Resin composition, method for producing the same, and prepreg

Abstract

To provide a resin composition, a method for producing the same, and a prepreg.SOLUTION: A method for producing a resin composition includes: a ball mill process of forming a rough layer on the surface of a filler, and forming a chemically modified layer by bonding a polysiloxane resin to the rough layer, to obtain a modified filler; and adding the modified filler to a heat-resistant resin, to form a resin composition. Here, the polysiloxane resin has a functional group, and the equivalent of the polysiloxane resin is 1,500 g / mol to 10,000 g / mol.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a resin composition, a method for producing the same, and a prepreg, and particularly to a resin composition having a low coefficient of thermal expansion, a method for producing the same, and a prepreg.

Background Art

[0002] In order to improve efficiency, semiconductors are gradually developing towards heterogeneous integration, and its core technology is advanced packaging.

[0003] Advanced packaging refers to the packaging technology of wafers with a size of 7 nm or less. In order to cope with miniaturization, advanced packaging requires extremely high dimensional accuracy and reliability. Therefore, good dimensional stability and heat resistance are required for the carrier substrate.

[0004] In conventional carrier substrate materials, in order to achieve ideal properties, a higher content of filler is usually added. However, when the addition rate of the filler is high, the problem of filler sedimentation is likely to occur, and the reliability and yield of the carrier substrate decrease.

[0005] Therefore, solving the filler sedimentation so that the carrier substrate has good reliability on the premise that the carrier substrate material is improved to meet the desired properties is an important issue for this business.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The technical problem to be solved by the present invention is to provide a resin composition, a method for producing the same, and a prepreg in view of the deficiencies of the prior art.

Means for Solving the Problems

[0007] To solve the above technical problems, one of the technical means adopted by the present invention is to provide a method for manufacturing a resin composition. The method for manufacturing a resin composition includes performing a ball mill process to obtain a modified filler by forming a rough layer on the surface of the filler and attaching a polysiloxane resin to the rough layer to form a chemically modified layer, and adding the modified filler to a heat-resistant resin to form a resin composition. Here, the polysiloxane resin has a functional group, and the equivalent weight of the polysiloxane resin is 1,500 g / mol to 10,000 g / mol.

[0008] In one embodiment, the added weight of the filler in the ball mill process is 15 to 30 times the added weight of the polysiloxane resin.

[0009] In one embodiment, the particle size of the filler is 0.1 μm to 2 μm.

[0010] In one embodiment, the ball mill process is performed on the polysiloxane resin and the filler in a solvent such as butanone, cyclohexanone, or toluene.

[0011] In one embodiment, the functional group is at the side chain or the end of the molecular chain of the polysiloxane resin.

[0012] In one embodiment, the functional group includes an epoxy group or an amino group.

[0013] In one embodiment, the added weight of the modified filler is 2.5 to 3.5 times the added weight of the heat-resistant resin.

[0014] In one embodiment, the heat-resistant resin includes a bismaleimide resin, an epoxy resin, and a thermosetting acrylic resin.

[0015] In one embodiment, with the total weight of the heat-resistant resin being 100% by weight, the heat-resistant resin includes 50% to 70% by weight of a bismaleimide resin, 5% to 15% by weight of an epoxy resin, and 10% to 25% by weight of a thermosetting acrylic resin.

[0016] To solve the above technical problems, another technical means adopted by the present invention is to provide a resin composition. The resin composition includes a heat-resistant resin and a modified filler dispersed in the heat-resistant resin. The added weight of the modified filler is 2.5 to 3.5 times the added weight of the heat-resistant resin. A rough layer is formed on the surface of the modified filler, and a chemical modification layer formed of a polysiloxane resin is formed on the rough layer. The polysiloxane resin has a functional group, and the equivalent weight of the polysiloxane resin is 1,500 g / mol to 10,000 g / mol.

[0017] In one embodiment, the functional group includes an epoxy group or an amino group.

[0018] To solve the above technical problems, another technical means adopted by the present invention is to provide a prepreg obtained by impregnating a fiber substrate with the resin composition and then drying it. The polysiloxane resin crosslinks with the heat-resistant resin through a functional group, and the prepreg is for forming a resin substrate having a coefficient of thermal expansion of 1.0 ppm / °C to 3.5 ppm / °C.

[0019] In one embodiment, the glass transition temperature of the resin substrate is 340°C to 360°C.

Advantages of the Invention

[0020] Advantageous effects of the present invention are that the resin composition, its manufacturing method, and the prepreg according to the present invention, due to technical features such as "performing a ball mill process on the filler" and "the polysiloxane resin has a functional group and the equivalent weight of the polysiloxane resin is 1,500 g / mol to 10,000 g / mol", the resin substrate has good heat resistance and a low coefficient of thermal expansion.

Brief Description of the Drawings

[0021]

Figure 1

Figure 2

Figure 3

Figure 4

BEST MODE FOR CARRYING OUT THE INVENTION

[0022] In order to further understand the features and technical content of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings. However, the provided accompanying drawings are only for reference and explanation, and are not for limiting the scope of the claims of the present invention.

[0023] Hereinafter, "a resin composition, a method for manufacturing the same, and a prepreg" will be described according to a specific embodiment. Those skilled in the art can understand the advantages and effects of the present invention based on the content disclosed in this specification. The present invention can be implemented or applied according to other different specific embodiments, and for each detail in this specification, various modifications and changes can be made based on different viewpoints and applications without departing from the concept of the present invention. Also, as described in advance, the accompanying drawings of the present invention are simple schematic explanations and are not drawn based on actual sizes. The technical content of the present invention will be described in more detail based on the following embodiments, but the disclosed content does not limit the protection scope of the present invention. Also, the term "or" used in this specification may include any one or a combination of a plurality of items listed in relation to the actual situation.

[0024] The manufacturing method of the resin composition according to the present invention is such that a rough layer and a chemical modification layer are formed on the surface of the filler by a ball mill. The rough layer improves the surface area of the filler, which is advantageous for the formation of the chemical modification layer. The chemical modification layer improves the dispersibility of the filler in the resin composition and extends the sedimentation time of the filler in the resin composition. Thus, the resin composition has excellent processability, and the manufactured resin substrate also has good reliability.

[0025] The manufacturing method of the resin composition according to the present invention includes performing a ball mill process on the filler to obtain a modified filler (step S1), and forming a resin composition by adding the modified filler to a heat-resistant resin (step S2).

[0026] As shown in FIG. 1, FIG. 1 is a side view of the ball mill process. In the ball mill process, a filler F, a chemical modification liquid S, and polishing balls Z are added to a ball mill machine M. That is, in the present invention, a wet ball mill is employed.

[0027] When the ball mill machine M rotates, the filler F, the chemical modification liquid S, and the polishing balls Z roll in the ball mill machine M. During the rolling process, the polishing balls Z collide with the filler F and roll, exerting a polishing effect. Also, during the process of the polishing balls Z rotating, the aggregated filler F is dispersed, and the original surface area of the filler F is restored.

[0028] Specifically, the particle diameter of the filler F is 0.1 μm to 2 μm. For example, it may be 0.2 μm, 0.4 μm, 0.6 μm, 0.8 μm, 1.0 μm, 1.2 μm, 1.4 μm, 1.6 μm, or 1.8 μm, but the present invention is not limited thereto.

[0029] In one exemplary embodiment, the components of the filler F may be silicon dioxide or boron nitride, but the present invention is not limited thereto. Specifically, the filler F is subjected to a ball milling process in a normal temperature environment, and the rotation speed of the ball mill is 60 rpm to 720 rpm. The polishing ball Z may be zirconium dioxide, and the particle size of the polishing ball Z is 0.5 mm to 5 mm.

[0030] As shown in FIG. 2, after the surface of the filler F is polished with the polishing ball Z, a roughness layer 10 is formed on the surface of the filler F. The roughness layer 10 further improves the surface area of the filler F, which is advantageous for the subsequent formation of the chemical modification layer 20 on the roughness layer 10.

[0031] The chemical modification layer 20 is formed of a polysiloxane resin, and the polysiloxane resin forms a network structure on the surface of the filler F. The side chain or the end of the molecular chain of the polysiloxane resin has a functional group. After the polysiloxane resin adheres to the filler F, the functional group is exposed on the surface of the filler. The functional group has the effect of dispersing the filler F and improving the heat resistance of the resin composition.

[0032] Specifically, the polysiloxane resin adheres to the roughness layer 10 through an oxygen atom, and the molecular chain (R in FIG. 2) of the polysiloxane resin is located on the surface of the filler, thereby forming the chemical modification layer 20.

[0033] After the surface of the filler F is polished, it has a relatively large surface area (roughness layer 10), so more polysiloxane resin can be attached to the surface of the filler F. In order to form a chemically modified layer 20 with a stable structure on the surface of the filler F, the addition amount (weight) of the filler F is 15 to 30 times the addition amount of the polysiloxane resin. In this way, a chemically modified layer 20 with a stable structure can be formed by using the minimum amount of polysiloxane resin.

[0034] For example, the addition amount (by weight) of the filler F may be 17 times, 19 times, 21 times, 23 times, 25 times, 27 times, or 29 times the addition amount of the polysiloxane resin.

[0035] A functional group in the polysiloxane resin may be an epoxy group or an amino group, and the functional group may be located at the terminal or side chain of the polysiloxane resin. The equivalent weight of the polysiloxane resin may be 1,500 g / mol to 10,000 g / mol. The influence of the equivalent weight of the polysiloxane resin on the filler will be described later.

[0036] Specifically, the equivalent weight of the polysiloxane resin may be 2,000 g / mol, 3,000 g / mol, 4,000 g / mol, 5,000 g / mol, 6,000 g / mol, 7,000 g / mol, 8,000 g / mol, or 9,000 g / mol, but the present invention is not limited thereto.

[0037] In order to facilitate the progress of the ball mill process, in addition to adding the polysiloxane resin, a solvent is further added to improve the action between the filler F and the polysiloxane resin. In the present invention, the polysiloxane resin and the solvent together are referred to as the chemical modification liquid S. The solvent in the chemical modification liquid S may be butanone, cyclohexanone, or toluene, but the present invention is not limited thereto.

[0038] A roughness layer 10 is formed on the surface of the filler F. When a chemical modification layer 20 is formed on the roughness layer 10, a modified filler can be obtained. Next, a resin composition is formed by adding the modified filler to a heat-resistant resin. In the resin composition, the heat-resistant resin serves as a continuous phase, and the modified filler serves as a dispersed phase, and the modified filler is uniformly dispersed in the heat-resistant resin.

[0039] It should be noted that in the present invention, since the modified filler processed by the ball mill process is used, the resin composition according to the present invention can contain a relatively large amount of filler compared to the conventional resin composition. Specifically, the added weight of the modified filler is 2.5 to 3.5 times the added weight of the heat-resistant resin. For example, the added weight of the modified filler may be 2.75 times, 3.0 times or 3.25 times the added weight of the heat-resistant resin.

[0040] In the present invention, the components of the heat-resistant resin are not particularly limited. In one example, the heat-resistant resin includes a bismaleimide resin, an epoxy resin, and a thermosetting acrylic resin. Since the bismaleimide resin, the epoxy resin, and the thermosetting acrylic resin have bindable functional groups, the resin composition has excellent heat resistance and a low coefficient of thermal expansion after crosslinking.

[0041] In addition, since the chemical modification layer 20 of the modified filler also has bindable functional groups, using the modified filler can give the crosslinked resin composition excellent heat resistance and a low coefficient of thermal expansion compared to using a normal filler. After the modified filler is uniformly dispersed in the heat-resistant resin and the resin composition is crosslinked to form a resin substrate, it has uniform heat resistance and a coefficient of thermal expansion.

[0042] In order to impart ideal properties to the resin substrate, a relatively large amount of bismaleimide resin can be added to the heat-resistant resin. In one example, the content of the bismaleimide resin is more than the content of the epoxy resin, more than the content of the thermosetting acrylic resin, and further more than the total content of the epoxy resin and the thermosetting acrylic resin.

[0043] Specifically, taking the total weight of the heat-resistant resin as 100% by weight, the content of the bismaleimide resin is 50% to 70% by weight, the content of the epoxy resin is 5% to 15% by weight, and the content of the thermosetting acrylic resin is 10% to 25% by weight.

[0044] For example, the content of the bismaleimide resin may be any positive number between 50 wt% and 70 wt%. The content of the epoxy resin may be any positive number between 5 wt% and 15 wt%. The content of the thermosetting acrylic resin may be any positive number between 10 wt% and 25 wt%.

[0045] The method for manufacturing a metal substrate according to the present invention includes impregnating a fiber base material with the resin composition, taking out the fiber base material and drying it, and then obtaining a prepreg (step S3), and installing a metal layer on the prepreg, and hot pressing the prepreg and the metal layer to manufacture a metal substrate (step S4).

[0046] As shown in FIG. 3, FIG. 3 is a schematic diagram of the process of manufacturing a prepreg using a resin composition. In step S3, the resin composition adheres to the surface and gaps of the fiber base material 3, and after taking out and drying the impregnated fiber base material 3, a prepreg 4 (as shown in FIG. 4) is obtained. At this time, the resin composition in the prepreg 4 is not yet completely cured but has a fixed form.

[0047] As shown in FIG. 4, FIG. 4 is a schematic diagram of the process of manufacturing a metal substrate with a prepreg. In step S4, after installing a metal layer 5 on the prepreg 4, a hot pressing process is performed to obtain a metal substrate. At this time, the resin composition is completely cured, and the prepreg 4 is formed as a resin substrate. Also, the resin substrate has characteristics of a high glass transition temperature (exceeding 340°C) and a low coefficient of thermal expansion (less than 3.5 ppm / °C).

Example

[0048] [Experimental data] To explain the effects of the present invention, metal substrates according to Examples 1 to 5 and Comparative Examples 1 to 6 were manufactured based on the above steps S1 to S4, and the component ratios and characteristic results of the resin composition are as shown in Tables 1 and 2.

[0049] [Example 1] 75 g of silicon dioxide (filler) with a particle size of 0.1 μm to 2 μm, 100 g of zirconium dioxide (polishing balls) with a particle size of 0.5 mm to 5 mm, 3 g of polysiloxane resin, and 120 g of a mixed solvent of methyl ethyl ketone, cyclohexanone, and toluene (methyl ethyl ketone: cyclohexanone: toluene (weight ratio) = 45:45:10) were added to a ball mill machine. A modified filler was produced by performing a ball mill process at room temperature for 0.5 hours to 5 hours at a rotational speed of 60 rpm to 720 rpm. Here, the polysiloxane resin had an epoxy group in its side chain, and the equivalent weight of the polysiloxane resin was 10,000 g / mol.

[0050] After drying the modified filler, 78 g of the modified filler was added to 22 g of a heat-resistant resin to form a resin composition. The heat-resistant resin included 50 wt% to 70 wt% of a bismaleimide resin, 5 wt% to 15 wt% of an epoxy resin, and 10 wt% to 25 wt% of a thermosetting acrylic resin. In the examples of this specification, the heat-resistant resin included 70 wt% of a bismaleimide resin, 10 wt% of an epoxy resin, and 20 wt% of a thermosetting acrylic resin.

[0051] To evaluate the dispersion effect of the modified filler in the heat-resistant resin, an appropriate amount of the resin composition was filled into a sample bottle. In the sample bottle, the height of the resin composition was 4 cm to 5 cm. Next, using a dispersion stability & particle size analyzer (model: TURBISCAN), the light transmittance and reflection value in the sample bottle were measured at regular intervals, and a stability index was calculated. When the stability index exceeded 3.0, it was determined as sedimentation. Accordingly, the time for the resin composition to achieve a stability index exceeding 3.0 was defined as the sedimentation time of the resin composition.

[0052] Next, the fiber base material made of South Asian Plastic (product number 2116) was impregnated with the resin composition to attach the resin composition to the fiber base material, and then taken out and dried at a temperature of 100°C to 140°C to obtain a prepreg. After installing a metal layer on the prepreg, a metal substrate was manufactured by performing a hot press process at a temperature of 200°C to 270°C and a pressure of 10 kg / cm 2 ~30 kg / cm 2 . Here, the prepreg was completely cured and formed as a resin substrate.

[0053] To measure the properties of the resin substrate, the metal layer on the resin substrate was removed, and the E' (storage modulus), E'' (loss modulus), and Tanδ (the value of the ratio of E'' / E') of the resin substrate were measured with a dynamic mechanical analyzer (DMA) (manufacturer: TA instrument). The temperature at the point with the highest Tanδ (the value of the ratio of E'' / E') is the glass transition temperature (Tg). Also, the difference between the low-temperature baseline of Tanδ (the value of the ratio of E'' / E') and the glass transition temperature was calculated, and this difference has a negative correlation with the crosslinking degree of the resin base material. In this specification, when the difference is less than 0.02, it is represented as a high crosslinking degree (high). When the difference is 0.02 to 0.04, it is represented as a medium crosslinking degree (medium). When the difference exceeds 0.04, it is represented as a low crosslinking degree (low).

[0054] Similarly, after removing the metal layer on the resin substrate, the thermal expansion rate of the resin substrate at 50°C to 120°C was measured with a thermal mechanical analyzer (TMA) (manufacturer: TA instrument).

[0055] Also, the resin substrate was placed in an environment of 120°C and 100% relative humidity for 2 hours, and the water absorption of the resin substrate was calculated by measuring the weight of the resin substrate before and after.

[0056] [Examples 2 to 5] The metal substrates according to Examples 2 to 5 were manufactured in a method similar to that of Example 1, and the properties of the resin composition and the resin substrate were evaluated by the same method. The difference is that in Examples 2 to 5, the ball mill process was performed using polysiloxane resins having different types and contents.

[0057] Specifically, the functional group of the polysiloxane resin in Example 2 was an epoxy group and was located on the side chain of the molecular chain, and the equivalent weight of the polysiloxane resin was 1,500 g / mol. The functional group of the polysiloxane resin in Example 3 was an epoxy group and was located on the side chain of the molecular chain, and the equivalent weight of the polysiloxane resin was 3,800 g / mol. The functional group of the polysiloxane resin in Example 4 was an amino group and was located on the side chain of the molecular chain, and the equivalent weight of the polysiloxane resin was 2,400 g / mol. The functional group of the polysiloxane resin in Example 5 was an epoxy group and was located at the end of the molecular chain, and the equivalent weight of the polysiloxane resin was 2,400 g / mol.

[0058] [Comparative Examples 1 and 2] The metal substrates according to Comparative Examples 1 and 2 were each manufactured in a method similar to those of Examples 1 and 2, and the properties of the resin composition and the resin substrate were measured by the same method. The difference is that in Comparative Examples 1 and 2, the filler and the polysiloxane resin were directly stirred and mixed without performing the ball mill process.

[0059] [Comparative Example 3] The metal substrate according to Comparative Example 3 was manufactured in a method similar to that of Example 1, and the properties of the resin composition and the resin substrate were measured by the same method. The difference is that in Comparative Example 3, no polysiloxane resin was added to the ball mill process.

[0060] [Comparative Example 4] The metal substrate according to Comparative Example 4 was manufactured in a method similar to that of Comparative Example 3, and the properties of the resin composition and the resin substrate were measured by the same method. The difference between them is that in Comparative Example 4, the resin composition was formed by directly stirring and mixing the filler and the heat-resistant resin without performing ball milling.

[0061] [Comparative Examples 5, 6] The metal substrates according to Comparative Examples 5 and 6 were manufactured in a method similar to that of Example 1, and the properties of the resin composition and the resin substrate were measured by the same method. The difference between them is that in Comparative Examples 5 and 6, the ball milling process was performed using polysiloxane resins having different types and contents. Specifically, the functional group of the polysiloxane resin in Comparative Example 5 was an epoxy group and was located on the side chain of the molecular chain, and the equivalent weight of the polysiloxane resin was 300 g / mol. The functional group of the polysiloxane resin in Comparative Example 6 was an epoxy group and was located on the side chain of the molecular chain, and the equivalent weight of the polysiloxane resin was 15,000 g / mol. That is, the equivalent weights of the polysiloxane resins in Comparative Examples 5 and 6 were not included in the range of 1,500 g / mol to 10,000 g / mol.

[0062]

Table 1

[0063] According to Examples 1 and 2 and Comparative Examples 1 to 4, a chemically modified layer was formed on the surface of the filler by the ball milling process. Therefore, the modified filler was uniformly dispersed in the heat-resistant resin and had good stability. Even after standing for a long time, the modified filler still did not settle. Also, after being completely cured, the resin substrate had a relatively high glass transition temperature, a high degree of crosslinking, a low coefficient of thermal expansion, and a low water absorption rate.

[0064] Specifically, the glass transition temperature of the resin substrate exceeds 340°C and is preferably 342°C to 360°C. The coefficient of thermal expansion of the resin substrate is less than 3.5 ppm / °C and is preferably 1.5 ppm / °C to 2.8 ppm / °C.

[0065]

Table 2

[0066] According to Examples 1 to 3 and Comparative Examples 5 and 6, the equivalent weight of the polysiloxane resin affects the properties of the modified filler. If the equivalent weight of the polysiloxane resin is too high, the number of functional groups on the surface of the polysiloxane resin is too small, and the heat resistance of the resin substrate cannot be effectively improved, resulting in a low glass transition temperature (Comparative Example 6). If the equivalent weight of the polysiloxane resin is too low, the heat resistance of the resin substrate can be improved, but the dispersibility of the filler becomes poor, and the coefficient of thermal expansion of the resin substrate increases (Comparative Example 5).

[0067] Thus, the equivalent weight of the polysiloxane resin is preferably 1,500 g / mol to 10,000 g / mol.

[0068] According to Examples 4 and 5, the functional groups of the polysiloxane resin may be located at the ends of the molecular chains in addition to the side chains. Further, the functional groups are not limited to epoxy groups, and similar effects can be achieved even if the functional groups are amino groups.

[0069] [Advantageous Effects of Embodiments] As an advantageous effect of the present invention, the resin composition, its manufacturing method, and the prepreg according to the present invention have the technical features of "performing a ball mill process on the filler" and "the polysiloxane resin has functional groups and the equivalent weight of the polysiloxane resin is 1,500 g / mol to 10,000 g / mol", so that the resin substrate has good heat resistance and a low coefficient of thermal expansion.

[0070] The content disclosed above is only a preferred feasible embodiment of the present invention, and the scope of the claims of the present invention is not limited thereto. Therefore, all equivalent technical changes made using the content of the specification and drawings of the present invention are included in the scope of the claims of the present invention.

Description of Reference Numerals

[0071] M... Ball mill machine F... Filler S... Solvent Z... Grinding ball 10... Roughness layer 20... Chemically modified layer 3... Fiber substrate 4... Prepreg 4’... Resin substrate 5... Metal layer

Claims

1. A ball mill process for obtaining a modified filler by forming a roughness layer on the surface of the filler and attaching a polysiloxane resin to the roughness layer to form a chemical modification layer, wherein the polysiloxane resin has a functional group and the equivalent weight of the polysiloxane resin is 1,500 g / mol to 10,000 g / mol, and adding the modified filler to a heat-resistant resin to form a resin composition. A method for manufacturing a resin composition, characterized by comprising the above.

2. The method for manufacturing a resin composition according to claim 1, wherein in the ball mill process, the added weight of the filler is 15 times to 30 times the added weight of the polysiloxane resin.

3. The method for manufacturing a resin composition according to claim 1, wherein the particle size of the filler is 0.1 μm to 2 μm.

4. The method for manufacturing a resin composition according to claim 1, wherein the ball mill process is performed on the polysiloxane resin and the filler in a solvent that is butanone, cyclohexanone or toluene.

5. The method for manufacturing a resin composition according to claim 1, wherein the functional group is at the side chain or the end of the molecular chain of the polysiloxane resin.

6. The method for manufacturing a resin composition according to claim 1, wherein the functional group contains an epoxy group or an amino group.

7. The method for manufacturing a resin composition according to claim 1, wherein the added weight of the modified filler is 2.5 times to 3.5 times the added weight of the heat-resistant resin.

8. The method for manufacturing a resin composition according to claim 1, wherein the heat-resistant resin includes a bismaleimide resin, an epoxy resin, and a thermosetting acrylic resin.

9. Taking the total weight of the heat-resistant resin as 100% by weight, the heat-resistant resin includes 50% to 70% by weight of a bismaleimide resin, 5% to 15% by weight of an epoxy resin, and 10% to 25% by weight of a thermosetting acrylic resin. The method for manufacturing a resin composition according to claim 8.

10. A heat-resistant resin, and a modified filler dispersed in the heat-resistant resin, wherein the added weight of the modified filler is 2.5 times to 3.5 times the added weight of the heat-resistant resin. A roughness layer is formed on the surface of the modified filler, a chemical modification layer formed of a polysiloxane resin is formed on the roughness layer, the polysiloxane resin has a functional group, and the equivalent weight of the polysiloxane resin is 1,500 g / mol to 10,000 g / mol. A resin composition characterized by being.

11. The resin composition according to claim 10, wherein the functional group contains an epoxy group or an amino group.

12. A prepreg obtained by impregnating a fiber base material with the resin composition according to claim 10 or 11 and then drying, wherein the polysiloxane resin crosslinks with the heat-resistant resin through the functional group. The prepreg is for forming a resin substrate having a coefficient of thermal expansion of 1.0 ppm / °C to 3.5 ppm / °C. A prepreg characterized by being.

13. The prepreg according to claim 12, wherein the glass transition temperature of the resin substrate is 340°C to 360°C.

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