Power conversion apparatus and mechanically-electrically integrated motor apparatus

Abstract

To provide a power conversion apparatus reducing a concern of falling into a malfunction of a discharge resistor.SOLUTION: A power conversion apparatus has a semiconductor module 30, a capacitor module 40, a current sensor module 50, an ADC 16, a switchover switch, and a signal connector 18. The ADC 16 discharges power accumulated in a smoothing capacitor which the capacitor module 40 has. The switchover switch switches on / off conduction to the ADC 16 according to an external signal inputted from the signal connector 18. In plan view observed from a perpendicular direction, a region sandwiched by the ADC 16 and the signal connector 18 is regarded as a region A0 between resistor connectors. At least one of the semiconductor module 30, the capacitor module 40, and the current sensor module 50 is located in the region A0 between the resistor connectors in the plan view.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The disclosure in this specification relates to a power conversion device and a mechanically and electrically integrated motor device that are provided with a discharge resistor that discharges power stored in a smoothing capacitor. [Background technology]

[0002] The power conversion device described in Patent Document 1 includes a plurality of semiconductor elements that perform switching operations to convert power, and a smoothing capacitor that smooths the power supplied from a DC power source and supplies it to the semiconductor elements. If an external object were to collide with the power conversion device and damage the device, there is a risk of electric shock to repair workers if power remains stored in the smoothing capacitor. Therefore, the power conversion device described in Patent Document 1 includes a discharge resistor that discharges the power stored in the smoothing capacitor. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-177024 Summary of the Invention [Problem to be solved by the invention]

[0004] However, even if a discharge resistor is provided, there remains a concern that the discharge resistor may malfunction due to the collision.

[0005] One disclosed object is to provide a power conversion device and a mechanically and electrically integrated motor device that reduce the risk of the discharge resistor malfunctioning. [Means for solving the problem]

[0006] In order to achieve the above object, a power conversion device according to one aspect of the present disclosure includes the following components: a signal connector (18) to which an external signal is input; a semiconductor module (30) having a plurality of semiconductor elements (13) that perform switching operations in response to an external signal to convert power, and a semiconductor holding member (31) that holds the semiconductor elements; a capacitor module (40) having a smoothing capacitor (6) that smoothes power supplied from a DC power source (2) and supplies the power to a semiconductor element while smoothing the power, and a capacitor case (41) that houses the smoothing capacitor; a current sensor module (50) having a current sensor (51) for measuring the current value of the power output from a semiconductor element and a sensor holding member (52) for holding the current sensor; an active discharge resistor (16) that discharges the power stored in the smoothing capacitor; a changeover switch (62) for switching on and off the energization of the active discharge resistor in response to an external signal; In a plan view seen from the vertical direction, the area sandwiched between the active discharge resistor and the signal connector is defined as the inter-resistor connector area (A0), At least one of the semiconductor module, the capacitor module, and the current sensor module is located in the region between the resistor connectors in a plan view.

[0007] In the above-described power conversion device, at least one of the semiconductor module, capacitor module, and current sensor module is located in a region sandwiched between the active discharge resistor and the signal connector in a plan view. Therefore, even if a horizontal impact is applied to the power conversion device from the signal connector side, even if the signal connector is damaged, the active discharge resistor is likely to be protected by one of the modules and remain intact. Therefore, the above-described power conversion device can improve the probability of discharge even when a horizontal impact is applied.

[0008] In order to achieve the above object, a "mechanically integrated motor device" according to one aspect of the present disclosure includes the following configuration: a signal connector (18) to which an external signal is input; a semiconductor module (30) having a plurality of semiconductor elements (13) that perform switching operations in response to an external signal to convert power, and a semiconductor holding member (31) that holds the semiconductor elements; a capacitor module (40) having a smoothing capacitor (6) that smoothes power supplied from a DC power source (2) and supplies the power to a semiconductor element while smoothing the power, and a capacitor case (41) that houses the smoothing capacitor; a current sensor module (50) having a current sensor (51) for measuring the current value of the power output from a semiconductor element and a sensor holding member (52) for holding the current sensor; an active discharge resistor (16) that discharges the power stored in the smoothing capacitor; a changeover switch (62) for switching the energization of the active discharge resistor on and off in response to an external signal; a passive discharge resistor (15) capable of constantly discharging the power stored in the smoothing capacitor regardless of the content of an external signal; an electric motor (3) driven by power output from a semiconductor element; a housing (100) that houses a semiconductor module, a capacitor module, a current sensor module, and an electric motor; In a plan view seen from the vertical direction, the area sandwiched between the active discharge resistor and the signal connector is defined as the inter-resistor connector area (A0), At least one of the semiconductor module, the capacitor module, and the current sensor module is located in an area between the resistor connectors in a plan view; The passive discharge resistor is located closer to the geometric center (C2) of the housing than the active discharge resistor.

[0009] In the electromechanical integrated motor device disclosed herein, as in the power conversion device described above, at least one of the semiconductor module, capacitor module, and current sensor module is located in the area between the resistor connectors in a plan view. Therefore, even if the signal connector is damaged, the active discharge resistor is likely to remain intact because it is protected by one of the modules. This improves the likelihood that discharge will be possible even if the electromechanical integrated motor device is subjected to a horizontal impact.

[0010] Here, in the case of an active discharge resistor, if the power-off signal is not output normally, discharge will not occur even if the active discharge resistor is not damaged. In this respect, passive discharge resistors are more reliable and less likely to malfunction than active discharge resistors. In consideration of this, according to the above-mentioned electromechanical integrated motor device, the passive discharge resistor is positioned closer to the geometric center of the housing than the active discharge resistor. Therefore, the passive discharge resistor is more easily protected from external impacts than the active discharge resistor. In other words, the highly reliable passive discharge resistor is protected preferentially over the active discharge resistor. This reduces the risk of discharge being disabled from both the active discharge resistor and the passive discharge resistor.

[0011] The reference numbers in parentheses above merely indicate an example of the correspondence with specific configurations in the embodiments described below, and do not in any way limit the technical scope. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a diagram showing a circuit configuration and a drive system in a power conversion device according to a first embodiment. [Figure 2] 1 is a cross-sectional view showing a mechanically and electrically integrated motor device equipped with a power conversion device according to a first embodiment. [Figure 3] 1 is a plan view of a power conversion device according to a first embodiment, viewed from above. [Figure 4] FIG. 10 is a cross-sectional view showing a mechanically and electrically integrated motor device according to a second embodiment. [Figure 5]FIG. 10 is a plan view of a power conversion device according to a second embodiment, as viewed from above. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, several embodiments will be described with reference to the drawings. Note that in each embodiment, corresponding components are designated by the same reference numerals, and redundant description may be omitted. When only a portion of the configuration is described in each embodiment, the configuration of another embodiment previously described may be applied to the remaining portion of the configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations of several embodiments may be partially combined together even if not explicitly stated, provided that there is no particular problem with the combination.

[0014] The electric device of this embodiment is, for example, a power conversion device applied to a mobile body using a rotating electric machine as a drive source. The mobile body is, for example, an electric vehicle such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), or a plug-in hybrid electric vehicle (PHEV), an electric flying object such as a drone or an electric vertical take-off and landing aircraft (eVTOL), a ship, construction machinery, or agricultural machinery. An example in which the electric device is applied to a vehicle will be described below.

[0015] (First embodiment) First, the schematic configuration of a vehicle drive system will be described with reference to FIG.

[0016] <Vehicle drive system> As shown in Fig. 1, a vehicle drive system 1 includes a DC power supply 2, a motor generator (hereinafter referred to as MG3), and a power conversion device 4. The power conversion device 4 and the MG3 are integrally configured to provide an electromechanical integrated motor device.

[0017] The DC power supply 2 is a DC voltage source formed by a chargeable and dischargeable secondary battery. The MG3 is a three-phase AC rotating electric machine. The MG3 functions as a drive source for the vehicle, that is, an electric motor. The MG3 functions as a generator during regeneration. The power conversion device 4 converts power between the DC power supply 2 and the MG3.

[0018] <Circuit configuration of power conversion device> FIG. 1 shows the circuit configuration of a power conversion device 4. The power conversion device 4 includes at least a power conversion circuit. The power conversion circuit of this embodiment is an inverter. The power conversion device 4 may further include a smoothing capacitor 6, a drive circuit 7, a PDC 15, an ADC 16, and the like. PDC is an abbreviation for Passive Discharge and corresponds to a passive discharge resistor. ADC is an abbreviation for Active Discharge and corresponds to an active discharge resistor.

[0019] The smoothing capacitor 6 mainly smoothes the DC voltage supplied from the DC power supply 2. The smoothing capacitor 6 is connected to a P line 8, which is a power supply line on the high potential side, and an N line 9, which is a power supply line on the low potential side. The P line 8 is connected to the positive electrode of the DC power supply 2, and the N line 9 is connected to the negative electrode of the DC power supply 2. The positive electrode of the smoothing capacitor 6 is connected to the P line 8 between the DC power supply 2 and the inverter. The negative electrode of the smoothing capacitor 6 is connected to the N line 9 between the DC power supply 2 and the inverter. The smoothing capacitor 6 is connected in parallel to the DC power supply 2.

[0020] The inverter is a DC-AC conversion circuit. The inverter converts DC voltage into three-phase AC voltage in accordance with switching control by a control circuit mounted on control board 60 and outputs the voltage to MG3. This drives MG3 to generate a predetermined torque. During regenerative braking of the vehicle, the inverter converts the three-phase AC voltage generated by MG3 in response to rotational force from the wheels into DC voltage in accordance with switching control by the control circuit and outputs the DC voltage to P line 8. In this way, the inverter performs bidirectional power conversion between DC power source 2 and MG3.

[0021] The inverter is configured with upper and lower arm circuits 10 for three phases. The upper and lower arm circuits 10 are sometimes referred to as legs. Each upper and lower arm circuit 10 has an upper arm 10H and a lower arm 10L. The upper arm 10H and the lower arm 10L are connected in series between the P line 8 and the N line 9, with the upper arm 10H on the P line 8 side.

[0022] The connection point between the upper arm 10H and the lower arm 10L, i.e., the midpoint of the upper and lower arm circuit 10, is connected to the corresponding phase winding 3a of the MG3 via an output line 11. Of the upper and lower arm circuits 10, the U-phase upper and lower arm circuit 10U is connected to the U-phase winding 3a via the output line 11. The V-phase upper and lower arm circuit 10V is connected to the V-phase winding 3a via the output line 11. The W-phase upper and lower arm circuit 10W is connected to the W-phase winding 3a via the output line 11. The magnitude of the current of the power output from the output line 11 to the MG3 is detected by a current sensor 51. The current sensor 51 is provided on each of the output lines 11 for the U, V, and W phases.

[0023] The upper and lower arm circuits 10 (10U, 10V, 10W) each have a series circuit 12. The upper and lower arm circuits 10 may have one or more series circuits 12. When there are more than one series circuit 12, the series circuits 12 are connected in parallel to each other to form one phase of the upper and lower arm circuit 10. The series circuit 12 is formed by connecting a switching element 13 on the upper arm 10H side and a switching element 13 on the lower arm 10L side in series between a P line 8 and an N line 9.

[0024] The number of each of the high-side switching elements 13 and the low-side switching elements 13 constituting the series circuit 12 may be one or more. The series circuit 12 of this embodiment has two switching elements 13 on the high-side and two switching elements 13 on the low-side. The two switching elements 13 on the high-side are connected in parallel, and the two switching elements 13 on the low-side are connected in parallel to constitute one series circuit 12. In other words, each of the six arms 10H, 10L of the three-phase upper and lower arm circuits 10 is constituted by two switching elements 13 connected in parallel to each other.

[0025] The switching element 13 is a semiconductor element, and in this embodiment, an n-channel MOSFET is used as the switching element 13. MOSFET is an abbreviation for Metal Oxide Semiconductor Field Effect Transistor. The switching element 13 is not limited to a MOSFET. For example, an IGBT may be used. IGBT is an abbreviation for Insulated Gate Bipolar Transistor.

[0026] The two MOSFETs connected in parallel are turned on and off at the same timing by a common gate drive signal (drive voltage). In the upper arm 10H, the drain of the MOSFET is connected to a P line 8. In the lower arm 10L, the source of the MOSFET is connected to an N line 9. The drain of the MOSFET in the upper arm 10H and the drain of the MOSFET in the lower arm 10L are connected to each other.

[0027] The drive circuit 7 drives the switching elements 13 that constitute a power conversion circuit such as an inverter. The drive circuit 7 supplies a drive voltage to the gate of the corresponding MOSFET based on a drive command from the control circuit. The drive circuit drives the corresponding MOSFET, i.e., turns it on and off, by applying the drive voltage. The drive circuit is sometimes called a driver.

[0028] The control circuit includes a microcomputer. Hereinafter, this microcomputer will be referred to as microcomputer 61. The control circuit generates a drive command for operating the switching element 13 and outputs it to the drive circuit 7. The control circuit receives external signals such as a torque request input from a higher-level ECU (not shown), signals detected by various sensors, and an abnormality signal reporting the occurrence of an abnormality. ECU is an abbreviation for Electronic Control Unit. In addition, a signal detected by the current sensor 51 is input to the control circuit as an internal signal.

[0029] PDC 15 and ADC 16 are connected in parallel to smoothing capacitor 6 and discharge power stored in smoothing capacitor 6. For example, after turning off the power supply between DC power supply 2 and smoothing capacitor 6, power is discharged from smoothing capacitor 6 through PDC 15 or ADC 16. This prevents a worker performing maintenance on power conversion device 4 from receiving an electric shock when the worker touches power conversion device 4. For example, after a vehicle collides with an external obstacle or another vehicle, power is discharged from smoothing capacitor 6 through PDC 15 or ADC 16. This prevents a worker from receiving an electric shock when the worker touches power conversion device 4 to restore the vehicle. Note that PDC 15 and ADC 16 are included in power conversion device 4.

[0030] The PDC 15 is always connected to the P line 8 and the N line 9. Therefore, the PDC 15 always discharges the smoothing capacitor 6 not only when the power supply between the DC power supply 2 and the smoothing capacitor 6 is turned off, but also when it is turned on. The PDC 15 is set to a resistance value greater than that of the ADC 16. Therefore, the discharge speed by the PDC 15 is slower than the discharge speed by the ADC 16.

[0031] The ADC 16 is connected in series with a changeover switch 62. The changeover switch 62 is a switch such as a MOSFET, an IGBT, or an electromagnetic relay. When the changeover switch 62 is turned on, the ADC 16 is energized with the P line 8 and the N line 9, and is ready to discharge. When the changeover switch 62 is turned off, the ADC 16 is cut off from the P line 8 or the N line 9, and is ready to discharge. The on / off operation of the ADC 16 is controlled by a control circuit. The control circuit switches the on / off operation of the ADC 16 according to the content of the external signal described above.

[0032] For example, the circuit is configured so that the changeover switch 62 turns on when the supply of low voltage that drives the control circuit, etc., fails. In this way, the control circuit switches the power supply to the changeover switch 62 on and off depending on whether or not there is a low voltage failure. In this case, the microcomputer 61 does not control the changeover switch 62 to turn on. On the other hand, instead of the above circuit configuration, the following circuit configuration may be used. That is, when an external signal contains an abnormal signal, the control circuit turns on the changeover switch 62. For example, when an external signal that would normally be input is no longer input, the control circuit considers this to be an abnormality and turns on the changeover switch 62. In short, the control circuit switches the power supply to the changeover switch 62 on and off depending on the external signal. <Configuration of each module> As shown in FIG. 2, the power conversion device 4 includes a semiconductor module 30, a capacitor module 40, a current sensor module 50, a control board 60, and an inverter case 110.

[0033] The inverter case 110 is made of metal and has a generally cubic shape. The inverter case 110 houses the semiconductor module 30, the capacitor module 40, the current sensor module 50, the control board 60, the ADC 16, etc. The inverter case 110 has an opening for inserting and arranging the control board 60, and the opening is closed by a lid 113.

[0034] The motor case 120 accommodates the MG3 and the transmission 3b inside. The motor case 120 is made of metal and has a roughly cubic shape. The inverter case 110 is connected to the motor case 120. In other words, the power conversion device 4 is integrated with the MG3 to form an electromechanical integrated motor device. The inverter case 110 and the motor case 120 connected to each other correspond to the housing 100 of the electromechanical integrated motor device.

[0035] The transmission 3b is a transmission that changes the speed (e.g., reduces the speed) of the rotation of the MG3 and outputs it. The output shaft 3c of the transmission 3b protrudes from the inside to the outside of the motor case 120 and transmits rotational torque to the driving wheels of the vehicle. The bus bar B1 that connects the winding 3a of the MG3 to the semiconductor module 30 functions as the output line 11. This bus bar B1 is arranged to straddle from the inverter case 110 to the motor case 120. The current sensor module 50 is arranged to detect the current flowing through the bus bar B1.

[0036] The electromechanical integrated motor device is mounted on a vehicle. The arrows indicating up, down, front, and rear in Fig. 2 indicate the front-rear and up-down directions of the vehicle when the electromechanical integrated motor device is mounted on the vehicle. The up-down direction of the vehicle coincides with the vertical direction. The arrows indicating front, back, left, and right in Fig. 3 indicate the front-rear and left-right directions of the vehicle when the electromechanical integrated motor device is mounted on the vehicle. As shown in Fig. 2, the inverter case 110 is disposed above the motor case 120. The inverter case 110 is supported by being fastened to the motor case 120 with bolts. The motor case 120 is supported by being fastened to a bracket on the vehicle body with bolts.

[0037] The inverter case 110 has a cooling passage wall 112. The cooling passage wall 112 defines a cooling passage 112a therein through which a liquid refrigerant flows. The refrigerant is supplied from outside the inverter case 110 and circulates to mainly cool the semiconductor module 30. The refrigerant may also be used to cool the capacitor module 40, the current sensor module 50, the PDC 15, and the ADC 16.

[0038] The semiconductor modules 30 constitute the upper and lower arm circuits 10, i.e., the inverter. The power conversion device 4 of this embodiment includes three semiconductor modules 30. One semiconductor module 30 provides one series circuit 12, i.e., one phase of the upper and lower arm circuits 10. The three semiconductor modules 30 corresponding to each phase are arranged side by side in the left-right direction as shown in FIG. 3. Note that in FIG. 3, the three semiconductor modules 30 are illustrated as one unit.

[0039] The semiconductor module 30 has the above-mentioned multiple switching elements 13 and a molded resin 31 (semiconductor holding member) that holds the multiple switching elements 13. The semiconductor module 30 also has multiple external connection terminals (not shown) that protrude from the molded resin 31. The multiple external connection terminals include drain terminals connected to drain electrodes of the switching elements 13, source terminals connected to source electrodes of the switching elements 13, and signal terminals connected to gate electrodes of the switching elements 13.

[0040] The drain terminal of the upper arm 10H is connected to a P line 8, and the source terminal of the lower arm 10L is connected to an N line 9. Specifically, these terminals are connected to the positive and negative terminals of the smoothing capacitor 6 by bus bars B2. The source terminal of the upper arm 10H and the drain terminal of the lower arm 10L are connected to an output line 11. Specifically, these terminals are connected to the winding 3a of the MG3 by the bus bar B1 described above. The signal terminal is connected to the drive circuit 7 through a signal line (not shown).

[0041] The semiconductor module 30 is disposed so as to be in close contact with the cooling passage wall 112. Specifically, thermally conductive grease or thermally conductive gel is interposed between the semiconductor module 30 and the cooling passage wall 112. This thermally connects the semiconductor module 30 to the cooling passage wall 112, and heat generated in the semiconductor module 30 is dissipated to the refrigerant.

[0042] The semiconductor module 30 is supported by being bolted to the inverter case 110. Specifically, the mold resin 31 may be directly bolted to the inverter case 110, or a holding member for holding the semiconductor module 30 may be provided and the holding member may be bolted to the inverter case 110.

[0043] The capacitor module 40 includes the smoothing capacitor 6 described above and a capacitor case 41 that houses the smoothing capacitor 6. As an example, the smoothing capacitor 6 in this embodiment is a film capacitor formed by rolling a pair of film electrode sheets. The capacitor case 41 houses a plurality of smoothing capacitors 6 that are connected in parallel to each other. The capacitor case 41 is filled with a resin material that seals the smoothing capacitors 6 by potting.

[0044] Furthermore, the capacitor module 40 has a plurality of capacitor bus bars (not shown) protruding from the resin material. The capacitor bus bars are bus bars connected to the positive and negative electrodes of the smoothing capacitor 6, respectively. The capacitor bus bars are connected to one end of the bus bar B3. The other end of the bus bar B3 is connected to the power connector 19 attached to the inverter case 110. As a result, the electrodes of the smoothing capacitor 6 are connected to the DC power supply 2 by the bus bar B3. In other words, the positive electrode of the smoothing capacitor 6 is electrically connected to the P line 8, and the negative electrode of the smoothing capacitor 6 is electrically connected to the N line 9.

[0045] The power connector 19 may be disposed so as to protrude from the case wall of the inverter case 110, or may be disposed inside the inverter case 110 at a position facing an opening formed in the case wall. The power connector 19 is connected to a connector of a power cable connected to the DC power supply 2.

[0046] The current sensor module 50 has the current sensor 51 described above and a sensor holding member 52 that holds the current sensor 51. The current sensor 51 is provided on the bus bar B1 of each phase. The multiple current sensors 51 provided for each phase are held by one sensor holding member 52. The sensor holding member 52 is made of an electrically insulating resin. The sensor holding member 52 is supported by being fastened to the inverter case 110 with bolts.

[0047] A plurality of electronic components and connectors are mounted on the control board 60, and these electronic components constitute the aforementioned drive circuit 7. The control board 60 also has the aforementioned microcomputer 61, changeover switch 62, and board connector 63 mounted thereon.

[0048] The board connector 63 is connected to a connector (not shown) provided at one end of the signal harness 18a. The signal connector 18 provided at the other end of the signal harness 18a is provided in the inverter case 110. The signal connector 18 is connected to a connector of a signal line connected to a higher-level ECU. Note that the signal harness 18a and the board connector 63 may be eliminated, and the signal connector 18 may be mounted on the control board 60.

[0049] In this embodiment, the signal connector 18 is disposed so as to protrude from the case wall surface of the inverter case 110. However, the signal connector 18 may be disposed inside the inverter case 110 at a position facing an opening formed in the case wall surface. Moreover, the signal connector 18 may be disposed so as to protrude from the wall surface of the lid 113, or may be disposed inside the inverter case 110 at a position facing an opening formed in the lid 113.

[0050] In this embodiment, the signal connector 18 is held by the inverter case 110. However, the signal connector 18 may be held by the control board 60 or the lid 113. In this embodiment, the signal connector 18 is attached in an orientation that allows the connector to be connected from the front side of the vehicle. However, the orientation is not limited to this, and the connector may be connected from any of the rear side, upper side, left side, right side, and lower side.

[0051] The control board 60 is disposed above the semiconductor module 30. The semiconductor module 30 and the capacitor module 40 are disposed side by side in a direction perpendicular to the up-down direction (i.e., horizontally). The dotted line in Fig. 3 indicates the position of the control board 60, and as shown in the figure, the semiconductor module 30 and the capacitor module 40 are located in the area when the control board 60 is projected in the up-down direction.

[0052] Furthermore, a metal noise shielding plate 114 is disposed between the control board 60 and the semiconductor module 30. The noise shielding plate 114 blocks noise emitted from the switching elements 13, thereby preventing the control board 60 from malfunctioning due to the noise. In this embodiment, the noise shielding plate 114 is supported by the inverter case 110. However, the noise shielding plate 114 may be supported by the semiconductor module 30 or the capacitor module 40. The noise shielding plate 114 is large enough to cover the entire control board 60 when viewed from a direction perpendicular to the control board 60.

[0053] The PDC 15 is housed in a PDC case 15a, which is a resin case. A P-side power line 15p, one end of which is connected to the positive terminal of the PDC 15, and an N-side power line 15n, one end of which is connected to the negative terminal of the PDC 15, extend from the inside to the outside of the PDC case 15a. The PDC 15 is connected to a bus bar B3 that connects the capacitor bus bar to a power connector 19. Specifically, the other end of the P-side power line 15p is connected to the P-side bus bar B3, which corresponds to the P line 8, and the other end of the N-side power line 15n is connected to the N-side bus bar B3, which corresponds to the N line 9.

[0054] ADC 16 is housed in ADC case 16a, which is a resin case. A positive power line 16p connected to the positive terminal of ADC 16 and an negative power line 16n connected to the negative terminal of ADC 16 extend from the inside to the outside of ADC case 16a. ADC 16 is not directly connected to bus bar B3, but is connected to bus bar B3 via control board 60 and selector switch 62.

[0055] Specifically, the other end of P-side power line 16p and the other end of N-side power line 16n are connected to control board 60. Control board 60 and bus bar B3 are connected by P-side relay power line 16p1 and N-side relay power line 16n1. As a result, the other end of P-side power line 16p is electrically connected to P-side bus bar B3 via control board 60 and P-side relay power line 16p1. The other end of N-side power line 16n is electrically connected to N-side bus bar B3 via changeover switch 62 mounted on control board 60 and N-side relay power line 16n1.

[0056] <Positional relationship of each component> In the electromechanical integrated motor device mounted on a vehicle, in a plan view seen from the vertical direction as shown in FIG. 3 (see FIG. 3), the semiconductor module 30 and the capacitor module 40 are arranged between the ADC 16 and the signal connector 18. More specifically, in a plan view seen from the vertical direction, the area sandwiched between the ADC 16 and the signal connector 18 is defined as an inter-resistor connector area A0. The inter-resistor connector area A0 is the area sandwiched between two imaginary straight lines L1 and L2 shown by the dashed dotted lines in FIG. 3. The imaginary straight lines L1 and L2 are straight lines connecting the outermost portion of the signal connector 18 and the outermost portion of the ADC case 16a, and are set so as to maximize the area of the inter-resistor connector area A0.

[0057] A portion of the semiconductor module 30 and a portion of the capacitor module 40 are located in the inter-resistor connector area A0. Note that the respective configurations are not limited to the positional relationship shown in FIG. 3 , and it is sufficient that either the semiconductor module 30 or the capacitor module 40 is located in the inter-resistor connector area A0. Also, the entire semiconductor module 30 may be located in the inter-resistor connector area A0. The entire capacitor module 40 may be located in the inter-resistor connector area A0. Note that the current sensor module 50 is located outside the inter-resistor connector area A0.

[0058] The inverter center C1 shown in Figure 3 is the geometric center of the inverter case 110 in a planar view seen from the vertical direction. The geometric center is the position of the arithmetic mean taken over all points belonging to a target figure. The target figure is the two-dimensional outer shape of the inverter case 110 in a planar view.

[0059] Two imaginary straight lines L3 and L4 shown by the two-dot chain lines in FIG. 3 are perpendicular to each other and pass through the inverter center C1. The internal space of the inverter case 110 is divided into four regions A1, A2, A3, and A4 by the two imaginary straight lines L3 and L4. Of these four regions A1, A2, A3, and A4, a pair of regions positioned diagonally opposite each other is referred to as a diagonal region. For example, the pair of regions A1 and A2 corresponds to a diagonal region. The signal connector 18 is arranged in one of the diagonal regions (region A2), and the ADC 16 is arranged in the other diagonal region (region A1).

[0060] In other words, the ADC 16 and the signal connector 18 are disposed diagonally relative to each other inside the inverter case 110. Note that in the example shown in Fig. 3, the inverter case 110 is rectangular in plan view, and the imaginary lines L3 and L4 are set so as to be perpendicular to the short and long sides of the rectangle. However, this is not limited to this, and the imaginary lines L3 and L4 may be set so as to extend obliquely relative to the short and long sides of the rectangle. Furthermore, the inverter case 110 is not limited to being rectangular in plan view, and may have a shape in plan view that combines multiple rectangles, for example.

[0061] In this embodiment, the signal connector 18 is arranged on the control board 60 side with respect to the noise shielding plate 114. However, the signal connector 18 may be arranged on the opposite side of the control board 60 with respect to the noise shielding plate 114. In this embodiment, the ADC 16 is arranged on the opposite side of the control board 60 with respect to the noise shielding plate 114. However, the ADC 16 may be arranged on the control board 60 side with respect to the noise shielding plate 114.

[0062] In a plan view seen from the vertical direction, the semiconductor module 30, the capacitor module 40, and the current sensor module 50 are arranged side by side without overlapping one another. Furthermore, in this embodiment, the ADC 16 is arranged side by side with the semiconductor module 30, the capacitor module 40, and the current sensor module 50 without overlapping one another. Similarly to the ADC 16, the PDC 15 is also arranged side by side with no overlapping with each module. Furthermore, the PDC 15 and the ADC 16 are arranged side by side without overlapping one another in the above plan view.

[0063] The capacitor module 40 is disposed at a position farther from the ADC 16 than the semiconductor module 30. That is, in the above plan view, the ADC 16, the semiconductor module 30, the capacitor module 40, and the signal connector 18 are arranged in this order.

[0064] 2 and 3 is the geometric center of the housing 100 in three dimensions, i.e., the up-down direction, the left-right direction of the vehicle, and the front-rear direction of the vehicle. The figure that is the target of the geometric center is the three-dimensional outer shape of the housing 100. The PDC 15 is disposed at a position closer to the housing center C2 than the ADC 16. In this embodiment, the housing center C2 is located inside the motor case 120. More specifically, the housing center C2 is located inside the MG3.

[0065] 2, PDC 15 is disposed between inverter case 110 and motor case 120. Specifically, PDC 15 is disposed between bottom surface 111 of inverter case 110 and the upper surface of motor case 120. In other words, PDC 15 is located outside inverter case 110, but in the space formed between inverter case 110 and motor case 120.

[0066] <Summary of the First Embodiment> Here, assume that an external object collides with the vehicle. As a result of the collision, an on-vehicle component or an external object collides with the power conversion device 4 in the direction indicated by the arrows in Figures 2 and 3. In this case, even if the signal connector 18 is damaged, the ADC 16 is likely to remain unharmed because it is protected by the semiconductor module 30 and the capacitor module 40. This is because, in this embodiment, the semiconductor module 30 and the capacitor module 40 are located in the resistor-connector area A0 between the ADC 16 and the signal connector 18.

[0067] In the above scenario, damage to the signal connector 18 prevents external signals from being input to the control circuit. As a result, the control circuit assumes that an abnormality has occurred and turns on the changeover switch 62, causing the charge stored in the smoothing capacitor 6 to be quickly discharged from the ADC 16. As described above, according to this embodiment, even if an impact is applied to the power conversion device 4 and the signal connector 18 is damaged, the ADC 16 is protected by each module, improving the likelihood that it will be able to discharge.

[0068] Furthermore, in this embodiment, the signal connector 18 is arranged in one diagonal area (area A2), and the ADC 16 is arranged in the other diagonal area (area A1). This allows the signal connector 18 and the ADC 16 to be spaced apart more widely than when the signal connector 18 and the ADC 16 are arranged in the same area or adjacent areas. This further increases the likelihood that the ADC 16 will be protected and remain intact even if the signal connector 18 is damaged. This further increases the likelihood that the ADC 16 will be able to discharge.

[0069] Here, when the selector switch 62 is turned on to discharge electricity from the ADC 16, the ADC 16 generates heat and reaches a high temperature (for example, about 200°C). In consideration of this, in this embodiment, the ADC 16 is arranged without being mounted on the control board 60, and is electrically connected to the control board 60 by the P-side power line 16p and the N-side power line 16n. Therefore, damage to the control board 60 due to the heat generated by the ADC 16 can be prevented.

[0070] Furthermore, in this embodiment, the capacitor module 40 is disposed farther from the ADC 16 than the semiconductor module 30. Therefore, the capacitor module 40 can be protected from heat damage caused by the ADC 16, which becomes hot, with priority over the semiconductor module 30. Generally, the capacitor module 40 has a lower heat resistance temperature than the semiconductor module 30, so this embodiment can suitably protect the capacitor module 40 from heat damage.

[0071] Furthermore, this embodiment includes a PDC 15 that can discharge at all times regardless of the content of the external signal. This means that even if the ADC 16 is damaged and cannot discharge, the PDC 15 may remain intact. In other words, this embodiment, which includes both the ADC 16 and the PDC 15, ensures redundancy in the discharge function.

[0072] The ADC 16 is set to discharge in a shorter time than the PDC 15. For example, the ADC 16 is set to a smaller resistance value than the PDC 15. Therefore, when an abnormality occurs, the selector switch 62 can be turned on to quickly discharge the ADC 16. This eliminates the need to set the PDC 15 to discharge in a short time. Therefore, the resistance value of the PDC 15 can be set to reduce the amount of power wasted from the PDC 15 during normal operation when no discharge is required. In other words, according to this embodiment, which includes both the ADC 16 and the PDC 15, it is possible to reduce wasted power consumption from the PDC 15 while ensuring redundancy in the discharge function, and yet, it is possible to quickly discharge the ADC 16 during an abnormality.

[0073] Here, in the case of the ADC 16, if the power-off signal is not output normally, the ADC 16 will not discharge even if it is not damaged. In this respect, the PDC 15 has higher reliability in terms of preventing malfunction than the ADC 16. In consideration of this, in this embodiment, the PDC 15 is disposed closer to the housing center C2 of the housing 100 than the ADC 16. Therefore, the PDC 15 is more easily protected from external impacts than the ADC 16. In other words, the highly reliable PDC 15 is protected preferentially over the ADC 16. This reduces the risk of discharge failure from either the ADC 16 or the PDC 15.

[0074] Furthermore, in this embodiment, PDC 15 is disposed between inverter case 110 and motor case 120. Therefore, PDC 15 is protected not only by inverter case 110 but also by robust motor case 120, thereby improving the function of protecting PDC 15 from impact. Moreover, because PDC 15 is disposed outside inverter case 110, it is possible to prevent various electrical components housed in inverter case 110 from being damaged by heat from PDC 15, which becomes hot. The resistance value of PDC 15 is set with consideration given to reducing the amount of heat generated.

[0075] (Second embodiment) In the first embodiment, the semiconductor module 30 and the capacitor module 40 are arranged side by side in the horizontal direction. In contrast, the semiconductor module 30 and the capacitor module 40 according to this embodiment are arranged side by side in the vertical direction, as shown in Figures 4 and 5. Furthermore, the power conversion device 4 according to this embodiment includes a boost circuit (not shown) that boosts the voltage supplied from the DC power supply 2, and a reactor 20 that reduces noise superimposed on the P line 8.

[0076] In the first embodiment, the semiconductor module 30 and the capacitor module 40 are located in the area A0 between the resistor connectors. In contrast, in this embodiment, the current sensor module 50 is located in the area A0 between the resistor connectors, as shown in Fig. 5. These points are the main features of this embodiment, which will be described in detail below.

[0077] The inverter case 110 has partition walls that divide the interior into multiple rooms R1, R2, and R3. The noise shielding plate 114 according to this embodiment is formed integrally with the inverter case 110, and this noise shielding plate 114 corresponds to a partition wall. The cooling passage wall 112 that forms the cooling passage 112a also corresponds to a partition wall. The cooling passage wall 112 divides the interior of the inverter case 110 into two rooms R1 and R2. The noise shielding plate 114 divides the interior of the inverter case 110 into two rooms R2 and R3. The three rooms R1, R2, and R3 are partitioned so that they are aligned vertically.

[0078] As described above, the plurality of smoothing capacitors 6 are housed in the capacitor case 41. In the first embodiment, the plurality of smoothing capacitors 6 are arranged so that the capacitor case 41 has a generally cubic shape. In contrast, in the present embodiment, the plurality of smoothing capacitors 6 are arranged so that the capacitor case 41 has a U-shape in plan view, as shown in FIG. 5 .

[0079] The control board 60, PDC 15, and signal connector 18 are arranged in the living room R3 located on the top floor. In the first embodiment, the signal connector 18 is electrically connected to the control board 60 via the signal harness 18a and the board connector 63. In contrast, in the present embodiment, the signal harness 18a and the board connector 63 are eliminated, and the signal connector 18 is mounted on the control board 60. The signal connector 18 is arranged to protrude from the wall surface of the lid 113 through an opening formed in the lid 113.

[0080] The room R2 located on the middle level contains the semiconductor module 30, the current sensor module 50, the ADC 16, and the power connector 19. The cooling passage 112a is disposed between the semiconductor module 30 and the cooling passage wall 112, and cools the semiconductor module 30 as well as the cooling passage wall 112.

[0081] A capacitor module 40 and a reactor 20 are disposed in the lower living room R1. The reactor 20 reduces noise superimposed on the P line 8 and is provided by a coil. One terminal of the coil is connected to the P line 8, and the other terminal is connected to the boost circuit. The capacitor module 40 and the reactor 20 are disposed side by side in the horizontal direction. The capacitor module 40 and the reactor 20 are thermally connected to the cooling passage wall 112 and are cooled by the refrigerant flowing through the cooling passage 112a.

[0082] 5 indicates the position of the control board 60, and as shown in the figure, the semiconductor module 30, capacitor module 40, current sensor module 50, and signal connector 18 are located in the area obtained by projecting the control board 60 in the vertical direction. Note that the PDC 15 and ADC 16 are located outside the area obtained by projecting the control board 60 in the vertical direction.

[0083] The resistor-connector area A0 according to this embodiment is the area sandwiched between two imaginary straight lines L1 and L2 indicated by the dashed-dotted lines in FIG. 5. In a plan view seen from the vertical direction, the current sensor module 50 is located in the resistor-connector area A0. In the example shown in FIG. 5, a portion of the current sensor module 50 is located in the resistor-connector area A0, but the entire current sensor module 50 may be located in the resistor-connector area A0. The semiconductor module 30, the capacitor module 40, and the reactor 20 are located outside the resistor-connector area A0.

[0084] The semiconductor module 30 is disposed at a position farther from the ADC 16 than the current sensor module 50. That is, in the above plan view, the separation distance between the semiconductor module 30 and the ADC 16 is greater than the separation distance between the current sensor module 50 and the ADC 16. Furthermore, the capacitor module 40 is disposed at a position farther from the ADC 16 than the current sensor module 50. That is, in the above plan view, the separation distance between the capacitor module 40 and the ADC 16 is greater than the separation distance between the current sensor module 50 and the ADC 16.

[0085] As described above, in this embodiment, the current sensor module 50 is located in the inter-resistor connector area A0. Therefore, similar to the effect of the first embodiment, even if the power conversion device 4 receives an impact and the signal connector 18 is damaged, the ADC 16 is protected by the current sensor module 50, and the probability that it will be able to discharge is improved.

[0086] Furthermore, in this embodiment, the semiconductor module 30 is disposed farther from the ADC 16 than the current sensor module 50. Therefore, the semiconductor module 30 can be protected from heat damage caused by the ADC 16, which becomes hot, with priority given to protecting the current sensor module 50.

[0087] Furthermore, in this embodiment, the capacitor module 40 is disposed farther from the ADC 16 than the current sensor module 50. Therefore, the capacitor module 40 can be protected from heat damage caused by the high temperature of the ADC 16, prior to the current sensor module 50. Generally, the capacitor module 40 has a lower heat resistance temperature than the current sensor module 50, so this embodiment can suitably protect the capacitor module 40 from heat damage.

[0088] Furthermore, in this embodiment, inverter case 110 has partition walls that divide the interior into multiple rooms R1, R2, and R3, and ADC 16 and PDC 15 are arranged in separate rooms. This reduces the possibility that both ADC 16 and PDC 15 will be unable to discharge when an impact is applied to power conversion device 4, thereby improving redundancy of the discharge function.

[0089] Furthermore, in this embodiment, a metal noise shielding plate 114 is provided between the semiconductor module 30 and the control board 60. The control board 60 is disposed in one area (room R3) separated by the noise shielding plate 114, and the ADC 16 is disposed in the other area (room R2). Therefore, the control board 60 can be better protected from heat damage of the ADC 16 than when the control board 60 is disposed in the same area as the ADC 16.

[0090] Furthermore, in this embodiment, a cooling passage wall 112 is provided between the capacitor module 40 and the semiconductor module 30, and defines a cooling passage 112a therein through which a liquid refrigerant flows. The ADC 16 is disposed on the opposite side of the cooling passage wall 112 from the capacitor module 40. That is, among the multiple rooms R1, R2, and R3, the ADC 16 is disposed in room R2, which is separate from room R1 in which the capacitor module 40 is disposed. This prevents the capacitor module 40 from suffering thermal damage from the ADC 16. The ADC 16 may be disposed in a room separate from the capacitor module 40. For example, the ADC 16 may be disposed in room R3 instead of room R2.

[0091] (Other embodiments) Although multiple embodiments of the present disclosure have been described above, not only the combinations of configurations explicitly stated in the description of each embodiment but also partial combinations of configurations of multiple embodiments can be made without explicit statements, as long as there are no particular problems with the combinations. Furthermore, combinations of configurations described in multiple embodiments and modified examples that are not explicitly stated are also considered to be disclosed by the following description.

[0092] In each of the above embodiments, the imaginary lines L1 and L2 that define the resistor-connector area A0 are lines that pass through the outermost portion of the ADC case 16a. Alternatively, the imaginary lines L1 and L2 may be lines that pass through the outermost portion of the ADC 16 housed in the ADC case 16a. Furthermore, although the ADC 16 is housed in the ADC case 16a in each of the above embodiments, the ADC case 16a may be eliminated.

[0093] In each of the above embodiments, the ADC 16 is arranged side by side with the semiconductor module 30, the capacitor module 40, and the current sensor module 50 so as not to overlap them in a plan view seen from the vertical direction. However, at least a portion of the ADC 16 may be arranged to overlap each module in the plan view. Alternatively, the entire ADC 16 may be arranged to overlap each module in the plan view.

[0094] In each of the above embodiments, in a plan view seen from the vertical direction, the ADC 16 is arranged side by side so as not to overlap with the PDC 15. However, the ADC 16 may be arranged so that at least a portion of the ADC 16 overlaps with the PDC 15 in the plan view.

[0095] In the first embodiment, the semiconductor module 30 and the capacitor module 40 are located in the inter-resistor connector area A0 in a plan view. However, either the semiconductor module 30 or the capacitor module 40 may be located in the inter-resistor connector area A0 in a plan view. It is sufficient that at least one of the semiconductor module 30, the capacitor module 40, and the current sensor module 50 is located in the inter-resistor connector area A0 in a plan view. For example, all of these modules may be located in the inter-resistor connector area A0. It is also desirable that the reactor 20 be located in the inter-resistor connector area A0 in a plan view.

[0096] In each of the above embodiments, the semiconductor holding member is molded resin 31, but the semiconductor holding member may be a resin case. In this case, instead of at least a portion of molded resin 31 being located in the inter-resistor connector area A0, at least a portion of the resin case may be located in the inter-resistor connector area A0.

[0097] In each of the above embodiments, the signal connector 18 is arranged in one of the diagonal areas (area A2), and the ADC 16 is arranged in the other of the diagonal areas (area A1). However, the signal connector 18 and the ADC 16 may be arranged in adjacent areas or in the same area.

[0098] In each of the above embodiments, the ADC 16 is not mounted on the control board 60, but it may be mounted on the control board 60. In each of the above embodiments, the ADC 16 and the control board 60 are separately arranged on one side and the other side of the noise shielding plate 114, but they may be arranged on the same side. In addition, the power conversion device 4 does not need to be provided with the noise shielding plate 114.

[0099] In each of the above embodiments, both the PDC 15 and the ADC 16 are provided, but the PDC 15 may be omitted if the ADC 16 is provided. The ADC 16 and the PDC 15 do not have to be arranged in different rooms among the multiple rooms R1, R2, and R3, and may be arranged in the same room. The ADC 16 and the capacitor module 40 do not have to be arranged in different rooms among the multiple rooms R1, R2, and R3, and may be arranged in the same room. The ADC 16 does not have to be arranged in room R2 as shown in FIG. 4, and may be arranged in room R1 or room R3.

[0100] In the above embodiments, the power conversion device is applied to an inverter, but may also be applied to a converter that converts a DC voltage into a DC voltage of a different value. The converter is configured, for example, with a reactor and the above-mentioned upper and lower arm circuits 10. This configuration enables voltage step-up and step-down.

[0101] (Disclosure of technical ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be written in a multiple dependent form, with the subsequent clause referring to the preceding clause as an alternative. Furthermore, some clauses may be written in a multiple dependent form, referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0102] (Technical thought 1) a signal connector (18) for inputting an external signal; a semiconductor module (30) having a plurality of semiconductor elements (13) that perform switching operations in response to the external signal to convert power, and a semiconductor holding member (31) that holds the semiconductor elements; a capacitor module (40) including a smoothing capacitor (6) that smoothes the power supplied from a DC power source (2) and supplies it to the semiconductor element, and a capacitor case (41) that houses the smoothing capacitor; a current sensor module (50) having a current sensor (51) for measuring the current value of the power output from the semiconductor element and a sensor holding member (52) for holding the current sensor; an active discharge resistor (16) that discharges the power stored in the smoothing capacitor; a changeover switch (62) that switches the energization of the active discharge resistor on and off in response to the external signal, In a plan view seen from the vertical direction, a region sandwiched between the active discharge resistor and the signal connector is defined as an inter-resistor connector region (A0), At least one of the semiconductor module, the capacitor module, and the current sensor module is located in the area between the resistor connectors in the plan view.

[0103] (Technical thought 2) an inverter case (110) that houses the semiconductor module, the capacitor module, and the current sensor module; Among the four regions divided by two imaginary lines (L3, L4) that pass through an inverter center (C1), which is the geometric center of the inverter case in the plan view, and are perpendicular to each other, a pair of regions that are diagonally positioned to each other are defined as diagonal regions (A1, A2), The power conversion device according to Technical Idea 1, wherein the signal connector is arranged in one of the diagonal areas and the active discharge resistor is arranged in the other of the diagonal areas.

[0104] (Technical Thought 3) a control board (60) on which the changeover switch is mounted, The power conversion device according to Technical Idea 1 or 2, wherein the active discharge resistor is arranged without being mounted on the control board and is electrically connected to the control board by power lines (16p, 16n).

[0105] (Technical Thought 4) a metallic noise shielding plate (114) disposed between the semiconductor module and the control board; A power conversion device according to Technical Idea 3, in which the control board is arranged in one area partitioned by the noise shielding plate, and the active discharge resistor is arranged in the other area.

[0106] (Technical Thought 5) In the plan view, the semiconductor module and the capacitor module are arranged side by side without overlapping, The power conversion device according to any one of Technical Concepts 1 to 4, wherein the capacitor module is disposed at a position farther away from the active discharge resistor than the semiconductor module.

[0107] (Technical Thought 6) In the plan view, the current sensor module and the semiconductor module are arranged side by side without overlapping, The power conversion device according to any one of Technical Ideas 1 to 5, wherein the semiconductor module is disposed at a position farther away from the active discharge resistor than the current sensor module.

[0108] (Technical Thought 7) a cooling passage wall (112) disposed between the capacitor module and the semiconductor module and defining therein a cooling passage (112a) through which a liquid refrigerant flows; The power conversion device according to any one of Technical Concepts 1 to 6, wherein the active discharge resistor is disposed on the opposite side of the cooling passage wall from the capacitor module.

[0109] (Technical Thought 8) The power conversion device according to any one of Technical Ideas 1 to 7, further comprising a passive discharge resistor (15) capable of constantly discharging the power stored in the smoothing capacitor regardless of the content of the external signal.

[0110] (Technical Thought 9) an inverter case (110) that houses the semiconductor module, the capacitor module, and the current sensor module; The inverter case has partition walls (112, 114) that divide the inside into a plurality of rooms (R1, R2, R3), The power conversion device according to Technical Idea 8, wherein the active discharge resistor and the passive discharge resistor are arranged in different living rooms.

[0111] (Technical Thought 10) a signal connector (18) for inputting an external signal; a semiconductor module (30) having a plurality of semiconductor elements (13) that perform switching operations in response to the external signal to convert power, and a semiconductor holding member (31) that holds the semiconductor elements; a capacitor module (40) including a smoothing capacitor (6) that smoothes the power supplied from a DC power source (2) and supplies it to the semiconductor element, and a capacitor case (41) that houses the smoothing capacitor; a current sensor module (50) having a current sensor (51) for measuring the current value of the power output from the semiconductor element and a sensor holding member (52) for holding the current sensor; an active discharge resistor (16) that discharges the power stored in the smoothing capacitor; a changeover switch (62) that switches the energization of the active discharge resistor on and off in response to the external signal; a passive discharge resistor (15) capable of constantly discharging the power stored in the smoothing capacitor regardless of the content of the external signal; an electric motor (3) driven by the power output from the semiconductor element; a housing (100) that houses the semiconductor module, the capacitor module, the current sensor module, and the electric motor; In a plan view seen from the vertical direction, a region sandwiched between the active discharge resistor and the signal connector is defined as an inter-resistor connector region (A0), At least one of the semiconductor module, the capacitor module, and the current sensor module is located in the region between the resistor connectors in the plan view, The electromechanical integrated motor device, wherein the passive discharge resistor is disposed closer to the geometric center (C2) of the housing than the active discharge resistor.

[0112] (Technical Thought 11) the housing includes an inverter case (110) that houses the semiconductor module, the capacitor module, and the current sensor module, and a motor case (120) that houses the electric motor; The electromechanical integrated motor device according to Technical Idea 10, wherein the passive discharge resistor is disposed between the inverter case and the motor case. [Explanation of symbols]

[0113] 100 housing, 110 inverter case, 112 partition wall (cooling passage wall), 112a cooling passage, 114 noise shielding plate, 114 partition wall, 120 motor case, 13 semiconductor element, 15 passive discharge resistor, 16 active discharge resistor, 16n, 16p power line, 18 signal connector, 2 DC power supply, 3 electric motor, 4 power conversion device, 30 semiconductor module, 31 semiconductor holding member, 40 capacitor module, 41 capacitor case, 50 current sensor module, 51 current sensor, 52 sensor holding member, 6 smoothing capacitor, 60 control board, 62 changeover switch, A0 area between resistor connectors, A1, A2 diagonal area, C1 inverter center, C2 geometric center, L3, L4 virtual line, R1, R2, R3 rooms.

Claims

1. A signal connector (18) into which an external signal is input, A semiconductor module (30) having a plurality of semiconductor elements (13) that switch in response to the external signal to convert power, and a semiconductor holding member (31) that holds the semiconductor elements, A capacitor module (40) having a smoothing capacitor (6) that smooths the power supplied from a DC power supply (2) and supplies it to the semiconductor element, and a capacitor case (41) that houses the smoothing capacitor, A current sensor module (50) having a current sensor (51) for measuring the current value of the power output from the semiconductor element, and a sensor holding member (52) for holding the current sensor, An active discharge resistor (16) for discharging the power stored in the smoothing capacitor, The system includes a changeover switch (62) that switches the active discharge resistor on and off in response to the external signal, In a plan view from the vertical, the region sandwiched between the active discharge resistor and the signal connector is defined as the inter-connector region (A0). A power conversion device in which at least one of the capacitor module and the current sensor module is located in the region between the resistor connectors in the plan view.

2. The inverter case (110) houses the semiconductor module, the capacitor module, and the current sensor module, In the aforementioned plan view, the inverter center (C1), which is the geometric center of the inverter case, is passed through two mutually orthogonal imaginary lines (L3, L4) that separate the four regions. Of these, a pair of regions that are diagonally opposite each other are designated as diagonal regions (A1, A2). The power conversion device according to claim 1, wherein the signal connector is located on one of the diagonal regions, and the active discharge resistor is located on the other of the diagonal regions.

3. The control board (60) on which the aforementioned changeover switch is mounted is provided. The power conversion device according to claim 1 or 2, wherein the active discharge resistor is positioned not on the control board and is electrically connected to the control board by power lines (16p, 16n).

4. The semiconductor module and the control board are separated by a metal noise shielding plate (114), The power conversion device according to claim 3, wherein the control board is arranged in one region separated by the noise shielding plate, and the active discharge resistor is arranged in the other region.

5. In the aforementioned plan view, the semiconductor module and the capacitor module are arranged side by side without overlapping. The power conversion device according to claim 1 or 2, wherein the capacitor module is positioned further away from the semiconductor module than the active discharge resistor.

6. In the aforementioned plan view, the current sensor module and the semiconductor module are arranged side by side without overlap. The power conversion device according to claim 1 or 2, wherein the semiconductor module is positioned further away from the current sensor module than the active discharge resistor.

7. Displaced between the capacitor module and the semiconductor module, it includes a cooling passage wall (112) that forms a cooling passage (112a) inside through which liquid coolant flows, The power conversion device according to claim 1 or 2, wherein the active discharge resistor is located on the opposite side of the capacitor module from the cooling passage wall.

8. The power conversion device according to claim 1 or 2, further comprising a passive discharge resistor (15) that can continuously discharge the power stored in the smoothing capacitor regardless of the content of the external signal.

9. The inverter case (110) houses the semiconductor module, the capacitor module, and the current sensor module, The inverter case has partition walls (112, 114) that divide the interior into multiple rooms (R1, R2, R3), The power conversion device according to claim 8, wherein the active discharge resistor and the passive discharge resistor are located in separate rooms.

10. The power conversion device according to claim 1, wherein the semiconductor module is positioned further away from the current sensor module than the active discharge resistor.

11. The power conversion device according to claim 1, wherein the capacitor module is positioned further away from the current sensor module than the active discharge resistor.

12. The control board (60) on which the changeover switch is mounted is provided. The power conversion device according to claim 1, wherein the active discharge resistor is not arranged in the region obtained by projecting the control board in a direction perpendicular to the board surface of the control board.

13. comprising a control board (60) on which the changeover switch is mounted, The power conversion device according to claim 1, wherein the current sensor module is arranged in a region obtained by projecting the control board in a direction perpendicular to the board surface of the control board.

14. A signal connector (18) into which an external signal is input, A semiconductor module (30) having a plurality of semiconductor elements (13) that switch in response to the external signal to convert power, and a semiconductor holding member (31) that holds the semiconductor elements, A capacitor module (40) having a smoothing capacitor (6) that smooths the power supplied from a DC power supply (2) and supplies it to the semiconductor element, and a capacitor case (41) that houses the smoothing capacitor, A current sensor module (50) having a current sensor (51) for measuring the current value of the power output from the semiconductor element, and a sensor holding member (52) for holding the current sensor, An active discharge resistor (16) for discharging the power stored in the smoothing capacitor, A changeover switch (62) that switches the active discharge resistor on and off in response to the external signal, The power stored in the smoothing capacitor is discharged at all times regardless of the content of the external signal by a passive discharge resistor (15), An electric motor (3) driven by power output from the semiconductor element, The system comprises the semiconductor module, the capacitor module, the current sensor module, and a housing (100) that houses the electric motor. In a plan view from the vertical, the region sandwiched between the active discharge resistor and the signal connector is defined as the inter-connector region (A0). At least one of the semiconductor module, the capacitor module, and the current sensor module is located in the region between the resistor connectors in the plan view. The passive discharge resistor is positioned closer to the geometric center (C2) of the housing than the active discharge resistor in the electromechanical motor device.

15. The housing includes an inverter case (110) housing the semiconductor module, the capacitor module, and the current sensor module, and a motor case (120) housing the electric motor. The electromechanical motor device according to claim 14, wherein the passive discharge resistor is disposed between the inverter case and the motor case.

16. Further comprising a reactor (20) that reduces noise superimposed on the power line (8), In the plan view, at least one of the capacitor modules or reactors (20) is located at a position overlapping with the semiconductor module. The electromechanical motor device according to claim 14 or 15, wherein a cooling passage (112a) exists between the semiconductor module and the capacitor module or reactor.

17. Further comprising a reactor (20) that reduces noise superimposed on the power line (8), The electromechanical motor device according to claim 14 or 15, wherein the reactor (20) is positioned further away from the current sensor module than the active discharge resistor.

18. The electromechanical motor device according to claim 14 or 15, wherein the current sensor module is located in the region between the resistor connectors in the plan view.

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