Measurement device, and measurement jig
JP2025080401APending Publication Date: 2025-05-26NHK SPRING CO LTD
Patent Information
- Application Number
- JP2023193511
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-11-14
- Publication Date
- 2025-05-26
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Figure 2025080401000001_ABST
Abstract
To provide a measurement device and measurement jig that can improve measurement accuracy of a film thickness.SOLUTION: A measurement device according to the present invention is a measurement system that includes a probe measuring a film thickness, and a measurement jig to be attached to the probe. The measurement jig has: a base part that is shaped into a prism, and is put in a measurement surface of the film thickness; and a cylindrical guide part that is erected in the base part, and guides an advancing and retreating motion of the probe, and in the measurement jig, a through-hole is formed that penetrates the base part and guide part. The guide part has: a spring part that expands / contracts in an advancing and retracting direction of the probe; and a spring seat that is locked to the probe, and to which a load toward a side where the probe separates from the measurement surface is applied by the spring part.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
Eddy current loss measuring sensor, apparatus and method for measurement of film thickness as well as recording medium
JP2001343205A