Method for evaluating curable resin composition, method for producing curable resin composition, and method for producing electronic component device

Abstract

To provide a method for evaluating a curable resin composition, which enables estimation of the peelability between a lead frame and a cured product of the curable resin composition that encapsulates a device by a simple process.SOLUTION: A method for evaluating a curable resin composition includes a step in which at least one parameter selected from the group consisting of: adhesive strength of a cured product of the curable resin composition containing an epoxy resin to AgCu; cure shrinkage of a molded article of the curable resin composition; and thermal expansion coefficient of the cured product of the curable resin composition, is evaluated to estimate the peelability between a lead frame including AgCu and a cured product of the curable resin composition containing an epoxy resin that encapsulates a device.SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to a method for evaluating a curable resin composition, a method for producing a curable resin composition, and a method for producing an electronic component device.

Background Art

[0002] In recent years, high-density mounting of semiconductor elements has been progressing. Along with this, resin-sealed semiconductor devices have become mainstream from conventional pin-insertion type packages to surface-mount type packages. Surface-mount type ICs (Integrated Circuits), LSIs (Large Scale Integration), etc. have become thin and small packages in order to increase the mounting density and reduce the mounting height. Therefore, the occupied area of the element with respect to the package has increased, and the thickness of the package has become very thin.

[0003] Furthermore, these packages have a different mounting method from pin-insertion type packages. That is, in a pin-insertion type package, after inserting pins into a wiring board, soldering is performed from the back surface of the wiring board, so the package has a structure in which it is not directly exposed to high temperatures. However, surface-mount type ICs are temporarily fixed on the surface of the wiring board and processed by a solder bath, a reflow device, etc., so the package is directly exposed to the soldering temperature (reflow temperature). As a result, when the package is moisture-absorbed, the moisture absorbed during reflow vaporizes, and the generated vapor pressure acts as a peeling stress, causing peeling between the support members such as elements and lead frames and the encapsulant, leading to the occurrence of package cracks, electrical characteristic defects, etc. Therefore, development of a sealing material having excellent adhesiveness to the support member and thus excellent solder heat resistance (reflow resistance) is desired.

[0004] As a sealing material having excellent reflow resistance, a curable resin composition containing an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an alkoxysilane polymer having a specific structure has been proposed in Patent Document 1. Also, for the purpose of improving reflow resistance, for example, the surface of the lead frame is roughened before plating treatment to improve the adhesiveness with the encapsulant.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] There is a demand for the development of an encapsulant that suppresses peeling from the lead frame even under more severe moisture-heat conditions (for example, moisture-heat conditions of 85°C and 85% RH). From the viewpoint of efficiently developing a curable resin composition such as such an encapsulant, it is desirable to estimate the peelability between the lead frame and the cured product of the curable resin composition encapsulating the element by a simple method.

[0007] The present disclosure has been made in view of the above situation, and an evaluation method for a curable resin composition capable of estimating the peelability between a cured product of a curable resin composition encapsulating a lead frame and an element by a simple method, and a method for producing a curable resin composition and a method for producing an electronic component device using this evaluation method are provided.

Means for Solving the Problems

[0008] <1> An evaluation method for a curable resin composition that estimates the peelability between a cured product of a curable resin composition containing an epoxy resin and a cured product of a curable resin composition containing an epoxy resin that encapsulates a lead frame containing AgCu and an element by evaluating at least one selected from the group consisting of the adhesive force of the cured product of the curable resin composition containing an epoxy resin to AgCu, the curing shrinkage rate of the molded product of the curable resin composition, and the thermal expansion rate of the cured product of the curable resin composition. <2> The adhesion strength is the adhesion strength at 100°C to 300°C after heating and humidifying at 50°C to 100°C and 50% to 95% RH for 10 hours to 1000 hours. The evaluation method of the curable resin composition according to <1>. <3> The curable resin composition further contains a curing agent, The evaluation method of the curable resin composition according to <1> or <2>, wherein the equivalent ratio of the curing agent to the epoxy resin, which is the equivalent ratio of the curing agent to the epoxy resin, is 0.8 or less. <4> The evaluation method of the curable resin composition according to any one of <1> to <3>, further comprising an inorganic filler. <5> The evaluation method of the curable resin composition according to any one of <1> to <4>, wherein the peelability is estimated by checking whether at least one numerical value selected from the group consisting of the adhesion strength, the curing shrinkage rate, and the thermal expansion rate satisfies specific conditions. <6> A method for producing a curable resin composition, comprising preparing a curable resin composition containing an epoxy resin based on the evaluation result of the evaluation method of the curable resin composition according to any one of <1> to <5>. <7> A method for producing a curable resin composition, comprising preparing a curable resin composition containing an epoxy resin, wherein at least one numerical value selected from the group consisting of the adhesion strength, the curing shrinkage rate, and the thermal expansion rate satisfies specific conditions based on the evaluation result of the evaluation method of the curable resin composition according to any one of <1> to <5>. <8> Manufacturing a curable resin composition containing an epoxy resin using the method for producing a curable resin composition according to <6> or <7>, Encapsulating an element with the cured product of the produced curable resin composition, A method for manufacturing an electronic component device, comprising:

Advantages of the Invention

[0009] According to the present disclosure, an evaluation method of a curable resin composition capable of estimating the peelability between a lead frame and a cured product of a curable resin composition encapsulating an element in a simple manner, a method for producing a curable resin composition using this evaluation method, and a method for producing an electronic component device can be provided.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments for implementing the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components (including element steps, etc.) are not essential unless otherwise clearly stated. The same applies to numerical values and their ranges, which do not limit the present disclosure.

[0011] In the present disclosure, the numerical range indicated by "~" includes the numerical values described before and after "~" as the minimum value and the maximum value, respectively. In the numerical ranges described step by step in the present disclosure, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerically described range. Also, in the numerical ranges described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the synthesis example. In the present disclosure, each component may include a plurality of corresponding compounds. When there are a plurality of substances corresponding to each component in the composition, the content rate or content of each component means the total content rate or content of the plurality of substances present in the composition, unless otherwise specified. In the present disclosure, the particles corresponding to each component may include a plurality of types. When there are a plurality of types of particles corresponding to each component in the composition, the particle diameter of each component means the value for the mixture of the plurality of types of particles present in the composition, unless otherwise specified. In the present disclosure, the term "lamination" means stacking layers, and two or more layers may be bonded, and two or more layers may be detachable. In the notation of the groups (atomic groups) of the present disclosure, the notation without indicating substitution and non-substitution includes both those having no substituents and those having substituents. In the present disclosure, the number of structural units represents an integer value for a single molecule, but represents a rational number that is an average value for an aggregate of a plurality of types of molecules. In the present disclosure, the number of carbon atoms means the total number of carbon atoms contained in an entire group. When the group has no substituent, it represents the number of carbon atoms forming the skeleton of the group. When the group has a substituent, it represents the total number obtained by adding the number of carbon atoms in the substituent to the number of carbon atoms forming the skeleton of the group.

[0012] In the present disclosure, the weight-average molecular weight (Mw) is a value measured using the following GPC measuring device under the following measurement conditions and converted using a calibration curve of standard polystyrene. However, for compounds whose accurate Mw cannot be measured by GPC due to their small molecular weight, the molecular weight determined from the chemical structure of the compound is adopted as the Mw, Mn, or degree of polymerization of the compound. An example of the measuring device is as follows, and for the creation of the calibration curve, 5 sample sets of standard polystyrene (「PStQuick MP-H」 and 「PStQuick B」, manufactured by Tosoh Corporation) may be used.

[0013] (GPC Measuring Device) GPC Device: High-speed GPC device 「HCL-8320GPC」, detector is a differential refractometer or UV, manufactured by Tosoh Corporation Column: Column TSKgel SuperMultipore HZ-H (column length: 15 cm, column inner diameter: 4.6 mm), manufactured by Tosoh Corporation (Measurement Conditions) Solvent: Tetrahydrofuran (THF) Measurement Temperature: 40 °C Flow Rate: 0.35 mL / min Sample Concentration: 10 mg / 5 mL of THF Injection Volume: 20 μL

[0014] (Evaluation Method of the Curable Resin Composition) The evaluation method of the curable resin composition of the present disclosure is a method of estimating the peelability between a lead frame containing AgCu and a cured product of a curable resin composition containing an epoxy resin that seals an element by evaluating at least one selected from the group consisting of the adhesive strength of the cured product of the curable resin composition containing an epoxy resin to AgCu, the cure shrinkage rate of the molded product of the curable resin composition, and the thermal expansion rate of the cured product of the curable resin composition.

[0015] In the evaluation method of the present disclosure, the peelability between the lead frame and the cured product of the curable resin composition that seals the element is estimated by evaluating at least one of the above-mentioned adhesive strength, cure shrinkage rate, and thermal expansion rate. Thereby, without actually forming the cured product of the curable resin composition that seals the element on the lead frame, the peelability between the lead frame and the cured product of the curable resin composition that seals the element can be estimated by a simple method.

[0016] In the evaluation method of the present disclosure, it is preferable to estimate the above-mentioned peelability by confirming whether at least one numerical value selected from the group consisting of adhesive strength, cure shrinkage rate, and thermal expansion rate satisfies specific conditions. For example, it is preferable to estimate the above-mentioned peelability by confirming whether at least one numerical value selected from the group consisting of adhesive strength, cure shrinkage rate, and thermal expansion rate is equal to or greater than a specific threshold value or equal to or less than the threshold value.

[0017] The above-mentioned adhesive strength may be the adhesive strength at 100°C to 300°C after heating and humidifying at 50°C to 100°C and 50% to 95% RH for 10 hours to 1000 hours from the viewpoint that the difference in peelability between the lead frame and the cured product of the curable resin composition that seals the element becomes significant when the composition of the curable resin composition is changed. For example, the above-mentioned adhesive strength may be the adhesive strength at 260°C after heating and humidifying at 85°C and 85% RH for 168 hours. The above-mentioned adhesive strength may be the adhesive strength at room temperature (for example, 25°C).

[0018] For example, it is possible to check whether the adhesive strength (also referred to as adhesive strength 1) at room temperature (for example, 25°C) is 7.0 MPa or more, or it is possible to check whether it is 7.5 MPa or more. The upper limit of the aforementioned adhesive strength 1 is not particularly limited.

[0019] It is possible to check whether the adhesive strength (also referred to as adhesive strength 2) at 260°C after heating and humidifying at 85°C and 85% RH for 168 hours is 0.40 MPa or more, it is possible to check whether it is 0.42 MPa or more, or it is possible to check whether it is 0.45 MPa or more. The upper limit of the aforementioned adhesive strength 2 is not particularly limited.

[0020] In the measurement of adhesive strength 1, first, a curable resin composition is molded by transfer molding on an Ag-plated Cu substrate, cured under the conditions of 150°C to 200°C and a curing time of 30 seconds to 5 minutes (for example, 175°C and a curing time of 120 seconds), and then post-cured under the conditions of 150°C to 200°C and a curing time of 30 minutes to 10 hours (for example, 5 hours at 175°C) to prepare a sample. The cured product of the sample may have a shape with a short side of 3.0 mm, a long side of 3.5 mm, and a thickness of 2.9 mm. The prepared sample is measured by performing a shear strength test in which the tool of the apparatus is applied to the cured product under the condition of room temperature (for example, 25°C) using a bond tester apparatus (for example, manufactured by Nordson Corporation, product name 4000 Optima).

[0021] In the measurement of adhesive strength 2, a sample is prepared in the same manner as in the measurement of adhesive strength 1. This sample is heated and humidified at 85°C and 85% RH for 168 hours, and then measured by performing a shear strength test in which the tool of the apparatus is applied to the cured product under the condition of 260°C using a bond tester apparatus (for example, manufactured by Nordson Corporation, product name 4000 Optima).

[0022] The curing shrinkage rate of the molded product of the aforementioned curable resin composition may be the curing shrinkage rate of a molded product molded under the conditions of a mold temperature of 150°C to 200°C, a molding pressure of 5 MPa to 10 MPa, and a curing time of 30 seconds to 5 minutes (for example, under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds).

[0023] It may be confirmed whether or not the curing shrinkage rate of the molded article molded under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds is 0.37% or more, whether or not it is 0.38% or more, and whether or not it is 0.40% or more. The upper limit of the curing shrinkage rate of the above-mentioned molded article is not particularly limited.

[0024] The coefficient of thermal expansion of the cured product of the above-mentioned curable resin composition may be the linear expansion coefficient (α1) at 10°C to 30°C or the linear expansion coefficient (α2) at 180°C to 200°C.

[0025] It may be confirmed whether or not the linear expansion coefficient (α1) at 10°C to 30°C is 8.0 ppm / °C or more, and whether or not it is 9.0 ppm / °C to 12.0 ppm / °C.

[0026] It may be confirmed whether or not the linear expansion coefficient (α2) at 180°C to 200°C is 32.0 ppm / °C to 60.0 ppm / °C, whether or not it is 33.0 ppm / °C to 55.0 ppm / °C, and whether or not it is 34.0 ppm / °C to 50.0 ppm / °C. Previously, it was considered that the smaller the linear expansion coefficient (α2) at 180°C to 200°C, the more the peeling from the lead frame was suppressed. However, it has been found that a linear expansion coefficient (α2) at 180°C to 200°C of 32.0 ppm / °C or more in the curable resin composition is more effective in suppressing the peeling from the lead frame. The reason for this is not clear, but it is presumed to be the effect of reducing thermal stress by suppressing warpage caused by the difference in linear expansion coefficient between members.

[0027] In the present disclosure, the linear expansion coefficient α1 and the linear expansion coefficient α2 are the slopes of the tangent lines at 10°C to 30°C and the slopes of the tangent lines at 180°C to 200°C when the strain of the cured product is plotted against temperature by a thermomechanical analysis method (TMA: Thermal Mechanical Analysis) based on JIS K 7197:2012. Note that the test load is 98 mN and the heating rate is 5°C / min for measurement. The linear expansion coefficient can be measured using a thermomechanical analyzer (for example, TMA / SS6100 manufactured by Seiko Instruments Inc.). Note that the cured product is produced by molding a curable resin composition using a transfer molding machine under the conditions of a mold temperature of 150°C to 200°C, a molding pressure of 5 MPa to 10 MPa, and a curing time of 30 seconds to 5 minutes (for example, the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds), and then performing post-curing under the conditions of 150°C to 200°C and a curing time of 30 minutes to 10 hours (for example, the conditions of 5 hours at 175°C). The cured product may have a rectangular shape with a short side of 5.1 mm, a long side of 20 mm, and a thickness of 2 mm.

[0028] In the present disclosure, from the viewpoint of fluidity, the spiral flow obtained by the following method for the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition is preferably 90 cm or more, more preferably 120 cm or more, and even more preferably 140 cm or more. The upper limit value of the spiral flow is not particularly limited and may be, for example, 170 cm or less.

[0029] The measurement of the spiral flow is to determine the flow distance when the curable resin composition is molded under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds using a mold for measuring spiral flow conforming to EMMI-1-66.

[0030] In the present disclosure, from the viewpoints of fluidity and curability, the gel time at 175°C of the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition is preferably 15 seconds or more, more preferably 18 seconds or more, and even more preferably 21 seconds or more.

[0031] The gel time is measured as the time from when 0.5 g of the thermosetting resin composition is placed on a hot plate preheated to 175°C to when the viscosity of the resin is lost. It is preferable to heat while periodically stirring the resin with a spatula or the like. "The viscosity of the resin is lost" refers to the phenomenon that the resin breaks or is destroyed when the resin is kneaded using a spatula or the like.

[0032] From the viewpoints of heat resistance and the like, in the present disclosure, the glass transition temperature (Tg) of the cured product of the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition is preferably higher than 110°C, more preferably 112°C or higher, and even more preferably 115°C or higher. The upper limit value of the Tg is not particularly limited and may be 200°C or lower, or may be 180°C or lower.

[0033] In the present disclosure, the glass transition temperature of the cured product is the temperature of the intersection of the tangent line at 10°C to 30°C and the tangent line at 200°C to 220°C obtained by the measurement of the above linear expansion coefficient.

[0034] (Epoxy resin) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition contains an epoxy resin. The epoxy resin may be used alone or in combination of two or more.

[0035] As the epoxy resin, a novolac epoxy resin obtained by epoxidizing a novolac resin obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, etc. and naphthol compounds such as α-naphthol, β-naphthol, dihydroxynaphthalene, etc. with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde, propionaldehyde, etc. under an acidic catalyst (phenol novolac type epoxy resin, orthocresol novolac type epoxy resin, etc.); a triphenylmethane type epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by condensing or co-condensing the above phenolic compound with an aromatic aldehyde compound such as benzaldehyde, salicylaldehyde, etc. under an acidic catalyst; a copolymer type epoxy resin obtained by epoxidizing a novolac resin obtained by co-condensing the above phenolic compound and naphthol compound with an aldehyde compound under an acidic catalyst; a diphenylmethane type epoxy resin which is a diglycidyl ether of bisphenol A, bisphenol F, etc.; a biphenyl type epoxy resin which is a diglycidyl ether of an alkyl-substituted or unsubstituted biphenol; a stilbene type epoxy resin which is a diglycidyl ether of a stilbene-based phenolic compound; a sulfur atom-containing type epoxy resin which is a diglycidyl ether of bisphenol S, etc.; an epoxy resin which is a glycidyl ether of alcohols such as butanediol, polyethylene glycol, polypropylene glycol, etc.; a glycidyl ester type epoxy resin which is a glycidyl ester of a polyvalent carboxylic acid compound such as phthalic acid, isophthalic acid, tetrahydrophthalic acid, etc.; a glycidylamine type epoxy resin in which active hydrogen bonded to a nitrogen atom such as aniline, diaminodiphenylmethane, isocyanuric acid, etc. is substituted with a glycidyl group; a dicyclopentadiene type epoxy resin obtained by epoxidizing a co-condensation resin of dicyclopentadiene and a phenolic compound;Alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane, which are obtained by epoxidizing the olefin bond within the molecule; Paraxylylene-modified epoxy resins which are glycidyl ethers of paraxylylene-modified phenol resins; Metaxylylene-modified epoxy resins which are glycidyl ethers of metaxylylene-modified phenol resins; Terpene-modified epoxy resins which are glycidyl ethers of terpene-modified phenol resins; Dicyclopentadiene-modified epoxy resins which are glycidyl ethers of dicyclopentadiene-modified phenol resins; Cyclopentadiene-modified epoxy resins which are glycidyl ethers of cyclopentadiene-modified phenol resins; Polycyclic aromatic ring-modified epoxy resins which are glycidyl ethers of polycyclic aromatic ring-modified phenol resins; Naphthalene-type epoxy resins which are glycidyl ethers of naphthalene ring-containing phenol resins; Halogenated phenol novolak-type epoxy resins; Hydroquinone-type epoxy resins; Trimethylolpropane-type epoxy resins; Linear aliphatic epoxy resins obtained by oxidizing an olefin bond with a peracid such as peracetic acid; Aralkyl-type epoxy resins which are obtained by epoxidizing aralkyl-type phenol resins such as phenol aralkyl resins and naphthol aralkyl resins; and the like. Further, aminophenol-type epoxy resins which are glycidyl ethers of aminophenol are also mentioned as epoxy resins.;

[0036] The epoxy resin preferably contains at least one selected from the group consisting of triphenylmethane-type epoxy resins and biphenyl-type epoxy resins, and more preferably contains at least one selected from the group consisting of triphenylmethane-type epoxy resins containing a t-Bu group and biphenyl-type epoxy resins.

[0037] From the viewpoint that peeling of the cured product of the resin composition from a lead frame containing AgCu is preferably suppressed, the epoxy resin preferably contains a triphenylmethane-type epoxy resin.

[0038] The triphenylmethane type epoxy resin preferably contains an epoxy resin having at least one selected from the group consisting of an alkyl group and an alkoxy group (hereinafter also referred to as a specific triphenylmethane type epoxy resin). When the triphenylmethane type epoxy resin has at least one selected from the group consisting of an alkyl group and an alkoxy group, the monomer becomes bulky and the molecular weight of the monomer increases, resulting in a polymer with a wide intermolecular distance and low crosslink density after polymerization. This results in fewer molecules per unit volume, and the molecules are easily dissolved when tensile stress is applied, so that a reduction in the modulus of elasticity and an increase in the linear expansion coefficient of the cured product of the curable resin composition are expected. As a result, the stress (a combination of strain, modulus of elasticity, linear expansion difference, and temperature difference) caused by the linear expansion difference between the lead frames is reduced and can be reduced to below the adhesive force of the resin, so that the cured product of the curable resin composition is prevented from peeling off from the lead frame. It is presumed that the reflow resistance is also improved.

[0039] The alkyl group in the specific triphenylmethane type epoxy resin preferably has a carbon number of 1 to 20, more preferably 1 to 16, and further preferably 1 to 10. The alkyl group may be linear, branched, or cyclic, but at least one of the alkyl groups is preferably branched and preferably contains a t-butyl group.

[0040] The alkoxy group contained in the specific triphenylmethane type epoxy resin preferably has a carbon number of 1 to 20, more preferably 1 to 16, and further preferably 1 to 10. The alkoxy group may be linear, branched, or cyclic.

[0041] It is preferable that the benzene ring contained in the specific triphenylmethane type epoxy resin has two or more alkyl groups, and it is more preferable that the benzene ring contained in the main chain has two or more alkyl groups. At least one of the two or more alkyl groups possessed by the benzene ring is preferably a branched alkyl group, and the branched alkyl group is preferably arranged at the ortho position with respect to the glycidyloxy group.

[0042] The specific triphenylmethane type epoxy resin may be an epoxy resin represented by the following formula (1).

[0043]

Chemical formula

[0044] In formula (1), each R independently represents an alkyl group or an alkoxy group, each i independently represents an integer of 1 to 3, and each k independently represents an integer of 0 to 4. n is an average value and indicates a number from 0 to 10.

[0045] Examples of the alkyl group and alkoxy group represented by R are those described above. i represents an integer of 1 to 3, preferably 2 or 3, and more preferably 2. When i is 2, at least one of the Rs represented by the subscript i is preferably a branched alkyl group, and more preferably a combination of a branched alkyl group and a linear alkyl group. For example, a combination of a t-butyl group and a methyl group can be mentioned. The t-butyl group and the methyl group may be arranged at any position on the benzene ring, but the t-butyl group is preferably arranged at the ortho position with respect to the glycidyloxy group. Also, the arrangement relationship between the t- butyl group and the methyl group may be any, and they may be arranged at the ortho, meta, or para position. Each k independently represents an integer of 0 to 4, and preferably 0.

[0046] Specific examples of the triphenylmethane type epoxy resin include the epoxy resin represented by the following formula (2).

[0047]

Chemical formula

[0048] The content of the specific triphenylmethane type epoxy resin is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, and even more preferably 90% by mass to 100% by mass, based on the total amount of the triphenylmethane type epoxy resin.

[0049] Among the above epoxy resins, from the viewpoints of the adhesiveness to the lead frame of the curable resin composition of the present disclosure and the balance between heat resistance and fluidity, it is preferable to contain a biphenyl type epoxy resin.

[0050] The biphenyl type epoxy resin is not particularly limited as long as it is an epoxy resin having a biphenyl skeleton. For example, an epoxy resin represented by the following general formula (II) is preferable.

[0051]

Chemical formula

[0052] In formula (II), R 8 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aromatic group having 4 to 18 carbon atoms, and all of them may be the same or different. n is an average value and represents a number from 0 to 10.

[0053] The stilbene type epoxy resin is not particularly limited as long as it is an epoxy resin having a stilbene skeleton. For example, an epoxy resin represented by the following general formula (III) is preferable.

[0054]

Chemical formula

[0055] In formula (III), R 9 and R 10 represent a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different from each other. n is an average value and represents a number from 0 to 10.

[0056] The diphenylmethane type epoxy resin is not particularly limited as long as it is an epoxy resin having a diphenylmethane skeleton. For example, an epoxy resin represented by the following general formula (IV) is preferable.

[0057]

Chemical formula

[0058] In formula (IV), R 11 and R 12 represent a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different from each other. n is an average value and represents a number from 0 to 10.

[0059] The sulfur atom-containing type epoxy resin is not particularly limited as long as it is an epoxy resin containing a sulfur atom. For example, an epoxy resin represented by the following general formula (V) can be mentioned.

[0060]

Chemical formula

[0061] In formula (V), R 13 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different from each other. n is an average value and represents a number from 0 to 10.

[0062] The novolac type epoxy resin is not particularly limited as long as it is an epoxy resin obtained by epoxidizing a novolac type phenol resin. For example, an epoxy resin represented by the following general formula (VI) can be mentioned.

[0063]

Chem.

[0064] In formula (VI), R 14 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. R 15 represents a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. i each independently represents an integer of 0 to 3. n is an average value and represents a number of 0 to 10.

[0065] The dicyclopentadiene-type epoxy resin is not particularly limited as long as it is an epoxy resin obtained by epoxidizing a compound having a dicyclopentadiene skeleton as a raw material. For example, an epoxy resin represented by the following general formula (VII) can be mentioned.

[0066]

Chem.

[0067] In formula (VII), R 16 represents a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. i each independently represents an integer of 0 to 3. n is an average value and represents a number of 0 to 10.

[0068] The copolymer-type epoxy resin obtained by epoxidizing a novolak resin obtained from a naphthol compound and a phenol compound and an aldehyde compound is not particularly limited as long as it is an epoxy resin using a compound having a naphthol skeleton and a compound having a phenol skeleton as raw materials. For example, an epoxy resin represented by the following general formula (IX) can be mentioned.

[0069]

Chem.

[0070] In formula (IX), R 19 ~R 21represents a monovalent organic group having 1 to 18 carbon atoms, and they may all be the same or different from each other. i independently represents an integer from 0 to 3, j independently represents an integer from 0 to 2, and k independently represents an integer from 0 to 4. l and m are average values, numbers from 0 to 10, and (l + m) represents a number from 0 to 10. The terminal of the epoxy resin represented by formula (IX) is either of the following formula (IX-1) or (IX-2). In formula (IX-1) and (IX-2), R 19 ~R 21 , the definitions of i, j, and k are the same as those of R 19 ~R 21 in formula (IX), i, j, and k. n is 1 (when bonded through a methylene group) or 0 (when not bonded through a methylene group).

[0071]

Chemical formula

[0072] Examples of the epoxy resin represented by the above general formula (IX) include a random copolymer containing l structural units and m structural units randomly, an alternating copolymer containing them alternately, a copolymer containing them regularly, a block copolymer containing them in a block shape, etc. Any one of these may be used alone or two or more of them may be used in combination.

[0073] As the copolymer-type epoxy resin, Epiklon HP-5000 (trade name, manufactured by DIC Corporation), which is a methoxynaphthalene-cresol formaldehyde co-condensation type epoxy resin containing the following two structural units in a random, alternating, or block order, is also preferable. For example, the epoxy resin represented by the following general formula can be mentioned. In the following general formula, n and m are average values, numbers from 0 to 10, and (n + m) represents a number from 0 to 10. Preferably, n and m are average values, numbers from 1 to 9, and (n + m) represents a number from 2 to 10.

[0074]

Chemical formula

[0075] The aralkyl type epoxy resin is not particularly limited as long as it is an epoxy resin made from a phenolic resin synthesized from at least one selected from the group consisting of phenolic compounds such as phenol and cresol and naphthol compounds such as naphthol and dimethylnaphthol, and dimethoxyparaxylene, bis(methoxymethyl)biphenyl or derivatives thereof. For example, an epoxy resin obtained by glycidyl etherifying a phenolic resin synthesized from at least one selected from the group consisting of phenolic compounds such as phenol and cresol and naphthol compounds such as naphthol and dimethylnaphthol, and dimethoxyparaxylene, bis(methoxymethyl)biphenyl or derivatives thereof is preferred, and epoxy resins represented by the following general formulas (X) and (XI) are more preferred.

[0076]

Chemical formula

[0077] In formulas (X) and (XI), R 38 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different from each other. R 37 , R 39 ~R 41 represent monovalent organic groups having 1 to 18 carbon atoms, and all of them may be the same or different from each other. i is an integer of 0 to 3 independently, j is an integer of 0 to 2 independently, k is an integer of 0 to 4 independently, and l represents an integer of 0 to 4 independently. n is an average value and is a number of 0 to 10 independently.

[0078] Regarding R 8 ~R 21 and R 37 ~R 41 in the above general formulas (II) to (VII), (IX) to (XI), "all of them may be the same or different from each other" means, for example, that all of the 8 to 88 R 8 in formula (II) may be the same or different from each other. The other R 9 ~R21 and R 37 ~R 41 Regarding ~R as well, it means that all of the respective numbers included in the formula may be the same or different. Also, R 8 ~R 21 and R 37 ~R 41 may each be the same or different. For example, all of R 9 and R 10 may be the same or different. Further, the monovalent organic group having 1 to 18 carbon atoms in the general formulas (III) to (VII), (IX) to (XI) is preferably an alkyl group or an aryl group.

[0079] In the above general formulas (II) to (VII), (IX) to (XI), n is an average value, and each is preferably independently in the range of 0 to 10. When n is 10 or less, the melt viscosity of the resin component does not become too high, the viscosity during melt molding of the curable resin composition decreases, and the occurrence of filling defects, deformation of bonding wires (gold wires connecting elements and leads), etc. tends to be suppressed. More preferably, n is set in the range of 0 to 4.

[0080] The epoxy equivalent of the epoxy resin is not particularly limited. From the viewpoint of the balance of various properties such as moldability, heat resistance, and electrical reliability, the epoxy equivalent of the epoxy resin is preferably 40 g / eq to 1000 g / eq, more preferably 45 g / eq to 500 g / eq, and even more preferably 50 g / eq to 350 g / eq. The epoxy equivalent of the epoxy resin shall be the value measured by the method in accordance with JIS K 7236:2009.

[0081] The epoxy resin may be solid or liquid at 25°C. When the epoxy resin is solid at 25°C, the softening point or melting point of the epoxy resin is not particularly limited. From the viewpoint of the balance between moldability and heat resistance, the softening point or melting point of the epoxy resin is preferably 40°C to 180°C. Further, from the viewpoint of handleability during the production of the curable resin composition, the softening point or melting point of the epoxy resin is preferably 50°C to 130°C. In the present disclosure, the softening point refers to the value measured by the ring and ball method of JIS K 7234:1986. In the present disclosure, the melting point refers to the value measured according to the visual method of JIS K 0064:1992.

[0082] From the viewpoint of the balance between moldability and heat resistance, the Mw of the epoxy resin is preferably 550 to 1050, more preferably 650 to 950.

[0083] The proportion of the triphenylmethane type epoxy resin in 100 parts by mass of the total amount of the epoxy resin in the curable resin composition is preferably 15 parts by mass or more, more preferably 20 parts by mass or more, and still more preferably 25 parts by mass or more. The upper limit value of the proportion is not particularly limited and may be 95 parts by mass or less, 90 parts by mass or less, 85 parts by mass or less, or 50 parts by mass or less.

[0084] The proportion of the biphenyl type epoxy resin in 100 parts by mass of the total amount of the epoxy resin in the curable resin composition is preferably 5 parts by mass or more, more preferably 10 parts by mass or more, and still more preferably 15 parts by mass or more. The upper limit value of the proportion is not particularly limited and may be 50 parts by mass or less, 40 parts by mass or less, or 30 parts by mass or less.

[0085] The total content of the epoxy resin in the curable resin composition is preferably 0.5% by mass to 60% by mass, more preferably 2% by mass to 50% by mass, and even more preferably 3% by mass to 45% by mass from the viewpoints of strength, fluidity, heat resistance, moldability, etc.

[0086] (Hardening agent) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition preferably contains a hardening agent. The type of the hardening agent is not particularly limited and can be selected from those generally used as components of the curable resin composition. The hardening agent may be used alone or in combination of two or more. In the present disclosure, the hardening agent only needs to have a structure capable of reacting with the epoxy resin contained in the curable resin composition and curing the curable resin composition, and even a compound having a small content and a small contribution to the curing reaction of the curable resin composition is included in the hardening agent.

[0087] Examples of the hardening agent include phenolic hardening agents, amine-based hardening agents, acid anhydride-based hardening agents, polymercaptan-based hardening agents, polyaminoamide-based hardening agents, isocyanate-based hardening agents, blocked isocyanate-based hardening agents, and the like. Among these, from the viewpoint of heat resistance, the hardening agent is preferably a phenolic hardening agent or an amine-based hardening agent. Also, from the viewpoints of the adhesiveness of the curable resin composition of the present disclosure to the lead frame and heat resistance, the hardening agent is preferably a phenolic hardening agent.

[0088] Examples of phenolic curing agents include phenolic resins and polyhydric phenol compounds having two or more phenolic hydroxyl groups in one molecule. Specifically, polyhydric phenol compounds such as resorcinol, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenyl; phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, dihydroxynaphthalene, etc. at least one phenolic compound selected from the group consisting of, and aldehyde compounds such as formaldehyde, acetaldehyde, propionaldehyde, etc. are condensed or co-condensed under an acidic catalyst to obtain a novolak-type phenolic resin; an aralkyl-type phenolic resin such as a phenolic resin synthesized from the above phenolic compound and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, etc., a naphthol aralkyl resin; a paraxylylene and / or metaxylylene-modified phenolic resin; a melamine-modified phenolic resin; a terpene-modified phenolic resin; a dicyclopentadiene-type phenolic resin and a dicyclopentadiene-type naphthol resin synthesized by copolymerization from the above phenolic compound and dicyclopentadiene; a cyclopentadiene-modified phenolic resin; a polycyclic aromatic ring-modified phenolic resin; a biphenyl-type phenolic resin; a triphenylmethane-type phenolic resin obtained by condensing or co-condensing the above phenolic compound and aromatic aldehyde compounds such as benzaldehyde, salicylaldehyde, etc. under an acidic catalyst; phenolic resins obtained by copolymerizing two or more of these, and the like. These phenolic curing agents may be used alone or in combination of two or more.

[0089] Examples of the aralkyl type phenolic resin include phenolic resins, naphthol aralkyl resins, etc. which are synthesized from phenolic compounds and dimethoxyparaxylene, bis(methoxymethyl)biphenyl, etc. The aralkyl type phenolic resin may be further copolymerized with other phenolic resins. Examples of the copolymerized aralkyl type phenolic resin include copolymerized phenolic resins of triphenylmethane type phenolic resin and aralkyl type phenolic resin, copolymerized phenolic resins of salicylaldehyde type phenolic resin and aralkyl type phenolic resin, copolymerized phenolic resins of novolak type phenolic resin and aralkyl type phenolic resin, etc.

[0090] The aralkyl type phenolic resin is not particularly limited as long as it is a phenolic resin synthesized from at least one selected from the group consisting of phenolic compounds and naphthol compounds, and dimethoxyparaxylene, bis(methoxymethyl)biphenyl or derivatives thereof. For example, phenolic resins represented by the following general formulas (XII) to (XIV) are preferable.

[0091] [Chemical formula]

[0092] In formulas (XII) to (XIV), R 23 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. R 22 , R 24 , R 25 and R 28 represent a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. R 26 and R 27 represent a hydroxyl group or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. i is each independently an integer of 0 to 3, j is each independently an integer of 0 to 2, k is each independently an integer of 0 to 4, and p is each independently an integer of 0 to 4. n is an average value and is each independently a number of 0 to 10.

[0093] From the viewpoints of the adhesiveness and heat resistance of the curable resin composition of the present disclosure to the lead frame, an aralkyl-type phenol resin is preferably a phenol resin represented by the general formula (XIII). From the viewpoints of the adhesiveness and heat resistance of the curable resin composition of the present disclosure to the lead frame, and further, in the general formula (XIII), it is preferable that both i and k are 0.

[0094] The dicyclopentadiene-type phenol resin is not particularly limited as long as it is a phenol resin obtained from a compound having a dicyclopentadiene skeleton as a raw material. For example, a phenol resin represented by the following general formula (XV) can be mentioned.

[0095]

Chemical formula

[0096] In formula (XV), R 29 represents a monovalent organic group having 1 to 18 carbon atoms, and they may all be the same or different from each other. i each independently represents an integer of 0 to 3. n is an average value and represents a number of 0 to 10.

[0097] The triphenylmethane-type phenol resin is not particularly limited as long as it is a phenol resin obtained from an aromatic aldehyde compound as a raw material. For example, a phenol resin represented by the following general formula (XVI) is preferable.

[0098]

Chemical formula

[0099] In formula (XVI), R 30 and R 31 represent a monovalent organic group having 1 to 18 carbon atoms, and they may all be the same or different from each other. i is each independently an integer of 0 to 3, and k is each independently an integer of 0 to 4. n is an average value and is a number of 0 to 10.

[0100] The copolymerized phenolic resin of a triphenylmethane type phenolic resin and an aralkyl type phenolic resin is not particularly limited as long as it is a copolymerized phenolic resin of a phenolic resin obtained from a compound having a benzaldehyde skeleton as a raw material and an aralkyl type phenolic resin. For example, the phenolic resin represented by the following general formula (XVII) is preferable.

[0101] [Chemical formula]

[0102] In formula (XVII), R 32 ~R 34 represent monovalent organic groups having 1 to 18 carbon atoms, and all of them may be the same or different. i is an integer of 0 to 3 independently, k is an integer of 0 to 4 independently, and q is an integer of 0 to 5 independently. l and m are average values and are numbers of 1 to 11 independently.

[0103] The novolak type phenolic resin is not particularly limited as long as it is a phenolic resin obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of a phenolic compound and a naphthol compound with an aldehyde compound under an acidic catalyst. For example, the phenolic resin represented by the following general formula (XVIII) is preferable.

[0104] [Chemical formula]

[0105] In formula (XVIII), R 35 represents a hydrogen atom or a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. R 36 represents a monovalent organic group having 1 to 18 carbon atoms, and all of them may be the same or different. i independently represents an integer of 0 to 3. n is an average value and represents a number of 0 to 10.

[0106] R in the above general formulas (XII) to (XVIII)22 ~R 36 Regarding the "each may be the same or different" described for ~R, for example, it means that all i ~R in formula (XII) may be the same or different from each other. For other ~R 22 it also means that all of them included in the formula may be the same or different from each other in terms of the respective numbers. Also, ~R 23 ~R 36 means that all of them included in the formula may be the same or different from each other in terms of the respective numbers. Also, ~R 22 ~R 36 may be the same or different from each other. For example, all of ~R 22 and ~R 23 may be the same or different from each other, and all of ~R 30 and ~R 31 may be the same or different from each other.

[0107] In the above general formulas (XII) to (XVIII), n is preferably in the range of 0 to 10. When it is 10 or less, the melt viscosity of the resin component does not become too high, and the viscosity during melt molding of the curable resin composition also becomes low, making it difficult for filling defects, deformation of bonding wires (gold wires connecting elements and leads), etc. to occur. The average n in one molecule is preferably set in the range of 0 to 4.

[0108] Specific examples of the amine-based curing agent include aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexylmethane; aromatic amine compounds such as diethyltoluenediamine, 3,3'-diethyl-4,4'-diaminodiphenylmethane, dimethylthiotoluenediamine, 2-methylaniline; imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole; and imidazoline compounds such as imidazoline, 2-methylimidazoline, 2-ethylimidazoline.

[0109] The functional group equivalent weight of the curing agent (in the case of phenolic curing agents, the hydroxyl group equivalent weight; in the case of amine curing agents, the active hydrogen equivalent weight) is not particularly limited. From the perspective of the balance of various properties such as moldability, heat resistance, and electrical reliability, it is preferably 10 g / eq to 1000 g / eq, and more preferably 30 g / eq to 500 g / eq. In the case of phenolic curing agents, the hydroxyl group equivalent weight refers to the value calculated based on the hydroxyl value measured in accordance with JIS K 0070:1992. Also, in the case of amine curing agents, the active hydrogen equivalent weight refers to the value calculated based on the amine value measured in accordance with JIS K 7237:1995.

[0110] When the curing agent is solid at 25°C, its softening point or melting point is not particularly limited. From the perspective of moldability and heat resistance, the softening point or melting point of the curing agent is preferably 40°C to 180°C. Also, from the perspective of handleability during the production of the curable resin composition, the softening point or melting point of the curing agent is preferably 50°C to 130°C.

[0111] When the curing agent is a phenolic curing agent, the equivalent ratio of the phenolic hydroxyl group (active hydrogen) of the phenolic curing agent to the epoxy group of the epoxy resin in the curable resin composition (moles of phenolic hydroxyl group (active hydrogen) of the phenolic curing agent / moles of epoxy group of the epoxy resin) is not particularly limited, and for example, it can be 0.5 to 1.2, may be 0.5 or more and less than 1.0, may be 0.55 to 0.9, or may be 0.6 to 0.8. When the equivalent ratio is 0.5 or more and less than 1.0, the adhesiveness between the cured product of the curable resin composition and the lead frame tends to improve. The reason for this is not clear, but it can increase the value of tanδ near the reflow temperature, and the internal stress of the resin cured product during reflow tends to be relaxed. From the perspective of improving the adhesion between the cured product of the curable resin composition and the lead frame, it is preferable that the equivalent ratio of the curing agent to the epoxy resin, that is, the curing agent / epoxy resin (preferably, the number of moles of phenolic hydroxyl groups (active hydrogens) of the phenolic curing agent / the number of moles of epoxy groups of the epoxy resin) is 0.8 or less.

[0112] When the curing agent contains a phenolic curing agent, from the perspective of the adhesion of the curable resin composition to the lead frame, the content of the phenolic curing agent in the total mass of the curing agent is preferably 50% by mass to 100% by mass, more preferably 60% by mass to 100% by mass, and even more preferably 70% by mass to 100% by mass.

[0113] When the phenolic curing agent contains an aralkyl-type phenolic resin, from the perspective of the adhesion of the curable resin composition to the lead frame, the content of the aralkyl-type phenolic resin in the total mass of the phenolic curing agent may be greater than 0% by mass and 100% by mass or less, and may also be 50% by mass to 70% by mass or 80% by mass to 100% by mass. The phenolic curing agent may not contain an aralkyl-type phenolic resin.

[0114] When the phenolic curing agent contains a triphenylmethane-type phenolic resin, from the perspective of the adhesion of the curable resin composition to the lead frame, the content of the triphenylmethane-type phenolic resin in the total mass of the phenolic curing agent may be greater than 0% by mass and 90% by mass or less, and may also be 20% by mass to 50% by mass or 70% by mass to 90% by mass.

[0115] (Inorganic filler) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition may contain an inorganic filler. By including the inorganic filler in the curable resin composition, the hygroscopicity of the curable resin composition is reduced, and the strength in the cured state tends to be improved. When the curable resin composition is used as a sealing material for a semiconductor package, it is preferable to contain an inorganic filler.

[0116] The inorganic material constituting the inorganic filler is not particularly limited. Specific examples of the inorganic material include spherical silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, aluminum nitride, boehmite, beryllia, magnesium oxide, zirconia, zircon, forsterite, steatite, spinel, mullite, titania, talc, clay, mica, titanate, and the like. An inorganic filler composed of an inorganic material having a flame retardant effect may be used. Examples of the inorganic material having a flame retardant effect include composite metal hydroxides such as aluminum hydroxide, magnesium hydroxide, and composite hydroxide of magnesium and zinc, and zinc borate. The inorganic filler may be used alone or in combination of two or more.

[0117] The shape of the inorganic filler is not particularly limited, and examples thereof include powdery, spherical, fibrous, and the like. From the viewpoints of the fluidity during molding of the curable resin composition and the mold wear, it is preferably spherical.

[0118] The average particle diameter of the inorganic filler is not particularly limited. From the viewpoint of the balance of the viscosity, the filling property, etc. of the curable resin composition, the volume average particle diameter of the inorganic filler is preferably 0.1 μm to 50 μm, more preferably 0.3 μm to 30 μm, and even more preferably 0.5 μm to 25 μm. The volume average particle diameter of the inorganic filler can be measured as the volume average particle diameter (D50) by a laser diffraction / scattering particle size distribution measuring device.

[0119] The particle diameter of the inorganic filler may be top-cut, may be top-cut at 100 μm or less, or may be top-cut at 75 μm or less. The top-cut particle diameter can be determined from the particle size distribution when the above volume average particle diameter (D50) is measured.

[0120] When the curable resin composition contains an inorganic filler, its content is not particularly limited. The content of the inorganic filler relative to the whole curable resin composition is preferably 30% to 90% by mass, more preferably 35% to 80% by mass, and even more preferably 40% to 70% by mass. When the content of the inorganic filler is 30% by mass or more of the whole curable resin composition, properties such as the thermal expansion coefficient, thermal conductivity, and elastic modulus of the cured product tend to be more improved. When the content of the inorganic filler is 90% by mass or less of the whole curable resin composition, an increase in the viscosity of the curable resin composition is suppressed, and the fluidity tends to be more improved and the moldability tends to be better.

[0121] The content of the inorganic filler relative to the whole curable resin composition is preferably 68% to 86% by volume, more preferably 70% to 84% by volume, and even more preferably 72% to 82% by volume. When the content of the inorganic filler is 68% by volume or more of the whole curable resin composition, properties such as the thermal expansion coefficient, thermal conductivity, and elastic modulus of the cured product tend to be more improved. When the content of the inorganic filler is 86% by volume or less of the whole curable resin composition, an increase in the viscosity of the curable resin composition is suppressed, and the fluidity tends to be more improved and the moldability tends to be better.

[0122] (Curing accelerator) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition may contain a curing accelerator. The type of the curing accelerator is not particularly limited and can be selected according to the type of the epoxy resin, the desired properties of the curable resin composition, etc. The curing accelerator may be used alone or in combination of two or more. Specific examples of the curing accelerator are described below, but are not limited thereto. As the hardening accelerator, diazabicycloalkenes such as 1,5-diazabicyclo[4.3.0]nonene-5 (DBN) and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU); cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolak salts of the cyclic amidine compounds or their derivatives; compounds having intramolecular polarization formed by adding compounds having a π bond, such as quinone compounds such as maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and diazophenylmethane; cyclic amidinium compounds such as tetraphenylborate salts of DBU, tetraphenylborate salts of DBN, tetraphenylborate salts of 2-ethyl-4-methylimidazole, and tetraphenylborate salts of N-methylmorpholine; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of the tertiary amine compounds; ammonium salt compounds such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide;Organic phosphines such as primary phosphines like ethylphosphine and phenylphosphine, secondary phosphines like dimethylphosphine and diphenylphosphine, and tertiary phosphines like triphenylphosphine, diphenyl(p-tolyl)phosphine, tris(alkylphenyl)phosphine, tris(alkoxyphenyl)phosphine, tris(alkylalkoxyphenyl)phosphine, tris(dialkylphenyl)phosphine, tris(trialkylphenyl)phosphine, tris(tetraalkylphenyl)phosphine, tris(dialkoxyphenyl)phosphine, tris(trialkoxyphenyl)phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, trinaphthylphosphine, tris(benzyl)phosphine, etc.; phosphine compounds such as complexes of the organic phosphines with organic borons; compounds having intramolecular polarization formed by adding a compound having a π bond such as maleic anhydride, 1,4-benzoquinone, 2,5-xylenol, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, anthraquinone, etc. to the organic phosphine or the phosphine compound; compounds having intramolecular polarization obtained through a dehydrohalogenation step after reacting the organic phosphine or the phosphine compound with a halogenated phenol compound such as 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-t-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo-4'-hydroxybiphenyl, etc.Tetra-substituted phosphonium compounds such as tetraphenylphosphonium, tetraphenylborate salts of tetra-substituted phosphonium such as tetraphenylphosphonium tetra-p-tolylborate, salts of tetra-substituted phosphonium and phenolic compounds, etc.; phosphobetaine compounds; adducts of phosphonium compounds and silane compounds, etc. can be mentioned.; Suitable curing accelerators include triphenylphosphine, quinone compound adducts of triphenylphosphine, etc.

[0123] When the curable resin composition contains a curing accelerator, the content of the curing accelerator is preferably 0.1% by mass to 8% by mass, more preferably 0.3% by mass to 7% by mass, and even more preferably 0.5% by mass to 6% by mass with respect to 100 parts by mass of the total amount of the epoxy resin and the curing agent. By setting the content of the curing accelerator within the above numerical range, the curing rate of the curable resin composition becomes an appropriate value, and the production of molded articles becomes easy.

[0124] (Various additives) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition may contain various additives such as coupling agents, stress relievers, mold release agents, colorants, flame retardants, ion exchangers, ultraviolet absorbers, etc. in addition to the above-mentioned components. Further, the curable resin composition may contain a siloxane compound having a structural unit having an epoxy group and an alkoxy group and having a polymerization degree of 2. The curable resin composition may contain various additives well-known in the art as needed in addition to the additives exemplified below.

[0125] (Coupling agent) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the method for producing a curable resin composition may contain a coupling agent. The type of the coupling agent is not particularly limited, and known coupling agents can be used. Examples of the coupling agent include silane coupling agents and titanium coupling agents. The coupling agent may be used alone or in combination of two or more.

[0126] The silane coupling agent is not particularly limited, and examples thereof include methyltrimethoxysilane, bis(3-(triethoxysilyl)propyl)tetrasulfide, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-(2-aminoethyl)aminopropyltrimethoxysilane, 3-(2-aminoethyl)aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-ureidopropyltriethoxysilane, octenyltrimethoxysilane, glycidoxyoctyltrimethoxysilane, methacryloxyoctyltrimethoxysilane, and the like.

[0127] Examples of the titanium coupling agent include isopropyltriisostearoyl titanate, isopropyltris(dioctyl pyrophosphate) titanate, isopropyltri(N-aminoethyl-aminoethyl) titanate, tetraoctylbis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(ditridecyl phosphite) titanate, bis(dioctyl pyrophosphate)oxyacetate titanate, bis(dioctyl pyrophosphate)ethylene titanate, isopropyltrioctanoyl titanate, isopropyldimethacrylisostearoyl titanate, isopropyltridodecylbenzenesulfonyl titanate, isopropylisostearyldiacryl titanate, isopropyltri(dioctyl phosphate) titanate, isopropyltricumylphenyl titanate, tetraisopropylbis(dioctyl phosphite) titanate, and the like.

[0128] When the curable resin composition contains a coupling agent, the content of the coupling agent is preferably 0.001 part by mass to 10 parts by mass, more preferably 0.01 part by mass to 8 parts by mass, and even more preferably 0.05 part by mass to 5 parts by mass, based on 100 parts by mass of the inorganic filler contained in the curable resin composition, from the viewpoint of the adhesiveness at the interface between the epoxy resin and the inorganic filler.

[0129] (Stress Relaxant) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition may contain a stress reliever such as silicone oil or silicone rubber particles. By including a stress reliever in the curable resin composition, warping deformation of the package and occurrence of package cracks can be further reduced. Examples of the stress reliever include known stress relievers (plasticizers) generally used. Specifically, examples of the stress reliever include thermoplastic elastomers such as silicone-based, styrene-based, olefin-based, urethane-based, polyester-based, polyether-based, polyamide-based, and polybutadiene-based; natural rubber (NR); rubber particles such as acrylonitrile-butadiene copolymer (NBR), acrylic rubber, urethane rubber, and silicone powder; and rubber particles having a core-shell structure such as methyl methacrylate-styrene-butadiene copolymer (MBS), methyl methacrylate-silicone copolymer, and methyl methacrylate-butyl acrylate copolymer. The stress reliever may be used alone or in combination of two or more. Among them, silicone-based stress relievers are preferred. Examples of the silicone-based stress reliever include those having an epoxy group, those having an amino group, and those obtained by polyether-modifying these.

[0130] When the curable resin composition contains a stress reliever, the content thereof is preferably 10 parts by mass to 60 parts by mass, more preferably 20 parts by mass to 50 parts by mass, based on 100 parts by mass of the epoxy resin contained in the curable resin composition.

[0131] (Release agent) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition may contain a release agent from the viewpoint of releasability from the mold when using the mold during molding. The release agent is not particularly limited, and conventionally known ones can be used. Examples of the release agent include higher fatty acids such as carnauba wax, montanic acid, and stearic acid, metal salts of higher fatty acids, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. The release agent may be used alone or in combination of two or more.

[0132] When the curable resin composition contains a release agent, the content of the release agent is preferably 0.01 part by mass to 15 parts by mass, more preferably 0.1 part by mass to 10 parts by mass, based on 100 parts by mass of the epoxy resin contained in the curable resin composition. When the amount of the release agent is 0.01 part by mass or more based on 100 parts by mass of the resin component, releasability tends to be sufficiently obtained. When it is 15 parts by mass or less, better releasability tends to be obtained.

[0133] (Colorant) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition may contain a colorant. Examples of the colorant include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant can be appropriately selected according to the purpose and the like. The colorant may be used alone or in combination of two or more.

[0134] When the curable resin composition contains a colorant, its content is preferably 0.01% by mass to 5% by mass, more preferably 0.05% by mass to 4% by mass.

[0135] (Flame Retardant) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition may contain a flame retardant. The flame retardant is not particularly limited, and conventionally known ones can be used. Examples of the flame retardant include organic or inorganic compounds containing a halogen atom, an antimony atom, a nitrogen atom, or a phosphorus atom, metal hydroxides, and the like. The flame retardant may be used alone or in combination of two or more.

[0136] When the curable resin composition contains a flame retardant, its content is not particularly limited as long as it is an amount sufficient to obtain a desired flame retardant effect. The content of the flame retardant is preferably 1 part by mass to 300 parts by mass, more preferably 2 parts by mass to 150 parts by mass, based on 100 parts by mass of the epoxy resin contained in the curable resin composition.

[0137] (Ion exchanger) In the present disclosure, the curable resin composition to be evaluated or the curable resin composition produced by the production method of the curable resin composition may contain an ion exchanger. When the curable resin composition is used as a sealing material for a semiconductor package, it is preferable to contain an inorganic ion exchanger from the viewpoint of improving the moisture resistance and high-temperature storage characteristics of the electronic component device provided with the element to be sealed. The ion exchanger is not particularly limited, and conventionally known ones can be used. Specifically, examples include hydrotalcite compounds and hydrous oxides of at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. The ion exchanger may be used alone or in combination of two or more. Specifically, examples of the ion exchanger include hydrotalcite represented by the following general formula (A).

[0138] Mg (1-X) Al X (OH)2(CO3) X / 2 ·mH2O···(A) (0 < X ≦ 0.5, m is a positive number)

[0139] When the curable resin composition contains an ion exchanger, its content is not particularly limited as long as it is sufficient to capture ions such as halogen ions. The content of the ion exchanger is preferably 0.1 part by mass to 30 parts by mass, more preferably 1 part by mass to 6 parts by mass, based on 100 parts by mass of the epoxy resin contained in the curable resin composition.

[0140] <Method for producing curable resin composition> The method for producing the curable resin composition of the present disclosure includes preparing a curable resin composition containing an epoxy resin based on the evaluation results of the evaluation method of the curable resin composition.

[0141] For example, based on the evaluation results of the evaluation method of the curable resin composition, a curable resin composition containing an epoxy resin may be prepared in which at least one numerical value selected from the group consisting of the above-mentioned adhesive strength, curing shrinkage rate, and thermal expansion rate satisfies specific conditions.

[0142] The method for producing the curable resin composition is not particularly limited. As a general method, a method of sufficiently mixing components in a predetermined blending amount with a mixer or the like, followed by melt-kneading with a mixing roll, an extruder, or the like, cooling, and pulverizing can be mentioned. More specifically, for example, a method of uniformly stirring and mixing a predetermined amount of the above-mentioned components, and kneading with a kneader, a roll, an extruder, etc. that have been pre-heated to 70°C to 140°C, cooling, and pulverizing can be mentioned.

[0143] The curable resin composition to be produced is preferably solid at 25°C. When the curable resin composition is solid at 25°C, the shape of the curable resin composition is not particularly limited, and examples include powdery, granular, tablet-like, etc. From the viewpoint of handleability, the dimensions and mass of the curable resin composition when it is tablet-like are preferably such that they match the molding conditions of the package.

[0144] (Use of curable resin composition) The use of the curable resin composition to be produced is not particularly limited, and it can be used, for example, in various mounting techniques as a sealing material for electronic component devices. Further, the curable resin composition can be used in various applications where it is desirable for the resin composition to have good fluidity and curability, such as resin molded bodies for various modules, resin molded bodies for motors, resin molded bodies for in-vehicle use, and sealing materials for protective materials for electronic circuits.

[0145] <Method for manufacturing an electronic component device> The method for manufacturing an electronic component device of the present disclosure includes manufacturing a curable resin composition containing an epoxy resin using a method for manufacturing the curable resin composition, and encapsulating an element with a cured product of the manufactured curable resin composition.

[0146] The electronic component device can include a support member on which an element is mounted. Examples of the support member include a lead frame, a wired tape carrier, a wiring board, glass, a silicon wafer, and an organic substrate. Among the above support members, a lead frame is preferable from the viewpoint of adhesiveness with the cured product of the curable resin composition.

[0147] The surface of the lead frame may or may not be roughened. From the viewpoint of manufacturing cost, a lead frame is preferable, and from the viewpoint of adhesiveness, a roughened lead frame is preferable. The roughening method is not particularly limited, and examples thereof include alkali treatment, silane coupling treatment, sand mat treatment, plasma treatment, and corona discharge treatment.

[0148] The lead frame preferably contains Ag, and may further contain Cu or the like.

[0149] Examples of the element included in the electronic component device include active elements such as silicon chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils.

[0150] Specific configurations of the electronic component device include, but are not limited to, the following configurations. (1) General resin-sealed ICs such as DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outline J-lead Package), TSOP (Thin Small Outline Package), TQFP (Thin Quad Flat Package), etc., which have a structure in which an element is fixed on a lead frame, and the terminal portion and lead portion of the element such as bonding pads are connected using wire bonding, bumps, etc., and then encapsulated using a curable resin composition; (2) TCP (Tape Carrier Package) having a structure in which an element connected to a tape carrier using bumps is encapsulated using a curable resin composition; (3) COB (Chip On Board) modules, hybrid ICs, multi-chip modules, etc., which have a structure in which an element connected to wiring formed on a support member using wire bonding, flip chip bonding, solder, etc., is encapsulated using a curable resin composition; (4) BGAs (Ball Grid Array), CSPs (Chip Size Package), MCPs (Multi Chip Package), SiPs (System in a Package), etc., which have a structure in which an element is mounted on the surface of a support member having terminals for wiring board connection formed on the back surface, the element is connected to the wiring formed on the support member using bumps or wire bonding, and then the element is encapsulated using a curable resin composition

[0151] The method of encapsulating the element using the curable resin composition is not particularly limited, and a known method can be applied. As the encapsulation method, for example, low-pressure transfer molding is common, but injection molding, compression molding, casting, etc. may also be used.

Examples

[0152] The present disclosure will be specifically described below with reference to examples, but the present disclosure is not limited to these examples. Also, numerical values in the tables mean "parts by mass" unless otherwise specified.

[0153] [Experimental Examples 1 to 5] After preliminarily mixing (dry blending) the materials having the formulations shown in Table 1, they were kneaded on a twin-screw roll (roll surface temperature: about 80°C) for about 15 minutes, cooled, and pulverized to produce a powdery curable resin composition. The equivalent ratio of the phenolic hydroxyl group (active hydrogen) of the phenolic curing agent to the epoxy group of the epoxy resin was 0.7.

[0154] Details of the materials in Table 1 are as follows.

[0155] · Epoxy Resin 1: A triphenylmethane type epoxy resin represented by formula (2), epoxy equivalent 214 g / eq · Epoxy Resin 2: A sulfur atom-containing type epoxy resin, epoxy equivalent 238 g / eq to 254 g / eq, melting point 116°C to 126°C · Epoxy Resin 3: A biphenyl type epoxy resin, epoxy equivalent 241 g / eq · Epoxy Resin 4: A methoxynaphthalene·cresol formaldehyde co-condensed type epoxy resin, epoxy equivalent 250 g / eq · Epoxy Resin 5: A biphenyl type epoxy resin, epoxy equivalent 192 g / eq · Epoxy Resin 6: A biphenyl type epoxy resin, epoxy equivalent 192 g / eq · Epoxy Resin 7: A biphenyl type epoxy resin, epoxy equivalent 192 g / eq

[0156] · Curing Agent 1: An aralkyl type phenolic resin, hydroxyl equivalent 175 g / eq · Curing Agent 2: A triphenylmethane type phenolic resin, hydroxyl equivalent 104 g / eq · Curing Agent 3: An alkyl-modified type phenolic resin, hydroxyl equivalent 224 g / eq · Curing Agent 4: A biphenylaralkyl type phenolic resin, hydroxyl equivalent 204 g / eq · Hardener 5: Aminotriazine-modified phenolic resin, amine equivalent 120 g / eq · UV absorber 1: Benzotriazole-based UV absorber · UV absorber 2: Triazine-based UV absorber · Curing accelerator 1: 1,4-Benzoquinone adduct of triphenylphosphine · Curing accelerator 2: Triphenylphosphine · Coupling agent 1: N-Phenyl-3-aminopropyltrimethoxysilane · Coupling agent 2: 3-Glycidoxypropyltrimethoxysilane · Coupling agent 3: Bis(3-(triethoxysilyl)propyl)tetrasulfide · Coupling agent 4: 3-Mercaptopropyltrimethoxysilane · Coupling agent 5: Methyltrimethoxysilane · Release agent: Ester wax such as montanic acid ester · Colorant: Carbon black · Ion exchanger 1: Unfired hydrotalcite compound (Mg / Al = 3.0) · Ion exchanger 2: Unfired hydrotalcite compound (Mg / Al = 2.25) · Ion exchanger 3: Unfired hydrotalcite compound (Mg / Al = 3.0) · Stress reliever 1: Silicone-based stress reliever having an epoxy group · Stress reliever 2: Triphenylphosphine oxide · Stress reliever 3: Coumarone resin, softening point 100 °C, Nippon Tsuchu Kagaku Co., Ltd. · Stress reliever 4: Indene polymer · Inorganic filler 1: Spherical silica particles with a volume average particle diameter of 26.9 μm · Inorganic filler 2: Spherical silica particles with a volume average particle diameter of 0.5 μm · Inorganic filler 3: Spherical silica particles with a volume average particle diameter of 20 μm

[0157] <<Evaluation of the curable resin composition>> The properties of the curable resin composition prepared in the experimental example were measured and evaluated by the following methods. The evaluation results are shown in Table 2.

[0158] <Measurement of spiral flow> The spiral flow of the curable resin composition was measured by the method described above.

[0159] <Measurement of gel time> The gel time of the curable resin composition was measured by the method described above.

[0160] <Measurement of linear expansion coefficient> The thermal expansion coefficients (α1) at 10°C to 30°C and (α2) at 180°C to 200°C of the cured product of the curable resin composition were measured by the method described above. As the thermomechanical analyzer, TMA / SS6100 manufactured by Seiko Instruments Inc. was used.

[0161] <Glass transition temperature (Tg) of cured product> The temperature at the intersection of the tangent line at 10°C to 30°C and the tangent line at 200°C to 220°C obtained from the measurement of the linear expansion coefficient was defined as the glass transition temperature of the cured product.

[0162] <Measurement of curing shrinkage rate> Using a mold with measured dimensions, by transfer molding, disk-shaped moldings (test pieces) of the curable resin composition obtained in the above examples and comparative examples were molded under the conditions of a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 90 seconds, and then the test pieces were allowed to cool to 25°C. After cooling, the average value of the diameters at two points on each of the front and back surfaces of the test piece was designated as Rm (mm), and the average value of the inner diameters at two points on the mold corresponding to the front surface of the test piece and the average value of the inner diameters at two points on the mold corresponding to the back surface of the test piece were designated as Rd (mm). By substituting into the following formula, the curing shrinkage rate of the curable resin composition was determined. Curing shrinkage rate (%) = [(Rd - Rm) / Rd] × 100

[0163] <Measurement of adhesion 1 to AgCu> The adhesive strength 1 of the cured product of the curable resin composition with respect to AgCu was measured by the above method. As the measuring device, the product name 4000 Optima manufactured by Nordson was used.

[0164] <Measurement of Adhesive Strength 2 with Respect to AgCu> The adhesive strength 2 of the cured product of the curable resin composition with respect to AgCu was measured by the above method. As the measuring device, the product name 4000 Optima manufactured by Nordson was used.

[0165] <Evaluation of Peelability under High Temperature and Humidity> An 80-pin flat package (lead frame material: AgCu) with outer dimensions of 20 mm in length, 14 mm in width, and 2 mm in thickness, on which a silicon chip (8 mm in length, 10 mm in width, and 0.4 mm in thickness) sealed using the cured product of the curable resin composition formed under the above conditions was mounted, was fabricated. The above package was heated under the conditions of 85°C and 85% RH for 168 hours (MSL1). Thereafter, at 260°C, a reflow process was performed for 10 seconds each, and the presence or absence of peeling inside the package was observed using an ultrasonic flaw detector (manufactured by Hitachi Construction Machinery Co., Ltd., HYE-FOCUS). The peelability was evaluated based on the number of packages in which peeling occurred with respect to the number of test packages (16 pieces).

[0166]

Table 1

[0167]

Table 2

[0168] As shown in Table 2, in Experimental Examples 1 to 3 where the numerical values of α1 and α2, which are the coefficients of thermal expansion, the curing shrinkage rate, Adhesion 1, and Adhesion 2 tend to be high, compared with Experimental Examples 4 and 5 where these numerical values tend to be low, it can be seen that peeling is significantly suppressed under the heating and humidifying conditions of 85°C and 85% RH for 168 hours. Therefore, it is possible to estimate the peelability between the lead frame and the cured product of the curable resin composition by evaluating the coefficient of thermal expansion, the curing shrinkage rate, the adhesion, etc.

Claims

1. An evaluation method for a curable resin composition, which evaluates at least one selected from the group consisting of the adhesive strength of a cured product of the curable resin composition containing an epoxy resin to AgCu, the curing shrinkage rate of a molded product of the curable resin composition, and the thermal expansion rate of the cured product of the curable resin composition, and estimates the peelability between a lead frame containing AgCu and a cured product of the curable resin composition encapsulating an element.

2. The evaluation method for the curable resin composition according to Claim 1, wherein the adhesive strength is the adhesive strength at 100°C to 300°C after heating and humidifying at 50°C to 100°C and 50% to 95% RH for 10 hours to 1000 hours.

3. The curable resin composition further contains a curing agent, and the evaluation method for the curable resin composition according to Claim 1, wherein the equivalent ratio of the curing agent to the epoxy resin, which is the equivalent ratio of the curing agent and the epoxy resin, is 0.8 or less.

4. The evaluation method for the curable resin composition according to Claim 1, which further contains an inorganic filler.

5. The evaluation method for the curable resin composition according to Claim 1, wherein the peelability is estimated by confirming whether at least one numerical value selected from the group consisting of the adhesive strength, the curing shrinkage rate, and the thermal expansion rate satisfies specific conditions.

6. A manufacturing method for a curable resin composition, which includes preparing a curable resin composition containing an epoxy resin based on the evaluation result of the evaluation method for the curable resin composition according to any one of Claims 1 to 5.

7. A manufacturing method for a curable resin composition, which includes preparing a curable resin composition containing an epoxy resin based on the evaluation result of the evaluation method for the curable resin composition according to any one of Claims 1 to 5, and at least one numerical value selected from the group consisting of the adhesive strength, the curing shrinkage rate, and the thermal expansion rate satisfies specific conditions.

8. Manufacturing a curable resin composition containing an epoxy resin using the manufacturing method for the curable resin composition according to Claim 6, and encapsulating an element with the cured product of the manufactured curable resin composition, A manufacturing method for an electronic component device including.

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