Joining device, and article manufacturing method
JP2025103814A5Pending Publication Date: 2026-04-09CANON KK
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2026-04-09
AI Technical Summary
Technical Problem
The generation of particles during the attachment and detachment of collets in a bonding apparatus can lead to precision issues in bonding dies to substrates, such as die tilting due to particle adhesion.
Method used
A bonding apparatus with a control unit that manages the balance between attractive forces acting between holding portions and chucks using magnets and negative pressure to minimize particle generation during collet attachment and detachment.
Benefits of technology
Reduces particle generation, enhancing the precision of the bonding process by controlling the forces involved in collet handling.
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Abstract
To provide a technique advantageous for reducing the generation of particles in a joining device.SOLUTION: A joining device performing processing of joining a first member to a second member, comprises: a first holding unit that holds a chuck in contact with the first member in the processing; a second holding unit that holds the chuck in attachment of the chuck to the first holding unit and / or removal of the chuck from the first holding unit; and a control unit that controls the balance between a first attractive force acting between the first holding unit and the chuck, and a second attractive force acting between the second holding unit and the chuck.SELECTED DRAWING: Figure 8
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