Light-emitting device

Abstract

To provide a light-emitting device with which a protective film can be disposed on a plane facing the mounting surface of a wire.SOLUTION: A light-emitting device 1 comprises: a substrate on which a pair of electrodes 12a and 12b and a pair of wiring patterns 11a and 11b connected respectively to the pair of electrodes are formed; a light-emitting element connected to the pair of wiring patterns; a dam material disposed so as to enclose the light-emitting element; an encapsulant for encapsulating the light-emitting element and located in a region enclosed by the dam material; and a pair of electrode bases formed by a conductive member and disposed so as to cover each of the pair of electrodes. Each of the pair of electrode bases are located at a position higher than the dam material and has a top face on which a conductive member can be placed.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a light emitting device. [Background technology]

[0002] Various techniques are known for improving the light-emitting characteristics and reliability of light-emitting devices that use light-emitting diode (LED) dies as light-emitting elements. Patent Document 1 describes a light-emitting device having a metal base, a first frame member arranged on the base, a plurality of mounted LED elements arranged outside the first frame member, a covering material that covers the plurality of LED elements, and a first through hole arranged inside the first frame member. In the light-emitting device described in Patent Document 1, the LED elements and the covering material are not arranged inside the first frame member, so that the LED elements do not generate heat in the area surrounded by the first frame member, and warping of the base caused by heat generated by the LED elements can be suppressed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-117820 Summary of the Invention [Problem to be solved by the invention]

[0004] In light-emitting devices that use LED dies as light-emitting elements, there is a demand for miniaturization, and the distance between a dam material arranged to surround the sealing material that seals the LED die and an electrode connected to a conductive member to supply power to the light-emitting device is becoming shorter.If the distance between the dam material and the electrode becomes shorter, there is a risk that when the electrode and the conductive member are connected by soldering, the solder will melt to the dam material, damaging the dam material and the sealing material and reducing reliability.

[0005] The present invention is intended to solve these problems, and provides a light emitting device in which soldering for connecting electrodes and conductive members can be easily performed regardless of the distance between the dam material and the electrodes. [Means for solving the problem]

[0006] The light-emitting device of the present invention comprises a substrate on which a pair of electrodes and a pair of wiring patterns connected to each of the pair of electrodes are formed, a light-emitting element connected to the pair of wiring patterns, a dam material arranged to surround the light-emitting element, a sealing material arranged in an area surrounded by the dam material and sealing the light-emitting element, and a pair of electrode stands formed of a conductive material and arranged to cover each of the pair of electrodes, each of the pair of electrode stands being positioned higher than the dam material and having an upper surface on which a conductive material can be placed.

[0007] Furthermore, in the light-emitting device of the present invention, it is preferable that each of the pair of electrode stands has an upper plate having an upper surface, a bottom plate arranged opposite the upper plate and connected to the pair of electrodes, and a holding plate having an upper end connected to the upper plate and a lower end connected to the bottom plate and holding the upper plate.

[0008] Furthermore, in the light emitting device according to the present invention, the bottom plate preferably has an opening or a notch formed therein.

[0009] Furthermore, in the light-emitting device of the present invention, it is preferable that the retaining plate further has a first side plate extending from one end of the upper plate toward the substrate, and a second side plate extending from the other end of the upper plate toward the substrate, and the bottom plate has a first bottom plate connected to a lower end of the first side plate and extending parallel to the extension direction of the substrate, and a second bottom plate connected to a lower end of the second side plate and extending in a direction opposite to the extension direction of the first bottom plate, and the opening is a gap formed between the first bottom plate and the second bottom plate.

[0010] Furthermore, it is preferable that the light emitting device according to the present invention further comprises a first connecting member formed of a conductive material and arranged around the bottom plate, and a second connecting member formed of an insulating material and arranged in the opening or notch.

[0011] Furthermore, in the light emitting device according to the present invention, the upper surface preferably has a recess or a hole formed therein.

[0012] Furthermore, in the light emitting device according to the present invention, each of the pair of electrode stands preferably further has a protrusion extending from the upper surface in a direction opposite to the substrate.

[0013] Furthermore, in the light emitting device according to the present invention, it is preferable that the protrusion extends from an end portion adjacent to the dam material on the upper surface.

[0014] Furthermore, in the light emitting device according to the present invention, the protrusion is preferably disposed at an angle so as to cover the upper surface.

[0015] Furthermore, in the light emitting device according to the present invention, the upper surface is preferably arranged at an incline.

[0016] In addition, the light-emitting device of the present invention has a substrate on which a pair of electrodes and a pair of wiring patterns connected to each of the pair of electrodes are formed, a light-emitting element connected to the pair of wiring patterns, a dam material arranged to surround the light-emitting element, a sealing material arranged in an area surrounded by the dam material and sealing the light-emitting element, and a pair of electrode stands formed of a conductive material and arranged to cover each of the pair of electrodes, each of the pair of electrode stands having an upper surface on which a conductive material can be arranged, and a shielding portion that shields the dam material and the sealing material from flux generated when the conductive material is soldered to the upper surface.

[0017] Furthermore, in the light-emitting device of the present invention, each of the pair of electrode stands has a rectangular planar shape, and further includes a support plate having one side connected to the shielding portion, which supports the shielding portion, and it is preferable that the shielding portion is arranged at an angle to cover the support plate, and each of the pair of electrode stands is arranged such that the side of the support plate connected to the shielding portion is located between the dam material and the side opposite to the side of the support plate connected to the shielding portion.

[0018] Furthermore, in the light-emitting device of the present invention, each of the pair of electrode stands further has a support stand that supports the shielding portion, and the shielding portion has an upright surface that is an upright surface, and an upper surface that faces the upright surface and has a downwardly convex arc-shaped planar shape, and it is preferable that each of the pair of electrode stands is arranged so that the upright surface is located between the dam material and the upper surface. Effect of the Invention

[0019] In the light emitting device according to the present invention, the electrodes and the conductive member can be easily connected by soldering, regardless of the distance between the dam material and the electrodes. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1A is a plan view of a light emitting device according to an embodiment, and FIG. 1B is a plan view of the light emitting device shown in FIG. [Diagram 2] 1(a) is a plan view of the light emitting device shown in FIG. 1(a) with a pair of electrode stands removed, and (b) is a cross-sectional view taken along line BB shown in (a). [Diagram 3] 2(a) is a perspective view of the electrode stand shown in FIG. 1, and (b) is a partial side view of the light emitting device as viewed from the direction indicated by arrow A in FIG. [Figure 4] (a) is a front view of an electrode stand according to a first modified example, (b) is a front view of an electrode stand according to a second modified example, (c) is a front view of an electrode stand according to a third modified example, and (d) is a perspective view of an electrode stand according to a fourth modified example. [Diagram 5] (a) is a perspective view of an electrode stand according to a fifth modified example, (b) is a perspective view of an electrode stand according to a sixth modified example, (c) is a front view of an electrode stand according to a seventh modified example, and (d) is a perspective view of an electrode stand according to an eighth modified example. [Figure 6] (a) is a front view of an electrode base for the 9th modified example, (b) is a front view of an electrode base for the 10th modified example, (c) is an oblique view of an electrode base for the 11th modified example, (d) is an oblique view of an electrode base for the 12th modified example, and (e) is an oblique view of an electrode base for the 13th modified example. [Figure 7] FIG. 2(a) is a front view of an electrode stand according to a fourteenth modification, (b) is a front view of an electrode stand according to a fifteenth modification, and (c) is a perspective view of an electrode stand according to a sixteenth modification. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Hereinafter, a light emitting device according to the present invention will be described with reference to the drawings. However, it should be noted that the technical scope of the present invention is not limited to the embodiments, but extends to the inventions described in the claims and their equivalents.

[0022] (Configuration and Function of Light Emitting Device According to the Embodiment) Fig. 1(a) is a plan view of a light emitting device according to an embodiment, Fig. 1(b) is a plan view of the light emitting device shown in Fig. 1(a) in a state where the device is connected to lead wires, Fig. 2(a) is a plan view of the light emitting device shown in Fig. 1(a) in a state where a pair of electrode stands are removed, and Fig. 2(b) is a cross-sectional view taken along line BB shown in Fig. 2(a).

[0023] The light emitting device 1 includes a substrate 10, a pair of wiring patterns 11a and 11b, a pair of electrodes 12a and 12b, a plurality of LED dies 13, a bonding wire 14, a solder resist 15, a dam material 16, a sealing material 17, and a pair of electrode bases 18 and 19. The light emitting device 1 is a chip on board (COB) type light emitting device, and emits white light in response to power being supplied from an external power source via lead wires 101 and 102 connected to the pair of electrode bases 18 and 19 by solder. The lead wires 101 and 102 each have a tip portion where a conductor such as a tin-plated soft copper wire is exposed, and a covering portion that is covered with a covering material formed of an insulator such as a flame-retardant cross-linked polyolefin. The conductor wires of the lead wires 101 and 102 may be a solid wire or a twisted wire. When connecting the tips of the lead wires 101 and 102 to the electrode bases 18 and 19, a solder having a melting temperature of about 215° C. to 220° C., such as a Sn--Ag--Cu type solder, is used.

[0024] The substrate 10 includes a mounting substrate 10a and a circuit substrate 10b. The mounting substrate 10a has a rectangular planar shape and has a planar area on the surface on which the LED die 13 is mounted.

[0025] The circuit board 10b has the same planar shape as the mounting board 10a, is attached to the surface of the mounting board 10a, and has a circular opening 10c formed in the center. A pair of wiring patterns 11a and 11b are formed on the upper surface of the circuit board 10b so as to surround the opening 10c, and a pair of electrodes 12a and 12b are formed near two diagonally opposite corners.

[0026] The electrode 12a is an anode electrode, and the electrode 12b is a cathode electrode. The pair of electrodes 12a and 12b are connected to an external power source (not shown) via a pair of lead wires 101 and 102. When a predetermined voltage is applied between the pair of electrodes 12a and 12b, the light emitting device 1 emits white light.

[0027] The LED die 13, also called a light emitting element, is mounted on the mounting substrate 10a exposed from the opening 10c via an insulating die bond material. In Fig. 2(a), the light emitting device 1 has 40 LED dies 13. The die bond material used to mount the LED die 13 is an epoxy adhesive, a silicone adhesive, or the like, which is not easily affected by heating associated with soldering.

[0028] The bonding wire 14 is made of a conductive material such as gold, and connects between the cathode and anode of adjacent LED dies 13. The bonding wire 14 also connects between the LED dies 13 adjacent to the outer edge of the opening 10c and the wiring patterns 11a and 11b. In the light emitting device 1, a row in which eight LED dies 13 are connected in series via the bonding wire 14 is connected in parallel to the wiring patterns 11a and 11b over five rows. However, in the LED die according to the embodiment, the number of LED dies 13 connected in series and the number of rows connected in parallel may be determined appropriately.

[0029] The solder resist 15 is a heat-resistant insulating resin such as epoxy resin, and is arranged on the circuit board 10b so as to cover the entire surface of the pair of wiring patterns 11a and 11b except for the pair of electrodes 12a and 12b, outside the dam material 16 described later.

[0030] The dam material 16 is a resin in which a filler such as silica is contained in a synthetic resin such as a silicone resin, and is arranged along the outer edge of the opening 10c so as to cover the wiring patterns 11a and 11b. The dam material 16 reflects the blue light emitted from the LED die 13 and emits it upward in the light emitting device 1, that is, in the opposite direction of the mounting substrate 10a of the LED die 13.

[0031] The sealing material 17 is a colorless and transparent synthetic resin such as an epoxy resin or a silicone resin, and is disposed inside the dam material 16 to integrally cover the LED die 13 and the bonding wires 14. The sealing material 17 is made of Y3Al5O 12 Green phosphor particles such as CaAlSiN3:Ce (Yttrium Aluminum Garnet, YAG) and red phosphor particles such as CaAlSiN3:Eu (CASN) are mixed. The green phosphor particles and the red phosphor particles are disposed by settling so as to cover at least a part of the surface of the mounting substrate 10a and the surface and side of the LED die 13. The light emitting device 1 emits white light by mixing the blue light from the LED die 13 with the green light and red light obtained by exciting the green phosphor and the red phosphor with a part of the blue light. The phosphors mixed in the sealing material 17 are not limited to the above two types of phosphors, and any combination of phosphors of other colors can be selected.

[0032] The pair of electrode bases 18 and 19 are made of a conductive material and are connected to the pair of electrodes 12a and 12b by being arranged so as to cover them, respectively. Lead wires 101 and 102 connected to an external power source (not shown) are connected to the pair of electrode bases 18 and 19, so that power is supplied from the external power source (not shown) to the multiple LED dies 13 via the pair of electrodes 12a and 12b and the pair of wiring patterns 11a and 11b.

[0033] The connection between the electrode base 18 and the electrode 12a is similar to the connection between the electrode base 19 and the electrode 12b. Moreover, the connection between the electrode base 18 and the lead wire 101 is similar to the connection between the electrode base 19 and the lead wire .

[0034] Fig. 3(a) is a perspective view of electrode stand 18, and (b) is a partial side view of light emitting device 1 as viewed from the direction indicated by arrow A in Fig. 1. Electrode stand 19 has the same structure as electrode stand 18, and therefore a description of electrode stand 19 will be omitted.

[0035] The electrode stand 18 is formed of a conductive material such as alloy steel such as stainless steel, copper alloy such as phosphor bronze, and alloy of iron and nickel such as 42 alloy, and has a frame-like front shape with one side cut out at the center. The electrode stand 18 has an upper plate 20, a first side plate 21, a second side plate 22, a first bottom plate 23, and a second bottom plate 24, and the front face faces the dam material 16, and is arranged so that light emitted from the light emitting element 13 can pass through the frame of the electrode stands 18 and 19. The electrode stand 18 is formed by metal processing such as pressing, casting, and cutting a conductive material. The electrode stand 18 is electrically connected to the electrode 12a by arranging the first bottom plate 23 and the second bottom plate 24 to be in contact with the electrode 12a by the first connecting member 27 and the second connecting member 28.

[0036] The upper plate 20 has an upper surface 25 to which the lead wire 101 is fixed by solder, and both ends are supported by the first side plate 21 and the second side plate 22. The upper plate 20 has a rectangular planar shape. The area of ​​the upper surface 25 is determined so that the solder for fixing the lead wire 101 to the upper surface is disposed on the surface of the upper plate 20 even if the solder spreads after wetting. The upper surface 25 of the upper plate 20 may be plated with solder for fixing the lead wire 101. The solder to be plated is, for example, a Sn-Ag-Cu-based solder having a melting temperature of about 215°C to 220°C. The side surface of the upper plate 20 facing the dam material 16 is coated with a reflective material such as white paint and white resist.

[0037] The first side plate 21 has a rectangular planar shape and is disposed so as to extend from one end of the upper plate 20, which is one side of the upper plate 20, toward the substrate 10. The upper end of the first side plate 21 is connected to the upper plate 20, and the lower end of the first side plate 21 is connected to the first bottom plate 23. The second side plate 22 has a rectangular planar shape and is disposed so as to extend from the other end of the upper plate 20, which is the side opposite to the side of the upper plate 20 to which the first side plate 21 is connected, toward the substrate 10. The upper end of the second side plate 22 is connected to the upper plate 20, and the lower end of the second side plate 22 is connected to the second bottom plate 24. The side surfaces of the first side plate 21 and the second side plate 22 facing the dam material 16 are coated with a reflective material such as white paint and white resist.

[0038] The first side plate 21 and the second side plate 22 are holding plates that hold the upper plate 20. The height of the first side plate 21 and the second side plate 22 is equal to the height H of the upper surface 25 on which the lead wires 101 are arranged. U is the height H of the dam material 16 D The height of the first side plate 21 and the second side plate 22 is determined to be higher than the height H L is the height H of the dam material 16 D It is preferable that it is higher than .

[0039] The first side plate 21 and the second side plate 22 may have a portion formed whose width is narrower than the width of the upper plate 20, or may have a notch or hole formed therein. By forming a portion whose width is narrower than the width of the upper plate 20, or by forming a notch or hole in the first side plate 21 and the second side plate 22, it is possible to make it difficult for heat generated when the lead wire 101 is soldered to the upper surface 25 to be conducted to the first bottom plate 23 and the second bottom plate 24. By making it difficult for heat generated when the lead wire 101 is soldered to the upper surface 25 to be conducted to the first bottom plate 23 and the second bottom plate 24, it is possible to reduce the risk of the first connection member 27 melting when the lead wire 101 is soldered.

[0040] The first bottom plate 23 has a rectangular planar shape, is connected to the lower end of the first side plate 21, and is disposed so as to extend toward the second side plate 22 in parallel to the extension direction of the substrate 10. The second bottom plate 24 has a rectangular planar shape, is connected to the lower end of the second side plate 22, and extends toward the first side plate 21 in the direction opposite to the extension direction of the first bottom plate 23. A gap 26, which is an example of an opening, is formed between the tip of the first bottom plate 23 and the tip of the second bottom plate 24.

[0041] A first connection member 27 is disposed around the first bottom plate 23 and the second bottom plate 24. The first connection member 27 is disposed around the first bottom plate 23 and the second bottom plate 24, and is disposed so as to extend in a tapered shape downward from the first side plate 21 and the second side plate 22. The first connection member 27 is the same solder as that used when connecting the lead wires 101 and 102 to the electrode bases 18 and 19, or the same solder as that plated on the upper surface 25.

[0042] A second connecting member 28 is disposed in a gap 26 formed between the tip of the first bottom plate 23 and the tip of the second bottom plate 24. The second connecting member 28 is a thermosetting adhesive made of a highly heat-resistant synthetic resin such as an epoxy adhesive.

[0043] A method for manufacturing the light emitting device 1 will be described. First, in an aggregate substrate preparation step, an aggregate substrate in which a plurality of substrates 10 are integrated is prepared. Next, in a light emitting element mounting step, a plurality of LED dies 13 are mounted via a die bond material at predetermined positions on the mounting substrate 10a of the plurality of substrates 10 included in the aggregate substrate. Next, in a wire bonding step, the LED dies 13 are wire bonded with bonding wires 14 between each other and between the LED dies 13 and the wiring patterns 11a and 11b. Next, in a dam material arrangement step, a dam material 16 is arranged so as to surround the mounting substrate 10a. Next, in a sealant arrangement step, a sealant 17 is arranged in the area surrounded by the dam material 16.

[0044] Next, in the electrode stand arrangement step, the electrode stands 18 and 19 are arranged so as to cover the electrodes 12a and 12b. The electrode stands 18 and 19 are arranged on the upper surfaces of the electrodes 12a and 12b, respectively, with the second connection member 28 before melting arranged in the gap 26. With the electrode stands 18 and 19 arranged on the electrodes 12a and 12b, the assembly board is heated to a temperature equal to or higher than the melting temperature of the second connection member 28, and the second connection member 28 is melted and then cooled, so that the electrode stands 18 and 19 are bonded to the electrodes 12a and 12b by the second connection member 28. Next, the peripheries of the first bottom plate 23 and the second bottom plate 24 are soldered. By soldering the peripheries of the first bottom plate 23 and the second bottom plate 24, the risk of insulation between the electrode stands 18 and 19 and the electrodes 12a and 12b is reduced. Then, in the cutting step, the assembly board is cut, and a plurality of light-emitting devices 1 are manufactured.

[0045] (Functions and Effects of the Light Emitting Device According to the Embodiment) In the light emitting device 1, the lead wires 101 and 102 can be connected to the upper surface 25 that is located at a higher position than the dam material 16, so there is no risk that a device that transports solder will come into contact with the dam material 16 during soldering. In the light emitting device 1, there is no risk that a device that transports solder will come into contact with the dam material 16 during soldering, so the electrodes 12a and 12b and the lead wires 101 and 102 can be easily connected by soldering.

[0046] In addition, the electrode stands 18 and 19 have a frame-like front shape and are arranged so that the light emitted from the light-emitting element 13 can pass through the frame of the electrode stands 18 and 19, so that the amount of light absorbed by the electrode stands 18 and 19 is reduced, and the decrease in light-emitting efficiency is suppressed.

[0047] Furthermore, in the light emitting device 1, because the second connection member 28 is disposed in the gap 26, it is possible to reduce the risk of the electrode bases 18 and 19 being misaligned even if the first connection member 27 melts when the lead wires 101 and 102 are soldered to the upper surface 25. Furthermore, because the second connection member 28 is disposed in the gap 26, the light emitting device 1 can employ, as the first connection member 27, a solder having a melting temperature lower than the melting temperature of the solder used when soldering the lead wires 101 and 102 to the upper surface 25.

[0048] Furthermore, in the light emitting device 1, a reflective material is applied to the side surfaces of the top plate 20, the first side plate 21, and the second side plate 22 facing the dam material 16, so that the light emitted from the light emitting element 13 is reflected by the side surfaces of the top plate 20, the first side plate 21, and the second side plate 22, thereby suppressing a decrease in light emitting efficiency and directivity.

[0049] Furthermore, since the electrode bases 18 and 19 are formed by metal processing such as pressing a conductive member, they can be formed easily and inexpensively, and the increase in manufacturing costs due to the arrangement of the electrode bases 18 and 19 can be kept to a minimum.

[0050] (Modification of the Light Emitting Device According to the Embodiment) In the light emitting device 1, the second connecting member 28 is disposed in the gap 26, but in the light emitting device according to the embodiment, the second connecting member 28 does not have to be disposed. When the second connecting member 28 is not disposed, the first connecting member 27 is formed of a solder having a melting temperature 20° C. or more higher than the solder used to connect the lead wires 101 and 102 and the solder plated on the upper surface 25. The first connecting member 27 is formed of, for example, a Sn-Sb solder having a melting temperature of about 240° C. to 245° C.

[0051] In addition, in the light emitting device 1, the LED die 13 is wire-bonded by the bonding wire 14, but in the light emitting device according to the embodiment, the LED die 13 may be flip-chip connected. When the LED die 13 is flip-chip connected, a conductive adhesive such as silver paste, a stud bump formed of a eutectic mixture of gold and tin, or the like may be used as a die bond material. For flip-chip connection, a die bond material having a melting temperature higher than the melting temperature of the first connection member 27 is used. In addition, when the LED die 13 has an upper electrode and a lower electrode, the upper electrode of the LED die 13 may be wire-bonded and the lower electrode may be connected by the same die bond material as when the LED die 13 is flip-chip connected.

[0052] In the light emitting device 1, the electrode stands 18 and 19 are formed to have a frame-like front shape with a gap 26 formed by the top plate 20 to the second bottom plate 24, but in the light emitting device according to the embodiment, the electrode stands may be formed into a shape other than a frame shape with a gap 26. Also, in the light emitting device 1, the electrode stands 18 and 19 are formed by metal processing a conductive member, but in the light emitting device according to the embodiment, the electrode stands may be formed from a thick or thin steel plate.

[0053] Figure 4(a) is a front view of an electrode stand for a first modified example, Figure 4(b) is a front view of an electrode stand for a second modified example, Figure 4(c) is a front view of an electrode stand for a third modified example, and Figure 4(d) is a perspective view of an electrode stand for a fourth modified example.

[0054] The electrode stand 18a according to the first modification has an upper plate 30, a side plate 31, and a bottom plate 32, and has a U-shaped front shape. The upper plate 30, the side plate 31, and the bottom plate 32 have a rectangular planar shape. The surface of the upper plate 30 opposite the surface facing the bottom plate 32 is an upper surface to which the tip of the lead wire 101 is fixed by solder, similar to the upper surface of the upper plate 20.

[0055] The side plate 31 is disposed so as to extend from one end of the upper plate 30, which is one side of the upper plate 30, toward the bottom plate 32. The upper end of the side plate 31 is connected to the upper plate 30, and the lower end of the side plate 31 is connected to the bottom plate 32. The side plate 31 is a holding plate that holds the upper plate 30. The height of the side plate 31 is determined by determining whether the height of the upper surface on which the lead wires 101 are disposed is greater than the height H of the dam material 16 of the light emitting device 1 on which the electrode stand 18a is mounted. D is determined to be higher than

[0056] The side plate 31 may have a portion whose width is narrower than the width of the upper plate 30, or may have a notch or hole formed therein. By forming a portion whose width is narrower than the width of the upper plate 30, or by forming a notch or hole in the side plate 31, it is possible to make it difficult for heat generated when the lead wire 101 is soldered to the upper surface of the upper plate 30 to be conducted to the bottom plate 32. By making it difficult for heat generated when the lead wire 101 is soldered to the upper surface of the upper plate 30 to be conducted to the bottom plate 32, it is possible to reduce the risk of the first connection member 27 melting when the lead wire 101 is soldered.

[0057] The bottom plate 32 is connected to the lower end of the side plate 31 and is disposed so as to extend parallel to the extension direction of the upper plate 30. The length of the bottom plate 32 is the same as the length of the upper plate 30, but the length of the bottom plate 32 may be longer than the length of the upper plate 30, or the length of the bottom plate 32 may be shorter than the length of the upper plate 30. The electrode stand 18a is disposed on the electrode 12a, and a first connection member 27 is disposed so as to surround the bottom plate 32, thereby electrically connecting to the electrode 12a.

[0058] The electrode stand 18b according to the second modification is different from the electrode stand 18a in that a through hole 33 is formed in the bottom plate 32. The configurations and functions of the components of the electrode stand 18b other than the through hole 33 are the same as those of the electrode stand 18a with the same reference numerals, and therefore detailed description will be omitted here. Note that, although the electrode stand 18b according to the second modification has the through hole 33 formed therein, in the electrode stand according to the embodiment, a notch may be formed in the bottom plate 32 instead of the through hole 33.

[0059] The through hole 33 is an example of an opening, and is disposed in the center of the bottom plate 32. Similar to the gap 26 of the electrode stand 18, the through hole 33 receives the second connection member 28 when the electrode stand 18b is connected to the electrode 12a.

[0060] The electrode stand 18c according to the third modification is different from the electrode stand 18a in that it has an inclined plate 34 instead of the side plate 31. The configurations and functions of the components of the electrode stand 18c other than the inclined plate 34 are the same as those of the electrode stand 18a with the same reference numerals, and therefore detailed description thereof will be omitted here. The electrode stand 18c has a Z-shaped front view.

[0061] The inclined plate 34 has a rectangular planar shape, and is disposed on the upper plate 30 so as to incline from one side toward the opposite side of the bottom plate 32. The upper end of the inclined plate 34 is connected to one side of the upper plate 30, and the lower end of the inclined plate 34 is connected to a side of the bottom plate 32 that faces the side of the bottom plate 32 that is disposed immediately below the side to which the upper end of the inclined plate 34 is connected. The inclined plate 34 is a holding plate that holds the upper plate 30. Note that the bottom plate 32 of the electrode stand 18c may have a through hole 33 formed therein, similar to the bottom plate 32 of the electrode stand 18b.

[0062] The inclined plate 34 may have a portion whose width is narrower than the width of the upper plate 30, or may have a notch or hole formed therein. By forming a portion whose width is narrower than the width of the upper plate 30, or by forming a notch or hole in the inclined plate 34, it is possible to make it difficult for heat generated when the lead wire 101 is soldered to the upper surface of the upper plate 30 to be conducted to the bottom plate 32. By making it difficult for heat generated when the lead wire 101 is soldered to the upper surface of the upper plate 30 to be conducted to the bottom plate 32, it is possible to reduce the risk of the first connection member 27 melting when the lead wire 101 is soldered.

[0063] The electrode base 18d according to the fourth modification is formed of a thick or thin steel plate. The thickness of the electrode base 18d is determined by the height of the upper surface 40 of the electrode base 18d being greater than the height H of the dam material 16 of the light emitting device 1 on which the electrode base 18d is mounted. D is determined to be higher than

[0064] Furthermore, in the light emitting device 1, the upper surfaces 25 of the electrode bases 18 and 19 are flat, but in the light emitting device according to the embodiment, the upper surface 25 of the electrode base may have recesses or openings formed therein into which the tips of the lead wires 101 and 102 can be fixed.

[0065] Figure 5(a) is an oblique view of an electrode stand for the fifth modified example, Figure 5(b) is an oblique view of an electrode stand for the sixth modified example, Figure 5(c) is a front view of an electrode stand for the seventh modified example, and Figure 5(d) is an oblique view of an electrode stand for the eighth modified example.

[0066] The electrode stand 18e according to the fifth modified example differs from the electrode stand 18 in that recesses 29 are formed on the outer surfaces of the top plate 20, the first side plate 21, the second side plate 22, the first bottom plate 23, and the second bottom plate 24. The configurations and functions of the components of the electrode stand 18e other than the recesses 29 are the same as those of the components of the electrode stand 18 with the same reference numerals, and therefore detailed description thereof will be omitted here.

[0067] Recess 29 is formed in the center of the outer surface of upper plate 20 so as to have a uniform width and depth from the edge connected to first side plate 21 to the edge connected to second side plate 22. The width and depth of recess 29 are determined according to the diameter of the conductor of lead wire 101. With recess 29 formed in upper surface 25 of electrode base 18e, it becomes easier to fix the tip of lead wire 101 to upper surface 25, and soldering of lead wire 101 becomes easier.

[0068] Further, the recesses 29 are formed in the centers of the outer surfaces of the first side plate 21 and the second side plate 22 so as to have a uniform width and depth from the edge connected to the top plate 20 to the edge connected to the first bottom plate 23 and the second bottom plate 24. By forming the recesses 29 on the outer surfaces of the first side plate 21 and the second side plate 22, the contact area between the electrode base 18e and the first connecting member 27 increases, and the adhesive strength increases.

[0069] Further, the recesses 29 are formed in the centers of the outer surfaces of the first bottom plate 23 and the second bottom plate 24 so as to have a uniform width and depth from the edges connected to the first side plate 21 and the second side plate 22, respectively, to the edges contacting the gap 26. With the recesses 29 formed in the outer surfaces of the first bottom plate 23 and the second bottom plate 24, the contact area between the electrode stand 18e and the second connecting member 28 is increased, and the adhesive strength is increased.

[0070] Electrode stand 18f according to the sixth modified example differs from electrode stand 18d in that a recess 41 is formed on the upper surface 40. The configurations and functions of the components of electrode stand 18f other than the recess 41 are the same as those of electrode stand 18d with the same reference numerals, and therefore detailed description thereof will be omitted here.

[0071] The recess 41 is formed in the center of the upper surface 40 so as to have a uniform width and depth from one side of the upper surface to the opposing other side. The width and depth of the recess 29 are determined according to the diameter of the conductor of the lead wire 101. With the recess 41 formed in the upper surface 40 of the electrode base 18f, it becomes easier to fix the tip of the lead wire 101 to the upper surface 40, and the lead wire 101 can be easily soldered.

[0072] An electrode stand 18g according to the seventh modified example differs from the electrode stand 18a in that a through hole 35 is formed in the upper plate 30. The configurations and functions of the components of the electrode stand 18g other than the through hole 35 are the same as those of the electrode stand 18a with the same reference numerals, and therefore detailed description thereof will be omitted here.

[0073] The through hole 35 is disposed near the tip of the upper plate 30. When the lead wire 101 is disposed, the tip of the lead wire 101 is inserted into the through hole 35. The diameter of the through hole 35 is determined according to the diameter of the conductive wire of the lead wire 101. With the through hole 35 formed in the upper plate 30, the electrode base 18g makes it easier to fix the lead wire 101 to the upper plate 30 and makes it easier to solder the lead wire 101.

[0074] Electrode stand 18h ​​according to the eighth modification is different from electrode stand 18d in that non-through holes 42 are formed in the upper surface 40. The configurations and functions of the components of electrode stand 18h ​​other than non-through holes 42 are the same as those of electrode stand 18d with the same reference numerals, and therefore detailed description thereof will be omitted here.

[0075] The non-through hole 42 is disposed near one side of the upper surface 40. When the lead wire 101 is disposed, the tip of the lead wire 101 is inserted into the non-through hole 42. The diameter of the non-through hole 42 is determined according to the diameter of the conductive wire of the lead wire 101. With the non-through hole 42 formed in the upper surface 40 of the electrode stand 18h, it becomes easier to fix the lead wire 101 to the upper surface 40 and easier to solder the lead wire 101.

[0076] Furthermore, in the light emitting device 1, the upper surfaces 25 of the electrode stands 18 and 19 are flat, but in the light emitting device according to the embodiment, the electrode stand may have a protrusion extending from one side of the upper surface in the direction opposite to the substrate 10.

[0077] Fig. 6(a) is a front view of an electrode stand according to a ninth modified example, Fig. 6(b) is a front view of an electrode stand according to a tenth modified example, and Fig. 6(c) is a perspective view of an electrode stand according to an eleventh modified example, Fig. 6(d) is a perspective view of an electrode stand according to a twelfth modified example, and Fig. 6(e) is a perspective view of an electrode stand according to a thirteenth modified example.

[0078] The electrode stand 18i according to the ninth modification is different from the electrode stand 18a in that it has a protrusion 36. The configurations and functions of the components of the electrode stand 18i other than the protrusion 36 are the same as those of the electrode stand 18a with the same reference numerals, and therefore detailed description thereof will be omitted here.

[0079] The protrusion 36 has a rectangular planar shape and is disposed so as to stand upright from the tip of the upper plate 30 in the direction opposite to the bottom plate 32. Since the protrusion 36, which can be contacted by the tip of the lead wire 101, is disposed at the tip of the upper plate 30, the electrode stand 18i makes it easier to fix the tip of the lead wire 101 to the upper plate 30 and easier to solder the lead wire 101.

[0080] Electrode stand 18j according to the tenth modification is different from electrode stand 18a in that it has a protrusion 37. The configurations and functions of the components of electrode stand 18j other than protrusion 37 are the same as those of electrode stand 18a with the same reference numerals, and therefore detailed description thereof will be omitted here.

[0081] The protrusion 37 has a rectangular planar shape and is arranged so as to stand upright from one side surface of the upper plate 30 facing the dam material 16 in the direction opposite to the bottom plate 32. The height of the protrusion 37 is preferably determined so as to be higher than the diameter of the conductor of the lead wire 101. The electrode base 18j has the protrusion 37, which can be contacted with the tip of the lead wire 101, arranged on one side surface of the upper plate 30 facing the dam material 16, which makes it easier to fix the tip of the lead wire 101 to the upper plate 30 and facilitates soldering of the lead wire 101. In addition, by arranging the protrusion 37 so as to be located between the upper surface of the upper plate 30 on which the lead wire 101 is arranged and the dam material 16, it is possible to prevent the flux generated when soldering the lead wire 101 from scattering on the upper surface of the dam material and the sealing material 17. The electrode base 18j has a protrusion 37 that prevents the flux from scattering onto the dam material and the upper surface of the sealing material 17, thereby preventing the flux from adhering to the upper surface of the sealing material 17 and causing a decrease in the luminous efficiency of the light emitting device 1.

[0082] Electrode stand 18k according to the eleventh modified example differs from electrode stand 18d in that it has a protrusion 43. The configurations and functions of the components of electrode stand 18k other than protrusion 43 are the same as those of electrode stand 18d with the same reference numerals, and therefore detailed description thereof will be omitted here.

[0083] The protrusion 43 has a rectangular planar shape and is arranged to stand upright from one side of the upper surface 40 facing the dam material 16. The height of the protrusion 43 is determined to be higher than the diameter of the conductor of the lead wire 101. The electrode base 18k has the protrusion 43, which can be contacted with the tip of the lead wire 101, arranged on one side of the upper surface 40, which makes it easier to fix the tip of the lead wire 101 to the upper plate 30 and makes it easier to solder the lead wire 101. In addition, by arranging the protrusion 43 to be located between the upper surface 40 on which the lead wire 101 is arranged and the dam material 16, it is possible to prevent the flux generated when soldering the lead wire 101 from scattering onto the upper surfaces of the dam material and the sealing material 17. The electrode base 18k can prevent the protrusion 43 from scattering onto the upper surfaces of the dam material and the sealing material 17, which prevents the flux from adhering to the upper surface of the sealing material 17, thereby preventing the light-emitting efficiency of the light-emitting device 1 from decreasing.

[0084] The electrode table 18l according to the twelfth modification has a support plate 50 and a shielding plate 51. The support plate 50 has a rectangular planar shape and has an upper surface 52 on which the lead wire 101 is disposed. The area of ​​the upper surface 52 is determined so that the solder for fixing the lead wire 101 to the upper surface is disposed on the surface of the upper plate 20 even if the solder spreads after being wetted. The shielding plate 51 has a rectangular planar shape, has a lower end connected to one side of the support plate 50, and is disposed at an incline so as to cover the support plate 50. The shielding plate 51 is also referred to as a protrusion and a shielding portion. The inclination angle and length of the shielding plate 51 are determined so as to cover the tip of the lead wire 101 according to the diameter of the tip of the lead wire 101.

[0085] When the electrode stand 18l is placed on the electrode 12a of the light emitting device 1, the electrode stand 18l is placed so that the side connected to the shielding plate 51 of the support plate 50 is located between the dam material 16 and the side of the support plate 50 opposite the side connected to the shielding plate 51. By placing the electrode stand 18l so that the side connected to the shielding plate 51 is located between the dam material 16 and the side opposite the side connected to the shielding plate 51, the flux generated when the lead wire 101 is soldered is shielded by the shielding plate 51. The shielding plate 51 shields the flux, thereby preventing the flux from scattering onto the upper surface of the dam material and the sealing material 17.

[0086] In addition, it is preferable that the electrode stand 18l is coated with a reflective material such as white paint or white resist on the surface of the shielding plate 51 facing the dam material 16. When the surface of the shielding plate 51 facing the dam material 16 is coated with a reflective material such as white paint or white resist, the light emitted from the light emitting element 13 is reflected with high efficiency by the surface of the shielding plate 51 facing the dam material 16, so that the amount of light absorbed by the electrode stand 18l is suppressed, and the decrease in the luminous efficiency is suppressed.

[0087] Furthermore, in the electrode stand 18l, the support plate 50 may be larger than the shielding plate 51 when viewed from above. If the support plate 50 is larger than the shielding plate 51, when the lead wire 101 is soldered, the portion to be soldered can be easily visually confirmed.

[0088] The electrode base 18m according to the thirteenth modification has a support base 60 and a protrusion 61. The support base 60 has a rectangular parallelepiped shape and supports the protrusion 61 on its upper surface. The protrusion 61 is also called a shielding part, and has one upright surface and a surface facing the upright surface that has a downwardly convex arc-shaped planar shape. The upright surface of the protrusion 61 forms the same plane as one of the side surfaces of the support base 60. The surface of the protrusion 61 that has a downwardly convex arc-shaped planar shape is the upper surface 62 on which the tip of the lead wire 101 is disposed. It is preferable that the area of ​​the upper surface 62 is determined according to the diameter of the lead wire 101 so that the upper end of the lead wire 101 is lower than the upper end of the protrusion 61.

[0089] When the electrode base 18m is placed on the electrode 12a of the light emitting device 1, the upright surface of the protrusion 61 is positioned between the dam material 16 and the upper surface 62. By positioning the electrode base 18m so that the upright surface of the protrusion 61 is positioned between the dam material 16 and the upper surface 62, the flux generated when the lead wire 101 is soldered is shielded by the protrusion 61. The protrusion 61 shields the flux, preventing the flux from scattering onto the upper surface of the dam material and the sealing material 17.

[0090] Moreover, it is preferable that a reflective material such as white paint or white resist is applied to the side surface of the electrode stand 18m facing the dam material 16. When a reflective material such as white paint or white resist is applied to the side surface facing the dam material 16, the light emitted from the light emitting element 13 is reflected with high efficiency by the side surface facing the dam material 16, so that the amount of light absorbed by the electrode stand 18m is suppressed and a decrease in the luminous efficiency is suppressed.

[0091] In the light-emitting device 1, the electrode stands 18 and 19 are arranged so that the upper plate 20 is parallel to the extension direction of the surface of the substrate, but in the light-emitting device according to the embodiment, the electrode stands may be arranged so that the upper plate is inclined from the extension direction of the surface of the substrate.

[0092] FIG. 7(a) is a front view of an electrode stand according to a fourteenth modified example, FIG. 7(b) is a front view of an electrode stand according to a fifteenth modified example, and FIG. 7(c) is a perspective view of an electrode stand according to a sixteenth modified example.

[0093] The electrode stand 18n according to the fourteenth modification differs from the electrode stand 18 in that it has a first side plate 21a instead of the first side plate 21. The configurations and functions of the components of the electrode stand 18n other than the first side plate 21a are the same as those of the components of the electrode stand 18 with the same reference numerals, and therefore detailed descriptions thereof will be omitted here. The first side plate 21a differs from the first side plate 21 in that it is lower in height than the first side plate 21. The configurations and functions of the first side plate 21a other than the height are the same as those of the first side plate 21, and therefore detailed descriptions thereof will be omitted here.

[0094] In the electrode stand 18n, the height of the first side plate 21a is lower than the height of the second side plate 22, so that the upper plate 20 is arranged at an incline such that the end connected to the first side plate 21a is lower than the end connected to the second side plate 22. In the electrode stand 18n, the tip of the lead wire 101 is arranged so that the tip is arranged near the end connected to the second side plate 22 which is arranged in a relatively high position. In the electrode stand 18n, by connecting the tip of the lead wire 101 so that the tip is arranged in a high position, the covering portion of the lead wire 101 connected to the electrode stand 18n can be easily stored in a position lower than the dam material 16, and the risk of blocking the light emitted from the light emitting device 1 is reduced.

[0095] The electrode stand 18o according to the fifteenth modification is different from the electrode stand 18a in the arrangement of the upper plate 30. The configurations and functions of the components of the electrode stand 18o other than the arrangement of the upper plate 30 are the same as those of the electrode stand 18a with the same reference numerals, and therefore detailed explanations are omitted here. The upper plate 30 is arranged so as to be spaced apart from the bottom plate 32 as it is spaced apart from the end connected to the side plate 31.

[0096] In electrode stand 18o, the tip of lead wire 101 is arranged so that the tip is located near the tip of upper plate 30 which is arranged in a relatively high position. By connecting the tip of lead wire 101 so that the tip is located in a high position in electrode stand 18o, the coating of lead wire 101 connected to electrode stand 18o can be easily stored in a position lower than dam material 16, and the risk of blocking light emitted from light emitting device 1 is reduced.

[0097] The electrode stand 18p according to the sixteenth modification is different from the electrode stand 18a in the arrangement of the top surface 40. The configurations and functions of the components of the electrode stand 18p other than the arrangement of the top surface 40 are the same as those of the electrode stand 18d with the same reference numerals, and therefore detailed explanations are omitted here. The top surface 40 is arranged so as to be spaced apart from one side and to be spaced apart from the bottom surface as it approaches the opposing other side.

[0098] In electrode stand 18p, the tip of lead wire 101 is arranged so that the tip is located near the other side of upper surface 40, which is arranged at a relatively high position. In electrode stand 18p, by connecting the tip of lead wire 101 so that the tip is located at a high position, the coating of lead wire 101 connected to electrode stand 18p can be easily stored at a position lower than dam material 16, and the risk of blocking light emitted from light emitting device 1 is reduced.

[0099] Furthermore, although the light emitting device 1 is a COB type light emitting device, the light emitting device according to the embodiment may be a surface mount device (SMD) type light emitting device, a light emitting device mounted with an LED package, or other light emitting devices other than the COB type. When the light emitting device according to the embodiment mounts an LED package, it is preferable that the melting temperature of the solder mounting the LED package is higher than the melting temperature of the first connection member 27.

[0100] Furthermore, although the light emitting device 1 has the dam material 16, the light emitting device according to the embodiment may not have the dam material 16. When the light emitting device according to the embodiment does not have the dam material 16, a material with high thixotropy may be used as the raw material of the sealing material 17, and the raw material of the sealing material 17 may be held by surface tension. When the light emitting device according to the embodiment does not have the dam material 16, a light transmissive sheet containing a phosphor may be disposed so as to cover the multiple LED dies 13, instead of the sealing material 17. [Explanation of symbols]

[0101] 1 Light emitting device 10 Substrate 11a, 11b Wiring patterns 12a, 12b electrode 13 Light emitting element 16 Dam material 17 Encapsulating materials 18, 18a~18p, 19 electrode stand

Claims

1. A substrate on which a pair of electrodes and a pair of wiring patterns connected to the pair of electrodes are formed; A light-emitting element connected to the pair of wiring patterns; A dam material arranged to surround the light emitting element; a sealing material disposed in an area surrounded by the dam material and sealing the light emitting element; a pair of electrode stands formed of a conductive material and arranged to cover the pair of electrodes, a pair of electrode stands each disposed at a position higher than the dam material and each having an upper surface on which a conductive member can be placed, the pair of electrode stands comprising: a first electrode stand;

2. Each of the pair of electrode stands is an upper plate having the upper surface; a bottom plate disposed opposite the top plate and connected to the pair of electrodes; a holding plate having an upper end connected to the upper plate and a lower end connected to the bottom plate, the holding plate holding the upper plate; The light emitting device of claim 1 ,

3. The light emitting device according to claim 2 , wherein the bottom plate has an opening or a notch formed therein.

4. the retaining plate further includes a first side plate extending from one end of the upper plate toward the substrate, and a second side plate extending from the other end of the upper plate toward the substrate; The bottom plate includes a first bottom plate connected to a lower end of a first side plate and extending parallel to an extension direction of the substrate, and a second bottom plate connected to a lower end of a second side plate and extending in a direction opposite to the extension direction of the first bottom plate; The light emitting device according to claim 3 , wherein the opening is a gap formed between the first bottom plate and the second bottom plate.

5. a first connection member formed of a conductive member and arranged around the bottom plate; a second connection member formed of an insulating member and disposed in the opening or the notch; The light emitting device of claim 3 further comprising:

6. The light emitting device according to claim 1 , wherein the upper surface is formed with a recess or a hole.

7. The light emitting device according to claim 1 , wherein each of the pair of electrode stands further includes a protrusion extending from the upper surface in a direction away from the substrate.

8. The light emitting device of claim 7 , wherein the protrusion extends from an end of the top surface adjacent the dam material.

9. The light emitting device according to claim 8 , wherein the protrusion is disposed at an angle so as to cover the upper surface.

10. The light emitting device according to claim 1 , wherein the upper surface is disposed at an angle.

11. A substrate on which a pair of electrodes and a pair of wiring patterns connected to the pair of electrodes are formed; A light-emitting element connected to the pair of wiring patterns; A dam material arranged to surround the light emitting element; a sealing material disposed in an area surrounded by the dam material and sealing the light emitting element; a pair of electrode stands formed of a conductive material and arranged to cover the pair of electrodes, A light-emitting device characterized in that each of the pair of electrode stands has an upper surface on which a conductive member can be placed, and a shielding portion that shields the dam material and the sealing material from flux generated when the conductive member is soldered to the upper surface.

12. Each of the pair of electrode stands has a rectangular planar shape, and further includes a support plate having one side connected to the shielding portion to support the shielding portion, The shielding portion is disposed at an angle so as to cover the support plate, The light-emitting device according to claim 11, wherein each of the pair of electrode stands is positioned so that the edge connected to the shielding portion of the support plate is located between the dam material and the edge opposite to the edge connected to the shielding portion of the support plate.

13. Each of the pair of electrode stands further includes a support stand for supporting the shielding portion, the shielding portion has an upright surface that is an upright surface, and an upper surface that faces the upright surface and has a downwardly convex arc-shaped planar shape, The light-emitting device according to claim 11 , wherein each of the pair of electrode stands is disposed such that the upright surface is located between the dam material and the upper surface.

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