Multi-layer ceramic electronic component
By forming a plating layer on the conductive layer of the multi-layer ceramic electronic components and providing a ceramic layer in the groove of the conductive layer, the problem of insufficient humidity protection and reliability in the prior art is solved, and high reliability in a high humidity environment and the effect of preventing unplating of the plating layer is achieved.
JP2025068590APending Publication Date: 2025-04-28SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information
- Application Number
- JP2024166277
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-10-16
- Filing Date
- 2024-09-25
- Publication Date
- 2025-04-28
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Figure 2025068590000001_ABST
Abstract
To provide a multi-layer ceramic electronic component that prevents a non-plating failure of an external electrode, and of which a moisture resistance reliability is improved.SOLUTION: A multi-layer ceramic electronic component includes: a plurality of dielectric layers 111, and a first internal electrode 121 and a second internal electrode 122 that are alternately arranged with the dielectric layers therebetween; a first external electrode that is connected to the first internal electrode, and includes a first conductive layer 131a and a first plating layer 131b that is arranged thereon; a second external electrode that is connected to the second internal electrode, and includes a first conductive layer 132a and a first plating layer 132b arranged thereon; a first coating part 141 that is arranged in a first groove part 133 positioned in the first conductive layer, and is in contact with the first plating layer; a second coating part 142 that is in contact with a second groove part 134 and the second plating layer; and a third coating part 143 that is in contact with one peripheral edge region of the first conductive layer and that of the second conductive layer.SELECTED DRAWING: Figure 3
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