Light emitting device and method for manufacturing the same

Abstract

To provide a light emitting device that can restrain occurrence of warping and has excellent thermal conductivity.SOLUTION: A light emitting device includes a first metal member having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, a second metal member that is separated from the first metal member and has an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, a first insulating member that is arranged between the side surface of the first metal member and the side surface of the second metal member and has an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, a light emitting element that has a first surface serving as a light extraction surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, and is electrically connected to the first metal member and the second metal member, and a second insulating member bonded to the upper surface of the first metal member and the upper surface of the second metal member. The side surface of the first insulating member is in contact with the side surface of the first metal member and the side surface of the second metal member without being bonded or adhered to each of them.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a light-emitting device and a method for manufacturing the light-emitting device.

Background Art

[0002] In recent years, high-output light-emitting devices configured using light-emitting elements such as LEDs as light sources have been used, and light-emitting devices having various characteristics have been proposed. For example, a substrate structure including a plurality of substrates, an insulating portion made of ceramic formed so as to fill the gap between the plurality of substrates, and an upper surface covering portion is known. In this substrate structure, the insulating portion is formed by filling a ceramic sprayed film made of an inorganic adhesive as a raw material (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a light-emitting device capable of reducing the occurrence of warping and having excellent thermal conductivity, and a method for manufacturing the light-emitting device.

Means for Solving the Problems

[0005] A light-emitting device according to an embodiment of the present disclosure includes a first metal member having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, a second metal member spaced apart from the first metal member and having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, a first insulating member disposed between the side surface of the first metal member and the side surface of the second metal member and having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, a light-emitting element having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface, and being electrically connected to the first metal member and the second metal member, and a second insulating member joined to the upper surface of the first metal member and the upper surface of the second metal member, wherein side surfaces of the first insulating member are not adhered or joined to and are in contact with the side surfaces of the first metal member and the second metal member, respectively.

[0006] A method for manufacturing a light-emitting device according to an embodiment of the present disclosure includes preparing a metal body having a lower surface and an upper surface having a recess, and a first insulating member which is a sintered ceramic disposed in the recess and has an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, disposing, on the upper surface of the metal body, a light-emitting element having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface so as to be electrically connected to the metal body, disposing a second insulating member on the upper surface of the metal body to fix the metal body, polishing or grinding at least one of the lower surface of the metal body and the lower surface of the first insulating member until at least the first insulating member is exposed from the lower surface of the metal body, cutting the second insulating member, and cutting the metal body.

Advantages of the Invention

[0007] According to an embodiment of the present disclosure, it is possible to provide a light-emitting device and a method for manufacturing a light-emitting device that can reduce the occurrence of warping and have excellent thermal conductivity.

Brief Description of the Drawings

[0008]

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Embodiments for Carrying Out the Invention

[0009] Hereinafter, with reference to the drawings, a light-emitting device according to an embodiment of the present invention (hereinafter, may be referred to as a "light-emitting device according to an embodiment") and a method for manufacturing a light-emitting device according to an embodiment of the present invention (hereinafter, may be referred to as a "method for manufacturing a light-emitting device according to an embodiment") will be described. In the following description, terms indicating a specific direction or position (for example, "up", "down", and other terms including those terms) are used as necessary. However, the use of those terms is for facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meanings of those terms. Also, parts denoted by the same reference numerals appearing in a plurality of drawings indicate the same or equivalent parts or members.

[0010] In addition, the embodiments described below exemplify a light-emitting device, a method for manufacturing a light-emitting device, etc. for embodying the technical idea of the present invention, and do not limit the present invention as follows. Further, the dimensions, materials, shapes, relative arrangements, etc. of the constituent parts described below are not intended to limit the scope of the present invention only to those, but are intended to be exemplified unless otherwise specifically described. Further, the content described in one embodiment is also applicable to other embodiments and modifications. Further, the sizes and positional relationships of the members shown in the drawings may be exaggerated for clarity of explanation. Further, in order to avoid excessive complexity of the drawings, a schematic diagram in which illustration of some elements is omitted or an end view showing only the cut surface as a cross-sectional view may be used.

[0011] 〔Light-emitting device〕 The light-emitting device according to the embodiment includes a first metal member having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, a second metal member spaced apart from the first metal member and having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, and a first insulating member disposed between the side surface of the first metal member and the side surface of the second metal member and having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface. The light-emitting device has a light-emitting element having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface, and being electrically connected to the first metal member and the second metal member, and a second insulating member joined to the upper surfaces of the first metal member and the second metal member. The side surface of the first insulating member is not adhered or joined to each of the side surfaces of the first metal member and the second metal member but is in contact therewith. The light-emitting device according to the embodiment further includes a wavelength conversion member on the first surface of the light-emitting element or above the first surface of the light-emitting element. At least one surface of the surface of the first metal member and at least one surface of the surface of the second metal member preferably have a plating layer, and further, other members may be provided as necessary.

[0012] <Light-emitting device according to the first embodiment> FIG. 1A is a schematic top view showing an example of a light-emitting device according to the first embodiment. FIG. 1B is an example of a cross-sectional view taken along line IB-IB of FIG. 1A.

[0013] The light-emitting device 100 according to the first embodiment includes a first metal member 1, a second metal member 2, a first insulating member 3, a light-emitting element 20, and a second insulating member 4. The light-emitting device 100 according to the first embodiment may have a bonding member. Hereinafter, each component of the light-emitting device 100 will be described.

[0014] The light-emitting device 100 is a device in which a first insulating member 3 is disposed between a side surface 1c of the first metal member 1 and a side surface 2c of the second metal member 2, and the light-emitting element 20 is electrically connected to the first metal member 1 and the second metal member 2 to emit light.

[0015] There are no particular restrictions on the shape, structure, and dimensions of the light-emitting device 100, and examples include a cube, a rectangular parallelepiped, etc. Also, there are no particular restrictions on the shape of the light-emitting device 100 in plan view, and examples include polygons such as a rectangle, a hexagon, an octagon, etc.

[0016] (First Metal Member and Second Metal Member) The first metal member 1 has an upper surface 1a, a lower surface 1b, and a side surface 1c connecting the upper surface 1a and the lower surface 1b. The second metal member 2 has a side surface 2c connecting the upper surface 2a and the lower surface 2b, and is disposed separated from the first metal member 1. In the light-emitting device 100 according to the first embodiment, the first metal member 1 and the second metal member 2 are shown as different members, but this is only for convenience of description to explain that the first insulating member 3 is disposed between the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2, and the first metal member 1 and the second metal member 2 have the same configuration. Therefore, in FIG. 1B, the arrangement of the first metal member 1 and the second metal member 2 may be reversed. Hereinafter, the second metal member 2 will be described together with the description of the first metal member 1.

[0017] When the second metal member 2 "separates" from the first metal member 1, it means that the first metal member 1 and the second metal member 2 are electrically insulated from each other.

[0018] The first metal member 1 and the second metal member 2 are members made of metal. There are no particular restrictions on the types of metals for the first metal member 1 and the second metal member 2, and examples include silver, copper, iron, silver - copper alloys, copper - zinc alloys, copper - tin alloys, etc. These may be used alone or in combination of two or more. Among these, in terms of thermal conductivity, it is preferable that the types of metals for the first metal member 1 and the second metal member 2 are copper.

[0019] In the light - emitting device 100 according to the first embodiment, the surfaces of the side surface 1c of the first metal member 1 that face the side surface 2c of the second metal member 2, and the surfaces of the side surface 2c of the second metal member 2 that face the side surface 1c of the first metal member 1 are parallel to each other.

[0020] The surfaces of the side surface 1c of the first metal member 1 that face the side surface 2c of the second metal member 2, and the surfaces of the side surface 2c of the second metal member 2 that face the side surface 1c of the first metal member 1 may be smooth, but preferably have irregularities. When the surfaces of the side surface 1c of the first metal member 1 that face the side surface 2c of the second metal member 2, and the surfaces of the side surface 2c of the second metal member 2 that face the side surface 1c of the first metal member 1 have irregularities, displacement in the thickness direction of the first metal member 1, the second metal member 2, and the first insulating member 3 in the light - emitting device 100 is less likely to occur, and the first insulating member 3 can be prevented from coming out of the lower surface 100b of the light - emitting device 100.

[0021] When the surfaces of the side surface 1c of the first metal member 1 that face the side surface 2c of the second metal member 2, and the surfaces of the side surface 2c of the second metal member 2 that face the side surface 1c of the first metal member 1 have irregularities, there are no particular restrictions on the shape, roughness, and dimensions of the irregularities as long as the thermal conductivity is not impaired, and they can be appropriately selected according to the purpose.

[0022] The shape of the unevenness on the surface of the side surface 1c of the first metal member 1 facing the side surface 2c of the second metal member 2, and the surface of the side surface 2c of the second metal member 2 facing the side surface 1c of the first metal member 1, for example, includes a satin finish. The shape of the unevenness can be confirmed by a microscope, a metallurgical microscope, a scanning electron microscope (SEM), etc.

[0023] Regarding the roughness of the unevenness on the surface of the side surface 1c of the first metal member 1 facing the side surface 2c of the second metal member 2, and the surface of the side surface 2c of the second metal member 2 facing the side surface 1c of the first metal member 1, for example, the surface roughness Ra is preferably 25 μm or less, more preferably 0.05 μm or more and 5 μm or less, and still more preferably 0.05 μm or more and 1 μm or less. When the surface roughness Ra of the unevenness is 25 μm or less, gaps are less likely to occur between the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3, and between the side surface 2c of the second metal member 2 and the side surface 3c of the first insulating member 3, and the thermal conductivity is improved. The surface roughness Ra of the unevenness can be measured by a microscope (for example, VHX manufactured by Keyence Corporation) or a laser microscope (for example, manufactured by Olympus Corporation).

[0024] In the light-emitting device 100 according to the first embodiment, the second insulating member 4 is disposed only on the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2.

[0025] (The first insulating member) The first insulating member 3 is disposed between the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2, and has an upper surface 3a, a lower surface 3b, and a side surface 3c connecting the upper surface 3a and the lower surface 3b.

[0026] The side surface 3c of the first insulating member 3 is not adhered or joined to, but in contact with, the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2 respectively. In other words, the first insulating member 3 is not adhered with an adhesive or the like between the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2, and also, the side surface 3c of the first insulating member 3, the side surface 1c of the first metal member 1, and the side surface 2c of the second metal member 2 are not joined by performing operations such as heating and voltage application alone or in combination. For example, if the first insulating member 3, the first metal member 1, and the second metal member 2 are adhered or joined respectively, when heat is repeatedly applied during driving of the light-emitting device or during mounting of the light-emitting device, since the linear expansion coefficients of the first insulating member 3 and the first metal member 1 etc. are greatly different, peeling and cracking are likely to occur between the first insulating member 3 and the first metal member 1 etc. On the contrary, in the light-emitting device 100 according to the first embodiment, since the first insulating member 3 and the first metal member 1 etc. are not adhered etc., it is hardly affected by the thermal expansion of the first metal member 1 and the second metal member 2, and warping is unlikely to occur. Also, generally, since the adhesive has a low thermal conductivity, the adhesive between the first metal member 1 and the second metal member 2 has difficulty in transmitting heat. On the contrary, in the light-emitting device 100 according to the first embodiment, since it is in direct contact without using an adhesive, the heat from the first metal member 1 and the second metal member 2 is efficiently transmitted to the first insulating member 3, and heat dissipation to the mounting substrate is improved.

[0027] There is no particular limitation on the material of the first insulating member 3, and examples thereof include ceramics, glass, resin, etc. These may be used alone or in combination of two or more. Among these, as the material of the first insulating member 3, ceramics are preferable, and white ceramics are more preferable. When the material of the first insulating member 3 is ceramics, the heat resistance is higher than when the material of the first insulating member 3 is resin. Also, when the material of the first insulating member 3 is white ceramics, the reflectance of light from the light-emitting element 20 can be increased.

[0028] There are no particular restrictions on the ceramics. For example, nitride-based ceramics such as silicon nitride, aluminum nitride, and boron nitride; oxide-based ceramics such as aluminum oxide, silicon oxide, calcium oxide, and magnesium oxide; silicon carbide; mullite; borosilicate glass, etc. may be mentioned. These may be used alone or in combination of two or more. Among these, nitride-based ceramics are preferred as the ceramics.

[0029] In addition, regarding the shape, structure, and dimensions of the first insulating member 3, there are no particular restrictions as long as it can be arranged in contact with the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2, but it is preferably a hexahedron.

[0030] The distance between the side surface 1c of the first metal member 1 or the side surface 2c of the second metal member 2 and the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 or the side surface 2c of the second metal member 2 has no particular restrictions, but is preferably 30 μm or less, more preferably 10 μm or less, still more preferably 3 μm or less, and particularly preferably 0 μm. When the distance between the side surface 1c of the first metal member 1 or the side surface 2c of the second metal member 2 and the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 or the side surface 2c of the second metal member 2 is 0 μm, the heat dissipation is particularly improved. Also, when the distance between the side surface 1c of the first metal member 1 or the side surface 2c of the second metal member 2 and the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 or the side surface 2c of the second metal member 2 is more than 0 μm and 30 μm or less, the stress between the first metal member 1 or the second metal member 2 and the first insulating member 3 can be relaxed. The distance between the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1, and the distance between the side surface 2c of the second metal member 2 and the side surface 3c of the first insulating member 3 in contact with the side surface 2c of the second metal member 2 may be the same as or different from each other.

[0031] In the cross-sectional view, the length of the upper surface 3a of the first insulating member 3 and the length of the lower surface 3b of the first insulating member 3 are not particularly limited as long as they can be disposed between the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2, and the side surface 3c of the first insulating member 3 can contact each of the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2, and can be appropriately selected according to the purpose.

[0032] The side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3 in contact with the side surface 2c of the second metal member 2 may be smooth, but preferably have irregularities. When the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3 in contact with the side surface 2c of the second metal member 2 have irregularities, displacement of the first metal member 1, the second metal member 2, and the first insulating member 3 in the thickness direction of the light-emitting device 100 is less likely to occur, and the first insulating member 3 can be prevented from coming out of the lower surface of the light-emitting device 100.

[0033] When the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3 in contact with the side surface 2c of the second metal member 2 have irregularities, the shape, roughness, and dimensions of the irregularities are not particularly limited as long as the thermal conductivity is not impaired, and can be appropriately selected according to the purpose.

[0034] Examples of the shape of the irregularities on the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3 in contact with the side surface 2c of the second metal member 2 include a satin finish. The shape of the irregularities can be confirmed by a microscope, a metalloscope, a scanning electron microscope (SEM), etc.

[0035] As the roughness of the unevenness on the side surface 3c of the first insulating member 3 that contacts the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3 that contacts the side surface 2c of the second metal member 2, for example, the surface roughness Ra is preferably 25 μm or less, more preferably 0.05 μm or more and 5 μm or less, and still more preferably 0.05 μm or more and 1 μm or less. When the surface roughness Ra of the unevenness is 25 μm or less, gaps are less likely to occur between the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3, and between the side surface 2c of the second metal member 2 and the side surface 3c of the first insulating member 3, and the thermal conductivity is improved. Note that the surface roughness Ra of the unevenness can be measured by a microscope (for example, VHX manufactured by Keyence Corporation) or a laser microscope (for example, manufactured by Olympus Corporation).

[0036] In the light-emitting device 100 according to the first embodiment, the upper surface 3a of the first insulating member 3 is flush with the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2. In other words, there is no step between the upper surface 1a of the first metal member 1, the upper surface 3a of the first insulating member 3, and the upper surface 2a of the second metal member 2. Thereby, the light-emitting element 20 can be suitably arranged on the upper surface 1a of the first metal member 1, the upper surface 3a of the first insulating member 3, and the upper surface 2a of the second metal member 2.

[0037] In the light-emitting device 100 according to the first embodiment, the lower surface 3b of the first insulating member 3 is flush with the lower surface 1b of the first metal member 1 and the lower surface 2b of the second metal member 2. In other words, there is no step between the lower surface 1b of the first metal member 1, the lower surface 3b of the first insulating member 3, and the lower surface 2b of the second metal member 2. Thereby, when mounting on the mounting substrate, the mounting stability between the lower surface 1b of the first metal member 1, the lower surface 3b of the first insulating member 3, the lower surface 2b of the second metal member 2, and the mounting substrate can be suitably ensured.

[0038] (Light-emitting element) The light-emitting element 20 has a first surface 20a that serves as a light extraction surface, a second surface 20b on the opposite side of the first surface 20a, and a side surface 20c that connects the first surface 20a and the second surface 20b, and is electrically connected to the first metal member 1 and the second metal member 2.

[0039] The light-emitting element 20 preferably has a pair of element electrodes 21, an element substrate, and a semiconductor laminate.

[0040] As an example, the light-emitting element 20 has a pair of element electrodes 21, a semiconductor laminate, and an element substrate laminated in this order from the upper surface 1a of the first metal member 1, the upper surface 2a of the second metal member 2, and the upper surface 3a side of the first insulating member 3, and is face-down mounted.

[0041] Note that in the light-emitting device 100 according to the embodiment, the pair of element electrodes 21 of the light-emitting element 20 may be mounted on the side opposite to the upper surface 1a of the first metal member 1, the upper surface 2a of the second metal member 2, and the upper surface 3a side of the first insulating member 3, and connected to the first metal member 1 and the second metal member 2 by wires, or may be flip-chip mounted.

[0042] As the semiconductor laminate, an arbitrary composition can be used according to the desired emission wavelength. For example, a nitride semiconductor (In x Al y Ga 1-x-y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, or GaAlAs, AlInGaP, etc. that can emit red light can be used. Further, the size and shape of the light-emitting element 20 can be appropriately selected according to the purpose of use.

[0043] As an example, a sapphire substrate or a silicon substrate is used as the element substrate.

[0044] The element electrode 21 may be electrically connected to the first metal member 1 and the second metal member 2 using a bonding member such as solder or an eutectic material, or may be electrically connected via a bonding member by a metal bump.

[0045] The metal bump is a member that electrically connects the element electrode 21, the first metal member 1, and the second metal member 2. The metal bump may be disposed either on the element electrode 21 side or on the first metal member 1 and second metal member 2 sides. Also, the shape, structure, dimensions, and number of the metal bumps can all be appropriately set as long as they can be disposed within the range of the element electrode 21. Further, the size of the metal bump can be appropriately adjusted according to the size of the semiconductor laminate, the required light emission output of the light emitting element, etc., and for example, a size with a diameter of about several tens of μm to several hundreds of μm can be mentioned.

[0046] The metal bump can be formed of, for example, Au, Ag, Cu, Al, Sn, Pt, Zn, Ni, or an alloy thereof, and can be formed of, for example, a stud bump known in the art. The stud bump can be formed by a stud bump bonder, a wire bonding device, or the like. Also, the metal bump may be formed by a method known in the art such as electroplating, electroless plating, vapor deposition, sputtering, etc.

[0047] As an example, the metal bump is joined via a joining member. Examples of the joining member used here include solders such as tin-bismuth-based, tin-copper-based, tin-silver-based, gold-tin-based, etc., eutectic alloys such as an alloy mainly composed of Au and Sn, an alloy mainly composed of Au and Si, an alloy mainly composed of Au and Ge, etc., or paste materials such as silver, gold, palladium, etc., anisotropic conductive materials such as ACP, ACF, etc., brazing materials of low melting point metals, conductive adhesives combining these, conductive composite adhesives, etc.

[0048] The pair of element electrodes 21 in the light emitting element 20 have electrodes of different polarities. One is a p electrode, and the other is disposed at a distance that does not electrically short-circuit with the n electrode. As an example, the element electrode 21 has a configuration in which the p electrode and the n electrode are each disposed at one location, but a configuration in which either one is at two locations and the other is at one location may also be acceptable.

[0049] The number of the light-emitting elements 20 may be one or plural. Also, the arrangement of the plural light-emitting elements 20 is not particularly limited, and examples thereof include a row shape and a lattice shape.

[0050] (Second insulating member) The second insulating member 4 is joined to the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2.

[0051] The second insulating member 4 preferably directly or indirectly covers the side surface 20c of the light-emitting element 20. Thereby, the second insulating member 4 can fix the light-emitting element 20 and improve the reliability of the light-emitting device 100.

[0052] Note that "directly covering" the side surface 20c of the light-emitting element 20 by the second insulating member 4 indicates that the side surface 20c of the light-emitting element 20 and the second insulating member 4 are directly joined. Also, "indirectly covering" the side surface 20c of the light-emitting element 20 by the second insulating member 4 indicates that the second insulating member 4 is disposed on the side surface 20c of the light-emitting element 20 via an adhesive. That is, it indicates that the side surface 20c of the light-emitting element 20 is covered with an adhesive, and the adhesive and the second insulating member 4 are adhered.

[0053] In the light-emitting device 100 according to the first embodiment, the upper surface 1a of the first metal member 1, the upper surface 2a of the second metal member 2, and the upper surface 3a of the first insulating member 3 are flush.

[0054] Also, in the light-emitting device 100 according to the first embodiment, the side surface 1c on the exposed surface side of the first metal member 1, the side surface 2c on the exposed surface side of the second metal member 2, and the side surface 4c on the exposed surface side of the second insulating member 4 are flush with each other.

[0055] Examples of the material of the second insulating member 4 include resin, glass, and ceramics. These may be used alone or in combination of two or more. Among these, as the material of the second insulating member 4, a translucent resin is preferable.

[0056] Examples of the light-transmissive resin include, for example, epoxy resin, silicone resin, etc. These may be used alone or in combination of two or more kinds.

[0057] Further, the second insulating member 4 may further contain a light reflecting member, a light shielding member, etc. in these materials.

[0058] There is no particular limitation on the light reflecting member, and a thermoplastic resin such as acrylic resin, polycarbonate resin, cyclic polyolefin resin, polyethylene terephthalate resin, polyethylene naphthalate resin or polyester resin, or a thermosetting resin such as epoxy resin or silicone resin can be used.

[0059] Examples of the light shielding member include white pigments such as titanium oxide, zinc oxide, tantalum oxide, niobium oxide, zirconia, aluminum oxide, etc. These may be used alone or in combination of two or more kinds.

[0060] The light emitting device 100 according to the above first embodiment can be preferably manufactured by the manufacturing method of the light emitting device according to the first embodiment described later.

[0061] <Light Emitting Device According to the Second Embodiment> The light emitting device 100 according to the second embodiment is the same as the light emitting device 100 according to the first embodiment except that the shapes of the first metal member 1, the second metal member 2, and the first insulating member 3 are different. FIG. 2 is a schematic cross-sectional view showing an example of the light emitting device 100 according to the second embodiment.

[0062] (First Metal Member and Second Metal Member) In the light-emitting device 100 according to the second embodiment, the surface of the side surface 1c of the first metal member 1 that faces the side surface 2c of the second metal member 2, and the surface of the side surface 2c of the second metal member 2 that faces the side surface 1c of the first metal member 1 have an inclination in the direction from the upper surface 100a of the light-emitting device 100 toward the lower surface 100b of the light-emitting device 100 in a cross-sectional view. At least one of the internal angles R1 between the upper surface 1a of the first metal member 1 and the surface of the side surface 1c of the first metal member 1 that faces the side surface 2c of the second metal member 2, and the internal angle R2 between the upper surface 2a of the second metal member 2 and the surface of the side surface 2c of the second metal member 2 that faces the side surface 1c of the first metal member 1 is preferably an obtuse angle, more preferably 93° or more and 130° or less, still more preferably 95° or more and 120° or less, and particularly preferably 97° or more and 110° or less. Further, it is preferable that both of the internal angles R1 and R2 are obtuse angles. When at least one of the internal angles R1 and R2 is an obtuse angle, the upper surface 3a of the first insulating member 3 becomes wider than the lower surface 3b of the first insulating member 3, so that it is possible to prevent the first insulating member 3 from coming out of the lower surface 100b of the light-emitting device 100. Note that the internal angles R1 and R2 may be the same as each other or different from each other.

[0063] When the surface of the side surface 1c of the first metal member 1 that faces the side surface 2c of the second metal member 2 has irregularities described later, the internal angle R1 is defined as the angle formed by the upper surface 1a of the first metal member 1 and an approximate line of the vertices of a plurality of convex portions on the side surface 1c of the first metal member 1. Similarly, when the surface of the side surface 2c of the second metal member 2 that faces the side surface 1c of the first metal member 1 has irregularities, the internal angle R2 is defined as the angle formed by the upper surface 2a of the second metal member 2 and an approximate line of the vertices of a plurality of convex portions on the side surface 2c of the second metal member 2.

[0064] In a plan view, the distance between the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2 is not particularly limited, but is preferably 30 μm or more and 1,000 μm or less, more preferably 50 μm or more and 500 μm or less, and still more preferably 50 μm or more and 200 μm or less. When the distance between the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2 is 30 μm or more and 1,000 μm or less, the heat dissipation performance is improved. In addition, it is possible to less likely cause a short circuit between the first metal member 1 and the second metal member 2.

[0065] In a bottom view, the distance between the lower surface 1b of the first metal member 1 and the lower surface 2b of the second metal member 2 is not particularly limited, but is preferably 30 μm or more and 1,000 μm or less, more preferably 50 μm or more and 500 μm or less, and still more preferably 50 μm or more and 200 μm or less. When the distance between the lower surface 1b of the first metal member 1 and the lower surface 2b of the second metal member 2 is 30 μm or more and 1,000 μm or less, the heat dissipation performance is improved.

[0066] The ratio (d2 / d1) of the distance d2 between the lower surface 1b of the first metal member 1 and the lower surface 2b of the second metal member 2 to the distance d1 between the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2 is not particularly limited, but is preferably 0.5 or more and 0.98 or less, more preferably 0.6 or more and 0.95 or less, and still more preferably 0.7 or more and 0.93 or less.

[0067] (First insulating member) In the light-emitting device 100 according to the second embodiment, the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 and the side surface 3c of the first insulating member 3 in contact with the side surface 2c of the second metal member 2 have an inclination in a direction from the upper surface 100a of the light-emitting device 100 toward the lower surface 100b of the light-emitting device 100 in a cross-sectional view, and the other side surfaces of the first insulating member 3 are substantially parallel to each other.

[0068] In the direction from the upper surface 100a of the light-emitting device 100 toward the lower surface 100b of the light-emitting device 100, at least one of the internal angles R3a between the surface having an inclination of the side surface 3c of the first insulating member 3 in contact with the side surface 1c of the first metal member 1 and the upper surface 3a of the first insulating member 3, and the internal angle R3b between the surface having an inclination of the side surface 3c of the first insulating member 3 in contact with the side surface 2c of the second metal member 2 and the upper surface 3a of the first insulating member 3 is preferably an acute angle, more preferably 50° or more and 87° or less, still more preferably 60° or more and 85° or less, and even more preferably 70° or more and 83° or less. Moreover, it is particularly preferable that both the internal angle R3a and the internal angle R3b are acute angles. Thereby, since the upper surface 3a of the first insulating member 3 becomes wider than the lower surface 3b of the first insulating member 3, it is possible to prevent the first insulating member 3 from coming out of the lower surface 100b of the light-emitting device 100. Note that the internal angles R3a and R3b may be the same as each other or different from each other.

[0069] The side surface 1c of the first metal member 1, the side surface 3c of the first insulating member 3 in contact therewith, the side surface 2c of the second metal member 2, and the side surface 3c of the first insulating member 3 in contact therewith may have the same inclination or different inclinations, but in order for the side surface 3c of the first insulating member 3 to be in contact with each of the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2 with high adhesion, it is preferable to have the same inclination. Therefore, it is preferable to satisfy [internal angle R3a ≤ 180° - (internal angle R1 ± 5°)], more preferably to satisfy [internal angle R3a = 180° ≤ (internal angle R1 ± 3°)], and even more preferably to satisfy [internal angle R3a = 180° ≤ (internal angle R1 ± 1°)].

[0070] When the side surface 3c of the first insulating member 3 that contacts the side surface 1c of the first metal member 1 has irregularities, the inner angle R3a is defined as the angle formed by the upper surface 3a of the first insulating member 3 and an approximate line connecting the vertices of a plurality of convex portions on the side surface 3c of the first insulating member 3 that contacts the side surface 1c of the first metal member 1. Similarly, when the side surface 3c of the first insulating member 3 that contacts the side surface 2c of the second metal member 2 has irregularities (the irregularities will be described later), the inner angle R3b is defined as the angle formed by the upper surface 3a of the first insulating member 3 and an approximate line connecting the vertices of a plurality of convex portions on the side surface 3c of the first insulating member 3 that contacts the side surface 2c of the second metal member 2.

[0071] The light-emitting device 100 according to the above-described second embodiment can be preferably manufactured by the manufacturing method of the light-emitting device according to the first embodiment, which will be described later.

[0072] <Light-Emitting Device According to the Third Embodiment> The light-emitting device 100 according to the third embodiment is the same as the light-emitting device 100 according to the first embodiment, except that the shape of the upper surface 3a of the first insulating member 3 is different. FIG. 3 is a schematic cross-sectional view showing an example of the light-emitting device 100 according to the third embodiment.

[0073] (First Insulating Member) The upper surface 3a of the first insulating member 3 is higher than the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2. In other words, there are steps between the upper surface 1a of the first metal member 1 and the upper surface 3a of the first insulating member 3, and between the upper surface 2a of the second metal member 2 and the upper surface 3a of the first insulating member 3, and the upper surface 3a of the first insulating member 3 forms a convex portion with respect to the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2. Thereby, the distance between the second surface 20b of the light-emitting element 20 and the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2 can be made a constant distance, and the heights of the light-emitting elements 20 of the light-emitting device 100 can be made uniform.

[0074] The light-emitting device 100 according to the above-described third embodiment can be preferably manufactured by the manufacturing method of the light-emitting device according to the second embodiment, which will be described later.

[0075] <Light-Emitting Device According to the Fourth Embodiment> The light-emitting device 100 according to the fourth embodiment is the same as the light-emitting device 100 according to the third embodiment, except that the shape of the upper surface 3a of the first insulating member 3 is different. FIG. 4 is a schematic cross-sectional view showing an example of the light-emitting device 100 according to the fourth embodiment.

[0076] The upper surface 3a of the first insulating member 3 is higher than the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2, similar to the light-emitting device 100 according to the third embodiment. However, the upper surface 3a of the first insulating member 3 further has a convex portion. The shape of the upper surface 3a of the first insulating member 3 is not limited to a shape having two-step convex portions in a cross-sectional view, and may be a one-step convex portion or three or more step convex portions. Also, instead of a convex portion having steps, it may be a tapered shape whose width narrows toward the second surface 20b of the light-emitting element 20. Thereby, when the pair of element electrodes 21 of the light-emitting element 20 are arranged on the second surface 20b of the light-emitting element 20, the upper surface 3a of the first insulating member 3 can further arrange a convex portion between the pair of element electrodes 21 of the light-emitting element 20. Even when the space between the pair of element electrodes 21 of the light-emitting element 20 is narrow, a short circuit can be prevented.

[0077] The light-emitting device 100 according to the above fourth embodiment can be preferably manufactured by the manufacturing method of the light-emitting device according to the third embodiment described later.

[0078] <Light-Emitting Device According to the Fifth Embodiment> The light-emitting device 100 according to the fifth embodiment is the same as the light-emitting device 100 according to the first embodiment, except that the shape of the lower surface 3b of the first insulating member 3 is different. FIG. 5 is a schematic cross-sectional view showing an example of the light-emitting device 100 according to the fifth embodiment.

[0079] The lower surface 3b of the first insulating member 3 is recessed from the lower surface 1b of the first metal member 1 and the lower surface 2b of the second metal member 2. In other words, there are steps between the lower surface 1b of the first metal member 1 and the lower surface 3b of the first insulating member 3, and between the lower surface 2b of the second metal member 2 and the lower surface 3b of the first insulating member 3, and the lower surface 3b of the first insulating member 3 forms a recess with respect to the lower surface 1b of the first metal member 1 and the lower surface 2b of the second metal member 2. As a result, the surface area of the lower surface 100b of the light-emitting device 100 composed of the lower surface 1b of the first metal member 1, the lower surface 3b of the first insulating member 3, and the lower surface 2b of the second metal member 2 increases. When mounting on a mounting substrate, the spread of wetting of the solder disposed on the lower surface 1b of the first metal member 1 is suppressed, and the solder does not adhere to the lower surface 2b of the second metal member 2, thereby preventing a short circuit. Also, the surface areas of the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2 increase, and by allowing solder or the like to crawl along the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2 to form a fillet, the thermal conductivity can be enhanced.

[0080] The light-emitting device 100 according to the fifth embodiment described above can be preferably manufactured by the manufacturing method of the light-emitting device according to the fourth embodiment described later.

[0081] <Light-emitting device according to the sixth embodiment> The light-emitting device 100 according to the sixth embodiment is the same as the light-emitting device 100 according to the first embodiment, except that the shapes of the first metal member 1 and the second metal member 2 are different. FIG. 6A is a schematic perspective view showing an example of the light-emitting device 100 according to the sixth embodiment. FIG. 6B is a schematic perspective view showing another example of the light-emitting device 100 according to the sixth embodiment. FIG. 6C is a schematic perspective view showing another example of the light-emitting device 100 according to the sixth embodiment. FIG. 6D is an example of a cross-sectional view taken along the line VID-VID of FIGS. 6A to 6C.

[0082] (First metal member and second metal member) In the light-emitting device 100 according to the sixth embodiment, in a plan view (top view), at least a part of the upper surfaces of the first metal member 1 and the second metal member 2 are arranged so as to be exposed from the second insulating member 4.

[0083] Specifically, in a cross-sectional view, the length (height) of the side surface 1c on the exposed surface side of the first metal member 1 (the side opposite to the surface in contact with the first insulating member 3) and the length (height) of the side surface 2c on the exposed surface side of the second metal member 2 (the side opposite to the surface in contact with the second insulating member 4) are increased, and the light-emitting element 20 and the second insulating member 4 are arranged so as to surround them.

[0084] In this case, the second insulating member 4 is not only disposed on the upper surface 1a1 of the first metal member 1 and the upper surface 2a1 of the second metal member 2, but also the side surface 4c of the second insulating member 4 is in contact with the first metal member 1 and the second metal member 2, and the upper surface 4a of the second insulating member 4, the upper surface 1a2 of the first metal member, and the upper surface 4a of the second insulating member 4 and the upper surface 2a2 of the second metal member 2 can be arranged to be flush.

[0085] Compared with the light-emitting device 100 according to the first embodiment, the area of the second insulating member 4 in a plan view increases in the light-emitting device 100 according to the sixth embodiment. Thereby, the reflectance of the light from the light-emitting element 20 can be made higher.

[0086] The light-emitting device 100 according to the above sixth embodiment can be preferably manufactured by the manufacturing method of the light-emitting device according to the fifth embodiment described later.

[0087] <Light-emitting device according to the seventh embodiment> The light-emitting device 100 according to the seventh embodiment is the same as the light-emitting device 100 according to the first embodiment, except that it further has a wavelength conversion member 5. FIG. 7A is a schematic top view showing an example of the light-emitting device 100 according to the seventh embodiment. FIG. 7B is an example of a cross-sectional view taken along line VIIB-VIIB of FIG. 7A.

[0088] (Wavelength conversion member) The wavelength conversion member 5 is disposed on the first surface 20a of the light-emitting element 20 or above the first surface 20a of the light-emitting element 20. The wavelength conversion member 5 absorbs at least a part of the light emitted from the first surface 20a of the light-emitting element 20 and emits light having a wavelength obtained by converting the wavelength of the absorbed light.

[0089] The wavelength conversion member 5 is preferably a plate-shaped member. Specifically, the wavelength conversion member 5 has, for example, a first surface 20a in contact with the light-emitting element 20, or a lower surface on the side where the first surface 20a of the light-emitting element 20 is disposed, an upper surface on the opposite side of the lower surface of the wavelength conversion member 5, and a side surface connecting the upper surface of the wavelength conversion member 5 and the lower surface of the wavelength conversion member 5. The upper surface of the wavelength conversion member 5 corresponds to the light extraction surface of the upper surface 100a of the light-emitting device 100. The lower surface of the wavelength conversion member 5 is disposed so as to be in contact with the first surface 20a of the light-emitting element 20. It is preferable that the lower surface of the wavelength conversion member 5 and the first surface 20a of the light-emitting element 20 are joined.

[0090] When the lower surface of the wavelength conversion member 5 and the first surface 20a of the light-emitting element 20 are "joined", the lower surface of the wavelength conversion member 5 and the first surface 20a of the light-emitting element 20 may be directly joined, or the lower surface of the wavelength conversion member 5 and the first surface 20a of the light-emitting element 20 may be disposed via an adhesive. That is, it indicates that either one of the lower surface of the wavelength conversion member 5 and the first surface 20a of the light-emitting element 20 is covered with an adhesive, and this adhesive is adhered to the other member.

[0091] When the light-emitting device 100 has the wavelength conversion member 5, the second insulating member 4 preferably directly or indirectly covers the side surface 20c of the light-emitting element 20 and the side surface of the wavelength conversion member 5. Thereby, the second insulating member 4 fixes the light-emitting element 20 and the wavelength conversion member 5, and the reliability of the light-emitting device 100 can be improved.

[0092] In addition, when the second insulating member 4 "directly covers" the side surface 20c of the light-emitting element 20 and the side surface of the wavelength conversion member 5, it indicates that the side surface 20c of the light-emitting element 20, the side surface of the wavelength conversion member 5, and the second insulating member 4 are directly joined. Further, when the second insulating member 4 "indirectly covers" the side surface 20c of the light-emitting element 20 and the side surface of the wavelength conversion member 5, it indicates that the second insulating member 4 is disposed on the side surface 20c of the light-emitting element 20 and the side surface of the wavelength conversion member 5 via an adhesive. That is, it indicates that the side surface 20c of the light-emitting element 20 and the side surface of the wavelength conversion member 5 are covered with an adhesive, and this adhesive is adhered to the second insulating member 4.

[0093] It is preferable that the upper surface and the lower surface of the wavelength conversion member 5 are flat, and it is more preferable that they are parallel to each other. The side surface of the wavelength conversion member 5 may be a vertical surface perpendicular to the upper surface and / or the lower surface of the wavelength conversion member 5, or may have an inclined surface inclined with respect to the upper surface and / or the lower surface of the wavelength conversion member 5. Further, the wavelength conversion member 5 may have a step between the upper surface and the lower surface of the wavelength conversion member 5.

[0094] It is preferable that the lower surface of the wavelength conversion member 5 has an area of about 0.8 times or more and 1.5 times or less the area of the first surface 20a of the light emitting element 20. The outer edge of the lower surface of the wavelength conversion member 5 may coincide with the outer edge of the first surface 20a of the light emitting element 20, but is preferably located inside or outside the outer edge of the first surface 20a of the light emitting element 20. That is, in plan view, it is preferable that either one of the outer edge of the first surface 20a of the light emitting element 20 and the outer edge of the lower surface of the wavelength conversion member 5 is included in the other.

[0095] The thickness of the wavelength conversion member 5 can be, for example, in the range of 50 μm or more and 300 μm or less.

[0096] Examples of the wavelength conversion member 5 include phosphors. As the phosphor, those known in the art can be used, and those that can be excited by the light emitted from the light emitting element 20 are preferably used. For example, as a phosphor that emits green light, yttrium aluminum garnet-based phosphors (for example, Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet-based phosphors (for example, Tb3(Al,Ga)5O 12 :Ce)-based phosphors, silicate-based phosphors (for example, (Ba,Sr)2SiO4:Eu), chlorosilicate-based phosphors (for example, Ca8Mg(SiO4)4C l2 :Eu), β-sialon-based phosphors (for example, Si 6-z Alz O z N 8-z : Eu (0 < z < 4.2)), SGS-based phosphors (e.g., SrGa2S4:Eu), etc. can be mentioned. As the yellow-emitting phosphor, α-sialon-based phosphors (e.g., M z (Si,Al) 12 (O,N) 16 (however, 0 < z ≤ 2, and M is a lanthanide element excluding Li, Mg, Ca, Y, or La and Ce), etc. can be mentioned. In addition, among the above green-emitting phosphors, there are also yellow-emitting phosphors.

[0097] Also, the wavelength conversion member 5, for example, in the yttrium aluminum garnet-based phosphor, by substituting a part of Y with Gd, the emission peak wavelength can be shifted to the long wavelength side, and yellow emission is possible. Also, among these, there are fluorescent substances that can emit orange light. As the red-emitting phosphor, nitrogen-containing calcium aluminosilicate (CASN or SCASN) - based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), BSESN - based phosphors (e.g., (Ba,Sr,Ca)2Si5N8:Eu), etc. can be mentioned. In addition, manganese-activated fluoride-based phosphors (general formula (I) A2[M 1-a Mn a F6] represented phosphors (however, in the above general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs, and NH4, M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0 < a < 0.2)) can be mentioned. As a representative example of this manganese-activated fluoride-based phosphor, there is a phosphor of manganese-activated potassium fluorosilicate (e.g., K2SiF6:Mn).

[0098] By combining these phosphors with a blue light-emitting element or an ultraviolet light-emitting element, a light-emitting device with a desired emission color (e.g., a white-based light-emitting device) can be manufactured.

[0099] Further, the wavelength conversion member 5 includes, for example, a sintered body of a phosphor, a resin, glass, ceramics, or a material in which a phosphor is contained in another inorganic substance. The wavelength conversion member 5 may also be a member in which a resin layer containing a phosphor is formed on the surface of a molded body such as resin, glass, or ceramics.

[0100] The light-emitting device 100 according to the above seventh embodiment can be preferably manufactured by the manufacturing method of the light-emitting device according to the sixth embodiment described later.

[0101] <Light-Emitting Device According to the Eighth Embodiment> The light-emitting device 100 according to the eighth embodiment is the same as the light-emitting device 100 according to the seventh embodiment, except that it further has a plating layer 6. FIG. 8 is a schematic cross-sectional view showing an example of the light-emitting device 100 according to the eighth embodiment.

[0102] Note that the light-emitting device 100 according to the eighth embodiment has a wavelength conversion member 5 as an example, but may not have the wavelength conversion member 5.

[0103] (Plating Layer) The plating layer 6 is a metal layer that covers the first metal member 1 and the second metal member 2. The plating layer 6 can efficiently reflect the light from the light-emitting element 20 to the upper surface 100a side of the light-emitting device 100. Further, the plating layer 6 can reduce the oxidation of the first metal member 1 and the second metal member 2.

[0104] The light-emitting device 100 has a plating layer 6 on at least one surface of the surface of the first metal member 1 and at least one surface of the surface of the second metal member 2. The plating layer 6 is preferably disposed on at least the upper surface 1a of the first metal member 1, and may be disposed on all surfaces of the upper surface 1a, the lower surface 1b, and the side surface 1c of the first metal member 1. Similarly, the plating layer 6 is preferably disposed on at least the upper surface 2a of the second metal member 2, and may be disposed on all surfaces of the upper surface 2a, the lower surface 2b, and the side surface 2c of the second metal member 2. By disposing the plating layer 6 on the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2, the light from the light-emitting element 20 can be efficiently reflected to the upper surface 100a side of the light-emitting device 100. Further, by interposing the plating layer 6, the connection between the external circuit components, wirings, etc. and the first metal member 1 and the second metal member 2 can be made good.

[0105] In the region where the first metal member 1 and the second metal member 2 are disposed, the upper surface 3a of the first insulating member 3 is flush with the plating layer 6. However, when the upper surfaces of the first metal member 1 and the second metal member 2 are flush with the upper surface 3a of the first insulating member 3, they may protrude from the upper surface 3a of the first insulating member 3 by the thickness of the plating layer 6. Further, when forming a plating layer on each lower surface of the first metal member 1 and the second metal member 2, the same configuration as the upper surfaces of the first metal member 1 and the second metal member 2 may be adopted.

[0106] The plating layer 6 is not particularly limited, and examples thereof include nickel, palladium, gold, silver, etc. These may be used alone or in combination of two or more. For example, from the sides of the upper surface 1a, the lower surface 1b, and the side surface 1c of the first metal member 1, and the upper surface 2a, the lower surface 2b, and the side surface 2c of the second metal member 2, a three-layer plating of nickel, palladium, and gold may be used, or a two-layer plating of nickel and gold may be used.

[0107] The light-emitting device 100 according to the above eighth embodiment can be preferably manufactured by the manufacturing method of the light-emitting device according to the seventh embodiment described later.

[0108] 〔Manufacturing method of light-emitting device〕 A method for manufacturing a light-emitting device according to an embodiment includes preparing a metal body having a lower surface and an upper surface with a recess, and a first insulating member that is a sintered ceramic disposed in the recess and having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface; disposing a light-emitting element having a first surface serving as a light extraction surface, a second surface on the opposite side of the first surface, and side surfaces connecting the first surface and the second surface on the upper surface of the metal body so as to be electrically connected to the metal body; disposing a second insulating member on the upper surface of the metal body to fix the metal body; polishing or grinding at least one of the lower surface of the metal body and the lower surface of the first insulating member until at least the first insulating member is exposed from the lower surface of the metal body; cutting the second insulating member; and cutting the metal body. The method for manufacturing a light-emitting device according to an embodiment preferably further includes disposing a wavelength conversion member in contact with the first surface of the light-emitting element or above the first surface of the light-emitting element when disposing the light-emitting element, and further includes other steps as necessary.

[0109] <Method for Manufacturing a Light-Emitting Device According to the First Embodiment> FIG. 9 is a flowchart showing an example of a method for manufacturing a light-emitting device according to the first embodiment. The method for manufacturing the light-emitting device 100 according to the first embodiment includes preparing (S101), disposing a light-emitting element (S102), fixing the metal body (S103), polishing or grinding (S104), cutting the second insulating member (S105), and cutting the metal body (S106).

[0110] FIG. 10A is a cross-sectional view showing an example of preparation (S101) of a method for manufacturing a light-emitting device according to the first embodiment. FIG. 10B is a cross-sectional view showing an example of arranging a light-emitting element (S102) of the method for manufacturing a light-emitting device according to the first embodiment. FIG. 10C is a cross-sectional view showing an example of fixing a metal body (S103) of the method for manufacturing a light-emitting device according to the first embodiment. FIG. 10D is a cross-sectional view showing an example of polishing or grinding (S104) of the method for manufacturing a light-emitting device according to the first embodiment. FIG. 10E is a cross-sectional view showing an example of cutting a second insulating member (S105) of the method for manufacturing a light-emitting device according to the first embodiment. FIG. 10F is a cross-sectional view showing an example of cutting a metal body (S106) of the method for manufacturing a light-emitting device according to the first embodiment.

[0111] (S101: Preparation) (S101: Preparation) includes preparing a metal body 30 having a lower surface 30b and an upper surface 30a having a recess 31, and a sintered ceramic first insulating member 3 disposed in the recess 31 and having an upper surface 3a, a lower surface 3b, and a side surface 3c connecting the upper surface 3a and the lower surface 3b.

[0112] FIG. 11 is a flowchart showing an example of preparation of the method for manufacturing a light-emitting device according to the first embodiment. Preparation (S101) preferably includes preparing a metal body (S11) and arranging a first insulating member (S12).

[0113] ((S11: Preparing a metal body)) FIG. 12A is a perspective view showing an example of a metal body used for preparing a metal body (S11) in preparation (S101) of the method for manufacturing a light-emitting device according to the first embodiment. FIG. 12B is a view showing a part of a cross-section in the thickness direction of the metal body 30 of FIG. 12A.

[0114] (S11: Preparing a metal body) includes preparing a metal body 30 having a lower surface 30b and an upper surface 30a having a recess 31.

[0115] Preparing the metal body (S11): If there is a commercially available product of the metal body 30 with the desired shape and dimensions, it may be possible to prepare a commercially available product, or it may include processing a concave portion 31 in a metal body that does not have the concave portion 31.

[0116] There is no particular limitation on the processing method when processing the concave portion 31 in the metal body 30, and it can be appropriately selected according to the shape of the target concave portion 31. Examples include drilling, laser processing, blasting, etching, and the like.

[0117] By processing the concave portion 31 by blasting, an uneven shape can be preferably imparted to the surface of the side surface 1c of the first metal member 1 facing the side surface 2c of the second metal member 2 and the surface of the side surface 2c of the second metal member 2 facing the side surface 1c of the first metal member 1. Thereby, in arranging the first insulating member (S12), displacement between the concave portion 31 and the first insulating member 3 arranged in the concave portion 31 is less likely to occur, and the first insulating member 3 can be prevented from coming out of the lower surface 100b of the light emitting device 100.

[0118] In preparing the metal body (S11), there is no particular limitation on the shape, structure, and dimensions of the concave portion 31. The length of the opening and the bottom surface of the concave portion 31 in a cross-sectional view may be the same or different. Among these, the shape of the concave portion 31 is preferably an opening such that the opening side is wider than the bottom surface side (that is, the length of the opening of the concave portion 31 is longer than the length of the bottom surface). Thereby, an inclination can be provided in the direction from the upper surface 100a of the light emitting device 100 toward the lower surface 100b of the light emitting device 100 on the surface of the side surface 1c of the first metal member 1 in the light emitting device 100 facing the side surface 2c of the second metal member 2 and the surface of the side surface 2c of the second metal member 2 facing the side surface 1c of the first metal member 1.

[0119] In preparing the metal body (S11), there is no particular limitation on the shape and dimensions of the concave portion 31, and it can be appropriately selected according to the desired shapes and dimensions of the first metal member 1 and the second metal member 2.

[0120] ((S12: Arranging the first insulating member)) In the preparation (S101), in the arranging of the first insulating member (S12), the first insulating member 3, which is a sintered ceramic having an upper surface 3a, a lower surface 3b, and side surfaces 3c connecting the upper surface 3a and the lower surface 3b, is arranged in the recess 31.

[0121] In the arranging of the first insulating member (S12), it is preferable to arrange the first insulating member 3 in the recess 31 by pushing the first insulating member 3 into the recess 31 in the metal body 30. Thereby, the side surface 3c of the first insulating member 3 can be arranged in a state of being in contact without being adhered or joined to the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2 respectively.

[0122] As a method of pushing the first insulating member 3 into the recess 31 in the metal body 30, there is no particular limitation, and it may be performed manually or using a device.

[0123] The recess 31 in the metal body 30 may have an opening of the recess 31 on the upper surface 30a side of the metal body 30 and a shape in which a single opening having a bottom surface of the recess 31 is opened on the lower surface 30b side of the metal body 30, or may be a hole portion of a through hole in which the bottom surface of the recess 31 on the lower surface 30b side of the metal body 30 is also opened. Thus, in the manufacturing method of the light-emitting device according to the first embodiment, the recess 31 is conveniently referred to as the recess 31 from the shape seen from the upper surface 30a side of the metal body 30 in a plan view, but the recess 31 may be a hole portion having no bottom surface.

[0124] Therefore, the direction of pushing the first insulating member 3 into the recess 31 in the metal body 30 is not particularly limited. It may be pushed in from the opening side of the recess 31 on the upper surface 30a side of the metal body 30 toward the bottom surface of the recess 31. When the recess 31 is a hole portion that is a through-hole, it may be pushed in from the bottom surface side of the hole portion on the lower surface 30b side of the metal body 30 toward the opening of the recess 31 on the upper surface 30a side of the metal body 30. When the inside of the recess 31 has irregularities or the side surface 3c of the first insulating member 3 described later has irregularities, the direction of pushing the first insulating member 3 into the recess 31 or the hole portion in the metal body 30 can be appropriately selected according to the irregular shape inside the recess 31 and the irregular shape of the side surface 3c of the first insulating member 3.

[0125] There is no particular limitation on the pushing amount of the first insulating member 3 in the recess 31 or the hole portion in the metal body 30. The height of the first insulating member 3 in the light-emitting device 100 can be adjusted according to the pushing amount of the first insulating member 3 in the recess 31 or the hole portion in the metal body 30. In the manufacturing method of the light-emitting device according to the first embodiment, the first insulating member 3 is pushed in and arranged so that the upper surface 3a of the first insulating member 3 is flush with the upper surface 30a of the metal body 30.

[0126] Alternatively, after pushing in and arranging the first insulating member 3 so that it is higher than the upper surface 30a of the metal body 30, the upper surface 3a of the first insulating member 3 may be polished or ground so that the upper surface 3a of the first insulating member 3 is flush with the upper surface 30a of the metal body 30.

[0127] The first insulating member 3 used in arranging the first insulating member (S12) is sintered ceramics. By using sintered ceramics as the first insulating member 3, the side surface 3c of the first insulating member 3 can be arranged in a state of being in contact without being adhered or joined to the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2 respectively. When a ceramic precursor before firing (for example, liquid ceramics) is used as the first insulating member 3, if the ceramics are fired after arranging the first insulating member (S12), warping may occur due to volume shrinkage of the ceramics, or the side surface 3c of the first insulating member 3 may be joined to the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2. When the side surface 3c of the first insulating member 3 is joined to the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2, peeling may occur between the first insulating member 3 and the first metal member 1 etc. due to reflow during mounting of the light-emitting device or heat generation during driving. Also, when a ceramic precursor before firing (for example, liquid ceramics) is used as the first insulating member 3, there are fluctuations in the dimensions of the first insulating member 3, but by using sintered ceramics, the fluctuations in the dimensions of the first insulating member 3 are small, and it is difficult to form a gap between the side surface 1c of the first metal member 1 and the side surface 2c of the second metal member 2, and a light-emitting device with excellent thermal conductivity can be obtained.

[0128] Arranging the first insulating member (S12) may be to prepare a commercially available product if there is a commercially available product of the first insulating member 3 made of sintered ceramics with a desired shape and dimensions, or may include processing sintered ceramics with arbitrary shapes and dimensions into the first insulating member 3 with desired shapes and dimensions.

[0129] There is no particular limitation on the processing method when processing sintered ceramics with arbitrary shapes and dimensions into the first insulating member 3 with desired shapes and dimensions, and it can be appropriately selected according to the shape of the target first insulating member 3. Examples include drilling, laser processing, blasting, etching, and underlay spacer processing.

[0130] By processing the first insulating member 3 by blasting or underlay spacer processing, an uneven shape can be preferably imparted to the side surface 3c of the first insulating member 3. Thereby, when arranging the first insulating member (S12), displacement between the concave portion 31 or the hole portion and the first insulating member 3 arranged in the concave portion 31 or the hole portion is unlikely to occur, and the first insulating member 3 can be prevented from coming out of the lower surface 100b of the light emitting device 100.

[0131] When arranging the first insulating member (S12), the shape, structure, and dimensions of the first insulating member 3 are not particularly limited, and there is no particular limitation as long as it can be arranged in contact with the inside of the concave portion 31 or the hole portion, but a similar shape to the shape of the concave portion 31 or the hole portion is preferable. Thereby, when the first insulating member 3 is pushed into the concave portion 31 or the hole portion of the metal body 30, it can be arranged without a gap. Among these, as the dimensions of the first insulating member 3, it is preferable that the area of the upper surface 3a of the first insulating member 3 is larger than the area of the lower surface 3b of the first insulating member 3.

[0132] As a specific example, when the inside of the concave portion 31 or the hole portion has an inclination in the direction from the upper surface 30a of the metal body 30 toward the lower surface 30b of the metal body 30, the shape of the side surface 3c of the first insulating member 3 in contact with the inside of the concave portion 31 or the hole portion preferably also has an inclination in the direction from the upper surface 30a of the metal body 30 toward the lower surface 30b of the metal body 30.

[0133] (S102: Arranging the light emitting element) In preparing the light emitting element (S102), on the upper surface 30a of the metal body 30, a light emitting element 20 having a first surface 20a serving as a light extraction surface, a second surface 20b on the opposite side of the first surface 20a, and a side surface 20c connecting the first surface 20a and the second surface 20b is arranged so as to be electrically connected to the metal body 30.

[0134] The light-emitting element 20 has element electrodes 21 of different polarities, and it is preferable to arrange the light-emitting element 20 such that the region where the first insulating member 3 in the metal body 30 is arranged comes between the element electrodes 21 of different polarities. Thereby, a light-emitting device 100 that electrically connects the first metal member 1 and the second metal member 2 to the light-emitting element 20 can be manufactured.

[0135] (S103: Fixing the metal body) In fixing the metal body (S103), the second insulating member 4 is arranged on the upper surface 30a of the metal body 30 to fix the metal body 30. The metal body 30 is preferably fixed by being joined by the second insulating member 4.

[0136] In fixing the metal body (S103), it is preferable that the second insulating member 4 includes fixing the light-emitting element 20. In this case, in fixing the metal body (S103), it is preferable to arrange the second insulating member 4 so as to surround the light-emitting element 20 and expose the first surface 20a that becomes the light extraction surface of the light-emitting element 20.

[0137] Fixing the light-emitting element 20 is preferably performed by directly or indirectly covering the side surface 20c of the light-emitting element 20. Thereby, the reliability of the light-emitting device 100 can be improved.

[0138] (S104: Polishing or grinding) In polishing or grinding (S104), at least one of the lower surface 30b of the metal body 30 and the lower surface 3b of the first insulating member 3 is polished or ground until the first insulating member 3 is exposed from the lower surface 30b of the metal body 30.

[0139] Grinding or machining (S104) involves grinding or machining the lower surface 30b of the metal body 30 along the cutting line XD-XD, so that the lower surface 3b of the first insulating member 3 can be exposed. Thereby, the lower surface 1b of the first metal member 1, the lower surface 2b of the second metal member 2, and the lower surface 3b of the first insulating member 3 can be made flush. In this case, since there is no step between the lower surface 1b of the first metal member 1, the lower surface 3b of the first insulating member 3, and the lower surface 2b of the second metal member 2, the mounting stability with the mounting substrate can be preferably ensured.

[0140] In grinding or machining (S104), it is preferable to include grinding or machining the upper surface of the second insulating member 4 until the first surface 20a of the light-emitting element 20 is exposed.

[0141] Grinding or machining (S104) involves grinding or machining the upper surface of the second insulating member 4 along the cutting line XD-XD, so that the first surface 20a of the light-emitting element 20 can be exposed. Thereby, the upper surface of the second insulating member 4 and the first surface 20a of the light-emitting element 20 can be made flush.

[0142] (S105: Cutting the second insulating member) In cutting the second insulating member (S105), the second insulating member 4 between adjacent light-emitting elements 20 is cut along the cutting line XF-XF in the thickness direction.

[0143] The method of cutting the second insulating member 4 is not particularly limited. For example, methods using a disk-shaped rotary blade, an ultrasonic cutter, laser light irradiation, a blade, a dicing saw, a wire saw, etc. can be mentioned.

[0144] (S106: Cutting the metal body) In cutting the metal body (S106), the metal body 30 between adjacent first insulating members 3 is cut along the cutting line XF-XF in the thickness direction. Thereby, the individual light-emitting devices 100 are obtained.

[0145] The method for cutting the metal body 30 is not particularly limited. For example, methods using a disk-shaped rotary blade, an ultrasonic cutter, laser light irradiation (e.g., fiber laser, CO2 laser, etc.), a blade, a dicing saw, a wire saw, etc. can be mentioned.

[0146] Cutting the second insulating member (S105) and cutting the metal body (S106) may be performed individually or simultaneously, but it is preferable to perform them individually. Since the hardness of the second insulating member 4 is different from that of the metal body 30, a light-emitting device 100 can be suitably obtained by selecting a cutting method suitable for each material. For example, by using a dicing saw or a wire saw using diamond abrasive grains, the second insulating member 4 and the metal body 30 can be cut simultaneously.

[0147] As a specific example of individually performing cutting the second insulating member (S105) and cutting the metal body (S106) using a dicing saw, since the hardness of the metal body 30 is harder than that of the second insulating member 4, it is preferable to use a dicing saw for cutting the second insulating member 4.

[0148] Also, cutting the second insulating member (S105) and cutting the metal body (S106) may be performed by different means. For example, a dicing saw may be used for cutting the second insulating member (S105), and laser light irradiation may be used for cutting the metal body (S106).

[0149] In the manufacturing method of the light-emitting device according to the first embodiment, a method of manufacturing two light-emitting devices 100 simultaneously has been shown, but the number of light-emitting devices to be manufactured simultaneously may be one or three or more. Also, the arrangement of the light-emitting devices 100 is not particularly limited, and examples include a row shape, a grid shape, etc.

[0150] <Manufacturing Method of Light-Emitting Device According to the Second Embodiment> The method for manufacturing a light-emitting device according to the second embodiment is the same as the method for manufacturing a light-emitting device according to the first embodiment, except that when arranging the first insulating member 3 in the concave portion 31 or the hole portion in arranging the first insulating member (S12), the upper surface 3a of the first insulating member 3 is arranged so as to be higher than the upper surface 1a of the first metal member 1 and the upper surface 2a of the second metal member 2.

[0151] FIG. 13A is a perspective view showing an example of a state where the first insulating member 3 is arranged on the metal body 30 in arranging the first insulating member (S12) in preparing (S101) the method for manufacturing a light-emitting device according to the second embodiment. FIG. 13B is a cross-sectional view in the thickness direction of the metal body 30 of FIG. 13A.

[0152] In the method for manufacturing a light-emitting device according to the second embodiment, the pushing amount of the first insulating member 3 into the concave portion 31 or the hole portion in the metal body 30 is adjusted, and the first insulating member 3 is pushed in and arranged so that the upper surface 3a of the first insulating member 3 is higher than the upper surface 30a of the metal body 30.

[0153] <Method for manufacturing a light-emitting device according to the third embodiment> The method for manufacturing a light-emitting device according to the third embodiment is the same as the method for manufacturing a light-emitting device according to the second embodiment, except that preparing (S101) includes processing the upper surface of the first insulating member (S13). FIG. 14 is a flowchart showing an example of preparing the method for manufacturing a light-emitting device according to the third embodiment.

[0154] ((S13: Processing the upper surface of the first insulating member)) In processing the upper surface of the first insulating member (S13) in preparing (S101), the shape of the upper surface 3a of the first insulating member 3 is processed.

[0155] FIG. 15 is a cross-sectional view showing an example of processing the upper surface of the first insulating member (S13) in the method for manufacturing a light-emitting device according to the third embodiment.

[0156] As a method for processing the shape of the upper surface 3a of the first insulating member 3, there are no particular limitations, and it can be appropriately selected according to the target shape of the upper surface 3a. For example, drilling, laser processing, blasting, etching, etc. can be mentioned.

[0157] <Manufacturing Method of Light-Emitting Device According to the Fourth Embodiment> The manufacturing method of the light-emitting device according to the fourth embodiment is the same as the manufacturing method of the light-emitting device according to the first embodiment, except that when arranging the first insulating member 3 in the recess 31 of the metal body 30 in the step of arranging the first insulating member (S12), the lower surface 3b of the first insulating member 3 is arranged so as not to contact the bottom surface in the recess 31. FIG. 16 is a cross-sectional view showing an example of arranging the first insulating member in the step of preparing (S101) the manufacturing method of the light-emitting device according to the fourth embodiment.

[0158] In the manufacturing method of the light-emitting device according to the fourth embodiment, methods include adjusting the pushing amount of the first insulating member 3 into the recess 31 in the metal body 30 and pushing and arranging the first insulating member 3 so that the lower surface 3b of the first insulating member 3 does not contact the bottom surface in the recess 31 of the metal body 30, and processing the shape of the first insulating member 3 into a shape that does not contact the bottom surface in the recess 31 of the metal body 30 in advance and then pushing the first insulating member 3 into the recess 31 in the metal body 30.

[0159] <Manufacturing Method of Light-Emitting Device According to the Fifth Embodiment> The manufacturing method of the light-emitting device according to the fifth embodiment is the same as the manufacturing method of the light-emitting device according to the first embodiment, except that in the step of preparing the metal body (S11), the shape of the metal body 30 is changed.

[0160] FIG. 17A is a perspective view showing another example of the metal body used in the step of preparing the metal body (S11) in the step of preparing (S101) the manufacturing method of the light-emitting device according to the fifth embodiment. FIG. 17B is a perspective view showing still another example of the metal body used in the step of preparing the metal body (S11) in the step of preparing (S101) the manufacturing method of the light-emitting device according to the fifth embodiment.

[0161] In preparing the metal body (S11), the first insulating member 3 is disposed in the recess 31 of the metal body 30 having such a shape. Further, in preparing the light-emitting element in the region 32 surrounded by a total of five surfaces including the four side surfaces and the bottom surface or a total of three surfaces including the two side surfaces and the bottom surface by the metal body 30 (S102), the light-emitting element 20 is disposed, and further, in fixing the metal body (S103), the second insulating member 4 is disposed, whereby the periphery of the light-emitting element 20 and the second insulating member 4 can be surrounded by the first metal member 1 and the second metal member 2.

[0162] <Manufacturing method of the light-emitting device according to the sixth embodiment> The manufacturing method of the light-emitting device according to the sixth embodiment is the same as the manufacturing method of the light-emitting device according to the first embodiment, except that it further includes disposing a wavelength conversion member (S203). FIG. 18 is a flowchart showing an example of the manufacturing method of the light-emitting device according to the sixth embodiment.

[0163] FIG. 19A is a cross-sectional view showing an example of disposing the wavelength conversion member (S203) in the manufacturing method of the light-emitting device according to the sixth embodiment. FIG. 19B is a cross-sectional view showing an example of fixing the metal body (S204) in the manufacturing method of the light-emitting device according to the sixth embodiment.

[0164] (S203: Disposing the wavelength conversion member) In disposing the wavelength conversion member (S203), in disposing the light-emitting element 20 (S202), the wavelength conversion member 5 is disposed so as to be in contact with the first surface 20a of the light-emitting element 20 or above the first surface 20a of the light-emitting element 20.

[0165] When the wavelength conversion member 5 is disposed in contact with the first surface 20a of the light-emitting element 20 in disposing the wavelength conversion member (S203), the lower surface of the wavelength conversion member 5 and the first surface 20a of the light-emitting element 20 can be joined using a translucent adhesive or the like as commonly used in the art. Further, the lower surface of the wavelength conversion member 5 and the first surface 20a of the light-emitting element 20 may be joined by a direct bonding method such as pressure bonding, surface activation bonding, atomic diffusion bonding, or hydroxyl group bonding.

[0166] When arranging the wavelength conversion member (S203), when arranging the wavelength conversion member 5 above the first surface 20a of the light-emitting element 20, for example, other members such as a light-transmissive member may be provided between the light-emitting element 20 and the wavelength conversion member 5.

[0167] (S204: Fixing the metal body) In the method for manufacturing a light-emitting device according to the sixth embodiment, in fixing the metal body (S204), the second insulating member 4 surrounds the light-emitting element 20 and the wavelength conversion member 5, and is the same as fixing the metal body (S103) in the method for manufacturing a light-emitting device according to the first embodiment, except that the upper surface of the wavelength conversion member 5 on the first surface 20a that becomes the light extraction surface of the light-emitting element 20 is exposed.

[0168] <Method for manufacturing a light-emitting device according to the seventh embodiment> The method for manufacturing a light-emitting device according to the seventh embodiment is the same as the method for manufacturing a light-emitting device according to the sixth embodiment, except that it further includes plating (S302). FIG. 20 is a flowchart showing an example of the method for manufacturing a light-emitting device according to the seventh embodiment.

[0169] Note that, as an example, the method for manufacturing a light-emitting device according to the seventh embodiment includes arranging the wavelength conversion member (S304), but it may not include arranging the wavelength conversion member (S304).

[0170] FIG. 21A is a cross-sectional view showing an example of plating (S302) in the method for manufacturing a light-emitting device according to the seventh embodiment. FIG. 21B is a cross-sectional view showing an example of arranging the light-emitting element (S303) and arranging the wavelength conversion member (S304) in the method for manufacturing a light-emitting device according to the seventh embodiment. FIG. 21C is a cross-sectional view showing an example of fixing the metal body (S305) in the method for manufacturing a light-emitting device according to the seventh embodiment. FIG. 21D is a cross-sectional view showing an example of cutting the metal body (S308) in the method for manufacturing a light-emitting device according to the seventh embodiment.

[0171] (S302: Plating) In the plating step (S302), plating is applied to at least one surface of the first metal member 1 and at least one surface of the second metal member 2 to form a plating layer 6. This allows the light from the light-emitting element 20 to be efficiently reflected toward the upper surface 100a side of the light-emitting device 100. Also, the plating layer 6 can reduce the oxidation of the first metal member 1 and the second metal member 2.

[0172] In the plating step (S302), plating may be applied to the lower surface 1b and side surface 1c of the first metal member 1, and the lower surface 2b and side surface 2c of the second metal member 2 to form a plating layer 6. By forming the plating layer 6 on the lower surface 1b of the first metal member 1 and the lower surface 2b of the second metal member 2, the bonding strength between the light-emitting device 100 and the mounting substrate can be increased.

[0173] The plating layer 6 can be formed by electroless plating. The plating step (S302) may be performed through a mask.

[0174] (S303: Disposing the light-emitting element) and (S304: Disposing the wavelength conversion member) The step of disposing the light-emitting element (S303) is the same as the step of preparing the light-emitting element (S102), except that the light-emitting element 20 having a first surface 20a that serves as a light extraction surface, a second surface 20b on the opposite side of the first surface 20a, and a side surface 20c connecting the first surface 20a and the second surface 20b is disposed on the plating layer 6 on the upper surface 30a of the metal body 30 so as to be electrically connected to the metal body 30.

[0175] The step of disposing the wavelength conversion member (S304) is the same as the step of disposing the wavelength conversion member (S203), except that the wavelength conversion member 5 is disposed on the light-emitting element 20 disposed on the plating layer 6 on the upper surface 30a of the metal body 30.

[0176] (S305: Fixing the metal body) Fixing the metal body (S305) is the same as fixing the metal body (S103) or fixing the metal body (S204), except that the second insulating member 4 is disposed on the plating layer 6 on the upper surface 30a of the metal body 30 and the metal body 30 having the plating layer 6 is fixed.

[0177] (S308: Cutting the metal body) Cutting the metal body (S308) is the same as cutting the metal body (S106) or cutting the metal body (S207), except that the plating layer 6 disposed on the upper surface 30a of the metal body 30 is cut together with the metal body 30.

[0178] As described above, the present invention has been described based on specific embodiments, but these are merely presented as examples, and the present invention is not limited by the above embodiments. The above embodiments can be implemented in various other forms, and various combinations, omissions, replacements, additions, changes, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

[0179] In addition to the above embodiments, the following supplementary notes are further disclosed. (Supplementary Note 1) A first metal member having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface; A second metal member having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, separated from the first metal member; A first insulating member having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface, disposed between the side surface of the first metal member and the side surface of the second metal member; A light-emitting element having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface, and electrically connected to the first metal member and the second metal member; A second insulating member joined to the upper surface of the first metal member and the upper surface of the second metal member; and The side surface of the first insulating member is not adhered or joined to, but in contact with, the side surfaces of the first metal member and the second metal member, respectively, and is a light-emitting device. (Appendix 2) The light-emitting device according to Appendix 1, further comprising a wavelength conversion member on the first surface of the light-emitting element or above the first surface of the light-emitting element. (Appendix 3) The light-emitting device according to Appendix 1 or 2, wherein at least one surface of the surface of the first metal member and at least one surface of the surface of the second metal member have a plated layer. (Appendix 4) The surface of the side surface of the first metal member facing the side surface of the second metal member and the surface of the side surface of the second metal member facing the side surface of the first metal member have an inclination in the direction from the upper surface of the light-emitting device to the lower surface of the light-emitting device. The light-emitting device according to any one of Appendices 1 to 3, wherein at least one of the inner angles between the upper surface of the first metal member and the surface of the side surface of the first metal member facing the side surface of the second metal member, and the inner angle between the upper surface of the second metal member and the surface of the side surface of the second metal member facing the side surface of the first metal member is an obtuse angle. (Appendix 5) The light-emitting device according to any one of Appendices 1 to 4, wherein the surface of the side surface of the first metal member facing the side surface of the second metal member and the surface of the side surface of the second metal member facing the side surface of the first metal member have irregularities. (Appendix 6) The light-emitting device according to any one of Appendices 1 to 5, wherein the upper surface of the first insulating member is flush with the upper surfaces of the first metal member and the second metal member. (Appendix 7) The light-emitting device according to any one of Appendices 1 to 6, wherein the upper surface of the first insulating member is higher than the upper surfaces of the first metal member and the second metal member. (Appendix 8) The light-emitting device according to any one of Appendices 1 to 7, wherein the lower surface of the first insulating member is flush with the lower surfaces of the first metal member and the second metal member. (Appended Note 9) The light-emitting device according to any one of Appended Notes 1 to 8, wherein the lower surface of the first insulating member is recessed from the lower surface of the first metal member and the lower surface of the second metal member. (Appended Note 10) The light-emitting device according to any one of Appended Notes 1 to 9, wherein the first insulating member is white ceramics. (Appended Note 11) The light-emitting device according to any one of Appended Notes 2 to 10, wherein the second insulating member directly or indirectly covers the side surface of the light-emitting element, or the side surface of the light-emitting element and the side surface of the wavelength conversion member. (Appended Note 12) Preparing a metal body having a lower surface and an upper surface having a recess, and a first insulating member which is a sintered ceramics disposed in the recess and having an upper surface, a lower surface, and side surfaces connecting the upper surface and the lower surface; Disposing a light-emitting element having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface on the upper surface of the metal body so as to be electrically connected to the metal body; Disposing a second insulating member on the upper surface of the metal body to fix the metal body; Polishing or grinding at least one of the lower surface of the metal body and the lower surface of the first insulating member until at least the first insulating member is exposed from the lower surface of the metal body; Cutting the second insulating member; Cutting the metal body; A method for manufacturing a light-emitting device, including the above steps. (Appended Note 13) The method for manufacturing a light-emitting device according to Appended Note 12, further including disposing a wavelength conversion member in contact with the first surface of the light-emitting element or above the first surface of the light-emitting element when disposing the light-emitting element. (Appended Note 14) The method for manufacturing a light-emitting device according to Appended Note 12 or 13, wherein in the step of preparing, the shape of the recess is an opening such that the opening side is wider than the bottom side. (Appended Note 15) In the preparation, the method for manufacturing a light-emitting device according to any one of Appendices 12 to 14, including that the area of the upper surface of the first insulating member is larger than the area of the lower surface of the first insulating member. (Appendix 16) In the preparation, the method for manufacturing a light-emitting device according to any one of Appendices 12 to 15, including pushing the first insulating member into the recess from the opening side of the recess in the metal body. (Appendix 17) In arranging the light-emitting element, the light-emitting element has element electrodes of different polarities, The method for manufacturing a light-emitting device according to any one of Appendices 12 to 16, including arranging the light-emitting element such that the region of the metal body where the first insulating member is arranged comes between the element electrodes of different polarities. (Appendix 18) In fixing the metal body, the method for manufacturing a light-emitting device according to any one of Appendices 12 to 17, including fixing the light-emitting element by the second insulating member.

Explanation of Reference Numerals

[0180] 1... First metal member 1a... Upper surface of the first metal member 1 1b... Lower surface of the first metal member 1 1c... Side surface of the first metal member 1 2... Second metal member 2a... Upper surface of the second metal member 2 2b... Lower surface of the second metal member 2 2c... Side surface of the second metal member 2 3... First insulating member 3a... Upper surface of the first insulating member 3 3b... Lower surface of the first insulating member 3 3c... Side surface of the first insulating member 3 20... Light-emitting element 20a... First surface of the light-emitting element 20 20b... Second surface of the light-emitting element 20 20c... Side surface of the light-emitting element 20 21... Element electrode 4... Second insulating member 4a…Upper surface of the second insulating member 4 4c…Side surface of the second insulating member 4 5…Wavelength conversion member 6…Plating layer 30…Metal body 30a…Upper surface of the metal body 30 30b…Lower surface of the metal body 30 31…Recess 32…Region 100…Light-emitting device 100a…Upper surface of the light-emitting device 100 100b…Lower surface of the light-emitting device 100

Claims

1. A first metal member having an upper surface and a lower surface, and side surfaces connecting the upper surface and the lower surface; A second metal member spaced apart from the first metal member, having an upper surface and a lower surface, and side surfaces connecting the upper surface and the lower surface; A first insulating member disposed between the side surface of the first metal member and the side surface of the second metal member, having an upper surface and a lower surface, and side surfaces connecting the upper surface and the lower surface; A light-emitting element having a first surface serving as a light extraction surface and a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface, and being electrically connected to the first metal member and the second metal member; A second insulating member joined to the upper surface of the first metal member and the upper surface of the second metal member; And having; A light-emitting device, wherein the side surface of the first insulating member is not adhered or joined to, but in contact with, each of the side surface of the first metal member and the side surface of the second metal member.

2. The light-emitting device according to claim 1, further comprising a wavelength conversion member on the first surface of the light-emitting element or above the first surface of the light-emitting element.

3. The light-emitting device according to claim 1, wherein at least one surface of the surface of the first metal member and at least one surface of the surface of the second metal member have a plating layer.

4. The surface of the side surface of the first metal member facing the side surface of the second metal member and the surface of the side surface of the second metal member facing the side surface of the first metal member have an inclination in the direction from the upper surface of the light-emitting device toward the lower surface of the light-emitting device, At least one of the interior angles between the upper surface of the first metal member and the surface of the side surface of the first metal member facing the side surface of the second metal member, and the interior angle between the upper surface of the second metal member and the surface of the side surface of the second metal member facing the side surface of the first metal member is an obtuse angle. The light-emitting device according to claim 1.

5. The surface of the side surface of the first metal member facing the side surface of the second metal member and the surface of the side surface of the second metal member facing the side surface of the first metal member have irregularities. The light-emitting device according to claim 1.

6. The light-emitting device according to claim 1, wherein the upper surface of the first insulating member is flush with the upper surface of the first metal member and the upper surface of the second metal member.

7. The light-emitting device according to claim 1, wherein the upper surface of the first insulating member is higher than the upper surface of the first metal member and the upper surface of the second metal member.

8. The light-emitting device according to claim 1, wherein the lower surface of the first insulating member is flush with the lower surfaces of the first metal member and the second metal member.

9. The light-emitting device according to claim 1, wherein the lower surface of the first insulating member is recessed from the lower surfaces of the first metal member and the second metal member.

10. The light-emitting device according to claim 1, wherein the first insulating member is a white ceramic.

11. The light-emitting device according to claim 2, wherein the second insulating member directly or indirectly covers the side surface of the light-emitting element, or the side surfaces of the light-emitting element and the wavelength conversion member.

12. Preparing a metal body having a lower surface and an upper surface having a recess, and a first insulating member which is a sintered ceramic disposed in the recess and having an upper surface, a lower surface, and side surfaces connecting the upper and lower surfaces; Disposing a light-emitting element having a first surface serving as a light extraction surface, a second surface opposite to the first surface, and side surfaces connecting the first surface and the second surface on the upper surface of the metal body so as to be electrically connected to the metal body; Disposing a second insulating member on the upper surface of the metal body to fix the metal body; Polishing or grinding at least one of the lower surface of the metal body and the lower surface of the first insulating member until at least the first insulating member is exposed from the lower surface of the metal body; Cutting the second insulating member; Cutting the metal body; A method for manufacturing a light-emitting device, including the above steps.

13. The method for manufacturing a light-emitting device according to claim 12, further including disposing a wavelength conversion member in contact with the first surface of the light-emitting element or above the first surface of the light-emitting element when disposing the light-emitting element.

14. The method for manufacturing a light-emitting device according to claim 12, wherein in the step of preparing, the shape of the recess is an opening such that the opening side is wider than the bottom side.

15. The method for manufacturing a light-emitting device according to claim 12, wherein in the step of preparing, the area of the upper surface of the first insulating member is larger than the area of the lower surface of the first insulating member.

16. The method for manufacturing a light-emitting device according to claim 12, wherein in the step of preparing, the first insulating member is pushed into the recess from the opening side of the recess in the metal body.

17. When disposing the light-emitting element, the light-emitting element has element electrodes of different polarities. The method of manufacturing a light-emitting device according to claim 12, comprising arranging the light-emitting element such that a region where the first insulating member is disposed in the metal body comes between the element electrodes of different polarities.

18. The method of manufacturing a light-emitting device according to claim 12, wherein, in fixing the metal body, the second insulating member includes fixing the light-emitting element.

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