Light-emitting device and method for manufacturing light-emitting device

Abstract

To provide a high performance light-emitting device.SOLUTION: A light-emitting device in one embodiment of the present invention comprises: a light-emitting element including an underside having an electrode, a top face located on the reverse side from the underside, and a side face connecting the underside and the top face together; a first coating member containing a first light reflection material and alkali earth metal silicate and covering at least a section of the underside and a side face of the electrode; and a second coating member containing a second light reflection material and alkali metal silicate and covering the side face of the light-emitting element.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a light-emitting device and a method for manufacturing the light-emitting device.

Background Art

[0002] A light-emitting device including a light-emitting element and a coating member made of an inorganic material that covers a part of the light-emitting element is known (Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Such a coating member made of an inorganic member still has room for improvement in order to improve the performance of the light-emitting device. The performance of the light-emitting device in this specification is, for example, insulation, strength, or heat resistance.

[0005] Therefore, an object of one embodiment of the present disclosure is to provide a high-performance light-emitting device.

Means for Solving the Problems

[0006] A light-emitting device according to an embodiment of the present disclosure includes a light-emitting element having a lower surface with an electrode, an upper surface located on the opposite side of the lower surface, and a side surface connecting the lower surface and the upper surface, a first coating member including a first light-reflecting material and an alkaline earth metal silicate that covers at least a part of the lower surface and a side surface of the electrode, and a second coating member including a second light-reflecting material and an alkali metal silicate that covers the side surface of the light-emitting element.

Effects of the Invention

[0007] According to an embodiment of the present disclosure, a high-performance light-emitting device can be provided.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2A

Figure 2B

Figure 2C

Figure 2D

Figure 2E

Figure 2F

Figure 2G

Figure 2H

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments for implementing the invention will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (for example, "up", "down", and other terms including these terms) are used as necessary. However, the use of these terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of these terms. Also, parts denoted by the same reference numerals in a plurality of drawings indicate the same or equivalent parts or members. In this specification, "coating" includes a state where members are in contact with each other and cover each other, and a state where members cover each other with another member or a gap therebetween.

[0010] Furthermore, the embodiments shown below exemplify a light-emitting device or the like for embodying the technical idea of the present invention, and do not limit the present invention to the following. Also, dimensions, materials, shapes, relative arrangements, etc. of the components described below are not intended to limit the scope of the present invention only thereto, but are intended to be illustrative unless otherwise specifically described. Also, the content described in one embodiment is applicable to other embodiments and modified examples. Also, the size and positional relationship of the members shown in the drawings may be exaggerated for clarity of explanation. Furthermore, in order to avoid excessive complexity of the drawings, schematic diagrams in which the illustration of some elements is omitted or end views showing only the cut surface as a cross-sectional view may be used.

[0011] <Light-emitting device> FIG. 1 is a schematic cross-sectional view of a light-emitting device according to an embodiment. As shown in FIG. 1, the light-emitting device 1 includes a light-emitting element 2 having a lower surface 24 with an electrode 22, an upper surface 23 located on the opposite side of the lower surface 24, and a side surface 25 connecting the lower surface 24 and the upper surface 23. The light-emitting device 1 also includes a first coating member 3A that includes a first light-reflecting material and an alkaline earth metal silicate and covers at least a part of the lower surface 24 and the side surface 26 of the electrode 22, and a second coating member 3B that includes a second light-reflecting material and an alkali metal silicate and covers the side surface 25 of the light-emitting element 2. Note that the shape of the light-emitting device 1 in plan view is, for example, rectangular.

[0012] The alkaline earth metal silicate contained in the first coating member 3A has a property of being less likely to react with moisture (for example, moisture present in the atmosphere) compared to the alkali metal silicate contained in the second coating member 3B. Therefore, the first coating member 3A can reduce the generation of metal ions due to reaction with moisture compared to the second coating member 3B. That is, the light-emitting device 1 can reduce the generation of leakage current caused by the contact of metal ions with the electrode 22 of the light-emitting element 2 by the first coating member 3A covering at least a part of the lower surface 24 of the light-emitting element 2 and the side surface 26 of the electrode 22. Since the light-emitting device 1 includes the first coating member 3A that covers at least a part of the lower surface 24 of the light-emitting element 2 and the side surface 26 of the electrode 22, it has high insulation properties.

[0013] The first coating member 3A is made of an inorganic material and contains an alkaline earth metal silicate as a binder for holding the light-reflecting material. The second coating member 3B is made of an inorganic material and contains an alkali metal silicate as a binder for holding the light-reflecting material. The first coating member 3A and the second coating member 3B each have a siloxane backbone structure with a network structure having siloxane bonds. The mechanical strength of the second coating member 3B is higher than that of the first coating member 3A. This is presumably because the alkali metal silicate contained in the second coating member 3B has a finer mesh structure than the alkaline earth metal silicate contained in the first coating member 3A. By including the second coating member 3B that covers the side surface 25 of the light-emitting element 2, the light-emitting device 1 can protect the light-emitting element 2 from external stress. Therefore, the light-emitting device 1 can be a high-performance light-emitting device 1 with excellent mechanical strength. As described above, by including the first coating member 3A and the second coating member 3B, the light-emitting device 1 can provide a high-performance light-emitting device 1.

[0014] As the light-emitting element 2, a semiconductor light-emitting element such as a light-emitting diode (LED) or a semiconductor laser (LD) can be preferably used. The light-emitting element 2 has an upper surface 23, a lower surface 24 having an electrode 22, and a side surface 25. The light-emitting element 2 has a semiconductor structure 21 and an electrode 22. The lower surface of the semiconductor structure 21 corresponds to the lower surface 24 of the light-emitting element 2 shown in FIG. 1. A pair of positive and negative electrodes 22 are arranged on the lower surface of the semiconductor structure 21. Further, the side surface of the semiconductor structure 21 corresponds to the side surface 25 of the light-emitting element 2 shown in FIG. 1.

[0015] The semiconductor structure 21 includes an n-side semiconductor layer, a p-side semiconductor layer, and a light-emitting layer sandwiched between the n-side semiconductor layer and the p-side semiconductor layer. The light-emitting layer may have a single quantum well (SQW) structure or a multiple quantum well (MQW) structure including a plurality of well layers. The semiconductor structure 21 includes a plurality of semiconductor layers made of a nitride semiconductor. The nitride semiconductor includes semiconductors of all compositions in which the composition ratios x and y are changed within their respective ranges in the chemical formula consisting of In x Al y Ga 1-x-y N (0≦x, 0≦y, x + y≦1). The emission peak wavelength of the light-emitting layer can be appropriately selected according to the purpose. The light-emitting layer is configured to emit, for example, visible light or ultraviolet light.

[0016] The light-emitting element 2 may or may not have a light-transmissive support substrate on the semiconductor structure 21. When the light-emitting element 2 has a support substrate, the upper surface of the support substrate becomes the upper surface 23 of the light-emitting element 2. When the light-emitting element 2 does not have a support substrate, the upper surface of the semiconductor structure 21 becomes the upper surface 23 of the light-emitting element 2.

[0017] The light-emitting element 2 may have one semiconductor structure 21 or may have a plurality of semiconductor structures 21. Further, one semiconductor structure 21 may have only one light-emitting layer or may have a plurality of light-emitting layers. The structure of the semiconductor structure 21 having a plurality of light-emitting layers may be a structure including a plurality of light-emitting layers between one n-side semiconductor layer and one p-side semiconductor layer, or may be a structure in which the structure including an n-side semiconductor layer, a light-emitting layer, and a p-side semiconductor layer in this order is repeated a plurality of times.

[0018] Examples of materials for the support substrate include nitride semiconductors such as sapphire, spinel (MgAl2O4), and gallium nitride.

[0019] The light-emitting element 2 can have an arbitrary shape in plan view. The shape of the light-emitting element 2 in plan view is, for example, rectangular (square, rectangle, etc.), triangular, or hexagonal. In plan view, when the shape of the light-emitting element 2 is rectangular, the size of the light-emitting element 2 can be, for example, 1 mm × 1 mm. The shape of the light-emitting element 2 in plan view may be the same as or different from the shape of the light-emitting device 1 in plan view. Note that the plan view in this specification means viewing from the upper surface 23 side of the light-emitting element 2.

[0020] As the material of the electrode 22, for example, Cu, Au, Ag, Pt, Ni, Pd, Sn, Ti, or an alloy of any combination of these metals can be used. The electrode 22 may be composed of a single layer or a plurality of layers.

[0021] The first covering member 3A covers at least a part of the lower surface 24 of the light-emitting element 2 and the side surface 26 of the electrode 22. In the example of FIG. 1, in the lower surface 24 of the light-emitting element 2, the region where the electrode 22 is not disposed is covered by the first covering member 3A. As another example, in the lower surface 24 of the light-emitting element 2, the periphery of the electrode 22 may be covered by the first covering member 3A, and the periphery of the first covering member 3A may be covered by the second covering member 3B.

[0022] In the example shown in FIG. 1, the first covering member 3A covers from the side surface 26 of the electrode 22 across a part of the lower surface 24 and the side surface 25 of the light-emitting element 2, and the second covering member 3B covers the region of the side surface 25 of the light-emitting element 2 that is not covered by the first covering member 3A. Note that in the example shown in FIG. 1, the side surface 25 of the light-emitting element is covered by the first covering member 3A and the second covering member 3B.

[0023] The side surface 25 of the light-emitting element is not limited to being covered by the first coating member 3A and the second coating member 3B, and may be covered only by the second coating member 3B. That is, the first coating member 3A may or may not cover the side surface 25 of the light-emitting element 2.

[0024] When the first coating member 3A covers the side surface 25 of the light-emitting element 2, the ratio of the first coating member 3A in the coating members (that is, the first coating member 3A and the second coating member 3B) in the light-emitting device 1 increases compared to the case where the first coating member 3A does not cover the side surface 25 of the light-emitting element 2. Thereby, generation of metal ions can be further reduced in the coating members in the light-emitting device 1.

[0025] By including the first light-reflecting material, the first coating member 3A can reflect the light emitted from the light-emitting element 2. The first light-reflecting material includes, for example, at least one selected from boron nitride, aluminum nitride, and aluminum oxide. Since boron nitride, aluminum nitride, or aluminum oxide is a material having excellent thermal conductivity, a first coating member 3A having excellent heat dissipation can be obtained. Further, the first light-reflecting material of the first coating member 3A is composed of a plurality of particles. And at least a part of the plurality of first light-reflecting materials are in contact with each other. Thereby, when the first coating member 3A includes a curing step in its formation, the shrinkage of the first coating member 3A can be reduced in the curing step. The first coating member 3A can further include a light diffusing material such as zirconium oxide and titanium oxide.

[0026] The first light-reflecting material is, for example, plate-shaped (including flaky) particles having two main surfaces. The first light-reflecting material may be primary particles, secondary particles in which two or more primary particles are aggregated, or a mixture of primary particles and secondary particles.

[0027] The average aspect ratio of the primary particles of the first light reflecting material is preferably 10 or more, more preferably 10 or more and 70 or less. When the first light reflecting material is boron nitride, the average aspect ratio of the first light reflecting material is, for example, 16.5 or more and 19.2 or less. When the first light reflecting material is aluminum oxide, the average aspect ratio of the first light reflecting material is, for example, 10 or more and 70 or less. The average aspect ratio of the first light reflecting material can be calculated, for example, by the following method.

[0028] (Method for calculating average aspect ratio) The average aspect ratio of the first light reflecting material is calculated by measuring the length of the major axis and the length of the minor axis of the first light reflecting material contained in the first coating member 3A in the cross section of the light emitting device 1. First, a cross section passing through the upper surface 23 of the light emitting element 2 of the light emitting device 1 and substantially orthogonal to the upper surface 23 of the light emitting element 2 is exposed. Next, the exposed cross section is mirror-polished. Then, the mirror-polished cross section is observed with a scanning electron microscope (SEM) at a magnification of 2000 to 3000 times, the cross section of the first light reflecting material is extracted from the obtained image, and a measurement region containing cross sections of about 1000 first light reflecting materials is selected.

[0029] Next, using image analysis software, the length of the major axis and the length of the minor axis of each cross section of the extracted first light reflecting material are measured one by one, and the ratio of the length of the major axis to the length of the minor axis (aspect ratio) is calculated. Then, the average value of the aspect ratios of 100 first light reflecting materials is taken as the average aspect ratio.

[0030] The average particle size of the first light reflecting material is preferably 0.6 μm or more and 43 μm or less. When the first light reflecting material is boron nitride, the average particle size of the first light reflecting material is, for example, 6 μm or more and 43 μm or less. When the first light reflecting material is aluminum oxide, the average particle size of the first light reflecting material is, for example, 0.6 μm or more and 10 μm or less.

[0031] Here, since the deformation and deterioration of the first light-reflecting material due to the manufacturing process are slight, the shape and dimensions of the powder of the first light-reflecting material are substantially the same as the shape and dimensions of the first light-reflecting material contained in the first coating member 3A. Therefore, the average particle size of the first light-reflecting material can be calculated, for example, by the following method.

[0032] (Method for calculating average particle size) The particle size of the powder of the first light-reflecting material is calculated, for example, using a scanning electron microscope "TM3030Plus" manufactured by Hitachi High-Technologies Corporation. First, one side of a carbon double-sided tape is attached to the sample stage of the microscope, and then the powder of the first light-reflecting material is placed on the other side of the double-sided tape. The magnification of the microscope is set to 1000 to 2000 times, and images of 100 powders (particles) of the first light-reflecting material are acquired. Then, the particle size of each particle is measured using image analysis software.

[0033] In this specification, the particle size of the powder of the first light-reflecting material means the maximum diameter among the diameters when viewed from one main surface of the first light-reflecting material. Next, the median diameter of the measured particles is calculated, and the calculated value is taken as the average particle size of the first light-reflecting material. Note that the particle size of the powder of the first light-reflecting material may also be measured and calculated by extracting the cross-section of the first coating member 3A by SEM and using image analysis software.

[0034] Examples of the alkaline earth metal silicate contained in the first coating member 3A include calcium silicate, magnesium silicate, beryllium silicate, strontium silicate, or barium silicate. Among these, it is preferable to use calcium silicate or magnesium silicate. Calcium silicate or magnesium silicate is less likely to react with moisture among alkaline earth metal silicates. When the alkaline earth metal silicate contained in the first coating member 3A is calcium silicate or magnesium silicate, the generation of metal ions due to the reaction between the alkaline earth metal silicate and moisture can be reduced. Thereby, the generation of leakage current caused by the contact of metal ions with the electrode 22 of the light-emitting element 2 can be reduced.

[0035] As described above, the first coating member 3A has higher insulation than the second coating member 3B. Therefore, the resistivity of the first coating member 3A is greater than the resistivity of the second coating member 3B. As a result, since the first coating member 3A with a high resistivity covers the electrode 22, the light-emitting device 1 has high insulation.

[0036] Since the second light-reflecting material contained in the second coating member 3B is the same as the first light-reflecting material contained in the first coating member 3A, the description thereof is omitted here. Note that the material, shape, aspect ratio, and particle size of the second light-reflecting material may be the same in all respects as those of the first light-reflecting material, or one or more of them may be different.

[0037] Examples of the alkali metal silicate contained in the second coating member 3B include potassium silicate, sodium silicate, and lithium metasilicate. Among these, the alkali metal silicate is preferably potassium silicate or sodium silicate. If it is potassium silicate or sodium silicate, in the network structure having a siloxane bond, since it has a finer network structure, the mechanical strength of the second coating member 3B containing the alkali metal silicate of potassium silicate or sodium silicate can be made higher.

[0038] The hardness of the second coating member 3B is preferably higher than the hardness of the first coating member 3A. As a result, since it has higher mechanical strength compared to a light-emitting device in which the light-emitting element is covered only with the first coating member 3A, a high-performance light-emitting device 1 can be provided.

[0039] Since the first coating member 3A contains an alkaline earth metal silicate and does not contain an organic group, the heat resistance can be enhanced as compared with the case where the coating member contains an organic group. Further, since the second coating member 3B contains an alkali metal silicate and does not contain an organic group, the heat resistance can be enhanced as compared with the case where the coating member contains an organic group. Therefore, since the first coating member 3A and the second coating member 3B have high heat resistance, a high-performance light-emitting device 1 can be provided.

[0040] The first covering member 3A preferably contacts the second covering member 3B. Thereby, in the manufacturing process described later, the mechanical strength of the first covering member 3A can be improved. The reason for the improvement in the mechanical strength of the first covering member 3A is that since the metal ions (i.e., alkali metal ions) derived from the alkali metal silicate contained in the second covering member 3B are water-soluble, when the first covering member 3A and the second covering member 3B come into contact before the first covering member 3A and the second covering member 3B are cured, the alkali metal ions can move into the first covering member 3A and form alkali metal silicate in the first covering member 3A after the first covering member 3A and the second covering member 3B are cured. Therefore, the first covering member 3A can improve the mechanical strength of the first covering member 3A by containing an alkali metal element derived from the alkali metal silicate contained in the second covering member 3B. The metal ions (i.e., alkaline earth metal ions) derived from the alkaline earth metal silicate contained in the first covering member 3A are hardly soluble in water and are considered to easily remain in the first covering member 3A without moving to the second covering member 3B.

[0041] The first covering member 3A does not necessarily have to contact the second covering member 3B. When the first covering member 3A does not contact the second covering member 3B, an intervening layer can be disposed between the first covering member 3A and the second covering member 3B. As the material of the intervening layer, for example, silicon oxide can be used.

[0042] In the example shown in FIG. 1, the light-emitting device 1 includes a translucent member 4 disposed on the upper surface 23 of the light-emitting element 2. Further, the second covering member 3B covers the entire side surface 41 of the translucent member 4. As a result, since the entire side surface 41 of the translucent member 4 is covered by the second covering member 3B, the mechanical strength of the light-emitting device 1 can be improved. The second covering member 3B can further cover the upper side of the side surface 25 of the light-emitting element 2. When the second covering member 3B covers the upper side of the side surface 25 of the light-emitting element 2, the first covering member 3A covers the lower side of the side surface 25 of the light-emitting element 2. Note that when the second covering member 3B covers the entire side surface 41 of the translucent member 4 and does not cover the entire side surface 25 of the light-emitting element 2, the entire side surface 25 of the light-emitting element 2 can be covered by the first covering member 3A.

[0043] The second covering member 3B is not limited to covering the entire side surface 41 of the translucent member 4, and the second covering member 3B may cover a part of the side surface 41 of the translucent member 4. As an example, the second covering member 3B may cover the upper side of the side surface 41 of the translucent member 4, and the first covering member 3A may cover the lower side of the side surface 41 of the translucent member 4. In this case, the first covering member 3A covers the entire side surface 25 of the light-emitting element 2. As another example, the upper end portion of the side surface 41 of the translucent member 4 may not be covered by the second covering member 3B and may be exposed to the outside.

[0044] In the example shown in FIG. 1, the boundary between the first covering member 3A and the second covering member 3B is a straight line parallel to the upper surface 23 of the light-emitting element 2. However, the boundary between the first covering member 3A and the second covering member 3B is not limited to this, and may be a straight line inclined with respect to the upper surface 23 of the light-emitting element 2 or a curve.

[0045] The upper surface 42 of the translucent member 4 exposed from the second covering member 3B is the light-emitting surface 11 of the light-emitting device 1. The first covering member 3A and the second covering member 3B constitute the outer surface of the light-emitting device 1.

[0046] The translucent member 4 may be disposed on the upper surface 23 of the light-emitting element 2 via an adhesive, or may be directly disposed without an adhesive.

[0047] The light-emitting device 1 does not necessarily include the translucent member 4 and may not include the translucent member 4. When the light-emitting device 1 does not include the translucent member 4, the upper surface 23 of the light-emitting element 2 serves as the light-emitting surface 11 of the light-emitting device 1.

[0048] The translucent member 4 can contain a wavelength-converting material capable of wavelength-converting at least part of the light from the light-emitting element 2. Thereby, a desired emission color can be obtained as the light-emitting device 1. The wavelength-converting material contained in the translucent member 4 may be of one type or a plurality of types.

[0049] The translucent member 4 may be composed of a wavelength-converting material and a base material, or may be composed of only the wavelength-converting material. Further, the translucent member 4 may have a configuration including an inorganic material and / or a light diffusing material described later with the wavelength-converting member as the base material.

[0050] When the translucent member 4 is composed of a wavelength-converting material and a base material, the wavelength-converting material may be contained in the base material or may be disposed on the surface of the base material. When the wavelength-converting material is disposed on the surface of the base material, the wavelength-converting material can be disposed on the surface of the base material facing the light-emitting element 2. Further, only the wavelength-converting material or a resin containing the wavelength-converting material may be disposed on the surface of the base material.

[0051] When the wavelength-converting material is contained in the base material, the wavelength-converting material may be dispersed or unevenly distributed in the base material.

[0052] Examples of the material of the base material include inorganic materials such as glass, ceramics, and sapphire, and organic materials such as resins or hybrid resins containing one or more of silicone resins, modified silicone resins, epoxy resins, modified epoxy resins, acrylic resins, phenolic resins, and fluorine resins.

[0053] As the wavelength-converting material, a known phosphor can be used. Examples of the phosphor include, for example, yttrium aluminum garnet-based phosphors (e.g., (Y,Gd)3(Al,Ga)5O 12:Ce), lutetium-aluminum-garnet-based phosphor (e.g., Lu3(Al,Ga)5O 12 :Ce), terbium-aluminum-garnet-based phosphor (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphor (e.g., Ca 10 (PO4)6Cl2:Eu), SAE-based phosphor (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphor (e.g., Ca8MgSi4O 16 Cl2:Eu), silicate-based phosphor (e.g., (Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon-based phosphor (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphor (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu), etc., oxynitride-based phosphors, LSN-based phosphors (e.g., (La,Y)3Si6N 11 :Ce), BSESN-based phosphors (e.g., (Ba,Sr)2Si5N8:Eu), SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc., nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2(Si 1-x Al x )F 6-x :Mn Here, x satisfies 0 < x < 1.) or MGF-based phosphors (e.g., 3.5MgO·0.5MgF2·GeO2:Mn), etc., fluoride-based phosphors, quantum dots having a perovskite structure (e.g., (Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 Here, FA and MA represent formamidinium and methylammonium, respectively.), II-VI group quantum dots (e.g., CdSe), III-V group quantum dots (e.g., InP), or quantum dots having a chalcopyrite structure (e.g., (Ag,Cu)(In,Ga)(S,Se)2), etc. can be used.

[0054] Note that the light-transmissive member 4 can contain a light diffusing material according to the purpose. As the light diffusing material, those known in the art can be used. As the light diffusing material, for example, titanium oxide, silicon oxide, aluminum oxide, barium titanate, yttrium aluminum perovskite (YAP) can be used.

[0055] In the example shown in FIG. 1, the light-emitting device 1 does not include a wiring substrate. However, the light-emitting device 1 is not limited thereto and may include a wiring substrate. When the light-emitting device 1 includes a wiring substrate, the electrode 22 of the light-emitting element 2 is electrically connected to the wiring of the wiring substrate. Further, on the surface of the wiring substrate facing the light-emitting element 2, a covering member similar to the first covering member 3A can be disposed in a region other than the region electrically connected to the electrode 22 of the light-emitting element 2. Further, one light-emitting element 2 may be electrically connected to one wiring substrate, or a plurality of light-emitting elements 2 may be electrically connected. As the base material of the wiring substrate, for example, aluminum nitride can be used.

[0056] <Method for manufacturing a light-emitting device> FIGS. 2A to 2H are schematic cross-sectional views for explaining a method for manufacturing a light-emitting device according to an embodiment. With reference to FIGS. 2A to 2H, an example of a method for manufacturing the light-emitting device 1 of the present embodiment will be described.

[0057] (Step of preparing the light-emitting element 2) As shown in FIG. 2A, the method for manufacturing the light-emitting device 1 of the present embodiment includes a step of preparing a light-emitting element 2 having a lower surface 24 having an electrode 22, an upper surface 23 located on the opposite side of the lower surface 24, and a side surface 25 connecting the lower surface 24 and the upper surface 23. The number of light-emitting elements 2 to be prepared may be plural or one. In the step of preparing the light-emitting element 2, only the light-emitting element 2 may be prepared, or as shown in FIG. 2A, the light-emitting element 2 on which the light-transmissive member 4 is disposed may be prepared. Since the light-emitting element 2 and the light-transmissive member 4 are the same as those of the light-emitting device 1 described above, the description thereof will be omitted here. Hereinafter, members common to the light-emitting device 1 may be omitted from the description because they are the same as those of the light-emitting device 1.

[0058] (Step of preparing the first coating member 3A) The manufacturing method of the light-emitting device 1 of the present embodiment includes a step of preparing a first coating member 3A containing a first light-reflecting material and an alkaline earth metal silicate, as shown in FIG. 2B.

[0059] The step of preparing the first coating member 3A may include a step of mixing a first light-reflecting material, silicon oxide, and an alkaline earth metal aqueous solution to prepare a mixture, and a step of forming the mixture into a sheet shape. The concentration of alkaline earth metal ions in the mixture is, for example, 0.5 mol / L or more and 2.5 mol / L or less. In the step of preparing the mixture, for example, after mixing the mixed powder, it can be defoamed and stirred by a stirring defoaming machine that can be depressurized and stirred. Note that the mixture formed into a sheet shape is in an uncured state in the present embodiment.

[0060] Details of the first light-reflecting material are as described above, so the description is omitted here.

[0061] The weight ratio of the silicon oxide powder to the first light-reflecting material powder is, for example, 1:4 or more and 1:1 or less. That is, the weight of the first light-reflecting material powder is 1 time or more and 4 times or less the weight of the silicon oxide powder, for example, with respect to the weight of the silicon oxide powder. The weight ratio of the alkaline earth metal aqueous solution to the mixed powder is, for example, 2:10 or more and 8:10 or less. That is, the weight of the mixed powder is 1.25 times or more and 5 times or less the weight of the alkaline earth metal aqueous solution, with respect to the weight of the alkaline earth metal aqueous solution. If the weight of the alkaline earth metal aqueous solution is too small with respect to the weight of the mixed powder, a plurality of fine lumps will be formed when the mixed powder and the alkaline earth metal aqueous solution are mixed, making molding difficult. On the other hand, if the weight of the alkaline earth metal aqueous solution is too large with respect to the weight of the mixed powder, cracks may occur when the mixture is heated and cured, and the strength of the first coating member 3A obtained by curing may decrease.

[0062] (Step of preparing the second coating member 3B) As shown in FIG. 2C, the manufacturing method of the light-emitting device 1 according to this embodiment includes a step of preparing a second coating member 3B containing a second light-reflecting material and an alkali metal silicate.

[0063] The step of preparing the second coating member 3B may include a step of mixing a second light-reflecting material, silicon oxide, and an alkali metal aqueous solution to prepare a mixture, and a step of forming the mixture into a sheet shape. The concentration of the alkali metal aqueous solution is preferably 1 mol / L or more, for example, from the viewpoint of ease of curing and strength after heat curing. On the other hand, from the viewpoint of reducing precipitation of excess alkali metal after mixing, it is preferably 5 mol / L or less. The alkali metal aqueous solution is, for example, a potassium hydroxide solution or a sodium hydroxide solution. In the step of preparing the mixture, for example, after mixing the mixed powder, it can be defoamed and stirred by a stirring defoaming machine that can be depressurized and stirred. Note that the mixture formed into a sheet shape is in an uncured state in this embodiment.

[0064] Details of the second light-reflecting material are as described above, and thus the description is omitted here.

[0065] The weight ratio of the silicon oxide powder to the second light-reflecting material powder is, for example, 1:4 or more and 1:1 or less. That is, the weight of the second light-reflecting material powder is 1 time or more and 4 times or less the weight of the silicon oxide powder, for example, with respect to the weight of the silicon oxide powder. The weight ratio of the alkali metal aqueous solution to the mixed powder is, for example, 2:10 or more and 8:10 or less. That is, the weight of the mixed powder is 1.25 times or more and 5 times or less the weight of the alkali metal aqueous solution, with respect to the weight of the alkali metal aqueous solution. If the weight of the alkali metal aqueous solution is too small with respect to the weight of the mixed powder, a plurality of fine lumps are formed when the mixed powder and the alkali metal aqueous solution are mixed, making molding difficult. On the other hand, if the weight of the alkali metal aqueous solution is too large with respect to the weight of the mixed powder, cracks may occur when the mixture is heated and cured, and the strength of the second coating member 3B obtained by curing may decrease.

[0066] (Step of placing the light-emitting element 2) As shown in FIG. 2E, the manufacturing method of the light-emitting device 1 according to this embodiment includes a step of placing the light-emitting element 2 on the support 5. As the support 5, an adhesive sheet such as polyimide can be used. In the step of placing the light-emitting element 2, the light-emitting element 2 is placed on the support 5 with the upper surface 23 facing the support 5 (that is, the light-emitting element 2 is placed on the support 5 with the upper surface 23 and the lower surface 24 of the light-emitting element 2 reversed). Thereby, when applying the first coating member 3A from above the light-emitting element 2 toward the light-emitting element 2 and the support 5, the lower surface 24 of the light-emitting element 2 is more likely to be coated with the first coating member 3A than when the lower surface 24 of the light-emitting element 2 faces the support 5. In the example shown in FIG. 2E, a light-transmitting member 4 is disposed between the support 5 and the upper surface 23 of the light-emitting element 2. In this case, after disposing the light-transmitting member 4 on the upper surface 23 of the light-emitting element 2, the light-emitting element 2 provided with the light-transmitting member 4 may be placed on the support 5. Also, the light-transmitting member 4 may be placed on the support 5 and the light-emitting element 2 may be placed on the light-transmitting member 4. In the example shown in FIG. 2E, a plurality of light-emitting elements 2 are placed on the support 5. However, it is not limited thereto, and one light-emitting element 2 may be placed on the support 5.

[0067] (Step of coating with the first coating member 3A and the second coating member 3B) As shown in FIG. 2F, the manufacturing method of the light-emitting device 1 according to this embodiment includes a step of coating the light-emitting element 2 with the first coating member 3A and the second coating member 3B. In the step of coating with the first coating member 3A and the second coating member 3B, at least a part of the lower surface 24 of the light-emitting element 2 and the side surface 26 of the electrode 22 are coated with the first coating member 3A, and the side surface 25 of the light-emitting element 2 is coated with the second coating member 3B. Specifically, as shown in FIG. 2D, the step of coating with the first coating member 3A and the second coating member 3B may include a step of preparing a coating member laminate 3 by laminating the first coating member 3A and the second coating member 3B, and a step of coating the light-emitting element 2 with the coating member laminate 3 as shown in FIG. 2F. Thereby, the light-emitting element 2 can be coated with the first coating member 3A and the second coating member 3B at once, and the light-emitting device 1 can be efficiently manufactured.

[0068] In the step of preparing the coated member laminate 3, the first coated member 3A and the second coated member 3B may be directly laminated, or may be laminated via an adhesive or the like. Here, the first coated member 3A and the second coated member 3B are in a sheet form. When they are in an uncured state, the coated member laminate 3 is in a sheet form and in an uncured state.

[0069] In the step of coating with the coated member laminate 3, as shown in FIG. 2E, the coated member laminate 3 can be pressed against the light-emitting element 2 using a mold 6 (that is, an upper mold 6A and a lower mold 6B). Thereby, at least a part of the lower surface 24 of the light-emitting element 2 and the side surface 26 of the electrode 22 can be easily coated with the first coated member 3A, and the side surface 25 of the light-emitting element 2 can be coated with the second coated member 3B. For example, using a vibrating device, the coated member laminate 3 disposed on the lower mold 6B can be pressed against the light-emitting element 2 in a state where the upper mold 6A and / or the lower mold 6B is vibrated. In the step of coating with the coated member laminate 3, the coated member laminate 3 is disposed on the upper mold 6A, the support 5 and the light-emitting element 2 are disposed on the lower mold 6B, and the coated member laminate 3 and the light-emitting element 2 are sandwiched between the upper mold 6A and the lower mold 6B, and the coated member laminate 3 can be pressed against the light-emitting element 2. In addition, in the step of coating with the coated member laminate 3, the coated member laminate 3 is pressed against the light-emitting element 2 such that the second coated member 3B side of the coated member laminate 3 faces the light-emitting element 2.

[0070] In the example of FIG. 2E, the thickness of the coated member laminate 3 (that is, the sum of the thickness (T1) of the first coated member 3A and the thickness (T2) of the second coated member 3B) is thicker than the sum of the thickness (T3) of the light-emitting element 2 and the thickness (T4) of the light-transmissive member 4, and the thickness (T2) of the second coated member 3B is thinner than the sum of the thickness (T4) of the light-transmissive member 4 and the thickness (T5) of the semiconductor structure 21. With such a thickness relationship, the light-emitting element 2 can be coated with the first coated member 3A.

[0071] When the light-emitting element 2 is disposed on the support 5 such that the upper surface 23 of the light-emitting element 2 faces the support 5, the step of covering with the first covering member 3A and the second covering member 3B may include a step of covering the side surface 25 of the light-emitting element 2 with the second covering member 3B, and after the step of covering the side surface 25 of the light-emitting element 2 with the second covering member 3B, a step of covering at least a part of the lower surface 24 of the light-emitting element 2 and the side surface 26 of the electrode 22 with the first covering member 3A. That is, in the step of covering with the first covering member 3A and the second covering member 3B, after covering the light-emitting element 2 with the second covering member 3B without preparing the covering member laminate 3, the light-emitting element 2 may be covered with the first covering member 3A. Thereby, by covering the first covering member 3A and the second covering member 3B independently, the respective thicknesses of the first covering member 3A and the second covering member 3B can be adjusted with high accuracy.

[0072] (Step of curing) In the manufacturing method of the light-emitting device 1 of the present embodiment, in the step of covering with the first covering member 3A and the second covering member 3B, the first covering member 3A and the second covering member 3B are in an uncured state. In this case, after the step of covering with the first covering member 3A and the second covering member 3B, a step of curing the first covering member 3A and the second covering member 3B is included.

[0073] The curing step includes, for example, a preliminary curing step of curing the mixture at a first temperature T1 and a main curing step of curing the mixture at a second temperature T2 higher than the first temperature T1. The preliminary curing step is, for example, heating at a first temperature T1 of 80°C or higher and 100°C or lower for 10 minutes or more and 2 hours or less. The main curing step is, for example, heating at a second temperature T2 of 150°C or higher and 250°C or lower for 10 minutes or more and 3 hours or less.

[0074] (Step of exposing the electrode 22) As shown in FIG. 2G, the manufacturing method of the light-emitting device 1 of the present embodiment may include a step of removing a part of the first covering member 3A and exposing the electrode 22 after the step of covering with the first covering member 3A and the second covering member 3B. The removal of the first covering member 3A can be performed, for example, by grinding.

[0075] (Step of individualizing) In the manufacturing method of the light-emitting device 1 of the present embodiment, in the step of mounting the light-emitting elements 2, a plurality of light-emitting elements 2 are mounted on the support 5. In this case, as shown in FIG. 2H, after the step of covering with the first covering member 3A and the second covering member 3B, in the first covering member 3A and the second covering member 3B between adjacent light-emitting elements 2, a step of cutting and individualizing at a cutting planned surface C orthogonal to the support 5 can be included. In the step of individualizing, for example, a cutting blade such as a blade can be used to cut so as to pass through the cutting planned surface C.

[0076] In the manufacturing method of the light-emitting device 1 of the present embodiment, in the step of preparing the second covering member 3B or the step of preparing the covering member laminate 3, a recess can be formed in a portion of the second covering member 3B facing the light-emitting element 2. Thereby, the thickness of the second covering member disposed on the lower surface 24 side of the light-emitting element 2 can be made thinner, and when the covering member laminate 3 is pressed against the light-emitting element 2, at least a part of the lower surface 24 of the light-emitting element 2 and the side surface 26 of the electrode 22 can be easily covered with the first covering member 3A. The cross-sectional shape of the recess is, for example, rectangular or trapezoidal. The depth of the recess may be smaller than the thickness of the second covering member 3B, may be larger, or may be the same as the thickness of the second covering member 3B. Also, the width of the recess can be, for example, the same as the width of the light-emitting element 2. Here, the width refers to a direction orthogonal to the direction from the lower surface 24 to the upper surface 23 of the light-emitting element 2.

[0077] In the manufacturing method of the light-emitting device 1 of the present embodiment, in the step of covering with the first covering member 3A and the second covering member 3B, at least a part of the lower surface 24 of the light-emitting element 2, the side surface 26 of the electrode 22, and the side surface 25 of the light-emitting element 2 are covered with the first covering member 3A, and the outer surface of the first covering member 3A can be covered with the second covering member 3B. Thereby, a light-emitting device 1 with improved mechanical strength can be manufactured.

[0078] In the manufacturing method of the light-emitting device 1 according to this embodiment, in the step of placing the light-emitting element 2, the light-emitting element 2 may be placed on the support 5 with the lower surface 24 facing the support 5. In this case, in the step of covering with the covering member laminate 3, the covering member laminate 3 is pressed against the light-emitting element 2 such that the first covering member 3A side of the covering member laminate 3 faces the light-emitting element 2. In the step of covering with the first covering member 3A and the second covering member 3B, when the covering member laminate 3 is not prepared, the step of covering with the first covering member 3A and the second covering member 3B may include a step of covering at least a part of the lower surface 24 of the light-emitting element 2 and the side surface 26 of the electrode 22 with the first covering member 3A, and after the step of covering with the first covering member 3A, a step of covering the side surface 25 of the light-emitting element 2 with the second covering member 3B.

Example

[0079] Hereinafter, the embodiment will be described in more detail with reference to examples.

[0080] First, a light-emitting element having a lower surface with an electrode, an upper surface located on the opposite side of the lower surface, and side surfaces was prepared.

[0081] A mixed powder obtained by mixing boron nitride powder with an average particle size of 10 μm and an average aspect ratio of 20 and silicon oxide powder with a median diameter of 0.4 μm as the average particle size was mixed with a potassium hydroxide solution having a concentration of 3 mol / L to prepare a mixture. The silicon oxide powder and the boron nitride powder were mixed at a weight ratio of 3:5. The calcium hydroxide solution and the mixed powder were mixed at a weight ratio of 3.8:9. The mixing of the mixed powder and the calcium hydroxide solution was performed until a uniform viscosity was obtained, and then degassed and stirred by a stirring degassing machine capable of stirring under reduced pressure. The obtained mixture was formed into a sheet shape to prepare a first covering member.

[0082] A mixed powder obtained by mixing boron nitride powder with an average particle size of 10 μm and an average aspect ratio of 20 and silicon oxide powder with a median diameter of 0.4 μm was mixed with a potassium hydroxide solution having a concentration of 3 mol / L to prepare a mixture. The silicon oxide powder and the boron nitride powder were mixed at a weight ratio of 3:5. The potassium hydroxide solution and the mixed powder were mixed at a weight ratio of 3.8:9. The mixing of the mixed powder and the potassium hydroxide solution was carried out until a uniform viscosity was obtained, and then degassed and stirred by a stirring degassing machine capable of stirring under reduced pressure. The obtained mixture was formed into a sheet shape to prepare a second coating member.

[0083] The prepared first coating member and the second coating member were laminated to form a coating member laminate. Then, a light-emitting element was placed on a support, and using a mold, the coating member laminate was pressed against the light-emitting element to coat the lower surface of the light-emitting element and the side surface of the electrode with the first coating member, and the side surface of the light-emitting element was coated with the second coating member.

[0084] Next, the first coating member and the second coating member were heated at 95 °C under a pressure of 1 MPa for 40 minutes for temporary curing. Further, it was heated at 200 °C under a pressure of 1 MPa for 40 minutes for full curing to produce the light-emitting device of Example 1.

[0085] As Comparative Example 1, a light-emitting device in which the lower surface of the light-emitting element, the side surface of the electrode, and the side surface of the light-emitting element were coated with the first coating member was produced. For each of the light-emitting devices of Example 1 and Comparative Example 1, the current value when a voltage of 1.5 V (i.e., a voltage lower than the voltage at which the light-emitting element 2 can emit light) was applied in the forward direction was measured. In Example 1, it was 0 μA, and in Comparative Example 1, it was 0.13 μA. From this result, it was confirmed that in the comparative example, a leakage current was generated via the first coating member 3A disposed between the electrodes 22. On the other hand, in Example 1, it was confirmed that no leakage current was generated.

[0086] (Aspects of the present invention) The present invention includes the following aspects. <Aspect 1> A light-emitting element having a lower surface with an electrode, an upper surface located on the opposite side of the lower surface, and a side surface connecting the lower surface and the upper surface. A first coating member including a first light-reflecting material and an alkaline earth metal silicate, and covering at least a part of the lower surface and a side surface of the electrode. A light-emitting device including a second coating member including a second light-reflecting material and an alkali metal silicate, and covering the side surface of the light-emitting element. <Aspect 2> The light-emitting device according to Aspect 1, wherein the resistivity of the first coating member is greater than the resistivity of the second coating member. <Aspect 3> The light-emitting device according to Aspect 1 or 2, wherein the hardness of the second coating member is higher than the hardness of the first coating member. <Aspect 4> The light-emitting device according to any one of Aspects 1 to 3, wherein the alkaline earth metal silicate is calcium silicate or magnesium silicate. <Aspect 5> The light-emitting device according to any one of Aspects 1 to 4, wherein the alkali metal silicate is potassium silicate or sodium silicate. <Aspect 6> The light-emitting device according to any one of Aspects 1 to 5, wherein the first coating member is in contact with the second coating member. <Aspect 7> The light-emitting device according to any one of Aspects 1 to 6, wherein the first coating member contains an alkali metal element derived from the alkali metal silicate contained in the second coating member. <Aspect 8> The first coating member covers from the side surface of the electrode across a part of the lower surface and the side surface of the light-emitting element. The light-emitting device according to any one of Aspects 1 to 7, wherein the second coating member covers a region on the side surface of the light-emitting element that is not covered by the first coating member. <Aspect 9> The light-emitting device includes a light-transmitting member disposed on the upper surface of the light-emitting element. The second covering member is the light-emitting device according to any one of Aspects 1 to 8 that covers a side surface of the light-transmissive member. <Aspect 10> A step of preparing a light-emitting element having a lower surface having an electrode, an upper surface located on the opposite side of the lower surface, and a side surface connecting the lower surface and the upper surface; A step of preparing a first covering member containing a first light-reflecting material and an alkaline earth metal silicate; A step of preparing a second covering member containing a second light-reflecting material and an alkali metal silicate; A step of placing the light-emitting element on a support; A step of covering the light-emitting element with the first covering member and the second covering member, including: In the step of covering with the first covering member and the second covering member, at least a part of the lower surface of the light-emitting element and a side surface of the electrode are covered with the first covering member, and a side surface of the light-emitting element is covered with the second covering member. A method for manufacturing a light-emitting device. <Aspect 11> In the step of placing the light-emitting element, the light-emitting element is placed on the support with the upper surface facing the support. A method for manufacturing a light-emitting device according to Aspect 10. <Aspect 12> In the step of preparing the first covering member and the second covering member, the first covering member and the second covering member are in an uncured state, The step of covering with the first covering member and the second covering member is A step of laminating the first covering member and the second covering member to form a covering member laminate; A step of covering the light-emitting element with the covering member laminate. A method for manufacturing a light-emitting device according to Aspect 10 or 11. <Aspect 13> In the step of covering with the covering member laminate, A method for manufacturing a light-emitting device according to Aspect 12, wherein the covering member laminate is pressed against the light-emitting element using a mold. <Aspect 14> The step of covering with the first covering member and the second covering member is A step of covering the side surface of the light-emitting element with the second covering member; A method for manufacturing a light-emitting device according to aspect 10, including: after the step of covering the side surface of the light-emitting element with the second covering member, a step of covering at least a part of the lower surface of the light-emitting element and the side surface of the electrode with the first covering member. <Aspect 15> The step of preparing the first covering member includes a step of mixing the first light-reflecting material, silicon oxide, and an alkaline earth metal aqueous solution to prepare a mixture. A method for manufacturing a light-emitting device according to any one of aspects 10 to 14, wherein the concentration of alkaline earth metal ions in the mixture is 0.5 mol / L or more and 2.5 mol / L or less. <Aspect 16> In the step of covering with the first covering member and the second covering member, the first covering member and the second covering member are in an uncured state. A method for manufacturing a light-emitting device according to any one of aspects 10 to 15, including a step of curing the first covering member and the second covering member after the step of covering with the first covering member and the second covering member.

Explanation of symbols

[0087] 1 Light-emitting device 11 Light-emitting surface 2 Light-emitting element 21 Semiconductor structure 22 Electrode 23 Upper surface 24 Lower surface 25 Side surface 3 Covering member laminate 3A First covering member 3B Second covering member 4 Translucent member 41 Side surface 42 Upper surface 5 Support 6 Mold 6A Upper mold 6B Lower mold

Claims

1. A light-emitting element having a lower surface with an electrode, an upper surface located on the opposite side of the lower surface, and a side surface connecting the lower surface and the upper surface, A first coating member containing a first light-reflecting material and an alkaline earth metal silicate, covering at least a part of the lower surface and the side surface of the electrode, A light-emitting device comprising a second coating member containing a second light-reflecting material and an alkali metal silicate, covering the side surface of the light-emitting element.

2. The light-emitting device according to claim 1, wherein the resistivity of the first coating member is greater than the resistivity of the second coating member.

3. The light-emitting device according to claim 2, wherein the hardness of the second coating member is higher than the hardness of the first coating member.

4. The light-emitting device according to claim 3, wherein the alkaline earth metal silicate is calcium silicate or magnesium silicate.

5. The light-emitting device according to claim 4, wherein the alkali metal silicate is potassium silicate or sodium silicate.

6. The light-emitting device according to claim 5, wherein the first coating member is in contact with the second coating member.

7. The light-emitting device according to claim 6, wherein the first coating member contains an alkali metal element derived from the alkali metal silicate contained in the second coating member.

8. The first coating member covers from the side surface of the electrode across at least a part of the lower surface and a part of the side surface of the light-emitting element, The light-emitting device according to claim 7, wherein the second coating member covers an area on the side surface of the light-emitting element that is not covered by the first coating member.

9. Comprising a light-transmitting member disposed on the upper surface of the light-emitting element, The light-emitting device according to any one of claims 1 to 8, wherein the second coating member covers the side surface of the light-transmitting member.

10. A step of preparing a light-emitting element having a lower surface with an electrode, an upper surface located on the opposite side of the lower surface, and a side surface connecting the lower surface and the upper surface, A step of preparing a first coating member containing a first light-reflecting material and an alkaline earth metal silicate, A step of preparing a second coating member containing a second light-reflecting material and an alkali metal silicate, A step of placing the light-emitting element on a support, A step of covering the light-emitting element with the first coating member and the second coating member, including A method for manufacturing a light-emitting device, in the step of covering with the first coating member and the second coating member, at least a part of the lower surface of the light-emitting element and the side surface of the electrode are covered with the first coating member, and the side surface of the light-emitting element is covered with the second coating member.

11. In the step of placing the light-emitting element, the light-emitting element is placed on the support with the upper surface facing the support. The method for manufacturing a light-emitting device according to claim 10.

12. In the step of preparing the first covering member and the second covering member, the first covering member and the second covering member are in an uncured state. The step of covering with the first covering member and the second covering member is a step of laminating the first covering member and the second covering member to form a covering member laminate, and a step of covering the light-emitting element with the covering member laminate. The method for manufacturing a light-emitting device according to claim 11.

13. In the step of covering with the covering member laminate, using a mold to press the covering member laminate against the light-emitting element. The method for manufacturing a light-emitting device according to claim 12.

14. The step of covering with the first covering member and the second covering member is a step of covering the side surface of the light-emitting element with the second covering member, and after the step of covering the side surface of the light-emitting element with the second covering member, a step of covering at least a part of the lower surface of the light-emitting element and the side surface of the electrode with the first covering member. The method for manufacturing a light-emitting device according to claim 10.

15. The step of preparing the first covering member includes a step of mixing the first light-reflecting material, silicon oxide, and an alkaline earth metal aqueous solution to prepare a mixture. The concentration of alkaline earth metal ions in the mixture is 0.5 mol / L or more and 2.5 mol / L or less. The method for manufacturing a light-emitting device according to claim 10.

16. In the step of covering with the first covering member and the second covering member, the first covering member and the second covering member are in an uncured state. After the step of covering with the first covering member and the second covering member, the step of curing the first covering member and the second covering member is included. The method for manufacturing a light-emitting device according to claim 10.

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