Light emitting device and method for manufacturing the same

Abstract

To provide a highly reliable light-emitting device and a method for manufacturing the same.SOLUTION: A light emitting device includes a substrate, a light emitting element, an auxiliary body, and a bonding portion. The substrate has a plurality of terminal portions on an upper surface side. The light emitting element is disposed on an upper surface side of the substrate, and includes a plurality of electrodes on a side facing an upper surface of the substrate. The auxiliary body includes a lower surface bonded to the terminal portion, an upper surface, and a side surface located on a side of the electrode and connecting the lower surface and the upper surface. The side surface is inclined so as to be separated from the electrode as the side surface approaches the lower surface. The bonding portion is in contact with the terminal portion, the electrode, and the auxiliary body, and being made of a conductive material.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device and a method for manufacturing the same.

Background Art

[0002] A light-emitting device in which a large number of light-emitting elements are arranged on a substrate has been developed. When manufacturing such a light-emitting device, a step of bonding the light-emitting elements to the substrate is required. In this bonding step, problems such as misalignment of the positions of the light-emitting elements, poor connection, and insufficient bonding strength may occur. When such problems occur, the reliability of the light-emitting device decreases.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An embodiment has been made in view of the above problems, and an object thereof is to provide a highly reliable light-emitting device and a method for manufacturing the same.

Means for Solving the Problems

[0005] The light-emitting device according to the embodiment includes a substrate, a light-emitting element, an auxiliary body, and a bonding portion. The substrate has a plurality of terminal portions on the upper surface side. The light-emitting element is disposed on the upper surface side of the substrate and has a plurality of electrodes on the side facing the upper surface of the substrate. The auxiliary body has a lower surface joined to the terminal portion, an upper surface, and a side surface located on the side of the electrode and connecting the lower surface and the upper surface, and the side surface is inclined so as to be farther from the electrode as it approaches the lower surface. The bonding portion is in contact with the terminal portion, the electrode, and the auxiliary body and is made of a conductive material.

[0006] The manufacturing method of the light-emitting device according to the embodiment includes a step of disposing a first mask on the upper surface of a substrate having a first terminal portion and a second terminal portion on the upper surface side. The first mask has a first mask portion located between the first terminal portion and the second terminal portion, a second mask portion covering a first portion of the first terminal portion and exposing a second portion of the first terminal portion, and a third mask portion covering a third portion of the second terminal portion and exposing a fourth portion of the second terminal portion. A side surface of the second mask portion farther from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate, and a side surface of the third mask portion farther from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate. The manufacturing method includes a step of forming a first auxiliary body and a second auxiliary body using the first mask, a step of removing the first mask, and a step of disposing a second mask on the upper surface of the substrate. The second mask covers the space between the first terminal portion and the second terminal portion and exposes the first portion of the first terminal portion and the third portion of the second terminal portion. The manufacturing method includes a step of disposing a light-emitting element having a first electrode and a second electrode on the side facing the upper surface, such that the first electrode is located on the first portion of the first terminal portion and the second electrode is located on the third portion of the second terminal portion, on the second mask, a step of forming a first bonding portion in contact with the first portion of the first terminal portion, the first auxiliary body, and the first electrode, and a second bonding portion in contact with the third portion of the second terminal portion, the second auxiliary body, and the second electrode, and a step of removing the second mask.

[0007] The manufacturing method of the light-emitting device according to the embodiment includes a step of disposing a third mask on the upper surface of a substrate having a first terminal portion and a second terminal portion on the upper surface side, exposing a part of the first portion of the first terminal portion and covering the second portion, and exposing a part of the third portion of the second terminal portion and covering the fourth portion; a step of disposing a conductive material on the substrate and on the third mask; a step of removing the third mask to form a first support portion made of the conductive material and in contact with the first portion, and a second support portion made of the conductive material and in contact with the third portion; and a step of disposing a first mask. The first mask includes a first mask portion located between the first terminal portion and the second terminal portion, a second mask portion covering the first portion and the first support portion of the first terminal portion and exposing the second portion, and a third mask portion covering the third portion and the second support portion of the second terminal portion and exposing the fourth portion. A side surface of the second mask portion farther from the first mask portion inclines toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate. A side surface of the third mask portion farther from the first mask portion inclines toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate. The manufacturing method further includes a step of forming a first auxiliary body and a second auxiliary body using the first mask; a step of removing the first mask; a step of disposing a light-emitting element having a first electrode and a second electrode on a side facing the upper surface such that the first electrode is in contact with the first support portion and the second electrode is in contact with the second support portion; and a step of forming a first joint portion in contact with the first portion of the first terminal portion, the first auxiliary body, and the first electrode, and a second joint portion in contact with the third portion of the second terminal portion, the second auxiliary body, and the second electrode.

Advantages of the Invention

[0008] According to the embodiment, a highly reliable light-emitting device and a method for manufacturing the same can be realized.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

Figure 23

Figure 24

Figure 25

Figure 26

Figure 27

Figure 28

Figure 29

Figure 30

Figure 31

Figure 32

Figure 33

Figure 34

Figure 35

Figure 36

Figure 37

Figure 38

Figure 39

Figure 40

Figure 41

Figure 42

Figure 43

Figure 44

Figure 45

Figure 46

Figure 47

Figure 48

Figure 49

Figure 50

Figure 51

Figure 52

Figure 53

Figure 54

Figure 55

Figure 56

Figure 57

Figure 58

Figure 59

MODE FOR CARRYING OUT THE INVENTION

[0010] <First Embodiment> FIG. 1 is a plan view showing a light-emitting device according to this embodiment. FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. 1. FIG. 3 is a partially enlarged cross-sectional view showing region III of FIG. 2. FIG. 4 is a perspective view showing a substrate, a terminal portion, and an auxiliary body of the light-emitting device according to this embodiment.

[0011] Note that each drawing is schematic and is simplified and emphasized as appropriate. Also, even for the same components, the dimensional ratios and positional relationships do not necessarily exactly match between the drawings. Further, FIG. 1 shows a region in which four light-emitting elements 20 are arranged in two rows and two columns, but the number of light-emitting elements 20 included in the light-emitting device 1 may be five or more, three or less, or even one. The same applies to other drawings described later.

[0012] [Light-Emitting Device] First, the configuration of the light-emitting device according to this embodiment will be schematically described. As shown in FIGS. 1 to 4, the light-emitting device 1 according to this embodiment includes a substrate 10, a light-emitting element 20, an auxiliary body 30, and a bonding portion 40. The substrate 10 has a plurality of terminal portions 50 on the upper surface 10a side thereof. The light-emitting element 20 is disposed on the upper surface 10a side of the substrate 10. The light-emitting element 20 has a plurality of electrodes 60 on the side facing the upper surface 10a of the substrate 10. The auxiliary body 30 has a lower surface 30a, an upper surface 30b, and a side surface 30c. The lower surface 30a is bonded to the terminal portion 50. The side surface 30c is located on the electrode 60 side and connects the lower surface 30a and the upper surface 30b. The side surface 30c is inclined so as to be farther away from the electrode 60 as it approaches the lower surface 30a. The bonding portion 40 is in contact with the terminal portion 50, the electrode 60, and the auxiliary body 30. The bonding portion 40 is made of a conductive material.

[0013] The terminal portion 50 has a first terminal portion 51 and a second terminal portion 52. Hereinafter, the first terminal portion 51 and the second terminal portion 52 are also collectively referred to simply as "terminal portion 50". The electrodes 60 of the light-emitting element 20 have a first electrode 61 bonded to the first terminal portion 51 and a second electrode 62 bonded to the second terminal portion 52. The first electrode 61 and the second electrode 62 are also collectively referred to simply as "electrode 60". The auxiliary body 30 has a first auxiliary body 31 bonded to the first electrode 61 and a second auxiliary body 32 bonded to the second electrode 62. The first auxiliary body 31 and the second auxiliary body 32 are also collectively referred to simply as "auxiliary body 30". The auxiliary body 30 is preferably made of a conductive material. The first electrode 61 and the second electrode 62 are disposed between the first auxiliary body 31 and the second auxiliary body 32.

[0014] Next, the configuration of the light-emitting device 1 will be described in detail. The substrate 10 is a wiring board with wirings provided inside, and for example, it is an ASIC (Application Specific Integrated Circuit). As described above, on the upper surface 10a side of the substrate 10, the first terminal portion 51 and the second terminal portion 52 are arranged. One first terminal portion 51 and one second terminal portion 52 are arranged in a pair. Hereinafter, this pair is referred to as a "terminal pair". The first terminal portion 51 and the second terminal portion 52 are made of a conductive material, for example, gold (Au). External connection electrodes may be provided on the lower surface of the substrate 10. In this case, the external connection electrodes may be connected to the wirings on the upper surface side of the substrate 10 by via wirings arranged inside the substrate 10.

[0015] Hereinafter, in this specification, for convenience of explanation, an XYZ orthogonal coordinate system is adopted. In each terminal pair, the direction from the first terminal portion 51 to the second terminal portion 52 is defined as the "X direction". The direction parallel to the upper surface 10a and orthogonal to the X direction is defined as the "Y direction". The terminal pair composed of the first terminal portion 51 and the second terminal portion 52 is arranged in a matrix along the X direction and the Y direction on the upper surface 10a. The direction perpendicular to the upper surface 10a and from the substrate 10 toward the light-emitting element 20 is defined as the "Z direction". The Z direction is also referred to as "up", and the opposite direction of the Z direction is also referred to as "down", but this expression is also for convenience and has nothing to do with the direction of gravity. Looking from the Z direction is also referred to as "top view". In the description of the top view, in some cases, components that are actually hidden by other components and cannot be seen are regarded as visible for explanation.

[0016] The light-emitting device 1 is provided with a plurality of light-emitting elements 20, which are arranged in a matrix along the X direction and the Y direction. The light-emitting element 20 is, for example, a light-emitting diode (LED). Each light-emitting element 20 may be individually drivable by the substrate 10. The light-emitting elements 20 are arranged corresponding to the terminal pairs.

[0017] The shape of the light-emitting element 20 is, for example, an inverted quadrangular frustum. The light-emitting element 20 has an upper surface 20a, a lower surface 20b, and side surfaces 20c. The shape of the upper surface 20a is rectangular, for example, square. The lengths of the upper surface 20a in the X direction and the Y direction are, for example, 50 μm or less. The shape of the lower surface 20b is also rectangular, for example, square. The lower surface 20b is smaller than the upper surface 20a. In a top view, the lower surface 20b is located inside the upper surface 20a. Four side surfaces 20c are provided and are each inclined with respect to the Z direction.

[0018] The first electrode 61 and the second electrode 62 are disposed on the lower surface 20b side of the light-emitting element 20 and are arranged along the X direction. The first electrode 61 of the light-emitting element 20 faces and is spaced apart from the first terminal portion 51 of the substrate 10. The second electrode 62 faces and is spaced apart from the second terminal portion 52. The electrode 60 is made of a conductive material, for example, gold or copper (Cu).

[0019] The shape of the auxiliary body 30 is a rod shape extending in the Y direction. The length of the auxiliary body 30 in the Y direction is equal to or less than the length of the terminal portion 50 in the Y direction. The shape of the XZ cross section orthogonal to the axial direction of the auxiliary body 30 is, for example, trapezoidal. The length of the lower surface 30a in the X direction is shorter than the length of the upper surface 30b in the X direction. The side surface 30c is inclined with respect to the YZ plane so as to be farther from the electrode 60 as it goes downward. The side surface 30d on the opposite side of the side surface 30c is, for example, parallel to the YZ plane. In the present embodiment, one auxiliary body 30 is provided for one terminal portion 50. In a top view, the auxiliary body 30 is located inside the light-emitting element 20. The auxiliary body 30 is made of, for example, gold.

[0020] The joint portion 40 has a first joint portion 41 and a second joint portion 42. The first joint portion 41 and the second joint portion 42 are collectively referred to simply as the "joint portion 40". The shape of the joint portion 40 is a rod shape extending in the Y direction, and the shape of the XZ cross-section orthogonal to the axial direction is, for example, a trapezoid. The lower surface 40a of the joint portion 40 is in contact with the upper surface of the terminal portion 50, and the upper surface 40b of the joint portion 40 is in contact with the electrode 60. Note that the electrode 60 may enter the joint portion 40 from the upper surface 40b. The side surface 40c of the joint portion 40 is in contact with the side surface 30c of the auxiliary body 30. The side surface 40c of the joint portion 40 connects the lower surface 40a and the upper surface 40b. The side surface 40c is inclined with respect to the YZ plane so as to be farther away from the electrode 60 as it goes downward.

[0021] The first joint portion 41 is disposed above the first terminal portion 51 and laterally of the first auxiliary body 31. The first joint portion 41 is in contact with the upper surface of the first terminal portion 51, the side surface 30c of the first auxiliary body 31, and the lower part of the first electrode 61. The second joint portion 42 is disposed above the second terminal portion 52 and laterally of the second auxiliary body 32. The second joint portion 42 is in contact with the upper surface of the second terminal portion 52, the side surface 30c of the second auxiliary body 32, and the lower part of the second electrode 62.

[0022] [Manufacturing Method of Light-Emitting Device] Next, a manufacturing method of the light-emitting device according to the present embodiment will be described. FIG. 5 is a plan view showing the manufacturing method of the light-emitting device according to the present embodiment. FIG. 6 is a cross-sectional view taken along line VI-VI shown in FIG. 5. FIG. 7 is a plan view showing the manufacturing method of the light-emitting device according to the present embodiment. FIG. 8 is a cross-sectional view taken along line VIII-VIII shown in FIG. 7. FIG. 9 is a plan view showing the manufacturing method of the light-emitting device according to the present embodiment. FIG. 10 is a cross-sectional view taken along line X-X shown in FIG. 9. FIG. 11 is a plan view showing the manufacturing method of the light-emitting device according to the present embodiment. FIG. 12 is a cross-sectional view taken along line XII-XII shown in FIG. 10. FIG. 13 is a plan view showing the manufacturing method of the light-emitting device according to the present embodiment. Figure 14 is a cross-sectional view taken along line XIV-XIV shown in Figure 13. Figure 15 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. Figure 16 is a cross-sectional view taken along line XVI-XVI shown in Figure 15. Figure 17 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. Figure 18 is a cross-sectional view taken along line XVIII-XVIII shown in Figure 17.

[0023] (Step of arranging the first mask 110) First, as shown in FIGS. 5 and 6, a substrate 10 is prepared. As described above, the substrate 10 has a first terminal portion 51 and a second terminal portion 52 on the upper surface 10a side. Terminal pairs each consisting of one first terminal portion 51 and one second terminal portion 52 are arranged in a matrix along the X direction and the Y direction. The substrate 10 is, for example, an ASIC.

[0024] Next, as shown in FIGS. 7 and 8, a first mask 110 is arranged on the upper surface 10a of the substrate 10. The first mask 110 has a first mask portion 111, a second mask portion 112, a third mask portion 113, and a fourth mask portion 114. The first mask portion 111, the second mask portion 112, the third mask portion 113, and the fourth mask portion 114 are integrally formed.

[0025] The first mask portion 111 is located between the first terminal portion 51 and the second terminal portion 52 in each terminal pair. The second mask portion 112 covers the first portion 51a of the first terminal portion 51 and exposes the second portion 51b of the first terminal portion 51. The first portion 51a of the first terminal portion 51 is located on the second terminal portion 52 side, and the second portion 51b is located on the side far from the second terminal portion 52. The third mask portion 113 covers the third portion 52a of the second terminal portion 52 and exposes the fourth portion 52b of the second terminal portion 52. The third portion 52a of the second terminal portion 52 is located on the first terminal portion 51 side, and the fourth portion 52b is located on the side far from the first terminal portion 51. The first portion 51a of the first terminal portion 51 and the third portion 52a of the second terminal portion 52 are arranged between the second portion 51b of the first terminal portion 51 and the fourth portion 52b of the second terminal portion 52.

[0026] The side surface 112a of the second mask portion 112, which is farther from the first mask portion 111, is inclined toward the space between the first terminal portion 51 and the second terminal portion 52 as it moves away from the substrate 10. The side surface 113a of the third mask portion 113, which is farther from the first mask portion 111, is inclined toward the space between the first terminal portion 51 and the second terminal portion 52 as it moves away from the substrate 10.

[0027] The fourth mask portion 114 covers the region between the terminal pairs on the substrate 10. In the present embodiment, in a top view, the shape of the fourth mask portion 114 is lattice-shaped. In the XZ cross-section, the second mask portion 112, the first mask portion 111, and the third mask portion 113 are arranged continuously. In the XZ cross-section, the second mask portion 112 is separated from the fourth mask portion 114, and the third mask portion 113 is separated from the fourth mask portion 114. As a result, a first opening 115 is formed between the second mask portion 112 and the fourth mask portion 114, and a second opening 116 is formed between the third mask portion 113 and the fourth mask portion 114. The side surface 112a of the second mask portion 112 is also the side surface of the first opening 115. The side surface 113a of the third mask portion 113 is also the side surface of the second opening 116.

[0028] The first mask 110 is made of, for example, resist, and is formed by exposing and developing, for example, a positive resist disposed on the entire surface of the substrate 10 and removing the exposed portions. At this time, by continuously changing the exposure light amount along the X direction, the side surface 112a of the second mask portion 112 and the side surface 113a of the third mask portion 113 are formed.

[0029] (Step of forming the first auxiliary body 31 and the second auxiliary body 32) Next, as shown in FIGS. 9 and 10, the first auxiliary body 31 and the second auxiliary body 32 are formed using the first mask 110. For example, by performing gold plating starting from the terminal portion 50 or sputtering using gold as a target, the first auxiliary body 31 is formed in the first opening 115 of the first mask 110, and the second auxiliary body 32 is formed in the second opening 116.

[0030] At this time, the lower surface 30a of the first auxiliary body 31 is in contact with the first terminal portion 51, the side surface 30c is in contact with the side surface 112a of the second mask portion 112, and the upper surface 30b is exposed on the upper surface of the first mask 110. Also, the lower surface 30a of the second auxiliary body 32 is in contact with the second terminal portion 52, the side surface 30c is in contact with the side surface 113a of the third mask portion 113, and the upper surface 30b is exposed on the upper surface of the first mask 110.

[0031] (Step of removing the first mask 110) Next, as shown in FIGS. 11 and 12, the first mask 110 is removed. As a result, the first auxiliary body 31 remains on the first terminal portion 51, and the second auxiliary body 32 remains on the second terminal portion 52.

[0032] (Step of arranging the second mask 120) Next, as shown in FIGS. 13 and 14, the second mask 120 is arranged on the upper surface 10a of the substrate 10. The second mask 120 covers the space between the first terminal portion 51 and the second terminal portion 52, and exposes the first portion 51a of the first terminal portion 51 and the third portion 52a of the second terminal portion 52.

[0033] For example, the second mask has a fifth mask portion 121 and a sixth mask portion 122. The fifth mask portion 121 and the sixth mask portion 122 each extend in the Y direction and are arranged over a plurality of terminal pairs arranged along the Y direction. The fifth mask portion 121 and the sixth mask portion 122 are spaced apart from each other.

[0034] The fifth mask portion 121 covers the space between the first terminal portion 51 and the second terminal portion 52 in each terminal pair. The sixth mask portion 122 covers the auxiliary body 30, the region between the auxiliary bodies 30 in the Y direction, and the region between the terminal pairs in the X direction. As a result, the first portion 51a of the first terminal portion 51, the region between the first portions 51a of the terminal pairs adjacent to each other in the Y direction, the third portion 52a of the second terminal portion 52, and the region between the third portions 52a of the terminal pairs adjacent to each other in the Y direction are not covered by the second mask 120.

[0035] The height of the sixth mask portion 122, that is, the position of the upper surface of the sixth mask portion 122 in the Z direction, is set to be the same as the height of the fifth mask portion 121 or lower than the fifth mask portion 121. The second mask 120 is formed, for example, by forming a resist film over the entire surface and performing exposure and development. The fifth mask portion 121 and the sixth mask portion 122 may be formed together or may be formed in two steps.

[0036] (Step of disposing the light-emitting element 20 on the second mask 120) Next, as shown in FIGS. 15 and 16, the light-emitting element 20 is disposed on the second mask 120. The configuration of the light-emitting element 20 is as described above, and the first electrode 61 and the second electrode 62 are provided on the lower surface 20b side. Then, the light-emitting element 20 is disposed on the second mask 120 such that the first electrode 61 of the light-emitting element 20 is positioned on the first portion 51a of the first terminal portion 51 and the second electrode 62 of the light-emitting element 20 is positioned on the third portion 52a of the second terminal portion 52.

[0037] For example, the region between the first electrode 61 and the second electrode 62 on the lower surface 20b of the light-emitting element 20 is brought into contact with the upper surface of the fifth mask portion 121 of the second mask 120. At this time, the lower surface 20b of the light-emitting element 20 may or may not be in contact with the sixth mask portion 122 of the second mask 120. Thereby, the light-emitting element 20 is supported by at least the fifth mask portion 121 of the second mask 120. Also, the first electrode 61 and the second electrode 62 are separated from the second mask 120.

[0038] (Step of forming the first bonding portion 41 and the second bonding portion 42) Next, as shown in FIGS. 17 and 18, a first bonding portion 41 that contacts the first portion 51a of the first terminal portion 51, the first auxiliary body 31, and the first electrode 61, and a second bonding portion 42 that contacts the third portion 52a of the second terminal portion 52, the second auxiliary body 32, and the second electrode 62 are formed. For example, gold is plated starting from the first portion 51a of the first terminal portion 51 and the third portion 52a of the second terminal portion 52.

[0039] The gold plating film that grows starting from the first portion 51a of the first terminal portion 51 grows upward while contacting the side surface 30c of the first auxiliary body 31, contacts the lower end of the first electrode 61, and covers the lower end of the first electrode 61. Thereby, the first joint portion 41 is formed. The first electrode 61 is joined via the first terminal portion 51 and the first joint portion 41. Similarly, the gold plating film that grows starting from the third portion 52a of the second terminal portion 52 grows upward while contacting the side surface 30c of the second auxiliary body 32, contacts the lower end of the second electrode 62, and covers the lower end of the second electrode 62. Thereby, the second joint portion 42 is formed. The second electrode 62 is joined via the second terminal portion 52 and the second joint portion 42.

[0040] (Step of removing the second mask 120) Next, as shown in FIGS. 1 to 4, the second mask 120 is removed. Thereby, the light-emitting device 1 is manufactured.

[0041] [Effect] According to the present embodiment, in the steps shown in FIGS. 11 and 12, after forming the auxiliary body 30 on the terminal portion 50 of the substrate 10, in the steps shown in FIGS. 13 and 14, the second mask 120 is formed, and in the steps shown in FIGS. 15 and 16, the light-emitting element 20 is arranged on the second mask 120. In the steps shown in FIGS. 17 and 18, the joint portion 40 is formed. Thereby, since the position and shape of the joint portion 40 are regulated by the auxiliary body 30, variations in the position or shape of the joint portion 40 can be suppressed, and the occurrence of joint failure due to these variations can be suppressed. Further, by arranging the light-emitting element 20 on the second mask 120, the positional accuracy of the light-emitting element 20 can be improved. As a result, the reliability of the light-emitting device 1 is improved.

[0042] Further, in the present embodiment, the auxiliary body 30 is formed using the first mask 110. Thereby, the accuracy of the position and shape of the auxiliary body 30 can be improved. As a result, the accuracy of the position and shape of the joint portion 40 is improved, and the reliability of the light-emitting device 1 is improved.

[0043] Furthermore, in the present embodiment, the side surface 30c of the auxiliary body 30 is inclined so as to be farther from the electrode 60 as it approaches the lower surface 30a. As a result, the bonding area between the auxiliary body 30 and the joint portion 40 increases, the bonding strength increases, and the joint portion 40 is engaged with the auxiliary body 30, making it difficult to drop off from the substrate 10. This also improves the reliability of the light-emitting device 1. Further, by forming the auxiliary body 30 of a conductive material, the electrical resistance between the terminal portion 50 and the electrode 60 can be reduced.

[0044] Furthermore, in the steps shown in FIGS. 13 and 14, a sixth mask portion 122 is provided in the second mask 120. As a result, when forming the joint portion 40 in the steps shown in FIGS. 17 and 18, it is possible to suppress a short circuit between the terminal portions 50 between adjacent terminal pairs.

[0045] <First Modification of the First Embodiment> FIG. 19 is a perspective view showing a substrate, a terminal portion, and an auxiliary body of the light-emitting device according to this modification. In the following-described modifications and embodiments, parts similar to those already described will be explained in a simplified or omitted manner, and differences will be explained in detail. Also, the same reference numerals will be given to components similar to those already described, and detailed explanations will be omitted.

[0046] As shown in FIG. 19, in the light-emitting device 1a according to this modification, the first auxiliary body 31 extends over a plurality of terminal pairs arranged along the Y direction. That is, one first auxiliary body 31 is in contact with a plurality of first terminal portions 51 arranged along the Y direction. The second auxiliary body 32 is provided for each second terminal portion 52, as in the first embodiment. This modification can be applied when the first electrodes 61 may be shared among a plurality of light-emitting elements 20 arranged along the Y direction. The configurations, manufacturing methods, and effects other than those described above in this modification are the same as those in the first embodiment.

[0047] <Second Modification of the First Embodiment> FIG. 20 is a perspective view showing a substrate, a terminal portion, and an auxiliary body of the light-emitting device according to this modification. As shown in FIG. 20, in the light-emitting device 1b according to this modified example, two first auxiliary bodies 31 are provided for one first terminal portion 51. The two first auxiliary bodies 31 are arranged along the Y direction. Also, two second auxiliary bodies 32 are provided for one second terminal portion 52. The two second auxiliary bodies 32 are arranged along the Y direction. This modified example can be suitably applied, for example, when two first electrodes 61 and two second electrodes 62 are provided for the light-emitting element 20. Note that three or more first auxiliary bodies 31 may be provided for one first terminal portion 51, and three or more second auxiliary bodies 32 may be provided for one second terminal portion 52, and the number of first auxiliary bodies 31 and the number of second auxiliary bodies 32 may be different. The configurations, manufacturing methods, and effects other than those described above in this modified example are the same as those in the first embodiment.

[0048] <Second Embodiment> FIG. 21 is a plan view showing the light-emitting device according to this embodiment. FIG. 22 is a cross-sectional view taken along line XXII-XXII shown in FIG. 21. FIG. 23 is a partially enlarged cross-sectional view showing region XXIII in FIG. 22. FIG. 24 is a perspective view showing the substrate, terminal portion, and auxiliary body of the light-emitting device according to this embodiment.

[0049] [Light-Emitting Device] As shown in FIGS. 21 to 24, in the light-emitting device 2 according to this embodiment, the auxiliary body 30 has a third auxiliary body 33 and a fourth auxiliary body 34 in addition to the above-described first auxiliary body 31 and second auxiliary body 32. The third auxiliary body 33 is joined to the first electrode 61 of the light-emitting element 20. The fourth auxiliary body 34 is joined to the second electrode 62 of the light-emitting element 20. The side surface 30c of the third auxiliary body 33 is inclined with respect to the YZ plane so as to be farther away from the first electrode 61 as it goes downward. The side surface 30c of the fourth auxiliary body 34 is inclined with respect to the YZ plane so as to be farther away from the second electrode 62 as it goes downward.

[0050] In the X direction, the third auxiliary body 33 and the fourth auxiliary body 34 are arranged between the first auxiliary body 31 and the second auxiliary body 32. The first electrode 61 is arranged between the first auxiliary body 31 and the third auxiliary body 33. The second electrode 62 is arranged between the second auxiliary body 32 and the fourth auxiliary body 34.

[0051] That is, on the first terminal portion 51 of the substrate 10, the first auxiliary body 31 and the third auxiliary body 33 are arranged such that the side surfaces 30c face each other. On the first terminal portion 51, between the first auxiliary body 31 and the third auxiliary body 33, a first bonding portion 41 is arranged. Inside and on the upper surface of the first bonding portion 41, the first electrode 61 of the light-emitting element 20 is arranged. And the side surface 30c of the first auxiliary body 31 and the side surface 30c of the third auxiliary body 33 face the first electrode 61 and are inclined so as to be separated from each other as they go downward.

[0052] Similarly, on the second terminal portion 52 of the substrate 10, the second auxiliary body 32 and the fourth auxiliary body 34 are arranged such that the side surfaces 30c face each other. On the second terminal portion 52, between the second auxiliary body 32 and the fourth auxiliary body 34, a second bonding portion 42 is arranged. Inside and on the upper surface of the second bonding portion 42, the second electrode 62 of the light-emitting element 20 is arranged. And the side surface 30c of the second auxiliary body 32 and the side surface 30c of the fourth auxiliary body 34 face the second electrode 62 and are inclined so as to be separated from each other as they go downward.

[0053] [Manufacturing Method of Light-Emitting Device] Next, a manufacturing method of the light-emitting device according to the present embodiment will be described. FIG. 25 is a plan view showing a manufacturing method of the light-emitting device according to the present embodiment. FIG. 26 is a cross-sectional view taken along line XXVI-XXVI shown in FIG. 25. FIG. 27 is a plan view showing a manufacturing method of the light-emitting device according to the present embodiment. FIG. 28 is a cross-sectional view taken along line XXVIII-XXVIII shown in FIG. 27. FIG. 29 is a plan view showing a manufacturing method of the light-emitting device according to the present embodiment. FIG. 30 is a cross-sectional view taken along the line XXX-XXX shown in FIG. 29. FIG. 31 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. FIG. 32 is a cross-sectional view taken along the line XXXII-XXXII shown in FIG. 30. FIG. 33 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. FIG. 34 is a cross-sectional view taken along the line XXXIV-XXXIV shown in FIG. 33. FIG. 35 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. FIG. 36 is a cross-sectional view taken along the line XXXVI-XXXVI shown in FIG. 35.

[0054] (Step of arranging the first mask 110) First, as shown in FIGS. 5 and 6, a substrate 10 is prepared. Next, as shown in FIGS. 25 and 26, a first mask 110 is arranged on the upper surface 10a of the substrate 10. In the present embodiment, the first terminal portion 51 has one first portion 51a and two second portions 51b, and one first portion 51a is arranged between the two second portions 51b. Further, the second terminal portion 52 has one third portion 52a and two fourth portions 52b, and one third portion 52a is arranged between the two fourth portions 52b.

[0055] The first mask 110 has a first mask portion 111, a second mask portion 112, a third mask portion 113, and a fourth mask portion 114. The first mask portion 111, the second mask portion 112, the third mask portion 113, and the fourth mask portion 114 are integrally formed. The first mask portion 111 is located between the first terminal portion 51 and the second terminal portion 52 in each terminal pair. The fourth mask portion 114 covers the region between the terminal pairs on the substrate 10. In the present embodiment, in a top view, the shape of the fourth mask portion 114 is lattice-shaped. In an XZ cross-section, the second mask portion 112 is separated from the fourth mask portion 114, and the third mask portion 113 is separated from the fourth mask portion 114.

[0056] The second mask portion 112 covers the first portion 51a of the first terminal portion 51 and exposes two second portions 51b arranged on both sides of the first portion 51a in the X direction. Thereby, a first opening 115 is formed between the second mask portion 112 and the fourth mask portion 114, and a third opening 117 is formed between the second mask portion 112 and the first mask portion 111.

[0057] The third mask portion 113 covers the third portion 52a of the second terminal portion 52 and exposes two fourth portions 52b arranged on both sides of the third portion 52a in the X direction. Thereby, a second opening 116 is formed between the third mask portion 113 and the fourth mask portion 114, and a fourth opening 118 is formed between the third mask portion 113 and the first mask portion 111.

[0058] The side surface 112a of the second mask portion 112 on the side far from the first mask portion 111 is inclined toward the space between the first terminal portion 51 and the second terminal portion 52 as it moves away from the substrate 10. The side surface 112a of the second mask portion 112 is also the side surface of the first opening 115. The side surface 112b of the second mask portion 112 on the side close to the first mask portion 111 is inclined away from the space between the first terminal portion 51 and the second terminal portion 52 as it moves away from the substrate 10. The side surface 112b of the second mask portion 112 is also the side surface of the third opening 117. The side surface 112a and the side surface 112b of the second mask portion 112 are inclined with respect to the YZ plane so as to approach each other as they move away from the substrate 10.

[0059] The side surface 113a of the third mask portion 113 on the side far from the first mask portion 111 is inclined toward the space between the first terminal portion 51 and the second terminal portion 52 as it moves away from the substrate 10. The side surface 113a of the third mask portion 113 is also the side surface of the second opening 116. The side surface 113b of the third mask portion 113 on the side close to the first mask portion 111 is inclined away from the space between the first terminal portion 51 and the second terminal portion 52 as it moves away from the substrate 10. The side surface 113b of the third mask portion 113 is also the side surface of the fourth opening 118. The side surface 113a and the side surface 113b of the third mask portion 113 are inclined with respect to the YZ plane so as to approach each other as they move away from the substrate 10.

[0060] (Step of forming auxiliary body 30) Next, as shown in FIGS. 27 and 28, an auxiliary body 30 is formed using a first mask 110. For example, by performing gold plating starting from the terminal portion 50 or sputtering with gold as a target, a first auxiliary body 31 is formed in the first opening 115 of the first mask 110, a second auxiliary body 32 is formed in the second opening 116, a third auxiliary body 33 is formed in the third opening 117, and a fourth auxiliary body 34 is formed in the fourth opening 118.

[0061] At this time, the lower surface 30a of the third auxiliary body 33 is in contact with the first terminal portion 51, the side surface 30c is in contact with the side surface 112b of the second mask portion 112, and the upper surface 30b is exposed on the upper surface of the first mask 110. Also, the lower surface 30a of the fourth auxiliary body 34 is in contact with the second terminal portion 52, the side surface 30c is in contact with the side surface 113b of the third mask portion 113, and the upper surface 30b is exposed on the upper surface of the first mask 110. The first auxiliary body 31 and the second auxiliary body 32 are the same as in the first embodiment.

[0062] (Step of removing the first mask 110) Next, as shown in FIGS. 29 and 30, the first mask 110 is removed. As a result, the first auxiliary body 31 and the third auxiliary body 33 remain separated from each other on the first terminal portion 51, and the second auxiliary body 32 and the fourth auxiliary body 34 remain separated from each other on the second terminal portion 52.

[0063] (Step of disposing the second mask 120) Next, as shown in FIGS. 31 and 32, a second mask 120 is disposed on the upper surface 10a of the substrate 10. The second mask has a fifth mask portion 121 and a sixth mask portion 122. The fifth mask portion 121 and the sixth mask portion 122 each extend in the Y direction and are disposed over a plurality of terminal pairs arranged along the Y direction. The fifth mask portion 121 and the sixth mask portion 122 are separated from each other.

[0064] The fifth mask portion 121 covers between the first terminal portion 51 and the second terminal portion 52 in each terminal pair. The fifth mask portion 121 also covers the third auxiliary body 33 and the fourth auxiliary body 34. The sixth mask portion 122 covers the region between the terminal pairs in the X direction. The sixth mask portion 122 also covers the first auxiliary body 31 and the second auxiliary body 32.

[0065] (Step of disposing the light-emitting element 20 on the second mask 120) Next, as shown in FIGS. 33 and 34, the light-emitting element 20 is disposed on the second mask 120. For example, the region between the first electrode 61 and the second electrode 62 on the lower surface 20b of the light-emitting element 20 is brought into contact with the upper surface of the fifth mask portion 121 of the second mask 120. Thereby, the light-emitting element 20 is supported by at least the fifth mask portion 121 of the second mask 120.

[0066] At this time, the first electrode 61 of the light-emitting element 20 is on the first portion 51a of the first terminal portion 51 and is located between the first auxiliary body 31 and the third auxiliary body 33. The second electrode 62 of the light-emitting element 20 is on the third portion 52a of the second terminal portion 52 and is located between the second auxiliary body 32 and the fourth auxiliary body 34.

[0067] (Step of forming the first bonding portion 41 and the second bonding portion 42) Next, as shown in FIGS. 35 and 36, for example, by plating gold starting from the first portion 51a of the first terminal portion 51 and the third portion 52a of the second terminal portion 52, the first bonding portion 41 and the second bonding portion 42 are formed. The first bonding portion 41 is in contact with the first portion 51a of the first terminal portion 51, the first auxiliary body 31, the third auxiliary body 33, and the first electrode 61. Thereby, the first electrode 61 is bonded to the first terminal portion 51 via the first bonding portion 41. The second bonding portion 42 is in contact with the third portion 52a of the second terminal portion 52, the second auxiliary body 32, the fourth auxiliary body 34, and the second electrode 62. Thereby, the second electrode 62 is bonded to the second terminal portion 52 via the second bonding portion 42.

[0068] (Step of removing the second mask 120) Next, as shown in FIGS. 21 to 24, the second mask 120 is removed. Thereby, the light-emitting device 2 is manufactured.

[0069] [Effect] In the present embodiment, in the steps shown in FIGS. 29 and 30, the first auxiliary body 31 and the third auxiliary body 33 are formed on the first terminal portion 51 of the substrate 10, and the second auxiliary body 32 and the fourth auxiliary body 34 are formed on the second terminal portion 52. Then, in the steps shown in FIGS. 33 and 34, the first electrode 61 of the light-emitting element 20 is disposed between the first auxiliary body 31 and the third auxiliary body 33, and the second electrode 62 is disposed between the second auxiliary body 32 and the fourth auxiliary body 34. Next, in the steps shown in FIGS. 35 and 36, a first bonding portion 41 is formed between the first auxiliary body 31 and the third auxiliary body 33 on the first terminal portion 51 and bonded to the first electrode 61, and a second bonding portion 42 is formed between the second auxiliary body 32 and the fourth auxiliary body 34 on the second terminal portion 52 and bonded to the second electrode 62.

[0070] Thereby, since the first bonding portion 41 is restricted from both sides in the X direction by the first auxiliary body 31 and the third auxiliary body 33, the positional accuracy and the shape accuracy of the first bonding portion 41 are further improved, and the bonding strength with the substrate 10 is improved. Further, since the second bonding portion 42 is restricted from both sides in the X direction by the second auxiliary body 32 and the fourth auxiliary body 34, the positional accuracy and the shape accuracy of the second bonding portion 42 are further improved, and the bonding strength with the substrate 10 is improved. As a result, the reliability of the light-emitting device 2 is further improved. The configurations, manufacturing methods, and effects other than the above in the present embodiment are the same as those in the first embodiment.

[0071] <The Third Embodiment> FIG. 37 is a plan view showing a light-emitting device according to the present embodiment. FIG. 38 is a cross-sectional view taken along line XXXVIII-XXXVIII shown in FIG. 37. FIG. 39 is a perspective view showing a substrate, a terminal portion, and an auxiliary body of the light-emitting device according to the present embodiment. Note that FIGS. 37 and 38 show a region where one light-emitting element 20 is disposed.

[0072] Light-emitting device As shown in FIGS. 37 to 39, the light-emitting device 3 according to the present embodiment further includes a support portion 70 in addition to the configuration of the light-emitting device 2 according to the second embodiment. The support portion 70 is made of a conductive material. The support portion 70 is disposed on the terminal portion 50, is in contact with the terminal portion 50, the electrode 60, and the bonding portion 40, and is separated from the auxiliary body 30.

[0073] The support portion 70 is formed of, for example, gold. The shape of the support portion 70 is, for example, a rectangular plate shape, the longitudinal direction is the Y direction, the width direction is the X direction, and the thickness direction is the Z direction. For example, the length of the support portion 70 in the Y direction is longer than the length in the X direction, and the length in the X direction is longer than the length in the Z direction. The support portion 70 has a first support portion 71 and a second support portion 72. Hereinafter, the first support portion 71 and the second support portion 72 are also collectively referred to simply as the "support portion 70". In a top view, the support portion 70 may be larger or smaller than the electrode 60.

[0074] The first support portion 71 is disposed between the first terminal portion 51 and the first electrode 61 in the Z direction and is in contact with the first terminal portion 51 and the first electrode 61. The first support portion 71 is disposed between the first auxiliary body 31 and the third auxiliary body 33 in the X direction and is separated from the first auxiliary body 31 and the third auxiliary body 33. Further, the first support portion 71 is in contact with the first bonding portion 41.

[0075] The second support portion 72 is disposed between the second terminal portion 52 and the second electrode 62 in the Z direction and is in contact with the second terminal portion 52 and the second electrode 62. The second support portion 72 is disposed between the second auxiliary body 32 and the fourth auxiliary body 34 in the X direction and is separated from the second auxiliary body 32 and the fourth auxiliary body 34. Further, the second support portion 72 is in contact with the second bonding portion 42.

[0076] Manufacturing method of light-emitting device Next, a manufacturing method of the light-emitting device according to the present embodiment will be described. FIG. 40 is a plan view showing a manufacturing method of the light-emitting device according to the present embodiment. FIG. 41 is a cross-sectional view taken along the line XLI-XLI shown in FIG. 40. Figure 42 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. Figure 43 is a cross-sectional view taken along line XLIII-XLIII shown in Figure 42. Figure 44 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. Figure 45 is a cross-sectional view taken along line XLV-XLV shown in Figure 44. Figure 46 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. Figure 47 is a cross-sectional view taken along line XLVII-XLVII shown in Figure 46. Figure 48 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. Figure 49 is a cross-sectional view taken along line XLIX-XLIX shown in Figure 48. Figure 50 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. Figure 51 is a cross-sectional view taken along line LI-LI shown in Figure 50. Figure 52 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. Figure 53 is a cross-sectional view taken along line LIII-LIII shown in Figure 52.

[0077] (Step of arranging the third mask 130) First, as shown in FIGS. 5 and 6, a substrate 10 is prepared. Next, as shown in FIGS. 40 and 41, a third mask 130 is arranged on the upper surface 10a of the substrate 10. The third mask 130 exposes a part of the first part 51a of the first terminal portion 51 and a part of the third part 52a of the second terminal portion 52.

[0078] The third mask 130 is formed, for example, by forming a resist film on the entire upper surface 10a of the substrate 10 and performing exposure and development. The third mask 130 is formed with a fifth opening 131 and a sixth opening 132. A part of the first part 51a of the first terminal portion 51 is exposed in the fifth opening 131, and a part of the third part 52a of the second terminal portion 52 is exposed in the sixth opening 132.

[0079] (Step of disposing a conductive material on the substrate 10 and on the third mask 130) Next, as shown in FIGS. 42 and 43, a conductive material 79 is disposed on the substrate 10 and on the third mask 130. For example, gold is deposited by sputtering or vapor deposition. The conductive material 79 is also disposed within the fifth opening 131 and within the sixth opening 132.

[0080] (Step of forming the first support portion 71 and the second support portion 72) Next, as shown in FIGS. 44 and 45, the third mask 130 is removed. At this time, among the conductive material 79, the portion disposed on the third mask 130 is removed together with the third mask 130. On the other hand, among the conductive material 79, the portions disposed within the fifth opening 131 and within the sixth opening 132 remain and become the first support portion 71 and the second support portion 72, respectively. The first support portion 71 is in contact with a part of the first part 51a of the first terminal portion 51, and the second support portion 72 is in contact with a part of the third part 52a of the second terminal portion 52.

[0081] (Step of disposing the first mask 110) Next, as shown in FIGS. 46 and 47, the first mask 110 is disposed on the upper surface 10a of the substrate 10. At this time, the second mask portion 112 of the first mask 110 covers the first support portion 71, and the third mask portion 113 of the first mask 110 covers the second support portion 72.

[0082] (Step of forming the auxiliary body 30) Next, as shown in FIGS. 48 and 49, a first auxiliary body 31 is formed within the first opening 115 of the first mask 110, a second auxiliary body 32 is formed within the second opening 116, a third auxiliary body 33 is formed within the third opening 117, and a fourth auxiliary body 34 is formed within the fourth opening 118. The auxiliary body 30 is formed at a position separated from the support portion 70.

[0083] (Step of removing the first mask 110) Next, as shown in FIGS. 50 and 51, the first mask 110 is removed. As a result, the first support portion 71, the first auxiliary body 31, and the third auxiliary body 33 remain separated from each other on the first terminal portion 51, and the second support portion 72, the second auxiliary body 32, and the fourth auxiliary body 34 remain separated from each other on the second terminal portion 52.

[0084] (Step of arranging the light-emitting element 20) Next, as shown in FIGS. 52 and 53, the light-emitting element 20 is arranged on the substrate 10. At this time, the lower surface of the first electrode 61 is arranged to be in contact with the upper surface of the first support portion 71, and the lower surface of the second electrode 62 is arranged to be in contact with the upper surface of the second support portion 72. The first electrode 61 and the first support portion 71 are solid-phase bonded, and the second electrode 62 and the second support portion 72 are solid-phase bonded.

[0085] (Step of forming the first joint portion 41 and the second joint portion 42) Next, as shown in FIGS. 37 and 38, for example, by plating gold starting from the first portion 51a of the first terminal portion 51 and the third portion 52a of the second terminal portion 52, the first joint portion 41 and the second joint portion 42 are formed. The first joint portion 41 is in contact with the first portion 51a of the first terminal portion 51, the first support portion 71, the first auxiliary body 31, the third auxiliary body 33, and the first electrode 61. As a result, the first electrode 61 is joined to the first terminal portion 51 via the first joint portion 41. The second joint portion 42 is in contact with the third portion 52a of the second terminal portion 52, the second support portion 72, the second auxiliary body 32, the fourth auxiliary body 34, and the second electrode 62. As a result, the second electrode 62 is joined to the second terminal portion 52 via the second joint portion 42. In this way, the light-emitting device 3 is manufactured.

[0086] [Effect] In this embodiment, in the steps shown in FIGS. 40 to 45, a first support portion 71 is formed on the first terminal portion 51, and a second support portion 72 is formed on the second terminal portion 52. Then, in the steps shown in FIGS. 52 and 53, the light-emitting element 20 is arranged such that the first electrode 61 is in contact with the first support portion 71 and the second electrode 62 is in contact with the second support portion 72. Thereby, the light-emitting element 20 can be stably arranged on the substrate 10 without forming the second mask 120. As a result, the manufacturing cost of the light-emitting device 3 can be reduced, and the stability when arranging the light-emitting element 20 is improved. For this reason, the reliability of the light-emitting device 3 is further improved. The configurations, manufacturing methods, and effects other than those described above in this embodiment are the same as those in the second embodiment.

[0087] <Fourth Embodiment> FIG. 54 is a plan view showing a light-emitting device according to this embodiment. FIG. 55 is a cross-sectional view taken along the LV-LV line shown in FIG. 54. Note that FIGS. 54 and 55 show a region where one light-emitting element 20 is arranged.

[0088] As shown in FIGS. 54 and 55, the light-emitting device 4 according to this embodiment is different from the light-emitting device 2 according to the second embodiment in that the joint portion 40 is formed of a eutectic alloy and the electrodes 60 of the light-emitting element 20 are in contact with the terminal portions 50. The joint portion 40 is formed of, for example, a gold-tin alloy (AuSn).

[0089] The joint portion 40 includes a first joint portion 43 arranged on the first terminal portion 51 and a second joint portion 44 arranged on the second terminal portion 52. The first joint portion 43 and the second joint portion 44 are made of a eutectic alloy, for example, a gold-tin alloy. The first joint portion 43 is eutectically joined to the first terminal portion 51, the first auxiliary body 31, the third auxiliary body 33, and the first electrode 61. The second joint portion 44 is eutectically joined to the second terminal portion 52, the second auxiliary body 32, the fourth auxiliary body 34, and the second electrode 62.

[0090] [Manufacturing Method of Light-Emitting Device] Next, a manufacturing method of the light-emitting device according to this embodiment will be described. FIG. 56 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. FIG. 57 is a cross-sectional view taken along line LVII-LVII shown in FIG. 56. FIG. 58 is a plan view showing a method of manufacturing a light-emitting device according to the present embodiment. FIG. 59 is a cross-sectional view taken along line LIX-LIX shown in FIG. 58.

[0091] (Step of arranging the first mask 110) First, as shown in FIGS. 5 and 6, a substrate 10 is prepared. Next, as shown in FIGS. 25 and 26, a first mask 110 is arranged on the upper surface 10a of the substrate 10.

[0092] (Step of forming the auxiliary body 30) Next, as shown in FIGS. 27 and 28, an auxiliary body 30 is formed using the first mask 110. For example, by performing gold plating starting from the terminal portion 50 or sputtering using gold as a target, a first auxiliary body 31, a second auxiliary body 32, a third auxiliary body 33, and a fourth auxiliary body 34 are formed.

[0093] (Step of removing the first mask 110) Next, as shown in FIGS. 29 and 30, the first mask 110 is removed.

[0094] (Step of arranging the conductive paste 150) Next, as shown in FIGS. 56 and 57, a fourth mask 140 is arranged on the auxiliary body 30. The fourth mask 140 is made of, for example, metal, and a seventh opening 141 and an eighth opening 142 are formed therein. The seventh opening 141 is located on the first portion 51a of the first terminal portion 51, and the eighth opening 142 is located on the third portion 52a of the second terminal portion 52.

[0095] Next, as shown in FIGS. 58 and 59, a conductive paste 150 is applied onto the fourth mask 140, for example, by a printing method. The conductive paste 150 contains a eutectic alloy, for example, a gold-tin alloy. Thereby, the conductive paste 150 is disposed on the first terminal portion 51 through the seventh opening 141 of the fourth mask 140, and the conductive paste 150 is disposed on the second terminal portion 52 through the eighth opening 142. Then, the fourth mask 140 is removed. At this time, even if the conductive paste 150 is disposed on the fourth mask 140, the conductive paste 150 disposed on the fourth mask 140 is removed together with the fourth mask 140.

[0096] (Step of disposing the light-emitting element 20) Next, as shown in FIGS. 54 and 55, the light-emitting element 20 is disposed on the substrate 10. At this time, the lower end of the first electrode 61 of the light-emitting element 20 passes through the conductive paste 150 and contacts the first terminal portion 51, and the lower end of the second electrode 62 passes through the conductive paste 150 and contacts the second terminal portion 52.

[0097] (Step of curing the conductive paste 150) Next, the conductive paste 150 is cured by performing a formic acid reflow process. Thereby, the conductive paste 150 disposed on the first terminal portion 51 becomes the first joint portion 41, and the conductive paste 150 disposed on the second terminal portion 52 becomes the second joint portion 42. As a result, the first terminal portion 51 is joined to the first electrode 61 by eutectic bonding, and the second terminal portion 52 is joined to the second electrode 62 by eutectic bonding. In this way, the light-emitting device 4 is manufactured.

[0098] [Effect] In the present embodiment, in the steps shown in FIGS. 58 and 59, the conductive paste 150 is applied onto the terminal portion 50 of the substrate 10, and in the steps shown in FIGS. 54 and 55, after the electrode 60 of the light-emitting element 20 enters the conductive paste 150 and contacts the terminal portion 50, the conductive paste 150 is cured to form the joint portion 40. Thereby, the light-emitting element 20 can be stably disposed on the substrate 10. The configurations, manufacturing methods, and effects other than the above in the present embodiment are the same as those in the second embodiment.

[0099] Instead of applying the conductive paste 150, the lower part of the electrode 60 of the light-emitting element 20 may be formed of a eutectic alloy, brought into contact with the terminal part 50, and then the eutectic alloy may be cured. Thereby, the formation of the fourth mask 140 and the application of the conductive paste 150 can be omitted.

[0100] Each of the above-described embodiments and modifications thereof is an example embodying the present invention, and the present invention is not limited to these embodiments and modifications. For example, in each of the above-described embodiments and modifications, those obtained by adding, deleting, or changing some components or steps are also included in the present invention. Further, each of the above-described embodiments and modifications can be implemented in combination with each other.

[0101] The present invention includes the following aspects.

[0102] (Appendix 1) A substrate having a plurality of terminal parts on the upper surface side, A light-emitting element disposed on the upper surface side of the substrate and having a plurality of electrodes on the side facing the upper surface of the substrate, An auxiliary body having a lower surface joined to the terminal part, an upper surface, and a side surface located on the side of the electrode and connecting the lower surface and the upper surface, wherein the side surface is inclined so as to be farther from the electrode as it approaches the lower surface, A bonding part made of a conductive material and in contact with the terminal part, the electrode, and the auxiliary body, A light-emitting device including

[0103] (Appendix 2) The light-emitting device according to Appendix 1, wherein the auxiliary body is made of a conductive material.

[0104] (Appendix 3) The terminal part has a first terminal part and a second terminal part, The light-emitting element has a first electrode joined to the first terminal part and a second electrode joined to the second terminal part, The auxiliary body has a first auxiliary body joined to the first electrode and a second auxiliary body joined to the second electrode, The light-emitting device according to appended claim 1 or 2, wherein the first electrode and the second electrode are disposed between the first auxiliary body and the second auxiliary body.

[0105] (Appended claim 4) The terminal portion has a first terminal portion and a second terminal portion, The light-emitting element has a first electrode joined to the first terminal portion and a second electrode joined to the second terminal portion, The auxiliary body has a first auxiliary body and a third auxiliary body joined to the first electrode, and a second auxiliary body and a fourth auxiliary body joined to the second electrode, The third auxiliary body and the fourth auxiliary body are disposed between the first auxiliary body and the second auxiliary body, The first electrode is disposed between the first auxiliary body and the third auxiliary body, The light-emitting device according to appended claim 1 or 2, wherein the second electrode is disposed between the second auxiliary body and the fourth auxiliary body.

[0106] (Appended claim 5) The light-emitting device according to any one of appended claims 1 to 4, further comprising a support portion disposed on the terminal portion, made of a conductive material, in contact with the terminal portion, the electrode, and the joint portion, and separated from the auxiliary body.

[0107] (Appended claim 6) A step of disposing a first mask on the upper surface of a substrate having a first terminal portion and a second terminal portion on the upper surface side, the first mask having a first mask portion located between the first terminal portion and the second terminal portion, a second mask portion covering a first portion of the first terminal portion and exposing a second portion of the first terminal portion, and a third mask portion covering a third portion of the second terminal portion and exposing a fourth portion of the second terminal portion, wherein a side surface of the second mask portion on a side far from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate, and a side surface of the third mask portion on a side far from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate; and a step of forming a first auxiliary body and a second auxiliary body using the first mask. A step of forming a first auxiliary body and a second auxiliary body using the first mask. The step of removing the first mask; The step of disposing a second mask on the upper surface of the substrate to cover between the first terminal portion and the second terminal portion and expose the first portion of the first terminal portion and the third portion of the second terminal portion; The step of disposing a light-emitting element having a first electrode and a second electrode on the side facing the upper surface on the second mask such that the first electrode is positioned on the first portion of the first terminal portion and the second electrode is positioned on the third portion of the second terminal portion; The step of forming a first bonding portion in contact with the first portion of the first terminal portion, the first auxiliary body, and the first electrode, and a second bonding portion in contact with the third portion of the second terminal portion, the second auxiliary body, and the second electrode; The step of removing the second mask; A method for manufacturing a light-emitting device including the above steps.

[0108] (Appendix 7) The method for manufacturing a light-emitting device according to Appendix 6, wherein in the step of forming the first bonding portion and the second bonding portion, plating is performed starting from the first portion of the first terminal portion and the third portion of the second terminal portion.

[0109] (Appendix 8) The first portion of the first terminal portion and the third portion of the second terminal portion are disposed between the second portion of the first terminal portion and the fourth portion of the second terminal portion, The method for manufacturing a light-emitting device according to Appendix 6 or 7, wherein in the step of forming the first bonding portion and the second bonding portion, the first electrode is bonded via the first terminal portion and the first bonding portion, and the second electrode is bonded via the second terminal portion and the second bonding portion.

[0110] (Appendix 9) The first terminal portion has two of the second portions, The second terminal portion has two of the fourth portions, The first portion of the first terminal portion is disposed between the two second portions of the first terminal portion, The third part of the second terminal portion is the manufacturing method of the light-emitting device according to any one of Appendices 6 to 8 disposed between the two fourth parts of the second terminal portion.

[0111] (Appendix 10) A step of disposing a third mask on the upper surface of a substrate having a first terminal portion and a second terminal portion on the upper surface side, exposing a part of the first part of the first terminal portion and covering the second part, and exposing a part of the third part of the second terminal portion and covering the fourth part; A step of disposing a conductive material on the substrate and on the third mask; A step of forming a first support portion made of the conductive material and in contact with the first part and a second support portion made of the conductive material and in contact with the third part by removing the third mask; A step of disposing a first mask having a first mask portion located between the first terminal portion and the second terminal portion, a second mask portion covering the first part and the first support portion of the first terminal portion and exposing the second part, and a third mask portion covering the third part and the second support portion of the second terminal portion and exposing the fourth part, wherein a side surface of the second mask portion far from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate, and a side surface of the third mask portion far from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate; A step of forming a first auxiliary body and a second auxiliary body using the first mask; A step of removing the first mask; A step of disposing a light-emitting element having a first electrode and a second electrode on a side facing the upper surface, such that the first electrode is in contact with the first support portion and the second electrode is in contact with the second support portion; A step of forming a first joint portion in contact with the first part of the first terminal portion, the first auxiliary body, and the first electrode, and a second joint portion in contact with the third part of the second terminal portion, the second auxiliary body, and the second electrode; A manufacturing method of a light-emitting device comprising the above.

[0112] (Appendix 11) In the step of forming the first auxiliary body and the second auxiliary body, the manufacturing method of the light-emitting device according to any one of Appendices 6 to 10, in which plating is performed starting from the second part of the first terminal part and the fourth part of the second terminal part.

Industrial Applicability

[0113] The present invention can be used, for example, as a light source for vehicle headlights and display devices.

Explanation of Signs

[0114] 1, 1a, 1b, 2, 3, 4 Light-emitting device 10 Substrate 10a Upper surface 20 Light-emitting element 20a Upper surface 20b Lower surface 20c Side surface 30 Auxiliary body 30a Lower surface 30b Upper surface 30c Side surface 30d Side surface 31 First auxiliary body 32 Second auxiliary body 33 Third auxiliary body 34 Fourth auxiliary body 40 Joint part 40a Lower surface 40b Upper surface 40c Side surface 41 First joint part 42 Second joint part 43 First joint part 44 Second joint part 50 Terminal part 51 First terminal part 51a First part 51b Second part 52 Second terminal part 52a Third part 52b Fourth part 60 Electrode 61 First electrode 62 Second electrode 70 Support part 71 First support part 72 Second support part 79 Conductive material 110 First mask 111 First mask part 112 Second mask part 113 Third mask part 114 Fourth mask part 112a Side surface 112b Side surface 113a Side surface 113b Side surface 115 First opening 116 Second opening 117 Third opening 118 Fourth opening 120 Second mask 121 Fifth mask part 122 Sixth mask part 130 Third mask 131 Fifth opening 132 Sixth opening 140 Fourth mask 141 Seventh opening 142 Eighth opening 150 Conductive paste

Claims

1. a substrate having a plurality of terminal portions on the upper surface side; a light-emitting element disposed on the upper surface side of the substrate and having a plurality of electrodes on the side facing the upper surface of the substrate; an auxiliary body having a lower surface joined to the terminal portion, an upper surface, and a side surface located on the side of the electrode and connecting the lower surface and the upper surface, wherein the side surface is inclined so as to be farther from the electrode as it approaches the lower surface; a bonding portion made of a conductive material and in contact with the terminal portion, the electrode, and the auxiliary body; a light-emitting device comprising the above.

2. The light-emitting device according to claim 1, wherein the auxiliary body is made of a conductive material.

3. The terminal portion has a first terminal portion and a second terminal portion; the light-emitting element has a first electrode joined to the first terminal portion and a second electrode joined to the second terminal portion; the auxiliary body has a first auxiliary body joined to the first electrode and a second auxiliary body joined to the second electrode; The light-emitting device according to claim 1, wherein the first electrode and the second electrode are disposed between the first auxiliary body and the second auxiliary body.

4. The terminal portion has a first terminal portion and a second terminal portion; the light-emitting element has a first electrode joined to the first terminal portion and a second electrode joined to the second terminal portion; the auxiliary body has a first auxiliary body and a third auxiliary body joined to the first electrode, and a second auxiliary body and a fourth auxiliary body joined to the second electrode; the third auxiliary body and the fourth auxiliary body are disposed between the first auxiliary body and the second auxiliary body; the first electrode is disposed between the first auxiliary body and the third auxiliary body; The light-emitting device according to claim 1, wherein the second electrode is disposed between the second auxiliary body and the fourth auxiliary body.

5. The light-emitting device according to claim 1, further comprising a support portion disposed on the terminal portion, made of a conductive material, in contact with the terminal portion, the electrode, and the bonding portion, and provided separately from the auxiliary body.

6. A step of disposing a first mask on the upper surface of a substrate having a first terminal portion and a second terminal portion on the upper side, the first mask having a first mask portion located between the first terminal portion and the second terminal portion, a second mask portion covering a first portion of the first terminal portion and exposing a second portion of the first terminal portion, and a third mask portion covering a third portion of the second terminal portion and exposing a fourth portion of the second terminal portion, wherein a side surface of the second mask portion far from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate, and a side surface of the third mask portion far from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate; A step of forming a first auxiliary body and a second auxiliary body using the first mask; A step of removing the first mask; A step of disposing a second mask on the upper surface of the substrate to cover the space between the first terminal portion and the second terminal portion and expose the first portion of the first terminal portion and the third portion of the second terminal portion; A step of disposing a light-emitting element having a first electrode and a second electrode on the side facing the upper surface on the second mask such that the first electrode is located on the first portion of the first terminal portion and the second electrode is located on the third portion of the second terminal portion; A step of forming a first bonding portion in contact with the first portion of the first terminal portion, the first auxiliary body, and the first electrode, and a second bonding portion in contact with the third portion of the second terminal portion, the second auxiliary body, and the second electrode; A step of removing the second mask; A method for manufacturing a light-emitting device comprising the above steps.

7. The method for manufacturing a light-emitting device according to claim 6, wherein in the step of forming the first bonding portion and the second bonding portion, plating is performed starting from the first portion of the first terminal portion and the third portion of the second terminal portion.

8. The first portion of the first terminal portion and the third portion of the second terminal portion are disposed between the second portion of the first terminal portion and the fourth portion of the second terminal portion. The method for manufacturing a light-emitting device according to claim 6, wherein in the step of forming the first bonding portion and the second bonding portion, the first electrode is bonded via the first terminal portion and the first bonding portion, and the second electrode is bonded via the second terminal portion and the second bonding portion.

9. The first terminal portion has two of the second portions. The second terminal portion has two of the fourth portions. The first portion of the first terminal portion is disposed between the two second portions of the first terminal portion. The method of manufacturing a light-emitting device according to claim 6, wherein the third portion of the second terminal portion is disposed between the two fourth portions of the second terminal portion.

10. A step of disposing a third mask on the upper surface of a substrate having a first terminal portion and a second terminal portion on the upper surface side, exposing a part of the first portion of the first terminal portion and covering the second portion, and exposing a part of the third portion of the second terminal portion and covering the fourth portion. A step of disposing a conductive material on the substrate and on the third mask. A step of removing the third mask to form a first support portion made of the conductive material and in contact with the first portion, and a second support portion made of the conductive material and in contact with the third portion. A first mask portion located between the first terminal portion and the second terminal portion, a second mask portion covering the first portion and the first support portion of the first terminal portion and exposing the second portion, and a third mask portion covering the third portion and the second support portion of the second terminal portion and exposing the fourth portion. The side surface of the second mask portion far from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate, and the side surface of the third mask portion far from the first mask portion is inclined toward the space between the first terminal portion and the second terminal portion as it moves away from the substrate. A step of disposing a first mask. A step of forming a first auxiliary body and a second auxiliary body using the first mask. A step of removing the first mask. A step of disposing a light-emitting element having a first electrode and a second electrode on the side facing the upper surface, such that the first electrode is in contact with the first support portion and the second electrode is in contact with the second support portion. A step of forming a first bonding portion in contact with the first portion of the first terminal portion, the first auxiliary body, and the first electrode, and a second bonding portion in contact with the third portion of the second terminal portion, the second auxiliary body, and the second electrode. A method of manufacturing a light-emitting device comprising the above steps.

11. The method of manufacturing a light-emitting device according to any one of claims 6 to 10, wherein in the step of forming the first auxiliary body and the second auxiliary body, plating is performed starting from the second portion of the first terminal portion and the fourth portion of the second terminal portion.

Images