Light-emitting device, light-emitting module and method for manufacturing light-emitting device

Abstract

To provide a light-emitting device capable of suppressing occurrence of color unevenness in light emitted from a light-emitting plane, a light-emitting module and a method for manufacturing a light-emitting device.SOLUTION: A light-emitting device comprises: substrate; a light-emitting element including a light-emitting layer disposed on the substrate; and a phosphor part which is adhered to the light-emitting element via a translucent adhesive, includes a phosphor which is excited by light emitted from the light-emitting layer and generates fluorescent light and includes on a bottom face a slit formed along an outer edge of a top face of the light-emitting element. The adhesive adheres the top face of the light-emitting element and the bottom face of the phosphor part while filling the slit.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a light-emitting device, a light-emitting module, and a method for manufacturing a light-emitting device.

Background Art

[0002] A light-emitting device including a light-emitting element and a phosphor plate is disclosed. For example, Patent Document 1 discloses a light-emitting device having a light-emitting element and a phosphor plate adhesively bonded to the upper surface of the light-emitting element via a transparent adhesive.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the light-emitting device disclosed in Patent Document 1, when the phosphor plate is adhered to the upper surface of the light-emitting element, the center of the light-emitting element and the center of the phosphor plate may be displaced during the curing of the adhesive, that is, the self-alignment property of the adhesive with respect to the phosphor plate may be reduced. If such a situation occurs, color unevenness may occur in the light emitted from the light-emitting surface of the light-emitting device.

[0005] The present invention has been made in view of the above points, and provides a light-emitting device, a light-emitting module, and a method for manufacturing a light-emitting device capable of suppressing the occurrence of color unevenness in the light emitted from the light-emitting surface.

Means for Solving the Problems

[0006] The light-emitting device according to the present invention includes a substrate, a light-emitting element including a light-emitting layer disposed on the substrate, and a phosphor that is adhered to the light-emitting element via a light-transmissive adhesive and emits fluorescence when excited by light emitted from the light-emitting layer, and has a phosphor portion having a slit formed along the outer edge of the upper surface of the light-emitting element on the lower surface, and the adhesive adheres the upper surface of the light-emitting element and the lower surface of the phosphor portion while filling the slit.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0008] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and the description of overlapping components is omitted.

Examples

[0009] [Outline of the Light-Emitting Device 100] With reference to FIGS. 1 and 2, the configuration of the light-emitting device 100 according to Example 1 will be described. FIG. 1 is a top view of the light-emitting device 100. FIG. 2 is a cross-sectional view taken along line 2-2 of the light-emitting device 100 shown in FIG. 1.

[0010] The light-emitting device 100 includes a support substrate 11, a light-emitting element 13 disposed on the support substrate 11, and a phosphor portion 15 disposed on the light-emitting element 13. In FIG. 1, in order to ensure the visibility of the figure, the outer edge of the upper surface of the light-emitting element 13 and the inner edge of the slit SL in the phosphor portion 15 are slightly shifted so as not to overlap. However, in Example 1, actually, in a top view, the outer edge of the light-emitting element 13 and the inner edge of the slit SL formed in the phosphor portion 15 overlap each other as shown in FIG. 2. That is, the lower end of the inner edge of the slit SL and the outer edge of the light-emitting element 13 overlap each other in the vertical direction.

[0011] Also, in FIG. 2, the vertical direction in the figure is the height direction of the light-emitting device 100, and the horizontal direction in the figure is the width direction of the light-emitting device 100. In FIG. 2, a center line CL passing through the center in the width direction of the light-emitting device 100 is indicated by a two-dot chain line.

[0012] [Support Substrate 11] First, the support substrate 11 will be described. The support substrate 11 is a flat substrate having a rectangular upper surface shape. The support substrate 11 is made of a material having electrical insulation properties such as aluminum nitride (AlN) or aluminum oxide (Al2O3), for example.

[0013] [Light-Emitting Element 13] Next, the configuration of the light-emitting element 13 will be described. The light-emitting element 13 is disposed on the support substrate 11 as described above and is a light-emitting diode (LED) having a rectangular upper surface shape.

[0014] The light-emitting element 13 includes a semiconductor structure layer 17 having a light-emitting layer, a translucent substrate 18 disposed on the upper surface of the semiconductor structure layer 17, and a p electrode 21 and an n electrode 22 disposed on the lower surface of the semiconductor structure layer 17.

[0015] The semiconductor structure layer 17 is a semiconductor laminate composed of an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer (none of which are shown), each having gallium nitride (GaN) as a main material. When the light-emitting element 13 is driven, blue light with a peak wavelength of about 450 nm is emitted from the light-emitting layer of the semiconductor structure layer 17.

[0016] The translucent substrate 18 is a flat substrate with a rectangular upper surface shape. The translucent substrate 18 is made of a material that is translucent to the blue light emitted from the light-emitting layer of the semiconductor structure layer 17, such as sapphire (Al2O3) or GaN. Note that the translucent substrate 18 is also a growth substrate for the semiconductor structure layer 17.

[0017] The p-electrode 21 is an electrode electrically connected to the p-type semiconductor layer of the semiconductor structure layer 17. The p-electrode 21 is joined to a p-side wiring (not shown) formed on the upper surface of the support substrate 11 via a conductive joining member (not shown).

[0018] The n-electrode 22 is an electrode electrically connected to the n-type semiconductor layer via a through electrode (not shown) that penetrates the light-emitting layer and the p-type semiconductor layer of the semiconductor structure layer 17 in the vertical direction and whose side surfaces are covered with an insulator. In other words, the n-electrode 22 is electrically connected only to the n-type semiconductor layer and is insulated from the light-emitting layer and the p-type semiconductor layer. The n-electrode 22 is joined to an n-side wiring (not shown) formed on the upper surface of the support substrate 11 via a conductive joining member (not shown).

[0019] As described above, the light-emitting element 13 includes the semiconductor structure layer 17, the translucent substrate 18 disposed on the upper surface of the semiconductor structure layer 17, and the p-electrode 21 and the n-electrode 22 disposed on the lower surface of the semiconductor structure layer 17 and joined to the support substrate 11, respectively. That is, in the light-emitting device 100, the light-emitting element 13 is flip-chip mounted on the support substrate 11.

[0020] [Phosphor part 15] Next, the phosphor part 15 will be described. The phosphor part 15 is a plate-like body with a rectangular upper surface shape arranged on the light-emitting element 13. The phosphor part 15 is configured such that the size of the lower surface is larger than the upper surface of the light-emitting element 13. In other words, the phosphor part 15 has an eaves portion that protrudes laterally from the upper surface of the light-emitting element 13 in a top view.

[0021] In the light-emitting device 100, the phosphor part 15 has a slit SL with a triangular cross-sectional shape formed along the outer edge of the upper surface of the light-emitting element 13 on the lower surface. In the light-emitting device 100, the slit SL is formed in an annular shape as shown in FIG. 1.

[0022] In the light-emitting device 100, the slit SL is formed such that the inner edge overlaps the outer edge of the upper surface of the light-emitting element 13 in a top view. In other words, the slit SL is formed such that the outer edge in a top view is located outside the outer edge of the upper surface of the light-emitting element 13.

[0023] The phosphor part 15 is adhered by an adhesive 24 disposed between the lower surface and the upper surface of the translucent substrate 18 of the light-emitting element 13 while filling the inside of the slit SL provided on the lower surface. The adhesive 24 is made of a translucent resin such as, for example, a silicone resin.

[0024] The phosphor part 15 is made of a phosphor that is excited by blue light as excitation light emitted from the light-emitting element 13 to emit fluorescence. The fluorescence generated from the phosphor when excited by blue light has a broad green to orange wavelength range spanning 480 to 700 nm and has a yellow peak wavelength at 520 to 570 nm.

[0025] The phosphor part 15 is, for example, a ceramic phosphor plate made of a medium of alumina (Al2O3) or silicon dioxide (SiO2) containing yttrium aluminum garnet (YAG:Ce) phosphor particles with cerium (Ce) as an activator.

[0026] Note that the phosphor part 15 is not limited to a phosphor plate composed of YAG:Ce phosphor particles. For example, it may be a phosphor plate in which YAG, which is the base material of the phosphor particles, serves as a medium. In this case, the phosphor part 15 may be a polycrystal or a single crystal.

[0027] When the excitation light (blue light) emitted from the light-emitting element 13 enters the phosphor part 15, a part of it directly passes through the phosphor part 15, and a part excites the phosphor, causing fluorescence to be emitted from the excited phosphor.

[0028] Therefore, from the upper surface of the phosphor part 15, the excitation light that has passed through the phosphor part 15 without contributing to the generation of fluorescence and the fluorescence emitted from the phosphor are emitted. As a result, white light in which blue light and yellow fluorescence are mixed is extracted from the upper surface of the phosphor part 15. That is, the upper surface of the phosphor part 15 is the light-emitting surface of the light-emitting device 100.

[0029] [Suppression of color unevenness of emitted light] Here, with reference to FIGS. 1 and 2, suppression of color unevenness of the light emitted from the light-emitting surface of the light-emitting device 100 according to the present embodiment will be described.

[0030] When the light-emitting element 13 and the phosphor part 15 are adhered during the manufacture of the light-emitting device 100, the adhesive 24 in a pre-cured state is potted on the upper surface of the light-emitting element 13, that is, the upper surface of the translucent substrate 18, and the phosphor part 15 is placed thereon. As a result, the adhesive 24 spreads and wets between the upper surface of the translucent substrate 18 and the lower surface of the phosphor part 15, and then cures, thereby adhering the light-emitting element 13 and the phosphor part 15.

[0031] When the phosphor part 15 is placed on the upper surface of the light-emitting element 13, a so-called self-alignment effect is exhibited in which the sides of the upper surface of the light-emitting element 13 and the sides of the lower surface of the phosphor part 15 are parallel to each other and their centers overlap due to the surface tension of the adhesive 24. That is, due to the self-alignment effect of the adhesive 24, the line passing through the center of the light-emitting element 13 and the line passing through the center of the phosphor part 15 overlap the center line CL in FIG. 2.

[0032] For example, when the phosphor part 15 without the slit SL formed on the lower surface is adhered to the upper surface of the light-emitting element 13, since the lower surface of the phosphor part 15 is larger than the upper surface of the light-emitting element 13, when the self-alignment effect of the adhesive 24 works, the center of the light-emitting element 13 and the center of the phosphor part 15 may not coincide and a deviation may occur.

[0033] For example, when such a deviation occurs between the light-emitting element 13 and the phosphor part 15, when the light-emitting device 100 is viewed from above, color unevenness will occur in the light emitted from the light-emitting surface of the light-emitting device 100. Specifically, for example, there is a possibility that a difference in chromaticity will occur between the light emitted from the central region of the light-emitting surface of the light-emitting device 100 and the light emitted from the region on one end side of the light-emitting surface.

[0034] Also, even if the upper surface of the light-emitting element 13 and the lower surface of the phosphor part 15 are the same size, for example, when the adhesive 24 is applied excessively on the upper surface of the light-emitting element 13, when the phosphor part 15 is placed, the above-described self-alignment effect cannot be exerted well, and there is a possibility that the center of the light-emitting element 13 and the center of the phosphor part 15 will deviate when the adhesive 24 hardens.

[0035] In the light-emitting device 100 of this embodiment, as described above, the phosphor part 15 has the slit SL formed along the outer edge of the upper surface of the light-emitting element 13 on the lower surface. Further, in the light-emitting device 100 of this embodiment, the adhesive 24 adheres the light-emitting element 13 and the phosphor part 15 while filling the slit SL.

[0036] In the light-emitting device 100 of this embodiment, since such a slit SL is formed in the phosphor part 15, when the phosphor part 15 is placed on the upper surface of the light-emitting element 13, the adhesive 24 that has spread wetly between the upper surface of the light-emitting element 13 and the lower surface of the phosphor part 15 spreads into the slit SL by capillary action.

[0037] Accordingly, according to the light-emitting device 100 of the present embodiment, when the adhesive 24 cures, the adhesive 24 that has entered the slit SL acts like an anchor on the phosphor portion 15, making it difficult for the center position of the phosphor portion 15 to move when self-aligned by the adhesive 24. That is, it is possible to suppress the centers of the light-emitting element 13 and the phosphor portion 15 from shifting from each other when they are adhered.

[0038] Further, even when the phosphor portion 15 is placed in a state where the adhesive 24 is excessively applied on the upper surface of the light-emitting element 13 as described above, the excess amount of the adhesive 24 can be received by the slit SL, so that the balance of the phosphor portion 15 is maintained when the adhesive 24 cures. That is, according to the light-emitting device 100 of the present embodiment, even if the application amount of the adhesive 24 is somewhat excessive, the self-aligning property of the adhesive 24 is less likely to deteriorate.

[0039] Therefore, according to the light-emitting device 100 of the present embodiment, it is difficult for a shift to occur between the center of the light-emitting element 13 and the center of the phosphor portion 15 after the adhesive 24 cures. Thus, according to the light-emitting device 100 of the present embodiment, it is possible to suppress the occurrence of color unevenness in the light emitted from the light-emitting surface of the light-emitting device 100.

[0040] In the light-emitting device 100 of the present embodiment, the slit SL preferably has a width w of 3 to 5 μm and a depth d of 30 to 80 μm, and particularly preferably the depth d is about 50% of the thickness t, when the thickness t of the phosphor portion 15 is 150 μm as shown in FIG. 2, for example.

[0041] In addition, in the light-emitting device 100 of the present embodiment, the adhesive 24 is configured to enter the slit SL when the light-emitting element 13 and the phosphor portion 15 are adhered. Therefore, for example, compared with a model in which the slit SL is not formed in the phosphor portion 15, when the same amount of the adhesive 24 as that of the model is used, the amount of the adhesive 24 protruding to the side surface of the light-emitting element 13 can be reduced by the amount that enters the slit SL.

[0042] Therefore, according to the light-emitting device 100 of the present embodiment, the size of the fillet formed on the side surface of the light-emitting element 13 can be reduced by the spread of the wet adhesive 24 protruding from the side surface of the light-emitting element 13. Thereby, for example, it is possible to suppress the generation of stray light due to the emission of excitation light or fluorescence to the outside along the fillet.

[0043] Further, in the light-emitting device 100 of the present embodiment, as described above, the size of the lower surface of the phosphor portion 15 is configured to be larger than the upper surface of the light-emitting element 13. Thereby, for example, when a plurality of light-emitting devices 100 are arranged, it is possible to suppress the occurrence of a phenomenon in which light emitted from one light-emitting device 100 interferes with the adjacent other light-emitting device 100, that is, so-called optical crosstalk (details will be described later).

[0044] In the light-emitting device 100 of the present embodiment, although it is assumed that the inner edge of the slit SL is formed so as to overlap the outer edge of the upper surface of the light-emitting element 13, the present invention is not limited to this. For example, the slit SL may be formed such that the inner edge and the outer edge of the slit SL straddle the outer edge of the upper surface of the light-emitting element 13 in a top view. Further, the outer edge of the slit SL may be located inside the outer edge of the upper surface of the light-emitting element 13.

[0045] Further, in the light-emitting device 100 of the present embodiment, although the slit SL has a triangular cross-sectional shape, the present invention is not limited to this, and the slit SL may have other shapes. For example, the slit SL may have a trapezoidal, rectangular, semi-circular or other cross-sectional shape.

[0046] In the light-emitting device 100 of the present embodiment, an example in which the adhesive 24 reaches the slit SL has been described, but the adhesive 24 may be in a state of filling the slit SL and reaching the outer edge of the lower surface of the phosphor portion 15.

[0047] [Manufacturing method of the light-emitting device 100] Hereinafter, with reference to FIGS. 3 and 4, a method for manufacturing the light-emitting device 100 according to this embodiment will be described. FIGS. 3 and 4 are cross-sectional views showing the manufacturing process of the light-emitting device 100. Hereinafter, the process of adhering the phosphor portion 15 to the light-emitting element 13 will be mainly described.

[0048] First, the light-emitting element 13 is flip-chip mounted on the support substrate 11 (step S1: element mounting step). Specifically, the p-electrode 21 and the n-electrode 22 of the light-emitting element 13 are mounted on the upper surface of the support substrate 11 via a conductive bonding member (not shown), and can be mounted by performing a reflow process.

[0049] Next, the phosphor portion 15 having a slit SL formed on its lower surface is adhered to the upper surface of the light-emitting element 13 (step S2: phosphor portion adhesion step). Specifically, as shown in FIG. 3, an adhesive 24 in a pre-cured state is potted on the upper surface of the light-transmitting substrate 18 of the light-emitting element 13, and the phosphor portion 15 is placed thereon to cure the adhesive 24, thereby adhering the light-emitting element 13 and the phosphor portion 15.

[0050] In step S2, as shown in FIG. 4, when the phosphor portion 15 is placed, the adhesive 24 spreads wet in the direction indicated by the solid-line arrow. At this time, the adhesive 24 enters the slit SL formed on the lower surface of the phosphor portion 15 by capillary action.

[0051] After the phosphor portion 15 is placed, in the process of curing the adhesive 24, the self-alignment effect due to the surface tension of the adhesive 24 acts, so that the light-emitting device 100 can be manufactured without displacement between the center of the light-emitting element 13 and the center of the phosphor portion 15 as described above.

[0052] In the manufacture of the phosphor portion 15 of the light-emitting device 100, for example, a slit SL having a width w of about 3 to 5 μm can be formed by cutting the main surface of a flat phosphor plate into a rectangular shape using a laser or a dicing saw until the depth from the main surface becomes a depth d.

[0053] [Modification Example 1 of the Light-Emitting Device 100] Next, with reference to FIG. 5, Modification 1 of the light-emitting device 100 of Example 1 will be described. FIG. 5 is a cross-sectional view of the light-emitting device 110 along the line 5-5 of FIG. 1. The light-emitting device 110 is different from Example 1 in the formation mode of the slit SL, and is the same as Example 1 in other respects.

[0054] In the light-emitting device 110, the slit SL is formed annularly along the outer edge of the upper surface of the light-emitting element 13 and in a top view, similarly to Example 1. Further, in the light-emitting device 110, the depth of the slit SL changes in each portion along each side of the upper surface of the light-emitting element 13.

[0055] Specifically, as shown in FIG. 5, the slit SL has the deepest depth at the position corresponding to the center of each side of the upper surface of the light-emitting element 13, that is, on the center line CL in the figure, and the depth becomes shallower toward the side. For example, in the light-emitting device 110, the slit SL has a depth d which is the maximum depth m and is about 50% of the thickness t of the phosphor layer 15.

[0056] When the phosphor layer 15 is placed on the upper surface of the light-emitting element 13 during the manufacture of the light-emitting device 110, the adhesive 24 spreads wet in a concentric circle in a top view. Therefore, the adhesive 24 first reaches the central portion of each portion along each side of the upper surface of the light-emitting element 13 of the slit SL, and then spreads to each side.

[0057] In this modification, since the depth of the central portion of each portion along each side of the upper surface of the light-emitting element 13 of the slit SL is the deepest as described above, the most adhesive 24 enters the central portion.

[0058] Therefore, when the adhesive 24 is cured, the adhesion strength with the phosphor layer 15 is increased in the above-described central portion of the slit SL, so that the alignment accuracy of the adhesive 24 with respect to the phosphor layer 15 can be improved. That is, the centers of the light-emitting element 13 and the phosphor layer 15 can be more easily aligned.

[0059] Therefore, according to the light-emitting device 110 of this modified example, similar to Example 1, due to the self-alignment effect of the adhesive 24, the centers of the light-emitting element 13 and the phosphor part 15 coincide, thereby suppressing the occurrence of color unevenness in the light emitted from the light-emitting surface of the light-emitting device 110.

[0060] [Modified Example 2 of the Light-Emitting Device 100] Next, with reference to FIG. 6, a modified example 2 of the light-emitting device 100 of Example 1 will be described. FIG. 6 is a top view of the light-emitting device 120. The light-emitting device 120 is different from Example 1 in the formation mode of the slit SL, and is the same as Example 1 in other respects.

[0061] Note that also in this modified example, in order to ensure the visibility of the figure, the outer edge of the upper surface of the light-emitting element 13 and the inner edge of the slit SL in the phosphor part 15 are slightly shifted so as not to overlap in the drawing.

[0062] In the light-emitting device 120, the slit SL extends in a direction along each side of the upper surface of the light-emitting element 13 in a top view, and each end reaches the outer edge of the lower surface of the phosphor part 15. That is, in the light-emitting device 120, the slit SL is formed in a cross shape in a top view.

[0063] Even when the slit SL is formed in this way, similar to Example 1, the self-alignment effect of the adhesive 24 is exerted so that the centers of the light-emitting element 13 and the phosphor part 15 coincide. Therefore, also in the light-emitting device 120 of this modified example, the occurrence of color unevenness in the light emitted from the light-emitting surface of the light-emitting device 120 can be suppressed.

[0064] [Modified Example 3 of the Light-Emitting Device 100] Next, with reference to FIG. 7, a modified example 3 of the light-emitting device 100 of Example 1 will be described. FIG. 7 is a top view of the light-emitting device 130. The light-emitting device 130 is different from Example 1 in the formation mode of the slit SL, and is the same as Example 1 in other respects.

[0065] Note that, also in this modified example, in order to ensure the visibility of the figure, the outer edge of the upper surface of the light-emitting element 13 and the inner edge of the slit SL in the phosphor portion 15 are slightly shifted so as not to overlap as shown in the figure.

[0066] In the light-emitting device 130, the slit SL extends in a direction along each side of the upper surface of the light-emitting element 13 in a top view, and each is spaced apart from each other. That is, in the light-emitting device 130, the slit SL is individually formed on the lower surface of the phosphor portion 15.

[0067] Even when the slit SL is formed in this way, similarly to the first embodiment, the self-alignment effect of the adhesive 24 is exerted so that the center of the light-emitting element 13 and the center of the phosphor portion 15 coincide. Therefore, also in the light-emitting device 130 of this modified example, it is possible to suppress the occurrence of color unevenness in the light emitted from the light-emitting surface of the light-emitting device 130.

Embodiment

[0068] Next, with reference to FIG. 8, the light-emitting device 200 according to the second embodiment will be described. FIG. 8 is a cross-sectional view of the light-emitting device 200. The light-emitting device 200 is different from the first embodiment in that it has a light reflection member 26, and other points, such as the formation mode of the slit SL, are the same as those of the first embodiment.

[0069] In the light-emitting device 200, the light reflection member 26 is a covering member that continuously covers the side surface of the light-emitting element 13 and the lower surface exposed from the adhesive 24 of the phosphor portion 15 on the support substrate 11. In the light-emitting device 200, the outer edge of the light reflection member 26 coincides with the outer edge of the phosphor portion 15 in a top view.

[0070] The light reflection member 26 is made of a resin body in which a plurality of particles are dispersed inside. Specifically, the light reflection member 26 is configured by dispersing titanium oxide (TiO2) particles having a rutile-type crystal structure in a resin medium having translucency such as silicone resin or epoxy resin.

[0071] In the light-emitting device 200 of this embodiment, the light-reflecting member 26 scatters the blue light emitted from the light-emitting element 13 and the yellow fluorescence emitted from the phosphor portion 15 without absorbing them. Therefore, the light-reflecting member 26 reflects, for example, the blue light emitted from the light-emitting element 13 and reaching the side surface of the light-emitting element 13 to the upper surface side of the light-emitting element 13.

[0072] Therefore, according to the light-emitting device 200 of this embodiment, by providing the light-reflecting member 26 on the side surface of the light-emitting element 13, it is possible to suppress light leakage from the side surface. In addition, since a part of the light reflected by the light-reflecting member 26 travels toward the upper surface of the light-emitting element 13, the amount of light emitted from the light-emitting device 200 can be increased.

[0073] Also in the light-emitting device 200 of this embodiment, similar to Embodiment 1, the self-alignment effect of the adhesive 24 is exhibited so that the center of the light-emitting element 13 and the center of the phosphor portion 15 coincide. Therefore, also in the light-emitting device 130 of this modification, it is possible to suppress the occurrence of color unevenness in the light emitted from the light-emitting surface of the light-emitting device 200.

[0074] Note that, in the light-emitting device 200 of Embodiment 2, the formation mode of the light-reflecting member 26 is not limited to this. For example, the light-reflecting member 26 may reach the upper surface of the phosphor portion 15. That is, the light-reflecting member 26 may be formed so as to expose only the upper surface of the phosphor portion 15.

Embodiment

[0075] Next, with reference to FIG. 9, the light-emitting module 300 according to Embodiment 3 will be described. FIG. 9 is a cross-sectional view of the light-emitting module 300. The light-emitting module 300 is different from Embodiment 1 in that a plurality of light-emitting devices 140 are arranged and a light-reflecting member 31 is provided. Note that, in this embodiment, the light-emitting device excluding the support substrate 11 from the light-emitting device 100 will be described as the light-emitting device 140.

[0076] In the light-emitting module 300, the support 27 is composed of a support substrate 28 having a rectangular upper surface shape and a frame body 29 formed along the outer edge of the upper surface on the upper surface of the support substrate 28. The support 27 is made of a material having electrical insulation properties such as AlN or Al2O3, for example.

[0077] In the light-emitting module 300, the light-emitting devices 140 are arranged on the support substrate 28 along the left-right direction in the drawing such that the distance between the outer edges of the phosphor portions 15 of each other is the interval L. The interval L is, for example, 50 μm. In this embodiment, two light-emitting devices 140 are shown as an example, but the number thereof may be appropriately changed according to the size of the light-emitting module 300.

[0078] In the light-emitting module 300, the light reflecting member 31 continuously covers the side surface of the light-emitting element 13 and the lower surface exposed from the adhesive 24 of the phosphor portion 15 on the support substrate 11. The light reflecting member 26 is made of a resin body in which titanium oxide particles are dispersed inside, similar to Example 2.

[0079] In each of the light-emitting devices 140, the phosphor portion 15 is configured such that the size of the lower surface is larger than the upper surface of the light-emitting element 13 as described above. In other words, the phosphor portion 15 has an eaves portion that protrudes laterally from the upper surface of the light-emitting element 13 in a top view.

[0080] For example, when the upper surface of the light-emitting element 13 and the lower surface of the phosphor portion 15 in the light-emitting module 300 are the same size, a part of the blue light emitted from one of the adjacent light-emitting devices 140 and transmitted through the light reflecting member 31 may travel toward the phosphor portion 15 of the other light-emitting device 140.

[0081] As a result, the blue light emitted from one light-emitting device 140 enters the phosphor portion 15 of the adjacent other light-emitting device 140, and unintended fluorescence is emitted from the phosphor portion 15, and there is a risk that light of a pattern different from the desired light distribution pattern as the entire module is emitted.

[0082] In the light-emitting module 300 of the present embodiment, since the size of the lower surface of the phosphor portion 15 is larger than the upper surface of the light-emitting element 13, the light traveling toward the other light-emitting device 140 is likely to be blocked by the above-described eaves portion. That is, the light emitted from one light-emitting device 140 is less likely to interfere with the adjacent light-emitting device 140.

[0083] Therefore, according to the light-emitting module 300 of the present embodiment, it is possible to suppress the occurrence of a phenomenon in which the light emitted from one light-emitting device 140 interferes with the adjacent other light-emitting device 140, that is, so-called light crosstalk.

[0084] In each of the light-emitting devices 140 of the light-emitting module 300 of the present embodiment, the ratio of the size of the lower surface of the phosphor portion 15 to the size of the upper surface of the light-emitting element 13 is preferably in the range of 103 to 110%. For example, when the size of the upper surface of the light-emitting element 13 is 1 mm square, the size of the lower surface of the phosphor portion 15 is preferably 1.11 mm square.

[0085] Also in the light-emitting module 300 of the present embodiment, similar to the first embodiment, the self-alignment effect of the adhesive 24 is exhibited so that the center of the light-emitting element 13 and the center of the phosphor portion 15 coincide. Therefore, also in the light-emitting module 300 of the present embodiment, it is possible to suppress the occurrence of color unevenness in the light emitted from each light-emitting surface of the light-emitting device 140.

[0086] The light-emitting module 300 of the present embodiment can be manufactured, for example, by mounting each of the light-emitting devices 140 on the support substrate 28 of the support 27 at an interval L, and then filling the light-reflecting member 31 in the uncured state up to the outer edge of the lower surface of the phosphor portion 15 and heating and curing it.

[0087] Note that, also in the light-emitting module 300 of the present embodiment, the light-reflecting member 31 may reach up to the upper surface of the phosphor portion 15. Further, the light-emitting module 300 may be, for example, in a mode in which the light-emitting devices 200 shown in the second embodiment are arranged. That is, the light-emitting devices 200 each provided with the light-reflecting member 26 may be arranged side by side.

[0088] Also, as a modified example of the light-emitting module 300 of Example 3, it is also possible to adopt a structure without the light reflection member 31. For example, it is also possible to adopt an arrangement in which the light-emitting device 100 shown in Example 1 is arranged on the support substrate 28.

Explanation of Reference Numerals

[0089] 100, 110, 120, 130, 200 Light-emitting device 300 Light-emitting module 11, 28 Support substrate 13 Light-emitting element 15 Phosphor part 17 Semiconductor structure layer 18 Translucent substrate 21 p-electrode 22 n-electrode 24 Adhesive 26, 31 Light reflection member 29 Frame

Claims

1. a substrate; a light-emitting element including a light-emitting layer disposed on the substrate; a phosphor member that is bonded to the light-emitting element via a light-transmissive adhesive, contains a phosphor that is excited by light emitted from the light-emitting layer to emit fluorescence, and has a slit formed along the outer edge of the upper surface of the light-emitting element on the lower surface; and the adhesive bonds the upper surface of the light-emitting element and the lower surface of the phosphor member while filling the slit, the light-emitting device being characterized in this.

2. The light-emitting device according to claim 1, wherein the phosphor member has a lower surface larger in size than the upper surface of the light-emitting element.

3. The light-emitting device according to claim 2, wherein the inner edge of the slit overlaps the outer edge of the upper surface of the light-emitting element in a top view.

4. The light-emitting device according to claim 2 or 3, wherein the slit is formed in an annular shape in a top view.

5. The light-emitting element has a rectangular upper surface shape, and in each portion along each side of the upper surface of the light-emitting element, the depth at the position corresponding to the center of each side of the upper surface of the light-emitting element is the deepest, the light-emitting device according to claim 2 or 3 being characterized in this.

6. The light-emitting element has a rectangular upper surface shape, and the slit extends in a direction along each side of the upper surface of the light-emitting element in a top view and each end reaches the outer edge of the lower surface of the phosphor member, the light-emitting device according to claim 2 or 3 being characterized in this.

7. The light-emitting element has a rectangular upper surface shape, and the slits are formed separately from each other in a direction along each side of the upper surface of the light-emitting element in a top view, the light-emitting device according to claim 2 or 3 being characterized in this.

8. The light-emitting device according to any one of claims 1 to 3, further comprising a light reflection member formed across the side surface of the light-emitting element and having reflectivity with respect to the light emitted from the light-emitting layer and the fluorescence emitted from the phosphor.

9. A light-emitting module in which a plurality of light-emitting devices are arranged on a substrate, each of the plurality of light-emitting devices including a light-emitting element including a light-emitting layer and a phosphor member that is bonded to the light-emitting element via a light-transmissive adhesive, contains a phosphor that is excited by light emitted from the light-emitting layer to emit fluorescence, and has a slit formed along the outer edge of the upper surface of the light-emitting element on the lower surface. In each of the plurality of light-emitting devices, the light-emitting module is characterized in that the adhesive fills the slit and adheres the upper surface of the light-emitting element and the lower surface of the phosphor portion.

10. A method for manufacturing a light-emitting device, comprising: a substrate; a light-emitting element including a light-emitting layer disposed on the substrate; and a phosphor that is adhered to the light-emitting element via a light-transmissive adhesive and emits fluorescence when excited by light emitted from the light-emitting layer, the phosphor portion having a slit formed along the outer edge of the upper surface of the light-emitting element on the lower surface. An adhesion step of adhering the upper surface of the light-emitting element and the lower surface of the phosphor portion using the adhesive while filling the slit. A method for manufacturing a light-emitting device, characterized by including the above.

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