Adhesive film

By using double-sided adhesive in the semiconductor manufacturing process, combining high hardness and soft hardenable resin, the problem of temporary fixation and peeling of semiconductor sheets with uneven surfaces at high temperatures is solved, and good thermal stability and easy peeling are achieved.

JP2025042989APending Publication Date: 2025-03-28SEKISUI CHEMICAL CO LTD
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Patent Information

Application Number
JP2023150244
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-15
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

The prior art is difficult to effectively remove temporary fixing materials with uneven surfaces used in semiconductor manufacturing under high temperature conditions, especially when encountering silicon single wafers with conical undulations, it is difficult to completely peel off.

Method used

Double-sided adhesive is used. The glue layer on the first side contains a hardenable resin with high hardness, and the glue layer on the second side contains a softer hardenable resin. By adjusting the hardness and composition of these resins, the glue layer has good thermal stability and peelability at high temperatures.

Benefits of technology

Effective temporary fixation and subsequent easy peeling of semiconductor sheets with uneven surfaces under high temperature conditions are achieved, and the glue layer residue and damage is avoided.

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Abstract

To provide an adhesive film which has excellent heat resistance and can be easily re-peeled off even from an adherend having an uneven surface during peeling.SOLUTION: There is provided an adhesive film having a first adhesive layer on one surface and a second adhesive layer on the other surface, wherein the hardness of the second adhesive layer at a depth of 1000 nm measured by the nanoindentation method is less than 340 kPa and the absolute value of the difference obtained by subtracting the hardness of the second adhesive layer at a depth of 1000 nm measured by the nanoindentation method from the hardness of the first adhesive layer at a depth of 1000 nm measured by the nanoindentation method is larger than 35 kPa.SELECTED DRAWING: None
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