Measurement device, and measurement jig

JP2025080401APending Publication Date: 2025-05-26NHK SPRING CO LTD
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Patent Information

Application Number
JP2023193511
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-14
Publication Date
2025-05-26

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Abstract

To provide a measurement device and measurement jig that can improve measurement accuracy of a film thickness.SOLUTION: A measurement device according to the present invention is a measurement system that includes a probe measuring a film thickness, and a measurement jig to be attached to the probe. The measurement jig has: a base part that is shaped into a prism, and is put in a measurement surface of the film thickness; and a cylindrical guide part that is erected in the base part, and guides an advancing and retreating motion of the probe, and in the measurement jig, a through-hole is formed that penetrates the base part and guide part. The guide part has: a spring part that expands / contracts in an advancing and retracting direction of the probe; and a spring seat that is locked to the probe, and to which a load toward a side where the probe separates from the measurement surface is applied by the spring part.SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

  • Eddy current loss measuring sensor, apparatus and method for measurement of film thickness as well as recording medium

    JP2001343205A