Sensor device and monitoring device

Abstract

To provide a sensor device with an excellent resistance to deformation.SOLUTION: A sensor device 100 includes: an elastic substrate 120; an at least one elastic strain sensor 110 provided on the elastic substrate 120; and an elastic wire 130 on the elastic substrate, the elastic wire being electrically connected to the elastic strain sensor 110. The relation of 1<VR1 / VR2 is satisfied when the VR1 (Ω / cm) denotes the volume resistivity of the elastic strain sensor 110 when sensor is not extended at the temperature of 25°C and the VR2 (Ω / cm) denotes the volume resistivity of the elastic strain sensor 130 when sensor is not extended at the temperature of 25°C.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a sensor device and a monitoring apparatus. [Background technology]

[0002] Various sensor devices using strain sensors have been developed. For example, the technology described in Patent Document 1 is known as this type of technology. Patent Document 1 describes an elastic strain sensor device that includes an elastic substrate having a channel filled with a conductive liquid, a control system that measures the electrical resistance of the channel, and a wire that is inserted into the conductive liquid and connected to the control system (claim 1, paragraph 0017, FIG. 5, etc. of Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-167151 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, as a result of investigations by the present inventors, it has become clear that the elastic strain sensor device described in Patent Document 1 has room for improvement in terms of durability against deformation. [Means for solving the problem]

[0005] In elastic strain sensor devices, the substrate on which the sensor is mounted is made of an elastic material, but the wiring connecting to the sensor is usually made of a non-elastic metal material. Therefore, it was found that when the substrate is deformed or deformed repeatedly, there is a risk of breakage in the metal wiring, which is a non-elastic material.

[0006] As a result of further studies by the present inventors, by using a stretchable wiring as the wiring connected to the stretchable strain sensor, breakage of the wiring due to substrate deformation or repeated deformation thereof is suppressed, and thus a sensor device excellent in deformation durability can be realized. Based on this finding, the present invention has been completed.

[0007] According to the present invention, a stretchable substrate, one or more stretchable strain sensors provided on the stretchable substrate, a stretchable wiring provided on the stretchable substrate and electrically connected to the stretchable strain sensor, are provided, When the volume resistivity of the stretchable strain sensor at 25°C and when not stretched is VR1 (Ω·cm), and the volume resistivity of the stretchable wiring at 25°C and when not stretched is VR2 (Ω·cm), a sensor device is provided which is configured such that VR1 and VR2 satisfy 1 < VR1 / VR2.

[0008] Also according to the present invention, the above-described sensor device, and a control unit are provided, and a monitoring device is provided in which the control unit acquires stress information received by the stretchable strain sensor based on changes in the electrical characteristics of the stretchable strain sensor.

Advantages of the Invention

[0009] According to the present invention, a sensor device excellent in deformation durability and a system using the same monitoring device are provided.

Brief Description of the Drawings

[0010] [Figure 1] It is a diagram showing an example of the configuration of the sensor device of the present embodiment. [Diagram 2] It is a cross-sectional view taken along line A-A of FIG. 1 and other diagrams showing modified examples. [Diagram 3] It is a diagram showing the configuration of the sensor devices of Examples 1 and 2.

Best Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and the description thereof will be omitted as appropriate. The drawings are schematic views and do not match the actual dimensional ratios.

[0012] The sensor device of this embodiment will be outlined.

[0013] The sensor device of this embodiment includes a stretchable substrate, one or more stretchable strain sensors provided on the stretchable substrate, and a stretchable wiring provided on the stretchable substrate and electrically connected to the stretchable strain sensors. When the volume resistivity of the stretchable strain sensor at 25°C and when not stretched is VR1 (Ω·cm), and the volume resistivity of the stretchable wiring at 25°C and when not stretched is VR2 (Ω·cm), this sensor device is configured such that VR1 and VR2 satisfy 1 < VR1 / VR2.

[0014] According to this embodiment, by configuring the substrate, the strain sensor, and the wiring with stretchable materials, a flexible sensor device that can be stretched and / or bent can be realized. Therefore, even when the substrate is deformed such as stretched, disconnection in the stretchable wiring is suppressed, and stable measurement becomes possible. In this way, a sensor device with excellent deformation durability can be realized. In addition, since the stretchable wiring has elastic characteristics of deforming and / or stretching, it can be configured so as not to hinder the deformation of the substrate and the strain sensor such as stretching and bending, as compared with the case of wiring made of a non-stretchable material such as a metal material. Therefore, the external force received from the measurement object can be measured more stably.

[0015] According to the findings of the present inventor, when a stretchable conductive material is used for the stretchable strain sensor and the stretchable wiring, by configuring the volume resistivity of the stretchable strain sensor to be higher than that of the stretchable wiring, it has been found that the external force received by the stretchable strain sensor can be detected as an electrical signal in the resistance value change.

[0016] In addition, since a stretchable strain sensor and stretchable wiring can be formed by printing using a conductive paste containing a conductive filler and an elastomer material as the stretchable conductive material, a sensor device with excellent design freedom in sensor and / or wiring design can be provided.

[0017] The use of the sensor device of this embodiment is not particularly limited, and it can be applied to various situations such as electronic devices, medical devices, machines, robots, vehicles / aircraft, and factory equipment. Furthermore, an example of the sensor device may be a wearable device that can be worn on the human body, etc., and may be configured in the form of, for example, a belt, a wristband, a glove, a finger cot, etc. As a specific example of the sensor device, it can also be used as a tactile sensor device.

[0018] By using the sensor device of this embodiment to acquire, analyze, and / or display the electrical signal obtained from the stretchable strain sensor, a monitoring device suitable for various applications can be constructed.

[0019] Each component of the sensor device of this embodiment will be described in detail.

[0020] Fig. 1 is a top view showing an example of the configuration of a sensor device 100. Fig. 2(a) is a cross-sectional view taken along line AA in Fig. 1.

[0021] The sensor device 100 in FIG. 1 includes a stretchable substrate 120, a stretchable strain sensor 110, and a stretchable wiring 130.

[0022] The expansion and contraction strain sensor 110 can convert an external force into an electric signal. Specifically, the expansion and contraction strain sensor 110 can detect deformation in the X-axis direction and / or Y-axis direction, which are in the substrate plane, and deformation in the Z-axis direction, which is perpendicular to the substrate plane.

[0023] The expansion and contraction strain sensor 110 may be, for example, a sensor that utilizes the piezoresistive effect, the piezoelectric effect, or electrostatic capacitance. When the piezoresistive effect is utilized, the stretching strain sensor 110 can convert the change in resistance value due to the deformation of the stretching conductive material into an electrical signal. Specific examples include a strain gauge having a resistance wire made of a stretching conductive material, and a pressure-sensitive conductive rubber made of a stretching conductive material. When using capacitance, the stretching strain sensor 110 can convert the change in capacitance caused by the deformation of the stretching conductive material into an electric signal. A specific example is a capacitor in which a capacitive film made of a stretching conductive material is sandwiched between two electrodes.

[0024] A pressure sensor may be used as the expansion strain sensor 110. The expansion strain sensor 110, which is a pressure sensor, has a pressure-receiving surface and can detect deformation caused by pressure in the Z-axis direction, which is perpendicular to the substrate surface. The shape of the expansion and contraction strain sensor 110 as viewed from the Z-axis direction may be, for example, a polygonal shape such as a square, a circular shape, an elliptical shape, or the like, but is not limited to these.

[0025] The expansion strain sensor 110 may be configured with an expansion sensor that detects strain in the substrate plane direction, which is the X-axis direction and / or the Y-axis direction. The shape of the expansion strain sensor 110 as viewed from the Z-axis direction may be, for example, a linear shape, a wavy shape, a vortex shape, a comb shape, or any other linear shape, but is not limited thereto.

[0026] An example of the stretching strain sensor 110 may include a pressure-sensitive resistor having a piezoresistive effect, which may be made of a stretchable conductive material, preferably a pressure-sensitive conductive elastomer, and more preferably a conductive elastomer including a conductive filler and an elastomeric material.

[0027] The elastic wiring 130 is electrically connected to the elastic strain sensor 110 and can transmit an electrical signal from the elastic strain sensor 110 to the outside.

[0028] The elastic wiring 130 may have two output signal wirings (first wiring 132, second wiring 134) for each elastic strain sensor 110, and may further have a constant voltage power supply wiring and / or a GND (ground) wiring depending on the circuit design of the elastic strain sensor 110.

[0029] 1, a first wiring 132 and a second wiring 134 of the output signal wiring are electrically connected to the stretching strain sensor 110. For example, when an external force is applied to vary the resistance value of the stretching strain sensor 110, the output voltage between the first wiring 132 and the second wiring 134 varies. Based on this output voltage variation, it becomes possible to measure the external force received by the stretching strain sensor 110.

[0030] The stretchable wiring 130 is composed of a stretchable conductive layer that includes a conductive elastomer. The conductive elastomer may include a conductive filler and an elastomeric material.

[0031] When both the stretching strain sensor 110 and the elastic wiring 130 have components made of conductive elastomer, the volume resistance value of the conductive elastomer of the stretching strain sensor 110 is configured to be higher than the volume resistance value of the conductive elastomer of the elastic wiring 130.

[0032] As a specific example, the conductive elastomer constituting the stretching strain sensor 110 can contain a conductive carbon material as a conductive filler. In this case, the conductive elastomer constituting the stretchable wiring 130 may contain metal powder such as silver powder. For example, when the volume resistivity of the conductive elastomer containing the conductive carbon material in the stretching strain sensor 110 is 10 ―1 Ω cm~10 3 In this case, the volume resistance of the conductive elastomer of the elastic wiring 130 is, for example, 10 -5 Ω cm~10 -1 This volume resistivity is measured at 25°C when unstretched.

[0033] Thus, the stretchable strain sensor 110 may be configured to include a conductive carbon material and an elastomer material. In this case, the stretchable strain sensor 110 may be formed, for example, by a printing method using a conductive paste containing a conductive carbon material and an elastomer material. This enables a free sensor design.

[0034] On the other hand, one stretchable substrate 120 may be configured to include a conductive filler other than the conductive carbon material and an elastomer material. The conductive filler includes, for example, but is not limited to, silver powder. In this case, the stretchable substrate 120 may be formed by a printing method using a conductive paste containing a conductive filler and an elastomer material. This enables a free wiring design.

[0035] In the present embodiment, the volume resistivity of the stretchable strain sensor 110 at 25 °C and when not stretched is VR1 (Ω·cm), the volume resistivity of the stretchable strain sensor 110 at 25 °C and when stretched by 20% is VR1' (Ω·cm), the resistance value of the stretchable strain sensor 110 at 25 °C, when not stretched and under no load is R1 (Ω), the resistance value of the stretchable strain sensor 110 at 25 °C and when stretched by 20% is R1' (Ω), the resistance value of the stretchable strain sensor 110 when a pressure of 1.67 N / mm 2 is applied at 25 °C is R1'' (Ω), the volume resistivity of the stretchable wiring 130 at 25 °C and when not stretched is VR2 (Ω·cm), the volume resistivity of the stretchable wiring at 25 °C and when stretched by 20% is VR2' (Ω·cm), the resistance value of the stretchable wiring 130 at 25 °C and when not stretched is R2 (Ω), and the resistance value of the stretchable wiring 130 at 25 °C and when stretched by 20% is R2' (Ω). These volume resistivities may be the volume resistivities of the members of the stretchable conductive material that constitutes at least a part of the stretchable strain sensor 110 and the stretchable wiring 130.

[0036] VR1 and VR2 are configured to satisfy 1 < VR1 / VR2. Preferably, VR1 and VR2 satisfy 1.0×10 2 ≤ VR1 / VR2, and more preferably 5.0×10 2It is configured to satisfy ≦VR1 / VR2. Thereby, it becomes possible to stably detect an electric signal due to resistance value fluctuation.

[0037] R1 and R1' are configured to satisfy, for example, 1 < R1' / R1 ≦ 10. Preferably, R1 and R2 are configured to satisfy R1' / R1 ≦ 9, and more preferably R1' / R1 ≦ 8. Thereby, it becomes possible to stably detect an electric signal due to resistance value fluctuation.

[0038] R1 and R1'' are configured to satisfy, for example, 1 < R1'' / R1 ≦ 10. Preferably, R1 and R1'' are configured to satisfy <R1'' / R1 ≦ 9, and more preferably <R1'' / R1 ≦ 8. Thereby, it becomes possible to stably detect an electric signal due to resistance value fluctuation.

[0039] R2 and R2' are configured to satisfy, for example, 1 < R2' / R2 ≦ 2. Preferably, R2 and R2' are configured to satisfy R2' / R2 ≦ 1.8, and more preferably R2' / R2 ≦ 1.6. Thereby, it becomes possible to stably detect an electric signal due to resistance value fluctuation.

[0040] VR1' and VR2' are configured to satisfy, for example, 1 < VR1' / VR2'. Preferably, VR1' and VR2' are configured to satisfy 1.0×10 2 ≦VR1' / VR2', and more preferably 5.0×10 2 ≦VR1' / VR2'. Thereby, it becomes possible to stably detect an electric signal due to resistance value fluctuation. Note that, since it becomes possible to stably detect resistance value fluctuation in the expansion and contraction strain sensor as the difference in volume resistivity is larger, the upper limits of VR1 / VR2 and VR1' / VR2 are not particularly limited.

[0041] The volume resistivity of the stretchable wiring 130 at 25°C and when not stretched is, for example, 1×10 -5 Ω·cm or more and 1×10 -1 Ω·cm or less, preferably 5×10 -5 Ω·cm or more and 5×10 -2Ω cm or less, preferably 1×10 -4 Ω cm or more 1×10 -2 By setting the resistance within such a range, it is possible to realize the elastic wire 130 having excellent electrical properties both when unstretched and when stretched. In addition, stable measurement becomes possible.

[0042] In this specification, the term "elasticity" refers to the rate of elongation when stretched in a predetermined direction. The predetermined direction may be, for example, the extension direction in which the elastic wire 130 has the maximum length in the top view of FIG. When stretched in this extension direction, having elasticity means that the stretchable wiring 130 can be stretched to an elongation rate of, for example, 10% or more, preferably 20% or more, and more preferably 50% or more, and does not break at that elongation rate.

[0043] The stretchable substrate 120 has a stretchable strain sensor 110 and a stretchable wiring 130 on one surface 121 .

[0044] In the sensor device 100, a structure in which the stretchable substrate 120 and the stretchable wiring 130 are laminated may be formed. The state in which the stretchable substrate 120 and the stretchable wiring 130 are laminated may be a state in which the surfaces of the stretchable insulating layer and the stretchable conductive layer that constitute them are in surface contact with each other, and may be a state in which they are chemically and / or physically bonded and adhered to each other. Therefore, even during elongation or repeated elongation, the risk of damage such as peeling of the stretchable wiring 130 from the surface of the stretchable substrate 120 can be suppressed. This makes it possible to realize a sensor device 100 that is excellent in deformation durability.

[0045] The stretchable substrate 120 may be made of an insulating elastomer. The insulating elastomer may be an elastomer that does not contain a conductive filler, and may, for example, contain a non-conductive filler and an elastomeric material.

[0046] The upper limit of the thickness of the stretchable substrate 120 can be set according to the application, and may be, for example, 10 mm or less, preferably 1 mm or less, but from the viewpoint of ease of deformation, it is more preferably 400 μm or less. In addition, a thin device that is easy to hold in the mouth can be configured. On the other hand, the lower limit of the thickness of the stretchable substrate 120 is, from the viewpoint of mechanical strength, for example, 10 μm or more, preferably 50 μm or more, and more preferably 100 μm or more.

[0047] The upper limit of the durometer hardness A of the stretchable substrate 120 is not particularly limited, but may be, for example, 80 or less, and preferably 70 or less. This increases the ease of deformation, which makes deformation such as bending and stretching easier. On the other hand, the lower limit of the durometer hardness A of the stretchable substrate 120 is, for example, not less than 10, preferably not less than 30, and more preferably not less than 40. This can increase the friction durability and mechanical strength.

[0048] The lower limit of the tear strength of the stretchable substrate 120 is, for example, 25 N / mm or more, preferably 28 N / mm or more, more preferably 30 N / mm or more, even more preferably 33 N / mm or more, and even more preferably 34 N / mm or more. This improves durability during repeated use. In addition, a device that is not easily torn even when thinned can be configured. This improves the design freedom of the substrate. On the other hand, the upper limit of the tear strength of the stretchable substrate 120 is not particularly limited, but may be, for example, 80 N / mm or less, or 70 N / mm or less, which allows the various properties of the substrate to be balanced.

[0049] The lower limit of the breaking elongation of the stretchable substrate 120 is, for example, 100% or more, preferably 200% or more, more preferably 300% or more, and even more preferably 400% or more, which can improve the high stretchability and durability of the substrate. On the other hand, the upper limit of the breaking elongation of the stretchable substrate 120 is not particularly limited, but may be, for example, 2000% or less, or 1800% or less, which allows the various properties of the substrate to be balanced.

[0050] The lower limit of the tensile strength of the stretchable substrate 120 is, for example, 5.0 MPa or more, preferably 10.0 MPa or more, and more preferably 12.0 MPa or more. This can improve the mechanical strength of the substrate. In addition, a substrate with excellent durability that can withstand repeated deformation can be realized. On the other hand, the upper limit of the tensile strength of the stretchable substrate 120 is not particularly limited, but may be, for example, 25 MPa or less, or 20 MPa or less, so that the various properties of the substrate can be balanced.

[0051] In this embodiment, the following method can be used to measure the characteristics of each member of the sensor device and the characteristics of the elastomer (insulating elastomer or conductive elastomer) used in each member. To measure the characteristics of each member, each member such as a substrate may be used as it is as a test piece.

[0052] (Durometer hardness A measurement procedure) A sheet-like test piece is prepared using the elastomer, and the durometer hardness A of the obtained sheet-like test piece at 25° C. is measured in accordance with JIS K6253 (1997).

[0053] (Procedure for measuring tensile strength) Using the elastomer, a dumbbell-shaped No. 3 test piece is prepared in accordance with JIS K6251 (2004), and the tensile strength of the dumbbell-shaped No. 3 test piece at 25°C is measured.

[0054] (Measurement conditions for breaking elongation) Using the elastomer, a dumbbell-shaped No. 3 test piece is prepared in accordance with JIS K6251 (2004), and the resulting dumbbell-shaped No. 3 test piece is measured for its breaking elongation at 25°C. The breaking elongation is calculated by [gauge line movement distance (mm)] ÷ [initial gauge line distance (20 mm)] × 100.

[0055] (Measuring procedure for tear strength) A crescent-shaped test piece is prepared using the elastomer in accordance with JIS K6252 (2001), and the tear strength of the obtained crescent-shaped test piece at 25°C is measured.

[0056] A modification of the sensor device 100 will now be described.

[0057] The number of the stretchable strain sensors 110 mounted on the stretchable substrate 120 may be one or more, and may be two or more.

[0058] In the case of a plurality of expansion / contraction strain sensors 110, two output signal wires, a constant voltage power supply wire and / or a GND (ground) wire may be formed for each of the expansion / contraction strain sensors 110. In addition, a common wiring may be used for the GND wiring in the multiple expansion and contraction strain sensors 110.

[0059] The arrangement of the stretching strain sensor 110 is not limited to on one surface 121. For example, a portion of the stretching strain sensor 110 may be embedded in the stretchable substrate 120, or the entire stretching strain sensor 110 may be embedded inside the stretchable substrate 120.

[0060] The elastic wiring 130 may be entirely formed on one surface 121, but a part of it may be embedded in the elastic substrate 120, and a wiring region other than the terminal connection region may be embedded in the elastic substrate 120. In addition, the elastic wiring 130 may be formed on both surfaces of the elastic substrate 120.

[0061] The surface of the elastic wiring 130 may be exposed as shown in FIG. 2(a), or may be partially or entirely covered by elastic cover parts 140, 141 as shown in FIGS. 2(b) and (c).

[0062] The sensor device 100 may include a stretchable cover (stretchable cover 140) containing an elastomer material that covers the surface of the stretchable wiring 130. This can further increase the deformation durability of the sensor device 100. In addition, the exposed wiring portion of the stretchable wiring 130 can be covered (sealed) with the stretchable cover 140 made of an insulating material to increase safety in use. Furthermore, by using the stretchable cover 140 made of a biocompatible material, hygiene management during use becomes easier. Furthermore, by covering a part or the entire wiring portion of the stretchable wiring 130 other than the connection portion with the stretchable cover 140, both sides of the stretchable substrate 120 and the stretchable cover 140 can be disinfected with an alcohol-based or non-alcohol-based disinfectant, making it easier to manage hygiene during use.

[0063] The stretchable cover portion 140 is configured to expose the first end of the stretchable wiring 130 that connects to the stretchable strain sensor 110 and the second end that connects to the outside, and may cover some or all of the other wiring portions.

[0064] 2(b), the stretchable cover part 140 may be configured so as not to cover the pressure receiving surface (upper surface) of the stretching strain sensor 110. This allows the external force sensitivity of the pressure receiving surface of the stretching strain sensor 110 to be maintained high. The stretchable cover 140 may be configured to cover the top and side surfaces of the stretchable strain sensor 110, as shown in stretchable cover 141 in Fig. 2(c). The stretchable cover 140 made of a stretchable material can suppress a reduction in the external force received by the pressure-receiving surface even if it covers the pressure-receiving surface of the stretchable strain sensor 110, as shown in stretchable cover 141 in Fig. 2(c). This can improve durability in use as well as stability during use.

[0065] The stretchable cover parts 140 and 141 may be made of an insulating elastomer containing an elastomer material. By configuring the stretchable cover parts 140 and 141 to contain the same elastomer material as the stretchable substrate 120, the adhesion between the stretchable substrate 120 and the stretchable cover parts 140 and 141 can be improved. From the viewpoint of improving adhesion with other members, the stretchable cover parts 140 and 141 may contain the same elastomer material as that contained in the stretchable wiring 130 or the stretchable strain sensor 110 .

[0066] Here, the monitoring device of this embodiment will be described.

[0067] An example of a monitoring apparatus includes the above-mentioned sensor device 100 and a control unit. The control unit obtains information about the stress applied to the stretching strain sensor 110 based on a change in the electrical characteristics of the stretching strain sensor 110.

[0068] The control unit controls various operations of the monitoring device. The control unit includes a storage device that stores various information, a clock function (e.g., a real-time clock), a communication circuit that transmits various information to the outside via wired or wireless communication, an A / D conversion circuit, an MPU (Micro Processing Unit), a power supply, etc. The control unit is electrically connected to the sensor device 100 via wires. The control unit may also be configured as a microcomputer that is externally connected to the sensor device 100 .

[0069] Information (sensor signal) relating to an external force such as pressure detected by the stretching strain sensor 110 is transmitted to a control unit via an elastic wiring 130 electrically connected to the stretching strain sensor 110.

[0070] The control unit can calculate the pressure by, for example, dividing the output voltage from the expansion / contraction strain sensor 110, which varies depending on the pressure, by the area of ​​the pressure-receiving surface. The output voltage can be converted into a digital signal using an A / D conversion circuit.

[0071] When the expansion and contraction strain sensor 110 is a pressure sensor, the stress information includes at least one or more of pressure, pressure distribution, and changes over time of these. The pressure information includes information for each measurement point. The pressure information may be a value at a specific time, a maximum value, a minimum value, an average value for a specific period, a time corresponding to a specific value such as the maximum and minimum values ​​of the pressure, and / or waveform data indicating changes over time of these. The pressure distribution information includes information on a plurality of measurement points, and may be a calculated value calculated from pressure information, such as a total value of pressure within a specified area, using an appropriate formula.

[0072] The control unit may include an analysis unit that analyzes the obtained stress information. Specifically, the analysis unit may read out the pass conditions stored in the memory unit, determine whether the transmitted stress information meets the pass conditions, and judge it to be a pass if the pass conditions are met, and judge it to be a fail if the pass conditions are not met.

[0073] The monitoring method of the present embodiment can be performed using the sensor device 100. This monitoring method includes a step of acquiring stress information from the detection result of the sensor device 100.

[0074] Moreover, an example of the monitoring device may include a display unit. The display unit displays various information obtained by the monitoring device.

[0075] The display unit can display the stress information and / or the results shown by the analysis unit. For example, the display unit displays information about the pressure detected by the sensor device 100, or a result determined by the control unit based on information about the pressure detected by the sensor device 100.

[0076] The display unit is configured, for example, by a monitor of an external terminal, specifically, a monitor of an externally connected microcomputer.

[0077] The monitoring device may include a wireless unit that wirelessly transmits the stress information and / or the results displayed by the analysis unit to an external terminal. In this case, the display unit is connected to the control unit via wireless communication. Without being limited to this embodiment, the display unit may be connected to the control unit via wired communication, and may display the stress information stored in the storage medium and / or the results shown by the analysis unit.

[0078] The display unit can also be configured as a liquid crystal display unit or a lamp unit or the like provided in the sensor device 100. By configuring it in this way, the monitoring device can be configured as a portable device. In this case, the monitoring device may include a battery or the like.

[0079] Moreover, an example of the monitoring device may include an operation unit. The operation unit is composed of physical buttons such as switches or a touch panel, and a voice input means. By operating the operation unit, it is possible to start or end various operations of the monitoring device, or to set various operations. For example, in a monitoring device, a monitoring operation can be started or ended by operating the operation unit.

[0080] The elastomers constituting the various components of the sensor device 100 will now be described.

[0081] In this specification, elastomer means a stretchable elastic body including an elastomeric material, which is classified as an insulating elastomer or a conductive elastomer.

[0082] Examples of the insulating elastomer that can be used include silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, ethylene propylene rubber, etc. Among these, the elastomer includes one or more thermosetting elastomers (elastomer materials) selected from the group consisting of silicone rubber, urethane rubber, and fluororubber. The insulating elastomer may be composed of an elastomer material alone, or may be composed to include an elastomer material and a non-conductive filler. An example of the insulating elastomer includes silicone rubber, and preferably includes silicone rubber and a non-conductive filler. Silicone rubber is chemically stable among elastomers, and also has excellent mechanical strength. Among these, from the viewpoint of hygiene, it is preferable to use silicone rubber, which has high biocompatibility, as the elastomer material.

[0083] The conductive elastomer may be, for example, silicone rubber, urethane rubber, fluororubber, nitrile rubber, acrylic rubber, styrene rubber, chloroprene rubber, ethylene propylene rubber, etc. Among these, the elastomer includes one or more thermosetting elastomers (elastomer materials) selected from the group consisting of silicone rubber, urethane rubber, and fluororubber, and a conductive filler. A preferred example of the conductive elastomer includes silicone rubber and a conductive filler, which can enhance the elasticity and conductivity of the conductive elastomer.

[0084] At least one of the insulating elastomer and the conductive elastomer, and preferably both of them, may contain a non-conductive filler. As the non-conductive filler, a known material may be used, for example, silica particles, silicone rubber particles, talc, etc. Among these, silica particles may be used.

[0085] The conductive filler may include, for example, one or more selected from the group consisting of powder or fibrous metal-based fillers, carbon-based fillers (conductive carbon materials), metal oxide fillers, and metal-plated fillers.

[0086] In addition to the conductive filler, the conductive elastomer may further contain a non-conductive filler, which can improve the mechanical properties of the conductive elastomer.

[0087] At least two, or all, of the conductive elastomer of the stretch strain sensor 110, the conductive elastomer of the stretchable wiring 130, and the insulating elastomer of the stretchable substrate 120 may be configured to include the same elastomeric material.

[0088] In this specification, containing the same elastomer material means containing at least one of the same type of elastomer material among the types of thermosetting elastomers exemplified above. When the same silicone rubber is contained, the silicone rubber may be constituted by a cured product of a silicone rubber-based curable composition containing a vinyl group-containing organopolysiloxane.

[0089] The insulating elastomer may be composed of a cured product of a silicone rubber-based curable composition containing a vinyl group-containing organopolysiloxane, and the conductive elastomer may be composed of a conductive filler and a cured product of a silicone rubber-based curable composition containing a vinyl group-containing organopolysiloxane.

[0090] The components of the silicone rubber-based hardenable composition will be described in detail below.

[0091] In this specification, containing the same silicone rubber means that the silicone rubber-based curable composition contains at least the same type of vinyl group-containing linear organopolysiloxane, and may further contain one or more selected from the group consisting of the same type of crosslinking agent, the same type of non-conductive filler, the same type of silane coupling agent, and the same type of catalyst.

[0092] The same type of vinyl-containing linear organopolysiloxanes are those that contain at least the same vinyl groups as functional groups and have a linear structure, but may differ in the amount of vinyl groups in the molecule, the molecular weight distribution, or the amount added.

[0093] Crosslinking agents of the same type are sufficient if they have at least a common structure such as a linear structure or a branched structure, and may have different molecular weight distributions in the molecule or different functional groups, or may have different amounts added.

[0094] Non-conductive fillers of the same type may have at least a common constituent material, and may differ in particle size, specific surface area, surface treatment agent, or the amount of the surface treatment agent added.

[0095] Silane coupling agents of the same type are sufficient as long as they have at least a common functional group, and may differ in other functional groups in the molecule or in the amount added.

[0096] The same type of catalyst is sufficient if it has at least common constituent materials, and may contain different compositions in the catalyst, or may have different amounts of the components added.

[0097] The silicone rubber-based curable composition constituting the same silicone rubber may further contain one or more components selected from the group consisting of different types of vinyl group-containing linear organopolysiloxanes, crosslinking agents, non-conductive fillers, silane coupling agents, and catalysts.

[0098] The silicone rubber-based hardening composition of the present embodiment may contain a vinyl group-containing organopolysiloxane (A). The vinyl group-containing organopolysiloxane (A) is a polymer that is the main component of the silicone rubber-based hardening composition of the present embodiment.

[0099] The vinyl group-containing organopolysiloxane (A) can contain a vinyl group-containing linear organopolysiloxane (A1) having a linear structure.

[0100] The vinyl group-containing linear organopolysiloxane (A1) has a linear structure and contains vinyl groups, and these vinyl groups become crosslinking points during curing.

[0101] The vinyl group content of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but for example, it is preferable that the vinyl group content is 15 mol% or less and that the vinyl group content is 2 or more in the molecule. This optimizes the amount of vinyl groups in the vinyl group-containing linear organopolysiloxane (A1), and ensures the formation of a network with each component described below.

[0102] In this specification, the symbol "to" indicates that the upper and lower limits are included, unless otherwise specified.

[0103] In this specification, the vinyl group content refers to the mol % of vinyl group-containing siloxane units when all units constituting the vinyl group-containing linear organopolysiloxane (A1) are taken as 100 mol %, where it is considered that there is one vinyl group per vinyl group-containing siloxane unit.

[0104] The degree of polymerization of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is, for example, preferably within the range of about 1000 to 10000, and more preferably about 2000 to 5000. The degree of polymerization can be determined, for example, as the polystyrene-equivalent number average degree of polymerization (or number average molecular weight) measured by GPC (gel permeation chromatography) using chloroform as a developing solvent.

[0105] Furthermore, the specific gravity of the vinyl group-containing linear organopolysiloxane (A1) is not particularly limited, but is preferably in the range of about 0.9 to 1.1.

[0106] By using a vinyl group-containing linear organopolysiloxane (A1) having a degree of polymerization and specific gravity within the above ranges, it is possible to improve the heat resistance, flame retardancy, chemical stability, etc. of the resulting silicone rubber.

[0107] As the vinyl group-containing linear organopolysiloxane (A1), those having a structure represented by the following formula (1) are particularly preferred.

[0108] [ka]

[0109] In formula (1), R 1 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a hydrocarbon group consisting of a combination thereof, each having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, with a methyl group being preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group, with a vinyl group being preferred. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0110] Also, R 2 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, or a hydrocarbon group consisting of a combination thereof, each having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0111] Also, R 3 is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group consisting of a combination thereof. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group.

[0112] Furthermore, R in formula (1) 1 and R 2 Examples of the substituent of R include a methyl group and a vinyl group. 3 Examples of the substituent include a methyl group.

[0113] In addition, in formula (1), multiple R 1are independent of each other and may be different or the same. 2 , and R 3 The same applies to.

[0114] Furthermore, m and n are the numbers of repeating units constituting the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1), where m is an integer of 0 to 2000 and n is an integer of 1000 to 10000. m is preferably 0 to 1000 and n is preferably 2000 to 5000.

[0115] A specific example of the structure of the vinyl group-containing linear organopolysiloxane (A1) represented by formula (1) is that represented by the following formula (1-1).

[0116] [ka]

[0117] In formula (1-1), R 1 and R 2 are each independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

[0118] The vinyl group-containing linear organopolysiloxane (A1) may contain a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more vinyl groups in the molecule and having a vinyl group content of 0.4 mol% or less. The vinyl group content of the first vinyl group-containing linear organopolysiloxane (A1-1) may be 0.1 mol% or less.

[0119] The vinyl group-containing linear organopolysiloxane (A1) may contain a first vinyl group-containing linear organopolysiloxane (A1-1) and a second vinyl group-containing linear organopolysiloxane (A1-2) having a vinyl group content of 0.5 to 15 mol %.

[0120] By combining the first vinyl group-containing linear organopolysiloxane (A1-1) and the second vinyl group-containing linear organopolysiloxane (A1-2) having a high vinyl group content as the raw rubber, which is the raw material of the silicone rubber, the vinyl groups can be unevenly distributed, and the crosslinking density can be more effectively formed in the crosslinked network of the silicone rubber. As a result, the tear strength of the silicone rubber can be more effectively increased.

[0121] Specifically, as the vinyl group-containing linear organopolysiloxane (A1), it is preferable to use, for example, a first vinyl group-containing linear organopolysiloxane (A1-1) having two or more units in which R1 is a vinyl group and / or units in which R2 is a vinyl group in the molecule and containing 0.4 mol % or less of these units in the above formula (1-1), and a second vinyl group-containing linear organopolysiloxane (A1-2) containing 0.5 to 15 mol % of units in which R1 is a vinyl group and / or units in which R2 is a vinyl group.

[0122] The first vinyl group-containing linear organopolysiloxane (A1-1) preferably has a vinyl group content of 0.01 to 0.2 mol %, and the second vinyl group-containing linear organopolysiloxane (A1-2) preferably has a vinyl group content of 0.8 to 12 mol %.

[0123] Furthermore, when the first vinyl group-containing linear organopolysiloxane (A1-1) and the second vinyl group-containing linear organopolysiloxane (A1-2) are combined and blended, the ratio of (A1-1) to (A1-2) is not particularly limited, but for example, the weight ratio of (A1-1):(A1-2) is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.

[0124] The first and second vinyl group-containing linear organopolysiloxanes (A1-1) and (A1-2) may each be used alone or in combination of two or more.

[0125] The vinyl group-containing organopolysiloxane (A) may also contain a vinyl group-containing branched organopolysiloxane (A2) having a branched structure.

[0126] <<Organohydrogenpolysiloxane (B)>> The silicone rubber-based hardenable composition of this embodiment can contain an organohydrogenpolysiloxane (B). The organohydrogenpolysiloxane (B) is classified into a linear organohydrogenpolysiloxane (B1) having a linear structure and a branched organohydrogenpolysiloxane (B2) having a branched structure, and may contain either one or both of these.

[0127] The linear organohydrogenpolysiloxane (B1) has a linear structure and a structure in which hydrogen is directly bonded to Si (≡Si-H), and is a polymer that undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with vinyl groups of components blended into the silicone rubber-based curable composition, thereby crosslinking these components.

[0128] The molecular weight of the linear organohydrogenpolysiloxane (B1) is not particularly limited, but for example, the weight average molecular weight is preferably 20,000 or less, and more preferably 1,000 or more and 10,000 or less.

[0129] The weight average molecular weight of the linear organohydrogenpolysiloxane (B1) can be measured, for example, by polystyrene conversion in gel permeation chromatography (GPC) using chloroform as a developing solvent.

[0130] Furthermore, it is usually preferred that the linear organohydrogenpolysiloxane (B1) does not have a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the linear organohydrogenpolysiloxane (B1).

[0131] As the linear organohydrogenpolysiloxane (B1) as described above, for example, one having a structure represented by the following formula (2) is preferably used.

[0132] [ka]

[0133] In formula (2), R 4 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these groups, or a hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, etc., and among these, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, a butenyl group, etc. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0134] Also, R 5 is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, a hydrocarbon group combining these groups, or a hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the alkenyl group having 1 to 10 carbon atoms include a vinyl group, an allyl group, and a butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0135] In addition, in formula (2), multiple R 4 are independent of each other and may be different or the same. 5 The same applies to R. 4 and R 5 At least two of these are hydride groups.

[0136] Also, R 6is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group combining these. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. 6 are independent of each other and may be different from each other or may be the same.

[0137] In addition, R in formula (2) 4 ,R 5 ,R 6 Examples of the substituent include a methyl group and a vinyl group, and from the viewpoint of preventing an intramolecular crosslinking reaction, a methyl group is preferred.

[0138] Furthermore, m and n are the numbers of repeating units constituting the linear organohydrogenpolysiloxane (B1) represented by formula (2), where m is an integer of 2 to 150 and n is an integer of 2 to 150. Preferably, m is an integer of 2 to 100 and n is an integer of 2 to 100.

[0139] The linear organohydrogenpolysiloxane (B1) may be used alone or in combination of two or more kinds.

[0140] Since the branched organohydrogenpolysiloxane (B2) has a branched structure, it forms regions with high crosslink density, and is a component that greatly contributes to the formation of a sparsely-dense structure of crosslink density in the silicone rubber system. Also, like the linear organohydrogenpolysiloxane (B1), it has a structure in which hydrogen is directly bonded to Si (≡Si-H), and undergoes a hydrosilylation reaction with the vinyl groups of the vinyl group-containing organopolysiloxane (A) and with the vinyl groups of the components blended in the silicone rubber-based hardening composition, forming a polymer that crosslinks these components.

[0141] The specific gravity of the branched organohydrogenpolysiloxane (B2) is in the range of 0.9 to 0.95.

[0142] Furthermore, it is usually preferred that the branched organohydrogenpolysiloxane (B2) does not have a vinyl group, which can reliably prevent the crosslinking reaction from proceeding within the molecule of the branched organohydrogenpolysiloxane (B2).

[0143] As the branched organohydrogenpolysiloxane (B2), one represented by the following average composition formula (c) is preferred.

[0144] Average composition formula (c) (H a (R 7 ) 3-a SiO 1 / 2 ) m (SiO 4 / 2 ) n (In formula (c), R 7 is a monovalent organic group, a is an integer ranging from 1 to 3, and m is H a (R 7 ) 3-a SiO 1 / 2 The number of units, n, is SiO 4 / 2 (the number of units)

[0145] In formula (c), R 7 is a monovalent organic group, preferably a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, an aryl group, or a hydrocarbon group consisting of a combination thereof. Examples of the alkyl group having 1 to 10 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferred. Examples of the aryl group having 1 to 10 carbon atoms include a phenyl group.

[0146] In formula (c), a is the number of hydride groups (hydrogen atoms directly bonded to Si) and is an integer ranging from 1 to 3, and preferably 1.

[0147] In addition, in formula (c), m is H a (R 7 ) 3-a SiO 1 / 2 The number of units, n, is SiO 4 / 2 It is the number of units.

[0148] The branched organohydrogenpolysiloxane (B2) has a branched structure. The linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) differ in that their structures are linear or branched, and the number of alkyl groups R bonded to Si (R / Si) when the number of Si is 1 is in the range of 1.8 to 2.1 for the linear organohydrogenpolysiloxane (B1) and 0.8 to 1.7 for the branched organohydrogenpolysiloxane (B2).

[0149] Since the branched organohydrogenpolysiloxane (B2) has a branched structure, for example, when heated in a nitrogen atmosphere to 1000° C. at a heating rate of 10° C. / min, the amount of residue is 5% or more. In contrast, since the linear organohydrogenpolysiloxane (B1) is linear, the amount of residue after heating under the above conditions is almost zero.

[0150] Specific examples of the branched organohydrogenpolysiloxane (B2) include those having a structure represented by the following formula (3).

[0151] [ka]

[0152] In formula (3), R 7 R is a substituted or unsubstituted alkyl group having 1 to 8 carbon atoms, an aryl group, or a hydrocarbon group combining these, or a hydrogen atom. Examples of the alkyl group having 1 to 8 carbon atoms include a methyl group, an ethyl group, and a propyl group, and among these, a methyl group is preferable. Examples of the aryl group having 1 to 8 carbon atoms include a phenyl group. 7 Examples of the substituent include a methyl group.

[0153] In addition, in formula (3), multiple R 7 are independent of each other and may be different from each other or may be the same.

[0154] In addition, in formula (3), "-O-Si≡" indicates that Si has a branched structure extending three-dimensionally.

[0155] The branched organohydrogenpolysiloxane (B2) may be used alone or in combination of two or more kinds.

[0156] In addition, the amount of hydrogen atoms (hydride groups) directly bonded to Si in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is not particularly limited. However, in the silicone rubber-based curable composition, the total amount of hydride groups in the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) is preferably 0.5 to 5 moles, more preferably 1 to 3.5 moles, per mole of vinyl group in the vinyl group-containing linear organopolysiloxane (A1). This ensures that a crosslinked network is formed between the linear organohydrogenpolysiloxane (B1) and the branched organohydrogenpolysiloxane (B2) and the vinyl group-containing linear organopolysiloxane (A1).

[0157] <<Silica particles (C)>> The silicone rubber-based hardenable composition of this embodiment may contain silica particles (C) as a non-conductive filler, if necessary.

[0158] The silica particles (C) are not particularly limited, but for example, fumed silica, calcined silica, precipitated silica, etc. may be used. These may be used alone or in combination of two or more kinds.

[0159] The silica particles (C) have a specific surface area, as measured by the BET method, of, for example, 50 to 400 m 2 / g, and 100 to 400m 2 / g is more preferable. The average primary particle size of the silica particles (C) is, for example, preferably from 1 to 100 nm, and more preferably from about 5 to 20 nm.

[0160] By using silica particles (C) having a specific surface area and average particle size within this range, it is possible to improve the hardness and mechanical strength, particularly the tensile strength, of the silicone rubber that is formed.

[0161] <<Silane coupling agent (D)>> The silicone rubber-based hardenable composition of this embodiment may contain a silane coupling agent (D). The silane coupling agent (D) may have a hydrolyzable group. The hydrolyzable group is hydrolyzed by water to become a hydroxyl group, and the hydroxyl group undergoes a dehydration condensation reaction with the hydroxyl group on the surface of the silica particles (C), thereby modifying the surface of the silica particles (C).

[0162] In addition, the silane coupling agent (D) may contain a silane coupling agent having a hydrophobic group. This provides the surface of the silica particles (C) with this hydrophobic group, so that the cohesive force of the silica particles (C) in the silicone rubber-based curable composition and in the silicone rubber is reduced (there is less cohesion due to hydrogen bonds caused by silanol groups), and as a result, it is presumed that the dispersibility of the silica particles in the silicone rubber-based curable composition is improved. This increases the interface between the silica particles and the rubber matrix, and enhances the reinforcing effect of the silica particles. Furthermore, it is presumed that the slipperiness of the silica particles in the matrix is ​​improved during deformation of the rubber matrix. And, due to the improvement in the dispersibility and slipperiness of the silica particles (C), the mechanical strength (for example, tensile strength, tear strength, etc.) of the silicone rubber due to the silica particles (C) is improved.

[0163] Furthermore, the silane coupling agent (D) may contain a silane coupling agent having a vinyl group. This allows the vinyl group to be introduced onto the surface of the silica particles (C). Therefore, when the silicone rubber-based curable composition is cured, that is, when the vinyl group of the vinyl group-containing organopolysiloxane (A) and the hydride group of the organohydrogenpolysiloxane (B) undergo a hydrosilylation reaction to form a network (crosslinked structure), the vinyl group of the silica particles (C) also participates in the hydrosilylation reaction with the hydride group of the organohydrogenpolysiloxane (B), so that the silica particles (C) are also incorporated into the network. This allows the formed silicone rubber to have a low hardness and a high modulus.

[0164] As the silane coupling agent (D), a silane coupling agent having a hydrophobic group and a silane coupling agent having a vinyl group can be used in combination.

[0165] An example of the silane coupling agent (D) is one represented by the following formula (4).

[0166] Y n -Si-(X) 4-n (4) In the above formula (4), n represents an integer of 1 to 3. Y represents any functional group having a hydrophobic group, a hydrophilic group, or a vinyl group, and when n is 1, it is a hydrophobic group, and when n is 2 or 3, at least one of them is a hydrophobic group. X represents a hydrolyzable group.

[0167] The hydrophobic group is an alkyl group having 1 to 6 carbon atoms, an aryl group, or a hydrocarbon group formed by combining these groups, and examples thereof include a methyl group, an ethyl group, a propyl group, and a phenyl group, with a methyl group being particularly preferred.

[0168] In addition, the hydrophilic group may be, for example, a hydroxyl group, a sulfonic acid group, a carboxyl group, or a carbonyl group, and among these, a hydroxyl group is particularly preferred. Note that, although a hydrophilic group may be included as a functional group, it is preferable that the hydrophilic group is not included from the viewpoint of imparting hydrophobicity to the silane coupling agent (D).

[0169] Further, examples of the hydrolyzable group include alkoxy groups such as methoxy and ethoxy groups, chloro groups, and silazane groups. Among these, silazane groups are preferred because of their high reactivity with the silica particles (C). In addition, those having a silazane group as a hydrolyzable group can be easily obtained by adding (Y n -Si-) structures.

[0170] Specific examples of the silane coupling agent (D) represented by the above formula (4) include, for example, alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, hexyltrimethoxysilane, hexyltriethoxysilane, and decyltrimethoxysilane; chlorosilanes such as methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, and phenyltrichlorosilane; and hexamethyldisilazane, which have a hydrophobic group as a functional group. Examples of the silane having a vinyl group include alkoxysilanes such as methacryloxypropyltriethoxysilane, methacryloxypropyltrimethoxysilane, methacryloxypropylmethyldiethoxysilane, methacryloxypropylmethyldimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylmethyldimethoxysilane; chlorosilanes such as vinyltrichlorosilane and vinylmethyldichlorosilane; and divinyltetramethyldisilazane. Among these, taking into consideration the above description, it is particularly preferable that the silane having a hydrophobic group is hexamethyldisilazane, and the silane having a vinyl group is divinyltetramethyldisilazane.

[0171] In this embodiment, the lower limit of the content of the silane coupling agent (D) is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). The upper limit of the content of the silane coupling agent (D) is preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 40% by mass or less, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). By making the content of the silane coupling agent (D) equal to or more than the above lower limit, when silica particles (C) are used, it is possible to improve the mechanical strength of the silicone rubber as a whole. Also, by making the content of the silane coupling agent (D) equal to or less than the above upper limit, it is possible for the silicone rubber to have appropriate mechanical properties.

[0172] <<Platinum or platinum compounds (E)>> The silicone rubber-based hardenable composition of this embodiment may contain platinum or a platinum compound (E). Platinum or a platinum compound (E) is a catalytic component that acts as a catalyst during curing. The amount of platinum or a platinum compound (E) added is a catalytic amount.

[0173] As the platinum or platinum compound (E), known substances can be used, such as platinum black, platinum supported on silica or carbon black, chloroplatinic acid or an alcohol solution of chloroplatinic acid, a complex salt of chloroplatinic acid and an olefin, and a complex salt of chloroplatinic acid and a vinylsiloxane.

[0174] The platinum or platinum compound (E) may be used alone or in combination of two or more kinds.

[0175] <<Water(F)>> Furthermore, the silicone rubber-based hardening composition of this embodiment may contain water (F) in addition to the above components (A) to (E).

[0176] Water (F) functions as a dispersion medium for dispersing each component contained in the silicone rubber-based hardening composition, and is also a component that contributes to the reaction between the silica particles (C) and the silane coupling agent (D). Therefore, the silica particles (C) and the silane coupling agent (D) can be more reliably linked to each other in the silicone rubber, and uniform properties can be exhibited overall.

[0177] Furthermore, when water (F) is contained, its content can be appropriately set, but specifically, for example, it is preferably in the range of 10 to 100 parts by weight, more preferably in the range of 30 to 70 parts by weight, relative to 100 parts by weight of the silane coupling agent (D). This makes it possible to more reliably proceed with the reaction between the silane coupling agent (D) and the silica particles (C).

[0178] (Other Ingredients) Furthermore, the silicone rubber-based hardening composition of the present embodiment may further contain other components in addition to the above components (A) to (F), such as inorganic fillers other than the silica particles (C), such as diatomaceous earth, iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide, cerium oxide, calcium carbonate, magnesium carbonate, zinc carbonate, glass wool, and mica, as well as additives such as reaction inhibitors, dispersants, pigments, dyes, antistatic agents, antioxidants, flame retardants, and thermal conductivity improvers.

[0179] In the silicone rubber-based hardening composition, the content ratio of each component is not particularly limited, but is set, for example, as follows.

[0180] In this embodiment, the upper limit of the content of the silica particles (C) may be, for example, 60 parts by weight or less, preferably 50 parts by weight or less, and more preferably 40 parts by weight or less, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A). This allows the balance of mechanical strength such as hardness and tensile strength to be achieved. The lower limit of the content of the silica particles (C) is not particularly limited, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A), but may be, for example, 10 parts by weight or more.

[0181] The silane coupling agent (D) is preferably contained in an amount of 5 parts by weight or more and 100 parts by weight or less, more preferably 5 parts by weight or more and 40 parts by weight or less, per 100 parts by weight of the vinyl group-containing organopolysiloxane (A), which can reliably improve the dispersibility of the silica particles (C) in the silicone rubber-based curable composition.

[0182] The content of the organohydrogenpolysiloxane (B) is preferably, for example, 0.5 parts by weight or more and 20 parts by weight or less, and more preferably 0.8 parts by weight or more and 15 parts by weight or less, based on 100 parts by weight of the total amount of the vinyl group-containing organopolysiloxane (A), the silica particles (C), and the silane coupling agent (D). By keeping the content of (B) within the above range, a more effective curing reaction may be achieved.

[0183] The content of platinum or platinum compound (E) means the amount of catalyst, and can be set appropriately, but specifically, the amount of platinum group metal in this component is 0.01 to 1000 ppm by weight, preferably 0.1 to 500 ppm, relative to the total amount of vinyl group-containing organopolysiloxane (A), silica particles (C), and silane coupling agent (D). By making the content of platinum or platinum compound (E) equal to or greater than the lower limit, the obtained silicone rubber composition can be sufficiently cured. By making the content of platinum or platinum compound (E) equal to or less than the upper limit, the curing speed of the obtained silicone rubber composition can be improved.

[0184] Furthermore, when water (F) is contained, its content can be appropriately set, but specifically, for example, it is preferably in the range of 10 to 100 parts by weight, more preferably in the range of 30 to 70 parts by weight, relative to 100 parts by weight of the silane coupling agent (D). This makes it possible to more reliably proceed with the reaction between the silane coupling agent (D) and the silica particles (C).

[0185] <Silicone rubber manufacturing method> Next, a method for producing the silicone rubber of this embodiment will be described. In the method for producing the silicone rubber of this embodiment, a silicone rubber-based hardening composition is prepared, and the silicone rubber can be obtained by hardening the silicone rubber-based hardening composition. Details are provided below.

[0186] First, the components of the silicone rubber-based hardening composition are mixed uniformly using any kneading device to prepare the silicone rubber-based hardening composition.

[0187] [1] For example, a predetermined amount of vinyl group-containing organopolysiloxane (A), silica particles (C), and a silane coupling agent (D) are weighed out, and then kneaded using any kneading device to obtain a kneaded product containing these components (A), (C), and (D).

[0188] It is preferable to prepare this mixture by first kneading the vinyl-containing organopolysiloxane (A) with the silane coupling agent (D) and then kneading (mixing) the silica particles (C), which improves the dispersibility of the silica particles (C) in the vinyl-containing organopolysiloxane (A).

[0189] In addition, when obtaining this kneaded product, water (F) may be added to the kneaded product of the components (A), (C), and (D) as necessary, which allows the reaction between the silane coupling agent (D) and the silica particles (C) to proceed more reliably.

[0190] Furthermore, it is preferable that the kneading of each of the components (A), (C), and (D) is carried out through a first step of heating at a first temperature and a second step of heating at a second temperature. This allows the surface of the silica particles (C) to be surface-treated with the coupling agent (D) in the first step, and allows the by-products generated by the reaction between the silica particles (C) and the coupling agent (D) to be reliably removed from the kneaded product in the second step. After that, the component (A) may be added to the obtained kneaded product as necessary, and further kneaded. This allows the compatibility of the components in the kneaded product to be improved.

[0191] The first temperature is preferably, for example, about 40 to 120° C., and more preferably, for example, about 60 to 90° C. The second temperature is preferably, for example, about 130 to 210° C., and more preferably, for example, about 160 to 180° C.

[0192] Moreover, the atmosphere in the first step is preferably an inert atmosphere such as a nitrogen atmosphere, and the atmosphere in the second step is preferably a reduced pressure atmosphere.

[0193] Furthermore, the time for the first step is, for example, preferably about 0.3 to 1.5 hours, and more preferably about 0.5 to 1.2 hours, and the time for the second step is, for example, preferably about 0.7 to 3.0 hours, and more preferably about 1.0 to 2.0 hours.

[0194] By setting the above conditions for the first and second steps, the above effects can be obtained more significantly.

[0195] [2] Next, the organohydrogenpolysiloxane (B) and platinum or a platinum compound (E) are weighed out in predetermined amounts, and then the components (B) and (E) are kneaded into the mixture prepared in the above step [1] using any kneading device to obtain a silicone rubber-based curable composition. The obtained silicone rubber-based curable composition may be a paste containing a solvent.

[0196] In addition, when mixing the components (B) and (E), it is preferable to mix the mixture prepared in the above step [1] with the organohydrogenpolysiloxane (B) and the mixture prepared in the above step [1] with platinum or a platinum compound (E), and then mix the mixtures together. This allows the components (A) to (E) to be reliably dispersed in the silicone rubber-based curable composition without allowing the reaction between the vinyl group-containing organopolysiloxane (A) and the organohydrogenpolysiloxane (B) to proceed.

[0197] The temperature at which the components (B) and (E) are kneaded is, for example, preferably about 10 to 70°C, and more preferably about 25 to 30°C, as roll setting temperature.

[0198] Furthermore, the kneading time is, for example, preferably about 5 minutes to 1 hour, and more preferably about 10 to 40 minutes.

[0199] In the above steps [1] and [2], by setting the temperature within the above range, the progress of the reaction between the vinyl group-containing organopolysiloxane (A) and the organohydrogenpolysiloxane (B) can be more reliably prevented or inhibited. In addition, in the above steps [1] and [2], by setting the kneading time within the above range, the components (A) to (E) can be more reliably dispersed in the silicone rubber-based curable composition.

[0200] The kneading device used in each of steps [1] and [2] is not particularly limited, but for example, a kneader, a two-roll mill, a Banbury mixer (continuous kneader), a pressure kneader, etc. can be used.

[0201] In addition, a reaction inhibitor such as 1-ethynylcyclohexanol may be added to the kneaded mixture in step [2], which makes it possible to more effectively prevent or inhibit the progress of the reaction between the vinyl group-containing organopolysiloxane (A) and the organohydrogenpolysiloxane (B) even if the temperature of the kneaded mixture is set to a relatively high temperature.

[0202] [3] Next, the silicone rubber-based hardenable composition is hardened to form a silicone rubber.

[0203] In this embodiment, the curing process of the silicone rubber-based curable resin composition is carried out, for example, by heating at 100 to 250° C. for 1 to 30 minutes (first curing) and then post-baking at 200° C. for 1 to 4 hours (second curing).

[0204] Through the above steps, a silicone rubber made of a cured product of the silicone rubber-based curable resin composition is obtained.

[0205] [3] Next, the silicone rubber-based hardening composition obtained in step [2] is dissolved in a solvent to obtain an insulating paste. [3] Next, the silicone rubber-based hardening composition obtained in step [2] is dissolved in a solvent, and a conductive filler is added to obtain a conductive paste.

[0206] (solvent) The conductive paste and the insulating paste contain a solvent. As the solvent, various known solvents can be used, including, for example, high boiling point solvents. These may be used alone or in combination of two or more kinds.

[0207] The lower limit of the boiling point of the high boiling point solvent is, for example, 100°C or higher, preferably 130°C or higher, and more preferably 150°C or higher. This can improve the printing stability of screen printing and the like. On the other hand, the upper limit of the boiling point of the high boiling point solvent is not particularly limited, but may be, for example, 300°C or lower, 290°C or lower, or 280°C or lower. This can suppress excessive heat history during wiring formation, thereby preventing damage to the base and maintaining a good shape of the wiring formed from the conductive paste.

[0208] The solvent can be appropriately selected from the viewpoints of the solubility and boiling point of the silicone rubber-based curable resin composition, and can include, for example, an aliphatic hydrocarbon having 5 to 20 carbon atoms, preferably an aliphatic hydrocarbon having 8 to 18 carbon atoms, and more preferably an aliphatic hydrocarbon having 10 to 15 carbon atoms.

[0209] Examples of the solvent include aliphatic hydrocarbons such as pentane, hexane, cyclohexane, heptane, methylcyclohexane, ethylcyclohexane, octane, decane, dodecane, and tetradecane; aromatic hydrocarbons such as benzene, toluene, ethylbenzene, xylene, mesitylene, trifluoromethylbenzene, and benzotrifluoride; diethyl ether, diisopropyl ether, dibutyl ether, cyclopentyl methyl ether, cyclopentyl ethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, and diethylene glycol dimethyl ether. Examples of the ethers include ethanol monobutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl-n-propyl ether, 1,4-dioxane, 1,3-dioxane, and tetrahydrofuran; haloalkanes such as dichloromethane, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, and 1,1,2-trichloroethane; carboxylic acid amides such as N,N-dimethylformamide and N,N-dimethylacetamide; sulfoxides such as dimethyl sulfoxide and diethyl sulfoxide; and esters such as diethyl carbonate. These may be used alone or in combination of two or more. The solvent used here may be appropriately selected from among solvents capable of uniformly dissolving or dispersing the components in the conductive paste.

[0210] The above solvents are the polar term of the Hansen solubility parameters (δ p ) is, for example, 10MPa 1 / 2 or less, preferably 7 MPa 1 / 2 More preferably, it is 5.5 MPa or less. 1 / 2 The silicone rubber-based hardening resin composition may contain a first solvent having the polarity (δ) of 1 to 3. This makes it possible to improve the dispersibility and solubility of the silicone rubber-based hardening resin composition in the paste. p The lower limit of the pressure is not particularly limited, but may be, for example, 0 Pa. 1 / 2 More than that is fine.

[0211] The hydrogen bond term of the Hansen solubility parameters in the first solvent (δ h ) is, for example, 20MPa 1 / 2 or less, preferably 10 MPa 1 / 2 More preferably, it is 7 MPa or less. 1 / 2 This makes it possible to improve the dispersibility and solubility of the silicone rubber-based hardening resin composition in the paste. h The lower limit of the pressure is not particularly limited, but may be, for example, 0 Pa. 1 / 2 More than that is fine.

[0212] Hansen solubility parameters (HSP) are an index that indicates the degree to which a substance dissolves in another substance. HSP expresses solubility as a three-dimensional vector. This three-dimensional vector is typically expressed by the dispersion term (δ d ), polarity term (δ p ), hydrogen bond term (δ h ) and it can be determined that compounds with similar vectors have high solubility. The similarity of vectors can be determined by the Hansen Solubility Parameter distance (HSP distance).

[0213] As used herein, the Hansen Solubility Parameters (HSP values) can be calculated using software called HSPiP (Hansen Solubility Parameters in Practice), where the computer software HSPiP developed by Hansen and Abbott includes a function for calculating HSP distances and a database of Hansen parameters for various resins and solvents or non-solvents. The solubility of each resin in pure solvents and mixed solvents of good and poor solvents is investigated, and the results are entered into the HSPiP software to calculate D: dispersion term, P: polarity term, H: hydrogen bond term, and R0: radius of the solubility sphere.

[0214] As the solvent of this embodiment, for example, one having a small difference in HSP distance, polarity term, or hydrogen bond term between the elastomer or the structural units constituting the elastomer and the solvent can be selected.

[0215] The lower limit of the viscosity of the conductive paste and / or insulating paste when measured at a shear rate of 20 [1 / s] at room temperature of 25°C is, for example, 1 Pa·s or more, preferably 5 Pa·s or more, and more preferably 10 Pa·s or more. This can improve film formability. Also, shape retention can be improved even when a thick film is formed. On the other hand, the upper limit of the viscosity of the conductive paste and / or insulating paste at room temperature of 25°C is, for example, 100 Pa·s or less, preferably 90 Pa·s or less, and more preferably 80 Pa·s or less. This can improve the printability of the paste.

[0216] At room temperature of 25°C, the viscosity measured at a shear rate of 1 [1 / s] is η1, the viscosity measured at a shear rate of 5 [1 / s] is η5, and the thixotropic index is the viscosity ratio (η1 / η5). In this case, the lower limit of the thixotropy index of the conductive paste and / or insulating paste is, for example, 1.0 or more, preferably 1.1 or more, and more preferably 1.2 or more. This allows the shape of the wiring obtained by the printing method to be stably maintained. On the other hand, the upper limit of the thixotropy index of the conductive paste and / or insulating paste is, for example, 3.0 or less, preferably 2.5 or less, and more preferably 2.0 or less. This allows the paste to be easily printed.

[0217] The content of the silicone rubber-based curable composition in the insulating paste is preferably 10% by mass or more, more preferably 15% by mass or more, and even more preferably 20% by mass or more, based on 100% by mass of the insulating paste. The content of the silicone rubber-based curable composition in the insulating paste is preferably 50% by mass or less, more preferably 40% by mass or less, and even more preferably 35% by mass or less, based on 100% by mass of the insulating paste.

[0218] (Conductive filler) As the conductive filler, a known conductive material may be used, but metal powder (G) or a conductive carbon material may also be used. The metal constituting the metal powder (G) is not particularly limited, but may include, for example, at least one of copper, silver, gold, nickel, tin, lead, zinc, bismuth, antimony, or metal powder alloyed with these, or two or more of these. Of these, it is preferable that the metal powder (G) contains silver or copper, that is, silver powder or copper powder, because of high conductivity and high availability. Note that these metal powders (G) may also be coated with other metals.

[0219] Examples of the conductive carbon material include conductive carbon black, carbon nanotubes, and graphene.

[0220] In this embodiment, the shape of the metal powder (G) is not limited, but conventional shapes such as dendritic, spherical, scale-like, etc. may be used. Among these, scale-like metal powder (G) may be used.

[0221] The particle size of the metal powder (G) is not limited. For example, the average particle size D 50 The particle size of the metal powder (G) is, for example, an average particle size D 50It is preferably 1,000 μm or less, more preferably 100 μm or less, and further preferably 20 μm or less. Average particle size D 50 By setting the value in this range, the silicone rubber can exhibit an appropriate electrical conductivity. The particle size of the metal powder (G) can be defined as the average particle size of 200 arbitrarily selected metal powder particles obtained by observing, for example, the conductive paste or silicone rubber molded using the conductive paste with a transmission electron microscope and performing image analysis.

[0222] The content of the conductive filler in the conductive paste is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more, based on the total amount of the conductive paste. The content of the conductive filler in the conductive paste is preferably 85% by mass or less, more preferably 75% by mass or less, and even more preferably 65% ​​by mass or less, based on the total amount of the conductive paste. By setting the content of the conductive filler to be equal to or greater than the above lower limit, the silicone rubber can have appropriate conductive properties, while by setting the content of the conductive filler to be equal to or less than the above upper limit, the silicone rubber can have appropriate flexibility.

[0223] The content of the silicone rubber-based hardening composition in the conductive paste is preferably 1% by mass or more, more preferably 3% by mass or more, and even more preferably 5% by mass or more, based on 100% by mass of the conductive paste. The content of the silicone rubber-based hardening composition in the conductive paste is preferably 25% by mass or less, more preferably 20% by mass or less, and even more preferably 15% by mass or less, based on 100% by mass of the conductive paste. By making the content of the silicone rubber-based hardening composition equal to or greater than the above lower limit, the silicone rubber can have an appropriate degree of flexibility, while by making the content of the silicone rubber-based hardening composition equal to or less than the above upper limit, the mechanical strength of the silicone rubber can be improved.

[0224] The lower limit of the content of the silica particles (C) in the conductive paste can be, for example, 1% by mass or more, preferably 3% by mass or more, and more preferably 5% by mass or more, based on 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can improve the mechanical strength of the silicone rubber. On the other hand, the upper limit of the content of the silica particles (C) in the conductive paste can be, for example, 20% by mass or less, preferably 15% by mass or less, and more preferably 10% by mass or less, based on 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can balance the elastic electrical properties and mechanical strength of the silicone rubber.

[0225] The lower limit of the content of the conductive filler in the conductive cured material obtained by curing the conductive paste constituting the elastic wiring 130 is, for example, 65% by mass or more, preferably 70% by mass or more, and more preferably 75% by mass or more, based on 100% by mass of the conductive cured material. This improves the elastic electrical properties. On the other hand, the upper limit of the content of the conductive filler in the conductive cured material is, for example, 95% by mass or less, preferably 90% by mass or less, and more preferably 85% by mass or less, based on 100% by mass of the elastic wiring 130. This makes it possible to suppress a decrease in rubber properties such as elasticity.

[0226] The lower limit of the content of silica particles (C) in the conductive cured product obtained by curing the conductive paste constituting the elastic wiring 130 can be, for example, 1% by mass or more, preferably 3% by mass or more, and more preferably 4% by mass or more, based on 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can improve the mechanical strength of the silicone rubber. On the other hand, the upper limit of the content of silica particles (C) in the conductive cured product is, for example, 20% by mass or less, preferably 15% by mass or less, and more preferably 10% by mass or less, based on 100% by mass of the total amount of the silica particles (C) and the conductive filler. This can balance the elastic electrical properties and mechanical strength of the silicone rubber.

[0227] Next, an example of a manufacturing process for the sensor device of this embodiment will be described.

[0228] The sensor device of this embodiment includes a step of forming a stretchable substrate, a step of forming a stretchable wire on the stretchable substrate, and a step of mounting a pressure sensor on the stretchable wire.

[0229] First, the insulating paste is applied onto the support. Various methods can be used as the application method, and for example, a printing method such as a squeegee method using a squeegee can be used. Then, the coating-like insulating paste is dried to form an insulating layer (an elastic substrate made of an insulating elastomer) on the support. The drying conditions can be appropriately set depending on the type and amount of the solvent in the insulating paste, and for example, the drying temperature can be 120°C to 180°C, and the drying time can be 1 minute to 30 minutes, etc.

[0230] The stretchable substrate may be formed by a molding method such as calendar molding or compression molding using the silicone rubber-based curable composition. Alternatively, the stretchable substrate may be obtained by molding a known elastomer material into a predetermined shape such as a sheet.

[0231] Then, a mask having a predetermined opening pattern is placed on the insulating layer, and a conductive paste is applied onto the insulating layer through the mask and dried to form a pattern for the expansion and contraction strain sensor. Similarly, conductive pastes with different volume resistivities are used to draw patterns of stretchable wiring that will be connected to the stretchable strain sensor patterns. The coating method can be the same as the coating method for the insulating paste, and for example, squeegee printing using a squeegee may be used.

[0232] Here, when the insulating paste and the conductive paste each contain a silicone rubber-based curable composition, a conductive coating film (conductive layer) having a predetermined pattern shape may be laminated on the dried insulating layer, and then these may be cured together. The curing process can be appropriately set according to the silicone rubber-based curable composition, but for example, the curing temperature can be 120°C to 220°C, and the curing time can be 1 hour to 3 hours, etc. After or before the curing process, the mask can be removed. This allows the cured product of the conductive layer (the elastic strain sensor and the elastic wiring made of the conductive elastomer) having a predetermined pattern shape to be formed on the elastic substrate made of the cured product of the insulating layer.

[0233] If necessary, a stretchable cover portion that covers the surface of the stretchable wiring may be formed on the stretchable wiring. For example, a mask having a predetermined opening pattern is arranged, and an insulating paste is applied through the mask to form an insulating layer (stretchable cover). Note that the above-mentioned curing treatment may be performed together with other members (such as stretchable wiring) on ​​the substrate after the stretchable cover is formed. In this manner, a sensor device is obtained.

[0234] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various configurations other than those described above can be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of the present invention are included in the present invention. EXAMPLES

[0235] The present invention will be described in detail below with reference to examples, but the present invention is not limited to the descriptions of these examples.

[0236] The raw material components shown in Table 1 are as follows: (A1-1): First vinyl group-containing linear organopolysiloxane: A vinyl group-containing dimethylpolysiloxane (structure represented by the above formula (1-1)) synthesized according to the following synthesis scheme 1. (A1-2): Second vinyl group-containing linear organopolysiloxane: A vinyl group-containing dimethylpolysiloxane (having the structure represented by the above formula (1-1) and R 1 and R 2 is a vinyl group)

[0237] (Organohydrogenpolysiloxane (B)) (B-1): Organohydrogenpolysiloxane: Momentive Corporation, "TC-25D"

[0238] (Silica particles (C)) (C): Silica microparticles (particle size 7 nm, specific surface area 300 m 2 / g), manufactured by Nippon Aerosil Co., Ltd., "AEROSIL300"

[0239] (Silane coupling agent (D)) (D-1): Hexamethyldisilazane (HMDZ), manufactured by Gelest, "HEXAMETHYLDISILAZANE (SIH6110.1)" (D-2) Divinyltetramethyldisilazane, manufactured by Gelest, "1,3-DIVINYLTETRAMETHYLDISILAZANE (SID4612.0)"

[0240] (Platinum or platinum compounds (E)) (E-1): Platinum compound (manufactured by Momentive, product name "TC-25A")

[0241] (Water(F)) (F):Pure water

[0242] (Metal powder (G)) (G1): Silver powder, manufactured by Tokuriki Chemical Laboratory, product name "TC-101", median diameter d 50 : 8.0μm, aspect ratio 16.4, average major axis 4.6μm

[0243] (Synthesis of vinyl group-containing organopolysiloxane (A)) [Synthesis Scheme 1: Synthesis of First Vinyl Group-Containing Linear Organopolysiloxane (A1-1)] A first vinyl group-containing linear organopolysiloxane (A1-1) was synthesized according to the following formula (5). That is, 74.7 g (252 mmol) of octamethylcyclotetrasiloxane and 0.1 g of potassium siliconate were placed in a 300 mL separable flask equipped with a cooling tube and stirring blade and replaced with Ar gas, and the temperature was raised and the mixture was stirred at 120° C. for 30 minutes. At this time, an increase in viscosity was confirmed. The mixture was then heated to 155° C. and stirred for 3 hours, after which 0.1 g (0.6 mmol) of 1,3-divinyltetramethyldisiloxane was added and the mixture was stirred at 155° C. for an additional 4 hours. After four hours, the mixture was diluted with 250 mL of toluene and then washed three times with water. The washed organic layer was washed several times with 1.5 L of methanol for reprecipitation purification, and the oligomer and polymer were separated. The resulting polymer was dried overnight at 60°C under reduced pressure to obtain a first vinyl group-containing linear organopolysiloxane (A1-1) (Mn = 2.2 × 10 5 , Mw=4,8×10 5 The vinyl group content calculated from H-NMR spectrum measurement was 0.04 mol %.

[0244] [ka]

[0245] [Synthesis Scheme 2: Synthesis of the second vinyl group-containing linear organopolysiloxane (A1-2)] A second vinyl group-containing linear organopolysiloxane (A1-2) was synthesized as shown in the following formula (6) (Mn=2.3×10 5 , Mw=5.0×10 5 The vinyl group content calculated from H-NMR spectrum measurement was 0.93 mol %.

[0246] [ka]

[0247] (Preparation of Silicone Rubber-Based Curable Composition) Silicone rubber-based curable compositions Samples 1 and 2 were prepared according to the following procedure. First, a mixture of 90% vinyl group-containing organopolysiloxane (A), silane coupling agent (D), and water (F) was pre-kneaded in the proportions shown in Table 1 below, and then silica particles (C) were added to the mixture and further kneaded to obtain a kneaded product (silicone rubber compound). Here, the kneading after the addition of the silica particles (C) was carried out through a first step of kneading for 1 hour under conditions of 60 to 90°C in a nitrogen atmosphere for the coupling reaction, and a second step of kneading for 2 hours under conditions of 160 to 180°C in a reduced pressure atmosphere for the removal of the by-product (ammonia). Thereafter, the mixture was cooled, and the remaining 10% of the vinyl group-containing organopolysiloxane (A) was added in two portions and kneaded for 20 minutes. Next, organohydrogenpolysiloxane (B), platinum or a platinum compound (E) was added to 100 parts by weight of the obtained kneaded product (silicone rubber compound) in the proportions shown in Table 2 below, and kneaded with a roll to obtain a silicone rubber-based curable composition.

[0248] (Preparation of conductive paste) 13.7 parts by weight of the obtained silicone rubber-based hardening composition of Sample 1 was immersed in 31.8 parts by weight of tetradecane (solvent), then stirred with a planetary centrifugal mixer, 54.5 parts by weight of metal powder (G1) was added, and the mixture was kneaded with a triple roll mill to obtain a conductive paste 1 (silver paste).

[0249] 29.3 parts by weight of the obtained silicone rubber-based hardening composition of Sample 1 was immersed in 68.5 parts by weight of tetradecane (solvent), then stirred with a planetary centrifugal mixer, 2.2 parts by weight of carbon black was added, and the mixture was kneaded with a triple roll mill to obtain a conductive paste 2 (carbon paste).

[0250] [Table 1]

[0251] (Preparation of stretchable substrate) The obtained silicone rubber-based hardening composition of Sample 2 was pressed at 170°C and 10 MPa for 10 minutes to form a sheet having a thickness of 500 μm and was primarily hardened. It was then secondary hardened at 200°C for 4 hours to obtain a sheet-like silicone rubber (a hardened product of the silicone rubber-based hardening composition) having a hardness of about 40. This was cut into a width of 2 cm and a length of 5 cm to prepare the elastic substrate 120. [Example 1] (Fabrication of sensor device) Using the obtained conductive paste 2 (carbon paste), a square pattern with a length of 2 mm and a width of 1.5 mm was drawn on the above-mentioned stretchable substrate 120 through a mask, and then dried at 140°C for 30 minutes to form a stretching strain sensor 110 (pressure sensor) with a thickness of 100 μm. Using the obtained conductive paste 1 (silver paste), two linear patterns with a length of 10 mm and a width of 1 mm were drawn on both ends of the stretching strain sensor 110 through a mask, and cured at 180 degrees for two hours to form a 20 μm thick stretchable wiring 130 (first wiring 132, second wiring 134) electrically connected to the stretching strain sensor 110. In this manner, the sensor device 100 having a pressure sensor shown in FIG. 3(a) was fabricated.

[0252] [Example 2] Using the obtained conductive paste 2 (carbon paste), a linear pattern with a length of 30 mm and a width of 5 mm was drawn on the above-mentioned stretchable substrate 120 through a mask, and then dried at 140°C for 30 minutes to form a stretchable strain sensor 110 (stretchable sensor) with a thickness of 50 μm. Using the obtained conductive paste 1 (silver paste), two linear patterns with a length of 5 mm and a width of 3 mm were drawn on both ends of the stretching strain sensor 110 through a mask, and cured at 180 degrees for two hours to form a stretchable wiring 130 (first wiring 132, second wiring 134) electrically connected to the stretching strain sensor 110 with a thickness of 50 μm. In this manner, the sensor device 100 having a stretch sensor shown in FIG. 3(b) was fabricated.

[0253] The conductive paste 1 for the stretchable wiring and the conductive paste 2 for the stretchable sensor used in each example were each applied to a slide glass in a size of 10 mm square and 60 μm thick, and cured in an oven at 180° C. for 120 minutes. The volume resistivity of the cured product was measured by a four-probe method after curing for 120 minutes in an oven at 180° C. The volume resistivity (VR1) of the stretchable strain sensor 110 at 25° C. and unstretched was 5.2 Ω·cm, and the volume resistivity (VR2) of the stretchable wiring 130 at 25° C. and unstretched was 2.4×10 ―4 The value was Ω·cm.

[0254] <Durability to deformation> In an environment of 25° C., a force was applied to the pressure-receiving surface (thickness direction) of the pressure sensor (expansion / contraction strain sensor 110) of the sensor device 100 of Example 1 under the following conditions, and the resistance value (Ω) between the first wiring 132 and the second wiring 134 was measured. No load (pressure: 0N / mm 2 ): 512Ω 3N (Pressure: 1N / mm 2 ) applied: 584Ω 5N (Pressure: 1.67N / mm 2 ) applied: 607Ω When the pressure on the pressure-receiving surface of the pressure sensor was increased or decreased, the fluctuation in the measured resistance also showed the same increasing tendency. This confirmed that the force applied to the pressure sensor can be quantified based on the resistance detected by the pressure sensor. After repeatedly applying a force of no load → 3N → 5N to the pressure-receiving surface of the pressure sensor multiple times, it was confirmed that the resistance value when pressure was applied was the same as the value before the pressure application operation. In addition, after the stretchable substrate 120 of the sensor device 100 was repeatedly subjected to bending or stretching deformation operations multiple times, it was confirmed that the resistance value of the unstretched sensor device 100 when pressure was applied was equivalent to the value before the deformation operation.

[0255] In an environment of 25° C., the expansion sensor (expansion strain sensor 110) of the sensor device 100 of Example 2 was stretched in the longitudinal direction under the conditions described below, and the resistance value (Ω) between the first wiring 132 and the second wiring 134 was measured. ·Unstretched (stretched: 0%): 6843Ω ·20% extension: 9768Ω ·50% extension: 12300Ω When the degree of elongation in the longitudinal direction of the stretch sensor was increased, the fluctuation in the measured resistance also showed the same tendency to increase. This confirmed that the amount of strain in the planar direction of the stretch sensor can be quantified based on the resistance value detected by the stretch sensor. After the stretching operation of stretching the stretch sensor in the longitudinal direction under the conditions of unstretched → 20% stretched → 50% stretched was repeated multiple times, it was confirmed that the resistance value during stretching was the same as the value before the stretching operation. In addition, it was confirmed that after the stretchable substrate 120 of the sensor device 100 was repeatedly subjected to bending or stretching deformation operations multiple times, the resistance value of the sensor device 100 during stretching was equivalent to the value before the deformation operations.

[0256] [Comparative Examples 1 and 2] The elastic wiring 130 (first wiring 132, second wiring 134) in the sensor device 100 of Examples 1 and 2 was changed to a non-elastic metallic lead wire, and the sensor devices of Comparative Examples 1 and 2 were produced. In the sensor device of Comparative Example 1, a change in resistance due to the application of pressure was confirmed, but it was confirmed that the lead wires were damaged by deformation operations such as bending or stretching. In addition, in the sensor device of Comparative Example 2, the lead wire was damaged by the stretching operation, so the resistance during stretching could not be measured.

[0257] <Fit> When the sensor devices 100 of Examples 1 and 2 were wrapped around the fingers of test subjects and the wearing comfort was evaluated, it was confirmed that the test subjects felt little discomfort when wearing the device.

[0258] In the sensor devices of Examples 1 and 2, the stretchable strain sensors functioned as flexible and stretchable pressure sensors or stretch sensors, and showed excellent deformation durability. [Explanation of symbols]

[0259] 100 Sensor Devices 110 Stretching strain sensor 120 Stretchable substrate 121 one side 130 Stretchable wiring 132 First wiring 134 Second wiring 140, 141 Elastic cover part

Claims

1. A stretchable substrate and One or more stretchable strain sensors are provided on the stretchable substrate, A stretchable wiring is provided on the stretchable substrate and electrically connected to the stretchable strain sensor, Equipped with, The stretchable substrate, the stretchable strain sensor, and the stretchable wiring contain the same type of elastomer material. A sensor device configured such that, when the volume resistivity of the stretchable strain sensor at 25°C and in an unstretched state is VR1 (Ω·cm), and the volume resistivity of the stretchable wiring at 25°C and in an unstretched state is VR2 (Ω·cm), VR1 and VR2 satisfy the condition 1 < VR1 / VR2.

2. A sensor device according to claim 1, The stretchable substrate is composed of an insulating elastomer containing a non-conductive filler and the elastomer material. The stretchable strain sensor is composed of a conductive filler and a conductive elastomer containing the elastomer material, A sensor device in which the stretchable wiring is composed of a conductive filler, a non-conductive filler, and a conductive elastomer including the elastomer material.

3. A sensor device according to claim 1 or 2, A sensor device in which the stretchable substrate, the stretchable strain sensor, and the stretchable wiring contain the same type of silicone rubber.

4. A sensor device according to claim 1 or 2, A sensor device comprising a conductive carbon material and an elastomer material, wherein the stretchable strain sensor is a sensor device.

5. A sensor device according to claim 2, A sensor device in which the nonconductive filler in the stretchable substrate includes silica particles, silicone rubber particles, or talc.

6. A sensor device according to claim 2, A sensor device in which the conductive filler in the stretchable wiring contains silver powder.

7. A sensor device according to claim 1 or 2, The thickness of the aforementioned stretchable substrate is 10 mm or less. The durometer hardness A of the stretchable substrate is 80 or less. The elongation at break of the stretchable substrate is 100% or more. A sensor device in which the degree of elongation of the aforementioned expandable wiring is 10% or more.

8. A sensor device according to claim 1 or 2, A sensor device comprising a stretchable cover portion containing an elastomer material that covers the surface of the aforementioned stretchable wiring.

9. A sensor device according to claim 1 or 2, Sensor devices used in electronic devices, medical devices, machinery, or robots.

10. A sensor device according to claim 1 or 2, A sensor device that is a tactile sensor device.

11. A sensor device according to claim 1 or 2, A sensor device configured such that 1.0 × 10² ≤ VR1 / VR2.

12. A sensor device according to claim 1 or 2, A sensor device in which the volume resistivity of the stretchable wiring at 25°C and in an unstretched state is 1 × 10⁻⁵ Ω·cm or more and 1 × 10⁻¹ Ω·cm or less.

13. A sensor device according to claim 1 or 2, A sensor device in which the substrate thickness of the stretchable substrate is 400 μm or less.

14. A sensor device according to claim 1 or 2, A sensor device in which the tear strength of the stretchable substrate at 25°C, measured in accordance with JIS K6252 (2001), is 25 N / mm or more.

15. A sensor device according to claim 1 or 2, A sensor device in which the tensile strength of the stretchable substrate, measured at 25°C in accordance with JIS K6251 (2004), is 5.0 MPa or more.

16. A sensor device according to claim 1 or 2, It comprises a control unit and, A monitoring device in which the control unit acquires stress information received by the stretchable strain sensor based on changes in the electrical characteristics of the stretchable strain sensor.

17. A monitoring device according to claim 16, A monitoring device in which the stress information includes at least one or more of pressure, pressure distribution, and their changes over time.

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