Electronic device

Abstract

To solve a problem that, when noises superimposed on two detection signals constituting a differential signal are of different magnitudes, a detected physical amount easily causes an error.SOLUTION: An electronic device includes: a sensor having a first detection electrode that outputs a first detection signal and a second detection electrode that outputs a second detection signal; and a package that accommodates the sensor. The package includes: a first interconnection connected to the first detection electrode; a second interconnection connected to the second detection electrode; a third interconnection overlapped with the first interconnection and the second interconnection in a plan view and having an electric potential different from those of the first interconnection and the second interconnection; and a capacity adjustment part provided so that a different between first parasitic capacitance between the first interconnection and the third interconnection and second parasitic capacitance between the second interconnection and the third interconnection is reduced.SELECTED DRAWING: Figure 14

Description

[Technical field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] Patent Document 1 discloses, as an example of an electronic device, a composite sensor that houses an angular velocity sensor and an acceleration sensor in one package. Angular velocity and acceleration are physical quantities. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-40619 A Summary of the Invention [Problem to be solved by the invention]

[0004] In some cases, a physical quantity is detected based on the difference between two detection signals that constitute a differential signal. If the noises superimposed on the two detection signals are of different magnitudes, noise-induced errors are likely to occur in the detected physical quantity. [Means for solving the problem]

[0005] The electronic device comprises a sensor having a first detection electrode that outputs a first detection signal and a second detection electrode that outputs a second detection signal, and a package that houses the sensor, wherein the first detection signal and the second detection signal form a differential signal with respect to each other, and the package has a first wiring electrically connected to the first detection electrode, a second wiring electrically connected to the second detection electrode, a third wiring that overlaps with the first wiring and the second wiring in a planar view and has a different potential from the first wiring and the second wiring, and a capacitance adjustment unit arranged to reduce a difference between a first parasitic capacitance between the first wiring and the third wiring and a second parasitic capacitance between the second wiring and the third wiring. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a perspective view showing an electronic device. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. 4 is a perspective view showing the case and a third electronic component. [Figure 6] FIG. 4 is a perspective view showing a case, a second electronic component, and a third electronic component. [Figure 7] FIG. 2 is an exploded perspective view showing a first electronic component. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. [Figure 11] FIG. [Figure 12] FIG. 4 is a plan view illustrating a power supply wiring, a first detection pad, and a second detection pad. [Figure 13] FIG. 4 is a plan view illustrating a power supply wiring, a first detection pad, and a second detection pad. [Figure 14] FIG. 4 is a plan view illustrating an example of a capacitance adjustment unit. [Figure 15] 15 is a cross-sectional view taken along line AA in FIG. 14 . [Figure 16] FIG. 4 is a plan view illustrating an example of a capacitance adjustment unit. [Figure 17] FIG. 4 is a cross-sectional view illustrating an example of a capacitance adjustment portion. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] As shown in FIG. 1, the electronic device 1 has a case 2 and a lid 3. The lid 3 is stacked on the case 2. The case 2 is an example of a package. In FIG. 1, an X-axis, a Y-axis, and a Z-axis are indicated. The X-axis, the Y-axis, and the Z-axis are mutually orthogonal coordinate axes. The X-axis, the Y-axis, and the Z-axis are also indicated as necessary for the figures shown in FIG. 1 and subsequent figures. In this case, the X-axis, the Y-axis, and the Z-axis in each figure correspond to the X-axis, the Y-axis, and the Z-axis in FIG. 1. FIG. 1 shows a state in which the electronic device 1 is placed on an XY plane defined by the X-axis and the Y-axis.

[0008] In the following, when the X-axis, Y-axis, and Z-axis are indicated in the diagrams or explanations showing components or units of the electronic device 1, they refer to the X-axis, Y-axis, and Z-axis in a state where the components or units are incorporated into the electronic device 1. The X-axis, Y-axis, and Z-axis are each indicated with an arrow. For each of the X-axis, Y-axis, and Z-axis, the direction of the arrow indicates the + (positive) direction, and the direction opposite to the arrow indicates the - (negative) direction. The Z-axis is an axis perpendicular to the XY plane. A plan view is a view of the electronic device 1 as viewed in the -Z direction.

[0009] 2, the electronic device 1 further includes a first electronic component 5, a second electronic component 6, and a third electronic component 7. The first electronic component 5, the second electronic component 6, and the third electronic component 7 are housed inside a case 2. A concave cavity 8 is formed in the case 2. The first electronic component 5, the second electronic component 6, and the third electronic component 7 are housed in the cavity 8 of the case 2.

[0010] The case 2 can be formed, for example, by firing a ceramic substrate. The cavity 8 can be formed by stacking a plurality of ceramic substrates. The lid 3 can be made of, for example, various metal plates. With the first electronic component 5, the second electronic component 6, and the third electronic component 7 housed in the cavity 8 of the case 2, the case 2 is closed by the lid 3. The case 2 and the lid 3 are joined to each other, for example, by seam welding.

[0011] The first electronic component 5 and the second electronic component 6 are each a sensor that detects the motion of an object on which the electronic device 1 is installed. The first electronic component 5 detects the angular velocity of the object. The second electronic component 6 detects the acceleration of the object. The third electronic component 7 is a circuit board that controls the first electronic component 5 and the second electronic component 6. The third electronic component 7 processes the detection signals output from the first electronic component 5 and the second electronic component 6. The third electronic component 7 controls signals for driving the first electronic component 5 and the second electronic component 6.

[0012] The first electronic component 5 detects the angular velocity of the object around the Z-axis. In this embodiment, the first electronic component 5 is a gyro sensor. The second electronic component 6 includes an acceleration sensor. The acceleration sensor detects the acceleration along the Y-axis of the object. For example, a capacitance type acceleration sensor can be adopted as the acceleration sensor. Furthermore, for example, a quartz acceleration sensor can be adopted as the acceleration sensor. The acceleration sensor may be one that detects the acceleration along the X-axis of the object. The acceleration sensor may be one that detects the acceleration along the Z-axis of the object. The first electronic component 5 is an example of a sensor. The second electronic component 6 is an example of a second sensor.

[0013] The second electronic component 6 may include two acceleration sensors. Both of the two acceleration sensors may be capacitive acceleration sensors. Both of the two acceleration sensors may be quartz acceleration sensors. The two acceleration sensors may be a capacitive acceleration sensor and a quartz acceleration sensor. The two acceleration sensors may be an acceleration sensor that detects acceleration along the Y axis and an acceleration sensor that detects acceleration along the X axis. The two acceleration sensors may be an acceleration sensor that detects acceleration along the Y axis and an acceleration sensor that detects acceleration along the Z axis. The two acceleration sensors may be an acceleration sensor that detects acceleration along the X axis and an acceleration sensor that detects acceleration along the Z axis.

[0014] The second electronic component 6 may include three acceleration sensors. All three acceleration sensors may be capacitive acceleration sensors. All three acceleration sensors may be quartz acceleration sensors. The three acceleration sensors may be a mixture of capacitive acceleration sensors and quartz acceleration sensors. The three acceleration sensors are an acceleration sensor that detects acceleration along the Y axis, an acceleration sensor that detects acceleration along the X axis, and an acceleration sensor that detects acceleration along the Z axis.

[0015] The third electronic component 7 is formed of, for example, an IC (Integrated Circuit). The third electronic component 7 processes various signals output from the first electronic component 5 and the second electronic component 6. The third electronic component 7 includes various circuits for processing various signals output from the first electronic component 5 and the second electronic component 6. The third electronic component 7 has various circuit elements formed therein that constitute various circuits.

[0016] As shown in FIG. 3, the case 2 has a bottom surface 11, a first step 12, and a second step 13 inside the cavity 8. The bottom surface 11 constitutes the bottom of the cavity 8. The first step 12 is located in the +Z direction of the bottom surface 11. The first step 12 surrounds the bottom surface 11 along the inner circumference of the cavity 8 in a plan view. The first step 12 is formed in a frame shape that surrounds the bottom surface 11 of the cavity 8 in a plan view. The second step 13 is located in the +Z direction of the first step 12.

[0017] As shown in FIG. 4, the second step 13 is provided at least in two places facing each other across the bottom surface 11 in a plan view. In FIG. 4, the second step 13 is hatched to clearly show the configuration. Except for the place where the second step 13 is provided, the first step 12 protrudes further inward into the cavity 8 than the second step 13. When the case 2 is viewed from above, the bottom surface 11, the first step 12, and the second step 13 can be seen. In a plan view, the first step 12 is located outside the bottom surface 11. The second step 13 is provided at a position overlapping the first step 12 in a plan view. The second step 13 overlaps a part of the first step 12 in a plan view.

[0018] Various electrodes and wiring are formed on the case 2. A power supply wiring 15 is formed on the bottom surface 11. Various terminal electrodes (not shown) are formed on the back surface of the case 2. The power supply wiring 15 is electrically connected to terminal electrodes formed on the back surface of the case 2 via a wiring pattern (not shown). A driving voltage for driving the electronic device 1 is applied to the power supply wiring 15. In addition to the terminal electrodes connected to the power supply wiring 15, terminal electrodes for outputting detection signals output from the first electronic component 5 and the second electronic component 6 are also formed on the back surface of the case 2. The terminal electrodes formed on the back surface of the case 2 include a ground terminal that is grounded to a reference potential.

[0019] As shown in FIG. 3, a plurality of first electrode pads 17 are formed on the first step 12. The third electronic component 7 is electrically connected to the plurality of first electrode pads 17. A plurality of sensor wirings 18 are formed on the second step 13. The first electronic component 5 is electrically connected to the plurality of sensor wirings 18. Some of the plurality of first electrode pads 17 are electrically connected to some of the plurality of sensor wirings 18 via a wiring pattern (not shown). Various electrical signals are transmitted and received between the first electronic component 5 and the third electronic component 7 via some of the plurality of first electrode pads 17 and some of the plurality of sensor wirings 18.

[0020] As shown in FIG. 5, the third electronic component 7 is placed on the bottom surface 11 of the cavity 8. The third electronic component 7 is located in the +Z direction of the power supply wiring 15. An insulating layer (not shown) is interposed between the power supply wiring 15 and the third electronic component 7. The third electronic component 7 is electrically connected to the first electrode pad 17 by a plurality of wires 21. As shown in FIG. 6, the second electronic component 6 is placed in the +Z direction of the third electronic component 7. The second electronic component 6 is placed on the third electronic component 7. The second electronic component 6 is electrically connected to the third electronic component 7 by a plurality of wires 21.

[0021] As shown in FIG. 7, the first electronic component 5 has a sensor element 25 and a support portion 26. The sensor element 25 has a vibrating piece 31. The vibrating piece 31 is formed from a quartz substrate. The vibrating piece 31 is formed from, for example, a Z-cut quartz substrate. In this embodiment, the vibrating piece 31 has a double T-shaped structure. The support portion 26 has an insulating member 32 and a plurality of leads 33. The plurality of leads 33 include a first driving lead 33A, a second driving lead 33B, a first detection lead 33C, a second detection lead 33D, a first ground lead 33E, and a second ground lead 33F.

[0022] The insulating member 32 is formed of, for example, polyimide resin. The insulating member 32 is formed in a sheet shape. A metal wiring pattern (not shown) is printed on the insulating member 32. The multiple leads 33 are electrically connected to the wiring pattern of the insulating member 32. The insulating member 32 has a device hole 34 formed therein. The multiple leads 33 extend from the insulating member 32 toward the inside of the device hole 34 in a plan view. The multiple leads 33 are bent. The multiple leads 33 protrude in the +Z direction from the insulating member 32 toward the inside of the device hole 34. The support portion 26 is a TAB (Tape Automated Bonding) tape. The multiple leads 33 are spaced apart from each other. The multiple leads 33 each have an end 35 located inside the device hole 34 in a plan view. The end 35 is located in the +Z direction from the insulating member 32. The sensor element 25 is electrically connected to the end 35 of the multiple leads 33.

[0023] As shown in FIG. 8, the sensor element 25 has a first driving unit 41, a second driving unit 42, a detection unit 43, a first connecting arm 44, and a second connecting arm 45. The first driving unit 41 includes a first driving arm 41A and a second driving arm 41B. The second driving unit 42 includes a third driving arm 42A and a fourth driving arm 42B. The detection unit 43 includes a base 46, a first detection arm 43A, and a second detection arm 43B. The first detection arm 43A extends from the base 46 in the +X direction. The second detection arm 43B extends from the base 46 in the -X direction. The first driving unit 41 is located in the +Y direction of the detection unit 43. The second driving unit 42 is located in the -Y direction of the detection unit 43.

[0024] The first driving unit 41 is connected to the base 46 by the first connecting arm 44. The second driving unit 42 is connected to the base 46 by the second connecting arm 45. The first connecting arm 44 extends from the base 46 in the +Y direction. The second connecting arm 45 extends from the base 46 in the -Y direction. The first driving arm 41A extends from the first connecting arm 44 in the +X direction. The second driving arm 41B extends from the first connecting arm 44 in the -X direction. The first driving unit 41 can also be considered to be divided into the first driving arm 41A and the second driving arm 41B with the first connecting arm 44 as the boundary. The third driving arm 42A extends from the second connecting arm 45 in the +X direction. The fourth driving arm 42B extends from the second connecting arm 45 in the -X direction. The second drive portion 42 can also be considered to be divided into a third drive arm 42A and a fourth drive arm 42B, with the second connecting arm 45 as the boundary.

[0025] The first driving section 41 has a first driving electrode 51 and a second driving electrode 52. The second driving section 42 also has a first driving electrode 51 and a second driving electrode 52. The first driving electrode 51 of the first driving section 41 and the first driving electrode 51 of the second driving section 42 are electrically connected to each other. The first driving electrode 51 is an electrode common to the first driving section 41 and the second driving section 42. The second driving electrode 52 of the first driving section 41 and the second driving section 42 are electrically connected to each other. The second driving electrode 52 is an electrode common to the first driving section 41 and the second driving section 42.

[0026] The detection unit 43 has a first detection electrode 53, a second detection electrode 54, and a common electrode 55. The first detection electrode 53 is provided on the first detection arm 43A. The second detection electrode 54 is provided on the second detection arm 43B. The common electrode 55 is provided on the first detection arm 43A and the second detection arm 43B. The common electrode 55 of the first detection arm 43A and the common electrode 55 of the second detection arm 43B are electrically connected to each other. The first detection electrode 53 is provided on a surface of the first detection arm 43A facing the +Z direction. The surface facing the +Z direction is also called the main surface 56 of the vibrating element 31. The second detection electrode 54 is provided on the main surface 56 of the second detection arm 43B. The common electrode 55 of the first detection arm 43A is provided on a side surface of the first detection arm 43A facing the +Y direction. The common electrode 55 of the second detection arm 43B is provided on a side surface of the second detection arm 43B facing the +Y direction. The common electrode 55 is grounded to the ground, which is the reference potential.

[0027] The first drive electrode 51 is provided on the first drive arm 41A, the second drive arm 41B, the third drive arm 42A, and the fourth drive arm 42B. The second drive electrode 52 is also provided on the first drive arm 41A, the second drive arm 41B, the third drive arm 42A, and the fourth drive arm 42B. The first drive electrode 51 of the first drive arm 41A and the first drive electrode 51 of the second drive arm 41B are both provided on the main surface 56. The second drive electrode 52 of the first drive arm 41A and the second drive electrode 52 of the second drive arm 41B are both provided on the side surface facing the +Y direction.

[0028] The first drive electrode 51 of the third drive arm 42A and the first drive electrode 51 of the fourth drive arm 42B are both provided on the side surface facing the -Y direction. The second drive electrode 52 of the third drive arm 42A and the second drive electrode 52 of the fourth drive arm 42B are both provided on the main surface 56. An AC excitation signal is applied between the first drive electrode 51 and the second drive electrode 52. The arrangement of the first drive electrode 51 and the arrangement of the second drive electrode 52 are reversed between the first drive unit 41 and the second drive unit 42.

[0029] Due to this electrode arrangement, the first driving unit 41 and the second driving unit 42 vibrate line-symmetrically with respect to an axis L1 along the X-axis passing through the detection unit 43, as shown in Fig. 9. The first driving unit 41 and the second driving unit 42 vibrate line-symmetrically with respect to the axis L1 means that the first driving arm 41A and the third driving arm 42A move toward and away from each other. The first driving unit 41 and the second driving unit 42 vibrate line-symmetrically with respect to the axis L1 means that the second driving arm 41B and the fourth driving arm 42B move toward and away from each other.

[0030] When the first driver 41 and the second driver 42 vibrate, an angular velocity around the Z-axis is generated in the sensor element 25, and a Coriolis force acts on the first driver 41 and the second driver 42. The first detection arm 43A and the second detection arm 43B vibrate due to the Coriolis force acting on the first driver 41 and the second driver 42. The vibration of the first detection arm 43A and the second detection arm 43B causes detection signals to be output from the first detection electrode 53 and the second detection electrode 54, respectively. The detection signal output from the first detection electrode 53 and the detection signal output from the second detection electrode 54 are in opposite phase to each other.

[0031] The detection signal output from the first detection electrode 53 is called the first detection signal. The detection signal output from the second detection electrode 54 is called the second detection signal. The first detection signal and the second detection signal form a differential signal. The angular velocity is detected based on a differential amplified signal, which is a signal obtained by amplifying the difference between the first detection signal and the second detection signal. When an angular velocity around the Z axis occurs in the sensor element 25, the first detection signal and the second detection signal are in opposite phase to each other. At this time, the differential amplified signal of the first detection signal and the second detection signal is amplified twice as much as the first detection signal and the second detection signal. The angular velocity is detected based on this differential amplified signal.

[0032] When no angular velocity is generated in the sensor element 25, that is, when the sensor element 25 is in a stationary state, the first detection signal and the second detection signal are both at the reference potential. When the sensor element 25 is in a stationary state, a differentially amplified signal of the first detection signal and the second detection signal is not output. Therefore, no angular velocity is detected. When the sensor element 25 moves linearly along the Y axis, the first detection signal and the second detection signal are in phase with each other. Therefore, the first detection signal and the second detection signal are cancelled out by the differential amplification. Therefore, no angular velocity is detected.

[0033] 10, the support portion 26 has a first driving terminal 61, a second driving terminal 62, a first detection terminal 63, a second detection terminal 64, a first ground terminal 65, and a second ground terminal 66. The first driving terminal 61, the second driving terminal 62, the first detection terminal 63, the second detection terminal 64, the first ground terminal 65, and the second ground terminal 66 are provided on a surface of the insulating member 32 facing the -Z direction. The first driving terminal 61, the second driving terminal 62, the first detection terminal 63, the second detection terminal 64, the first ground terminal 65, and the second ground terminal 66 are terminal electrodes formed on the insulating member 32.

[0034] The first driving terminal 61 is electrically connected to the first driving electrode 51 shown in FIG. 8 through the first driving lead 33A. The second driving terminal 62 is electrically connected to the second driving electrode 52 shown in FIG. 8 through the second driving lead 33B. The first detection terminal 63 is electrically connected to the first detection electrode 53 shown in FIG. 8 through the first detection lead 33C. The second detection terminal 64 is electrically connected to the second detection electrode 54 shown in FIG. 8 through the second detection lead 33D. The first ground terminal 65 is electrically connected to the common electrode 55 shown in FIG. 8 through the first ground lead 33E. The second ground terminal 66 is a spare terminal electrode. The second ground terminal 66 is grounded to the ground potential. The second ground terminal 66 may be electrically connected to the sensor element 25 through the second ground lead 33F.

[0035] A drive signal, which is an excitation signal, is applied from the third electronic component 7 to the first drive terminal 61 and the second drive terminal 62 shown in FIG. 10. The drive signal is applied from the first drive terminal 61 to the first drive electrode 51 via the first drive lead 33A. The drive signal is applied from the second drive terminal 62 to the second drive electrode 52 via the second drive lead 33B. The first detection signal output from the first detection electrode 53 is input to the third electronic component 7 via the first detection lead 33C and the first detection terminal 63. The second detection signal output from the second detection electrode 54 is input to the third electronic component 7 via the second detection lead 33D and the second detection terminal 64. The common electrode 55 is grounded to the ground potential via the first ground lead 33E and the first ground terminal 65.

[0036] 11, a first drive pad 71, a second drive pad 72, a first detection pad 73, a second detection pad 74, a first ground pad 75, and a second ground pad 76 are formed on the second step 13 of the case 2. The first drive pad 71, the second drive pad 72, the first detection pad 73, the second detection pad 74, the first ground pad 75, and the second ground pad 76 are formed on a surface of the second step 13 facing the +Z direction. The first drive pad 71, the second drive pad 72, the first detection pad 73, the second detection pad 74, the first ground pad 75, and the second ground pad 76 each extend along the XY plane. The first drive pad 71, the second drive pad 72, the first detection pad 73, the second detection pad 74, the first ground pad 75, and the second ground pad 76 are each part of the sensor wiring 18 shown in FIG.

[0037] The first electronic component 5 is mounted on a first drive pad 71, a second drive pad 72, a first detection pad 73, a second detection pad 74, a first ground pad 75, and a second ground pad 76 shown in FIG. 11. The first drive terminal 61 shown in FIG. 10 is electrically connected to the first drive pad 71 by a bonding material such as solder. The second drive terminal 62 is electrically connected to the second drive pad 72 by a bonding material such as solder. The first detection terminal 63 is electrically connected to the first detection pad 73 by a bonding material such as solder. The second detection terminal 64 is electrically connected to the second detection pad 74 by a bonding material such as solder. The first ground terminal 65 is electrically connected to the first ground pad 75 by a bonding material such as solder. The second ground terminal 66 is electrically connected to the second ground pad 76 by a bonding material such as solder.

[0038] In this embodiment, in a cross-sectional view when the electronic device 1 is cut along the XZ plane, the second electronic component 6 and the third electronic component 7 are located between the power supply wiring 15 and the first electronic component 5 shown in Fig. 11. According to this electronic device 1, it is easier to reduce the size of the electronic device 1 compared to a configuration in which the first electronic component 5, the second electronic component 6, and the third electronic component 7 are arranged in a plane.

[0039] The first detection pad 73 and the second detection pad 74 shown in FIG. 11 overlap the power supply wiring 15 in a plan view. A first parasitic capacitance occurs between the first detection pad 73 and the power supply wiring 15. A second parasitic capacitance occurs between the second detection pad 74 and the power supply wiring 15. The first parasitic capacitance is one of the factors that cause noise to occur in the first detection signal output from the first detection pad 73 to the third electronic component 7. The second parasitic capacitance is one of the factors that cause noise to occur in the second detection signal output from the second detection pad 74 to the third electronic component 7. The first detection pad 73 is an example of a first wiring. The second detection pad 74 is an example of a second wiring. The power supply wiring 15 is an example of a third wiring. In this embodiment, the distance along the Z axis between the power supply wiring 15 and the first detection pad 73 is equal to the distance along the Z axis between the power supply wiring 15 and the second detection pad 74.

[0040] As shown in FIG. 12, when the first area SA and the second area SB are equivalent to each other, the first parasitic capacitance and the second parasitic capacitance are equivalent to each other. The first area SA is an area where the first detection pad 73 and the power supply wiring 15 overlap in a plan view. The second area SB is an area where the second detection pad 74 and the power supply wiring 15 overlap in a plan view. In the example shown in FIG. 12, both the first detection pad 73 and the second detection pad 74 are contained within the area of ​​the power supply wiring 15 in a plan view. Therefore, the first area SA is the same as the area of ​​the first detection pad 73. The second area SB is the same as the area of ​​the second detection pad 74. Noise may occur in the first detection signal due to the first parasitic capacitance. Noise may occur in the second detection signal due to the second parasitic capacitance. When the first area SA and the second area SB are equivalent to each other, the absolute value of the noise occurring in the first detection signal is equivalent to the absolute value of the noise occurring in the second detection signal.

[0041] As described above, in the electronic device 1, the angular velocity is detected based on the differentially amplified signal of the first detection signal and the second detection signal. When the first area SA and the second area SB are equivalent to each other, the noise occurring in the first detection signal and the noise occurring in the second detection signal are cancelled by the differentially amplified signal. When the first area SA and the second area SB are equivalent to each other, the error in the detection result by the first electronic component 5 is suppressed to a low level.

[0042] As shown in FIG. 13, when the area of ​​one of the first detection pad 73 and the second detection pad 74 is larger than the area of ​​the other in a plan view, the first parasitic capacitance and the second parasitic capacitance are different from each other. In the example shown in FIG. 13, the area of ​​the first detection pad 73 is larger than the area of ​​the second detection pad 74. In the example shown in FIG. 13, the first area SA is larger than the second area SB. When the first area SA is larger than the second area SB, the first parasitic capacitance is larger than the second parasitic capacitance. When the first area SA is larger than the second area SB, the absolute value of the noise generated in the first detection signal is larger than the absolute value of the noise generated in the second detection signal. When the first area SA is larger than the second area SB, the difference between the noise generated in the first detection signal and the noise generated in the second detection signal appears in the differential amplification signal. When the first area SA is larger than the second area SB, an error is likely to occur in the detection result by the electronic device 1.

[0043] As shown in FIG. 14, in this embodiment, a capacitance adjustment section 81 is provided. The capacitance adjustment section 81 is structured so as to reduce the difference between a first parasitic capacitance between the first detection pad 73 and the power supply wiring 15 and a second parasitic capacitance between the second detection pad 74 and the power supply wiring 15. The example of the capacitance adjustment section 81 shown in FIG. 14 is called a capacitance adjustment section 81A. The capacitance adjustment section 81A is structured such that the power supply wiring 15 is partially missing in an area overlapping one of the first detection pad 73 and the second detection pad 74, which has a larger area. In the example shown in FIG. 14, the capacitance adjustment section 81A is structured such that the power supply wiring 15 is missing in an island shape.

[0044] FIG. 15 is a cross-sectional view taken along line AA in FIG. 14. As shown in FIG. 15, the capacitance adjustment section 81A is also expressed as a non-electrode region in which the power supply wiring 15 is partially missing. The capacitance adjustment section 81A is not limited to a structure in which the power supply wiring 15 is missing in an island shape, and a structure in which the power supply wiring 15 is missing in a notch shape may also be adopted. The capacitance adjustment section 81A makes it easy to keep the difference between the first area SA and the second area SB low. The capacitance adjustment section 81A reduces the difference between the first parasitic capacitance and the second parasitic capacitance. The capacitance adjustment section 81A makes it easy to make the magnitudes of noise superimposed on the first detection signal and the second detection signal the same. The capacitance adjustment section 81A makes it easy to keep the noise generated in the differential amplification signal of the first detection signal and the second detection signal low. The capacitance adjustment section 81A makes it easy to keep the error of the detection result by the electronic device 1 low.

[0045] As shown in FIG. 16, a capacitance adjustment unit 81B may be used. The capacitance adjustment unit 81B has a structure in which a wiring area 82 is added to the first detection pad 73 or the second detection pad 74. In FIG. 16, the wiring area 82 is hatched to make the configuration easier to understand. In the example shown in FIG. 16, the capacitance adjustment unit 81B has a structure in which a wiring area 82 is added to the second detection pad 74. The capacitance adjustment unit 81B makes it easy to keep the difference between the first area SA and the second area SB low. The capacitance adjustment unit 81B reduces the difference between the first parasitic capacitance and the second parasitic capacitance. The capacitance adjustment unit 81B makes it easy to make the magnitudes of noise superimposed on the first detection signal and the second detection signal equal to each other. The capacitance adjustment unit 81B makes it easy to keep the noise generated in the differential amplification signal of the first detection signal and the second detection signal low. The capacitance adjustment unit 81B makes it easy to keep the error of the detection result by the electronic device 1 low.

[0046] As shown in FIG. 17, a capacitance adjustment section 81C may be employed. In the example shown in FIG. 17, the area of ​​the first detection pad 73 is larger than the area of ​​the second detection pad 74. Furthermore, in the example shown in FIG. 17, the first area SA is larger than the second area SB. The capacitance adjustment section 81C has a structure in which the distance D1 is larger than the distance D2. The distance D1 is the distance between the first detection pad 73 or the second detection pad 74, whichever has a larger area in a plan view, and the power supply wiring 15. The distance D2 is the distance between the other of the first detection pad 73 or the second detection pad 74 and the power supply wiring 15. In the example shown in FIG. 17, the distance D1 is the distance between the first detection pad 73 and the power supply wiring 15. In the example shown in FIG. 17, the distance D2 is the distance between the second detection pad 74 and the power supply wiring 15.

[0047] The capacitance adjustment unit 81C reduces the difference between the first parasitic capacitance and the second parasitic capacitance. The capacitance adjustment unit 81C makes it easy to make the magnitudes of noise superimposed on the first detection signal and the second detection signal equal to each other. The capacitance adjustment unit 81C makes it easy to keep noise generated in the differentially amplified signal of the first detection signal and the second detection signal low. The capacitance adjustment unit 81C makes it easy to keep errors in the detection result by the electronic device 1 low.

[0048] 14 and 16, the first detection pad 73 and the second detection pad 74 are each located within a region overlapping with the power supply wiring 15 in a plan view. However, at least one of the first detection pad 73 and the second detection pad 74 may protrude from the region overlapping with the power supply wiring 15 in a plan view. Even if at least one of the first detection pad 73 and the second detection pad 74 protrudes from the region overlapping with the power supply wiring 15 in a plan view, the difference between the first parasitic capacitance and the second parasitic capacitance can be reduced by the capacitance adjustment unit 81.

[0049] The first detection pad 73, the second detection pad 74, and the power supply wiring 15 may each have a hierarchical structure. The hierarchical structure is, for example, a structure in which the first detection pad 73 and the second detection pad 74 extend from the second stage 13 to the first stage 12 and the bottom surface 11 via via wiring or the like. The hierarchical structure also includes a structure in which the power supply wiring 15 extends from the bottom surface 11 to the first stage 12 and the second stage 13 via via wiring or the like. Even if the first detection pad 73, the second detection pad 74, and the power supply wiring 15 have a hierarchical structure, the difference between the first parasitic capacitance and the second parasitic capacitance can be reduced by the capacitance adjustment unit 81. [Explanation of symbols]

[0050] 1...electronic device, 2...case, 3...lid, 5...first electronic component, 6...second electronic component, 7...third electronic component, 8...cavity, 11...bottom surface, 12...first stage, 13...second stage, 15...power supply wiring, 17...first electrode pad, 18...sensor wiring, 21...wire, 25...sensor element, 26...support, 31...vibrator element, 32...insulating member, 33...lead, 33A...first drive lead, 33B...second drive lead, 33C...first detection lead, 33D...second detection lead, 33E...first ground lead, 33F...second ground lead, 34...device hole, 35...end, 41...first drive section, 41A...first drive arm, 41B...second drive arm, 42...second drive section, 42A...third drive arm, 42B...fourth drive arm, 43...detection section, 43A...first detection arm, 43B...second detection arm, 44...first connecting arm, 45...second connecting arm, 46...base, 51...first drive electrode, 52...second drive electrode, 53...first detection electrode, 54...second detection electrode, 55...common electrode, 56...main surface, 61...first drive terminal, 62...second drive terminal, 63...first detection terminal, 64...second detection terminal, 65...first ground terminal, 66...second ground Land terminal, 71...first drive pad, 72...second drive pad, 73...first detection pad, 74...second detection pad, 75...first ground pad, 76...second ground pad, 81...capacitance adjustment section, 81A...capacitance adjustment section, 81B...capacitance adjustment section, 81C...capacitance adjustment section, 82...wiring area, L1...axis, SA...first area, SB...second area, D1...distance, D2...distance.

Claims

1. A sensor including a first detection electrode that outputs a first detection signal and a second detection electrode that outputs a second detection signal, The package containing the aforementioned sensor, Includes, Based on the differential signal between the first detection signal and the second detection signal, a physical quantity is detected. The aforementioned package is A first wiring that is electrically connected to the first detection electrode, The second wiring is electrically connected to the second detection electrode, In a plan view, the third wiring overlaps with the first and second wirings and has a different potential than the first and second wirings. A capacitance adjustment unit is provided to reduce the difference between the first parasitic capacitance occurring between the first wiring and the third wiring and the second parasitic capacitance occurring between the second wiring and the third wiring. including, Electronic devices.

2. In Claim 1, In a plan view, the area of ​​one of the first wiring and the second wiring is larger than the area of ​​the other. The aforementioned capacity adjustment unit is In a plan view, in the region where one of the first and second wirings overlaps, The structure is such that the third wiring is partially missing. Electronic devices.

3. In Claim 1, The aforementioned capacity adjustment unit is The structure is such that a wiring area is added to the first wiring or the second wiring. Electronic devices.

4. In Claim 1, In a plan view, the area of ​​one of the first wiring and the second wiring is larger than the area of ​​the other. The aforementioned capacity adjustment unit is The distance between one of the first and second wirings and the third wiring is The structure is such that the distance between the other of the first and second wirings and the third wiring is greater than the distance between them. Electronic devices.

5. In Claim 1, Inside the aforementioned package, The second sensor, A circuit board that controls the aforementioned sensor and the second sensor, Furthermore, In a cross-sectional view, the second sensor and the circuit board are, The aforementioned sensor, The three wires mentioned above, Placed between, Electronic devices.

Images