Substrate for semiconductor device and semiconductor device
JP2025094273AInactive Publication Date: 2025-06-24MAXELL LTD
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Patent Information
- Application Number
- JP2025058434
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2025-06-24
- Estimated Expiration
- Not applicable · inactive patent
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Figure 2025094273000001_ABST
Abstract
To provide a substrate for a semiconductor device that is effective when a large number of electrodes of a semiconductor element (electrodes of a mounting substrate) are arranged, and a semiconductor device using the substrate for semiconductor device.SOLUTION: In a substrate for a semiconductor device, a plurality of metal portions 11 that become at least electrode portions 11b is formed on a mother substrate 10. The metal portions 11 are arranged such that one end is disposed on the outer periphery and the other end is concentrated in the center. The other end sides of the metal portions 11 have a mounting area for semiconductor elements.SELECTED DRAWING: Figure 7
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Citation Information
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