Coil component

Abstract

To provide a coil component that can maintain connection reliability between a coil and an external electrode within the coil component despite vibration or external impact, and can strengthen the physical bonding force between an electrode portion and the main body by a structure in which the electrode portion is folded to cover the main body.SOLUTION: A coil component according to an embodiment of the present invention includes a main body including a first surface and a second surface opposing each other in a first direction, and a third surface connecting the first surface and the second surface, a support member disposed within the main body, a coil disposed on the support member, including a coil pattern having at least one turn and a lead-out portion extending from an outer end of the coil pattern to the first surface or the second surface, and an electrode portion disposed on the main body, extending from the lead-out portion to the outside of the main body, and having an average thickness thinner than the average thickness of the lead-out portion.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a coil component. [Background technology]

[0002] An inductor, which is one type of coil component, is a typical passive electronic component used in electronic devices along with resistors and capacitors.

[0003] As electronic devices become more sophisticated and smaller, the number of electronic components used in the electronic devices is also increasing and becoming smaller.

[0004] Meanwhile, thin film coil components in which a coil is plated on a support member are advantageous in terms of miniaturization, but have the problem of reduced bonding strength between the external electrodes and the coil. Therefore, there is a demand for a structure that can maintain the reliability of the connection between the coil and the external electrodes even when subjected to vibration or impact. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2023-016157 A Summary of the Invention [Problem to be solved by the invention]

[0006] One object of the embodiments of the present invention is to provide a coil component capable of maintaining connection reliability between the coil and the external electrodes within the coil component despite vibration or external impact.

[0007] Another object of the present invention is to strengthen the physical bonding force between the electrode portion and the main body by using a structure in which the electrode portion is folded and covered with the main body. [Means for solving the problem]

[0008] According to one aspect of the present invention, a coil component can be provided, comprising: a main body including a first surface and a second surface opposing each other in a first direction, and a third surface connecting the first surface and the second surface; a support member disposed within the main body; a coil disposed on the support member, the coil including a coil pattern having at least one turn and a pull-out portion extending from an outer end of the coil pattern to the first surface or the second surface; and an electrode portion disposed on the main body, extending from the pull-out portion to the outside of the main body, the electrode portion having an average thickness thinner than the average thickness of the pull-out portion. Effect of the Invention

[0009] According to one aspect of the present invention, it is possible to maintain the reliability of the connection between the coil and the external electrode in the coil component despite vibration or external impact.

[0010] According to another aspect of the present invention, the electrode portion is folded to cover the main body, thereby making it possible to strengthen the physical bonding force between the electrode portion and the main body. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view illustrating a coil component according to a first embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view taken along line II' in FIG. 1 and an enlarged view of the left and right sides. [Diagram 3] FIG. 2 is a cross-sectional view taken along line II-II' in FIG. [Figure 4a] FIG. 2 is a right side view of FIG. [Figure 4b] This is a variation of FIG. 4a. [Figure 4c] This is a variation of FIG. 4a. [Figure 4d] This is a variation of FIG. 4a. [Diagram 5] FIG. 3 is a view showing a first modified example of the coil component according to the first embodiment of the present invention, which corresponds to FIG. 2. [Figure 6]FIG. 7 is a diagram showing a second modified example of the coil component according to the first embodiment of the present invention, which corresponds to FIG. 5. [Figure 7] FIG. 11 is a perspective view illustrating a coil component according to a second embodiment of the present invention. [Figure 8a] FIG. 8 is a bottom view of FIG. [Figure 8b] This is a variation of FIG. 8a. [Figure 8c] This is a variation of FIG. 8a. [Figure 8d] This is a variation of FIG. 8a. [Figure 8e] This is a variation of FIG. 8a. [Figure 9] FIG. 11 is a perspective view illustrating a coil component according to a third embodiment of the present invention. [Figure 10] FIG. 10 is an exploded perspective view showing the connection relationship between the coils in FIG. 9. [Figure 11] FIG. 10 is a left side view of FIG. [Figure 12] FIG. 10 is a right side view of FIG. [Figure 13] 3A to 3C are process diagrams illustrating a coil forming step of the coil device according to the first embodiment of the present invention. [Figure 14] 3A to 3C are process diagrams illustrating a main body forming step of the coil component according to the first embodiment of the present invention. [Figure 15] 4A to 4C are process diagrams illustrating a bending step of an electrode portion of a coil device according to a first embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The terms used in this application are merely used to describe certain embodiments and are not intended to limit the present invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, the terms "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and should be understood as not precluding the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. And, in the entire specification, "on" means to be located above or below the target part, and does not necessarily mean to be located on the upper side based on the direction of gravity.

[0013] In addition, the term "bonding" does not only mean a case where the components are in direct physical contact with each other in the contact relationship between the components, but is used as a concept that also encompasses a case where other components are interposed between the components and the components are in contact with each other.

[0014] The size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited to those shown in the drawings.

[0015] In the drawings, the L direction may be defined as the first direction or length direction, the W direction may be defined as the second direction or width direction, and the T direction may be defined as the third direction or thickness direction.

[0016] Hereinafter, a coil device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components are designated by the same drawing numbers, and duplicate descriptions thereof will be omitted.

[0017] Various kinds of electronic components are used in electronic devices, and various kinds of coil components can be appropriately used between such electronic components for the purpose of removing noise, etc.

[0018] That is, in electronic devices, coil components can be used as power inductors, high frequency inductors, general beads, high frequency beads (GHz beads), common mode filters, and the like.

[0019] First embodiment

[0020] FIG. 1 is a perspective view showing a schematic configuration of a coil device 1000 according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line I-I' in FIG. 1 and an enlarged view of the left and right sides, FIG. 3 is a cross-sectional view taken along line II-II' in FIG. 1, FIG. 4a is a right side view of FIG. 1, and FIGS. 4b to 4d are modified examples of FIG. 4a.

[0021] On the other hand, in order to more clearly show the bonding between the components, the insulating layer on the main body 100 that can be applied to this embodiment is omitted.

[0022] 1 to 4d, a coil device 1000 according to a first embodiment of the present invention may include a main body 100, a support member 210, a coil 300, and electrode portions 510 and 520. In the embodiment of FIG.

[0023] The coil device 1000 according to this embodiment does not include a separate external electrode, but may include electrode portions 510, 520 that are formed integrally with the coil 300, extend from the coil 300 to the outside of the body 100, and are bent along the side and bottom surfaces of the body 100.

[0024] As a result, the bonding strength between the coil 300 and the external electrode can be improved compared to a structure in which a separate external electrode is connected to the coil 300, and the physical bonding strength between the electrode units 510, 520 and the body 100 can also be strengthened due to the structure in which the electrode units 510, 520 are bent to cover the body 100.

[0025] As a result, the coil device 1000 according to the present embodiment can have an effect of maintaining the connection reliability between the coil 300 and the electrode parts 510 and 520 despite external shocks and vibrations.

[0026] The main components constituting the coil device 1000 according to this embodiment will be described in detail below.

[0027] The main body 100 forms the exterior of the coil device 1000 according to this embodiment, and has a support member 210 and a coil 300 embedded therein.

[0028] The body 100 may be formed in a generally hexahedral shape.

[0029] The main body 100 includes a first surface 101 and a second surface 102 that face each other in a length direction (L, first direction), a third surface 103 and a fourth surface 104 that face each other in a thickness direction (T, third direction), and a fifth surface 105 and a sixth surface 106 that face each other in a width direction (W, second direction). The first surface 101, the second surface 102, the fifth surface 105, and the sixth surface 106 of the main body 100 correspond to wall surfaces of the main body 100 that connect the third surface 103 and the fourth surface 104 of the main body 100.

[0030] The main body 100 may be exemplarily formed so that the coil device 1000 according to the present embodiment including the electrode parts 510 and 520 has a length of 2.5 mm, a width of 2.0 mm, and a thickness of 0.8 mm, a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.6 mm, a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.6 mm, a length of 1.6 mm, a width of 0.8 mm, and a thickness of 0.4 mm, a length of 1.4 mm, a width of 1.2 mm, and a thickness of 0.65 mm, a length of 1.0 mm, a width of 0.7 mm, and a thickness of 0.65 mm, a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.65 mm, or a length of 0.8 mm, a width of 0.4 mm, and a thickness of 0.5 mm, but is not limited thereto. Meanwhile, the above exemplary values ​​regarding the length, width, and thickness of the coil device 1000 are values ​​that do not reflect process errors, and therefore values ​​within the range that can be recognized as process errors should be considered to fall within the above exemplary values.

[0031] The length of the coil part 1000 may refer to the maximum value among the dimensions of a plurality of line segments that are spaced apart from each other in the thickness direction T by connecting two outermost boundary lines facing each other in the length direction L of the coil part 1000 in parallel with the length direction L, based on an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T at the center of the width direction W of the coil part 1000. Alternatively, the length of the coil part 1000 may refer to the minimum value among the dimensions of the above-mentioned plurality of line segments. Alternatively, the length of the coil part 1000 may refer to the arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the length direction L may be equally spaced from each other in the thickness direction T, but the scope of the present invention is not limited thereto.

[0032] The thickness of the coil part 1000 may refer to the maximum value among the dimensions of a plurality of line segments spaced apart from each other in the length direction L by connecting two outermost boundary lines facing each other in the thickness direction T of the coil part 1000 shown in an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T at the center of the width direction W of the coil part 1000 in the image in parallel with the thickness direction T. Alternatively, the thickness of the coil part 1000 may refer to the minimum value among the dimensions of the above-mentioned plurality of line segments. Alternatively, the thickness of the coil part 1000 may refer to the arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the thickness direction T may be equally spaced from each other in the length direction L, but the scope of the present invention is not limited thereto.

[0033] The width of the coil part 1000 may refer to the maximum value among the dimensions of a plurality of line segments spaced apart from each other in the length direction L by connecting two outermost boundary lines facing each other in the width direction W of the coil part 1000 shown in an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-width direction W at the center of the thickness direction T of the coil part 1000 in the image in parallel with the width direction W. Alternatively, the width of the coil part 1000 may refer to the minimum value among the dimensions of the above-mentioned plurality of line segments. Alternatively, the width of the coil part 1000 may refer to the arithmetic average value of at least three or more of the dimensions of the above-mentioned plurality of line segments. Here, the plurality of line segments parallel to the width direction W may be equally spaced from each other in the length direction L, but the scope of the present invention is not limited thereto.

[0034] Alternatively, each of the length, width, and thickness of the coil device 1000 may be measured by a micrometer measurement method. The micrometer measurement method may be performed by setting a zero point with a gauge R&R (Repeatability and Reproducibility) micrometer, inserting the coil device 1000 according to the present embodiment between the tips of the micrometer, and rotating the measurement lever of the micrometer. Meanwhile, when measuring the length of the coil device 1000 by the micrometer measurement method, the length of the coil device 1000 may mean a value measured once, or may mean an arithmetic average of values ​​measured multiple times. This may be similarly applied to the width and thickness of the coil device 1000.

[0035] The main body 100 may include a magnetic material and a resin. Specifically, the main body 100 may be formed by laminating one or more magnetic composite sheets in which a magnetic material is dispersed in a resin. However, the main body 100 may have a structure other than the structure in which a magnetic material is dispersed in a resin. For example, the main body 100 may be made of a magnetic material such as ferrite, or may be made of a non-magnetic material.

[0036] The magnetic material can be a ferrite or metallic magnetic powder.

[0037] The ferrite may be, for example, at least one of spinel-type ferrites such as Mg-Zn-based, Mn-Zn-based, Mn-Mg-based, Cu-Zn-based, Mg-Mn-Sr-based, and Ni-Zn-based ferrites; hexagonal-type ferrites such as Ba-Zn-based, Ba-Mg-based, Ba-Ni-based, Ba-Co-based, and Ba-Ni-Co-based ferrites; garnet-type ferrites such as Y-based ferrites; and Li-based ferrites.

[0038] The metal magnetic powder may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). For example, the metal magnetic powder may be at least one of pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder and Fe-Cr-Al alloy powder.

[0039] The metal magnetic powder can be amorphous or crystalline. For example, the metal magnetic powder may be Fe-Si-B-Cr based amorphous alloy powder, but is not necessarily limited thereto.

[0040] The ferrite and metal magnetic powder may each have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

[0041] The body 100 may include two or more types of magnetic materials dispersed in a resin. Here, different types of magnetic materials means that the magnetic materials dispersed in the resin are distinguished from each other by any one of average diameter, composition, crystallinity, and shape.

[0042] The resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like, either alone or in combination.

[0043] The main body 100 has a core 110 that penetrates the support member 210 and the coil 300. The core 110 can be formed by filling the through hole of the support member 210 with a magnetic composite sheet, but is not limited thereto.

[0044] The support member 210 may be disposed within the body 100. The support member 210 is configured to support the coil 300. Meanwhile, in some embodiments, the support member 210 may be omitted, for example, when the coil 300 corresponds to a wound coil or has a coreless structure.

[0045] The support member 210 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as a polyimide, or a photosensitive insulating resin, or may be formed of an insulating material in which such an insulating resin is impregnated with a reinforcing material such as glass fiber or an inorganic filler. For example, the support member 210 may be formed of a material such as prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) resin, PID (Photo Imagable Dielectric), Copper Clad Laminate (CCL), etc., but is not limited thereto.

[0046] As the inorganic filler, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0047] When the support member 210 is made of an insulating material including a reinforcing material, the support member 210 can provide better rigidity. When the support member 210 is made of an insulating material including no glass fiber, it is advantageous to reduce the thickness of the parts by thinning the entire thickness of the support member 210 and the coil 300 (meaning the sum of the dimensions of the coil 300 and the support member 210 along the thickness direction T in FIG. 1). When the support member 210 is made of an insulating material including a photosensitive insulating resin, it is advantageous to reduce the number of processes for forming the coil 300, thereby reducing production costs, and fine vias 320 can be formed. The thickness of the support member 210 can be, for example, 10 μm to 50 μm, but is not limited thereto.

[0048] The coil 300 is disposed on the support member 210. The coil 300 is embedded in the body 100 and exhibits the characteristics of a coil component. For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil 300 can play a role in stabilizing the power supply of an electronic device by storing an electric field as a magnetic field and maintaining an output voltage.

[0049] The coil 300 is formed on at least one of the opposing surfaces of the support member 210 and has at least one turn. In this embodiment, the coil 300 may include coil patterns 311 and 312, a via 320, and lead-out portions 331 and 332.

[0050] Furthermore, electrode sections 510 and 520 , which will be described later, can extend integrally from lead sections 331 and 332 , and can extend to the outside of main body 100 with a thickness thinner than that of lead sections 331 and 332 .

[0051] 1 to 3, the first coil pattern 311 and the second coil pattern 312 are disposed on both opposing sides of the support member 210, and may be in the form of a planar spiral having at least one turn around the core 110 of the main body 100. For example, based on the direction of FIG. 1, the first coil pattern 311 is disposed on the upper surface of the support member 210 and forms at least one turn around the core 110. The second coil pattern 312 is disposed on the lower surface of the support member 210 and forms at least one turn around the core 110. The first and second coil patterns 311 and 312 are formed such that ends of the outermost turns connected to the lead-out portions 331 and 332 extend in the directions of the first surface 101 and the second surface 102 of the main body 100, respectively.

[0052] 1 to 3, the lead-out portions 331 and 332 may extend from the coil patterns 311 and 312 to the first surface 101 or the second surface 102 of the main body 100. As shown in FIG.

[0053] Specifically, the first lead-out portion 331 may extend from an outer end of the first coil pattern 311 to the first surface 101 of the body 100, and may be connected to the first electrode portion 510 that extends and is bent to the outside of the body 100. However, the first lead-out portion 331 and the first electrode portion 510 may have a structure in which they are integrally formed and connected to each other, except that they have different thicknesses.

[0054] Similarly, the second lead-out portion 332 may extend from an outer end of the second coil pattern 312 to the second surface 102 of the body 100 and be connected to the second electrode portion 520 that extends and is bent to the outside of the body 100. However, the second lead-out portion 332 and the second electrode portion 520 may have a structure in which they are integrally formed and connected to each other, except that they have different thicknesses.

[0055] 3, the coil 300 may further include a via 320 connecting the first coil pattern 311 and the second coil pattern 312. Specifically, the via 320 may pass through the support member 210 and connect inner ends of the innermost turns of the first and second coil patterns 311 and 312 to each other. Therefore, a signal input to the first electrode unit 510 may be output to the second electrode unit 520 through the first lead-out unit 331, the first coil pattern 311, the via 320, the second coil pattern 312, and the second lead-out unit 332. With this structure, each component of the coil 300 may function as one coil connected between the first and second electrode units 510 and 520 as a whole.

[0056] At least one of the coil patterns 311 and 312, the via 320, and the lead-out portions 331 and 332 may include at least one conductive layer.

[0057] For example, when the first coil pattern 311, the via 320, and the first lead-out portion 331 are formed by plating on the upper surface of the support member 210 (based on the direction of FIG. 1), each of the first coil pattern 311, the via 320, and the first lead-out portion 331 may include a seed layer and an electrolytic plating layer. The seed layer may be formed by an electroless plating method or a vapor phase deposition method such as sputtering. Each of the seed layer and the electrolytic plating layer may have a single layer structure or a multilayer structure. The multilayer electrolytic plating layer may be formed in a conformal film structure in which one electrolytic plating layer is covered by another electrolytic plating layer, or may be formed in a shape in which another electrolytic plating layer is laminated on only one surface of one electrolytic plating layer. The seed layer of the first coil pattern 311, the seed layer of the via 320, and the seed layer of the first lead-out portion 331 may be formed integrally and may not have a boundary formed between them, but is not limited thereto. The electrolytic plating layer of the first coil pattern 311, the electrolytic plating layer of the via 320, and the electrolytic plating layer of the first lead-out portion 331 may be integrally formed, and no boundary may be formed between them, but is not limited thereto.

[0058] Each of the coil patterns 311, 312, the via 320, and the lead-out portions 331, 332 may include a conductive material such as, but not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or an alloy thereof.

[0059] In addition, the electrode portions 510 and 520 integrated with the lead portions 331 and 332 may also contain the above-mentioned conductive material.

[0060] 1 and 2, the electrode parts 510 and 520 may be disposed on the body 100 by extending from the leading parts 331 and 332 to the outside of the body 100, and may be formed with an average thickness thinner than the average thickness of the leading parts 331 and 332.

[0061] The lead-out portions 331 and 332 have substantially the same thickness as the coil patterns 311 and 312, but step regions in which the thickness changes discontinuously may be formed between the lead-out portions 331 and 332 and the electrode portions 510 and 520.

[0062] In addition, the average thickness of the electrode parts 510 and 520 may be formed to be thinner than the average thickness of the support member 210. As an example, the average thickness of the support member 210 may be 68 μm, and the average thickness of the electrode parts 510 and 520 may be 30 μm, but is not limited thereto.

[0063] Here, the average thickness of the lead-out portions 331, 332 or the support member 210 may refer to, for example, the arithmetic average value of at least three or more dimensions of a plurality of line segments spaced apart from each other in the length direction L by connecting two outermost boundary lines facing each other in the thickness direction T of the lead-out portions 331, 332 or the support member 210 shown in an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T at the center of the width direction W of the coil device 1000 in the above image in parallel with the thickness direction T. Here, the plurality of line segments may be equally spaced from each other, but the scope of the present invention is not limited thereto.

[0064] In addition, the average thickness of the electrode parts 510 and 520 may refer to, for example, an arithmetic average value of at least three or more dimensions of a plurality of line segments spaced apart from each other in the thickness direction T by connecting two outermost boundary lines facing each other in the length direction L of the electrode parts 510 and 520 shown in an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T at the center of the width direction W of the coil device 1000 in the above image. Here, the plurality of line segments may be equally spaced from each other, but the scope of the present invention is not limited thereto.

[0065] 2, the electrode units 510 and 520 are formed integrally with the lead-out units 331 and 332, and the boundaries between them may not be visible. That is, the first electrode unit 510 may be formed integrally with the first lead-out unit 331 without an interface, and the second electrode unit 520 may be formed integrally with the second lead-out unit 332 without an interface.

[0066] Referring to FIG. 2, the electrode portions 510, 520 may include extension portions 511, 521 that are directly connected to the pull-out portions 331, 332 and that are arranged on the first surface 101 or the second surface 102 of the main body 100, and pad portions 512, 522 that are arranged on the third surface 103.

[0067] The extensions 511 and 521 and the pads 512 and 522 may be integrally formed with each other and connected without an interface.

[0068] 1 and 2, the extension portions 511, 521 may include a bent portion BP bent toward the third surface 103 of the main body 100 in the area in contact with the pull-out portions 331, 332, and the outer surface of the bent portion BP may include a curved surface.

[0069] The bent portion BP of the present embodiment corresponds to a feature resulting from a process in which the electrode units 510 and 520 are integrally formed from the lead-out portions 331 and 332 and bent downward to closely contact the surface of the body 100. Therefore, the outer surface of the bent portion BP may be formed in a round shape.

[0070] Referring to FIG. 2 , the first extension 511 may extend from the first drawer 331 to the outside of the body 100 and be disposed on the first surface 101 of the body 100 .

[0071] Similarly, the second extension portion 521 may extend from the second drawer portion 332 to the outside of the main body 100 and be disposed on the second surface 102 of the main body 100 .

[0072] Referring to FIG. 2, the average length H1 of the first extension portion 511 may be formed to be different from the average length H2 of the second extension portion 521, and the average length H1 of the first extension portion 511 may be formed to be longer than the average length H2 of the second extension portion 521.

[0073] The above feature may correspond to the difference between the sum of the thickness of the support member 210 and the thickness of the electrode parts 510 and 520, which is caused by the extension parts 511 and 521 extending from each of the pull-out parts 331 and 332 being bent downward and placed on the main body 100.

[0074] Here, the average length of the extensions 511, 512 may refer to, for example, the arithmetic average value of at least three or more dimensions of a plurality of line segments spaced apart from each other in the length direction L by connecting the boundaries between the two uppermost and lowermost ends of the extensions 511, 512 facing each other in the thickness direction T in an optical microscope image or a scanning electron microscope (SEM) image of a cross-section in the length direction L-thickness direction T at the center of the width direction W of the coil device 1000 in the above image. Here, the plurality of line segments may be equally spaced from each other, but the scope of the present invention is not limited thereto.

[0075] FIG. 4a is a right side view of FIG. 1, and FIGS. 4b to 4d are modified examples of FIG. 4a.

[0076] 4a, the extensions 511 and 521 of the present embodiment may have a constant width along the second direction W. For example, the extensions 511 and 521 may have a rectangular shape based on the cross section of the WT.

[0077] However, the scope of the present invention is not limited to this, and the shapes of the extensions 511 and 521 can be modified in various ways as follows.

[0078] 4b, the width of the extensions 511 and 521 along the second direction W may be maximum in the area in contact with the pad portions 512 and 522. For example, the extensions 511 and 521 may have a trapezoidal shape based on the cross section of the WT.

[0079] 4c, the width of the extensions 511 and 521 along the second direction W may be smallest in the area in contact with the pad portions 512 and 522. For example, the extensions 511 and 521 may have an inverted trapezoid shape based on the cross section of the WT.

[0080] 4d, the width of the extensions 511, 521 along the second direction W may be greatest at a central region of the extensions 511, 521. For example, the extensions 511, 521 may have a hexagonal shape based on a cross section of the WT.

[0081] Referring to FIG. 1, the width of the pad portions 512 and 522 along the second direction W may be greatest in an area closest to the center of the third surface 103 of the body 100 .

[0082] In addition, the width of the pad parts 512 and 522 in the second direction W may be gradually increased toward the center of the third surface 103 of the main body 100 .

[0083] In addition, the width of the pad portions 512 and 522 in the second direction W may be formed to be minimum in the area where the pad portions 512 and 522 contact the extension portions 511 and 512 .

[0084] Since each region of the electrode portions 510, 520 has the above-mentioned shape, the physical bonding force between the main body 100 and the electrode portions 510, 520 can be strengthened, and since the width of the extension portions 511, 512 is formed narrow, the risk of short-circuiting with adjacent components can be reduced when mounting the coil component 1000 according to this embodiment on a printed circuit board PCB.

[0085] 2, the electrode units 510 and 520 may further include a first metal layer 11 disposed on the pad units 512 and 522. For example, the first metal layer 11 may be a nickel (Ni) plating layer.

[0086] Also, the electrode parts 510 and 520 may further include a second metal layer 22 disposed on the first metal layer 11. For example, the second metal layer 22 may be a tin (Sn) plating layer.

[0087] The first metal layer 11 and the second metal layer 22 may be formed by electrolytic plating, but are not limited thereto.

[0088] 2 and 3, the insulating film IF is disposed between the coil 300 and the body 100 so as to cover the coil 300. The insulating film IF may be formed along the surfaces of the support member 210 and the coil 300. The insulating film IF is for insulating the coil 300 from the body 100, and may include, but is not limited to, a known insulating material such as parylene. The insulating film IF may be formed by, but is not limited to, a method such as vapor deposition, and may also be formed by laminating insulating films on both sides of the support member 210.

[0089] Modification of the first embodiment

[0090] FIG. 5 is a diagram showing a first modified example 1000' of the coil device according to the first embodiment of the present invention, which corresponds to FIG.

[0091] 5 is different from FIG. 2 in that it further includes an adhesive layer AL disposed between the main body 100 and the pad portions 512, 522. FIG.

[0092] Therefore, in describing this modified example, only the adhesive layer AL that differs from the first embodiment of the present invention will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configuration.

[0093] Referring to FIG. 5, the coil device 1000 ′ according to this embodiment may further include an adhesive layer AL disposed between the pad portions 512 , 522 and the third surface 103 of the body 100 .

[0094] The adhesive layer AL is configured to strengthen the bonding force between the pad portions 512 and 522 and the main body 100, and may include epoxy.

[0095] The adhesive layer AL may be a conductive epoxy containing metal particles, but is not limited thereto, and may be a non-conductive epoxy.

[0096] Referring to FIG. 5, the adhesive layer AL in this embodiment is formed as a single layer, but is not limited thereto and may be formed as a multi-layer structure.

[0097] The adhesive layer AL may be formed in a sheet or paste form containing epoxy, but is not limited thereto.

[0098] The coil device 1000' according to this embodiment further includes an adhesive layer AL disposed between the pad portions 512, 522 and the third surface 103 of the body 100, thereby improving the mechanical properties that can withstand impacts and vibrations.

[0099] FIG. 6 is a view showing a second modified example 1000'' of the coil device according to the first embodiment of the present invention, which corresponds to FIG.

[0100] 6 is different from FIG. 5 in that it further includes an insulating layer 700 disposed between the third surface 103 of the main body 100 and the adhesive layer AL.

[0101] Therefore, in explaining this modified example 1000'', only the insulating layer 700 which differs from the first modified example 1000' of the present invention will be explained, and the explanation in the first embodiment of the present invention can be applied as is to the remaining configuration.

[0102] Referring to FIG. 6, the insulating layer 700 is disposed on the third surface 103 of the body 100, and at least a portion of the insulating layer 700 may be disposed to extend between the third surface 103 of the body 100 and the adhesive layer AL.

[0103] That is, while FIG. 6 shows the insulating layer 700 covering the entire third surface 103 of the main body 100, this is not limited thereto, and the insulating layer 700 may have a form in which a portion of the insulating layer 700 extends between the third surface 103 of the main body 100 and the adhesive layer AL, and a portion of the adhesive layer AL overlaps with the insulating layer 700.

[0104] For example, the insulating layer 700 may be formed by applying and curing a material including an insulating resin on the surface of the body 100. In this case, the insulating layer 700 may include at least one of thermoplastic resins such as polystyrene-based, vinyl acetate-based, polyester-based, polyethylene-based, polypropylene-based, polyamide-based, rubber-based, and acrylic-based, thermosetting resins such as phenol-based, epoxy-based, urethane-based, melamine-based, and alkyd-based, and photosensitive insulating resins.

[0105] The coil device 1000 ″ according to this embodiment can reduce the risk of leakage current occurring between the pad portions 512 and 522 along the surface of the main body 100 .

[0106] Furthermore, by interposing the insulating layer 700 between the main body 100 and the adhesive layer AL, the bonding strength can be strengthened compared to when the adhesive layer AL is disposed directly on the main body 100 .

[0107] Second embodiment

[0108] FIG. 7 is a perspective view that diagrammatically illustrates a coil device 2000 according to a second embodiment of the present invention.

[0109] Comparing FIG. 7 with FIG. 1, the coil device 2000 according to this embodiment differs from the first embodiment in the shapes of the pad portions 512 and 522.

[0110] Therefore, in describing this embodiment, only the first embodiment of the present invention and the shape of the pad portions 512, 522 will be described, and the description of the first embodiment of the present invention can be applied as is to the remaining configuration of this embodiment.

[0111] Referring to FIG. 7, the pad portions 512 and 522 of the coil device 2000 according to the present embodiment may be formed to have a constant width in the second direction W, which may be the same as the width of the main body 100 .

[0112] As a result, the pad portions 512, 522 of the coil part 2000 according to this embodiment can have a larger area than that of the first embodiment, and thus the area over which the electrode portions 510, 520 cover the main body 100 can be increased, thereby further strengthening the physical bonding force between the electrode portions 510, 520 and the main body 100.

[0113] Furthermore, the coil device 2000 according to this embodiment has pad portions 512, 522 with large areas, which makes it possible to reduce the direct current resistance Rdc generated at the pad portions 512, 522 when the coil device 2000 is mounted on a printed circuit board PCB.

[0114] In addition, when the electrode units 510 and 520 are formed in the form of a coil bar in which a number of coils 300 are connected, the design process of the electrode units 510 and 520 can be simplified.

[0115] FIG. 8a is a bottom view of FIG. 7, and FIGS. 8b to 8e are modifications of FIG. 8a.

[0116] Referring to FIG. 8a, the pad portions 512 and 522 of this embodiment may have generally flat outer surfaces.

[0117] However, the scope of the present invention is not limited thereto. The pad portions 512 and 522 may have at least one groove GP formed on the outer surface thereof, and the groove GP may be modified into various shapes as follows.

[0118] Referring to FIG. 8b, the groove portion GP may have a circular shape based on the cross section of the LW.

[0119] Also, referring to FIG. 8c, the groove portion GP may have a quadrangular shape based on the cross section of LW.

[0120] Also, referring to FIG. 8d, the groove portion GP may have a rhombus shape based on the cross section of LW.

[0121] Also, referring to FIG. 8e, the groove portion GP may have a linear shape along the second direction based on the LW cross section.

[0122] The groove portion GP may be formed by punching and may penetrate the pad portions 512 and 522, but is not limited thereto, and may be formed in a recessed form in the groove portion GP area without penetrating the pad portions 512 and 522.

[0123] When the pad portions 512, 522 have at least one groove portion GP as in this embodiment and its modified example, the surface area of ​​the outer surface of the pad portions 512, 522 can be increased, thereby strengthening the bonding force when mounted on the printed circuit board PCB.

[0124] In addition, when the groove portion GP is formed to penetrate the pad portions 512, 522, a bonding material such as solder can be filled therein when mounting on the printed circuit board PCB, thereby providing effects such as strengthening the bonding force and preventing the component from rotating.

[0125] Third embodiment

[0126] FIG. 9 is a perspective view illustrating a coil device 3000 according to a third embodiment of the present invention, FIG. 10 is an exploded perspective view illustrating the connection relationship between coils 300, 400 in FIG. 9, FIG. 11 is a left side view of FIG. 9, and FIG. 12 is a right side view of FIG. 9.

[0127] 9 is different from FIG 1 in the configurations of the coils 300, 400, the support members 210, 220, and the electrode portions 510, 520, 530, 540. That is, the coil device 3000 according to the present embodiment may further include a second coil 400, a second support member 220, a third electrode portion 530, and a fourth electrode portion 540.

[0128] Therefore, in describing this embodiment, only the second coil 400, the second support member 220, the third electrode portion 530 and the fourth electrode portion 540, as well as the connection relationships between these components, which are different from the first embodiment of the present invention, will be described, and the explanation in the first embodiment of the present invention can be applied as is to the remaining components of this embodiment.

[0129] 9 and 10, a coil device 3000 according to this embodiment may include a first coil 300 and a second coil 400 that may be magnetically coupled when energized.

[0130] The magnitude of the coupling coefficient k can be adjusted depending on the distance between the first coil 300 and the second coil 400, and the sign of the mutual inductance can be determined depending on the winding direction of the first coil 300 and the second coil 400.

[0131] In the coil device 3000 according to the present embodiment, the first coil 300 and the second coil 400 are wound in opposite directions, but the present invention is not limited thereto and may be wound in the same direction.

[0132] 9 and 10, a first coil pattern 311 and a second coil pattern 312 may be arranged on both sides of a first support member 210, respectively, and the first coil pattern 311 and the second coil pattern 312 may be connected by a first via 320 penetrating the first support member 210.

[0133] Similarly, a third coil pattern 411 and a fourth coil pattern 412 may be arranged on both sides of the second support member 220, respectively, and the third coil pattern 411 and the fourth coil pattern 412 may be connected by a second via 420 that penetrates the second support member 220.

[0134] The first to fourth electrode parts 510, 520, 530, and 540 may extend from the first to fourth lead parts 331, 332, 431, and 432 to the outside of the body 100 and be bent toward the third surface 103 of the body 100, respectively.

[0135] 11 and 12, each of the electrode portions 510, 520, 530, 540 of the coil device 3000 according to this embodiment may include an extension portion 511, 521, 531, 541 and a pad portion 512, 522, 532, 542, and the average lengths of the first to fourth extension portions 511, 521, 531, 541 may be different from each other.

[0136] Specifically, the average length H31 of the first extension portion 511 shown in FIG. 11 may be longer than the average length H33 of the third extension portion 531.

[0137] 12. In addition, the average length H32 of the second extension portion 521 shown in FIG.

[0138] Also, referring to FIGS. 9 to 12, the average lengths H31, H32, H33, and H34 of the first to fourth extensions 511, 521, 531, and 541 may be formed to satisfy H31>H32>H33>H34, respectively.

[0139] Coil component manufacturing process

[0140] Figures 13 to 15 are process diagrams that generally show the manufacturing process steps of a coil device according to the first embodiment of the present invention, where Figure 13 is a process diagram that generally shows the coil formation step of the coil device according to the first embodiment of the present invention, Figure 14 is a process diagram that generally shows the body formation step of the coil device according to the first embodiment of the present invention, and Figure 15 is a process diagram that generally shows the electrode portion bending step of the coil device according to the first embodiment of the present invention.

[0141] The process according to this embodiment is performed in the state of a coil bar in which a plurality of coils 300 are connected, and the bending process of the electrode units 510 and 520 may be performed in units of individual components after dicing.

[0142] Referring to FIG. 13, first, a thin coil 300P and electrodes 510 and 520 can be formed on both sides of a support member 210 through primary plating to the thickness of the electrodes 510 and 520.

[0143] Next, after disposing a plating resist only on the regions of the electrode portions 510 and 520, only the coil pattern can be grown to a desired thickness through secondary plating.

[0144] Next, the plating resist that has served as the dam masking is removed, thereby realizing a structure in which the coil 300 and the thin electrode portions 510, 520 are integrated together.

[0145] 14, dummy members DM are arranged above and below the coil 300 and the electrode units 510, 520 realized in FIG. 13, and the magnetic sheet MS is pressed and hardened in the vertical direction to form the main body 100. Then, a dicing process can be performed to obtain coil components 1000 with the thin electrode units 510, 520 exposed in individual component units.

[0146] 15, downward pressure can be applied to the electrode portions 510, 520 of the coil device 1000 obtained in FIG. 10 via the bending member BM, thereby bending the electrode portions 510, 520 to make them adhere closely to the side surfaces of the main body 100. As shown in FIG.

[0147] Next, the electrode parts 510 and 520 are placed on the guide member GM, and downward pressure is applied to bend the electrode parts 510 and 520 again, so that they can be brought into close contact with the lower surface of the main body 100.

[0148] Through the above manufacturing process, the coil device 1000 according to the first embodiment of the present invention can be realized.

[0149] As described above, one embodiment of the present invention has been described. However, a person having ordinary knowledge in the art may modify and change the present invention in various ways by adding, changing or deleting components without departing from the concept of the present invention described in the claims, and this may also be said to be within the scope of the present invention. [Explanation of symbols]

[0150] 100 Body 110 cores 210, 220 Support member 300p, 300, 400 coil 311, 312, 411, 412 coil patterns 320, 420 Via 331, 332, 431, 432 Drawer section 510, 520, 530, 540 electrode part 511, 521, 531, 541 extension BP bending part 512, 522, 532, 542 Pad section 11 1st metal layer 22 Second metal layer GP groove AL adhesive layer 700 Insulation Layer IF insulating film Tc coil thickness Te electrode thickness H1, H2, H31, H32, H33, H34 Extension length PR Plating resist MS Magnetic Sheet DM Dummy material BM bending parts GM Guide material 1000, 1000', 1000'', 2000, 3000 coil parts

Claims

1. a main body including a first surface and a second surface facing each other in a first direction, and a third surface connecting the first surface and the second surface; a support member disposed within the body; a coil disposed on the support member, the coil including a coil pattern having at least one turn and a lead portion extending from an outer end of the coil pattern to the first surface or the second surface; an electrode portion extending from the lead portion to the outside of the main body and disposed on the main body, the electrode portion having an average thickness thinner than the average thickness of the lead portion.

2. The coil component according to claim 1 , wherein the electrode portion is integrally formed with the lead portion.

3. The electrode portion is The coil component according to claim 1 , further comprising: an extension portion directly connected to the lead portion and disposed on the first surface or the second surface; and a pad portion disposed on the third surface.

4. the extension portion includes a bent portion bent toward the third surface in a region in contact with the pull-out portion, The coil component according to claim 3 , wherein an outer surface of the bent portion includes a curved surface.

5. The coil component according to claim 3 , wherein the extension portion has a constant width along a second direction perpendicular to the first direction.

6. The coil component according to claim 3 , wherein a width of the extension portion along a second direction perpendicular to the first direction is maximum in a region in contact with the pad portion.

7. The coil component according to claim 3 , wherein a width of the extension portion along a second direction perpendicular to the first direction is smallest in a region in contact with the pad portion.

8. The coil component according to claim 3 , wherein a width of the extension portion along a second direction perpendicular to the first direction is maximum at a central region of the extension portion.

9. The coil component according to claim 3 , wherein a width of the pad portion along a second direction perpendicular to the first direction is maximum in a region closest to a center of the third surface.

10. The coil component according to claim 9 , wherein a width of the pad portion along the second direction is wider the closer to a center of the third surface.

11. The coil component according to claim 9 , wherein the width of the pad portion along the second direction is smallest in a region in contact with the extension portion.

12. The coil component according to claim 3 , wherein at least one groove is formed in an outer surface of the pad portion.

13. The coil component according to claim 12 , wherein the groove portion penetrates the pad portion.

14. The coil component according to claim 3 , wherein an adhesive layer is disposed between the pad portion and the third surface.

15. The coil component of claim 14 , wherein the adhesive layer comprises an epoxy.

16. The coil component according to claim 14 , wherein the adhesive layer is formed from a plurality of layers.

17. The coil component of claim 14 , wherein an insulating layer is disposed on the third surface, at least a portion of the insulating layer extending between the third surface and the adhesive layer.

18. The coil component according to claim 3 , wherein the electrode portion further includes a first metal layer disposed on the pad portion.

19. The coil component according to claim 18 , wherein the electrode portion further includes a second metal layer disposed on the first metal layer.

20. The coil component according to claim 1 , wherein an average thickness of the electrode portions is smaller than an average thickness of the support member.

21. the coil pattern includes a first coil pattern disposed on one surface of the support member and a second coil pattern disposed on the other surface of the support member, the lead-out portion includes a first lead-out portion extending from the first coil pattern to the first surface, and a second lead-out portion extending from the second coil pattern to the second surface, the electrode portion includes a first electrode portion extending from the first lead portion and disposed on the first surface, and a second electrode portion extending from the second lead portion and disposed on the second surface, The coil component according to claim 1 , wherein the first electrode portion and the second electrode portion each extend onto a third surface.

22. the first electrode portion includes a first extension portion directly connected to the first lead portion and disposed on the first surface, and a first pad portion disposed on the third surface, the second electrode portion includes a second extension portion directly connected to the second lead portion and disposed on the second surface, and a second pad portion disposed on the third surface, The coil component according to claim 21 , wherein an average length of the first extension portion between the first lead portion and the first pad portion is different from an average length of the second extension portion between the second lead portion and the second pad portion.

23. The coil component according to claim 22 , wherein an average length of the first extension portion between the first lead portion and the first pad portion is longer than an average length of the second extension portion between the second lead portion and the second pad portion.

24. The main body, a first coil and a second coil disposed within the body, the first coil and the second coil having at least one turn; a first electrode portion and a second electrode portion extending from both ends of the first coil to the outside of the main body and disposed on the main body; a third electrode portion and a fourth electrode portion extending from both ends of the second coil to the outside of the body and disposed on the body, an average thickness of each of the first electrode portion and the second electrode portion is smaller than an average thickness of the first coil; A coil component, wherein an average thickness of each of the third electrode portion and the fourth electrode portion is thinner than an average thickness of the second coil.

25. The coil assembly of claim 24 , wherein the first coil and the second coil are spaced apart from each other and wound in opposite directions.

26. the first electrode portion and the second electrode portion are integrally formed with the first coil, The coil component according to claim 24 , wherein the third electrode portion and the fourth electrode portion are integrally formed with the second coil.

27. The main body includes a first surface and a second surface facing each other in a first direction, and a third surface connecting the first surface and the second surface, Each of the first electrode portion and the third electrode portion is disposed on the first surface and extends to the third surface, The coil component according to claim 24 , wherein each of the second electrode portion and the fourth electrode portion is disposed on the second surface and extends onto the third surface.

28. the first electrode portion and the third electrode portion disposed on the first surface have average lengths different from each other, The coil component according to claim 27 , wherein the second electrode portion and the fourth electrode portion arranged on the second surface have average lengths different from each other.

29. a first support member on which the first coil is disposed; and a second support member on which the second coil is disposed. The coil component according to claim 24 .

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