Light-emitting device and light-emitting unit

Abstract

To provide a light-emitting device that can be made compact.SOLUTION: A light-emitting device has a support body which has a first conductive part, a second conductive part and a third conductive part arranged apart from one another, a first light-emitting element which is arranged on the first conductive part, and an integrated circuit which is electrically connected to the first light-emitting element, wherein the first conductive part is located at least in part between the second conductive part and the third conductive part in a first direction, the integrated circuit is arranged side by side with the first light-emitting element in a second direction orthogonal to the first direction, and the maximum length of the integrated circuit in the second direction is shorter than the maximum length of the integrated circuit in the first direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device and a light-emitting unit.

Background Art

[0002] For example, Patent Document 1 discloses a light-emitting device having a support, a light-emitting element disposed on the support, and an integrated circuit disposed on the support.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An embodiment according to the present disclosure aims to provide a light-emitting device that can be miniaturized.

Means for Solving the Problems

[0005] A light-emitting device according to an embodiment of the present disclosure includes a support on which a first conductive portion, a second conductive portion, and a third conductive portion are arranged apart from each other, a first light-emitting element disposed on the first conductive portion, and an integrated circuit electrically connected to the first light-emitting element. At least a part of the first conductive portion is located between the second conductive portion and the third conductive portion in a first direction, the integrated circuit is arranged side by side with the first light-emitting element in a second direction orthogonal to the first direction, and a maximum length of the integrated circuit in the second direction is shorter than a maximum length of the integrated circuit in the first direction.

Effects of the Invention

[0006] According to an embodiment of the present disclosure, a light-emitting device that can be miniaturized can be provided.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

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Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments will be described with reference to the drawings. Since each drawing schematically shows the embodiments, the scale, interval, or positional relationship of each member may be exaggerated, or illustration of a part of the member may be omitted.

[0009] In the following description, components having substantially the same function are denoted by a common reference numeral, and the description thereof may be omitted. Also, terms indicating a specific direction or position (for example, "up", "down", and other terms including these terms) may be used. However, these terms are merely used for the sake of clarity of the relative direction or position in the referenced drawings. If the relative direction or position relationship by terms such as "up" and "down" in the referenced drawings is the same, in drawings other than the present disclosure, actual products, etc., it does not have to be arranged in the same way as the referenced drawings. In this specification, "parallel" includes not only the case where two straight lines, sides, surfaces, etc. do not intersect even when extended, but also the case where the angle formed by two straight lines, sides, surfaces, etc. intersects within a range of 10° or less. The positional relationship expressed as "up" in this specification includes both the case where they are in contact and the case where they are not in contact but are located above.

[0010] In this specification, as a direction expression, a rectangular coordinate system having D1 axis, D2 axis, and D3 axis is used. The D1 axis, D2 axis, and D3 axis are orthogonal to each other. The direction along the D1 axis is defined as the first direction D1, the direction along the D2 axis is defined as the second direction D2, and the direction along the D3 axis is defined as the vertical direction. Also, the direction in which the arrow of the D1 axis points is defined as the right direction, and the opposite direction of the right direction is defined as the left direction. The direction in which the arrow of the D2 axis points is defined as the front direction, and the opposite direction of the front direction is defined as the rear direction. The direction in which the arrow of the D3 axis points is defined as the upper direction, and the opposite direction of the upper direction is defined as the lower direction. Looking at an object from above is called a top view. The top view is synonymous with a plan view.

[0011] [First Embodiment] With reference to FIGS. 1 to 3, a light-emitting device according to the first embodiment will be described. FIGS. 1 to 3 are schematic top views showing an example of a light-emitting device 100 according to the first embodiment.

[0012] As shown in FIGS. 1 to 3, the light-emitting device 100 includes a support 1 on which a first conductive portion 11, a second conductive portion 12, and a third conductive portion 13 are arranged apart from each other, a first light-emitting element 21 disposed on the first conductive portion 11, and an integrated circuit 3 electrically connected to the first light-emitting element 21. In the example shown in FIGS. 1 to 3, the light-emitting device 100 includes a plurality of first wires 4 connected to the integrated circuit 3, a second light-emitting element 22, and a third light-emitting element 23. Further, the plurality of first wires 4 includes a second wire 5 connecting the integrated circuit 3 and the first conductive portion 11. Furthermore, the support 1 has a via 6 electrically connected to the first conductive portion 11. Note that the light-emitting device 100 may include wires other than the plurality of first wires 4, conductive portions other than the first conductive portion 11, the second conductive portion 12, and the third conductive portion 13, and vias other than the via 6. The connection portion a is a portion where wires such as the plurality of first wires 4 are connected to a conductive portion such as the first conductive portion 11, the second conductive portion 12, or the third conductive portion.

[0013] In the present embodiment, at least a part of the first conductive portion 11 is located between the second conductive portion 12 and the third conductive portion 13 in the first direction D1. The integrated circuit 3 is arranged side by side with the first light-emitting element 21 in a second direction D2 orthogonal to the first direction D1. The maximum length L2 of the integrated circuit 3 in the second direction D2 is shorter than the maximum length L1 of the integrated circuit 3 in the first direction D1. With this configuration, in the present embodiment, the light-emitting device 100 can be miniaturized in the second direction D2, and a miniaturizable light-emitting device 100 can be provided. From the viewpoint of miniaturizing the light-emitting device 100, it is preferable that the maximum length L2 of the integrated circuit 3 in the second direction D2 is shorter than half of the maximum length L1 of the integrated circuit 3 in the first direction D1. Further, it is preferable that the first light-emitting element 21 is positioned between the second conductive portion 12 and the third conductive portion 13 in the first direction D1. With this configuration, it becomes easy to arrange the first light-emitting element 21, the second conductive portion 12, and the third conductive portion 13 at high density, so that the light-emitting device 100 can be easily miniaturized. Furthermore, in the second direction D2, it is preferable that the second conductive portion 12 and the third conductive portion 13 do not overlap the first light-emitting element 21. By doing so, it becomes easy to miniaturize the light-emitting device 100 in the second direction D2.

[0014] In the light-emitting device 100 shown in FIGS. 1 to 3, the integrated circuit 3 is located on the first conductive portion 11. Thereby, the gap between the integrated circuit 3 and the first conductive portion 11 can be eliminated as compared with the case where the integrated circuit 3 is located away from the first conductive portion 11. Since there is no such gap, in the light-emitting device 100 shown in FIGS. 1 to 3, the light-emitting device 100 can be miniaturized.

[0015] In the light-emitting device 100 shown in FIG. 1, the maximum length L3 in the first direction D1 of the first portion 111 of the first conductive portion 11 including the region overlapping with the first light-emitting element 21 is shorter than the maximum length L4 in the first direction D1 of the second portion 112 of the first conductive portion 11 including the region overlapping with the integrated circuit 3. With this configuration, in the light-emitting device 100 shown in FIG. 1, in the first direction D1, the first portion 111 of the first conductive portion 11 including the region overlapping with the first light-emitting element 21 can be accommodated inside the second portion 112 of the first conductive portion 11 including the region overlapping with the integrated circuit 3, so that the light-emitting device 100 can be miniaturized in the first direction D1. In FIG. 1, the dashed-dotted line frame indicating the first portion 111 and the two-dashed line frame indicating the second portion 112 are shown for the purpose of explanation.

[0016] In the light-emitting device 100 shown in FIG. 2, the integrated circuit 3 includes a first outer edge 31 facing the first light-emitting element 21 in a top view and a second outer edge 32 located on the opposite side of the first outer edge 31 in a top view. The integrated circuit 3 also includes a third outer edge 33 connected to each of the first outer edge 31 and the second outer edge 32 in a top view and a fourth outer edge 34 located on the opposite side of the third outer edge 33 in a top view. In the light-emitting device 100 shown in FIG. 2, in a top view, the plurality of first wires 4 are located away from the second outer edge 32. With this configuration, in the light-emitting device 100 shown in FIG. 2, since the first wire 4 is not located at a position straddling the second outer edge 32, miniaturization of the light-emitting device 100 in the second direction D2 becomes easy.

[0017] In the light-emitting device 100 shown in FIG. 2, the number of the first wires 4 that overlap with the first outer edge 31 in a top view is larger than the total number of the first wires 4 that overlap with the third outer edge 33 and the fourth outer edge 34 in a top view. Thus, in the light-emitting device 100 shown in FIGS. 1 to 3, since it becomes easier to shorten the maximum length L2 of the integrated circuit 3 in the second direction D2, miniaturization of the light-emitting device 100 becomes easy in the second direction D2.

[0018] In the light-emitting device 100 shown in FIG. 2, the second wire 5 is connected to the third portion 113 between the first light-emitting element 21 and the integrated circuit 3 in the first conductive portion 11 in the second direction D2. The longer the second wire 5 is, the more easily it breaks. By connecting the second wire 5 to the third portion 113, the second wire 5 can be made shorter as compared with the case where the second wire 5 is connected to a portion of the first conductive portion 11 on the side opposite to the side where the integrated circuit 3 is located with respect to the first light-emitting element 21. Thus, in the light-emitting device 100 shown in FIG. 2, disconnection of the second wire 5 can be reduced. Note that, in FIG. 2, the broken-line frame showing the third portion 113 is illustrated for the purpose of explanation.

[0019] In the light-emitting device 100 shown in FIGS. 1 to 3, the via 6 is located between the first light-emitting element 21 and the integrated circuit 3 in the second direction D2. With this configuration, heat emitted from each of the first light-emitting element 21 and the integrated circuit 3 can be released through the via 6 to an external substrate or the like on which the support 1 is disposed. As a result, in the light-emitting device 100 shown in FIGS. 1 to 3, heat dissipation of the light-emitting device 100 can be improved.

[0020] In the light-emitting device 100 shown in FIG. 2, the minimum distance e1 between the integrated circuit 3 and the via 6 in the second direction D2 is shorter than the minimum distance e2 between the connection portion a51 where the second wire 5 is connected to the first conductive portion 11 and the integrated circuit 3 in the second direction D2. With this configuration, since the integrated circuit 3 and the via 6 are located close to each other in a plan view, heat emitted from the integrated circuit 3 can be easily released through the via 6 to an external substrate or the like on which the support 1 is disposed.

[0021] In the light-emitting device 100 shown in FIGS. 1 to 3, the emission peak wavelength of the first light-emitting element 21 is 430 nm or more and 480 nm or less. Also, the emission peak wavelength of the second light-emitting element 22 is 500 nm or more and 580 nm or less. Further, the emission peak wavelength of the third light-emitting element 23 is 600 nm or more and 780 nm or less. By including the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 in the light-emitting device 100, it becomes easier to emit white light.

[0022] In the light-emitting device 100 shown in FIG. 3, the minimum distance e3 between the second light-emitting element 22 and the integrated circuit 3 in the second direction D2 is longer than the minimum distance e4 between the first light-emitting element 21 and the integrated circuit 3 in the second direction D2. Generally, when emitting white light from a light-emitting element that emits blue light, a light-emitting element that emits green light, and a light-emitting element that emits red light, the light-emitting element that emits green light is required to have a higher luminance than the light-emitting element that emits blue light. For this reason, the current value when driving the light-emitting element that emits green light is higher than the current value when driving the light-emitting element that emits blue light. Therefore, compared with the light-emitting element that emits blue light, the temperature is likely to rise due to heat generation. On the other hand, since the integrated circuit also generates heat, the closer the light-emitting element is arranged to the integrated circuit, the more likely the temperature is to rise due to the heat of the integrated circuit being transmitted. When the junction temperature is reached due to the temperature rise, the light-emitting element may be damaged. In the light-emitting device 100 shown in FIG. 3, since the minimum distance e3 between the second light-emitting element 22 and the integrated circuit 3 in the second direction D2 is longer than the minimum distance e4 between the first light-emitting element 21 and the integrated circuit 3 in the second direction D2, the heat of the integrated circuit 3 can be reduced from being transmitted to the second light-emitting element 22. Thereby, in the light-emitting device 100 shown in FIG. 3, the temperature rise of the second light-emitting element 22 can be suppressed, and the breakage of the second light-emitting element 22 can be reduced.

[0023] Hereinafter, each element constituting the light-emitting device 100 will be described in detail.

[0024] (Support 1) The support 1 is a member on which the light-emitting element 2 is placed. The light-emitting element 2 is placed on the upper surface. The light-emitting element 2 is joined to the upper surface of the support 1 by a joining member such as resin, solder, or conductive paste. In the example shown in FIG. 3, the light-emitting device 100 has conductive parts 51 to 60 in addition to the first conductive part 11, the second conductive part 12, and the third conductive part 13. The conductive part 51 is a conductive part that is located to the left of the integrated circuit 3 in a top view and has a substantially rectangular shape with the second direction D2 as its longitudinal direction. The conductive part 52 is a conductive part that is located in front of the conductive part 51 in a top view and has a substantially rectangular shape with the second direction D2 as its longitudinal direction. The conductive part 53 is a conductive part that is located in front of the conductive part 52 in a top view and has a substantially rectangular shape with the second direction D2 as its longitudinal direction. The conductive part 54 is a conductive part that extends from the left side to the front of the first conductive part 11 and also extends from the front end of the support 1 to the right side in a top view. The conductive part 55 is a conductive part that is located inside the conductive part 54 and extends from the left side to the front of the first conductive part 11 and also extends from the front end of the support 1 to the right side in a top view. The conductive part 56 is a part that extends from the front to the right of the first conductive part 11 and has a shape that branches to the right and the rear in a top view. The conductive part 57 is a conductive part that extends from the right side to the front of the first conductive part 11 in a top view. The conductive part 58 is a conductive part that is located to the right of the first conductive part 11 in a top view and has a substantially rectangular shape with the second direction D2 as its longitudinal direction. The conductive part 59 is a conductive part that is located behind the conductive part 58 in a top view and has a substantially rectangular shape with the second direction D2 as its longitudinal direction. The conductive part 60 is a conductive part that is located behind the conductive part 59 in a top view and has a substantially rectangular shape with the second direction D2 as its longitudinal direction.

[0025] For the support 1, a wiring board including a substrate and wiring can be used. The substrate can be composed of resin, ceramics, glass, etc. As the resin, known materials such as the above-mentioned thermosetting resin and thermoplastic resin can be used. Examples of the ceramics include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, or a mixture thereof. The wiring can be formed of copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or an alloy thereof. These metals or alloys can be either a single layer or multiple layers.

[0026] For the first conductive portion 11, the second conductive portion 12, and the third conductive portion 13, leads having conductivity and functioning as electrodes for supplying power to the light-emitting element 2 can be used. As the base material of the lead, metals such as copper, aluminum, gold, silver, iron, nickel, or an alloy thereof, phosphor bronze, copper containing iron, etc. can be used. These can be either a single layer or a laminated structure (for example, a clad material). In particular, it is preferable to use copper, which is inexpensive and has high heat dissipation, as the base material. Further, the lead may have a metal layer on the surface of the base material. The metal layer includes gold, silver, aluminum, nickel, palladium, rhodium, copper, or an alloy thereof. Note that the metal layer may be provided on the entire surface of the lead or partially. Also, the metal layer can be made into different layers for the region formed on the upper surface of the lead and the region formed on the lower surface of the lead. For example, the metal layer formed on the upper surface of the lead is a metal layer composed of a plurality of layers including nickel and silver metal layers, and the metal layer formed on the lower surface of the lead is a metal layer not including a nickel metal layer. Also, the metal layer such as gold formed on the upper surface of the lead can be made thicker than the metal layer such as gold formed on the lower surface of the lead. When a metal layer containing silver is formed on the outermost surface of the lead, it is preferable to provide a protective layer such as silicon oxide on the surface of the metal layer containing silver. Thereby, it is possible to suppress the discoloration of the metal layer containing silver due to sulfur components in the air. The film formation method of the protective layer can be, for example, film formation by a vacuum process such as sputtering.

[0027] Note that the first conductive part 11 only needs to be a member capable of conducting current, and it is not necessary for a current for causing the light-emitting element 2 to emit light to flow through it. The first conductive part 11 can also be used as a heat dissipation part in the light-emitting device 100. The first conductive part 11 can be configured to include a metal material or the like that has conductivity and good heat dissipation properties.

[0028] (Light-emitting element 2) The light-emitting device 100 has at least one light-emitting element 2. In the examples shown in FIGS. 1 to 3, the light-emitting device 100 has a first light-emitting element 21, a second light-emitting element 22, and a third light-emitting element 23. The number of light-emitting elements 2 included in the light-emitting device 100 may be one, two, three, or four or more. In FIGS. 1 to 3, for the purpose of showing that a plurality of light-emitting elements 2 include the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23, the reference numeral of the light-emitting element 2 is also noted together with the reference numerals of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. There may be cases where reference numerals are noted together for the same purpose in the figures shown hereinafter.

[0029] In the examples shown in FIGS. 1 to 3, the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are arranged at the center of the support 1. By arranging a plurality of light-emitting elements 2 at the center of the support 1, the plurality of light-emitting elements 2 can be arranged at high density, and the positions of the plurality of light-emitting elements 2 can be made difficult to change even when the light-emitting device 100 is mounted at a rotated position.

[0030] The light-emitting element 2 includes a semiconductor laminate. The semiconductor laminate includes, for example, a substrate such as sapphire or gallium nitride, an n-type semiconductor layer disposed on the substrate, a p-type semiconductor layer, and a light-emitting layer sandwiched between the n-type semiconductor layer and the p-type semiconductor layer. The light-emitting element 2 also includes an n-side electrode electrically connected to the n-type semiconductor layer and a p-side electrode electrically connected to the p-type semiconductor layer. The n-side electrode and the p-side electrode constitute a part of the upper surface of the light-emitting element 2. Note that the light-emitting element 2 does not necessarily include a substrate such as sapphire or gallium nitride. By doing so, it becomes easy to miniaturize the light-emitting element 2.

[0031] As the structure of the light-emitting layer, a structure having a single active layer such as a double heterostructure or a single quantum well structure (SQW) may be used, or a structure having a group of active layers such as a multiple quantum well structure (MQW) may be used. The light-emitting layer can emit visible light or ultraviolet light. The light-emitting layer can emit light from blue to red as visible light. As such a semiconductor laminate including the light-emitting layer, for example, In x Al y Ga 1-x-y N (0 ≦ x, 0 ≦ y, x + y ≦ 1) can be included. The semiconductor laminate can include at least one light-emitting layer capable of emitting the above-described light. For example, the semiconductor laminate may have a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may have a structure in which a structure including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in this order is repeated a plurality of times. When the semiconductor laminate includes a plurality of light-emitting layers, it may include light-emitting layers having different peak wavelengths, or may include light-emitting layers having the same peak wavelength. Note that the same peak wavelength means that there may be a variation of about several nm, for example. Such a combination of light-emitting layers can be appropriately selected. For example, when the semiconductor laminate includes two light-emitting layers, the light-emitting layers can be selected in combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. Further, the light-emitting layer may include a plurality of active layers having different peak wavelengths, or may include a plurality of active layers having the same peak wavelength.

[0032] The first light-emitting element 21 emits light including a first peak wavelength. The wavelength at which the output value of the light spectrum emitted from the first light-emitting element 21 is the highest is defined as the first peak wavelength. In the examples shown in FIGS. 1 to 3, the first light-emitting element 21 emits blue light. Note that the first light-emitting element 21 may emit green light, red light, or the like.

[0033] The second light-emitting element 22 emits light including a second peak wavelength different from the first peak wavelength. The wavelength at which the output value of the light spectrum emitted from the second light-emitting element 22 is the highest is defined as the second peak wavelength. In the examples shown in FIGS. 1 to 3, the second light-emitting element 22 emits green light. Note that the second light-emitting element 22 may emit blue light, red light, or the like.

[0034] The third light-emitting element 23 emits light including a third peak wavelength different from the first peak wavelength and the second peak wavelength. The wavelength at which the output value of the light spectrum emitted from the third light-emitting element 23 is the highest is defined as the third peak wavelength. In the examples shown in FIGS. 1 to 3, the third light-emitting element 23 emits red light. Note that the third light-emitting element 23 may emit blue light, green light, or the like.

[0035] (Integrated circuit 3) In the examples shown in FIGS. 1 to 3, the integrated circuit 3 is an electronic circuit such as a large-scale integration (LSI) circuit that drives the light-emitting element 2 to emit light. A drive signal of the integrated circuit 3 is supplied to the integrated circuit 3 via the second conductive portion 12. For example, an integrated circuit 3 having the following specifications and functions can be used. However, the specifications and functions of the integrated circuit 3 are not limited to the following. · 488 Hz, 12-bit PWM (Pulse Width Modulation) control · Temperature correction function · 8-bit luminance resolution (Red, Green, Blue) · Dimming function · Connection in a daisy chain manner of up to 4079 light-emitting devices such as LEDs (Light Emitting Diodes) is possible · Bidirectional communication and half-duplex communication are possible · Supports 16 multicast address groups · Built-in OSC (Oscillator) · Maximum length in the first direction D1: 2.29 mm · Maximum length in the second direction D2: 0.73 mm

[0036] The numbers attached inside the integrated circuit 3 in FIGS. 1 to 3 represent the pin numbers of the plurality of pins provided in the integrated circuit 3. The names, types, and descriptions of the pins corresponding to the pin numbers are shown in Table 1 below. Note that the chip select signal in Table 1 means a signal for selecting any one of the first light-emitting element 21, the second light-emitting element 22, or the third light-emitting element 23 provided in the light-emitting device 100.

[0037]

Table 1

[0038] The pin numbered 1 of the integrated circuit 3 is connected to the conductive portion 51 in FIG. 3. The pin numbered 2 of the integrated circuit 3 is connected to the conductive portion 52 in FIG. 3. The pin numbered 3 of the integrated circuit 3 is connected to the conductive portion 53 in FIG. 3. The pin numbered 4 of the integrated circuit 3 is connected to the second conductive portion 12 in FIG. 3. The pin numbered 5 of the integrated circuit 3 is connected to the conductive portion 54 in FIG. 3. The pin numbered 6 of the integrated circuit 3 is connected to the first conductive portion 11 in FIG. 3. The pin numbered 7 of the integrated circuit 3 is connected to the conductive portion 55 in FIG. 3. The pin numbered 8 of the integrated circuit 3 is connected to the first conductive portion 11 in FIG. 3. The pin numbered 9 of the integrated circuit 3 is connected to the first light-emitting element 21 in FIG. 3. The pin numbered 10 of the integrated circuit 3 is connected to the first conductive portion 11 in FIG. 3. The pin numbered 11 of the integrated circuit 3 is connected to the third light-emitting element 23 in FIG. 3. The pin numbered 12 of the integrated circuit 3 is connected to the first conductive portion 11 in FIG. 3. The pin numbered 13 of the integrated circuit 3 is connected to the conductive portion 56 in FIG. 3. The pin numbered 14 of the integrated circuit 3 is connected to the first conductive portion 11 in FIG. 3. The pin numbered 15 of the integrated circuit 3 is connected to the conductive portion 57 in FIG. 3. The pin numbered 16 of the integrated circuit 3 is connected to the third conductive portion 13 in FIG. 3. The pin numbered 17 of the integrated circuit 3 is connected to the conductive portion 58 in FIG. 3. The pin numbered 18 of the integrated circuit 3 is connected to the conductive portion 59 in FIG. 3. The pin numbered 19 of the integrated circuit 3 is connected to the conductive portion 60 in FIG. 3. Note that the positions of the pins are not particularly limited. For example, instead of the pin numbered 8 connected to the first conductive portion 11, a pin located between the pin numbered 8 and the pin numbered 9 may be connected to the first conductive portion 11.

[0039] [Second Embodiment] Next, with reference to FIG. 4, a light-emitting device according to the second embodiment will be described. FIG. 4 is a schematic top view showing an example of a light-emitting device 100a according to the second embodiment. Note that the same names and reference numerals as those in the already described embodiments indicate the same or similar members or configurations, and detailed descriptions thereof will be omitted as appropriate. This also applies to the descriptions of the embodiments shown hereinafter.

[0040] As shown in FIG. 4, the light-emitting device 100a according to the present embodiment is mainly different from the light-emitting device 100 according to the first embodiment in that it has a first reflecting member 7 that surrounds the first light-emitting element 21 in a top view. The first reflecting member 7 covers at least a part of each of the first outer edge 31, the third outer edge 33, and the fourth outer edge 34 of the integrated circuit 3. With this configuration, it becomes easier to reduce the peeling of the integrated circuit 3 from the support 1. The first reflecting member 7 may cover the second outer edge 32 of the integrated circuit 3, and as shown in FIG. 4, it may not cover the second outer edge 32 of the integrated circuit 3. For example, when the first reflecting member 7 covers the second outer edge 32 of the integrated circuit 3, it is necessary to increase the area of the support 1 disposed outside the second outer edge 32 to some extent, so the light-emitting device may be enlarged. In the present embodiment, since the first reflecting member 7 exposes the second outer edge 32, it becomes easier to reduce the area of the support 1 disposed outside the second outer edge 32. Thereby, the light-emitting device 100a can be miniaturized in the second direction D2.

[0041] In the light-emitting device 100a shown in FIG. 4, the maximum length L5 in the first direction D1 of the opening 71 defined by the lower end of the inner surface of the first reflecting member 7 is shorter than the maximum length L1 of the integrated circuit 3 in the first direction D1. With this configuration, since the length of the first reflecting member 7 in the first direction D1 can be shortened, in the light-emitting device 100a shown in FIG. 4, the light-emitting device 100a can be miniaturized in the first direction D1.

[0042] In the light-emitting device 100a shown in FIG. 4, in a top view, the outer edge of the integrated circuit 3 has a rectangular shape. The first reflecting member 7 covers two corner portions 35 of the integrated circuit 3 located on the first light-emitting element 21 side. Two corner portions 36 of the integrated circuit 3 located on the side opposite to the first light-emitting element 21 are exposed from the first reflecting member 7. By covering the two corner portions 35 of the integrated circuit 3 located on the first light-emitting element 21 side, the integrated circuit 3 can be prevented from peeling off from the support 1. Further, by exposing the two corner portions 36 of the integrated circuit 3 located on the side opposite to the first light-emitting element 21 from the first reflecting member 7, the volume of the first reflecting member 7 can be reduced. According to the reduction of the volume of the first reflecting member 7, the variation in the shape of the first reflecting member 7 can be reduced. As a result, in a plurality of light-emitting devices 100a, the variation in appearance among the light-emitting devices 100a can be reduced.

[0043] (The first reflecting member 7) The first reflecting member 7 is a member having reflectivity with respect to the light emitted by the light-emitting element 2. By providing the light-emitting device 100a with the first reflecting member 7, the light emitted from the light-emitting element 2 being absorbed by the support can be reduced. As a result, the light extraction efficiency of the light-emitting device 100a is improved. In this specification, having reflectivity means that the reflectivity with respect to the peak wavelength of the light-emitting element 2 is 50% or more. When the light-emitting device 100a includes a plurality of light-emitting elements 2, it is sufficient that the reflectivity with respect to the peak wavelength of at least one light-emitting element 2 is 50% or more.

[0044] The first reflecting member 7 includes, for example, a resin material as a base material and a light-reflective substance. As the resin material of the first reflecting member 7, a thermosetting resin, a thermoplastic resin, or the like can be used. In the case of a thermoplastic resin, a polyphthalamide resin, polybutylene terephthalate (PBT), an unsaturated polyester, or the like can be used. In the case of a thermosetting resin, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used. In particular, as the resin material, it is preferable to use a thermosetting resin such as an epoxy resin or a silicone resin, which is excellent in heat resistance and light resistance.

[0045] The first reflecting member 7 preferably contains a light-reflective substance in the resin material serving as the base material. As the light-reflective substance, it is preferable to use a member that is difficult to absorb the light from the light-emitting element 2 and has a large refractive index difference with respect to the resin material serving as the base material. As the light-reflective substance, for example, titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, and aluminum nitride can be used. The first reflecting member 7 may contain a light-absorbing substance in the resin material serving as the base material described above. As the light-absorbing substance, a dark-colored pigment such as carbon black can be used. The first reflecting member 7 may be made of, for example, an inorganic material containing boron nitride or alkali metal silicate. Further, it may contain titanium oxide or zirconium oxide.

[0046] The first reflecting member 7 may be in contact with or separated from the light-emitting element 2. When the first reflecting member 7 is in contact with the light-emitting element 2, it becomes easier to increase the area of the upper surface of the support 1 covered by the first reflecting member 7. Thereby, it becomes easier to reduce the absorption of the light from the light-emitting element 2 by the support 1. Also, when the first reflecting member 7 is separated from the light-emitting element 2, it becomes easier to extract the light from the side surface of the light-emitting element 2.

[0047] As illustrated in FIG. 4, one first reflecting member 7 may surround the entire circumference of the light-emitting element 2. However, a plurality of first reflecting members 7 may be positioned to surround the light-emitting element 2. When one first reflecting member 7 surrounds the entire circumference of the light-emitting element 2, it becomes easier to increase the area of the upper surface of the support 1 covered by the first reflecting member 7. Thereby, it becomes easier to reduce the absorption of the light from the light-emitting element 2 by the support 1. Also, when a plurality of first reflecting members 7 surround the light-emitting element, it becomes easier to reduce the volume of each of the plurality of first reflecting members 7. Thereby, it becomes easier to reduce the variation in the shape of the plurality of first reflecting members 7, so it becomes easier to improve the yield of the light-emitting device 100a.

[0048] [Third Embodiment] Next, with reference to FIGS. 5 to 7, a light-emitting device according to a third embodiment will be described. FIG. 5 is a schematic top view showing an example of a light-emitting device 100b according to the third embodiment. FIG. 6 is a schematic perspective view showing an example of the light-emitting device 100b cut along line VI-VI in FIG. 5. FIG. 7 is a schematic cross-sectional view along line VII-VII in FIG. 5.

[0049] As shown in FIGS. 5 and 6, the light-emitting device 100b according to the present embodiment is mainly different from the light-emitting device 100a according to the second embodiment in that it has a covering member 9 that covers the outer surfaces of the first reflecting member 7 and the integrated circuit 3 in a top view. In the example shown in FIG. 5, the outer surface 30 indicates the outer surface of the integrated circuit 3, and the outer surface 70 indicates the outer surface of the first reflecting member 7. Also, in the examples shown in FIGS. 5 and 6, the light-emitting device 100b has a second reflecting member 8 that covers the side surface of the first light-emitting element 21 and the upper surface of the support 1. In the present embodiment, by covering the outer surfaces of the first reflecting member 7 and the integrated circuit 3 with the covering member 9, the application of an external force to the first reflecting member 7 and the integrated circuit 3 can be reduced, and the first reflecting member 7 and the integrated circuit 3 can be protected from external forces.

[0050] A cross-section perpendicular to the first surface 101 passing through the first light-emitting element 21 and the second light-emitting element 22 is defined as the first cross-section. As shown in FIG. 7, in the second reflecting member 8, in the first cross-section, a first height TH11, which is the minimum height of the second reflecting member 8 located between the first light-emitting element 21 and the second light-emitting element 22, is higher than a second height TH12, which is the minimum height of the second reflecting member 8 located outside the first light-emitting element 21. Also, the first height TH11 is higher than a third height TH13, which is the minimum height of the second reflecting member 8 located outside the second light-emitting element 22. Thereby, the absorption of the light emitted from the first light-emitting element 21 by the second light-emitting element 22 can be reduced, and the absorption of the light emitted from the second light-emitting element 22 by the first light-emitting element 21 can be reduced. In the present specification, being located outside the light-emitting element means being located such that the distance to the outer edge of the light-emitting device, which is closer to the light-emitting element in the lateral direction, is shorter than that of the light-emitting element.

[0051] As shown in FIG. 7, the first element height CH1, which is the maximum height of the first light-emitting element 21, is preferably 0.9 times or more and 1.1 times or less of the second element height CH2, which is the maximum height of the second light-emitting element 22. By doing so, it becomes easier to reduce the non-overlapping portion between the first light-emitting element 21 and the second light-emitting element 22 in the third direction D3. As a result, it becomes easier to improve the color mixing property of the light-emitting device 100. The difference between the first element height CH1 and the second element height CH2 is preferably 30 μm or less.

[0052] (Second reflecting member 8) As described above, the second reflecting member 8 is a member that covers the side surface of the first light-emitting element 21 and the upper surface of the support 1. The second reflecting member 8 exposes at least a part of the upper surface of the first light-emitting element. The second reflecting member 8 can include a plurality of reflecting particles and a base material made of a light-transmissive material. For the reflecting particles, for example, the same light-reflecting substance as the first reflecting member 7 can be used. For the base material of the second reflecting member 8, for example, the same resin material as the first reflecting member 7 can be used. The second reflecting member 8 may not have the reflecting particles settled, or may have the reflecting particles settled. In order to settle the reflecting particles, natural sedimentation or centrifugal sedimentation can be used. Centrifugal sedimentation can be performed, for example, using a centrifuge. Further, the second reflecting member 8 may be made of an inorganic material containing, for example, boron nitride or alkali metal silicate. Furthermore, it may contain titanium oxide or zirconium oxide.

[0053] (Coating member 9) As described above, the coating member 9 is a member that covers the outer surfaces of the first reflecting member 7 and the integrated circuit 3 in a top view. The coating member 9 is configured to include, for example, a light-reflective material that blocks light by reflecting light. The coating member 9 functions to return the light emitted from the light-emitting element 2 and reaching the coating member 9 through the first reflecting member 7 back into the first reflecting member 7. Thereby, the light extraction efficiency from the light-emitting device 100b can be improved.

[0054] Examples of the resin used for the base material of the covering member 9 include thermoplastic resins and thermosetting resins. In the case of thermoplastic resins, for example, polyamide resins, polyphthalamide resins, liquid crystal polymers, polybutylene terephthalate (PBT), unsaturated polyesters, etc. can be used. In the case of thermosetting resins, for example, epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, etc. can be used.

[0055] The covering member 9 can be formed using a resin material in which particles of a light-reflective substance are contained as a filler in the base material to impart light reflectivity. As the light-reflective substance, for example, titanium oxide, aluminum oxide, zirconium oxide, magnesium oxide, etc. can be used. The content of the filler, which is the light-reflective substance in the covering member 9, may be 5% by mass or more and 60% by mass or less, preferably 10% by mass or more and 50% by mass or less. The average particle size of the filler is preferably about 0.5 μm or more and 15 μm or less. By setting the size of the filler within this range, the covering member 9 can obtain at least one of good strength and light reflectivity. The covering member 9 may be composed of a member that absorbs light. The covering member 9 may contain a light-absorbing substance in the resin material serving as the above base material. As the light-absorbing substance, dark-colored pigments such as carbon black can be used.

[0056] The covering member 9 can be formed by using a resin material in which at least one of light reflectivity and strength is imparted by containing a filler in the base material, by a molding method such as a transfer molding method, an injection molding method, a compression molding method, etc. using a mold, or a coating method such as a screen printing method.

[0057] (Second covering member 10) The second covering member 10 in Fig. 7 is a member that covers at least a part of the upper surface of the first light-emitting element 21 and at least a part of the upper surface of the second light-emitting element 22. Thereby, the upper surfaces of the first light-emitting element 21 and the second light-emitting element 22 can be protected from external forces and the like. In the present embodiment, the upper surface of the second covering member 10 is the light-emitting surface of the light-emitting device 100.

[0058] As the base material of the second covering member 10, the same material as the base material of the covering member 9 can be used. The second covering member 10 may contain a plurality of reflective particles. Since the second covering member 10 contains a plurality of reflective particles, the light emitted from the upper surface of the first light-emitting element 21 and the light emitted from the upper surface of the second light-emitting element 22 are likely to diffuse within the second covering member 10, so that the color mixing property of the light-emitting device 100 is likely to be improved. Note that the second covering member 10 may contain a wavelength conversion member.

[0059] [Fourth Embodiment] Next, with reference to FIG. 8, the light-emitting unit according to the fourth embodiment will be described. FIG. 8 is a schematic diagram showing an example of the system configuration of the light-emitting unit 200 according to the fourth embodiment.

[0060] The light-emitting unit 200 shown in FIG. 8 includes a plurality of the above-described light-emitting devices 100. The plurality of light-emitting devices 100 are arranged side by side in the first direction D1. In the example shown in FIG. 8, the light-emitting unit 200 includes a plurality of light-emitting devices 100 including a first light-emitting device 100-1, a second light-emitting device 100-2, and a third light-emitting device 100-3. In the present embodiment, by arranging the plurality of light-emitting devices 100 side by side in the first direction D1, the light-emitting unit 200 including the plurality of light-emitting devices 100 can be miniaturized in the second direction D2. Note that the light-emitting unit 200 may include a plurality of light-emitting devices 100a or a plurality of light-emitting devices 100b, and may include a combination of one or more light-emitting devices 100, one or more light-emitting devices 100a, or one or more light-emitting devices 100b.

[0061] Each of the plurality of light-emitting devices 100 shown in FIG. 8 incorporates an SPI (Serial Peripheral Interface) and can communicate with a host controller via the SPI. The SPI is composed of signal lines including four systems: chip select, clock, and data lines (SDI and SDO). In the SPI, a clock signal is transmitted from the main host controller to the light-emitting device 100 as a replica, and the replica transmits or receives data in synchronization with the clock signal from the main. The main can control the plurality of light-emitting devices 100. The light-emitting unit 200 connects the plurality of light-emitting devices 100 in a daisy chain. In the daisy chain, one of the light-emitting devices 100 is connected to the main, and the light-emitting device 100 connected to the main and the other plurality of light-emitting devices 100 are connected in series. The light-emitting device 100 transmits data to the next light-emitting device 100 while receiving the data transmitted from the main. Each of the plurality of light-emitting devices 100 can exchange data with the previous light-emitting device 100 and the next light-emitting device 100. In the light-emitting unit 200, by connecting in a daisy chain, a single main such as a microcontroller can control the plurality of light-emitting devices 100.

[0062] In the light-emitting unit 200 shown in FIG. 8, the second conductive portion 12 is connected to an input terminal that inputs an electrical signal from an adjacent light-emitting device 100, and the third conductive portion 13 is connected to an output terminal that outputs an electrical signal to an adjacent light-emitting device 100. In other words, in the light-emitting unit 200 shown in FIG. 8, the plurality of light-emitting devices 100 are connected in a daisy chain.

[0063] More specifically, in the first light-emitting device 100-1 shown in FIG. 8, the conductive portion 60 inputs the data SDO_IN from the second light-emitting device 100-2. Also, in the first light-emitting device 100-1, the third conductive portion 13 outputs the chip select signal CSX_OUT, the conductive portion 58 outputs the clock signal SCLK_OUT, and the conductive portion 59 outputs the data signal SDI_OUT to the adjacent second light-emitting device 100-2, respectively.

[0064] In the second light-emitting device 100-2 shown in FIG. 8, the second conductive portion 12 inputs the chip select signal CSX_IN, the conductive portion 53 inputs the clock signal SCLK_IN, and the conductive portion 52 inputs the data signal SDI_IN from the adjacent first light-emitting device 100-1, respectively. Further, in the second light-emitting device 100-2, the conductive portion 51 outputs the data SDO_OUT to the adjacent first light-emitting device 100-1. Further, in the second light-emitting device 100-2, the third conductive portion 13 outputs the chip select signal CSX_OUT, the conductive portion 58 outputs the clock signal SCLK_OUT, and the conductive portion 59 outputs the data signal SDI_OUT to the adjacent third light-emitting device 100-3, respectively.

[0065] In the third light-emitting device 100-3 shown in FIG. 8, the second conductive portion 12 inputs the chip select signal CSX_IN, the conductive portion 53 inputs the clock signal SCLK_IN, and the conductive portion 52 inputs the data signal SDI_IN from the adjacent second light-emitting device 100-2, respectively. Further, in the third light-emitting device 100-3, the conductive portion 51 outputs the data SDO_OUT to the adjacent second light-emitting device 100-2.

[0066] By connecting a plurality of light-emitting devices 100 in a daisy chain, in the light-emitting unit 200 shown in FIG. 8, the light-emitting unit 200 including a plurality of light-emitting devices 100 can be miniaturized in the second direction D2, and wiring or connection management of the plurality of light-emitting devices 100 can be efficiently performed.

[0067] In the light-emitting unit 200 shown in FIG. 8, the support 1 included in each of the plurality of light-emitting devices 100 includes a fourth conductive portion located on one side of the integrated circuit 3 in the first direction D1 and a fifth conductive portion located on the other side of the integrated circuit 3 in the first direction D1. In the example shown in FIG. 8, "one side" is the left side in a top view, and "the other side" is the right side in a top view. Each of the conductive portion 51, the conductive portion 52, the conductive portion 53, and the second conductive portion 12 shown in FIG. 3 corresponds to the fourth conductive portion. Further, each of the conductive portion 60, the conductive portion 59, the conductive portion 58, and the third conductive portion 13 shown in FIG. 3 corresponds to the fifth conductive portion.

[0068] Each of the fourth conductive part and the fifth conductive part can either input or output an electrical signal. In the light-emitting unit 200 shown in FIG. 8, by including the fourth conductive part and the fifth conductive part, without increasing the size of the light-emitting unit 200 in the second direction D2, the number of input / outputs of electrical signals to each of the plurality of light-emitting devices 100 can be increased, and the degree of freedom in controlling each of the plurality of light-emitting devices 100 can be raised.

[0069] [Fifth Embodiment] Next, a light-emitting device according to the fifth embodiment will be described. FIG. 9 is a schematic top view of a light-emitting device 100c according to the fifth embodiment.

[0070] The light-emitting device 100c according to the present embodiment is different from the light-emitting device 100 according to the first embodiment in that it has an integrated circuit 3c, a first via 6c1, a second via 6c2, and a third via 6c3. Each of the first via 6c1, the second via 6c2, and the third via 6c3 is a via provided on the support 1 and electrically connected to the first conductive part 11.

[0071] The first via 6c1, the second via 6c2, and the third via 6c3 are located between the first light-emitting element 21 and the integrated circuit 3c in the second direction D2. With this configuration, the heat generated from each of the first light-emitting element 21 and the integrated circuit 3 can be dissipated to an external substrate or the like on which the support 1 is disposed through each of the first via 6c1, the second via 6c2, and the third via 6c3. As a result, in the light-emitting device 100c, the heat dissipation performance of the light-emitting device 100c is improved.

[0072] The arrangement of some pins of the integrated circuit 3c is different from that of the integrated circuit 3 of the light-emitting device 100 according to the first embodiment. In FIG. 9, the numbers attached inside the integrated circuit 3c represent the pin numbers of the plurality of pins provided in the integrated circuit 3c. The names, types, and descriptions of the pins corresponding to the pin numbers are shown in Table 2 below.

[0073]

Table 2

[0074] As shown in Table 2, the pin numbered 10 is the power ground of the first light-emitting element 21. The pin numbered 12 is the power ground of the third light-emitting element 23. The pin numbered 14 is the power ground of the second light-emitting element 22. In the integrated circuit 3c, these pins are different from the integrated circuit 3 included in the light-emitting device 100 according to the first embodiment.

[0075] In the integrated circuit 3c, other pins are arranged between the pin numbered 9 which is the output pin to the first light-emitting element 21 and the pin numbered 11 which is the output pin to the third light-emitting element 23. For example, the vicinity of the output pin for controlling the current to the light-emitting element is likely to experience a temperature rise. By arranging other pins between the output pin to the first light-emitting element 21 and the output pin to the third light-emitting element 23, the distance between these output pins becomes longer compared to the case where the output pin to the first light-emitting element 21 and the output pin to the third light-emitting element 23 are adjacent to each other. As a result, the temperature rise of the integrated circuit 3c is likely to be reduced.

[0076] In the integrated circuit 3c, the pin numbered 10 which is the power ground pin of the first light-emitting element 21 is arranged adjacent to the pin numbered 9 which is the output pin to the first light-emitting element 21. As a result, in the light-emitting device 100c, the external noise applied to each of the output pin to the first light-emitting element 21 and the power ground pin of the first light-emitting element 21 becomes comparable. As a result, the external noise is canceled, the influence of the external noise is likely to be reduced, and the internal noise applied to the output pin to the first light-emitting element 21 is likely to be reduced.

[0077] In the light-emitting device 100c, the minimum distance Lg between the geometric center 220 of the second light-emitting element 22 in the first direction D1 and the pin of pin number 13 which is an output pin to the second light-emitting element 22 is longer than the minimum distance Lb between the geometric center 210 of the first light-emitting element 21 in the first direction D1 and the pin of pin number 9 which is an output pin to the first light-emitting element 21. Thereby, the distance between the second light-emitting element 22 which has a higher current value and is more likely to cause a temperature rise compared with the first light-emitting element 21 and the output pin to the second light-emitting element 22 becomes longer compared with the distance between the first light-emitting element 21 and the output pin to the first light-emitting element 21. As a result, the temperature rise of the light-emitting device 100c is likely to be reduced. Note that the light-emitting device 100c according to the present embodiment may be combined with the light-emitting device 100a according to the second embodiment or the light-emitting device 100b according to the third embodiment.

[0078] [Sixth Embodiment] Next, the light-emitting unit according to the sixth embodiment will be described. The light-emitting unit according to the sixth embodiment is different from the light-emitting unit 200 according to the fourth embodiment in that it includes a plurality of light-emitting devices 100 and a light guide member disposed above the plurality of light-emitting devices 100 and guiding the light emitted from the plurality of light-emitting devices 100.

[0079] (First Example) FIG. 10 is a schematic top view showing a light-emitting unit 200a according to the first example of the sixth embodiment. FIG. 11 is a schematic cross-sectional view taken along line XI-XI in FIG. 10.

[0080] The light-emitting unit 200a includes a substrate 211, a first light-emitting device 100-1, a second light-emitting device 100-2, a third light-emitting device 100-3, a fourth light-emitting device 100-4, a fifth light-emitting device 100-5, and a light guide member 220a. The light-emitting unit 200a is a light-emitting unit used in, for example, ambient lighting.

[0081] In the first example shown in FIG. 10, the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 are arranged on the upper surface 212 of the substrate 211 side by side in the first direction D1. Any one of the light-emitting device 100, the light-emitting device 100a, the light-emitting device 100b, or the light-emitting device 100c can be applied to the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5. For convenience of explanation, hereinafter, when the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 are not distinguished, they may be collectively referred to as the light-emitting device 100.

[0082] The light guide member 220a is a member that allows the light emitted from the plurality of light-emitting devices 100 to enter the inside of the light guide member 220a, guides the light inside the light guide member 220a, and then emits the light from the inside of the light guide member 220a to the outside. The light guide member 220a has a substantially rectangular outer shape with the first direction D1 in which the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, and the fourth light-emitting device 100-4 are arranged side by side as the longitudinal direction in a top view. The light guide member 220a has a transmittance of 60% or more with respect to the light emitted from the light-emitting device 100.

[0083] The light guide member 220a includes a first light guide portion 220a-1, a second light guide portion 220a-2, a third light guide portion 220a-3, a fourth light guide portion 220a-4, a fifth light guide portion 220a-5, and a light emission portion 224. The first light guide portion 220a-1 is disposed above the first light-emitting device 100-1 and guides the light from the first light-emitting device 100-1. The second light guide portion 220a-2 is disposed above the second light-emitting device 100-2 and guides the light from the second light-emitting device 100-2. The third light guide portion 220a-3 is disposed above the third light-emitting device 100-3 and guides the light from the third light-emitting device 100-3. The fourth light guide portion 220a-4 is disposed above the fourth light-emitting device 100-4 and guides the light from the fourth light-emitting device 100-4. The fifth light guide portion 220a-5 is disposed above the fifth light-emitting device 100-5 and guides the light from the fifth light-emitting device 100-5.

[0084] The first light guide part 220a-1, the second light guide part 220a-2, the third light guide part 220a-3, the fourth light guide part 220a-4, and the fifth light guide part 220a-5 each include a light incident part 221a, a first reflection part 222a, and a second reflection part 223a.

[0085] The light incident part 221a is a part through which the light from the light emitting device 100 enters the inside of the light guide member 220a. Further, the light incident part 221a is a part that forms a concave part that is concave upward in a sectional view along the first direction D1 and the third direction shown in FIG. 11. The light incident part 221a has a substantially rectangular outer shape in a top view shown in FIG. 10.

[0086] The first reflection part 222a and the second reflection part 223a are parts that reflect upward a part of the light incident from the light incident part 221a and that has reached the first reflection part 222a and the second reflection part 223a. The first reflection part 222a and the second reflection part 223a are arranged side by side with the light incident part 221a interposed therebetween in the first direction D1.

[0087] A part of the light guided through the light incident part 221a inside the light guide member 220a is emitted from the light guide member 220a through the light emission part 224. Another part of the light transmitted through the light incident part 221a inside the light guide member 220a is reflected by the first reflection part 222a or the second reflection part 223a and then emitted from the light guide member 220a through the light emission part 224. The light emission part 224 is a common light emission part in each of the first light guide part 220a-1, the second light guide part 220a-2, the third light guide part 220a-3, the fourth light guide part 220a-4, and the fifth light guide part 220a-5.

[0088] In the light emitting unit 200a, by guiding the light emitted from the first light emitting device 100-1, the second light emitting device 100-2, the third light emitting device 100-3, the fourth light emitting device 100-4, and the fifth light emitting device 100-5 by the light guide member 220a, the light distribution of the light emitted from the light guide member 220a can be controlled.

[0089] (Second example) FIG. 12 is a schematic top view showing a light-emitting unit 200b according to a second example of the sixth embodiment. FIG. 13 is a schematic cross-sectional view taken along line XIII-XIII in FIG. 12. In the top view of FIG. 12, some illustrations of the configuration corresponding to the cross-sectional view of FIG. 13 may be omitted in order to avoid excessive complication of the drawing.

[0090] The light-emitting unit 200b includes a substrate 211, a first light-emitting device 100-1, a second light-emitting device 100-2, a third light-emitting device 100-3, a fourth light-emitting device 100-4, a fifth light-emitting device 100-5, and a light guide member 220b. The light-emitting unit 200b is a light-emitting unit used as a backlight for a liquid crystal display panel, an organic EL (Electro Luminescence) display panel, or the like.

[0091] In the second example shown in FIG. 11, the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5 are arranged on the upper surface 212 of the substrate 211 side by side in the first direction D1. Any one of the light-emitting device 100, the light-emitting device 100a, the light-emitting device 100b, or the light-emitting device 100c can be applied to the first light-emitting device 100-1, the second light-emitting device 100-2, the third light-emitting device 100-3, the fourth light-emitting device 100-4, and the fifth light-emitting device 100-5.

[0092] The light guide member 220b includes a first light guide member 220b-1, a second light guide member 220b-2, a third light guide member 220b-3, a fourth light guide member 220b-4, and a fifth light guide member 220b-5.

[0093] The first light guide member 220b-1 is disposed above the first light-emitting device 100-1. The first light guide member 220b-1 is a member that causes the light emitted from the first light-emitting device 100-1 to enter the inside of the first light guide member 220b-1, guides the light inside the first light guide member 220b-1, and then emits the light from the inside of the first light guide member 220b-1 to the outside.

[0094] The second light guide member 220b-2 is disposed above the second light emitting device 100-2. The second light guide member 220b-2 is a member that causes the light emitted from the second light emitting device 100-2 to enter the inside of the second light guide member 220b-2, guides the light inside the second light guide member 220b-2, and then emits the light from the inside of the second light guide member 220b-2 to the outside.

[0095] The third light guide member 220b-3 is disposed above the third light emitting device 100-3. The third light guide member 220b-3 is a member that causes the light emitted from the third light emitting device 100-3 to enter the inside of the third light guide member 220b-3, guides the light inside the third light guide member 220b-3, and then emits the light from the inside of the third light guide member 220b-3 to the outside.

[0096] The fourth light guide member 220b-4 is disposed above the fourth light emitting device 100-4. The fourth light guide member 220b-4 is a member that causes the light emitted from the fourth light emitting device 100-4 to enter the inside of the fourth light guide member 220b-4, guides the light inside the fourth light guide member 220b-4, and then emits the light from the inside of the fourth light guide member 220b-4 to the outside.

[0097] The fifth light guide member 220b-5 is disposed above the fifth light emitting device 100-5. The fifth light guide member 220b-5 is a member that causes the light emitted from the fifth light emitting device 100-5 to enter the inside of the fifth light guide member 220b-5, guides the light inside the fifth light guide member 220b-5, and then emits the light from the inside of the fifth light guide member 220b-5 to the outside.

[0098] The first light guide member 220b-1, the second light guide member 220b-2, the third light guide member 220b-3, the fourth light guide member 220b-4, and the fifth light guide member 220b-5 each have a substantially circular outer shape in a top view and have a transmittance of 60% or more with respect to the light emitted from the light emitting device 100. Further, the first light guide member 220b-1, the second light guide member 220b-2, the third light guide member 220b-3, the fourth light guide member 220b-4, and the fifth light guide member 220b-5 each include a light incident portion 221b, a first light emission portion 222b, and a second light emission portion 223b.

[0099] The light incident portion 221b is a substantially flat portion through which the light from the light emitting device 100 enters the inside of the light guide member 220b. The light incident portion 221b has a substantially circular outer shape in a top view.

[0100] The first light emitting portion 222b is a curved surface portion through which a part of the light emitted from the light emitting device 100 and transmitted through the inside of the light guide member 220b exits the light guide member 220b. The first light emitting portion 222b has a substantially circular ring shape in a top view.

[0101] The second light emitting portion 223b is a substantially flat portion through which a part of the light emitted from the light emitting device 100 and transmitted through the inside of the light guide member 220b exits the light guide member 220b. The second light emitting portion 223b has a substantially circular outer shape in a top view.

[0102] In the light emitting unit 200b, by guiding the light emitted from the first light emitting device 100-1, the second light emitting device 100-2, the third light emitting device 100-3, the fourth light emitting device 100-4, and the fifth light emitting device 100-5 by the light guide member 220b, the light distribution of the light emitted from the light guide member 220b can be controlled.

[0103] The light guide member included in the light emitting unit according to the sixth embodiment is not limited to the light guide member 220a shown in the first example and the light guide member 220b shown in the second example. The light guide member included in the light emitting unit according to the sixth embodiment may be, for example, one or more convex lenses, one or more concave lenses, one or more meniscus lenses, one or more Fresnel lenses, one or more diffractive lenses, one or more cylindrical lenses, or a combination thereof.

[0104] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope described in the claims.

[0105] The ordinal numbers, quantities, and other numbers used in the description of the embodiments are all examples for specifically describing the technology of the present disclosure, and the present disclosure is not limited to the exemplified numbers. In addition, the connection relationships between components are examples for specifically describing the technology of the present disclosure, and the connection relationships for realizing the functions of the present disclosure are not limited thereto.

[0106] Since the light-emitting device and the light-emitting unit of the present disclosure can be miniaturized, for example, they can be suitably used as light-emitting devices for the interior decoration of vehicles such as automobiles. However, the light-emitting device and the light-emitting unit of the present disclosure are not limited to being used for the interior decoration of vehicles, and can be used for various applications.

[0107] Aspects of the present disclosure are as follows, for example. <Item 1> A light-emitting device having a support on which a first conductive portion, a second conductive portion, and a third conductive portion are arranged apart from each other, a first light-emitting element arranged on the first conductive portion, and an integrated circuit electrically connected to the first light-emitting element, at least a part of the first conductive portion being located between the second conductive portion and the third conductive portion in a first direction, the integrated circuit being arranged side by side with the first light-emitting element in a second direction orthogonal to the first direction, and a maximum length of the integrated circuit in the second direction being shorter than a maximum length of the integrated circuit in the first direction. <Item 2> The light-emitting device according to <Item 1>, wherein the integrated circuit is located on the first conductive portion. <Item 3> The light-emitting device according to <Item 2>, wherein a maximum length in the first direction of a first portion of the first conductive portion including a region overlapping with the first light-emitting element is shorter than a maximum length in the first direction of a second portion of the first conductive portion including a region overlapping with the integrated circuit. <Item 4> The light-emitting device includes a plurality of first wires connected to the integrated circuit. In a top view, the integrated circuit includes a first outer edge facing the first light-emitting element, a second outer edge located on the opposite side of the first outer edge, a third outer edge connected to each of the first outer edge and the second outer edge, and a fourth outer edge located on the opposite side of the third outer edge. The plurality of first wires are located away from the second outer edge in a top view, and the light-emitting device is the light-emitting device according to any one of <Item 1> to <Item 3>. <Item 5> The number of the first wires overlapping the first outer edge in a top view is greater than the total number of the first wires overlapping the third outer edge and the fourth outer edge in a top view, and the light-emitting device is the light-emitting device according to <Item 4>. <Item 6> The plurality of first wires include second wires connecting the integrated circuit and the first conductive portion. The second wires are connected to a third portion of the first conductive portion located between the first light-emitting element and the integrated circuit in the second direction, and the light-emitting device is the light-emitting device according to <Item 4>. <Item 7> The support has vias connected to the first conductive portion. The vias are located between the first light-emitting element and the integrated circuit in the second direction, and the light-emitting device is the light-emitting device according to <Item 6>. <Item 8> The minimum distance between the integrated circuit and the vias in the second direction is shorter than the minimum distance between the integrated circuit and a connection portion where the second wires are connected to the first conductive portion in the second direction, and the light-emitting device is the light-emitting device according to <Item 7>. <Item 9> The light-emitting device further includes a second light-emitting element and a third light-emitting element. The emission peak wavelength of the first light-emitting element is 430 nm or more and 480 nm or less, the emission peak wavelength of the second light-emitting element is 500 nm or more and 580 nm or less, and the emission peak wavelength of the third light-emitting element is 600 nm or more and 780 nm or less, and the light-emitting device is the light-emitting device according to any one of <Item 1> to <Item 8>. <Item 10> The minimum distance between the second light-emitting element and the integrated circuit in the second direction is longer than the minimum distance between the first light-emitting element and the integrated circuit in the second direction, and the light-emitting device is the light-emitting device according to <Item 9>. <Item 11> In a top view, it has a first reflecting member surrounding the first light-emitting element, and the first reflecting member covers at least a part of each of the first outer edge, the third outer edge, and the fourth outer edge of the integrated circuit. The light-emitting device according to <Item 7>. <Item 12> The maximum length in the first direction of the opening defined by the lower end of the inner surface of the first reflecting member is shorter than the maximum length of the integrated circuit in the first direction. The light-emitting device according to <Item 11>. <Item 13> In a top view, the outer edge of the integrated circuit has a rectangular shape, the first reflecting member covers two corner portions of the integrated circuit located on the first light-emitting element side, and two corner portions of the integrated circuit located on the side opposite to the first light-emitting element are exposed from the first reflecting member. The light-emitting device according to <Item 11> or <Item 12>. <Item 14> Further having a covering member covering the outer surfaces of the first reflecting member and the integrated circuit respectively. The light-emitting device according to any one of <Items 11> to <Item 13>. <Item 15> Having a plurality of the light-emitting devices according to any one of <Items 1> to <Item 14>, and the plurality of light-emitting devices are arranged side by side in the first direction. A light-emitting unit. <Item 16> The second conductive portion is connected to an input terminal for inputting an electrical signal from an adjacent light-emitting device, and the third conductive portion is connected to an output terminal for outputting an electrical signal to an adjacent light-emitting device. The light-emitting unit according to <Item 15>. <Item 17> The support body included in each of the plurality of light-emitting devices further includes a fourth conductive portion located on one side of the integrated circuit in the first direction and a fifth conductive portion located on the other side of the integrated circuit in the first direction. The light-emitting unit according to <Item 15> or <Item 16>.

Explanation of Reference Numerals

[0108] 1 Support body 101 First surface 11 First conductive portion 111 First portion 112 Second portion 113 Part 3 12 Second conductive part 13 Third conductive part 2 Light-emitting element 21 First light-emitting element 210 Geometric center of the first light-emitting element 22 Second light-emitting element 220 Geometric center of the second light-emitting element 23 Third light-emitting element 3 Integrated circuit 30 Outer surface of the integrated circuit 31 First outer edge 32 Second outer edge 33 Third outer edge 34 Fourth outer edge 35, 36 Corners 4 First wire 5 Second wire 6 Via 6c1 First via 6c2 Second via 6c3 Third via 7 First reflecting member 70 Outer surface of the first reflecting member 71 Opening 8 Second reflecting member 9 Coating member 10 Second coating member 51 - 60 Conductive parts 100, 100a, 100b Light-emitting devices 100 - 1 First light-emitting device 100 - 2 Second light-emitting device 100 - 3 Third light-emitting device 100 - 4 Fourth light-emitting device 100 - 5 Fifth light-emitting device 200, 200a, 200b Light-emitting units 211 Substrate 212 Upper surface 220a, 220b Light guide members 220a - 1 First light guide part 220a - 2 Second light guide part 220a - 3 Third light guide part 220a - 4 Fourth light guide part 220a - 5 Fifth light guide part 220b-1 First light guide member 220b-2 Second light guide member 220b-3 Third light guide member 220b-4 Fourth light guide member 220b-5 Fifth light guide member 221a, 221b Light incident part 222a First reflection part 222b First light emission part 223a Second reflection part 223b Second light emission part 224 Light emission part a Connection part a51 Connection part where the second wire is connected to the first conductive part CH1 First element height CH2 Second element height D1 First direction D2 Second direction D3 Third direction e1 Minimum distance between the integrated circuit and the via in the second direction e2 Minimum distance between the connection part and the integrated circuit e3 Minimum distance between the second light emitting element and the integrated circuit in the second direction e4 Minimum distance between the first light emitting element and the integrated circuit in the second direction L1 Maximum length of the integrated circuit in the first direction L2 Maximum length of the integrated circuit in the second direction L3 Maximum length in the first direction of the first part L4 Maximum length in the first direction of the second part L5 Maximum length in the first direction of the opening TH11 First height TH12 Second height TH13 Third height

Claims

1. A support in which a first conductive portion, a second conductive portion, and a third conductive portion are arranged apart from each other, a first light-emitting element disposed on the first conductive portion, an integrated circuit electrically connected to the first light-emitting element, having, at least a part of the first conductive portion is located between the second conductive portion and the third conductive portion in a first direction, the integrated circuit is arranged side by side with the first light-emitting element in a second direction orthogonal to the first direction, A light-emitting device, wherein a maximum length of the integrated circuit in the second direction is shorter than a maximum length of the integrated circuit in the first direction.

2. The light-emitting device according to claim 1, wherein the integrated circuit is located on the first conductive portion.

3. The light-emitting device according to claim 2, wherein a maximum length in the first direction of a first portion of the first conductive portion including a region overlapping with the first light-emitting element is shorter than a maximum length in the first direction of a second portion of the first conductive portion including a region overlapping with the integrated circuit.

4. Comprising a plurality of first wires connected to the integrated circuit, in a top view, the integrated circuit includes a first outer edge facing the first light-emitting element, a second outer edge located on the opposite side of the first outer edge, a third outer edge connected to each of the first outer edge and the second outer edge, and a fourth outer edge located on the opposite side of the third outer edge, The light-emitting device according to claim 1, wherein the plurality of first wires are located away from the second outer edge in a top view.

5. The light-emitting device according to claim 4, wherein the number of the first wires overlapping the first outer edge in a top view is larger than the total number of the first wires overlapping the third outer edge and the fourth outer edge in a top view.

6. The plurality of first wires include second wires connecting the integrated circuit and the first conductive portion, The light-emitting device according to claim 4, wherein the second wire is connected to a third portion of the first conductive portion located between the first light-emitting element and the integrated circuit in the second direction.

7. The support has vias connected to the first conductive portion, The light-emitting device according to claim 6, wherein the vias are located between the first light-emitting element and the integrated circuit in the second direction.

8. The light-emitting device according to claim 7, wherein a minimum distance between the integrated circuit and the via in the second direction is shorter than a minimum distance between the integrated circuit and a connection portion where the second wire is connected to the first conductive portion in the second direction.

9. Further comprising a second light-emitting element and a third light-emitting element, wherein a peak emission wavelength of the first light-emitting element is 430 nm or more and 480 nm or less, wherein a peak emission wavelength of the second light-emitting element is 500 nm or more and 580 nm or less, The light-emitting device according to claim 1, wherein a peak emission wavelength of the third light-emitting element is 600 nm or more and 780 nm or less.

10. The light-emitting device according to claim 9, wherein a minimum distance between the second light-emitting element and the integrated circuit in the second direction is longer than a minimum distance between the first light-emitting element and the integrated circuit in the second direction.

11. In a top view, having a first reflecting member surrounding the first light-emitting element, The light-emitting device according to claim 7, wherein the first reflecting member covers at least a part of each of the first outer edge, the third outer edge, and the fourth outer edge of the integrated circuit.

12. The light-emitting device according to claim 11, wherein a maximum length in the first direction of an opening defined by a lower end of an inner surface of the first reflecting member is shorter than a maximum length of the integrated circuit in the first direction.

13. In a top view, an outer edge of the integrated circuit has a rectangular shape, The first reflecting member covers two corner portions of the integrated circuit located on the first light-emitting element side, The light-emitting device according to claim 11, wherein two corner portions of the integrated circuit located on a side opposite to the first light-emitting element are exposed from the first reflecting member.

14. The light-emitting device according to claim 11, further comprising a covering member covering outer surfaces of the first reflecting member and the integrated circuit respectively.

15. Having a plurality of the light-emitting devices according to any one of claims 1 to 14, The plurality of light-emitting devices are arranged side by side in the first direction, a light-emitting unit.

16. The second conductive portion is connected to an input terminal for inputting an electrical signal from an adjacent light-emitting device, The light-emitting unit according to claim 15, wherein the third conductive portion is connected to an output terminal for outputting an electrical signal to an adjacent light-emitting device.

17. The support bodies respectively included in the plurality of light-emitting devices, A fourth conductive portion located on one side of the integrated circuit in the first direction, The light-emitting unit according to claim 15, further comprising a fifth conductive portion located on the other side of the integrated circuit in the first direction.

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