Resin composition, pellet, and molded product

Abstract

To provide: a resin composition capable of yielding a molded product having a low I value; a pellet; and a molded product.SOLUTION: A resin composition comprises: 0.01 to 1.5 pts.mass of a compound represented by the formula (1), and 0.01 to 1.5 pts.mass of an aliphatic compound (X) comprising 3 to 5 structures represented by -CH2OH in each molecule, per 100 pts.mass of a polycarbonate resin. In the formula (1), each R independently represents a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin composition, a pellet, and a molded article, and in particular to a resin composition containing a polycarbonate resin as a main component. [Background technology]

[0002] Polycarbonate resins have been widely used for various applications due to their excellent performance. In particular, polycarbonate resins are actively used for components that require transparency, such as power covers, lighting lenses, lighting covers, and light guide members. For example, Patent Document 1 discloses polycarbonate resin composition pellets containing a polycarbonate resin (A), an aromatic compound (B) represented by the following formula, and a phosphorus-based stabilizer (C), characterized in that the content of the aromatic compound (B) in the pellets is 0.001 to 1 mass %, and the content of the phosphorus-based stabilizer (C) is 0.003 to 0.5 mass %. [ka] (In the formula, Y is an organic group that does not contain any of the elements nitrogen, sulfur, or halogen, or a hydrogen atom. When Y is a hydrogen atom, X is an alkyl group or an aryl group which may have a substituent, and when Y is an organic group which does not contain any of the elements nitrogen, sulfur, and halogen, X is an organic group which does not contain any of the elements nitrogen, sulfur, and halogen, and in this case, X and Y may be the same or different. g represents an integer of 1 or 2. n represents an integer of 0 to 5, and when n is 2 or more, the n X's may be the same or different. k represents an integer of 1 to 4, and when k is 2 or more, Y is the organic group having two or more -(CH 2 ) g The OY groups may be the same or different, provided that n+k is 6 or less. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 198321 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, a low YI value is required for resin molded products used for components that require transparency, such as power covers, lighting lenses, lighting covers, light guide members, etc. In this regard, the molded products formed from the resin composition described in Patent Document 1 have an excellent YI value. However, depending on the application, etc., an even lower YI value may be required. The applicant of the present application has also studied the possibility of lowering the YI value by blending paraxylylene glycol dimethyl ether (PXDM) with polycarbonate resin. However, since PXDM is a liquid and is classified as a hazardous material, there are restrictions on the amount of addition when it is used during blending and extrusion due to safety considerations. On the other hand, trimethylolpropane and trimethylolethane do not have such restrictions. Therefore, it would be beneficial if the content of PXDM could be reduced. The present invention has an object to solve the above problems, and to provide a resin composition, pellets, and a molded article that are capable of providing a molded article having a low YI value. [Means for solving the problem]

[0005] In view of the above problems, the present inventors have conducted research and found that the above problems can be solved by adding compound (X) described below. Specifically, the above problems were solved by the following means. <1> For 100 parts by mass of polycarbonate resin, 0.01 to 1.5 parts by mass of a compound represented by formula (1), In one molecule, -CH 2and 0.01 to 1.5 parts by mass of an aliphatic compound (X) containing 3 to 5 structures represented by OH. [ka] (In formula (1), each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.) <2> The compound (X) includes a compound represented by formula (X1). <1> The resin composition according to claim 1. [ka] (In formula (X1), R x1 is an n-valent, substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, where n is an integer of 3 to 5. <3> In the formula (X1), R x1 each independently represents an unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms; <1> or <2> The resin composition according to claim 1. <4> The compound (X) includes at least one selected from the group consisting of trimethylolethane, trimethylolpropane, and pentaerythritol. <1> ~ <3> 10. The resin composition according to claim 9 . <5> The compound (X) contains trimethylolethane. <1> ~ <4> 10. The resin composition according to claim 9 . <6> In the formula (1), each R is independently an unsubstituted alkyl group having 1 to 5 carbon atoms. <1> ~ <5> 10. The resin composition according to claim 9 . The resin composition according to claim 1. <7> In the formula (1), each R is independently a methyl group or an ethyl group. <1> ~ <6> 10. The resin composition according to claim 9 . <8> the total amount of the compound represented by formula (1) and the compound (X) is 0.01 to 1.5 parts by mass, and the mass ratio of the compound represented by formula (1) to the compound (X) is 10:90 to 90:10; <1> ~ <7> 10. The resin composition according to claim 9 . <9> The compound (X) contains at least one selected from the group consisting of trimethylolethane, trimethylolpropane, and pentaerythritol, In the formula (1), each R is independently a methyl group or an ethyl group. the total amount of the compound represented by formula (1) and the compound (X) is 0.01 to 1.5 parts by mass, and the mass ratio of the compound represented by formula (1) to the compound (X) is 10:90 to 90:10; <1> ~ <8> 10. The resin composition according to claim 9 . <10> <1> ~ <9> 2. A pellet of the resin composition according to claim 1. <11> <1> ~ <9> 2. A molded article formed from the resin composition according to claim 1. <12> <10> A molded article formed from the pellets according to claim 1. Effect of the Invention

[0006] According to the present invention, it is possible to provide a resin composition, pellets, and a molded article that can provide a molded article having a low YI value. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, an embodiment of the present invention (hereinafter, simply referred to as "the present embodiment") will be described in detail. Note that the present embodiment is an example for explaining the present invention, and the present invention is not limited to the present embodiment. In this specification, the word "to" is used to mean that the numerical values ​​before and after the word "to" are included as the upper and lower limits. In addition, any combination of the upper and lower limits of the numerical values ​​in this specification is an example of this embodiment. In this specification, various physical properties and characteristic values ​​are those at 23° C. unless otherwise specified. Examples of the substituent in this specification are preferably a halogen atom, a cyano group, a nitro group, a hydroxy group, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, a heterocyclic group, a heterocyclic oxy group, an alkenyl group, an alkylsulfanyl group, an arylsulfanyl group, an acyl group, or an amino group, more preferably a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkenyl group, or an acyl group, even more preferably an alkyl group, an aryl group, an aryloxy group, or an alkenyl group, and even more preferably an alkyl group. The formula weight of these substituents is preferably 15 or more, and preferably 200 or less. The formula weight is, for example, the formula weight of a methyl group (-CH 3 ) is 15. These substituents may further have a substituent, but it is preferable that they have no substituent. If the measurement methods, etc. described in the standards shown in this specification vary from year to year, they will be based on the standards as of January 1, 2023, unless otherwise stated.

[0008] The resin composition of the present embodiment contains 100 parts by mass of a polycarbonate resin, 0.01 to 1.5 parts by mass of a compound represented by formula (1), and a -CH 2 and 0.01 to 1.5 parts by mass of an aliphatic compound (X) containing 3 to 5 structures represented by OH. By using such a constitution, it is possible to obtain a resin composition capable of providing a molded product having a low YI value. [ka] (In formula (1), each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.) The present invention will be described in detail below.

[0009] <Polycarbonate resin> The resin composition of the present embodiment contains a polycarbonate resin. The polycarbonate resin is not particularly limited as long as it contains a -[OR-OC(=O)]- unit (R is an organic group, preferably a hydrocarbon group, more preferably an aliphatic group, an aromatic group, or both an aliphatic group and an aromatic group, and further has a straight-chain structure or a branched structure) containing a carbonate bond in the molecular main chain. In this embodiment, the polycarbonate resin is preferably an aromatic polycarbonate resin, and more preferably a polycarbonate resin having a bisphenol skeleton. By using such a polycarbonate resin, the obtained molded product can achieve better heat resistance and toughness. In this embodiment, the polycarbonate resin having a bisphenol skeleton is preferably a structural unit having a bisphenol skeleton in 90 mol % or more of all structural units, more preferably a structural unit having at least one skeleton of bisphenol A, bisphenol C, and bisphenol AP, and even more preferably a structural unit having a bisphenol A skeleton in 90 mol % or more of all structural units.

[0010] The viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 10,000 or more, more preferably 12,000 or more, and even more preferably 15,000 or more. By making it equal to or more than the lower limit, the durability of the molded article obtained tends to be further improved. The upper limit of the viscosity average molecular weight (Mv) of the polycarbonate resin is preferably 50,000 or less, more preferably 40,000 or less, even more preferably 30,000 or less, even more preferably 25,000 or less, and even more preferably 20,000 or less. By making it equal to or less than the upper limit, the molding processability of the molded article tends to be further improved. The viscosity average molecular weight (Mv) was calculated by using methylene chloride as a solvent and an Ubbelohde viscometer to determine the intrinsic viscosity [η] (unit: dL / g) at 25°C, and then using the Schnell viscosity formula, i.e., η = 1.23 × 10 -4 ×Mv 0.83 , means a value calculated from When two or more types of polycarbonate resins are used, the viscosity average molecular weight is the mixture.

[0011] The method for producing the polycarbonate resin is not particularly limited, and polycarbonate resins produced by the conventionally known phosgene method (interfacial polymerization method) or melting method (ester exchange method) can be used. In addition, when the melting method is used, polycarbonate resins in which the amount of OH groups in the terminal groups is adjusted can be used.

[0012] The polycarbonate resin used in this embodiment may be a recycled polycarbonate resin product (including recovered products, material recycled products, chemical recycled products, etc.), a rejected product, or a scrap from the molding of a thermoplastic resin containing polycarbonate resin.

[0013] In addition to the above, details of the polycarbonate resin can be referred to in paragraphs 0013 to 0041 of JP 2021-084942 A and paragraphs 0030 to 0035 of JP 2021-119211 A, the contents of which are incorporated herein by reference.

[0014] The content of the polycarbonate resin in the resin composition of this embodiment is preferably 85% by mass or more of the resin composition, more preferably 90% by mass or more, even more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 98% by mass or more. The upper limit of the content of the polycarbonate resin in the resin composition is the amount such that the total of the polycarbonate resin, the compound represented by formula (1), and the compound (X) is 100% by mass. The resin composition of the present embodiment may contain only one type of polycarbonate resin, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0015] <Compound represented by formula (1)> The resin composition of this embodiment contains 0.01 to 1.5 parts by mass of the compound represented by formula (1) relative to 100 parts by mass of polycarbonate resin. By containing the compound represented by formula (1), the YI value of the obtained molded article can be reduced. Furthermore, the extrudability of the resin composition of this embodiment can be improved, making it easier to produce pellets. In addition, a resin composition (pellets) excellent in mold deposit during molding can be obtained. [ka] (In formula (1), each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.)

[0016] In formula (1), each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, and preferably an unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms. The aliphatic hydrocarbon group is preferably a substituted or unsubstituted alkyl group, and more preferably an unsubstituted alkyl group. The alkyl group is preferably a linear alkyl group or a branched alkyl group, and more preferably a linear alkyl group. The number of carbon atoms constituting the aliphatic hydrocarbon group is preferably 7 or less, more preferably 5 or less, and even more preferably 3 or less, and is 1 or more. More specifically, each R is preferably an unsubstituted alkyl group having 1 to 5 carbon atoms, more preferably an unsubstituted alkyl group having 1 to 4 carbon atoms, even more preferably an unsubstituted alkyl group having 1 to 3 carbon atoms, and still more preferably a methyl group or an ethyl group. In addition, R may be the same or different, but it is preferable that they are the same. Examples of the substituent that the substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms may have include an aryl group and a halogen atom, and a phenyl group, a fluorine atom and a chlorine atom are preferred. In this embodiment, it is preferred that the group is unsubstituted.

[0017] In this embodiment, the total number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the total number of hydrogen atoms directly bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) is preferably 3 or more, more preferably 4 or more. By making it equal to or more than the lower limit, the transmittance in the short wavelength region tends to be improved. In addition, the upper limit of the total number of hydrogen atoms directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) and the total number of hydrogen atoms directly bonded to the hydroxyl group directly bonded to the carbon atom bonded to the aromatic ring of the compound represented by formula (1) is preferably 6 or less, more preferably 5 or less, and even more preferably 4 or less. By making it equal to or less than the upper limit, the transmittance in the short wavelength region tends to be improved. When the resin composition of the present embodiment contains two or more types of compounds represented by formula (1), the number of protons at the benzyl position of the compound represented by formula (1) and the addition concentration are multiplied, and the sum of these values ​​is the relative proton number.

[0018] Examples of the compound represented by formula (1) are given below. It goes without saying that the compound represented by formula (1) in this embodiment is not limited to these. [ka]

[0019] The content of the compound represented by formula (1) in the resin composition of this embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, even more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.3 parts by mass or more, relative to 100 parts by mass of polycarbonate resin. By making it equal to or more than the lower limit, the transmittance in the short wavelength region tends to be improved. In addition, the content of the compound represented by formula (1) is 1.5 parts by mass or less, preferably 1.0 parts by mass or less, more preferably less than 0.7 parts by mass, even more preferably 0.6 parts by mass or less, even more preferably 0.5 parts by mass or less, and even more preferably 0.45 parts by mass or less, relative to 100 parts by mass of polycarbonate resin. By making it equal to or less than the upper limit, mold deposits tend to be reduced. The resin composition of the present embodiment may contain only one type of compound represented by formula (1), or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0020] <Compound (X)> The resin composition of the present embodiment contains, in one molecule, -CH 2 The composition contains 0.01 to 1.5 parts by mass of an aliphatic compound (X) (sometimes simply referred to as "compound (X)" in this specification) containing 3 to 5 structures represented by OH. By using compound (X) together with the compound represented by formula (1), the YI value of the obtained molded article can be reduced even if the blending amount of the compound represented by formula (1) is reduced.

[0021] In this embodiment, compound (X) preferably includes a compound represented by formula (X1). [ka] (In formula (X1), R x1 is an n-valent, substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, where n is an integer of 3 to 5.

[0022] In formula (X1), R x1 are each independently an n-valent substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, preferably an n-valent unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, more preferably an unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms, and even more preferably an unsubstituted aliphatic hydrocarbon group having 2 to 4 carbon atoms. The aliphatic hydrocarbon group may be a saturated aliphatic hydrocarbon group or an unsaturated aliphatic hydrocarbon group, but is preferably a saturated aliphatic hydrocarbon group. In formula (X1), n ​​is preferably 3 or 4, and more preferably 3.

[0023] In this embodiment, compound (X) preferably contains at least one selected from the group consisting of trimethylolethane, trimethylolpropane, and pentaerythritol, more preferably contains trimethylolethane and / or trimethylolpropane, and further preferably contains trimethylolethane.

[0024] The content of the compound (X) in the resin composition of this embodiment is 0.01 parts by mass or more, preferably 0.05 parts by mass or more, more preferably 0.08 parts by mass or more, more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.25 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin. By making it equal to or more than the lower limit, (hue) tends to be improved. In addition, the content of the compound (X) is 1.5 parts by mass or less, preferably 1.0 parts by mass or less, more preferably less than 0.7 parts by mass, even more preferably 0.6 parts by mass or less, even more preferably 0.5 parts by mass or less, even more preferably 0.4 parts by mass or less, and even more preferably 0.35 parts by mass or less, relative to 100 parts by mass of the polycarbonate resin. By making it equal to or less than the upper limit, (mold deposit) tends to be reduced. The resin composition of the present embodiment may contain only one type of compound (X), or may contain two or more types. When two or more types are contained, the total amount is preferably within the above range.

[0025] In the resin composition of the present embodiment, the total amount of the compound represented by formula (1) and the compound (X) is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.08 parts by mass or more, even more preferably 0.1 parts by mass or more, even more preferably 0.2 parts by mass or more, and even more preferably 0.5 parts by mass or more, relative to 100 parts by mass of the polycarbonate resin. By making it equal to or more than the lower limit, the transmittance in the short wavelength region tends to be improved. In addition, the total amount of the compound represented by formula (1) and the compound (X) is preferably 1.5 parts by mass or less, more preferably 1.3 parts by mass or less, even more preferably 1.2 parts by mass or less, even more preferably 1.1 parts by mass or less, even more preferably 1.0 parts by mass or less, even more preferably 0.9 parts by mass or less, and may be 0.7 parts by mass or less, or 0.6 parts by mass or less, relative to 100 parts by mass of the polycarbonate resin. By making it equal to or less than the upper limit, the mold deposit tends to be reduced. In addition, in the resin composition of this embodiment, the mass ratio of the compound represented by formula (1) to the compound (X) is preferably 10:90 to 90:10. Furthermore, in the resin composition of this embodiment, when the total of the compound represented by formula (1) and the compound (X) is 100, the mass ratio of the compound represented by formula (1) to the compound (X) is preferably 20 or more, more preferably 30 or more, even more preferably 40 or more, even more preferably 50 or more, even more preferably more than 50, and may be preferably 80 or less, more preferably 70 or less, or 60 or less.

[0026] <Other ingredients> The resin composition of the present embodiment may contain other components as necessary, as long as the desired physical properties are not significantly impaired. Examples of the other components include various resin additives. Examples of resin additives include reactive compounds, stabilizers, release agents, ultraviolet absorbers, colorants (dyes, pigments), antistatic agents, flame retardants, flame retardant assistants, anti-dripping agents, anti-fogging agents, anti-blocking agents, flow improvers, plasticizers, dispersants, antibacterial agents, etc. The resin additives may be contained alone or in any combination and ratio of two or more.

[0027] <<Reactive compounds>> The resin composition of the present embodiment may contain a reactive compound. By containing a reactive compound, it is possible to reduce the YI value and the YI value after heating, and to obtain a molded product having excellent light transmittance in visible light. The reactive compound is preferably an epoxy compound and / or an oxetane compound, more preferably an epoxy compound.

[0028] The epoxy compound means a compound containing an epoxy group, and may contain only one epoxy group or two or more epoxy groups in one molecule, but preferably contains one to four epoxy groups, more preferably contains one to three epoxy groups, and even more preferably contains two epoxy groups. An oxetane compound means a compound containing an oxetanyl group, and may contain only one oxetanyl group or two or more oxetanyl groups in one molecule, but preferably contains one to four oxetanyl groups, more preferably contains one to three oxetanyl groups, and even more preferably contains two oxetanyl groups.

[0029] The molecular weight of the epoxy compound and / or oxetane compound is not particularly limited, but is preferably 100 or more, and is preferably 1500 or less, more preferably 1000 or less, even more preferably 800 or less, and may be 500 or less.

[0030] The epoxy compound and / or the oxetane compound is preferably an alicyclic epoxy compound and / or an alicyclic oxetane compound.

[0031] The alicyclic epoxy compound and / or alicyclic oxetane compound used in the present embodiment is preferably a compound represented by formula (2), a compound represented by formula (3), or a compound represented by formula (4), more preferably a compound represented by formula (2) and / or a compound represented by formula (4), and further preferably a compound represented by formula (2). Formula (2) [ka] (In formula (2), A 1 represents a divalent organic group.

[0032] In formula (2), A 1 is preferably a hydrocarbon group having 1 to 10 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, and more preferably an alkylene group having 1 to 10 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups. The alkylene group may be linear, branched, or cyclic, preferably linear or branched, and more preferably linear. Preferred examples of the compound represented by formula (2) include the following compounds. [ka] Formula (3) [ka] (In formula (3), A 2 and A 3 each independently represents a divalent organic group.

[0033] In formula (3), A 2 are each independently preferably a hydrocarbon group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and more preferably an alkylene group having 1 to 3 carbon atoms. In formula (3), A3 is preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, and even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, or a group consisting of a combination of two or more of the above groups. 3 The end (next to the oxygen atom) is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, and even more preferably an alkylene group having 1 to 10 carbon atoms. Preferred examples of the compound represented by formula (3) include the following compounds. [ka] n is an arbitrary integer, and is preferably 1 to 11. [ka]

[0034] Formula (4) [ka] (In formula (4), A 4 and A 5 R each independently represents a divalent organic group. a is an alkyl group having 1 to 5 carbon atoms, and nb is 0 or 1.

[0035] In formula (4), A 4are each independently preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a group consisting of a combination of two or more of the above groups, still more preferably an alkylene group having 1 to 10 carbon atoms, even more preferably an alkylene group having 1 to 3 carbon atoms, and still more preferably an ethylene group or a methylene group. In formula (4), A 5 is preferably a hydrocarbon group having 1 to 20 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, -O-, -C(=O)-, or a group consisting of a combination of two or more of the above groups, and even more preferably an alkylene group having 1 to 10 carbon atoms, an arylene group having 6 to 12 carbon atoms, or a group consisting of a combination of two or more of the above groups. 5 The end portion (next to the oxygen atom) is preferably a hydrocarbon group having 1 to 20 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms or an arylene group having 6 to 12 carbon atoms, even more preferably an alkylene group having 1 to 10 carbon atoms, and still more preferably an alkylene group having 1 to 3 carbon atoms.

[0036] R a is preferably an alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group or an ethyl group. It is preferable that nb is 1. Preferred examples of the compound represented by formula (4) include the following compounds. [ka]

[0037] In addition to the above, preferred examples of the epoxy compound and / or oxetane compound used in this embodiment include the compounds described in paragraphs 0043 to 0069 of JP 2021-038306 A and paragraphs 0023 to 0037 of JP 2021-031658 A, the contents of which are incorporated herein by reference.

[0038] When the resin composition of the present embodiment contains a reactive compound (preferably an epoxy compound and / or an oxetane compound, more preferably an epoxy compound), the content is preferably 0.01 parts by mass or more, more preferably 0.02 parts by mass or more, relative to 100 parts by mass of polycarbonate resin. By making the content equal to or more than the lower limit, the long-term heat resistance tends to be improved. In addition, the content of the reactive compound is preferably 1.5 parts by mass or less, more preferably 1.0 parts by mass or less, even more preferably 0.5 parts by mass or less, even more preferably 0.1 parts by mass or less, and even more preferably 0.08 parts by mass or less, relative to 100 parts by mass of polycarbonate resin. By making the content equal to or less than the upper limit, mold deposits tend to be reduced. The resin composition of the present embodiment may contain only one type of reactive compound, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0039] <<Stabilizer>> The resin composition of the present embodiment may contain a stabilizer. The stabilizers include heat stabilizers and antioxidants. Examples of the stabilizer include phenol-based, amine-based, phosphorus-based, and thioether-based stabilizers. Among these, in this embodiment, it is preferable to include a phosphorus-based heat stabilizer.

[0040] Any known phosphorus-based heat stabilizer can be used. Specific examples include phosphorus oxoacids such as phosphoric acid, phosphonic acid, phosphorous acid, phosphinic acid, and polyphosphoric acid; metal acid pyrophosphates such as sodium acid pyrophosphate, potassium acid pyrophosphate, and calcium acid pyrophosphate; phosphates of Group 1 or Group 2B metals such as potassium phosphate, sodium phosphate, cesium phosphate, and zinc phosphate; organic phosphate compounds, organic phosphite compounds, and organic phosphonite compounds, with organic phosphite compounds being particularly preferred.

[0041] Examples of the organic phosphite compound include triphenyl phosphite, tris(mononylphenyl)phosphite, tris(mononyl / dinonylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, monooctyldiphenyl phosphite, dioctylmonophenyl phosphite, monodecyldiphenyl phosphite, didecylmonophenyl phosphite, tridecyl phosphite, trilauryl phosphite, tristearyl phosphite, 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite, distearyl pentaerythritol diphosphite, bis(decyl)pentaerythritol diphosphite, bis(tridecyl)pentaerythritol diphosphite, and bis(nonylphenyl)pentaerythritol diphosphite. Specific examples of such organic phosphite compounds include "ADK STAB (registered trademark; the same applies below) 1178," "ADK STAB 2112," and "ADK STAB HP-10" manufactured by ADEKA Corporation, "JP-351," "JP-360," and "JP-3CP" manufactured by Johoku Chemical Industry Co., Ltd., and "IRGAFOS (registered trademark; the same applies below) 168" manufactured by BASF.

[0042] As for the phosphorus-based heat stabilizer used in this embodiment, in addition to the above, the description in paragraphs 0127 to 0133 of JP 2022-067329 A can be referred to, the contents of which are incorporated herein by reference.

[0043] As the phenol-based antioxidant, a hindered phenol-based antioxidant is preferably used. Specific examples of hindered phenol-based antioxidants include pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, thiodiethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], 2,4-dimethyl-6-(1-methylpentadecyl)phenol, diethyl[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]phosphate, 4,6-bis(octyl butylthiomethyl)-o-cresol, ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], hexamethylene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino)phenol, 2-[1-(2-hydroxy-3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, and the like.

[0044] Among them, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] and octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate are preferred. Specific examples of such hindered phenol-based antioxidants include "Irganox (registered trademark, the same applies below) 1010" and "Irganox 1076" manufactured by BASF, and "Adeka STAB AO-50" and "Adeka STAB AO-60" manufactured by ADEKA.

[0045] The content of the stabilizer in the resin composition of the present embodiment is usually 0.001 parts by mass or more, preferably 0.005 parts by mass or more, more preferably 0.01 parts by mass or more, and usually 1 part by mass or less, preferably 0.5 parts by mass or less, more preferably 0.3 parts by mass or less, relative to 100 parts by mass of the polycarbonate resin. By setting the content of the stabilizer within the above range, the effect of adding the stabilizer is more effectively exhibited. The resin composition of the present embodiment may contain only one type of stabilizer, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0046] <<Release agent>> The resin composition of the present embodiment may contain a mold release agent. By blending a mold release agent, the mold releasability of the resin composition can be further improved. Examples of the release agent include aliphatic carboxylic acids, salts of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15,000, polysiloxane-based silicone oils, ketone waxes, and light amides. Of these, aliphatic carboxylic acids, salts of aliphatic carboxylic acids, and esters of aliphatic carboxylic acids and alcohols are preferred. For details about the release agent, please refer to paragraphs 0055 to 0061 of JP2018-095706A, the contents of which are incorporated herein by reference. When the resin composition of the present embodiment contains a release agent, the content thereof in the resin composition is preferably 0.01 to 3 mass %. The resin composition of the present embodiment may contain only one type of release agent, or may contain two or more types. When two or more types are contained, the total amount is preferably in the above range.

[0047] <Physical properties of resin composition> The resin composition of this embodiment preferably has a low YI value when formed into a molded article with a 300-mm long optical path. Specifically, when the resin composition of this embodiment is formed into a molded article with a 300-mm long optical path, the YI value is preferably 15.7 or less, more preferably 15.5 or less, still more preferably 15.0 or less, and even more preferably 14.3 or less. Further, as the lower limit value of the YI value, 0 is ideal, but even if it is 1.0 or more, further 5.0 or more, particularly 10.0 or more, it sufficiently satisfies the required performance. Such a low YI value is achieved by blending the compound represented by formula (1) and compound (X). The YI value is measured according to the method described in the examples below.

[0048] The resin composition of this embodiment preferably has a light transmittance of 44.0% or more at a wavelength of 400 nm when formed into a molded article with a 300-mm long optical path, more preferably 44.5% or more, and still more preferably 45.0% or more. Further, although the upper limit of the light transmittance at a wavelength of 400 nm is not particularly defined, 99.0% or less is practical, and even 95.0% or less sufficiently satisfies the required performance. The resin composition of this embodiment preferably has a light transmittance of 68.0% or more at a wavelength of 480 nm when formed into a molded article with a 300-mm long optical path. Further, although the upper limit of the light transmittance at a wavelength of 500 nm is not particularly defined, 99.0% or less is practical, and even 95.0% or less sufficiently satisfies the required performance. The light transmittance is measured according to the method described in the examples below.

[0049] <Method for producing resin composition> The method for producing the resin composition of the present embodiment is not limited, and known methods for producing resin compositions can be widely adopted. For example, a method in which a polycarbonate resin, a compound represented by formula (1), a compound (X), and other components to be mixed as necessary are mixed in advance using various mixers such as a tumbler or a Henschel mixer, and then melt-kneaded using a mixer such as a Banbury mixer, a roll, a Brabender, a single-screw kneading extruder, a twin-screw kneading extruder, or a kneader can be mentioned. The temperature for melt-kneading is not particularly limited, but is usually in the range of 240 to 320°C.

[0050] <Molded products> The molded article of this embodiment is formed from the resin composition or pellets of this embodiment. The resin composition of this embodiment can also be molded directly without going through the pellet state. The above-mentioned resin composition (for example, pellets) is molded into a molded article by various molding methods. The shape of the molded article is not particularly limited and can be appropriately selected depending on the use and purpose of the molded article, and examples thereof include film-like, rod-like, cylindrical, annular, circular, elliptical, polygonal, irregular, hollow, frame-like, box-like, panel-like, and button-like shapes.

[0051] The method for forming the molded article is not particularly limited, and a conventionally known molding method can be adopted, for example, injection molding, injection compression molding, extrusion molding, profile extrusion, transfer molding, hollow molding, gas-assisted hollow molding, blow molding, extrusion blow molding, IMC (in-mold coating molding) molding, rotational molding, multi-layer molding, two-color molding, insert molding, sandwich molding, foam molding, pressure molding, etc. In particular, the resin composition of this embodiment is suitable for molded articles obtained by injection molding, injection compression molding, and extrusion molding. However, it goes without saying that the resin composition of this embodiment is not limited to molded articles obtained by these methods.

[0052] The molded article of this embodiment can be widely used for molded articles containing polycarbonate resin, particularly optical parts. Specifically, it is preferably used in electrical and electronic equipment / parts, office automation equipment / parts, information terminal equipment / parts, machine parts, home appliances, vehicle parts, building materials, various containers, leisure goods and sundries, lighting equipment, etc., and more specifically, it is preferably used for power covers, lighting lenses, lighting covers, light guiding members, etc. More specifically, it can be used for light guides and lenses that guide light from light sources such as LEDs in vehicle headlamps (headlamps), rear lamps, fog lamps, etc. for automobiles or motorcycles. For the use of the resin composition of this embodiment, in addition to the above, the descriptions in paragraphs 0098 to 0105 of JP 2020-189992 A can be referred to, the contents of which are incorporated herein by reference. EXAMPLES

[0053] The present invention will be described in more detail below with reference to examples. The materials, amounts, ratios, processing contents, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments used in the examples are difficult to obtain due to discontinuation or the like, measurements can be made using other instruments with equivalent performance.

[0054] 1. Raw materials The materials shown in Table 1 below were used. [Table 1]

[0055] 2. Comparative Examples 1 to 3, Examples 1 to 2, Reference Example 1 <Compound> Each component described in Table 1 was blended so as to be in the ratio (unit: part by mass) described in Table 2, and uniformly mixed with a tumbler mixer to obtain a mixture. This mixture was supplied to a single-screw extruder "VS40-32V" manufactured by Tanabe Plastics Machinery Co., Ltd., kneaded under the conditions of a screw rotation speed of 80 rpm, a discharge rate of 20 kg / hr, and a barrel temperature of 250°C, and extruded in a strand form from the tip of the extrusion nozzle. The extrudate was rapidly cooled in a water tank and cut using a pelletizer to be pelletized, thereby obtaining pellets of the resin composition.

[0056] <Measurement of light transmittance> After drying each of the resin compositions (pellets) obtained above at 120°C for 4 to 8 hours using a hot air circulation dryer, a 300-mm long optical path molded product (6 mm × 4 mm × 300 mm, L / d = 50) was molded at a temperature of 280°C using an injection molding machine ("S-2000i 150B" manufactured by Fanuc Corporation). Using the 300-mm long optical path molded product obtained above as a test piece, the light transmittance at wavelengths of 400 nm, 420 nm, 440 nm, 460 nm, 480 nm, and 500 nm was measured respectively using a haze meter (NDH4000) manufactured by Nippon Denshoku Industries Co., Ltd. in accordance with ASTM-D1003 under a D65 light source.

[0057] <Measurement of YI value> After drying each of the resin compositions (pellets) obtained above at 120°C for 4 to 8 hours using a hot air circulation dryer, a 300-mm long optical path molded product (6 mm × 4 mm × 300 mm, L / d = 50) was molded at a temperature of 280°C using an injection molding machine ("S-2000i 150B" manufactured by Fanuc Corporation). For this molded product, the YI (Yellow Index) value of 300 mm in length was measured using a long optical path spectral transmittance colorimeter ("ASA1" manufactured by Nippon Denshoku Industries Co., Ltd.).

[0058]

Table 2

[0059] As is clear from the above results, the molded articles obtained from the resin composition of this embodiment were able to reduce the YI value to a level equivalent to that of Reference Example 1 (Examples 1 and 2). Furthermore, the resin composition of this embodiment also had high light transmittance in the wavelength range of 400 to 500 nm. In particular, when trimethylolethane was used as compound (X), a significantly lower YI value was achieved than when the compound represented by formula (1) was used alone (Reference Example 1). In contrast, when compound (X) was used alone, the YI value was high (Comparative Example 2 and Comparative Example 3).

Claims

1. Per 100 parts by mass of polycarbonate resin, 0.01 to 1.5 parts by mass of a compound represented by formula (1); In one molecule, -CH 2 and 0.01 to 1.5 parts by mass of an aliphatic compound (X) containing 3 to 5 structures represented by OH. 【Chemistry 1】 (In formula (1), each R is independently a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms.)

2. The resin composition according to claim 1 , wherein the compound (X) comprises a compound represented by formula (X1): 【Chemistry 2】 (In formula (X1), R x1 is an n-valent, substituted or unsubstituted aliphatic hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 3 to 5.

3. In the formula (X1), R x1 and each independently represent an unsubstituted aliphatic hydrocarbon group having 1 to 5 carbon atoms.

4. The resin composition according to claim 1, wherein the compound (X) comprises at least one selected from the group consisting of trimethylolethane, trimethylolpropane, and pentaerythritol.

5. The resin composition according to claim 1 , wherein the compound (X) comprises trimethylolethane.

6. The resin composition according to claim 1 or 4, wherein in the formula (1), R is each independently an unsubstituted alkyl group having 1 to 5 carbon atoms.

7. The resin composition according to claim 1 or 4, wherein in the formula (1), R is each independently a methyl group or an ethyl group.

8. The total amount of the compound represented by formula (1) and the compound (X) is 0.01 to 1.5 parts by mass, and the mass ratio of the compound represented by formula (1) to the compound (X) is 10:90 to 90:

10. The resin composition according to claim 1 or 4.

9. The compound (X) includes at least one selected from the group consisting of trimethylolethane, trimethylolpropane, and pentaerythritol, In the formula (1), each R is independently a methyl group or an ethyl group. The total amount of the compound represented by formula (1) and the compound (X) is 0.01 to 1.5 parts by mass, and the mass ratio of the compound represented by formula (1) to the compound (X) is 10:90 to 90:

10. The resin composition according to claim 1.

10. A pellet of the resin composition according to any one of claims 1 to 5 and 9.

11. A molded article formed from the resin composition according to any one of claims 1 to 5 and 9.

12. A molded article formed from the pellets of claim 10.

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