Face-centered cubic structure metal plate and method for producing the same
The manufacturing of face-centered cubic metal plates with a {001} fiber texture near the surface addresses the challenge of achieving the required crystal orientation for specific applications, using techniques like shot peening and heat treatment to control the crystal orientation within a 50 μm depth from the surface.
Patent Information
- Application Number
- JP2023177940
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-10-15
- Publication Date
- 2025-04-25
AI Technical Summary
Existing methods struggle to achieve a {001} fiber texture near the surface of face-centered cubic metal plates, which is required for applications like aluminum thin films for electrolytic capacitors and aluminum plates for beverage cans.
A face-centered cubic metal plate is manufactured with a {001} fiber texture near the surface by orienting the crystal direction substantially parallel to the normal direction of the plate surface, using techniques such as shot peening and heat treatment to control the crystal orientation within a depth of 50 μm from the surface.
This approach allows for the accurate control of crystal orientation near the surface, achieving the desired {001} fiber texture which is essential for specific applications, without the need for complex rolling and heat treatment processes.
Smart Images
Figure 2025068193000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a face-centered cubic metal plate and a method for producing the same. [Background technology]
[0002] When shot peening is performed on a metal plate with a face-centered cubic structure, the crystal plane orientation of the material surface is oriented and distributed. For example, Non-Patent Document 1 states that when shot peening is performed on a pure Cu rolled plate with a face-centered cubic structure, the crystal lattice of Cu is <110> The direction of the rolled plate is parallel to the normal direction of the plate surface. <110> It is disclosed that a {110} fiber texture, in which the crystal lattice is randomly distributed so as to rotate around the axis of the {110} direction, can be obtained from the material surface to a depth of about 50 μm. [Prior art documents] [Non-patent literature]
[0003] [Non-Patent Document 1] Hisashi Sato et al., Crystallographic texture and applications of pure Cu formed by shot peening, Physica Status Solidi B, Vol. 259 (2022), pp. 2100550-1 - 2100550-10. Summary of the Invention [Problem to be solved by the invention]
[0004] The surface of face-centered cubic metal plates, including aluminum, has a crystal lattice structure. <001> It is often required that the {001} plane has a parallel relationship with the direction of the normal to the plate surface. For example, the surface of aluminum thin film for electrolytic capacitors is required to have an orientation distribution of the {001} plane of the aluminum crystal lattice. Furthermore, the surface of aluminum plate for beverage cans is also required to have a similar crystal orientation distribution.
[0005] Conventionally, the crystal lattice structure is <001> Face-centered cubic metal sheets with a crystal orientation distribution in which the direction and the normal direction of the sheet surface are parallel can be manufactured by a complex combination of rolling and heat treatment. However, the crystal lattice orientation is limited to the vicinity of the material surface, within a range of 50 μm from the material surface in the depth direction. <001> It was difficult to achieve a crystal orientation distribution in which the crystal orientation direction was parallel to the normal direction to the plate surface.
[0006] The present invention provides a face-centered cubic structure metal sheet having a {001} fiber texture near the surface, and a method for producing the same. [Means for solving the problem]
[0007] The face-centered cubic metal plate according to one embodiment of the present invention has a crystal structure in at least a part of the region including the surface of the metal plate within a region from the surface of the metal plate to a depth of 50 μm. <001> The direction is oriented approximately parallel to the normal direction to the plate surface.
[0008] According to the face-centered cubic metal plate, the crystal structure is <001> The direction of the crystal is oriented approximately parallel to the normal direction of the plate surface. <001> The crystal lattice has a randomly distributed {001} fiber texture that rotates around the axis of the {001} direction. This makes the material suitable for use as a metal sheet in applications requiring a {001} fiber texture near the surface, such as aluminum thin films for electrolytic capacitors and aluminum plates for beverage cans.
[0009] In the face-centered cubic metal plate, in a region from the surface of the metal plate to a depth of 50 μm, the crystal orientation distribution in at least a part of the region including the surface of the metal plate is measured. <001> The crystal orientation distribution may have at least one peak detected between 0° and 15° from the normal direction to the sheet surface, the peak having a higher intensity than the group of peaks formed between 75° and 105° from the normal direction to the sheet surface. In this case, the metal sheet has a {001} fiber texture near the surface.
[0010] In addition, in the above measurement, <111> The crystal orientation distribution may have peaks formed between 0° and 15° from the normal direction to the sheet surface and between 39° and 85° from the normal direction to the sheet surface, in which case the metal sheet has a {001} fiber texture near the surface.
[0011] In addition, the metal material that makes up the metal plate has a stacking fault energy of 80 J / m 2 In this case, the metal plate has a {001} fiber texture near the surface.
[0012] In another embodiment of the present invention, a method for producing a face-centered cubic metal plate is provided, comprising the steps of: forming a crystal structure in at least a part of a region including the surface of the metal plate from the surface to a depth of 50 μm; <001> This is a method for manufacturing a face-centered cubic metal plate in which the direction is oriented approximately parallel to the normal direction of the plate surface, and a surface treatment is performed by projecting a projection material onto the surface of the metal plate.
[0013] According to the above-mentioned manufacturing method of the face-centered cubic structure metal plate, the crystal orientation near the surface of the metal plate can be easily controlled to a predetermined direction by performing the surface processing treatment by projecting the projection material onto the surface of the metal plate. Therefore, compared with the conventional manufacturing technology in which rolling and heat treatment are performed to control the crystal orientation, complicated process management is not required. As a result, the metal plate having the {001} fiber texture near the surface can be obtained.
[0014] In the above-mentioned manufacturing method of the face-centered cubic metal plate, the crystalline orientation state in at least a part of the region from the surface of the metal plate to a depth of 50 μm, including the surface of the metal plate, may be controlled by adjusting at least one of the blast pressure and the blast time of the blast material in the surface processing treatment. In this case, the crystalline orientation can be precisely controlled in a predetermined direction in the vicinity of the surface of the metal plate.
[0015] Furthermore, after the surface processing, a heat treatment may be further performed, in which case the crystal orientation in the vicinity of the surface of the metal plate can be precisely controlled to a predetermined direction.
[0016] In addition, the metal material that makes up the metal plate has a stacking fault energy of 80 J / m 2 In this case, the crystal orientation in the vicinity of the surface of the metal plate can be controlled with high precision in a predetermined direction. [Brief description of the drawings]
[0017] [Figure 1] These are IPF maps of sample Al and sample Al-Mg obtained by the EBSD method. [Diagram 2] (001) pole figure, (111) pole figure, and (110) pole figure of sample Al and sample Al-Mg obtained by EBSD method. [Diagram 3] This is an IPF map of sample Al-7 obtained by the EBSD method. [Figure 4] (001) pole figure, (111) pole figure, and (110) pole figure of sample Al-7 obtained by EBSD method. [Diagram 5] This is an IPF map of sample Al-14 obtained by the EBSD method. [Figure 6] (001) pole figure, (111) pole figure, and (110) pole figure of sample Al-14 obtained by EBSD method. [Figure 7] This is an IPF map of sample Al-Mg-7 obtained by the EBSD method. [Figure 8] (001) pole figure, (111) pole figure, and (110) pole figure of sample Al-Mg-7 obtained by EBSD method. [Figure 9] This is an IPF map of sample Al-Mg-14 obtained by the EBSD method. [Figure 10] (001) pole figure, (111) pole figure, and (110) pole figure of sample Al-Mg-14 obtained by EBSD method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0018] Hereinafter, an embodiment of the present invention will be described.
[0019] [Face-centered cubic structure metal plate] First, the face-centered cubic metal plate will be described. The face-centered cubic metal plate has a crystal structure in at least a part of the region including the surface of the metal plate from the surface to a depth of 50 μm. <001> The direction is oriented approximately parallel to the normal direction to the plate surface.
[0020] The face-centered cubic metal plate can be made of a plate-shaped metal material whose crystal structure has a face-centered cubic lattice structure. Examples of the metal material that can be used include pure aluminum and pure nickel. In addition, the metal material can be made of a material having a stacking fault energy of 80 J / m 2 It is possible to use a metal material having a face-centered cubic structure whose composition is controlled so as to satisfy the above conditions. As such a metal material, for example, the above-mentioned pure aluminum and pure nickel, as well as various alloy materials that satisfy the above conditions, can be used.
[0021] In the face-centered cubic structure metal plate, the crystal orientation is oriented in at least a part of the region including the surface of the metal plate from the surface to a depth of 50 μm. That is, the crystal orientation is oriented in the region near the surface of the metal plate. Here, the at least a part of the region including the surface of the metal plate from the surface to a depth of 50 μm may be, for example, a region from the surface of the metal plate to a depth of 10 μm, a region from the surface of the metal plate to a depth of 25 μm, or a region from the surface of the metal plate to a depth of 50 μm.
[0022] In a face-centered cubic metal plate, the crystal orientation near the surface of the metal plate can be confirmed by, for example, measuring the crystal orientation distribution near the surface of the metal plate. The crystal orientation distribution can be measured by, for example, the electron backscatter diffraction (EBSD) method, which is suitable for measuring a local area, or the X-ray diffraction (XRD) method, which is suitable for measuring a wide area.
[0023] In the face-centered cubic metal plate, the crystal structure is <001> The direction is oriented approximately parallel to the normal direction of the plate surface. <001> This means that the direction of the crystal is controlled to an inclination of 0° to 15° with respect to the normal direction of the plate surface. <001> It has a randomly distributed {001} fiber texture with the crystal lattice rotating around the {001} direction.
[0024] [Manufacturing method for face-centered cubic metal plate] Next, a method for manufacturing a face-centered cubic metal plate will be described. The manufacturing method of the face-centered cubic structure metal plate involves projecting a projection material onto the surface of the metal plate to carry out a surface processing treatment.
[0025] The above-mentioned surface treatment can be carried out by projecting a projectile onto the surface of a metal plate and colliding the projectile with the surface of the metal plate at high speed. For example, shot peening, shot blasting, etc. can be used.
[0026] The material of the shot material used in the surface treatment can be appropriately selected depending on the material of the metal plate to be shot and hit, etc. For example, when pure aluminum, pure nickel, etc. are used as the metal material constituting the metal plate, hard particles such as zircon particles can be used as the shot material.
[0027] The conditions of the surface processing can be adjusted as appropriate. For example, the projection pressure of the projection material, the projection time, the distance between the surface of the metal plate and the projection nozzle that projects the projection material, etc. can be adjusted. The orientation state of the crystal orientation in the vicinity of the surface of the metal plate can be controlled by adjusting the projection pressure and projection time of the projection material.
[0028] After the above surface processing, a heat treatment may be further performed. In the heat treatment, the metal plate is heated to a predetermined temperature and held for a predetermined time. The conditions of the heat treatment can be appropriately adjusted, for example, the heating temperature, the holding time, etc. By adjusting the conditions of the heat treatment, the crystal orientation in the vicinity of the surface of the metal plate can be precisely controlled.
[0029] The present invention will be described below with reference to examples, but the present invention is not limited to these examples.
[0030] (Example) <Crystal orientation distribution before shot peening> First, samples were prepared. Specifically, metal plates made of pure aluminum and Al-10 mass% Mg alloy were obtained by cutting out sample pieces of 25 mm x 25 mm from a commercially available pure aluminum rolled plate with a thickness of 1.0 mm and an Al-10 mass% Mg alloy rolled plate in which 10 mass% magnesium was added to aluminum. In this way, a pure aluminum sample (sample Al) and an Al-10 mass% Mg alloy sample (sample Al-Mg) before shot peening were prepared. The stacking fault energy of pure aluminum is approximately 200 J / m 2 and the stacking fault energy is 80 J / m 2 This is higher than that of the Al-10 mass% Mg alloy, which is lower than that of the Al-10 mass% Mg alloy.
[0031] Next, the crystal orientation distribution on the surface of the samples (sample Al and sample Al-Mg) was analyzed using a scanning electron microscope equipped with an electron backscatter diffraction (EBSD) detector (TSL, OIM Data Collection 7). Figure 1 shows an inverse pole figure (IPF) map obtained by the EBSD method, which shows the crystal orientation distribution on the surface of the samples. From the IPF map in Figure 1, it can be seen that the samples before shot peening have flattened crystal grains, which suggests the structure after rolling.
[0032] Figure 2 shows the crystal structure of the sample surface obtained by EBSD. <001> direction, <111> Direction and <110> The (001) pole figure, (111) pole figure, and (110) pole figure show the crystal orientation distribution in the direction. From the pole figures in Figure 2, it can be seen that the surface of the sample has a crystal orientation distribution formed by rolling processing.
[0033] <Crystal orientation distribution of pure aluminum sample after shot peening> Next, the surface of the sample (sample Al) was subjected to shot peening under the conditions of a projection pressure of 0.2 MPa and projection times of 7 and 14 minutes. For the shot peening, an air nozzle type shot peening device (Pneumatic Blaster, manufactured by Fuji Manufacturing Co., Ltd.) was used. Zircon particles were used as the shot material (projection material). The distance between the sample surface and the projection nozzle was set to 65 mm. In this way, a sample (sample Al-7) that was shot peened under the projection time condition of 7 minutes and a sample (sample Al-14) that was shot peened under the projection time condition of 14 minutes were produced.
[0034] Next, sample Al-7 was polished 10 μm in from the processed surface, and the crystal orientation distribution of the polished surface (internal processed surface) was observed using a scanning electron microscope equipped with an EBSD detector. Figure 3 is an IPF map showing the crystal orientation distribution of the internal processed surface of the sample obtained by the EBSD method. From the IPF map in Figure 3, it can be seen that the crystal grains are fine on the internal processed surface 10 μm in from the processed surface of the sample.
[0035] Figure 4 shows the crystal structure of the internally machined surface of sample Al-7 obtained by EBSD. <001> direction, <111> Direction and <110> The (001) pole figure, (111) pole figure, and (110) pole figure show the crystal orientation distribution in the direction. From the pole figures in FIG. 4, the crystal lattice of aluminum <001> It can be seen that the orientation distribution is strong so that the direction is approximately parallel to the normal direction of the processed surface. <001> The direction is oriented approximately parallel to the normal direction of the processed surface, and <001> It can be seen that the orientations are randomly distributed near the machined surface. <001> The peak of the highest intensity in the direction is strongly oriented between 0° and 15° from the normal direction of the plate surface of the processed surface, specifically at a position that forms an angle of about 8° with the normal direction of the plate surface. <001> The orientation is strongly randomly distributed in the range of 75° to 105° from the normal direction of the plate surface of the processed surface, specifically, in the range of about 82° to 98° from the normal direction of the plate surface. <001> Although it is small compared to the direction, <111> The direction, <001> It can be seen that the orientation is weakly parallel to the normal direction of the processed surface, similar to the direction of the lattice. <111> The directional peaks are formed between 0° and 15° from the normal to the plate surface and between 39° and 69° from the normal to the plate surface.
[0036] Next, sample Al-14 was polished 10 μm in from the processed surface, and the crystal orientation distribution of the polished surface (internal processed surface) was observed using a scanning electron microscope equipped with an EBSD detector. Figure 5 is an IPF map showing the crystal orientation distribution of the internal processed surface of the sample obtained by the EBSD method. The IPF map in Figure 5 shows that the crystal grains are fine on the internal processed surface 10 μm in from the processed surface of the sample, similar to sample Al-7.
[0037] Figure 6 shows the crystal structure of the internally machined surface of sample Al-14 obtained by EBSD. <001> direction, <111> Direction and <110> The (001) pole figure, (111) pole figure, and (110) pole figure show the crystal orientation distribution in the direction. From the pole figures in FIG. 6, the crystal lattice of aluminum <001> It can be seen that the orientation distribution is strong so that the direction is approximately parallel to the normal direction of the processed surface. <001> The direction is oriented approximately parallel to the normal direction of the processed surface, and <001> It can be seen that the orientations are randomly distributed near the machined surface. <001> The peak of the highest intensity in the direction is strongly oriented between 0° and 15° from the normal direction of the plate surface of the processed surface, specifically at a position that forms an angle of about 15° with the normal direction of the plate surface. <001> The orientation is strongly randomly distributed in the direction between 75° and 105° from the normal direction of the plate surface of the processed surface, specifically, between about 75° and 105° from the normal direction of the plate surface. <001> Although it is small compared to the direction, <111> The direction, <001> It can be seen that the orientation is weakly parallel to the normal direction of the processed surface, similar to the direction of the lattice. <111> The directional peaks are formed between 0° and 15° from the normal direction to the plate surface and between 39° and 85° from the normal direction to the plate surface.
[0038] <Crystal orientation distribution of Al-10 mass% Mg alloy sample after shot peening> Next, the surface of the sample (sample Al-Mg) was subjected to shot peening under the conditions of a projection pressure of 0.2 MPa and projection times of 7 and 14 minutes. For the shot peening, an air nozzle type shot peening device (Pneumatic Blaster, manufactured by Fuji Manufacturing Co., Ltd.) was used. Zircon particles were used as the shot material (projection material). The distance between the sample surface and the projection nozzle was set to 65 mm. In this way, a sample (sample Al-Mg-7) that was shot peened under the projection time condition of 7 minutes and a sample (sample Al-Mg-14) that was shot peened under the projection time condition of 14 minutes were produced.
[0039] Next, the Al-Mg-7 sample was polished to within 10 μm from the processed surface, and the crystal orientation distribution of the polished surface (internal processed surface) was observed using a scanning electron microscope equipped with an EBSD detector. Figure 7 is an IPF map showing the crystal orientation distribution of the internal processed surface of the sample obtained by the EBSD method. From the IPF map in Figure 7, it can be seen that the crystal grains are fine on the internal processed surface 10 μm inside from the processed surface of the sample.
[0040] Figure 8 shows the crystal structure of the internally machined surface of the sample obtained by EBSD. <001> direction, <111> Direction and <110> The (001) pole figure, (111) pole figure, and (110) pole figure show the crystal orientation distribution in the direction. From the pole figures in FIG. 8, the crystal lattice of aluminum <110> It can be seen that the orientation distribution is strong so that the direction is approximately parallel to the normal direction of the processed surface. <110> The direction is oriented approximately parallel to the normal direction of the processed surface, and <110> We can see that the directions are randomly distributed. That is, <110> The peak of the highest intensity in the direction is strongly oriented between 0° and 20° from the normal direction of the plate surface of the processed surface, specifically at a position that forms an angle of about 20° with the normal direction of the plate surface. <110> The orientation is strongly and randomly distributed in a direction between 60° and 80° from the normal direction of the plate surface of the processed surface, specifically between about 40° and 100° from the normal direction of the plate surface.
[0041] Next, sample Al-Mg-14 was polished 10 μm in from the processed surface, and the crystal orientation distribution of the polished surface (internal processed surface) was observed with a scanning electron microscope equipped with an EBSD detector. Figure 9 is an IPF map showing the crystal orientation distribution of the internal processed surface of the sample obtained by the EBSD method. From the IPF map in Figure 9, it can be seen that the crystal grains are fine in the internal processed surface 10 μm in from the processed surface of the sample, similar to sample Al-Mg-7.
[0042] Figure 10 shows the crystal structure of the internally machined surface of sample Al-Mg-14 obtained by EBSD. <001> direction, <111> Direction and <110> The (001) pole figure, (111) pole figure, and (110) pole figure show the crystal orientation distribution in the direction. From the pole figures in FIG. 10, the crystal lattice of aluminum <110> It can be seen that the orientation distribution is strong so that the direction is approximately parallel to the normal direction of the processed surface. <110> The direction is oriented approximately parallel to the normal direction of the processed surface, and <110> We can see that the directions are randomly distributed. That is, <110> The peak of the highest intensity in the direction is strongly oriented between 0° and 20° from the normal direction of the plate surface of the processed surface, specifically at a position that forms an angle of about 5° with the normal direction of the plate surface. <110> The orientation is strongly and randomly distributed in a direction between 60° and 80° from the normal direction of the plate surface of the processed surface, specifically between about 40° and 100° from the normal direction of the plate surface.
[0043] As shown in Figs. 3 to 10, the stacking fault energy is 80 J / m 2 When shot peening is performed on a pure aluminum metal plate with a higher solubility than that of the pure aluminum metal plate, the crystal grains are formed near the surface. <001> It was found that the {001} fiber texture was obtained with the direction oriented in the normal direction of the plate surface. On the other hand, the stacking fault energy was 80 J / m 2 It was found that {110} fiber texture was formed when shot peening was performed on a metal plate of an Al-10 mass% Mg alloy with a lower melting point than that of the Al-10 mass% Mg alloy.
[0044] (Other embodiments) The present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be embodied in various forms without departing from the scope of the present invention.
[0045] The function of one component in the above embodiments may be distributed as multiple components, or the functions of multiple components may be integrated into one component. Also, a part of the configuration of the above embodiments may be omitted. Also, at least a part of the configuration of the above embodiments may be added to or substituted for the configuration of another of the above embodiments. Note that all aspects included in the technical idea specified by the wording described in the claims are embodiments of the present invention.
Claims
1. A face-centered cubic metal plate, in which the <001> direction of the crystals is oriented approximately parallel to the normal direction to the plate surface in at least a portion of a region extending from the surface of the metal plate to a depth of 50 μm, including the surface of the metal plate.
2. 2. The face-centered cubic structure metal plate according to claim 1, wherein in a measurement of the crystal orientation distribution in at least a portion of the region including the surface of the metal plate from the surface to a depth of 50 μm, at least one peak having a higher intensity than the group of peaks formed between 75° and 105° from the normal direction to the plate surface is detected between 0° and 15° from the normal direction to the plate surface in the <001> direction of the crystal.
3. In the measurement, the crystal orientation distribution is such that peak groups formed in the <111> direction of the crystal are detected between 0° and 15° from the normal direction of the plate surface and between 39° and 85° from the normal direction of the plate surface. The face-centered cubic structure metal plate according to claim 2 has a crystal orientation distribution in which peak groups formed in the <111> direction of the crystal are detected between 0° and 15° from the normal direction of the plate surface and between 39° and 85° from the normal direction of the plate surface.
4. The metal material constituting the metal plate has a stacking fault energy of 80 J / m ２ 4. The face-centered cubic structure metal plate according to claim 1, which is a metal material having a face-centered cubic structure and whose composition is controlled so as to satisfy the above.
5. A method for producing a face-centered cubic metal plate in which the <001> direction of crystals is oriented approximately parallel to the normal direction of the plate surface in at least a portion of a region including the surface of the metal plate from the surface to a depth of 50 μm, the method comprising the steps of: A method for manufacturing a face-centered cubic structure metal plate, comprising projecting a projection material onto the surface of the metal plate to perform a surface processing treatment.
6. 6. The method for manufacturing a face-centered cubic structure metal plate according to claim 5, wherein at least one of the projection pressure and projection time of the projection material in the surface processing treatment is adjusted to control the orientation state of the crystal orientation in at least a portion of the region including the surface of the metal plate within a region from the surface of the metal plate to a depth of 50 μm.
7. The method for producing a face-centered cubic structure metal plate according to claim 5 or 6, further comprising carrying out a heat treatment after carrying out the surface processing treatment.
8. The metal material constituting the metal plate has a stacking fault energy of 80 J / m ２ 6. The method for producing a face-centered cubic structure metal plate according to claim 5, wherein the metal material has a face-centered cubic structure and the composition thereof is controlled so as to satisfy the above.