Method for lifting, method for manufacturing another substrate, and lifting device

Abstract

To attain increase of the size of a receptor substrate in a lift device, refining of the substrate, and reduction of a tact time, while keeping a high accuracy of a lift position.SOLUTION: The present invention has a configuration in which each stage group which moves while holding one of a doner substrate and a beam shaping optical system on which a lift target object is mounted and a reduction projection optical system, and a stage group which holds a receptor substrate as a lifting destination are formed on surface plates of separate solid bodies. The configuration allows minimization of vibrations associated with relative scanning of each substrate to laser beams or abnormalities of the synchronous positional accuracy of a stage used for the scanning.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present invention relates to an apparatus for precisely lifting an object located on a donor substrate onto a receptor substrate by laser irradiation (LIFT: Laser Induced Forward Transfer). [Background technology]

[0002] There is a technology in which a laser is irradiated onto an organic EL layer on a donor substrate, and the organic EL layer is lifted onto the opposing circuit substrate. Patent Document 1 discloses a technology in which one laser beam is converted into a plurality of rectangular laser beams having a uniform intensity distribution in a rectangular shape, which are arranged in series and at equal intervals, and the beams are irradiated onto a predetermined region of the donor substrate in a superimposed manner a predetermined number of times at intervals of at least a certain time, which are absorbed by a metal foil positioned between the donor substrate and the organic EL layer, generating an elastic wave, which lifts the peeled organic EL layer onto the opposing circuit substrate.

[0003] In this technology, a spacer having a preferable value of 80 to 100 [μm] is sandwiched between the donor substrate and the circuit substrate, and the substrate integrated with the distance between them kept constant is placed on a stage and scanned relatively with the laser light. However, in this case, a separate process for integrating the opposed donor substrate and the circuit substrate is required, and a donor substrate of the same size as the circuit substrate is required, which requires an increase in manufacturing costs and an increase in the size of the device in accordance with the demand for larger circuit substrates.

[0004] Similarly, Patent Document 2 discloses a technique for lifting an organic EL layer on a donor substrate to an opposing circuit substrate, in which a light absorbing layer is provided between the donor substrate and the organic EL layer, and the light absorbing layer absorbs irradiated laser light to generate shock waves, thereby lifting the organic EL layer to the opposing circuit substrate at a distance of 10 to 100 μm. However, there is no disclosure of a laser light scanning method, a stage configuration for realizing this, or even a lift device. Therefore, this technique cannot be used as a reference for maintaining and improving the lift position accuracy that can accommodate larger circuit substrates.

[0005] Also, in an exposure apparatus used for manufacturing semiconductor devices, a technology related to the step-and-scan method is disclosed in Patent Document 3. The basic idea is to intermittently expose a line of shot areas along the scanning exposure direction of the wafer stage while skipping some shot areas along the way, without stopping the wafer stage along the way. That is, the exposure apparatus includes a reticle stage that holds a reticle, a wafer stage that holds a wafer, and a projection optical system that projects the pattern of the reticle onto the wafer, and performs exposure while scanning both the reticle stage and the wafer stage relative to the projection optical system, and sequentially projects the pattern of the reticle onto multiple shot areas on the wafer, and performs intermittent exposure while scanning and moving the wafer stage without stopping the wafer stage for multiple shot areas on the wafer aligned along the scanning direction. This makes it possible to reduce the impact of vibrations and swings caused by the scanning of the stage on the exposure accuracy, compared to the step-and-repeat method in which the wafer stage is accelerated and decelerated repeatedly, in response to the demand for larger wafers and faster processing speeds.

[0006] However, the technology disclosed in Patent Document 3 is a technology for a semiconductor exposure apparatus based on reduced projection exposure, and its technical field is different from the lift technology of the present invention. In other words, the configuration and scanning technology of the reticle stage and wafer stage in the exposure apparatus are completely different from the stage configuration and scanning technology for reducing and projecting the mask pattern of the present invention onto an object on a donor substrate with high positional accuracy, and further lifting the object to a receptor substrate with the same high positional accuracy. Therefore, this cannot be referred to as the specific stage configuration and its scanning technology of the present invention. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2014-67671 A [Patent Document 2] JP 2010-40380 A [Patent Document 3] JP 2000-21702 A Summary of the Invention [Problem to be solved by the invention]

[0008] The donor stage that holds the donor substrate and the optical stage that holds the optical system mounted on the donor stage, and the receptor stage that holds the receptor substrate are configured as independent mechanisms, and further, the optical stage is not directly mounted on the donor stage, but is configured as a mechanism in which each is independently installed on a highly rigid base, thereby minimizing the effect of vibrations and various errors associated with scanning of each stage on the synchronous position accuracy between the stages. As a result, the objective of the present invention is to provide a lift device that contributes to larger and finer receptor substrates and shorter takt time while maintaining the lift position accuracy. [Means for solving the problem]

[0009] A first invention is an apparatus for selectively peeling off an object located on the front surface of a moving donor substrate by irradiating a pulsed laser beam from the back surface of the donor substrate toward the object and lifting the object onto a receptor substrate that moves opposite the donor substrate, the apparatus comprising: a pulsed laser device; a telescope that converts the pulsed laser beam emitted from the laser device into a parallel beam; a shaping optical system that uniformly shapes the spatial intensity distribution of the pulsed laser beam that has passed through the telescope; a mask that passes the pulsed laser beam shaped by the shaping optical system in a predetermined pattern; and a field lens located between the shaping optical system and the mask. a projection lens for reducing and projecting the laser light that has passed through the pattern of the mask onto the surface of a donor substrate, a mask stage for holding the field lens and the mask, an optical stage for holding the shaping optical system, the mask stage, and the projection lens, a donor stage for holding the donor substrate such that the rear surface of the donor substrate faces the laser light incident side, a receptor stage for holding a receptor substrate, and a programmable multi-axis control device having a trigger output function for the pulsed laser light oscillation and a stage control function, wherein the receptor stage has a Y axis when the horizontal plane is an XY plane, a Z axis in the vertical direction, and a θ-axis in a plane, the donor stage having an X-axis, a Y-axis and a θ-axis, the projection lens being held on the optical stage together with a Z-axis stage for the projection lens, the telescope, the shaping optical system, the field lens, the mask and the projection lens constituting a reduction projection optical system which reduces and projects a pattern of the mask onto a surface of a donor substrate, the X-axis of the donor stage being placed on a base plate 1, the Y-axis of the receptor stage being placed on a base plate 2 different from the base plate 1, and the Y-axis of the donor stage being suspended from the X-axis of the donor stage.

[0010] Here, the "moving" substrate includes a substrate that moves without stopping even when irradiated with pulsed laser light (indicated as "LS" in FIG. 1A. However, although FIG. 1A shows the main components of the second invention, it is referred to because it includes components common to the first invention. The same applies below.) and a substrate that stops when irradiated with pulsed laser light and repeats moving and stopping, which are selected according to the lifting process by the lifting device of the present invention and the required takt time, etc. Also included is a configuration in which the donor substrate (D) repeats moving and stopping, and the receptor substrate (R) does not stop, and vice versa. When only one shot is used to peel off the object from the donor substrate and a high takt time is required, a configuration in which the donor substrate and the receptor substrate move without stopping at the same or different speeds is preferably selected. On the other hand, when it is desired to stack the object to a certain thickness, a configuration in which the donor substrate moves without stopping and the receptor substrate stops for a certain number of shots may be selected.

[0011] The "object" is not particularly limited, and may be a lift object provided on a donor substrate or on a donor substrate via a light absorbing layer (not shown in FIG. 1A), including, but not limited to, a thin film such as the organic EL layer described in the above-mentioned patent document, or a large number of fine elements arranged regularly. The lift mechanism includes, but is not limited to, a shock wave generated by the light absorbing layer irradiated with laser light, which causes the object to be peeled off from the donor substrate and lifted toward the receptor substrate, and an object that does not have a light absorbing layer and is peeled off by laser light irradiated directly to the object.

[0012] The material of the donor substrate should have a transmission characteristic for the wavelength of the laser light, and is preferably one that does not warp much when the substrate is made larger. If the warp is so large that it cannot satisfy the uniformity of the gap between the donor substrate and the receptor substrate, the method of holding the donor substrate on the donor stage (Yd, θd) can be mechanically corrected by providing a suction area near the center of the donor substrate, or a method of correcting the warp using a gap sensor in combination with a height sensor, which will be described later.

[0013] In the present invention, the movable range of the donor stage refers to a range that includes the XY plane area in which the donor substrate must move in order to lift an object located near the edge of the donor substrate onto the receptor substrate, and depends on the size of the receptor substrate. As an example, if the size of the donor substrate in the XY plane is 200×200 [mm] and the receptor substrate is 400×400 [mm], the predetermined range in which the donor stage (Xd, Yd) must move is approximately 800×800 [mm]. This is shown in FIG. 4. If further movement is required to remove the donor substrate, this area is also included.

[0014] In addition, the term "base plate" does not limit the material, but must be a material with extremely high rigidity. Base plate 1 (G1) is preferably in a U-shape or a square-shape when viewed from above to provide rigidity. In addition, in FIG. 1A, base plate 2 is illustrated as a single piece, but more specifically, it may be configured as two base plates installed in the Y-axis direction, with a linear scale and a linear motor placed between them. Base plates 1 and 2 may be fixed on the same base plate (G). Furthermore, G1 may be configured as a combination of base plate 11 (G11) and base plate 12 (G12).

[0015] The material of each surface plate must be a highly rigid material such as steel, stone, or ceramic. For example, the stone material may be, but is not limited to, granite. Also, it is not necessary for all the surface plates to be made of the same material.

[0016] The movement of each stage will be described in detail in the examples below, but generally, the following operations are performed. First, the X-axis (Xd) of the donor stage is installed on G1 with the Y-axis (Yd) of the donor stage suspended, and moves in the X-axis direction. This movement changes the relative position along the X-axis between the donor substrate and the receptor substrate. The state of movement is shown in Figure 1B. Note that in all figures, details such as the movable table and linear guides of the stage are not shown.

[0017] The method of mounting the optical stage (Xo) on a base or the like is not limited, but various mechanisms can be selected, such as a state in which it is placed on Xd, a state in which it is placed on the same base as the base on which Xd is placed, or a state in which it is placed on a base different from Xd. Xo moves in the X-axis direction in parallel with Xd, and moves the shaping optical system (H), the field lens (F), the mask (M), and the projection lens (Pl) as a whole without changing the relative positions of each of them. On the other hand, the movement of Xo along the X-axis changes the relative positional relationship between the donor substrate and the projection lens. The state of this movement is shown in Figure 1C.

[0018] In addition, when there is no need to change the relative positions of the donor substrate and the projection lens in the X-axis direction, a configuration in which they always move together with the X-axis of the donor stage can be used, i.e., the optical stage can be omitted, and the homogenizer, field lens, mask, and projection lens can all be fixed on the X-axis of the donor stage or on a separate base.

[0019] The mask is held on a mask stage, which has at least a W axis that moves in the X axis direction together with the field lens, and preferably also has a U axis in the Y axis direction, a V axis that moves in the Z axis direction, an R axis that is a rotation axis in the YZ plane, a TV axis that adjusts the inclination relative to the V axis, and a TU axis that adjusts the inclination relative to the U axis. In order to suppress the input of heat due to laser irradiation to the mask, an aperture mask having a pattern one size larger than the mask pattern can be provided in front of the mask, and a double mask structure can be formed in combination with the mask.

[0020] The Y axis (Yd) of the donor stage and the Y axis (Yr) of the receptor stage move at the same or different speeds while keeping the gap between the donor substrate and the receptor substrate constant and maintaining extremely high parallelism during the lifting process. By limiting the receptor substrate movement mechanism to the Y axis and separating it from the donor substrate movement mechanism by the above-mentioned structure of the moving method of each stage group and the bases that support them, it is possible to suppress mutual influences due to interference and vibration between the moving areas of the substrates and to accommodate larger and finer receptor substrates.

[0021] A second invention is a lift device according to the first invention, characterized in that the X-axis of the donor stage is placed on the base plate 1, and the optical stage is placed on the X-axis of the donor stage.

[0022] Fig. 1A shows the main components of the lift device according to the second invention (side view). Fig. 1B shows the state (side view) where Xd has moved with Xo on it from the state of Fig. 1A. Fig. 1C shows the state (side view) where Xo has moved on Xd from the state of Fig. 1B. Fig. 1D shows the top view of Fig. 1C.

[0023] A third invention is a lift device according to the first invention, characterized in that the optical stage is placed on the base plate 1 and the X-axis of the donor stage is suspended from the base plate 1.

[0024] Fig. 2A shows the main components of the lift device according to the third invention (side view). Fig. 2B shows the state (side view) where Xd and Xo have moved the same distance on G1 (Xd is suspended from G1) from the state of Fig. 2A. Fig. 2C shows the state (side view) where only Xo has moved on G1 from the state of Fig. 2B.

[0025] A fourth invention is a lift device characterized in that, in the first invention, the X-axis of the donor stage is installed on the base plate 1, and the optical stage is placed on a base plate 3 different from both the base plate 1 and the base plate 2.

[0026] Here, "installed on the surface plate 1" includes a state in which it is placed on the surface plate 1 and a state in which it is suspended from the surface plate 1, but is not limited to these.

[0027] The fifth invention is a lift device according to the first invention, characterized in that it has a rotation adjustment mechanism between the X-axis of the donor stage and the base plate 1, and between the X-axis of the donor stage and the Y-axis of the donor stage, for fine-tuning the installation angle in the XY plane between the two.

[0028] Here, an example of a rotation adjustment mechanism (RP) to be installed between the X-axis (Xd) of the donor stage and the surface plate 1 (G1) is shown in FIG. 3A. In FIG. 3A, the left side shows a top view, and the right side shows a side view from the X-axis direction. The row of holes located on the outside in the top view is used for fixing to G1, and has a "play" (room / slack) to provide the rotation adjustment function. Furthermore, the two rows of holes located on the inside in the top view are holes through which screws are inserted to fix the RP and the linear guide of Xd. It is possible to use the side with the "play" as the hole for the linear guide of Xd, but if two linear guides are fixed independently and in parallel, the installation process may become more difficult.

[0029] On the other hand, an example of an RP installed between Xd and the Y axis (Yd) of the donor stage suspended from it is shown in Figure 3B. The two rows of holes located on the outside in the top view are used for fixing to Xd and have "play" to provide rotation adjustment function. Furthermore, the two rows of holes aligned in the Y-axis direction are used for fixing to Yd.

[0030] In addition, an RP different from the above can be used as the RP to be placed between G1 and Xd. For example, (not shown) a fulcrum (rotation axis in the Z-axis direction) for rotating and adjusting the RP on which Xd is placed relative to G1 in the XY plane is provided on the contact surface between the RP and G1, and a force point for the fulcrum is provided on the side (vertical surface) of the RP sufficiently distant from the fulcrum. A large screw is placed on G1 near the force point, which is pressed horizontally toward the force point. Similarly, a large screw is placed on the side of the RP on the opposite side. This allows the RP on which Xd is placed to rotate in the XY plane on the order of [μrad] around the fulcrum relative to G1.

[0031] A sixth invention is a lift device according to the second invention, characterized in that it has rotation adjustment mechanisms for fine-tuning the installation angles in the XY plane between the X-axis of the donor stage and the base plate 1, between the X-axis of the donor stage and the optical stage, and between the X-axis of the donor stage and the Y-axis of the donor stage.

[0032] As these RPs, for example, the RP used between G1 and Xd shown in FIG. 3A, the RP used between Xd and Xo shown in FIG. 3C, and the RP used between Xd and Yd shown in FIG. 3B can be used.

[0033] The seventh invention is a lift device according to the third invention, characterized in that it has rotation adjustment mechanisms for fine-tuning the installation angles in the XY plane between the X-axis of the donor stage and the base plate 1, between the optical stage and the base plate 1, and between the X-axis of the donor stage and the Y-axis of the donor stage.

[0034] Here, for example, the RP shown in Fig. 3A is used as the rotation adjustment mechanism between Xo and G1 and between Xd and G1, while the RP shown in Fig. 3B is used as the rotation adjustment mechanism between Xd and Yd. The former RP has holes through which the linear guide fixing screws of Xo and Xd pass, and the installation angle in the XY plane between the RP to which the linear guides for each stage are fixed and G1 is adjusted by the "play" provided in the holes.

[0035] The eighth invention is a lift device according to the fourth invention, characterized in that it has rotation adjustment mechanisms for fine-tuning the installation angles in the XY plane between the X-axis of the donor stage and the base plate 1, between the optical stage and the base plate 3, and between the X-axis of the donor stage and the Y-axis of the donor stage.

[0036] A ninth invention is a lift device according to any one of the first to eighth inventions, characterized in that the pulse laser device is an excimer laser.

[0037] Here, the oscillation wavelength of the excimer laser is mainly 193, 248, 308 or 351 [nm], but a suitable wavelength is selected from these depending on the material of the light absorption layer and the light absorption characteristics of the target object.

[0038] A tenth invention is the lift device according to the ninth invention, characterized in that it is provided with a pulse shutter that blocks any pulse train of laser pulses emitted from the pulse laser device.

[0039] A pulsed laser device receives a trigger signal from the programmable multi-axis control device and starts oscillating, but it is known that the energy of a certain number of pulses or a certain period of time immediately after the oscillation is so unstable that it cannot be used depending on the application. Therefore, in order to eliminate this unstable pulse group, it is necessary to eliminate it by mechanical shutter operation. Specifically, for example, in the case of an excimer laser oscillating at 1 [kHz], the time window between adjacent laser pulses is about 1 [ms], and a high-speed shutter function that can move (cross) a certain distance within this time is required. This certain distance depends on the spatial size of the laser light at the place where the shutter is operated, and if the distance is 5 [mm], the required shutter operation speed is 5 [m / s], and an ultra-high-speed shutter that moves an optical element in and out of the optical path using a voice coil or the like is required. Note that even if the spatial size can be reduced by a shaping optical system or the like and the distance crossed by the shutter member can be shortened, it can easily be damaged depending on the energy density of the laser light.

[0040] The 11th invention is a lift device according to any one of the first to tenth inventions, characterized in that the programmable multi-axis control device has a function of simultaneously controlling at least the Y axis of the receptor stage and the Y axis of the donor stage, and is equipped with a means for correcting the movement position error using two-dimensional distribution correction value data that has been created in advance to correct the movement position error of each stage.

[0041] For example, the position of the receptor substrate and the donor substrate during irradiation with the laser light is corrected by using two-dimensional distribution correction value data information in a pseudo XY plane by any combination of Xd or Xo and Yr or Yd. The causes of the position error to be corrected include, but are not limited to, pitching, yawing, and rolling accompanying the movement of each stage. In addition, the parameters for determining the correction value include the movement speeds of Yr and Yd and their ratio in addition to the position information of each stage.

[0042] The 12th invention is a lift device according to any one of the first to 11th inventions, characterized in that a high-magnification camera for monitoring the position of the donor substrate is installed on the Z axis of the receptor stage, or a high-magnification camera for monitoring the position of the receptor substrate is installed on the X axis of the donor stage or a part that moves therewith, or on the optical stage or a part that moves therewith.

[0043] Here, the "part that moves with the X-axis of the donor stage" includes Yd suspended from Xd. In the present invention, the parallelism between the Y-axes of each stage, the parallelism between the X-axes of each stage, and the squareness between the Y-axis and the X-axis of each stage are important parameters that affect the lift position accuracy. In verifying the parallelism and squareness when assembling each stage, the amount of deviation in the direction perpendicular to the movement distance of each stage holding the alignment substrate is monitored by a high-magnification and high-resolution camera, and the squareness is adjusted using the rotation adjustment mechanism. In adjusting the parallelism between Yr and Yd, both stages are moved (run parallel) the same distance in synchronization, and a high-magnification camera attached to one stage is used to observe whether the position of the pattern-matched alignment mark image (such as a cross mark) attached to the opposing stage is stationary without moving. In this case, movement in the Y-axis direction means an abnormality in the synchronization between Yd and Yr, and movement in the X-axis direction means an adjustment error in the parallelism between Yd and Yr.

[0044] Generally, a CCD camera is used as the high-magnification camera. Although the magnification depends on the lift position accuracy, for example, when detecting the above-mentioned deviation amount on the order of [μrad], that is, when detecting the deviation amount of 1 [μm] for a stage movement distance of 1 [m], it is recommended to use a camera with a resolution of 1 [μm] and a magnification of about 20 to 50 times.

[0045] A 13th invention is a lift device according to any one of the first to 12th inventions, characterized in that the donor stage and the receptor stage are equipped with a gap sensor that measures the gap between the surface (lower surface) of the donor substrate and the surface of the receptor substrate.

[0046] Here, the gap sensor is a combination of height sensors installed on both the donor and receptor stages. The height sensor installed on the donor stage measures the distance to the receptor substrate, and the height sensor installed on the receptor stage measures the distance to the donor substrate. The gap between the donor substrate and the receptor substrate is calculated from both measurement values ​​and the height information from the height sensors.

[0047] The 14th invention is a lift device according to any one of the 11th to 13th inventions, characterized in that it is equipped with position measurement means using laser interferometers for the Y axis of the receptor stage and the Y axis of the donor stage.

[0048] The laser interferometer for the Y-axis (Yr) of the receptor stage can be configured to include a mirror (Ic) held in a portion that moves together with Yr, an interferometer laser (IL) fixed to a base plate that is not easily affected by vibrations caused by the movement, such as base plate 2 (G2), and a quarter-wave plate (not shown). Preferably, a three-axis corner cube (retroreflector) is used as the mirror, and it is desirable to position it as close as possible to the position (height) of the receptor substrate. An outline is shown in Figure 5A. (The Z-axis and θ-axis of the donor stage group and receptor stage are not shown.)

[0049] Although Yr is controlled by a programmable multi-axis control device based on position information from the linear encoder, this laser interferometer is used to calibrate the linear encoder and also to calibrate the gear ratio when finely adjusting it in the gear mode operation of Yr and Yd described below.

[0050] The laser interferometer for the Y-axis (Yd) of the donor stage can be configured to include Ic held on a surface that moves together with Yd suspended from Xd, IL fixed to Xd, and a quarter-wave plate (not shown). Again, it is preferable to use a three-axis corner cube (retroreflector) as the mirror, and it is desirable to be as close as possible to the position (height) of the donor substrate. An outline is shown in Figure 5B. (The receptor stages are not shown.) The detection method for any of the interferometer lasers can be selected based on the required lift position accuracy.

[0051] The 15th invention is a lift device according to any one of the first to fourteenth inventions, characterized in that it is equipped with a confocal beam profiler having an imaging plane at a position conjugate to the position where the mask pattern is reduced and projected by the projection lens to form an image.

[0052] This confocal beam profiler makes it possible to monitor the position and spatial intensity distribution of the laser light projected onto the donor substrate surface in a reduced size, as well as its imaging state, in real time and with an accuracy equivalent to the imaging resolution of the reduced imaging optical system.

[0053] The 16th invention is a method of using a lift device according to any one of the 13th to 15th inventions, characterized in that, in any one of the 13th to 15th inventions, the amount of deflection of the donor substrate is measured in advance using the gap sensor together with XY position information of the donor substrate, and based on two-dimensional distribution data of the amount of deflection obtained by the measurement, the gap between the donor substrate and the receptor substrate is corrected by adjusting the Z axis (Zr) of the receptor stage or the Z axis stage of the projection lens, while lifting the donor substrate.

[0054] A seventeenth aspect of the present invention is a method for adjusting the parallelism of the Y axis of the receptor stage and the Y axis of the donor stage in the assembly process of the lift device according to any one of the eleventh to sixteenth aspects of the present invention, comprising the steps of: using the Y axis, the straightness of which has been adjusted together with the Z axis and the θ axis of the receptor stage, as a reference, adjusting the perpendicularity of the Y axis of the receptor stage and the X axis of the donor stage by a rotation adjustment mechanism located between the base plate 1 and the X axis of the donor stage; and adjusting the Y axis of the donor stage suspended from the X axis of the donor stage whose perpendicularity has been adjusted. a step of observing an alignment mark on the Y axis of the opposing donor stage with a high-magnification camera attached to a position that moves together with the Y axis of the receptor stage; and a step of adjusting the parallelism of the Y axis of the receptor stage and the Y axis of the donor stage based on the results of the observation using a rotation adjustment mechanism between the X axis of the donor stage and the Y axis of the donor stage.

[0055] In addition, in order to accurately check and adjust the parallelism of Yd and Yr, it is desirable to attach the high-magnification camera to the highest position of each stage or plate placed on Yr and to a highly rigid part. Effect of the Invention

[0056] The present invention, based on the high synchronous positional accuracy of the donor substrate and the receptor substrate, realizes an increase in size of the receptor substrate in the lift device and a reduction in tact time while maintaining high lift positional accuracy. [Brief description of the drawings]

[0057] [Figure 1A] 1 shows the main components of a lift device according to the present invention (side view). (Second invention) [Figure 1B] This shows the state (side view) in which the X-axis of the donor stage has moved with the optical stage placed on it from the state in FIG. 1A. [Figure 1C]This shows the state (side view) in which the optical stage has moved on the X-axis of the donor stage from the state shown in FIG. 1B. [Figure 1D] Top view of FIG. 1C. [Figure 2A] 1 shows the main components of a lift device according to the present invention (side view). (Third invention) [Figure 2B] This shows the state (side view) in which the X-axis of the donor stage and the optical stage have moved the same distance on the base 1 from the state in FIG. 2A. [Figure 2C] 2B, only the X-axis of the donor stage is moved on the base 1 (side view). [Figure 3A] An example of a rotation adjustment mechanism used between G1 and Xd is shown. [Figure 3B] An example of a rotation adjustment mechanism for use between Xd and Yd is shown. [Figure 3C] An example of a rotation adjustment mechanism used between Xd and Xo is shown. [Figure 4] The range in which the donor stage should move depending on the size of the receptor substrate is shown. [Figure 5A] This shows the Y-axis laser interferometer installed on the receptor stage. [Figure 5B] The Y-axis laser interferometer for the donor stage is shown installed. [Figure 6] 4 shows an example of a pattern applied to a mask. [Figure 7] 1 shows the lift process using a mask pattern with multiple rows. [Figure 8] The confocal beam profiler monitor is shown. [Figure 9A] The first shot of the lifting process is shown. [Figure 9B] Shows the second shot of the lifting process. [Figure 9C] Shows the third shot of the lifting process. [Figure 10] The appearance of the receptor substrate after one scan with a gear ratio of 1:2 is shown. [Figure 11] The figure shows the step scanning of the X-axis of the donor stage. [Figure 12] The synchronous position error when translating the Y-axis of the receptor stage and the Y-axis of the donor stage is shown. [Figure 13A] The first shot of the lift process using a matrix of donor substrates is shown. [Figure 13B] The second shot of the lift process using a matrix of donor substrates is shown. [Figure 13C] The third shot of the lift process using a matrix of donor substrates is shown. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0058] Hereinafter, a specific configuration of the lift device according to the present invention will be described in detail with reference to the drawings. EXAMPLES

[0059] In this embodiment 1, a layered (solid film) object formed in one piece on a donor substrate measuring 200×200 mm via a light absorbing layer is lifted onto a receptor substrate measuring 400×400 mm in a matrix of 12,000 vertical×12,000 horizontal elements, each with a shape of 10×10 μm, for a total of 144 million lift objects. The lift positions of these 144 million objects have a positional accuracy of ±1 μm, and the vertical and horizontal pitches of each object are 30 μm.

[0060] First, the main components of the lift device according to the present invention are shown in FIG. 1A. In FIG. 1A, the laser device, the control device, and other monitors are omitted, and the X-axis, Y-axis, and Z-axis directions are shown in the figure. The surface plate 1 (G1), the surface plate 11 (G11), the surface plate 12 (G12), and the surface plate 2 (G2) are all stone surface plates using granite. And the base surface plate (G) is made of highly synthetic iron. This embodiment is based on the configuration of the sixth invention described above.

[0061] The configuration of the lift device according to the first embodiment of the present invention will be described in order along the propagation of the laser light from when the pulsed laser light is emitted from the laser device to when the target object on the donor substrate is irradiated. First, the laser device used in this first embodiment is an excimer laser with an oscillation wavelength of 248 [nm]. The spatial distribution of the emitted laser light is approximately 8 x 24 [mm], and the beam divergence angle is 1 x 3 [mrad]. All of the figures are expressed in (length x width), and the numerical values ​​are FWHM.

[0062] There are various specifications for excimer lasers, including differences in output, repetition frequency, beam size, beam spread angle, and even laser beams that are vertically elongated (with the vertical and horizontal directions reversed), but there are many excimer lasers that can be used in this embodiment 1 by adding, omitting, or modifying the design of the optical system. Also, although it depends on the size of the laser device, it is generally installed on a base (laser surface plate) that is different from the base on which the stages of the lift device are installed.

[0063] The light emitted from the excimer laser enters the telescope optical system and propagates to the shaping optical system. Here, as shown in FIG. 1A, the shaping optical system is held on an optical stage (Xo) with its optical axis along the X-axis, and the optical stage is installed on the X-axis (Xd) of the donor stage that moves the donor substrate. The laser light just before entering the shaping optical system is adjusted by the telescope optical system so that it becomes approximately parallel light at any position within the movement range of the X-axis of the donor stage. Therefore, regardless of the movement of Xd and / or Xo in the X-axis direction, the laser light always enters the shaping optical system with approximately the same size and at the same angle (vertical). In this embodiment 1, the size is approximately 25×25 [mm] (length×width).

[0064] The shaping optical system (H) in this embodiment 1 is a combination of two pairs of uniaxial cylindrical lens arrays arranged at right angles in a plane perpendicular to the optical axis direction. The first lens array in each group is arranged to form an image on the mask (M) by the second lens array and a condenser lens (not shown) located behind it.

[0065] The laser light that passed through the shaping optical system is incident on the mask via the field lens (F), which, in combination with the projection lens (Pl), constitutes an image-side telecentric reduction projection optical system. The size of the laser light on the mask is 1 x 50 [mm] (FWHM), and the size of the area where the spatial intensity distribution uniformity is within ±5% is maintained at 0.5 x 45 [mm] or more.

[0066] The mask is fixed to the mask stage, which has a six-axis adjustment mechanism: the W axis that moves in the X-axis direction together with the field lens as mentioned above, the U axis that moves in the Y-axis direction, the V axis that moves in the Z-axis direction, the R axis which is the rotation axis within the YZ plane, the TV axis which adjusts the tilt relative to the V axis, and the TU axis which adjusts the tilt relative to the U axis.

[0067] The mask used in this embodiment 1 is a synthetic quartz plate on which a pattern is drawn (applied) by chrome plating. FIG. 6 shows an outline of the mask. In this mask, the window portion (a) shown in white and not plated with chrome transmits the laser light, and the colored portion (b) plated with chrome blocks the laser light. The shape of each window (a) is 50×50 μm, and a total of 300 of these are arranged in the X-axis direction (in a row) over 43.85 mm at intervals of 150 μm. The surface to be plated with chrome is the emission side of the laser light, while the incidence side is coated with an anti-reflection film for 248 nm. Furthermore, aluminum deposition or a dielectric multilayer film can be used instead of chrome plating.

[0068] In the case of a lift process in which multiple patterns are switched between on a single mask, masks with different patterns drawn on them can be used as long as they are within the range of the size of the laser light irradiated onto the mask from the shaping optical system and within the movable range of the mask stage.

[0069] In addition, in Fig. 7, when using a lifting process in which the donor substrate (D) is scanned multiple times or back and forth at the same speed while the receptor substrate (R) is scanned once (including stops along the way), it is also possible to adopt a mask pattern of multiple rows (however, the laser irradiation is performed intermittently and selectively within the mask pattern. In Fig. 7, it is shown as a 3 x 2 matrix). This makes it possible to use a donor substrate smaller in size than the receptor substrate.

[0070] The laser light that passes through the mask pattern is changed in its propagation direction to a vertically downward direction (-Z direction) by the epi-mirror and enters the projection lens. This projection lens is coated with an anti-reflection film for 248 nm and has a reduction ratio of 1 / 5. Details are shown in Table 1 below.

[0071] [Table 1]

[0072] The laser light emitted from the projection lens is incident on the back surface of the donor substrate and is accurately projected at a predetermined position on the light absorption layer formed on the front surface (lower surface) of the donor substrate at a reduced size of 1 / 5 of the mask pattern. Here, the predetermined position in the XY plane is determined after adjustment by the X-axis (Xd), Y-axis (Yd), and θ-axis (θd) of the donor stage based on an alignment mark or the like previously attached to the donor substrate.

[0073] To adjust the image plane of the mask pattern by the projection lens so that it is focused on the interface between the surface of the donor substrate and the light absorbing layer, adjust the Z-axis stage (Zl) of the projection lens and the W-axis position of the mask stage carrying the field lens (F). Note that it is possible to add an adjustment function (Z-axis stage) in the Z-axis direction of the donor substrate, but it is necessary to take into consideration the decrease in lift position accuracy due to the increased weight load on the X-axis (Xd) of the donor stage.

[0074] When adjusting the imaging position at the interface between the donor substrate surface and the light absorbing layer, a real-time monitor using a confocal beam profiler (BP) whose imaging plane is a plane that is conjugate with the imaging plane is effective. The state of the adjustment screen is shown in Fig. 8. In this embodiment 1, the spatial intensity distribution of the laser light imaged in a reduced form at the interface between the donor substrate surface and the light absorbing layer is monitored in real time with high resolution.

[0075] The above is the function performed by the device configuration in the present embodiment 1 regarding the propagation of the pulsed laser light emitted from the laser device.

[0076] Next, a brief description will be given of how the parallelism of the Y axis (Yr) of the receptor stage and the Y axis (Yd) of the donor stage in the device according to the present invention is mechanically achieved using the configuration of this embodiment 1.

[0077] As shown in Figure 1A, the X-axis (Xd) of the donor stage is placed on the granite base 1 (G1), and the optical stage (Xo) is placed on top of that. The receptor stage group (Yr, θr, Zr) is placed on the granite base 2 (G2). The whole is constructed on the base base (G). The rotation adjustment mechanisms (RP) are installed between G1 and Xd, between Xo and Xd, and between Xd and Yd (not shown).

[0078] In order to adjust the perpendicularity and parallelism of the axes of each stage, an adjustment substrate AD is used to be held on the donor stage instead of the donor substrate, and an adjustment substrate AR is used to be placed on the receptor stage instead of the receptor substrate. Lines indicating the X-axis (alignment line X) and Y-axis (alignment line Y), which form an exact right angle, are drawn on each adjustment substrate as alignment lines, and marks are also provided at predetermined positions (intervals).

[0079] 1) Parallelism of Yr and AR(Y) (perpendicularity of Yr and AR(X)) In order to adjust the parallelism between the Y-axis (Yr) of the receptor stage and the alignment line Y on the adjustment substrate AR, the adjustment substrate AR placed on the Z-axis (Zr) of the receptor stage is observed by a high-magnification CCD camera fixed to the optical stage (Xo) or the Z-axis stage for the projection lens installed thereon. The Yr axis is moved 400 [mm], and the θ-axis (θr) of the receptor stage is used for adjustment so that the deviation of the alignment line Y in the X-axis direction is within 1 [μm]. Note that the moving distance of the stage at this time is within the range of the effective stroke of the stage, and the allowable deviation varies depending on the required lift accuracy. (The same applies below.)

[0080] 2) Parallelism between AR(X) and Xd (perpendicularity between Yr and Xd) Next, using the alignment line X of the adjustment substrate AR adjusted as described above, the perpendicularity between the X-axis (Xd) of the donor stage and the Y-axis (Yr) of the receptor stage is adjusted while observing with a high-magnification CCD camera fixed to the optical stage (Xo) or the Z-axis stage for the projection lens installed thereon. The Xd axis is moved by 400 [mm], and the mounting angle between G1 and Xd is adjusted using the rotation adjustment mechanism between them described above so that the deviation of the alignment line X in the Y-axis direction is within 1 [μm], and G1 and Xd, i.e., the mounting angle of Xd relative to Yr, are also adjusted.

[0081] 3) Parallelism between AR(X) and Xo (squareness between Yr and Xo, parallelism between Xd and Xo) Using the alignment line X of the adjustment substrate AR adjusted as described above, the parallelism between the optical stage (Xo) and the X-axis (Xd) of the donor stage is adjusted while observing with a high-magnification CCD camera fixed to the optical stage (Xo) or a Z-axis stage for a projection lens installed thereon. The Xo axis is moved by 200 [mm], and the parallelism of the optical stage (Xo) with respect to the X-axis (Xd) of the donor stage is adjusted by a rotation adjustment mechanism between them so that the deviation of the alignment line X in the Y-axis direction is within 0.5 [μm].

[0082] 4) Parallelism of Yd and AD(Y) In order to adjust the parallelism between the Y-axis (Yd) of the donor stage and the alignment line Y on the adjustment substrate AD, the adjustment substrate AD held on the θ-axis (θd) of the donor stage is observed by a high-magnification CCD camera fixed to the optical stage (Xo) or the Z-axis stage for the projection lens installed thereon. The Yd-axis is moved by 200 [mm], and the θ-axis (θd) of the donor stage is used for adjustment so that the deviation of the alignment line Y in the X-axis direction is within 0.5 [μm].

[0083] 5) Parallelism between AD(X) and Xo (parallelism between AD(X) and Xd, perpendicularity between Xd and Yd) To adjust the perpendicularity of the X-axis (Xd) of the donor stage and the Y-axis (Yd) of the donor stage, the alignment line X on the adjustment substrate AD is observed by a high-magnification CCD camera fixed to the optical stage (Xo) whose parallelism with the X-axis (Xd) of the donor stage has already been adjusted, or to the Z-axis stage for the projection lens installed on the optical stage. The optical stage (Xo) is moved by 200 [mm], and the perpendicularity of the alignment line X with the Y-axis (Yd) of the donor stage suspended from the X-axis (Xd) of the donor stage is adjusted by the rotation adjustment mechanism between them so that the deviation in the Y-axis direction of the alignment line X is within 0.5 [μm].

[0084] 6) Parallelism between AD(Y) and Yr (Parallelism between Yd and Yr) Finally, to check the parallelism between the Y axis (Yd) of the donor stage and the Y axis (Yr) of the receptor stage, a high-magnification CCD camera is attached to the Y axis (Yd) of the donor stage and the alignment line Y of the adjustment substrate AR placed on the opposing receptor stage is observed. At this time, the adjustment board AD is removed. The X-axis (Xd) of the donor stage is moved so that the high-magnification CCD camera can observe any one end of the receptor stage. Next, the Y-axis (Yd) of the donor stage is moved 400 [mm], and it is confirmed that the deviation of the alignment line Y in the X-axis direction is within 1 [μm]. Furthermore, to perform the same check at the other end of the receptor stage, Xd is moved to the other end, and then Yd is moved 400 [mm] again, and it is confirmed that the deviation of the alignment line Y in the X-axis direction is within 1 [μm]. It is also possible to move Yd and Yr in parallel to observe the fluctuation in the position of the alignment mark.

[0085] Furthermore, if a high-magnification CCD camera is attached to the Y-axis (Yd) of the donor stage, there is a possibility that it may come into contact with these depending on the position of the X-axis of the donor stage and the shape (opening) of the stone surface plate 1. In that case, it is also possible to attach the high-magnification CCD camera to the Z-axis (Zr) of the receptor stage instead of Yd, and move the Y-axis (Yr) of the receptor stage by 200 [mm] to observe the alignment line Y of the adjustment substrate AD and confirm the amount of deviation in the X-axis direction.

[0086] Since the stone surface plate 1 (G1) and the stone surface plate 2 support each stage independently, and Yd is suspended from Xd installed on G1, the parallelism of Yr and Yd cannot be adjusted directly, but the parallelism of Yr and Yd is adjusted in the order of [μrad] in stages as described above. Note that as the adjustment steps from 1) to 6) are carried out in order, the error in parallelism (squareness) accumulates, so it is desirable to adjust the allowable deviation in the initial stage as small as possible. In addition, although the adjustment steps from 1) to 6) above describe the adjustment of the parallelism and squareness of each stage in the XY plane, adjustments around other axes (X axis and Y axis) are also necessary.

[0087] Next, the scanning of the donor substrate and the receptor substrate during lifting in this Example 1 will be described with reference to Figures 9A to 9C. Here, the top views of Figures 9A to 9C are images of an operator placed on the left side of these figures, with the donor substrate (D) and the receptor substrate (R) scanning back and forth relative to the operator.

[0088] First, the amount of deflection of the donor substrate, which is attached to the θ-axis (θd) of the donor stage, is measured over the entire surface of the donor substrate, and this is mapped as two-dimensional data together with the position information. This information is used as the correction amount for the Z-axis (Zr) of the receptor stage, which corresponds to the X-axis (Xd) and Y-axis (Yd) of the donor stage that moves during the lift process.

[0089] For the sake of convenience in the following description, a predetermined position on the front left side of the receptor substrate (R) and the donor substrate (D) as seen from the operator is defined as the origin of each substrate. The positions of the optical stage (Xo) and the receptor stage (Yr, θr) when the laser light is irradiated to the origin of the receptor substrate are defined as the origins, respectively. Similarly, for the donor substrate, the position of the donor stage (Xd, Yd, θd) when the laser light (LS) is irradiated is defined as the origin, respectively. However, the origin of each stage is not necessarily one end of its stroke range, but is a position that leaves a stroke for the subsequent lifting process or removal of the substrate.

[0090] FIG. 9A shows how the first pulse of laser light (LS) is irradiated onto the donor substrate (D) and receptor substrate (R) at the origin position. Here, both side view and top view are shown. The dashed-dotted line shows how the laser light is irradiated onto the target (S) by the reduced projection optical system, and the light absorbing layer (not shown) of the irradiated 10×10 [μm] area absorbs the laser light, is ablated, and generates a shock wave, which lifts the target of the same area onto the opposing receptor substrate. Although three targets are shown, in the case of this Example 1, a total of 300 targets are lifted toward the receptor substrate at one time.

[0091] In this Example 1, the laser device oscillates at 200 [Hz], and the lift is performed in one shot, so the receptor stage (Yr) scans the receptor substrate in the -Y direction at a speed of 6 [mm / s] without stopping to the next irradiation position.

[0092] On the other hand, the Y axis (Yd) of the donor stage is synchronized with the Y axis (Yr) of the receptor stage, and the donor substrate is scanned in the -Y direction at a speed of 3 [mm / s] without stopping. In other words, the ratio of the moving speeds (gear ratio) of Yd and Yr is 1:2. The state of the second shot after each substrate has moved is shown in Figure 9B.

[0093] The positions of Yr and Yd are synchronized by setting Yr as the reference (master) and Yd as the slave (slave), using the gear command of the stage system to operate both stages in gear mode synchronization. A programmable multi-axis control device is used for the control system.

[0094] In addition, the actual measurement value of the stage position by the laser interferometer is used to determine the gear ratio in the gear command. A corner cube (Ic) that moves with the moving table Yr and constitutes a laser interferometer is attached near the receptor substrate, and a He-Ne laser (IL) with a wavelength of 632.8 [nm] and a light receiving unit (not shown in FIG. 5A) are installed on the stone surface plate 2 (or an equivalent fixed position). Similarly, a corner cube is attached to the side of the moving table Yd, and the interferometer laser and light receiving unit (not shown in FIG. 5B) are installed on Xd. This realizes accurate position synchronization of each stage.

[0095] As mentioned above, each stage starts accelerating from a position just before the origin so that it is already in a stable uniform speed motion at the origin. During the acceleration time and the time until the stage reaches the origin, the laser pulse must be blocked so that the donor substrate is not irradiated with the laser light. Therefore, the programmable multi-axis control device transmits an external oscillation trigger or a high-speed shutter operation start trigger to the laser device, and a stage drive signal with high precision.

[0096] Furthermore, the state of the third shot is shown in Figure 9C. As can be seen from the figure, the movement distance of the receptor substrate (R) is twice that of the donor substrate (D). After this, the movement of the receptor substrate and the donor substrate proceeds in the same manner.

[0097] When the donor substrate has finished scanning 180 [mm] in the -Y direction, and when the receptor substrate has finished scanning 360 [mm] in the -Y direction, the laser oscillation is temporarily stopped or the laser light irradiation is blocked by a high-speed shutter. By scanning this distance, 300 objects lined up in the X-axis direction are lifted in 12,000 steps in the Y-axis direction of the receptor substrate, for a total of 3.6 million objects. Figure 10 shows how this works.

[0098] During the stop time, the Y-axis (Yr) of the receptor stage and the Y-axis (Yd) of the donor stage both return to the origin. (However, the acceleration distance in the next scan must be taken into consideration. The same applies below.) Meanwhile, the X-axis (Xd) of the donor stage returns to a position -9 mm from the previous origin. Then, the lift process starts again from a new area. This process is repeated.

[0099] In Fig. 11, after the step movement of -9[mm] x 20 times of Xd, the stage returns to a position (indicated by a solid line) 15[μm] in the -X direction from the previous origin (indicated by a dotted line), and the same operation is started with this point as the new origin. After this, the Y-axis scanning of both stages (180[mm] (Yd) and 360[mm] (Yr)) and the step operation of -9[mm] x 20 times of Xd are repeated. As a result, the laser light is irradiated to the area not irradiated with the laser light during the first 180[mm] scan of Xd (20 step movements of -9[mm]) (in the figure, the area to be irradiated with the next laser light (LS) is shown by a dashed line) and the object on the donor substrate can be lifted to the receptor substrate without waste and in larger quantities.

[0100] The approximate processing time is 360 [mm] / 6 [mm / s] x 40 [times] = 2400 [s]. Note that this time does not include the time it takes for the receptor stage's Y-axis (Yr) to travel the distance required for acceleration and deceleration, or the time it takes for the receptor stage to return to the origin after each Y-axis scan. In addition, by increasing the repetition frequency of the excimer laser to 1 [kHz], this processing time can be reduced to 1 / 5.

[0101] 12 shows the synchronous position error of both stages when the Y axis (Yr) of the receptor stage is translated synchronously at a moving speed of 150 [mm / s] over a distance of 400 [mm] with the Y axis (Yr) of the receptor stage as the reference (master) and at a moving speed of 75 [mm / s] over a distance of 200 [mm] with the Y axis (Yd) of the donor stage as the slave (slave) in this embodiment. Specifically, the difference (ΔYdr=δYd-δYr) between the error amount (δYr) between the position information obtained from the linear encoder and the position information measured by the laser interferometer for Yr as the reference (master) and the error amount (δYd) between the position information obtained from the linear encoder and the position information measured by the laser interferometer for Yd as the slave (slave) moving synchronously at 1 / 2 the speed of Yr is plotted as the elapsed time according to the moving speed of the receptor stage on the horizontal axis. As can be seen from these results, a position synchronization accuracy of within ±1 μm was achieved over a travel distance of 400 mm.

[0102] As described above, the lift pattern of the object onto the receptor substrate in this Example 1 is a matrix of 10 x 10 [μm] lifted at intervals of 30 [μm]. However, if the interval is set to 60 [μm], for example, it becomes possible to lift the equivalent of four receptor substrates with one donor substrate. EXAMPLES

[0103] In this Example 2, unlike Example 1 in which the objects on the surface of the donor substrate were in a single layer state, a total of 144 million objects, each 10×10 μm in size and spaced 15 μm apart, are formed in a matrix on a donor substrate also measuring 200×200 mm, and are lifted to a receptor substrate measuring 400×400 mm in size at half the density of the donor substrate, i.e., spaced 30 μm apart, in the same matrix state.

[0104] The arrangement of the objects finally lifted onto the receptor substrate is the same as in Example 1, but in Example 2, the objects are similarly arranged on the donor substrate in advance at twice the density, and are lifted onto the receptor substrate with a positional accuracy of ±1 μm, which is different. In this case, the positional synchronization accuracy of the Y axis (Yd) of the donor stage and the Y axis (Yr) of the receptor stage is required to be even stricter than in Example 1.

[0105] 13A to 13C, similarly to Example 1, the states of a donor substrate (D) and a receptor substrate (R) at the origin position, from when the first pulse of laser light (LS) is irradiated to the third shot, are shown. EXAMPLES

[0106] In this Example 3, the method of lifting the target object on the donor substrate surface to the receptor substrate is the same as in Example 1 or 2. On the other hand, the method of adjusting the parallelism between the Y axes of each stage and the parallelism between the X axes of each stage, and the perpendicularity between each Y axis and X axis is different from the above examples. That is, while the adjustment method described in Example 1 performs the adjustment steps 1) to 6) to adjust the parallelism between the Y axis (Yr) of the receptor stage and the Y axis (Yd) of the donor stage, in this Example 3, the parallelism between Yr and Yd is performed at an early stage of the adjustment steps.

[0107] 1) Straightness of Yr, θr, and Zr This adjustment step is a prerequisite adjustment step common to the above-mentioned Examples 1 and 2. The Y-axis (Yr) of the receptor stage installed on the stone surface plate 2 (G2), the θ-axis (θr) installed thereon, the Z-axis (Zr) and the straightness of the receptor substrate holder (straightness with respect to the Z-axis, which is the vertical direction when the horizontal plane is the XY plane) are adjusted using a laser interferometer or the like. Note that, basically, after this adjustment, no adjustment that may affect the squareness of the receptor stage group is made, and all adjustments of other stages are made based on, for example, the top surface of this receptor stage group.

[0108] 2) Parallelism of Yr and AR(Y) (perpendicularity of Yr and AR(X)) As in adjustment step 1) of Example 1, the parallelism between the Y axis (Yr) of the receptor stage and the alignment line Y on the adjustment substrate AR is adjusted. This adjusts the perpendicularity between Yr and the alignment line X. Note that, when using an alignment line or alignment mark that is directly drawn on Yr without using the adjustment substrate AR, this adjustment step 1) can be omitted.

[0109] 3) Parallelism of AR(X) and Xd (perpendicularity of Yr and Xd) Next, the alignment line X of the adjustment substrate AR is observed by a high-magnification CCD camera installed on an optical stage (Xo) placed on the X-axis (Xd) of the donor stage. The position of this high-magnification CCD camera in the Z-axis direction is determined by the design of the projection optical system, but in this embodiment 3, it is fixed using a Z-axis stage (Zl) that holds the projection lens near the position of the projection lens (Pl). Xd is moved 400 [mm], and the mounting angle of Xd with respect to the stone surface plate 1, that is, the perpendicularity of Xd with respect to Yr is adjusted using a rotation adjustment mechanism so that the deviation of the alignment line X in the Y-axis direction is within 0.3 [μm].

[0110] 4) Parallelism of Yr and Yd in the YZ plane In the description of the first embodiment, the description of the adjustment steps around the other axes (X-axis and Y-axis) was omitted, but here, the adjustment steps around the X-axis, i.e., the parallelism in the YZ plane, will be briefly described. The lower surface of the Y-axis (Yd) of the donor stage is observed using a height sensor installed on the Z-axis (Zr) or other part of the receptor stage. Yr and Yd are simultaneously moved (paralleled) the same distance in sync for 200 [mm] or more, and the fluctuation of the measurement value (distance between Zr and Yd) by the gap sensor is observed. A shim plate is inserted between the rotation adjustment mechanism installed between Xd and Yd and Yd or between Xd and Yd so that the fluctuation is within 5 [μm] or within a range sufficiently smaller than the focal depth of the image formed by the projection lens, and the parallelism in the YZ plane between Yr and Yd is adjusted.

[0111] 5) Parallelism of Yr and Yd The alignment mark for pattern matching provided on the underside of Yd is observed with a high-magnification CCD camera installed on Zr or another location. Yr and Yd are moved the same distance in sync (parallel movement), and if the position of the pattern-matched alignment mark image (such as a cross mark) moves in the X-axis direction, it is adjusted using a rotation adjustment mechanism installed between Xd and Yd to correct this. Note that it is also possible to use the alignment line Y of the adjustment substrate AD attached to the Y-axis of the donor stage instead of the alignment mark.

[0112] 6) Perpendicularity of Yr and Xo The alignment line X of the adjustment substrate AR, whose perpendicularity with the Y axis (Yr) of the receptor stage has been adjusted in the adjustment step 1), is observed by a high-magnification CCD camera installed on the optical stage (Xo). Xo is moved 400 [mm], and the mounting angle of Xo relative to Xd is adjusted using a rotation adjustment mechanism installed between them so that the deviation of the alignment line X in the Y axis direction is within 0.3 [μm]. EXAMPLES

[0113] FIG. 2A shows the main components of the lifting device of this Example 4. This is based on the seventh aspect of the present invention. In FIGS. 2A to 2C, the laser device, control device, monitor, and other devices (all of which are the same as in Example 1) are omitted, and the X-axis, Y-axis, and Z-axis directions are shown in the figures. The donor substrate, receptor substrate, and the arrangement of the lift object on the donor substrate and the arrangement after lifting onto the receptor substrate used in this Example 4 are the same as in Example 2.

[0114] The state of the optical system from the emission of the pulsed laser light from the excimer laser device to the irradiation of the lift target on the donor substrate is the same as that of Example 1, except for the parts caused by the difference in the construction of each stage group shown in Figures 1A and 2A, as described below. That is, in the case of the lift device according to the sixth invention shown in Figures 1A to 1C, the X-axis (Xd) of the donor stage is placed on the stone surface plate 1 (G1), and the optical stage (Xo) is placed on it in that order, whereas in the case of the lift device according to the seventh invention shown in Figures 2A to 2C, the Xo is placed on G1 and Xd is suspended below G1, which is the difference in the construction of these stage groups.

[0115] The light emitted from the excimer laser enters the telescope optical system and propagates to the shaping optical system. As shown in FIG. 2A, this shaping optical system is installed on an optical stage (Xo) that moves in the X-axis direction so that its optical axis is parallel. Xo is placed on a stone surface plate 1 (G1) made of granite, and a rotation adjustment mechanism (RP) is provided between the two. Here, Xo is perpendicular to the Y-axis (Yr) of the receptor stage placed on a stone surface plate 2 (G2) different from G1, and is parallel to the X-axis (Xd) of the donor stage. The laser light just before entering the shaping optical system is adjusted by the telescope optical system so that it has approximately the same shape (approximately 25×25 [mm] (length × width, FWHM) regardless of the movement of Xo.

[0116] The X-axis (Xd) of the donor stage is suspended below G1, and the Y-axis (Yd) of the donor stage is suspended further. There is also a rotation adjustment mechanism between them. FIG. 2B shows a side view of Xo and Xd having moved the same distance relative to G1. This allows the position in the X-axis direction relative to Yd to be changed without changing the relative positions of Xo and Xd on the X-axis. FIG. 2C shows a side view of only Xo having moved relative to G1. This allows the relative positions of Xd and Xo on the X-axis to be changed.

[0117] The details of the other reduced projection optical systems, the field lens (F), mask (M), and projection lens (Pl), are the same as those in Example 1. The laser light emitted from the projection lens enters the back surface of the donor substrate and is accurately projected at a reduced size of 1 / 5 of the pattern drawn on the mask toward the lift target formed on the front surface (lower surface) of the donor substrate. The image formation on the front surface of the donor substrate is measured by a confocal beam profiler, as in Example 1.

[0118] When the lift object placed on the surface of the donor substrate is lifted to the opposing receptor substrate based on the mask pattern projected in a reduced size as described above, how the donor substrate and receptor substrate are scanned and how the lift object is lifted onto the receptor substrate are shown in Figures 6, 10, 11, and 13A to 13C. Furthermore, the positional synchronization accuracy in the movement of the Y axis (Yr) of the receptor stage and the Y axis (Yd) of the donor stage is the same as that shown in Figure 12 in Example 1.

[0119] Furthermore, the method of adjusting the parallelism between the Y-axes of each stage, the parallelism between the X-axes, and the squareness between each Y-axis and X-axis is the same as in Example 3. That is, the Y-axis (Yr) of the receptor stage whose straightness has been adjusted is used as the adjustment reference, and the squareness between Yr and the X-axis (Xd) of the donor stage suspended from the stone surface plate 1 (G1) is observed by a high-magnification CCD camera fixed to the Z-axis (Zr) of the receptor stage, and adjusted by a rotation adjustment mechanism (RP) between G1 and Xd. Then, the parallelism between the Y-axis (Yd) of the donor stage suspended from the adjusted Xd and Yr is observed by the same high-magnification CCD camera, and adjusted by the RP between Xd and Yd. Finally, the squareness between the optical stage (Xo) and Yr is observed by a high-magnification CCD moving with Xo, and adjusted by the RP between G1 and Xo. [Industrial Applicability]

[0120] The present invention can be used as a display manufacturing device. [Explanation of symbols]

[0121] AD Donor Stage Adjustment Board Adjustment board for AR receptor stage BP Confocal Beam Profiler CCD high magnification camera D Donor Substrate F Field Lens G Base Plate G1 Surface Plate 1 G11 Surface Plate 11 G12 Surface Plate 12 G2 Surface Plate 2 G3 Surface Plate 3 H Shaping optical system Ic Corner cube for laser interferometer IL Laser for laser interferometer LS Laser Light M Mask Pl Projection Lens R receptor substrate RP Rotation Adjustment Mechanism S Object TE Telescope Xd X-axis of the donor stage Xo Optical stage (X axis) Yd Y axis of the donor stage Yl Projection lens and camera switching stage Yr Y axis of receptor stage Zl Z-axis stage of the projection lens Zr Z axis of receptor stage θd θ axis of the donor stage θr θ axis of receptor stage

Claims

1. 1. A lifting method for projecting a reduced mask pattern of laser light from a rear surface of a substrate onto an object provided on a front surface of the substrate, peeling the object from the substrate, and lifting the object onto another substrate, comprising: A lifting method, comprising displacing a mask pattern of laser light irradiated onto the substrate, the substrate, and the other substrate relative to each other.

2. The lifting method according to claim 1 , wherein the substrate and the another substrate are moved in the same direction with respect to a mask pattern of the laser light irradiated onto the substrate.

3. 2. The lift method according to claim 1, wherein the substrate and the other substrate are moved at different speeds relative to a mask pattern of the laser light irradiated onto the substrate.

4. 4. The lift method according to claim 2, wherein the moving speed of the other substrate is made faster than the moving speed of the substrate.

5. 5. The lifting method according to claim 2, wherein movement of the substrate and the another substrate is stopped when the substrate is irradiated with laser light.

6. 5. The lifting method according to claim 2, wherein the substrate and the another substrate are scanned without stopping the laser beam when the substrate is irradiated with the laser beam.

7. The lifting method according to any one of claims 1 to 6, wherein the substrate has a transmission characteristic with respect to the wavelength of the laser light.

8. The lifting method according to any one of claims 1 to 7, wherein the object is provided on a light absorbing layer formed on the substrate.

9. The lifting method according to any one of claims 1 to 7, wherein the object is provided on the substrate as a solid film.

10. The lifting method according to any one of claims 1 to 7, wherein the objects are arranged in a matrix on the substrate.

11. A method for manufacturing another substrate, the object being lifted by the lifting method according to any one of claims 1 to 10.

12. An apparatus for lifting an object provided on a surface of a substrate to another substrate by irradiating the object with a pulsed laser beam, comprising: A laser device that oscillates a pulsed laser beam; a mask having a mask pattern formed of the oscillated pulsed laser light; a projection lens that reduces and projects a mask pattern of the pulsed laser light onto the substrate; a stage for holding the substrate and a stage for holding the other substrate; having a lift device that is controlled so as to displace a mask pattern of pulsed laser light projected onto the substrate in a reduced scale, a stage that holds the substrate, and a stage that holds the other substrate, relative to one another.

13. A lifting method for projecting a reduced laser beam from a rear surface of a substrate toward an object provided on a front surface of the substrate, peeling the object from the substrate, and lifting the object onto another substrate, comprising: A lifting method, comprising displacing a laser beam irradiated to the substrate, the substrate, and the other substrate relative to each other.

14. An apparatus for lifting an object provided on a surface of a substrate to another substrate by irradiating the object with a pulsed laser beam, comprising: A laser device that oscillates a pulsed laser beam; a projection lens for reducing and projecting the oscillated pulsed laser light onto the substrate; a stage for holding the substrate and a stage for holding the other substrate; having A lift device that is controlled to displace a pulsed laser beam projected on the substrate in a reduced scale, a stage that holds the substrate, and the other substrate relative to one another.

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