Solventless hard coat resin composition and hard coat film using the same

A solvent-free hard coat resin composition with urethane acrylamide oligomer and other components addresses environmental and performance issues, providing stable coatings with excellent moldability and stain resistance for HC films.

JP2025101801APending Publication Date: 2025-07-08AICA KOGYO CO LTD
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Patent Information

Application Number
JP2023218825
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-12-26
Publication Date
2025-07-08

AI Technical Summary

Technical Problem

Existing solvent-based hard coat resin compositions face environmental and energy inefficiencies due to solvent volatilization, and they lack sufficient adhesion, moldability, and stain resistance, particularly coffee resistance, for practical applications.

Method used

A solvent-free hard coat resin composition comprising urethane acrylamide oligomer, monofunctional (meth)acrylate, crosslinkable polyfunctional monomer, leveling agent, and photopolymerization initiator, with specific blending ratios to achieve stable coating, excellent moldability, and stain resistance.

Benefits of technology

The solvent-free composition ensures stable coating appearance, improved moldability, and enhanced stain resistance, making it suitable for HC films in molding applications.

✦ Generated by Eureka AI based on patent content.

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Abstract

To provide an HC resin composition which stabilizes coating appearance while being solventless, and has excellent moldability and stain resistance (coffee resistance), and an HC film in which the cured layer is formed.SOLUTION: A solventless hard coat resin composition contains an urethane acrylamide oligomer, monofunctional (meth)acrylate, a crosslinkable polyfunctional monomer, a leveling agent, and a photopolymerization initiator, wherein the blended amount of the urethane acrylamide oligomer is 10 to 28 wt.% with respect to the total amount of the solid content.SELECTED DRAWING: None
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Description

Technical Field

[0001] The present invention relates to a solvent-free hard coat resin composition containing no diluting solvent and a hard coat film using the same.

Background Art

[0002] Acrylic photocurable resins are used in many fields to impart functionality to the surfaces of plastic films and plastic molded articles. For example, a hard coat (hereinafter referred to as HC) film having high hardness by being applied on a PET (polyethylene terephthalate) film is widely used as a film for touch panels and a film for molding.

[0003] Such HC resin compositions generally have a high viscosity, and in many cases, they are diluted with a solvent for improving coatability. However, such a composition containing a solvent has a large environmental load because the solvent is volatilized after coating, and also consumes a large amount of energy in a drying oven. Furthermore, compared with the solvent type, the solvent-free type has a low penetration and swelling effect on the easy adhesion formed for promoting adhesion, and there is also a tendency that the adhesion tends to be insufficient.

[0004] As a solvent-free HC curable composition for solving such problems, for example, a composition containing a urethane (meth) acrylate structure of a specific structure, a polyfunctional compound, a monofunctional compound, a silicone compound, and a photo radical initiator has been proposed (Patent Document 1). By using such a solvent-free HC resin composition, problems such as environmental load and energy loss during drying can be solved. However, since the oligomers and the like that can be used are limited in the solvent-free type, there are almost no HC resin compositions having excellent stretchability suitable for molding applications. In addition, when used as a molded article, there are almost no HC resin compositions having characteristics such as stain resistance, for example, coffee resistance, which are problematic in practical use. Therefore, a solvent-free HC resin composition having both excellent moldability and stain resistance has been demanded.

Prior Art Documents

Patent Document

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention provides an HC resin composition that is solvent-free, has a stable coating appearance, and further has excellent moldability and stain resistance (coffee resistance), and an HC film having a cured layer thereof formed.

Means for Solving the Problems

[0007] In order to achieve the above problems, the invention according to claim 1 includes a urethane acrylamide oligomer (A), a monofunctional (meth)acrylate (excluding (C)), a crosslinkable polyfunctional monomer (C), a leveling agent (D), and a photopolymerization initiator (E), and the blending amount of the (A) is 10 to 28% by weight based on the total solid content, and provides a solvent-free hard coat resin composition.

[0008] The invention according to claim 2 further provides the solvent-free hard coat resin composition according to claim 1, characterized in that the (C) includes a (meth)acrylate containing a vinyl ether group and / or an alkylene oxide-modified polyfunctional (meth)acrylate.

[0009] The invention according to claim 3 further provides the solvent-free hard coat resin composition according to claim 1, characterized in that the (D) is a silicone-based leveling agent.

[0010] The invention according to claim 4 further provides a hard coat film having a cured layer of the solvent-free hard coat resin composition according to any one of claims 1 to 3 formed on at least one side of a plastic substrate.

Effects of the Invention

[0011] The resin composition of the present invention is a solventless type, but has a stable coating appearance and further excellent moldability and stain resistance (coffee resistance). Therefore, it is useful as a solventless HC resin composition used for HC films for molding and the like.

Mode for Carrying Out the Invention

[0012] The present invention will be described in detail below.

[0013] The composition of the present invention (hereinafter referred to as this composition) is composed of a urethane acrylamide oligomer (A), a monofunctional (meth)acrylate (B), a crosslinkable polyfunctional monomer (C), a leveling agent (D), and a photopolymerization initiator (E). In this specification, (meth)acrylate includes both acrylate and methacrylate. Also, solventless means excluding the intentional blending of a solvent for dilution in the HC resin composition, and it does not mean excluding even the volatile components contained in trace amounts in each component of the HC resin composition. The solvent content refers to 5% by weight or less, typically 1% by weight or less.

[0014] The urethane acrylamide oligomer (A) used in the present invention is an oligomer having both an amide group and a urethane group in the molecule, and is mainly blended for the purpose of improving stain resistance and adhesion to the substrate. For example, it can be obtained by the reaction of a polyol, a (meth)acrylamide having a hydroxyl group, and a polyisocyanate, but is not limited thereto.

[0015] In the above (A), hydrogen bonds are likely to be formed between amide groups or between an amide group and a urethane group within and / or between molecules. And this hydrogen bond can be reversibly bonded and dissociated. It is considered that at room temperature, it improves scratch resistance as a hard segment, and at high temperature, the bond becomes loose and the ductility is improved.

[0016] The weight average molecular weight of the above (A) (hereinafter referred to as Mw) is preferably from 1,000 to 100,000, more preferably from 3,000 to 50,000, and particularly preferably from 5,000 to 30,000. By setting it to 1,000 or more, sufficient toughness can be ensured as a cured film, and by setting it to 100,000 or less, it becomes easy to adjust the viscosity suitable for coating, and sufficient leveling property and coatability can be ensured.

[0017] The glass transition point of the above (A) (hereinafter referred to as Tg) is preferably from -10 to 30°C, more preferably from -5 to 25°C, and particularly preferably from 0 to 20°C. By setting it within this range, it is possible to achieve both good moldability and film strength such as scratch resistance.

[0018] The blending amount of the above (A) is 10 to 28% by weight based on the total amount of the components, preferably 12 to 25% by weight, and more preferably 15 to 23% by weight. If it is less than 10% by weight, the stain resistance and adhesion to the substrate may decrease, and if it exceeds 28% by weight, it becomes difficult to adjust the viscosity, and the moldability may also decrease.

[0019] The monofunctional (meth)acrylate (B) used in the present invention is a reactive diluent that dilutes (A), and is also blended for the purpose of increasing the rigidity of the film. Since it is monofunctional, it forms a linear structure even when cured and does not form a network structure. As a result, (A) can be diluted without significantly inhibiting the ductility, and the rigidity of the film can also be increased. It is not particularly limited as long as it is a monomer having one (meth)acryloyl group in the molecule.

[0020] Examples of the component (B) include alkyl (meth) acrylates having a linear, branched, or cyclic alkyl group with 1 to 22 carbon atoms, hydroxyalkyl (meth) acrylates having a hydroxyl group introduced therein, N-alkylamino (meth) acrylates having an amino group introduced therein, (meth) acrylates having a cyclic structure introduced therein, and the like. These can be used alone or in combination of two or more. Among these, cyclic alkyl (meth) acrylates and (meth) acrylates having a cyclic structure introduced therein are preferable in terms of easily improving the rigidity of the film, and isobornyl acrylate and dicyclopentenyl acrylate are particularly preferable in terms of excellent reaction curability.

[0021] The blending amount of the component (B) is preferably 50 to 85% by weight, more preferably 55 to 80% by weight, and still more preferably 60 to 75% by weight based on the total amount of the components. By setting it to 50% by weight or more, sufficient dilutability and moldability can be ensured, and by setting it to 85% by weight or less, sufficient stain resistance (coffee resistance) can be ensured.

[0022] The crosslinkable polyfunctional monomer (C) used in the present invention is a reactive diluent that dilutes (A) and is also blended for the purpose of improving curability. It is not particularly limited as long as it is a polyfunctional monomer, but it preferably contains a vinyl ether group-containing (meth) acrylate (c1) or / and an alkylene oxide-modified polyfunctional (meth) acrylate in terms of excellent dilutability and not excessively increasing the hardness of the cured product.

[0023] The component (c1) is a monomer having a cationic polymerizable vinyl ether group that is not inhibited by oxygen polymerization and has good dilutability, and a (meth) acryloyl group that has good compatibility and reactivity with (A), and can be represented by the following general formula (1), for example. CH2=CR 1 -CO-(OCHR 2 CHR 3 )n-O-CH=CHR 4 ···(1) (In the formula, R1 and R4 represent a hydrogen atom or a methyl group, R2 and R3 each independently represent a hydrogen atom or an organic residue, and n represents an integer of 2 or more.)

[0024] Examples of the component (c1) include 2-(2-vinyloxyethoxy)ethyl (meth)acrylate, 2-(2-vinyloxyisopropoxy)ethyl (meth)acrylate, 2-(2-vinyloxyethoxy)propyl (meth)acrylate, 2-(2-vinyloxyisopropoxy)propyl acrylate, 2-(2-vinyloxyethoxyethoxy)ethyl (meth)acrylate, etc., and they can be used alone or in combination of two or more. Among these, 2-(2-vinyloxyethoxy)ethyl acrylate is particularly preferred because of its low viscosity, high dilution ability, and excellent curability.

[0025] The component (c2) is a polyfunctional (meth)acrylate having a block structure of alkylene oxide in its skeleton. Since it is modified with alkylene oxide, it has a low viscosity, and since the acryloyl groups, which are reactive functional groups, can maintain a certain distance from each other, the crosslinking density does not become excessively high, and internal stress and curing shrinkage remaining in the coating film can be reduced. Therefore, a good balance between the adhesion to the substrate and the coating film strength can be achieved, and as a result, a cured film with flexibility can be formed.

[0026] Examples of the alkylene oxide modification include ethylene oxide (hereinafter referred to as EO) modification, propylene oxide (hereinafter referred to as PO) modification, and butylene oxide (hereinafter referred to as BO) modification. The average addition number of the alkylene oxide modification is preferably 2 to 12, and more preferably 3 to 8. By setting it to 2 or more, improvement in scratch resistance and flexibility can be expected, and by setting it to 15 or less, it becomes easy to adjust to an appropriate viscosity.

[0027] Examples of the component (c2) include EO-modified glycerol poly(meth)acrylate, EO-modified diglycerol poly(meth)acrylate, EO-modified trimethylolpropane tri(meth)acrylate, EO-modified pentaerythritol poly(meth)acrylate, EO-modified dipentaerythritol poly(meth)acrylate, and their PO-modified products, BO-modified products, etc. They can be used alone or in combination of two or more. Among these, EO-modified products are preferred in terms of viscosity, curability, and availability. Also, EO-modified trimethylolpropane triacrylate (hereinafter referred to as TMPTA) is particularly preferred because it has a good balance between flexibility and scratch resistance.

[0028] The blending amount of (C) containing the components (c1) and (c2) is preferably 2 to 15% by weight, more preferably 3 to 10% by weight, and particularly preferably 4 to 8% by weight based on the total amount of the components. By setting it at 2% by weight or more, the reactivity can be sufficiently improved, and by setting it at 15% by weight or less, sufficient moldability can be ensured.

[0029] The leveling agent (D) used in the present invention is blended for the purpose of improving the leveling characteristics during coating and improving the scratch resistance of the cured film. It is preferably provided with reactive functional groups capable of polymerizing with the binder resin to form a cured coating film so that it does not drop over time due to bleeding or the like from the cured film and the weather resistance effect can be maintained for a long time. Examples include fluorine-based, silicone-based, fluorosilicone-based, etc., and they can be used alone or in combination of two or more.

[0030] Among these, silicone-based polysiloxane compounds capable of equalizing a large surface tension difference on the coating film surface are preferred. Examples include polyalkylsiloxane, polyarylsiloxane, polyalkylarylsiloxane, polyester-modified siloxane, polyether-modified siloxane, etc., and they can be used alone or in combination of two or more.

[0031] As the blending amount of the above (D), 0.1 to 5% by weight, preferably 0.3 to 3% by weight, based on the total solid content, is preferred. By setting it within this range, sufficient leveling property can be ensured and a stable coating film appearance can be obtained. Examples of commercially available products include BYK-UV3570 (trade name, manufactured by BYK Chemie, acryloyl group-containing polyester-modified polydimethylsiloxane compound), etc.

[0032] The photoinitiator (E) used in the present invention generates radicals upon irradiation with ultraviolet rays, electron beams, etc., and these radicals serve as the trigger for the polymerization reaction. General-purpose photoinitiators such as benzyl ketal-based, acetophenone-based, and phosphine oxide-based can be used. By arbitrarily selecting the light absorption wavelength of the photoinitiator, curability can be imparted over a wide wavelength range from the ultraviolet region to the visible light region. Specifically, 2,2-dimethoxy-1,2-diphenylethane-1-one as a benzyl ketal-based, 1-hydroxy-cyclohexyl-phenyl-ketone, 1-[4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methyl-propan-1-one as α-hydroxyacetophenone-based, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one as α-aminoacetophenone-based, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide as acylphosphine oxide-based, etc. are available, and they can be used alone or in combination of two or more. Among these, it is preferable to blend an α-hydroxyacetophenone-based which is less likely to cause yellowing.

[0033] The compounding amount of the above (E) is preferably 0.5 to 10 parts by weight, more preferably 2 to 8 parts by weight, based on 100 parts by weight of the radically polymerizable component. By setting it to 0.5 parts by weight or more, sufficient curability can be exhibited, and by setting it to 10 parts by weight or less, over-addition can be avoided, and yellowing of the coating film and deterioration of storage stability can be prevented. Commercially available products include Omnirad 184 (trade name: manufactured by IGM Resins, 1-hydroxy-cyclohexyl-phenyl-ketone), etc.

[0034] Furthermore, in addition to this, if necessary, in the range that does not impair the performance, a light stabilizer, a polymerization inhibitor, a wetting agent, an antioxidant, a curing aid, a silane coupling agent, a plasticizer, a sensitizer, an antifoaming agent, a flame retardant, an inorganic filler, an organic fine particle, a colorant such as a pigment, a dye or a pigment, an antibacterial agent, an antiviral agent, etc. can be used in combination as additives.

[0035] The above light stabilizer is compounded for the purpose of preventing deterioration of the cured film due to ultraviolet exposure or radiant heat. For example, a radical scavenger that efficiently traps alkyl radicals or peroxy radicals generated from a polymer that has been photo-degraded by ultraviolet rays, an ultraviolet absorber that suppresses the decomposition of the polymer by converting the energy of the absorbed ultraviolet rays into thermal energy, etc. can be mentioned, and they can be used alone or in combination of two or more.

[0036] Examples of the above radical scavenger include hindered amine-based (hereinafter referred to as HALS-based), hindered phenol-based, aromatic amine-based, etc., and they can be used alone or in combination of two or more. Among these, HALS-based with high radical scavenging efficiency even at low concentrations is preferable.

[0037] The compounding amount of the above radical scavenger is preferably 0.2 to 5% by weight, more preferably 0.5 to 2% by weight, based on the total solid content. By setting it within this range, sufficient light stability can be ensured. Commercially available products of the HALS series include Adeka Stab LA series (trade name: manufactured by ADEKA), etc.

[0038] Examples of the plastic substrate to which the composition is applied include polyester film, triacetyl cellulose film, polycarbonate film (hereinafter referred to as PC film), polysulfone film, nylon film, cycloolefin film, acrylic (hereinafter referred to as PMMA) film, polyimide film, ABS film, polyolefin film, PVC film, PVA film, etc. and composite films thereof. Among them, a biaxially stretched PET film is preferably used from the viewpoints of weather resistance, processability, dimensional stability, etc. In addition, for molding applications, PMMA film and PC film are preferably used, and their laminated films are also preferably used. The thickness of the film may generally be 25 μm to 500 μm.

[0039] The method of applying the composition is not particularly limited, and known coating methods such as roll coating, die coating, air knife coating, blade coating, spin coating, reverse coating, gravure coating, wire bar, etc. or gravure printing, screen printing, offset printing, inkjet printing, etc. can be used. The film thickness to be applied can be exemplified by 1 μm to 10 μm when dry, but is not limited thereto.

[0040] After applying the composition, it is cured using an ultraviolet irradiation machine. Examples of the light source for irradiating ultraviolet rays include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, carbon arc lamps, xenon lamps, metal halide lamps, electrodeless ultraviolet lamps, LED lamps, etc. The curing conditions are an irradiation intensity of 100 mW / cm 2 ~3000 mW / cm 2 and an integrated light amount of 50 to 2,000 mJ / cm 2 are exemplified. The atmosphere for irradiation may be in air or in an inert gas such as nitrogen or argon, but curing in an inert gas is preferred to prevent curing inhibition by oxygen.

[0041] The HC film obtained by applying and curing this composition on a plastic substrate (hereinafter referred to as this HC film) preferably has an elongation at break of 100% or more, more preferably 200% or more, in an atmosphere at 130°C. By setting the elongation at break to 100% or more, sufficient formability can be expected.

[0042] A decorative layer can be provided on this HC film as needed. Examples of the decoration methods include printing, metal vapor deposition, etc., and both of these can be used for decoration. Further, an adhesive layer or a primer layer may be provided to improve the adhesion to the injection molding resin.

[0043] A protective film may be laminated on this HC film to protect the surface on which this composition is applied. By using a protective film, damage can be prevented in the insert molding or outmold molding process, and an improvement in yield can be expected.

[0044] As a method of using this HC film in insert molding, for example, the surface on which this composition is applied is arranged so as to face the inner wall surface of the mold (so that the opposite surface of the cured layer of this composition is in contact with the molding resin), and if necessary, this HC film is preformed to follow the mold shape. Next, the mold is closed and molten molding resin is injected into the cavity, and the resin is solidified to form a resin molded product.

[0045] As a method of performing the above preforming, the HC film is preheated to a temperature equal to or higher than the softening point and placed in the mold, and vacuum suction is performed through the suction holes provided in the mold. Alternatively, a molding mold different from the injection molding mold can be used, and known molding methods such as vacuum molding, pressure air molding, and press molding can be used. Also, it is possible to simultaneously perform integral molding of the molding and the injection resin by the injection pressure of the molding resin without performing these preformings.

[0046] As the resin for injection molding, it is possible to use known resins capable of injection molding. For example, polyethylene resin, polypropylene resin, polystyrene resin, ABS resin, AS resin, acrylic resin, urethane resin, polyester resin, polycarbonate resin, polyphenylene ether resin, polyacetal resin, polysulfone resin, etc. can be mentioned, and they can be used alone or in combination of two or more. When the size is large like an automobile body, or even if the size is small but the wall thickness is thin, by approximating the shrinkage rate after molding to that of the HC film, problems such as warping can be avoided.

[0047] Furthermore, this HC film can also be used for overmolding. For example, it may be used for TOM (Three-Dimensional Overlay Method) molding. TOM molding is a film molding method in which a three-dimensional surface decoration is performed on a pre-molded substrate in an airtight box by vacuum and pressure-air molding. By using this HC film, regardless of the material of the substrate, it is possible to handle large three-dimensional products.

[0048] Hereinafter, the present invention will be described in detail based on examples and comparative examples, but these are only specific examples and are not particularly limited thereto. The blending amounts are shown in parts by weight, and when not indicated, they were measured under the conditions of room temperature 25°C and relative humidity 65%.

[0049] Example 1 Urethane acrylamide (Mw14500, Tg12°C) was used as (A), IBXA (trade name: manufactured by Kyoeisha Chemical Co., Ltd., isobornyl acrylate) was used as (B), 2-(2-vinyloxyethoxy)ethyl acrylate was used as (c1) of (C), BYK-UV3570 (trade name: manufactured by BYK Chemie, acryloyl group-containing polyester-modified polydimethylsiloxane compound) was used as (D), and Omnirad184 (trade name: manufactured by IGM Resins, α-hydroxy-phenone type) was used as (E). The HC resin composition of Example 1 was prepared by stirring until uniformly dissolved with the formulation described in Table 1.

[0050] Examples 2 to 7 In addition to the materials used in Example 1, FA-511AS (trade name: Resonac Co., Ltd., dicyclopentenyl acrylate) was used as the component (B), TPM-3EO-A (trade name: Kyoeisha Chemical Co., Ltd., EO-modified (modification number 3) TMPTA) was used as the component (c2) of (C), and LA-82 (trade name: ADEKA Corporation, 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate) was used as the HALS. The HC resin compositions of Examples 2 to 7 were prepared by stirring until uniformly dissolved with the formulations described in Tables 1 and 2.

[0051] Comparative Examples 1 to 4 In addition to the materials used in the examples, urethane acrylate (bifunctional, polyester backbone) was used as the oligomer replacing (A), and the HC resin compositions of Comparative Examples 1 to 4 were prepared by stirring until uniformly dissolved with the formulations described in Table 2.

[0052] Table 1 JPEG2025101801000001.jpg135157

[0053] Table 2 JPEG2025101801000002.jpg98128

[0054] The evaluation method was as follows.

[0055] Preparation of HC film for evaluation Using the HC resin composition prepared above, it was coated on A4360 (trade name: Toyobo Co., Ltd., PET film with a thickness of 125 μm) so that the dry film thickness became 10 μm, and ultraviolet irradiation was performed with a high-pressure mercury lamp manufactured by Eye Graphics Co., Ltd. at an output of 300 mW / cm2 and an integrated light amount of 600 mJ / cm2 to prepare an HC film for evaluation.

[0056] Viscosity: Measured at 25 ± 1°C with a cone plate viscometer RC-550 manufactured by Toki Sangyo Co., Ltd., with a cone angle of 3° R17.65 and a rotation speed of 100 rpm.

[0057] Coating Appearance: During the preparation of the above-mentioned HC film for evaluation, the appearance was visually inspected. The evaluation was marked as ○ when there was no coating unevenness or streaks, and as × when the leveling property was not perfect and coating streaks were visible.

[0058] Coffee Resistance: On the HC surface of the above-mentioned HC film for evaluation, one drop of coffee at a temperature of 20°C was dripped with a dropper and left at room temperature for 3 hours, and then wiped off. The evaluation was marked as ○ when no trace remained, and as × when a trace remained.

[0059] Adhesion: Using the above-mentioned HC film, in accordance with the old JIS K5400, a 10×10 grid of 1 mm squares was created for a cross-cut test, and the peeling state of the coating film was confirmed using cellophane tape (specified in JIS Z1522). When peeling the cellophane tape attached to the coating film side, the evaluation was marked as ○ when the number of peeled squares was 0, and as × when even one square was peeled off.

[0060] Formability (Elongation at Break): Using HBA-007P (product name: acrylic film manufactured by Mitsubishi Chemical Corporation, thickness 75 μm) as the base material, the HC film prepared under the same conditions as the above-mentioned HC film was cut into a size of 25 mm wide × 110 mm long. Using a TechnoGraph TGI-1KN manufactured by Minebea, a tensile test was conducted at a chuck distance of 50 mm, an ambient temperature of 130°C, and a tensile speed of 300 mm / min. The evaluation was visually checking for cracks. When the elongation rate was less than 100%, it was marked as ×; when it was 100% - 200%, it was marked as ○; when it was over 200%, it was marked as ◎. Calculation formula: Calculated based on how many millimeters it elongated from a reference of 50 mm. Elongated length (mm) / 50 mm × 100 = Elongation rate %

[0061] Evaluation results Table 3 JPEG2025101801000003.jpg102135

[0062] Table 4 JPEG2025101801000004.jpg101152

[0063] Each formulation of the examples was good without any problems in terms of viscosity, coating appearance, coffee resistance, adhesion, and moldability.

[0064] On the other hand, in Comparative Example 1 where the blending amount of (A) was below the lower limit, the coffee resistance and adhesion were inferior. In Comparative Example 2 where the blending amount of (A) exceeded the upper limit, the viscosity was high and the adhesion was also inferior. In Comparative Example 3 that did not contain (D), the appearance was inferior. In Comparative Example 4 where urethane acrylate A was blended instead of (A), the coffee resistance was inferior. None of these formulations were suitable for the present invention.

Claims

1. A solvent-free hard coat resin composition comprising a urethane acrylamide oligomer (A), a monofunctional (meth)acrylate (B) (excluding (C)), a crosslinkable polyfunctional monomer (C), a leveling agent (D), and a photopolymerization initiator (E), wherein the compounding amount of (A) is 10 to 28% by weight based on the total solid content.

2. The solvent-free hard coat resin composition according to Claim 1, wherein (C) contains a (meth)acrylate containing a vinyl ether group and / or an alkylene oxide-modified polyfunctional (meth)acrylate.

3. The solvent-free hard coat resin composition according to Claim 1, wherein (D) is a silicone-based leveling agent.

4. A hard coat film having a cured layer of the solvent-free hard coat resin composition according to any one of Claims 1 to 3 formed on at least one side of a plastic substrate.

Citation Information

Patent Citations

  • Solvent-free curable composition for hard coat and cured film thereof

    WO2009050957A1