. In other words, the fourth extension portion 325 is a portion that extends from the second electrode body 321 and contacts the end of the dielectric layer 110. The portion of the fourth extension portion 325 that contacts the end of the dielectric layer 110 constitutes the third surface (S3) of the laminate 100.

[0056] The fourth lead portion 325 is spaced apart from the third lead portion 323. The third lead portion 323 and the fourth lead portion 325 may be disposed at the same interval. For example, if the second electrode body 321 is circular, the line segment connecting the third lead portion 323 and the fourth lead portion 325 may be the diameter of the circle. As another example, if the second electrode body 321 is elliptical, the line segment connecting the third lead portion 323 and the fourth lead portion 325 may be the major axis or minor axis of the ellipse.

[0057] The third extension portion 323 is electrically connected to the third external electrode 230 , and the fourth extension portion 325 is electrically connected to the fourth external electrode 240 .

[0058] Meanwhile, if necessary, one or more pairs of lead portions may be added to the second internal electrode 320, and a corresponding number of external electrodes may be further disposed on the third surface (S3) of the laminate 100.

[0059] The internal electrodes 300 may be formed by printing a conductive paste containing a conductive metal on the surface of the dielectric layer 110. For example, a conductive paste containing nickel (Ni) or a nickel (Ni) alloy may be printed on the surface of the dielectric layer by screen printing or gravure printing to form the internal electrodes. However, the present embodiment is not limited thereto.

[0060] As an example, the average thickness of the internal electrode 300 may be within a range of several nm to several um.

[0061] With the above-described configuration, when a voltage is applied to the first external electrode 210, the second external electrode 220, the third external electrode 230, and the fourth external electrode 240, charge is accumulated between the first internal electrode 310 and the second internal electrode 320 which face each other. In other words, capacitance can be obtained between the first internal electrode 310 electrically connected to the first external electrode 210 and the second external electrode 220, and the third external electrode 230, and the second internal electrode 320 electrically connected to the fourth external electrode 240. The capacitance of the multilayer ceramic electronic component 1000 is proportional to the overlapping area of ​​the first internal electrode 310 and the second internal electrode 320 which overlap each other along the stacking direction (z-axis direction).

[0062] A region where the first internal electrode 310 and the second internal electrode 320 overlap in the stacking direction (z-axis direction) is called an active region, and a cover layer 120 may be disposed outside the active region.

[0063] The cover layer 120 can include a first cover layer 121 and a second cover layer 123 .

[0064] The first cover layer 121 is disposed between the first surface (S1) of the laminate 100 and the closest internal electrode 300. The second cover layer 123 is disposed between the second surface (S2) of the laminate 100 and the closest internal electrode 300.

[0065] The first cover layer 121 and the second cover layer 123 may have the same composition as the dielectric layer 110. The cover layers may be formed by laminating one or more dielectric layers on the outer surface of the topmost internal electrode and one or more dielectric layers on the outer surface of the bottommost internal electrode.

[0066] The first cover layer 121 and the second cover layer 123 may serve to prevent damage to the internal electrodes 300 due to physical or chemical stress.

[0067] The external electrode 200 is disposed outside the laminate 100 .

[0068] The external electrode 200 may include a first external electrode 210 , a second external electrode 220 , a third external electrode 230 and a fourth external electrode 240 .

[0069] The first external electrode 210, the second external electrode 220, the third external electrode 230 and the fourth external electrode 240 may be arranged spaced apart from one another on the third surface (S3) of the laminate 100. For example, the first external electrode 210, the second external electrode 220, the third external electrode 230 and the fourth external electrode 240 may be arranged at equal intervals on the third surface (S3).

[0070] At least one of the first external electrode 210, the second external electrode 220, the third external electrode 230 and the fourth external electrode 240 can extend to a portion of at least one of the first surface (S1) and the second surface (S2) of the laminate 100. In other words, the external electrode 200 can extend to a portion of the first surface (S1) and a portion of the second surface (S2) of the laminate 100, or can extend to a portion of the first surface (S1) or can extend to a portion of the second surface (S2).

[0071] The first external electrode 210 may include a first metal layer 211, a second metal layer 213, and a third metal layer 215. The first metal layer 211 may be connected to the first internal electrode 310, the second metal layer 213 may cover the first metal layer 211, and the third metal layer 215 may cover the second metal layer 213. The first metal layer 211 may include copper (Cu), the second metal layer 213 may include nickel (Ni), and the third metal layer 215 may include tin (Sn). However, this embodiment is not limited thereto. Meanwhile, the second external electrode 220, the third external electrode 230, and the fourth external electrode 240 may have the same structure and composition as the structure and composition of the first external electrode 210 described above.

[0072] FIG. 7 is a perspective view that illustrates a multilayer ceramic electronic component according to a comparative example.

[0073] 7, a multilayer ceramic electronic component 10 according to a comparative example includes a laminate 20 and an external electrode 30. The laminate 20 has a rectangular parallelepiped shape, and the external electrode 30 includes a first external electrode 31, a second external electrode 32, a third external electrode 33, and a fourth external electrode 34. Since the laminate 20 has a rectangular parallelepiped shape, it has eight vertices and twelve corners. The vertices and corners have very small areas and may be easily damaged when external pressure is applied.

[0074] Meanwhile, the laminate 100 of the multilayer ceramic electronic component 1000 according to this embodiment may have a cylindrical or elliptical cylindrical shape. Such a structure does not have parts corresponding to the vertices of a rectangular parallelepiped, and has fewer corners. Therefore, even if an external impact is applied to the multilayer ceramic electronic component according to this embodiment, the risk of breakage is not high. Furthermore, if the corners of the laminate are polished to have a rounded shape, the risk of breakage may be further reduced.

[0075] FIG. 8 is a perspective view illustrating a multilayer ceramic electronic component according to another embodiment, FIG. 9 is a cross-sectional view illustrating a first internal electrode of the multilayer ceramic electronic component of FIG. 8, and FIG. 10 is a cross-sectional view illustrating a second internal electrode of the multilayer ceramic electronic component of FIG.

[0076] 8, 9, and 10, a multilayer ceramic electronic component 2000 can include a multilayer body 2100 and an external electrode 2200.

[0077] The first internal electrode 2300 may include a first electrode body 2310 , a first lead portion 2311 , a second lead portion 2312 , a fifth lead portion 2315 and a sixth lead portion 2316 .

[0078] The first lead portion 2311 is electrically connected to the first external electrode 2210, and the second lead portion 2312 is electrically connected to the second external electrode 2220. In addition, the fifth lead portion 2315 is electrically connected to the fifth external electrode 2250, and the sixth lead portion 2316 is electrically connected to the sixth external electrode 2260.

[0079] Meanwhile, if necessary, one or more pairs of lead portions may be added to the first internal electrode 2300, and a corresponding number of external electrodes may be further disposed.

[0080] The second internal electrode 2400 may include a second electrode body 2410 , a third lead portion 2413 and a fourth lead portion 2414 .

[0081] The third lead portion 2413 is electrically connected to the third external electrode 2230 , and the fourth lead portion 2414 is electrically connected to the fourth external electrode 2240 .

[0082] Meanwhile, if necessary, one or more pairs of lead portions may be added to the second internal electrode 2400, and a corresponding number of external electrodes may be further disposed.

[0083] The remaining components other than those described above are the same as those of the multilayer ceramic electronic component shown in FIG. 1, and therefore a duplicated description thereof will be omitted.

[0084] Although the embodiments of the present invention have been described above, the present invention is not limited thereto, and can be embodied in various modified forms within the scope of the claims, the description of the invention, and the accompanying drawings, which of course also fall within the scope of the present invention. [Explanation of symbols]

[0085] 1000, 2000 Multilayer ceramic electronic components 100, 2100 laminate 110 Dielectric layer 120 Cover Layer 200, 2200 external electrode 210, 2210 1st external electrode 211, 221, 231, 241 1st metal layer 213, 223, 233, 243 2nd metal layer 215, 225, 235, 245 3rd metal layer 220, 2220 2nd external electrode 230, 2230 3rd external electrode 240, 2240 4th external electrode 300 internal electrode 310, 2300 1st internal electrode 311, 2310 1st electrode body 313, 2311 First drawer 315, 2312 Second drawer 320, 2400 2nd internal electrode 321, 2410 2nd electrode body 323, 2413 3rd drawer 325, 2414 4th drawer 2250 5th external electrode 2260 6th external electrode 2315 5th drawer 2316 6th drawer

Claims

1. A laminate including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction; and a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode disposed outside the laminate; The plurality of internal electrodes are a plurality of first internal electrodes connected to the first external electrode and the second external electrode; and a plurality of second internal electrodes connected to the third external electrode and the fourth external electrode; A multilayer ceramic electronic component, wherein an edge of a cross section of the laminate intersecting the first direction is curved.

2. the laminate includes a first surface and a second surface facing each other in the first direction, and a third surface connecting the first surface and the second surface; 2. The multilayer ceramic electronic component according to claim 1, wherein the third surface is a curved surface.

3. 3. The multilayer ceramic electronic component according to claim 2, wherein at least one of a boundary between the first surface and the third surface and a boundary between the second surface and the third surface has a round shape.

4. 3. The multilayer ceramic electronic component according to claim 2, wherein the laminate has a cylindrical or elliptical cylindrical shape.

5. 3. The multilayer ceramic electronic component according to claim 2, wherein the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode are disposed on the third surface of the laminate.

6. 6. The multilayer ceramic electronic component according to claim 5, wherein at least one of the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode extends to a portion of at least one of the first surface and the second surface of the laminate.

7. 6. The multilayer ceramic electronic component according to claim 5, wherein the first external electrode, the second external electrode, the third external electrode, and the fourth external electrode are disposed at equal intervals.

8. 3. The multilayer ceramic electronic component according to claim 1, wherein the laminate includes a structure in which the first internal electrodes and the second internal electrodes are laminated with the dielectric layers sandwiched therebetween.

9. Each of the plurality of first internal electrodes is A first electrode body; and The first electrode body includes a first lead portion and a second lead portion that are disposed on an edge of the first electrode body and spaced apart from each other, Each of the plurality of second internal electrodes is A second electrode body; and 3. The multilayer ceramic electronic component according to claim 1, further comprising a third lead portion and a fourth lead portion that are disposed on an edge of the second electrode body and spaced apart from each other.

10. the first lead portion is connected to the first external electrode, and the second lead portion is connected to the second external electrode; 10. The multilayer ceramic electronic component according to claim 9, wherein the third lead portion is connected to the third external electrode, and the fourth lead portion is connected to the fourth external electrode.

11. 10. The multilayer ceramic electronic component according to claim 9, wherein the first lead portion and the second lead portion are disposed at equal intervals.

12. The multilayer ceramic electronic component according to claim 11 , wherein the third lead portion and the fourth lead portion are disposed at equal intervals.

13. Each of the first internal electrodes further includes a fifth lead portion and a sixth lead portion disposed on an edge of the first electrode body and spaced apart from the first lead portion and the second lead portion, 11. The multilayer ceramic electronic component according to claim 10, further comprising a fifth external electrode connected to the fifth lead portion and a sixth external electrode connected to the sixth lead portion.

14. 10. The multilayer ceramic electronic component according to claim 9, wherein the first electrode body and the second electrode body have a circular or elliptical shape when viewed from the first direction.

15. the first external electrode and the second external electrode each include a first metal layer connected to the plurality of first internal electrodes, a second metal layer covering the first metal layer, and a third metal layer covering the second metal layer; 3. The multilayer ceramic electronic component according to claim 1, wherein the third external electrode and the fourth external electrode each include a first metal layer connected to the plurality of second internal electrodes, a second metal layer covering the first metal layer, and a third metal layer covering the second metal layer.

16. the first metal layer includes copper (Cu); the second metal layer includes nickel (Ni); The multilayer ceramic electronic component according to claim 15 , wherein the third metal layer contains tin (Sn).

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