Methods for measuring position, methods for manufacturing articles, position measuring devices, semiconductor manufacturing equipment

Abstract

To provide a position measuring method capable of reducing a measurement error caused by a shift a processing region in an alignment scope.SOLUTION: A method includes: a first processing step of setting processing regions on an image sensor for capturing an image of an alignment mark with the image sensor and performing position measurement processing; and a second processing step of calculating a position of the alignment mark on the basis of the processing regions set in the first processing step, wherein the final position of the alignment mark is calculated by shifting the processing regions set by the first processing step in pixel units of the imaging element and performing the second processing step by using the plurality of processing regions set by shifting.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a position measuring method, an article manufacturing method, a position measuring apparatus, a semiconductor manufacturing apparatus, an imprint apparatus, and the like. [Background technology]

[0002] Imprint technology is a technology that can form a pattern using a master on a resin supplied onto a substrate. Imprint technology has been proposed as one of the lithography techniques for mass production of semiconductor devices, magnetic storage media, etc.

[0003] An imprinting apparatus using this imprinting technology forms a pattern in resin supplied onto a substrate using an original plate. The imprinting apparatus hardens the resin while the original plate is in contact with the resin, and then separates the original plate from the hardened resin to form a resin pattern on the substrate.

[0004] In a lithography apparatus such as an imprint apparatus, it is necessary to accurately align the original and the substrate when bringing the original and the resin into contact with each other. The imprint apparatus employs, for example, a die-by-die alignment method as a method for alignment.

[0005] The die-by-die alignment method is a method of aligning by detecting an alignment mark formed in a shot area of ​​a substrate and an alignment mark formed on an original. Such techniques for aligning an original and a substrate have been proposed in the past.

[0006] For example, Patent Document 1 describes the configuration and processing method of an alignment mark, which has a rough inspection mark and a precision inspection mark as alignment marks, and the rough inspection mark is used for coarse alignment between an original and a substrate and for identifying the position of the precision inspection mark.

[0007] That is, the position of the precision inspection mark on the imaging element in the alignment scope is specified by measuring the rough inspection mark, and a measurement process is performed on a preset processing area of ​​the precision inspection mark to calculate the relative position between the original and the substrate. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2020-77850 A Summary of the Invention [Problem to be solved by the invention]

[0009] However, because the processing area allocated on the imaging element is in pixel units, even if the relative positions of the alignment scope and the alignment mark change by an amount smaller than the pixel resolution, the processing area set for the precision inspection mark cannot track the change in relative position.

[0010] Therefore, there is a problem that the processing area is slightly misaligned with respect to the precise inspection mark, resulting in measurement errors. One of the objects of the present invention is to solve such problems. [Means for solving the problem]

[0011] One aspect of the present invention is a method for producing a composition comprising the steps of: a first processing step of setting a processing area on the imaging element for performing a position measurement process by imaging the alignment mark using an imaging element that captures an image of the alignment mark; a second processing step of calculating a position of the alignment mark based on the processing area set by the first processing step, The method is characterized in that the processing area set by the first processing step is shifted in pixel units of the imaging element, and the final position of the alignment mark is calculated by performing the second processing step using the multiple processing areas set by shifting them. Effect of the Invention

[0012] According to the present invention, it is possible to provide a position measuring method capable of reducing measurement errors caused by deviations in a processing area in an alignment scope. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of an imprint apparatus according to a first embodiment. [Diagram 2] 1A to 1C are diagrams showing examples of alignment marks. [Diagram 3] FIG. 1 is a diagram showing an example of a substrate and shot arrangement. [Figure 4] 5 is a flowchart showing an imprint method using the imprint apparatus 100 according to the first embodiment. [Diagram 5] 13 is a flowchart showing an example of the alignment measurement operation performed by the control unit CNT in step S1014. [Figure 6] 1A to 1D are diagrams illustrating an example of a processing region on an image sensor according to the first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiment. In each drawing, the same members or elements are given the same reference numerals, and duplicated descriptions are omitted or simplified.

[0015] <Embodiment 1> 1 is a diagram showing an example of the configuration of an imprint apparatus according to embodiment 1. In embodiment 1, an example of a UV light curing imprint apparatus that cures resin by irradiating it with UV light (ultraviolet light) will be described. However, the imprint apparatus may be an imprint apparatus that cures resin by irradiating it with light in another wavelength range, or an imprint apparatus that cures resin by another energy (for example, heat).

[0016] The imprint apparatus 100 according to the embodiment of the present invention is configured to form a pattern in a plurality of shot areas of a substrate by repeating imprint shot cycles, where one imprint shot cycle is a cycle in which a pattern is formed in one shot area of ​​the substrate by hardening the resin while pressing the original against the resin.

[0017] As shown in FIG. 1, the imprint apparatus 100 according to the first embodiment includes, for example, an exposure mechanism 120, an original operation mechanism 130, an original shape correction mechanism 140, an alignment illumination mechanism 150, a substrate drive unit 160, an alignment mechanism 170, and a control unit CNT.

[0018] The exposure mechanism 120 irradiates ultraviolet light onto the resin (resist) R through the master (mold) M, thereby curing the resin R. In this embodiment, the resin R is an ultraviolet light curable resin. The exposure mechanism 120 includes, for example, a light source unit 110 and an optical system 112.

[0019] The light source unit 110 includes a light source such as a halogen lamp that generates ultraviolet light (e.g., i-rays and g-rays) and an elliptical mirror that collects the light generated by the light source. The optical system 112 can include a lens for irradiating the resin in the shot area with light for curing the resin R, a half mirror HM, a mirror 114, and the like.

[0020] The optical system 112 may include an optical integrator to uniformly illuminate the original M. Furthermore, light whose range is defined by an aperture (not shown) of the optical system 112 is incident on the resin R on the substrate W via the imaging system and the original M. The entire shot observation scope 190 is a scope for observing the entire shot, and is used to check the state of imprinting and the state of stamping and filling.

[0021] The original M is made of a material that is transparent at the wavelength of ultraviolet light, such as quartz, so that the original M can transmit ultraviolet light for curing the resin R. The original M can be transported by a not-shown original transport mechanism. The original transport mechanism includes, for example, a transport robot having a chuck such as a vacuum chuck.

[0022] The original operation mechanism 130 may include, for example, an original chuck 132 that holds the original M, an original driving mechanism 134 that drives the original chuck 132 to drive the original M, and an original base 136 that supports the original driving mechanism 134.

[0023] The original drive mechanism 134 includes a positioning mechanism that controls the position of the original M along six axes, and a mechanism that presses the original M against the substrate W or the resin R thereon, and separates the original M from the hardened resin R.

[0024] Here, the control of the six axes refers to control of the directions of the X-axis, Y-axis, and Z-axis in an XYZ coordinate system in which the support surface of the original chuck 132 (the surface that supports the substrate W) is the XY plane and the direction perpendicular to that is the Z axis, as well as control of the rotational direction around each axis.

[0025] The original shape correction mechanism 140 can be mounted on the original chuck 132. The original shape correction mechanism 140 corrects the shape of the original M by applying pressure to the original M from the outer circumferential direction using, for example, a cylinder operated by a fluid such as air or oil. Alternatively, the original shape correction mechanism 140 may include a temperature control unit that controls the temperature of the original M, and correct the shape of the original M by controlling the temperature of the original M.

[0026] The substrate W may deform (typically expand or contract) when subjected to a process such as heat treatment. The original shape correction mechanism 140 corrects the shape of the original M in response to such deformation of the substrate W so that the overlay error falls within a tolerable range.

[0027] The coating mechanism 180 applies the resin R sequentially to regions of the substrate W where imprinting is to be performed, or all at once to the entire surface of the substrate W. The coating mechanism 180 may be provided within the apparatus, or may be provided in an external apparatus and apply the resin R all at once to the substrate.

[0028] The coating mechanism 180 can include, for example, a tank that contains a resin, a nozzle that ejects the resin supplied from the tank through a supply path onto the substrate, a valve provided in the supply path, and a supply amount control unit.

[0029] The gas supply mechanism 200 is a mechanism that supplies a gas such as helium into the space of the master manipulation mechanism 130 to promote filling with the resin R. The inflow amount and inflow timing of the gas are optimized in advance in accordance with the imprint shot cycle.

[0030] Next, the original M is pressed against the resin R on the substrate, and in this state, the resin is hardened by being irradiated with ultraviolet light. Next, the same process is carried out for the next shot area.

[0031] The substrate driving unit 160 may include, for example, a substrate chuck 162 that holds the substrate W, a substrate stage 164 that drives the substrate W by driving the substrate chuck 162, and a stage driving mechanism (not shown). The stage driving mechanism may include a positioning mechanism that controls the position of the substrate W by controlling the position of the substrate stage 164 with respect to the above-mentioned six axes.

[0032] The alignment mechanism 170 may include, for example, an alignment scope 172 and an alignment stage mechanism 174. The alignment scope 172 may include an Automatic Adjustment Scope (AAS) that aligns the original M and the shot area of ​​the substrate W.

[0033] The alignment scope 172 detects an alignment mark formed on the original M and an alignment mark formed on the substrate W via the original M. Although only one alignment mechanism 170 is shown in FIG. 1, a plurality of alignment mechanisms 170 are mounted.

[0034] The alignment scope 172 has an imaging element that periodically and repeatedly captures images of the alignment mark AM at a preset accumulation time. The alignment scope 172 also calculates the relative positions of the alignment marks on the original M and the substrate W by a control unit CNT serving as an alignment measurement unit.

[0035] The control unit CNT measures the difference (coordinates, rotation, magnification, base component, etc.) between the shot shapes of the original M and the substrate W based on the measurement result of the relative positions of the alignment marks, and calculates the driving amount to be instructed to the substrate driving unit 160 based on the difference.

[0036] The alignment illumination mechanism 150 can include, for example, a light source 152 such as a laser diode, a light amount adjustment mechanism 154 such as an ND filter, a half mirror 156 that combines the alignment mechanism 170 and the optical axis, and the like.

[0037] The light amount adjustment mechanism 154 is an adjustment mechanism that can continuously change the transmittance, such as a continuously variable type ND filter that can change the transmittance depending on the position through which light passes, or a liquid crystal type ND filter that can electrically control the transmittance by an applied voltage, etc.

[0038] Although not shown, the imprint apparatus 100 also includes a surface plate and a vibration isolator (damper). The surface plate supports the entire imprint apparatus 100 and forms a reference plane when the substrate stage 164 moves. The vibration isolator removes vibrations from the floor and supports the surface plate.

[0039] 2(A) to (C) are diagrams showing examples of alignment marks, illustrating alignment marks formed on the original M and the substrate W. The alignment mark AMM on the original M (FIG. 2(A)) is composed of a rough inspection mark AMM_C and a detailed inspection mark AMM_F. The alignment mark AMW on the substrate W (FIG. 2(B)) is similarly composed of a rough inspection mark AMW_C and a detailed inspection mark AMW_F.

[0040] When the master M and the substrate W are superimposed, they become like the superimposed precision inspection mark AM_F in Figure 2(C). The precision inspection mark AMM_F on the master M and the precision inspection mark AMW_F on the substrate W are made with line-and-space patterns of different pitches and are arranged so as to overlap each other. Therefore, when the substrate W is observed through the master M, a moire pattern is generated in the superimposed precision inspection mark AM_F as shown in Figure 2, and the relative positions of the master M and the substrate W can be measured by detecting the phase of this moire pattern.

[0041] FIG. 3 is a diagram showing an example of a substrate and shot arrangement. As shown in FIG. 3, a plurality of shot areas S are formed on the substrate W, and a plurality of alignment marks are formed in each shot area S.

[0042] Fig. 4 is a flowchart showing an imprint method using the imprint apparatus 100 according to embodiment 1. The operation of the imprint apparatus 100 will be described below with reference to Fig. 4. Note that the operation of each step in the flowchart in Fig. 4 is performed sequentially by a CPU or the like as a computer in the control unit CNT executing a computer program stored in a memory.

[0043] First, in step S1002, the original M is transported to the original chuck 132, positioned, and held by the original chuck 132.

[0044] Next, in step S1004, the substrate W is loaded onto the substrate chuck 162 by a transport mechanism (not shown) and held by the substrate chuck 162. Here, it is assumed that at least a first layer pattern together with alignment marks has already been formed on the substrate W.

[0045] Next, in step S1006, the transmittance of light amount adjustment mechanism 154 is changed and driven. At this time, transmittance data that allows an image of the alignment mark to be correctly captured by alignment scope 172 is measured and stored in advance. Based on the stored data, the transmittance of light amount adjustment mechanism 154 is set so that the light amount for the shot to be imprinted can be measured under optimal conditions.

[0046] Next, in step S1008, the coating mechanism 180 coats the region where imprinting is to be performed with resin R. The resin R may be coated in advance onto the entire surface of the substrate W using an external device. Next, in step S1010, the alignment stage mechanism 174 drives the alignment scope 172 so that the alignment scope 172 is located at the position of the alignment mark on the original M.

[0047] Next, in step S1012, the original M is lowered by the original operating mechanism 130, so that the original M is pressed against the resin on the substrate W. Here, instead of driving the original M, the original M may be pressed against the resin by lifting the substrate W. The pressing load can be controlled, for example, using a load sensor built into the original driving mechanism 134.

[0048] Subsequently, from step S1014 onwards, an alignment measurement method (position measurement method) is performed according to the die-by-die alignment method. Specifically, images of the alignment marks of the original M and the substrate W are captured by the alignment scope 172, and the relative positions of the original M and the substrate W are measured by an image processing device (not shown).

[0049] Fig. 5 is a flowchart showing an example of the alignment measurement operation performed by the control unit CNT in step S1014. Note that the operation of each step in the flowchart in Fig. 5 is performed sequentially by a CPU or the like as a computer in the control unit CNT executing a computer program stored in a memory.

[0050] 5, first, in step S2002, rough inspection of the original M is performed. In the rough inspection of the original M, the position of the rough inspection mark AMM_C in FIG. 2C on the imaging element is detected. Next, in step S2004, rough inspection of the substrate W is performed. In the rough inspection of the substrate W, the position of the rough inspection mark AMW_C in FIG. 2C on the imaging element is detected.

[0051] When the rough inspection of the original M and the substrate W is completed, in step S2006, the position of the reference point AM_FC of the superimposed precision inspection mark AM_F on the image sensor is set with the rough inspection mark as a reference. When the position of the reference point is set in this manner, there is a possibility that the position of the reference point and the pixel position of the image sensor may be misaligned within one pixel.

[0052] In step S2008, a processing region AM_FR of the superimposed precise inspection mark AM_F centered on the reference point AM_FC is set (FIG. 2C).

[0053] Here, step S2008 functions as a first processing step (first processing unit) for imaging the alignment mark using an imaging element for imaging the alignment mark and setting a processing area on the imaging element for performing position measurement processing. Also, in the first processing step, a reference point of the alignment mark is set, and the processing area is set with the pixel of the imaging element closest to the reference point as the center.

[0054] 6(A) to (D) are diagrams for explaining examples of processing areas on an imaging element according to embodiment 1. The grid in Fig. 6(A) represents pixels of the imaging element of the alignment scope 172. In the example of Fig. 6(A), a processing area AM_FR is set in pixel units with the pixel closest to the reference point AM_FC of the superimposed precision inspection mark AM_F as the center pixel. In this example, a processing area AM_FR1 is set with the pixel (0,0) at the center.

[0055] In this example, the reference point of the superimposed precise inspection mark AM_F is located to the upper right of the center of the pixel (0,0). Therefore, three processing regions AM_FR2, AM_FR3, and AM_FR4 are also set with the pixels (0,1), (1,1), and (1,0) as the neighboring pixels close to the reference point of the superimposed precise inspection mark AM_F as their centers (FIGS. 6B-6D).

[0056] Furthermore, for example, if the reference point of the superimposed precision inspection mark AM_F is, for example, to the lower left of the center of the pixel (0,0), three processing areas can be set with the pixels (0,-1), (-1,-1), and (-1,0) as neighboring pixels close to the reference point of the superimposed precision inspection mark AM_F as their centers, respectively.

[0057] Next, in step S2010, the phase of the moire signal of each of the four processing regions AM_FR1 to AM_FR4 of the set superimposed precise inspection mark AM_F is detected, and the relative position between the original M and the substrate W is calculated. Then, in step S2012, it is determined whether processing of all of the four processing regions AM_FR1 to AM_FR4 of the four superimposed precise inspection marks AM_F defined above has been completed. If the result of the determination in step S2012 is NO, the process returns to step S2010 after changing the processing area in step S2014, and performs the moire phase detection process. If the result of the determination in step S2012 is YES, the process proceeds to step S2016.

[0058] In step S2016, the processing results of all processing areas AM_FR1 to AM_FR4 are statistically processed to calculate the final relative positions of the original M and the substrate W. The statistical processing uses a weighted average with weights according to the distances between the reference point AM_FC of the superimposed inspection mark AM_F and the centers (0,0), (0,1), (1,1), and (1,0) of the four processing areas, but is not limited to this and may also be a simple average or an interpolation process.

[0059] Thus, the statistical processing in this embodiment includes a weighted average, with the weight being determined based on the distance between the reference point of the alignment mark and the central pixels of the multiple processing regions.

[0060] Here, step S2016 functions as a second processing step (second processing unit) that calculates the position of the alignment mark based on the processing area set by the first processing step. In this embodiment, the processing area set by the first processing step as described above is shifted in pixel units of the image sensor, and the second processing step is performed using the multiple processing areas set by shifting them.

[0061] That is, in this embodiment, a second processing step is performed using multiple processing areas that are set in a shifted manner, and the position of the alignment mark is measured, and the final position of the alignment mark is calculated by statistically processing the results of the multiple position measurements obtained.

[0062] In step S2016, once the final relative position of the original M and the substrate W has been calculated, in step S1016, the difference in shot shape between the original M and the substrate W (coordinates, rotation, magnification, base component, etc.) is measured based on the measurement results of the relative position of the alignment mark.

[0063] Furthermore, in step S1016, in addition to the alignment, the shape of the original M is corrected by the original shape correcting mechanism 140 to match the shot shape of the substrate W, if necessary.

[0064] In step S1018, it is determined whether the shot shape difference between the original M and the substrate W is equal to or smaller than the tolerance. This is because, when shape correction is performed by the original shape correction mechanism 140, a correction error may remain in the shape correction of the original M due to a driving error of the original shape correction mechanism 140 or the like.

[0065] If it is greater than the tolerance, the process returns to step S1014, where measurement is performed again with the alignment scope 172, and the original shape is corrected until the difference in the shot shape between the original M and the substrate W is determined to be equal to or less than the predetermined tolerance in step S1018.

[0066] If it is determined in step S1018 that the residual is equal to or less than the tolerance, curing of the resin is started in step S1020. That is, the exposure mechanism 120 is used to irradiate the resin with ultraviolet light through the original M, thereby starting curing of the resin.

[0067] When the curing is completed, in step S1022, the original M is lifted by the original operating mechanism 130 to separate the original M from the cured resin. At this time, instead of driving the original M, the substrate W may be lowered.

[0068] In step S1024, it is determined whether imprinting has been completed for all shot areas on the substrate. If the determination in step S1024 is NO, that is, if there are any shot areas on which imprinting has not been performed, the process returns to step S1008, and the above process is repeated for the next shot area.

[0069] On the other hand, if the answer is YES in step S1024, that is, if it is determined that imprinting has been completed for all shot areas, then in step S1026, the substrate W is unloaded from the substrate chuck 162 and collected by a transport mechanism (not shown).

[0070] In the above embodiment, four processing regions are defined with the neighboring pixel of the reference point of the superimposed precise inspection mark AM_F as the center in step S2008 of Fig. 5. However, a tolerance may be set for the distance between the reference point of the superimposed precise inspection mark AM_F and the center of the nearest pixel, and if the distance is equal to or less than the tolerance, only one processing region with the pixel as the center may be set. In this case, the loop of steps S2012 to S2014 is not performed, so that the processing time can be shortened.

[0071] In addition, the statistical processing is not limited to four processing areas centered on four pixels near the reference point, but may be performed on nine processing areas centered on, for example, nine pixels near the reference point. In step S2006, when the reference point of the superimposed precision inspection mark AM_F is set, the position of the reference point of the superimposed precision inspection mark AM_F on the image sensor is set based on the rough inspection mark. However, the reference point may be set based on the outer shape of the precision inspection mark, for example.

[0072] In addition, in the above embodiment, the processing of the precision inspection mark involves processing the moire pattern created by overlapping the precision inspection mark AMM_F of the original M and the precision inspection mark AMW_F of the substrate W, but it is not limited to the moire pattern and may be any pattern that processes a single alignment mark of the original M or the substrate W.

[0073] Also, in step S1018, it is described that the process proceeds to the next step if the shot shape difference between the original M and the substrate W is within the tolerance, but even if it is not within the tolerance, the process may proceed to the next step when a preset elapsed time has elapsed since the start of alignment.

[0074] In other words, if the distance between the reference point of the alignment mark and the pixel center of the pixel of the image sensor closest to the reference point is less than a predetermined value, the second processing step is performed based on the processing area set in the first processing step, and it is not necessary to perform the second processing step using multiple processing areas.

[0075] In the above embodiment, the second process is performed using multiple processing areas to measure the alignment mark positions, and the final alignment mark positions are calculated by statistically processing the multiple position measurement results obtained. However, it is also possible to statistically process images from multiple processing areas, perform the second process using the statistically processed images to measure the alignment mark positions, and calculate the final alignment mark positions.

[0076] As described above, the present embodiment has been described taking as an example an imprint apparatus using die-by-die alignment, that is, an imprint apparatus including an imprint unit that uses the position measurement method of the embodiment to align a mold and a substrate and to form a pattern on the surface of the substrate by bringing the pattern of the mold into contact with resin on the surface of the substrate.

[0077] However, the present invention is also applicable to semiconductor exposure apparatuses (semiconductor manufacturing apparatuses) such as steppers and scanners, and to global alignment. That is, the position measurement method of the present embodiment can be used to align a mold and a substrate, and can also be applied to a semiconductor manufacturing apparatus having a pattern forming unit that forms a pattern on the surface of the substrate using the mold.

[0078] <Embodiment 2> By using the position measuring apparatus and the position measuring method according to the first embodiment in a lithography apparatus such as an imprint apparatus, the productivity and quality can be improved when manufacturing articles such as microdevices such as semiconductor devices and elements having fine structures.

[0079] A method for manufacturing a device (such as a semiconductor device, a magnetic storage medium, or a liquid crystal display element) as an article will be described. Such a manufacturing method may include a pattern formation step of forming a mold pattern on a surface of a substrate (such as a wafer, a glass plate, or a film-like substrate) using a lithography apparatus.

[0080] Here, the step of transferring the pattern of the mold may include a pattern forming step of forming a flat pattern. In addition, the substrate is not limited to a single base material and may include a multi-layer structure. Alternatively, the step of transferring the pattern may include a pattern forming step of exposing a photosensitive body on the substrate using a lithography device.

[0081] The manufacturing method further includes a step of processing the substrate before or after the pattern forming step, i.e., a manufacturing method of an article including an alignment step of aligning the mold and the substrate using the position measurement method in embodiment 1, a pattern forming step of forming a pattern on the surface of the substrate using the mold, and a processing step of processing the substrate to manufacture the article.

[0082] For example, the processing step may include a step of removing a residual film of the pattern and a developing step, and may also include well-known manufacturing steps such as a step of etching the substrate using the pattern as a mask, a step of cutting out chips from the substrate (dicing), a step of placing the chips on a frame and electrically connecting them (bonding), and a step of sealing with resin (molding).

[0083] A manufacturing method of an article in a lithography apparatus such as an imprint apparatus using the position measurement apparatus or position measurement method of the present embodiment has higher measurement accuracy than conventional methods, and is therefore advantageous in at least one of the performance, quality, productivity, and production costs of the article.

[0084] Although the present invention has been described in detail above based on the preferred embodiments, the present invention is not limited to the above-mentioned embodiments, and various modifications and combinations of the above-mentioned embodiments are possible based on the spirit of the present invention, and are not excluded from the scope of the present invention. The present invention includes the following combinations.

[0085] (Method 1) A position measurement method comprising an imaging element for imaging an alignment mark, a first processing step for setting a processing area on the imaging element for imaging the alignment mark and performing position measurement processing, and a second processing step for calculating the position of the alignment mark based on the processing area set by the first processing step, characterized in that the processing area set by the first processing step is shifted in pixel units of the imaging element, and the second processing step is performed using the multiple processing areas set by shifting, thereby calculating the final position of the alignment mark.

[0086] (Method 2) A position measurement method described in Method 1, characterized in that in the first processing step, a reference point of the alignment mark is set, and the processing area is set centered on the pixel of the imaging element that is closest to the reference point.

[0087] (Method 3) A position measurement method described in Method 1 or 2, characterized in that the second processing step is carried out using a plurality of processing areas set at different positions, and the position of the alignment mark is measured, and the final position of the alignment mark is calculated by statistically processing the obtained results of the plurality of position measurements.

[0088] (Method 4) A position measurement method described in Method 3, characterized in that the statistical processing includes a weighted average, and the weight is determined based on the distance between a reference point of the alignment mark and central pixels of multiple of the processing areas.

[0089] (Method 5) A position measurement method described in Method 4, characterized in that when the distance between the reference point of the alignment mark and the center of the pixel of the imaging element that is closest to the reference point is equal to or less than a predetermined value, the second processing step is performed based on the processing area set in the first processing step, and the second processing step using a plurality of the processing areas is not performed.

[0090] (Method 6) A method for manufacturing an article, comprising: an alignment step of aligning a mold and a substrate using the position measurement method according to any one of Methods 1 to 5; a pattern formation step of forming a pattern on a surface of the substrate using the mold; and a processing step of processing the substrate to manufacture the article.

[0091] (Configuration 1) A first processing unit includes an image sensor that captures an image of an alignment mark, and captures the image of the alignment mark and sets a processing area on the image sensor for performing a position measurement process; and a second processing unit that calculates the position of the alignment mark based on the processing area set by the first processing unit, wherein the second processing unit shifts the processing area set by the first processing unit in pixel units of the imaging element, and calculates the final position of the alignment mark using the multiple processing areas that are shifted.

[0092] (Configuration 2) A semiconductor manufacturing apparatus characterized by having a pattern forming section that aligns a mold and a substrate using the position measurement method described in any one of Methods 1 to 5, and forms a pattern on a surface of the substrate using the mold.

[0093] (Configuration 3) An imprinting apparatus comprising: an imprinting unit that uses a position measurement method described in any one of Methods 1 to 5 to align a mold and a substrate, and forms the pattern on the surface of the substrate by contacting a pattern of the mold with a resin on the surface of the substrate.

[0094] In order to realize a part or all of the control in the above-described embodiment, a computer program for realizing the functions of the above-described embodiment may be supplied to an apparatus, a system, etc. via a network or various storage media. Then, a computer (or a CPU, MPU, etc.) in the apparatus, system, etc. may read and execute the program. In this case, the program and the storage medium storing the program constitute the present invention. [Explanation of symbols]

[0095] 100: Imprint device 120: Exposure mechanism 140:Original shape correction mechanism 150: Alignment lighting mechanism 160: Circuit board drive unit 170: Alignment mechanism M:Original version R: Resin W: Substrate

Claims

1. A first processing step includes setting a processing area on the image sensor for imaging alignment marks and performing position measurement processing by imaging the alignment marks, A position measurement method comprising a second processing step of calculating the position of the alignment mark based on the processing area set by the first processing step, A position measurement method characterized by calculating the position of the alignment mark using a plurality of processing regions set by shifting the processing regions relative to each pixel of the image sensor.

2. The position measurement method according to claim 1, characterized in that, in the first processing step, a reference point of the alignment mark is set, and the processing area is set centered on the pixel of the image sensor closest to the reference point.

3. The position measurement method according to claim 1, characterized in that the second processing step is performed using a plurality of processing regions set with a staggered configuration to measure the position of the alignment mark, and the position of the alignment mark is calculated by statistically processing the results of the plurality of position measurements obtained.

4. The position measurement method according to claim 3, characterized in that the statistical processing includes a weighted average, and the weights are determined based on the distance between the reference point of the alignment mark and the central pixels of the plurality of processing regions.

5. The position measurement method according to claim 4, characterized in that if the distance between the reference point of the alignment mark and the center of the image sensor pixel closest to the reference point is less than or equal to a predetermined value, the second processing step is performed based on the processing area set in the first processing step, and the second processing step using a plurality of processing areas is not performed.

6. An alignment step of aligning a mold and a substrate using the position measurement method described in any one of claims 1 to 5, A pattern forming step of forming a pattern on the surface of the substrate using the mold, A method for manufacturing an article, comprising a processing step of processing the substrate to manufacture an article.

7. The system includes an image sensor for capturing alignment marks, and a processing area is set on the image sensor for capturing the alignment marks and performing position measurement processing. The system includes a processing unit that calculates the position of the alignment marks based on the set processing area, The position measuring device is characterized in that the processing unit calculates the position of the alignment mark using a plurality of processing regions set by shifting the processing regions relative to each other by one pixel unit of the image sensor.

8. A position measuring device according to claim 7, A semiconductor manufacturing apparatus characterized by having a pattern forming unit that aligns a mold and a substrate using the position measuring device and forms a pattern on the surface of the substrate using the mold.

9. The semiconductor manufacturing apparatus according to claim 8, characterized in that the semiconductor manufacturing apparatus is an imprint apparatus that forms the pattern on the surface of the substrate by bringing the pattern of the mold into contact with the resin on the surface of the substrate.

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