Method for manufacturing light-emitting device

Abstract

To provide a highly productive method for manufacturing a light-emitting device.SOLUTION: A method for manufacturing a light-emitting device comprises: a step in which a first light-emitting element is temporarily bonded to a wiring board; a step in which the characteristics of the first light-emitting element is evaluated and it is determined whether the first light-emitting element is non-defective or defective; a step in which the first light-emitting element having been determined to be defective is removed from the wiring board; a step in which a second light-emitting element is arranged in a region of the wiring board, in which the removed first light-emitting element has been arranged and the second light-emitting element is temporarily bonded to the wiring board; and a step in which electroless plating of a metal material is performed on the surface of a first structure in which an electrode of the first light-emitting element having been determined to be non-defective and the terminal of the wiring board are temporarily bonded, and on the surface of a second structure in which the electrode of the second light-emitting element and the terminal of the wiring board are temporarily bonded, and the first light-emitting element and the second light-emitting element which have been determined to be non-defective are normally bonded to the wiring board.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The embodiment relates to a method for manufacturing a light emitting device. [Background technology]

[0002] Light-emitting devices have been developed that have many light-emitting elements mounted on a single wiring board. In such light-emitting devices, if there is a defective light-emitting element mounted on the wiring board, a process is required to remove the defective element and replace it with a good element. However, this replacement process may reduce the productivity of the light-emitting device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-003236 A Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the embodiments is to provide a method for manufacturing a light emitting device with high productivity. [Means for solving the problem]

[0005] A method for manufacturing a light emitting device according to an embodiment includes the steps of: preparing a wiring board having a plurality of terminals; and a plurality of light emitting elements including a plurality of first light emitting elements and at least one second light emitting element, each of which has an electrode; temporarily bonding the first light emitting element to the wiring board by contacting and pressing the electrodes of the first light emitting elements with terminals of the wiring board; evaluating characteristics of the first light emitting element temporarily bonded to the wiring board and determining whether the first light emitting element is a pass / fail product based on the evaluation results; removing the first light emitting element determined to be a fail product in the step of determining whether the first light emitting element is a pass / fail product from the wiring board; The method includes a process of temporarily joining the second light-emitting element and the wiring board by placing the second light-emitting element in the area of ​​the plate where the removed first light-emitting element was located, and contacting and pressing the electrode of the second light-emitting element with the terminal of the wiring board to which the electrode of the removed first light-emitting element was temporarily joined; and a process of electrolessly plating a metal material on a surface of a first structure to which the electrode of the first light-emitting element determined to be a good product and the terminal of the wiring board are temporarily joined, and on a surface of a second structure to which the electrode of the second light-emitting element and the terminal of the wiring board are temporarily joined, thereby permanently joining the first light-emitting element determined to be a good product and the second light-emitting element to the wiring board. Effect of the Invention

[0006] According to the embodiment, a highly productive method for manufacturing a light emitting device can be realized. [Brief description of the drawings]

[0007] [Figure 1A] FIG. 1A is a plan view showing a wiring board. [Figure 1B] FIG. 1B is a cross-sectional view taken along line IB-IB shown in FIG. 1A. [Figure 2A] FIG. 2A is a plan view showing the first light emitting element. [Figure 2B] FIG. 2B is a cross-sectional view taken along line IIB-IIB shown in FIG. 2A. [Figure 3A] FIG. 3A is a plan view showing the second light emitting element. [Figure 3B]FIG. 3B is a cross-sectional view taken along line IIIB-IIIB shown in FIG. 3A. [Figure 4A] FIG. 4A is a cross-sectional view showing a method for manufacturing a light emitting device according to an embodiment. [Figure 4B] FIG. 4B is a partially enlarged cross-sectional view showing region IVB shown in FIG. 4A. [Diagram 5] FIG. 5 is a cross-sectional view showing a method for manufacturing a light emitting device according to an embodiment. [Figure 6] 6A to 6C are cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. [Figure 7] 7A to 7C are cross-sectional views showing a method for manufacturing a light emitting device according to an embodiment. [Figure 8] FIG. 8 is a cross-sectional view showing a method for manufacturing a light emitting device according to an embodiment. [Figure 9] FIG. 9 is a cross-sectional view showing a method for manufacturing a light emitting device according to an embodiment. [Figure 10] FIG. 10 is a plan view showing a method for manufacturing a light emitting device according to an embodiment. [Figure 11] FIG. 11 is a plan view showing a method for manufacturing a light emitting device according to an embodiment. [Figure 12] FIG. 12 is a plan view showing a method for manufacturing a light emitting device according to an embodiment. [Figure 13A] FIG. 13A is a cross-sectional view showing a light emitting device according to an embodiment. [Figure 13B] FIG. 13B is a partially enlarged cross-sectional view showing an area XIIIB shown in FIG. 13A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] <Embodiment> Hereinafter, the embodiments will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as the actual ones. Even when the same part is shown, the dimensional ratio and positional relationship between the drawings are not necessarily strictly the same. Furthermore, in this specification and each figure, elements similar to those explained with respect to the previous figures are given the same reference numerals, and detailed explanations are omitted as appropriate. Furthermore, an end view showing only the cut surface may be used as a cross-sectional view.

[0009] FIG. 1A is a plan view showing a wiring board, and FIG. 1B is a cross-sectional view taken along line IB-IB shown in FIG. 1A. FIG. 2A is a plan view showing the first light emitting element, and FIG. 2B is a cross-sectional view taken along line IIB-IIB shown in FIG. 2A. FIG. 3A is a plan view showing the second light emitting element, and FIG. 3B is a cross-sectional view taken along line IIIB-IIIB shown in FIG. 3A. FIG. 4A is a cross-sectional view showing a method for manufacturing a light emitting device according to this embodiment, and FIG. 4B is a partially enlarged cross-sectional view showing a region IVB shown in FIG. 4A. 5 to 9 are cross-sectional views showing a method for manufacturing the light emitting device according to this embodiment. 10 to 12 are plan views showing a method for manufacturing a light emitting device according to this embodiment. FIG. 13A is a cross-sectional view showing the light emitting device according to this embodiment, and FIG. 13B is a partially enlarged cross-sectional view showing a region XIIIB shown in FIG. 13A.

[0010] (Preparing a wiring board, a first light emitting element, and a second light emitting element) As shown in Figures 1A and 1B, a wiring board 30 is prepared. The wiring board 30 has an insulating base 31 and a plurality of terminals 32. The terminals 32 can be formed from a metal material, and preferably contain gold (Au). For example, at least the outermost surface of the terminals 32 is made of gold. The entire terminals 32 may be made of gold.

[0011] The wiring board 30 is, for example, an ASIC (Application Specific Integrated Circuit). Wiring (not shown) is provided in the base 31. At least one p-electrode pad (not shown) and at least one n-electrode pad (not shown) are provided on the upper surface of the base 31. For example, two adjacent terminals 32 form a pair, and a plurality of pairs are arranged in a matrix on the upper surface of the base 31. In one example, about 16,000 pairs of terminals 32 are arranged.

[0012] One of the pair of terminals 32 is connected to a p-electrode pad via a wiring in the base 31, and the other of the pair of terminals 32 is connected to an n-electrode pad via a wiring in the base 31. In this specification, "connection" means electrical connection.

[0013] As shown in Figures 2A and 2B, a plurality of first light-emitting elements 10 are prepared. Each of the first light-emitting elements 10 has an electrode 12. The electrode 12 can be made of a metal material, and preferably contains gold. For example, at least the outermost surface of the electrode 12 is made of gold. The entire electrode 12 may be made of gold.

[0014] The first light-emitting element 10 is, for example, a micro LED (Light Emitting Diode). Each of the first light-emitting elements 10 further includes a semiconductor laminate 11. The semiconductor laminate 11 includes a p-type layer, an n-type layer, and an active layer disposed between the p-type layer and the n-type layer. The semiconductor laminate 11 has an upper surface 11a, a lower surface 11b, and a side surface 11c. The upper surface 11a is a light-emitting surface of the first light-emitting element 10. The lower surface 11b is located opposite to the upper surface 11a.

[0015] For example, in a plan view, the upper surface 11a and the lower surface 11b are rectangular. Therefore, four side surfaces 11c are arranged between the upper surface 11a and the lower surface 11b. The lower surface 11b is smaller than the upper surface 11a. Therefore, the side surfaces 11c are inclined with respect to a direction perpendicular to the upper surface 11a and the lower surface 11b. The length of one side of the upper surface 11a is, for example, 50 μm or less.

[0016] For example, two electrodes 12 are arranged on the lower surface 11b of the semiconductor laminate 11. One electrode 12 is connected to the p-type layer of the semiconductor laminate 11, and the other electrode 12 is connected to the n-type layer of the semiconductor laminate 11.

[0017] The multiple first light-emitting elements 10 are arranged on the support substrate 101 in such a direction that the electrode 12 is located on the side farther from the support substrate 101. The support substrate 101 is, for example, a transfer jig, and includes, for example, silicon, glass, or sapphire. The first surface 101a of the support substrate 101 may have adhesive properties. In this case, the upper surface 11a of the semiconductor laminate 11 of the first light-emitting element 10 is adhered to the first surface 101a of the support substrate 101, which has adhesive properties. For example, about 16,000 first light-emitting elements 10 are arranged in a matrix on the first surface 101a of the support substrate 101.

[0018] As shown in Figs. 3A and 3B, at least one second light-emitting element 20 is prepared. The configuration of the second light-emitting element 20 is, for example, similar to the configuration of the first light-emitting element 10. The second light-emitting element 20 includes a semiconductor laminate 21 and an electrode 22. The electrode 22 can be formed of a metal material and preferably contains gold. For example, at least the outermost surface of the electrode 22 is made of gold, and for example, the entire electrode 22 may be made of gold. The first light-emitting element 10 and the second light-emitting element 20 are also collectively referred to as "light-emitting elements."

[0019] (Step of temporarily joining the first light emitting element to the wiring board) As shown in Figures 4A and 4B, the support substrate 101 is placed opposite the wiring substrate 30. At this time, the electrodes 12 of the first light-emitting elements 10 are placed opposite the terminals 32 of the wiring substrate 30. Next, the support substrate 101 and the wiring substrate 30 are brought close to each other, so that the electrodes 12 of the first light-emitting elements 10 come into contact with the terminals 32 of the wiring substrate 30 and are pressed against each other. In one example, the pressing force is 600 N for the entire first light-emitting elements 10, the pressing time is 10 seconds, the temperature is 200°C, and no ultrasonic waves are applied. In this example, the pressing force per unit area is 14.65 N / mm 2As a result, the electrodes 12 of the multiple first light emitting elements 10 are temporarily joined collectively to the multiple terminals 32. As a result, the multiple first light emitting elements 10 are temporarily joined to the wiring board 30.

[0020] In this step, the electrode 12 and the terminal 32 are joined together at parts of their surfaces while the electrode 12 and the terminal 32 generally maintain their shapes before joining. For example, as shown in FIG. 4B, if the lower surface of the electrode 12 before joining is convexly curved and the upper surface of the terminal 32 is generally flat, a gap 43 having a wedge-shaped cross section is formed between the periphery of the lower surface of the electrode 12 and the upper surface of the terminal 32. As a result, the electrode 12 and the terminal 32 are electrically connected, but the mechanical joining strength is strong enough to separate the electrode 12 from the terminal 32 without destroying the electrode 12 and the terminal 32. Next, as shown in FIG. 5, the support substrate 101 is removed from the plurality of first light-emitting elements 10.

[0021] (Step of determining whether the first light emitting element is good or bad) Next, as shown in FIG. 6, the characteristics of the first light-emitting element 10 temporarily joined to the wiring board 30 are evaluated, and based on the evaluation results, it is determined whether the first light-emitting element 10 is a non-defective product or a defective product.

[0022] For example, power is supplied to the plurality of first light-emitting elements 10 via the wiring board 30, and the electrical characteristics of the first light-emitting elements 10 are evaluated. The electrical characteristics to be evaluated are, for example, the luminance of light emitted from the first light-emitting elements 10 when a predetermined voltage is applied to each of the first light-emitting elements 10. By evaluating such electrical characteristics, the plurality of first light-emitting elements 10 temporarily joined to the wiring board 30 are classified into non-defective and defective products.

[0023] For example, a first light-emitting element 10 that emits light with a luminance equal to or greater than a reference value is deemed a "good product," and a first light-emitting element 10 that emits light with a luminance lower than the reference value or does not emit light at all is deemed a "defective product." Hereinafter, a first light-emitting element 10 that is determined to be defective is referred to as a "first light-emitting element 10x." In addition, the electrode 12 of the first light-emitting element 10x that is determined to be defective is referred to as an "electrode 12x," and the terminal 32 to which the first light-emitting element 10x is joined is referred to as a "terminal 32r."

[0024] (Step of removing the first light emitting element determined to be defective from the wiring substrate) 7, the electrode 12x of the first light-emitting element 10x determined to be defective in the process of determining whether the first light-emitting element 10 is a non-defective or defective element is separated from the terminal 32r of the wiring substrate 30. In this way, the first light-emitting element 10x determined to be defective is removed from the wiring substrate 30.

[0025] For example, the first light emitting element 10x is heated by irradiating the semiconductor laminate 11 of the first light emitting element 10x with laser light. This generates thermal stress at the interface between the electrode 12x of the first light emitting element 10x and the terminal 32r of the wiring board 30, and the electrode 12x is detached from the terminal 32r. Alternatively, the first light emitting element 10x may be removed from the wiring board 30 by adhering an adhesive jig to the first light emitting element 10x and then removing the jig together with the first light emitting element 10x from the wiring board 30. Alternatively, the first light emitting element 10x may be removed by sucking it with a suction device, or the first light emitting element 10x may be removed by blowing air partially against it.

[0026] The process of removing the first light-emitting elements 10x determined to be defective is repeated until all the first light-emitting elements 10x are replaced with the second light-emitting elements 20 or until the proportion of the first light-emitting elements 10x among the light-emitting elements temporarily joined to the wiring substrate 30 becomes equal to or less than a reference value.

[0027] (Step of temporarily joining the second light emitting element and the wiring board) 8, the second light-emitting element 20 is disposed in the region R10x where the first light-emitting element 10x was disposed on the wiring substrate 30. At this time, the second light-emitting element 20 is held by a jig 200, moved to the vicinity of the region R10x, and pressed against the wiring substrate 30.

[0028] The jig 200 has a first plane 201 and an air intake port 202. The outer shape of the first plane 201 is rectangular, and the size of the first plane 201 corresponds to an area in the wiring board 30 where nine first light-emitting elements 10 arranged in three rows and three columns are arranged. The first plane 201 is formed of a single member made of metal. The metal is, for example, a cemented carbide or stainless steel, and the cemented carbide is, for example, a WC-Co alloy, and the stainless steel is, for example, SUS304.

[0029] The air intake 202 has an opening 202a in a part of the first plane 201, for example, in the center. The opening 202a of the air intake 202 is smaller than the upper surface 21a of the semiconductor laminate 21 of the second light-emitting element 20. By making the pressure inside the air intake 202 negative relative to atmospheric pressure in a state in which the upper surface 21a of the second light-emitting element 20 is in contact with the first plane 201 so as to close the opening 202a, the jig 200 can adsorb the second light-emitting element 20 to the first plane 201, thereby temporarily fixing the second light-emitting element 20.

[0030] Next, as shown in FIG. 9, the jig 200 is moved to place the second light-emitting element 20 in the region R10x of the wiring board 30 where the first light-emitting element 10x was located, and the electrode 22 of the second light-emitting element 20 is brought into contact with the terminal 32r of the wiring board 30, i.e., the terminal to which the electrode 12x of the removed first light-emitting element 10x was joined.

[0031] At this time, as shown in FIGS. 9 and 10, the first flat surface 201 of the jig 200 is also in contact with the eight light-emitting elements arranged around the region R10x in which the first light-emitting element 10x was arranged.

[0032] As a result, the first plane 201 of the jig 200 presses the nine light-emitting elements arranged in an area of ​​three rows and three columns with the second light-emitting element 20 at the center, toward the wiring board 30. The temperature and time at this time are similar to those for the temporary bonding of the first light-emitting element 10 shown in Figures 4A and 4B. The pressing force of the jig 200 is adjusted according to the number of light-emitting elements that the jig 200 presses simultaneously.

[0033] As a result, the electrode 12 of the second light-emitting element 20 and the terminal 32r of the wiring board 30 are temporarily joined, and the second light-emitting element 20 is temporarily joined to the wiring board 30. In Fig. 10, the second light-emitting element 20 is indicated by a dot. The same applies to Figs. 11 and 12 described below. Thereafter, the pressure inside the air intake 202 of the jig 200 is returned to atmospheric pressure, and the jig 200 is moved away from the second light-emitting element 20.

[0034] As shown in FIG. 11, when the region R10x in which the first light-emitting element 10x was arranged is located on the side of the region R in which multiple first light-emitting elements 10 are arranged on the wiring board 30, the first plane 201 of the jig 200 presses one second light-emitting element 20 and five light-emitting elements located around it.

[0035] As shown in FIG. 12, when the region R10x is located at a corner of the region R, the first flat surface 201 of the jig 200 presses one second light-emitting element 20 and three light-emitting elements located around it.

[0036] The process of temporarily bonding the second light-emitting element 20 and the wiring board 30 is repeated until the second light-emitting element 20 is temporarily bonded to all the regions R10x. Note that, if the second light-emitting element 20 held by the jig 200 this time is the first second light-emitting element 20, the light-emitting elements arranged around the region R10x are all first light-emitting elements 10 determined to be non-defective, whereas, if the second light-emitting element 20 held by the jig 200 this time is the second or subsequent second light-emitting element 20, the light-emitting elements arranged around the region R10x are either the first light-emitting element 10 determined to be non-defective or the second light-emitting element 20 temporarily bonded in place of the defective first light-emitting element 10x before the second light-emitting element 20 to be temporarily bonded this time.

[0037] In the process of provisionally bonding the second light-emitting element 20, at the stage where the electrode 22 of the second light-emitting element 20 contacts the terminal 32r of the wiring board 30, the first plane 201 of the jig 200 is likely not in contact with the surrounding light-emitting elements, and the pressing force of the jig 200 is concentrated and applied to the second light-emitting element 20. As the provisional bonding of the electrode 22 and the terminal 32r progresses, the second light-emitting element 20 is pressed toward the wiring board 30, and the first plane 201 approaches the wiring board 30 accordingly. Then, when the first plane 201 contacts the light-emitting elements surrounding the second light-emitting element 20, the pressing force of the jig 200 is distributed and applied to the second light-emitting element 20 and the surrounding light-emitting elements, and it is possible to avoid the pressing force being concentrated only on the second light-emitting element 20.

[0038] As a result, until the temporary bonding between the electrode 22 and the terminal 32r progresses to a certain extent, a pressing force can be reliably applied to the second light-emitting element 20, and after the temporary bonding between the electrode 22 and the terminal 32r progresses to a certain extent, it is possible to prevent an excessive pressing force from being applied to the second light-emitting element 20. This allows the second light-emitting element 20 to be temporarily bonded to the wiring board 30 while preventing damage to the second light-emitting element 20.

[0039] Furthermore, even if there is a light-emitting element with insufficient temporary bonding around the second light-emitting element 20, the jig 200 presses the second light-emitting element 20 and the light-emitting element with insufficient temporary bonding at the same time, so that the light-emitting element with insufficient temporary bonding can be temporarily bonded again. Since the upper surface of the light-emitting element with insufficient temporary bonding is often slightly farther from the wiring board 30 than the upper surface of the light-emitting element with sufficient temporary bonding, the pressing force is applied intensively to the light-emitting element with insufficient temporary bonding as well as the second light-emitting element 20 until the position of the upper surface of the light-emitting element with insufficient temporary bonding becomes the same as the position of the upper surface of the light-emitting element with sufficient temporary bonding. This allows the light-emitting element with insufficient temporary bonding to be temporarily bonded again effectively.

[0040] The light-emitting elements that the first plane 201 of the jig 200 presses simultaneously are not limited to nine light-emitting elements arranged in three rows and three columns. For example, 25 light-emitting elements arranged in five rows and five columns may be pressed, or three light-emitting elements arranged in one row and three columns may be pressed. When the pressing force of the jig 200 is F and the number of light-emitting elements pressed simultaneously is n, the shape and size of the first plane 201 may be determined so that the value of (F / n) falls within a suitable range of pressing forces for temporarily bonding one light-emitting element to the wiring board 30.

[0041] Next, the characteristics of the second light-emitting element 20 temporarily bonded to the wiring board 30 are evaluated. The evaluation method is the same as the method used to evaluate the first light-emitting element 10. As a result, if any second light-emitting element 20 is determined to be defective, it is removed from the wiring board 30 and a new second light-emitting element 20 is temporarily bonded. This process is repeated until all light-emitting elements are determined to be non-defective or until the proportion of light-emitting elements determined to be non-defective reaches or exceeds a reference value.

[0042] (Main joining process) 13A and 13B, a metal material is electrolessly plated on a surface of a first structure 41 in which the electrode 12 of the first light-emitting element 10 determined to be a non-defective product is temporarily joined to the terminal 32 of the wiring board 30, and on a surface of a second structure 42 in which the electrode 22 of the second light-emitting element 20 is temporarily joined to the terminal 32r of the wiring board 30. Copper or gold can be used as the metal material for electrolessly plating, with gold being preferred.

[0043] For example, a structure in which a plurality of light emitting elements are temporarily bonded to the wiring board 30 is immersed in a plating solution. As a result, a metal layer 45 is formed on the surface of the first structure 41 and the surface of the second structure 42. The metal layer 45 is also disposed in the gap 43. As a result, the terminal 32 of the wiring board 30 and the electrode 12 of the first light emitting element 10 are permanently bonded, and the terminal 32r of the wiring board 30 and the electrode 22 of the second light emitting element 20 are permanently bonded. As a result, the first light emitting element 10 and the second light emitting element 20 that are determined to be non-defective are permanently bonded to the wiring board 30. The bonding strength between the light emitting element and the wiring board 30 after the permanent bonding is higher than the bonding strength between the light emitting element and the wiring board 30 after the temporary bonding and before the permanent bonding. In this manner, the light emitting device according to the present embodiment is manufactured.

[0044] The surface of the metal layer 45 formed by electroless plating has projections and recesses. This makes it possible to strengthen the bond between the metal layer 45 and the sealing resin when a sealing resin is provided on the wiring board 30 to cover the light emitting elements.

[0045] (effect) According to this embodiment, after the first light emitting element 10 is provisionally bonded to the wiring board 30 in the process shown in Figure 4A and Figure 4B, the characteristics of the first light emitting element 10 are evaluated in the process shown in Figure 6 to determine whether it is a good product or a defective product, the first light emitting element 10x determined to be a defective product is removed from the wiring board 30 in the process shown in Figure 7, the second light emitting element 20 is provisionally bonded to the region R10x of the wiring board 30 from which the first light emitting element 10x has been removed in the process shown in Figure 9, and electroless plating is performed in the process shown in Figure 13A and Figure 13B, so that the first light emitting element 10 and the second light emitting element 20 determined to be a good product are permanently bonded to the wiring board 30. As a result, the first light emitting element 10x determined to be a defective product can be efficiently replaced with the second light emitting element 20. Therefore, the light emitting device according to this embodiment has high productivity.

[0046] In the present embodiment, in the step of temporarily bonding the second light-emitting element 20 to the wiring board 30, as shown in Figs. 9 to 12, not only the second light-emitting element 20 but also the light-emitting elements arranged around the second light-emitting element 20 are pressed toward the wiring board 30 by the jig 200 at the same time. This allows the pressing force from the jig 200 to be distributed and applied to the multiple light-emitting elements, and prevents the pressing force from being concentrated on the second light-emitting element 20. As a result, damage to the second light-emitting element 20 can be suppressed.

[0047] Furthermore, in this embodiment, in the step of temporarily joining the second light-emitting element 20 to the wiring board 30, the first plane 201 of the jig 200 presses the light-emitting elements arranged in an area of ​​at least 3 rows and 3 columns around the second light-emitting element 20 against the wiring board 30. This allows nine light-emitting elements to be pressed simultaneously. Even when the second light-emitting element 20 is placed at a corner of the region R in which the light-emitting elements are placed on the wiring board 30, at least four light-emitting elements including the second light-emitting element 20 are pressed simultaneously. As a result, it is possible to prevent the pressing force from concentrating on the second light-emitting element 20.

[0048] Furthermore, in this embodiment, the first plane 201 of the jig 200 is formed from a single member made of a cemented carbide. This makes the first plane 201 highly rigid and less likely to distort even when the light emitting element is pressed. As a result, a stable pressing force can be applied to the second light emitting element 20.

[0049] Furthermore, in this embodiment, the electrode of the light-emitting element and the terminal of the wiring board each contain gold. As a result, in the process of removing the first light-emitting element 10x determined to be defective as shown in FIG. 7, the bond is released at the interface between the electrode 12x containing gold and the terminal 32r containing gold, so that residue is less likely to remain on the surface of the terminal 32r. Therefore, when the second light-emitting element 20 is temporarily bonded to the wiring board 30, the bonding strength between the electrode 22 and the terminal 32r can be increased.

[0050] Furthermore, in this embodiment, the metal material used for electroless plating on the surfaces of first structure 41 and second structure 42 also contains gold. This prevents an oxide layer from being formed at the interface between first structure 41 containing gold and metal layer 45 containing gold, and at the interface between second structure 42 containing gold and metal layer 45 containing gold, improving the adhesion of metal layer 45. As a result, the strength of the bond is improved.

[0051] 2A and 2B, a plurality of first light-emitting elements 10 are disposed on a support substrate 101, and in the process shown in Fig. 4A and 4B, the electrodes 12 of the plurality of first light-emitting elements 10 are temporarily bonded together to a plurality of terminals 32. This allows a plurality of first light-emitting elements 10, for example, about 16,000 pieces, to be temporarily bonded together to the wiring substrate 30, thereby improving the productivity of the light-emitting device.

[0052] The above-described embodiment is an example of implementing the present invention, and the present invention is not limited to this embodiment. For example, the present invention also includes the above-described embodiment in which some components or steps are added, deleted, or changed.

[0053] The present invention includes the following aspects.

[0054] (Appendix 1) A step of preparing a wiring board having a plurality of terminals and a plurality of light emitting elements including a plurality of first light emitting elements and at least one second light emitting element each having an electrode; a step of temporarily bonding the first light emitting element to the wiring board by contacting and pressing an electrode of the first light emitting element with a terminal of the wiring board; a step of evaluating characteristics of the first light emitting element temporarily joined to the wiring board, and determining whether the first light emitting element is a non-defective product or a defective product based on the evaluation result; removing the first light emitting element determined to be defective in the step of determining whether the first light emitting element is a non-defective or defective element from the wiring substrate; a step of temporarily bonding the second light-emitting element to the wiring board by placing the second light-emitting element in a region of the wiring board where the removed first light-emitting element was placed, and bringing an electrode of the second light-emitting element into contact with and pressing a terminal of the wiring board to which the electrode of the removed first light-emitting element was temporarily bonded; a step of electrolessly plating a metal material on a surface of a first structure in which an electrode of the first light-emitting element determined to be a non-defective product is temporarily joined to a terminal of the wiring board, and on a surface of a second structure in which an electrode of the second light-emitting element is temporarily joined to a terminal of the wiring board, thereby permanently joining the first light-emitting element determined to be a non-defective product and the second light-emitting element to the wiring board; A method for manufacturing a light emitting device comprising the steps of:

[0055] (Appendix 2) The method for manufacturing a light-emitting device described in Appendix 1, in which, in the process of temporarily joining the second light-emitting element and the wiring board, the second light-emitting element is placed in an area of ​​the wiring board where the removed first light-emitting element was placed using a jig that temporarily fixes the second light-emitting element to a first plane thereof, and the electrode of the second light-emitting element is brought into contact with the terminal of the wiring board to which the electrode of the removed first light-emitting element was joined, and the second light-emitting element and the light-emitting elements arranged around it are pressed against the wiring board using the first plane of the jig, thereby temporarily joining the second light-emitting element and the wiring board.

[0056] (Appendix 3) A method for manufacturing a light-emitting device as described in Appendix 2, in which, in the step of temporarily joining the second light-emitting element and the wiring board, the second light-emitting element and the wiring board are temporarily joined by pressing light-emitting elements arranged in an area of ​​at least 3 rows and 3 columns centered on the second light-emitting element on a first plane of the jig against the wiring board.

[0057] (Appendix 4) 4. The method for manufacturing a light emitting device according to claim 2, wherein the first plane of the jig is formed from a single member made of metal.

[0058] (Appendix 5) 5. The method for manufacturing a light emitting device according to claim 1, wherein the electrodes, the terminals, and the metal material each contain gold.

[0059] (Appendix 6) In the step of preparing the plurality of light-emitting elements, the plurality of first light-emitting elements are disposed on a support substrate in an orientation such that the electrode is located on a side farther from the support substrate; A method for manufacturing a light-emitting device according to any one of Appendices 1 to 5, in which, in the step of temporarily bonding the plurality of first light-emitting elements to the wiring board, the support board and the wiring board are brought close to each other, thereby bringing the electrodes of the first light-emitting elements into contact with and pressing them against the terminals of the wiring board, thereby temporarily bonding the electrodes of the plurality of first light-emitting elements to the plurality of terminals collectively. [Industrial Applicability]

[0060] The present invention can be used, for example, as a headlamp for a vehicle and a light source for a display device. [Explanation of symbols]

[0061] 10 First light emitting element 10x The first light-emitting element judged to be defective 11 Semiconductor laminate 11a Top side 11b Bottom side 11c side 12, 12x electrodes 20 Second light-emitting element 21 Semiconductor laminate 21a Top side 22 electrodes 30 Wiring board 31 Base 32, 32r terminal 41 First structure 42 Second structure 43 void 45 Metal layer 101 Support substrate 101a 1st page 200 Jig 201 1st plane 202 Air intake 202a opening R: Region in the wiring substrate 30 in which the plurality of first light emitting elements 10 are arranged R10x: Region of the wiring substrate 30 in which the first light emitting element 10x determined to be defective was located

Claims

1. A step of preparing a wiring board having a plurality of terminals and a plurality of light emitting elements including a plurality of first light emitting elements and at least one second light emitting element each having an electrode; a step of temporarily bonding the first light emitting element to the wiring board by contacting and pressing an electrode of the first light emitting element with a terminal of the wiring board; a step of evaluating characteristics of the first light emitting element temporarily joined to the wiring board, and determining whether the first light emitting element is a non-defective product or a defective product based on the evaluation result; removing the first light emitting element determined to be defective in the step of determining whether the first light emitting element is a defective item from the wiring substrate; a step of temporarily bonding the second light-emitting element to the wiring board by placing the second light-emitting element in a region of the wiring board where the removed first light-emitting element was placed, and bringing an electrode of the second light-emitting element into contact with and pressing a terminal of the wiring board to which the electrode of the removed first light-emitting element was temporarily bonded; a step of electrolessly plating a metal material on a surface of a first structure in which an electrode of the first light-emitting element determined to be a non-defective product is temporarily joined to a terminal of the wiring board, and on a surface of a second structure in which an electrode of the second light-emitting element is temporarily joined to a terminal of the wiring board, thereby permanently joining the first light-emitting element determined to be a non-defective product and the second light-emitting element to the wiring board; A method for manufacturing a light emitting device comprising the steps of:

2. 2. The method for manufacturing a light-emitting device as described in claim 1, wherein, in the process of temporarily joining the second light-emitting element and the wiring board, the second light-emitting element is placed in a region of the wiring board where the removed first light-emitting element was located using a jig that temporarily fixes the second light-emitting element to a first plane thereof, and the electrode of the second light-emitting element is brought into contact with the terminal of the wiring board to which the electrode of the removed first light-emitting element was joined, and the second light-emitting element and the light-emitting elements arranged around it are pressed against the wiring board using the first plane of the jig, thereby temporarily joining the second light-emitting element and the wiring board.

3. 3. The method for manufacturing a light-emitting device as described in claim 2, wherein, in the process of temporarily joining the second light-emitting element and the wiring board, the second light-emitting element and the wiring board are temporarily joined by pressing light-emitting elements arranged in an area of ​​at least three rows and three columns centered on the second light-emitting element on a first plane of the jig against the wiring board.

4. The method for manufacturing a light emitting device according to claim 2 , wherein the first plane of the jig is formed from a single member made of metal.

5. The method for manufacturing a light emitting device according to claim 1 , wherein the electrodes, the terminals, and the metal material each contain gold.

6. In the step of preparing the plurality of light-emitting elements, the plurality of first light-emitting elements are disposed on a support substrate in such an orientation that the electrode is located on a side farther from the support substrate; 2. A method for manufacturing a light-emitting device as described in claim 1, wherein in the process of temporarily joining the multiple first light-emitting elements to the wiring board, the support substrate and the wiring board are brought close to each other, thereby bringing the electrodes of the first light-emitting elements into contact with and pressing them against the terminals of the wiring board, thereby temporarily joining the electrodes of the multiple first light-emitting elements to the multiple terminals all at once.

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