Resin transfer device, injection molding system, and resin transfer method

Abstract

To discharge purged resin efficiently and reliably.SOLUTION: A resin transfer device 200 comprises a transfer section 202 extending horizontally, a frame 203 that is positioned on the transfer section 202 and can contain the dropped resin, and a frame drive section 208 that moves the frame 203 horizontally.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a resin conveying device, a chute, an injection molding system, and a resin conveying technique, and more particularly to a technique that is effective when applied to a resin conveying device, a chute, an injection molding system, and a resin conveying technique for discharging purged resin from a nozzle provided in an injection molding machine, for example. [Background technology]

[0002] Japanese Utility Model Publication No. 63-23010 (Patent Document 1) describes a technology that promotes cooling of resin by circulating cooling water in a resin receiver, and discharges resin by using an inclined resin receiver and blowing air. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Utility Model Application Publication No. 63-23010 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, molded products are manufactured through a molding cycle in which an injection molding machine operates continuously. However, the molding cycle may be interrupted, and in this case, molten resin remains inside the injection molding machine. In this case, the remaining resin may deteriorate due to heat, etc., making it difficult to restart the molding cycle with the resin remaining.

[0005] Furthermore, when attempting to manufacture a new molded product using a resin that is different in material, color, properties, etc. from the resin that has been used up until now, if the resin that has been used up until now remains inside the injection molding machine, it becomes difficult to manufacture a molded product using the new resin.

[0006] Therefore, in the above-described case, prior to the molding cycle, a purge process is performed to discharge the old resin remaining inside the injection molding machine. In this purge process, the resin material is discharged from a nozzle provided in the injection molding machine. The resin purged from the nozzle then hits, for example, a purge shutter arranged opposite the nozzle, falls vertically downward, and is collected in a resin receiver. The resin collected in the resin receiver is then removed.

[0007] In this regard, since the resin accumulated in the resin receiver has been removed manually, for example, an effective technique for efficiently removing the resin is desired, i.e., a method for removing the purged resin is desired. [Means for solving the problem]

[0008] In one embodiment, the resin conveying device includes a conveying section extending horizontally, a frame body arranged on the conveying section and capable of containing dropped resin, and a frame body drive section that moves the frame body horizontally.

[0009] In one embodiment, the chute has a seesaw mechanism, where the chute is configured to accumulate the resin discharged from the discharge port in a storage unit attached to the seesaw mechanism, and move the resin to the dust box by the seesaw motion of the seesaw mechanism caused by the weight of the resin accumulated in the storage unit.

[0010] The injection molding system according to one embodiment includes an injection molding machine that produces a molded product by injecting resin from a nozzle into a mold, and a resin transport device that transports purged resin purged from the nozzle. Here, the resin transport device has the above-described configuration.

[0011] The resin removal method in one embodiment includes a step of containing the resin that has fallen by purging in a frame, and a step of horizontally moving the frame containing the resin to a discharge port. [Effects of the Invention]

[0012] According to one embodiment, the purged resin can be efficiently and reliably discharged. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a diagram illustrating an example of the configuration of an injection molding machine. [Figure 2] FIG. 2 is a diagram illustrating the operation of the injection molding machine. [Figure 3] 3 is a diagram illustrating the operation of the injection molding machine following FIG. 2. FIG. [Figure 4] 4 is a diagram illustrating the operation of the injection molding machine following FIG. 3. FIG. [Figure 5] 5 is a diagram illustrating the operation of the injection molding machine following FIG. 4. FIG. [Figure 6] 6 is a diagram illustrating the operation of the injection molding machine following FIG. 5. [Figure 7] 7 is a diagram illustrating the operation of the injection molding machine following FIG. 6. FIG. [Figure 8] FIG. 1 is a diagram illustrating a related art. [Figure 9] FIG. 1 is a block diagram illustrating an example of the configuration of an injection molding system. [Figure 10] FIG. 10 is a block diagram showing another example of the configuration of the injection molding system. [Figure 11] FIG. 2 is a diagram showing a schematic configuration of a resin conveying device. [Figure 12] FIG. 2 is a diagram showing the configuration of a purge shutter. [Figure 13] FIG. 2 is a diagram illustrating a configuration of a transport unit. [Figure 14] 10A and 10B are diagrams illustrating the operation of the resin transport device. [Figure 15] 15 is a diagram illustrating the operation of the resin conveying device following FIG. 14. FIG. [Figure 16] 16 is a diagram illustrating the operation of the resin conveying device following FIG. 15. FIG. [Figure 17] 17 is a diagram illustrating the operation of the resin conveying device following FIG. 16. FIG. [Figure 18] FIG. 2 is a diagram showing a schematic configuration of a shooter. [Figure 19]10A and 10B are diagrams illustrating the operation of a shooter. [Figure 20] 10A and 10B are diagrams illustrating the operation of a shooter. [Figure 21] FIG. 2 is a plan view showing the configuration of a resin removal plate. [Figure 22] FIG. 2 is a diagram showing a schematic configuration of a resin cutting unit. [Figure 23] 10 is a flowchart illustrating the operation of the resin cutting unit. [Figure 24] 10A and 10B are diagrams illustrating a resin cutting operation. [Figure 25] 25 is a view illustrating the resin cutting operation following FIG. 24. [Figure 26] 26 is a view illustrating the resin cutting operation following FIG. 25. [Figure 27] 27 is a view illustrating the resin cutting operation following FIG. 26. [Figure 28] 28 is a view illustrating the resin cutting operation following FIG. 27. [Figure 29] 29 is a view illustrating the resin cutting operation following FIG. 28. [Figure 30] FIG. 30 is a diagram illustrating an alternative operation to that shown in FIG. 29. DETAILED DESCRIPTION OF THE INVENTION

[0014] In all the drawings for explaining the embodiments, the same components are generally designated by the same reference numerals, and repeated explanations thereof will be omitted. In addition, hatching may be used even in plan views to make the drawings easier to understand.

[0015] <Configuration of injection molding machine> FIG. 1 is a diagram showing an example of the configuration of an injection molding machine 100. As shown in FIG.

[0016] In FIG. 1, an injection molding machine 100 is made up of a mold clamping unit 1 and an injection unit 2.

[0017] <<Configuration of the mold clamping unit>> The mold clamping unit 1 has a movable platen 10 and a fixed platen 11, and is configured so that the distance between the movable platen 10 and the fixed platen 11 can be variably controlled. A movable die (mold) 12 and a fixed die (mold) 13 can be disposed between the movable platen 10 and the fixed platen 11. As a result, for example, by variably controlling the distance between the movable platen 10 and the fixed platen 11 using the mold clamping unit 1, the distance between the movable die 12 and the fixed die 13 can be shortened to perform "mold closing," and the distance between the movable die 12 and the fixed die 13 can be increased to perform "mold opening." At this time, when the movable die 12 and the fixed die 13 are "mold closed," an airtight space is formed between the movable die 12 and the fixed die 13, and a molded product is formed by pouring resin into this airtight space. In particular, in the injection molding machine 100 shown in Fig. 1, when the movable mold 12 and the fixed mold 13 are "closed," a sealed space is formed, and a molded product is formed by pouring resin into this sealed space. In this way, the mold clamping device 1 is configured.

[0018] <<Configuration of the injection unit>> Next, as shown in Figure 1, an injection device 2 that extrudes resin is connected to the fixed platen 11, and the resin extruded from the injection device 2 flows through the fixed platen 11 into an airtight space formed by "mold closing" between the movable mold 12 and the fixed mold 13.

[0019] The injection device 2 has a hopper 21 for receiving the resin raw material, and a cylinder 22. When the resin raw material is received in the hopper 21, the resin raw material is kneaded by a rotatable screw 23 disposed inside the cylinder 22. At this time, a heater 24 is disposed around the cylinder 22, and the resin raw material received inside the cylinder 22 is heated by the heater 24 while being kneaded by the screw 23 to become molten resin 25. A nozzle 26 is provided at the tip of the cylinder 22. The injection device 2 is configured in this manner.

[0020] <Operation of injection molding machine> Next, the operation of the injection molding machine 100 will be described.

[0021] First, the movable platen 10 of the mold clamping unit 1 is moved from the state shown in Fig. 1 to the state shown in Fig. 2. This brings the movable mold 12 into contact with the fixed mold 13, thereby "closing the mold." At this time, a large force is applied from the movable platen 10 in the direction of the arrow in Fig. 2 so that no gap is formed between the movable mold 12 and the fixed mold 13. Meanwhile, in the injection unit 2, the state shown in Fig. 1 is maintained, and the molten resin 25 is between the nozzle 26 and the screw 23. In other words, the molten resin 25 is not injected into the sealed space 30 between the movable mold 12 and the fixed mold 13.

[0022] Next, as shown in Figure 3, from the state shown in Figure 2, the screw 23 is moved leftward, i.e., in the forward direction, with a large force applied. At this time, the screw 23 is not rotated. As a result, molten resin 25 is injected from the tip of the nozzle 26 into the sealed space 30 between the movable mold 12 and the fixed mold 13. In the technical field of injection molding, the injection of molten resin 25 into the sealed space 30 is called "injection." Furthermore, the sealed space 30 between the movable mold 12 and the fixed mold 13 is sometimes called the "cavity."

[0023] Thereafter, as shown in FIG. 4, after the molten resin 25 is injected, the screw 23 maintains a state in which it applies pressure to the sealed space 30. This state is called a "pressure-holding state," and the movable mold 12 and the fixed mold 13 are cooled while maintaining this pressure-holding state. Then, as shown in FIG. 4, the resin raw material 40 is filled into the hopper 21. Here, when the movable mold 12 and the fixed mold 13 are cooled, the screw 23 is rotated to fill the space between the nozzle 26 and the screw 23 with molten resin 25 for the next injection. Specifically, when the screw 23 is rotated, the resin raw material 40 supplied from the hopper 21 is melted in the cylinder 22 of the injection device 2 and moves forward.

[0024] As a result, as shown in Figure 5, molten resin 25 accumulates between the nozzle 26 and the cylinder 22. Then, as a reaction to this, the screw 23 is pushed backward, returning to the state before injection. At this time, the process of moving the screw 23 backward while sending the molten resin 25 forward so that the molten resin 25 can be injected is called "metering." A heater 24 for heating the cylinder 22 is arranged around the cylinder 22. The heater 24 is arranged so as to surround the periphery of the cylinder 22, and the resin raw material 40 supplied from the hopper 21 is heated and melted into molten resin 25 by the heat from the heater 24 and shear heat generated by the rotation of the screw 23.

[0025] Next, the movable mold 12 and the fixed mold 13 are cooled to a temperature below the solidification temperature of the molten resin 25 filled in the sealed space 30. Thereafter, as shown in FIG. 6, the mold clamping device 1 is operated to "open" the movable mold 12 and the fixed mold 13. When the movable mold 12 and the fixed mold 13 are "opened" in this manner, the molded article 50 is peeled off from the fixed mold 13 and ejected from the movable mold 12. This molded article 50 becomes the product molded by the injection molding machine 100.

[0026] Next, as shown in Figure 7, molded article 50 is removed from movable mold 12. By repeating this series of steps (Figures 2 to 7), molded articles 50 of the same shape can be continuously manufactured. It can be seen that by repeatedly operating injection molding machine 100 in this manner, molded articles 50 can be mass-produced.

[0027] <Necessity of purging> As described above, the molded product 50 is produced through a molding cycle in which the injection molding machine 100 is continuously operated. However, the operation of the injection molding machine 100 may be stopped and the molding cycle interrupted for cleaning the injection molding machine 100, replacing the resin, replacing the molds (movable mold 12 and fixed mold 13) attached to the mold clamping device 1, etc. In this case, molten resin remains inside the injection molding machine 100. At this time, since the remaining resin may deteriorate due to heat or the like, it is difficult to resume the molding cycle with the resin remaining. Furthermore, when attempting to produce a new molded product 50 using a resin of a different material, color, properties, etc. from the resin previously used, it becomes difficult to produce the molded product 50 using the new resin if the resin previously used remains inside the injection molding machine 100.

[0028] Therefore, prior to the molding cycle, it is necessary to perform a process to discharge the old resin remaining inside the injection molding machine 100. This process is called "purging." In this purging, the screw 23 is rotationally driven to discharge the resin from the nozzle 26 provided in the injection molding machine 100. The resin purged from the nozzle 26 may, for example, hit a purge shutter arranged opposite the nozzle 26, fall vertically downward, and accumulate in a resin receiver. Thereafter, the resin accumulated in the resin receiver must be removed.

[0029] <Description of Related Art> 8, for example, resin 30a purged from nozzle 26 hits purge shutter 31 disposed opposite nozzle 26 and falls vertically downward. As a result, resin 30a accumulates in resin receiving portion 32 disposed below purge shutter 31. Then, as shown in FIG. 8, resin 30a accumulated in resin receiving portion 32 is manually removed after the cooling period of resin 30a has elapsed and hardened.

[0030] In this case, since the cooling period of the resin 30a is long, the resin 30a that has fallen cannot be removed immediately, and the resin 30a continues to accumulate in the resin receiving portion 32. Furthermore, since the resin 30a is removed manually, the burden on the worker is heavy.

[0031] In this regard, as a technique for removing the resin 30a without manual work, there is, for example, a technique related to Patent Document 1 described in the "Background Art" section.

[0032] This patent document describes a technique in which cooling water is circulated in a resin receiving section to promote cooling of the resin, and the resin is removed by using an inclined resin receiving section and air blowing. This technique allows the resin 30a to be discharged without manual labor.

[0033] However, the tilted resin receiving section and air blowing used in this technology may not reliably discharge the resin. This is because the driving force of the resin in this technology is weak, resulting from the air blowing force and the weight of the resin itself placed in the tilted resin receiving section. This may make it difficult to discharge the resin against the large frictional force caused by the resin sticking to the resin receiving section. In other words, the technology described in Patent Document 1 has room for improvement in terms of reliably discharging the resin.

[0034] Therefore, in this embodiment, an effort is made to overcome the room for improvement that exists in the technology described in Patent Document 1. The technical idea of this embodiment that incorporates this effort will be described below.

[0035] <Basic Concept of the Embodiment> The basic concept of this embodiment is to drop purged resin from a nozzle of an injection molding machine onto a horizontal surface, and then apply an external force to the solidified resin to transport the resin horizontally to a discharge port. A more desirable basic concept is to drop purged resin from a nozzle of an injection molding machine onto a horizontal surface, cool the resin while it is placed on the horizontal surface, and then apply an external force to the solidified resin to transport the resin horizontally to a discharge port. In other words, the basic concept of "cooling the resin while it is placed on a horizontal surface" is not essential, but it is desirable to include this configuration from the perspective of efficiently and reliably discharging the resin. This desirable concept is described below.

[0036] The features of the above-mentioned desirable concept are (1) that the resin is cooled while placed on a horizontal surface, and (2) that the solidified resin is conveyed by applying an external force. This allows the resin to be discharged efficiently and reliably according to the basic concept.

[0037] This point will be explained below.

[0038] First, we will explain the technical significance of the configuration in which "the resin is cooled while placed on a horizontal surface." For example, in a configuration in which the resin is dropped onto an inclined slope and then cooled on the slope, as in Patent Document 1, the resin is placed on the slope in a molten, highly viscous state, and is therefore likely to adhere to the slope due to its own weight. That is, even if the resin is rapidly cooled on the slope, it adheres to the slope while deforming in a highly viscous state, and therefore the resin is likely to adhere to the slope due to its high viscosity. In particular, when the resin adheres to the slope while deforming in a highly viscous state, this means that the contact area between the resin and the slope increases. Therefore, the synergistic factors of the resin's high viscosity and the increased contact area with the slope make the resin more likely to adhere to the slope. Furthermore, once the resin adheres to the slope, it remains on the slope, making it difficult to remove.

[0039] In contrast, in a configuration in which the resin is cooled while placed on a horizontal surface, the resin viscosity is less likely to affect the cooling performance. In other words, in a configuration in which the resin is cooled while placed on a horizontal surface, the resin can be cooled without being affected by the resin viscosity. In other words, in a configuration in which the resin is cooled while placed on a horizontal surface, the resin is less likely to deform when cooled, which makes it less likely for the contact area between the resin and the horizontal surface to increase. Considering that the larger the contact area, the more likely the resin is to stick, this means that the sticking of the resin is suppressed. Therefore, the technical significance of the configuration in which the resin is cooled while placed on a horizontal surface is to make it less likely for the resin to stick to the contact surface.

[0040] Next, the technical significance of the configuration of "applying an external force to solidified resin to transport it" will be explained. For example, the technology described in Patent Document 1 is configured to discharge resin by sliding it down an inclined surface mainly by the weight of the resin and the blowing of air. However, the weight of the resin and the blowing of air are weak forces, and the resin slides by its own weight from a molten, highly viscous state before solidification. In other words, the technology described in Patent Document 1 employs a configuration in which the resin slides by its own weight and the blowing of air, which are weak forces, from a molten, highly viscous state before solidification. In this case, discharging the resin becomes difficult because the resin slides from a non-slip state before solidification (a molten, highly viscous state before solidification).

[0041] In contrast, the basic concept of this embodiment is to "cool the resin while it is placed on a horizontal surface" to solidify the resin, and then "apply an external force to the solidified resin to transport it." That is, the basic concept is to not transport the resin in a soft, molten state, but to transport it after it has solidified. Furthermore, a configuration is also adopted in which the resin is transported horizontally by applying an external force to the resin that is stronger than the weak force of its own weight or air blowing. As a result, even if the resin adheres to a horizontal surface, the application of a strong external force, rather than the weak force of its own weight or air blowing, makes it easy to remove the resin from the horizontal surface and transport it. In other words, the technical significance of the configuration of "applying an external force to the solidified resin to transport it" is to reliably discharge the resin.

[0042] As described above, according to the basic concept of this embodiment, the resin can be reliably discharged. Furthermore, by embodying this basic concept as an automated system, it is possible to realize a system that can replace inefficient manual work.

[0043] The following describes an injection molding system that embodies the basic concept of this embodiment, is highly efficient, and is capable of reliably discharging purged resin.

[0044] <Injection molding system configuration> FIG. 9 is a block diagram showing an example of the configuration of an injection molding system 500.

[0045] 9, an injection molding system 500 includes an injection molding machine 100 and a resin conveying device 200. The injection molding machine 100 is equipped with a control unit 110. The control unit 110 is configured to control not only the operation of the injection molding machine 100 but also the operation of the resin conveying device 200. This provides the advantage that the control unit 110 can control the overall operation of the injection molding system 500 including the injection molding machine 100 and the resin conveying device 200.

[0046] However, the configuration of the injection molding system 500 is not limited to the configuration example shown in FIG. 9, but can also be realized by, for example, the configuration example shown in FIG. 10 below.

[0047] FIG. 10 is a block diagram showing another example of the configuration of the injection molding system 500.

[0048] 10, the injection molding machine 100 may be provided with a control unit 110, and the resin conveying device 200 may be provided with a control unit 210. In this case, the control unit 110 is configured to control the operation of the injection molding machine 100, while the control unit 210 is configured to control the operation of the resin conveying device 200. In this way, the injection molding machine 100 and the resin conveying device 200 may each be configured to be provided with a control unit.

[0049] The technical idea of this embodiment can be realized, for example, by an injection molding system 500 shown in FIG. 9, or by an injection molding system 500 shown in FIG.

[0050] <Configuration of resin transport device> Next, the configuration of the resin transport device 200 will be described.

[0051] FIG. 11 is a diagram showing a schematic configuration of the resin conveying device 200. As shown in FIG.

[0052] 11, resin conveying device 200 is configured to convey resin purged from nozzle 26 provided in an injection molding machine, and includes, for example, purge shutter 201, conveying section 202, frame 203, and chute 207. Specifically, resin conveying device 200 is configured to receive resin that hits purge shutter 201 arranged opposite nozzle 26 and falls in the vertical direction, using frame 203, and convey the resin to a predetermined position.

[0053] The purge shutter 201 is disposed opposite the nozzle 26 when purging is performed, and has the function of receiving the resin purged from the nozzle 26 and causing the resin to fall vertically downward (in the -z direction). For example, as shown in FIG. 12, the purge shutter 201 preferably has a rectangular shape in the zy plane (the surface facing the nozzle 26) and includes a cooling mechanism for circulating cooling water inside. Thus, when the resin purged from the nozzle 26 hits the surface of the purge shutter 201, the resin is cooled by the cooling mechanism provided in the purge shutter 201 and then falls vertically downward (in the -z direction). The surface of the purge shutter 201 may be coated to prevent the resin from sticking to the surface of the purge shutter 201. For example, the coating may be a fluororesin coating or a vinyl coating.

[0054] 11 and 13, the transfer unit 202 extends in the horizontal direction (x direction) and is configured to include a cooling mechanism 205 that cools at least a first region R1 that includes a position where the resin falls. The transfer unit 202 is provided with an outlet 206 for discharging the resin. Here, for example, the surface of the first region R1 may be coated to prevent the fallen resin from sticking thereto. Examples of the coating include a fluororesin coating and a vinyl coating.

[0055] Next, as shown in Fig. 11, a frame 203 is disposed on the conveying section 202. This frame 203 is configured to be able to contain the dropped resin. This frame 203 is configured to be able to move in the horizontal direction (x direction). That is, the frame 203 is configured to be able to move in the horizontal direction (x direction) by a frame driving section 208. For example, the frame 203 is configured to be able to move by the frame driving section 208 from a first position of the conveying section 202, where the frame 203 is disposed to contain the dropped resin, to a second position of the conveying section 202 while still containing the resin.

[0056] Specifically, the frame 203 has a through-hole 203a that contains the resin that has fallen into the conveying section 202, and a protruding section (claw section) 204 that protrudes from the inner wall of the through-hole 203a. The protruding section 204 has the function of peeling off the resin that has fallen into the conveying section 202 from the surface of the conveying section 202 when the frame 203 starts to move.

[0057] 11, the frame body 203 is provided with a detection sensor 220 for detecting the position at which the frame body 203 is placed. The resin conveying device 200 is configured to control the movement of the frame body 203 based on the output from the detection sensor 220.

[0058] As described above, the conveying section 202 is provided with the discharge port 206 that drops the resin below the conveying section 202 when the frame 203 containing the resin is placed in the second position. As shown in FIG. 11 , the resin conveying device 200 has a chute 207 that is placed opposite the discharge port 206. This chute 207 has the function of guiding the resin discharged from the discharge port 206 to a dust box (not shown). However, the chute 207 is not necessarily required, and for example, the resin discharged from the discharge port 206 can be configured to be placed directly into the dust box.

[0059] The resin conveying device 200 may be provided with a sensor 230 that detects that the resin has been discharged from the discharge port 206. For example, while Fig. 11 shows a configuration example in which the sensor 230 is provided in the chute 207, the present invention is not limited to this, and a configuration in which the sensor 230 is provided in the conveying section 202 may also be adopted.

[0060] The resin conveying device 200 in this embodiment is configured as described above.

[0061] <Operation of resin transport device> Next, the operation of the resin transport device 200 will be described.

[0062] First, as shown in Fig. 14, when resin 250 is purged from a nozzle 26 provided in an injection molding machine, the resin 250 purged from the nozzle 26 hits a purge shutter 201 disposed opposite the nozzle 26. At this time, for example, if a cooling mechanism that circulates cooling water is provided inside the purge shutter 201 as shown in Fig. 12, the resin 250 that hits the purge shutter 201 is cooled. As a result, the purged resin 250 is prevented from sticking to the purge shutter 201. Furthermore, if a coating for preventing the resin 250 from sticking is applied to the surface of the purge shutter 201, the purged resin 250 is even less likely to stick to the purge shutter 201.

[0063] 15, the resin 250 that hits the purge shutter 201 falls vertically downward (-z direction) and enters the inside of the through-hole 203a of the frame 203 arranged on the conveying section 202. That is, in the resin conveying device 200, the frame 203 is placed in advance at the first position of the conveying section 202 based on the output of the detection sensor 220. As a result, the fallen resin 250 is contained in the frame 203 that is placed at the first position of the conveying section 202.

[0064] Thereafter, resin 250 contained in frame 203 is cooled and solidified by cooling mechanism 205 provided in conveying section 202. In particular, in this embodiment, resin 250 arranged on the horizontal surface of conveying section 202 is cooled, so that dropped resin 250 is less likely to stick to the surface of conveying section 202. Furthermore, if a coating for preventing adhesion of resin 250 is applied to the surface of conveying section 202, dropped resin 250 can be less likely to stick to the surface of conveying section 202.

[0065] Next, as shown in FIG. 16 , the frame 203 containing the resin 250 is moved horizontally (in the x direction) from the first position to the second position by the frame driving unit 208. That is, by applying a strong external force to the frame 203 containing the resin 250, the frame 203 moves horizontally. At this time, if the inner wall of the through-hole 203a of the frame 203 is provided with a protrusion (claw) 204, even if the resin 250 remains attached to the surface of the conveying unit 202 after being cooled by the cooling mechanism 205, the resin 250 that has fallen onto the conveying unit 202 is peeled off from the surface of the conveying unit 202 by the protrusion 204 when the frame 203 starts to move. That is, the protrusion 204 has the function of peeling off the resin that has fallen onto the conveying unit 202 from the surface of the conveying unit 202. In this way, according to this embodiment, it is possible to reliably prevent the resin 250 from sticking.

[0066] Then, as shown in FIG. 17, when the frame body 203 containing the resin 250 approaches the second position, the resin conveying device 200 decelerates the speed of the frame body 203 and stops the frame body 203 at the second position based on the output from the detection sensor 220.

[0067] At this time, when the frame body 203 is in the second position, the resin 250 contained in the frame body 203 falls from the discharge port 206 provided in the conveying section 202 into the chute 207 provided below the conveying section 202. The resin 250 that has fallen into the chute 207 is discharged from the chute 207 into a dust box (not shown), for example.

[0068] In this embodiment, for example, a sensor 230 is attached to the chute 207 to detect that the resin 250 has been discharged from the discharge port 206. As a result, the resin conveying device 200 can determine whether or not the resin 250 has been discharged from the discharge port 206 based on the output from the sensor 230. When the resin conveying device 200 recognizes that the resin 250 has been discharged from the discharge port 206, it controls the frame driving unit 208 to move the frame 203 from the second position to the first position.

[0069] In this manner, by operating the resin conveying device 200 in this embodiment, the purged resin 250 can be disposed of in a dust box.

[0070] <Features of the embodiment> Next, the features of this embodiment will be described.

[0071] <<Features of the purge shutter>> First, a feature of the purge shutter 201 is that it is provided with a cooling mechanism, as shown in Fig. 12, for example. As a result, when resin purged from a nozzle provided in an injection molding machine hits the purge shutter 201, the resin is cooled by the cooling mechanism provided in the purge shutter 201. As a result, it is possible to prevent the purged resin from sticking to the purge shutter 201.

[0072] Furthermore, another feature of the purge shutter 201 is that a coating is applied to the surface of the purge shutter 201 that faces the nozzle to prevent the resin from sticking to the surface of the purge shutter 201. This makes it possible to further prevent the resin from sticking to the surface of the purge shutter 201. In other words, by combining the provision of a cooling mechanism in the purge shutter 201 and the application of a coating to the surface of the purge shutter 201, it is possible to effectively prevent the resin from sticking to the purge shutter 201.

[0073] <<Frame Features>> As explained in "Basic Concept of the Embodiment," one of the features of the basic concept is that solidified resin is conveyed by applying an external force to it. In this embodiment, applying an external force to solidified resin to convey it is achieved by using frame 203.

[0074] That is, as shown in Figures 14 to 17, when resin 250 is contained inside frame body 203, frame body driving unit 208 moves frame body 203 horizontally, and an external force is applied from frame body 203 to the solidified resin, causing it to be transported together with frame body 203.

[0075] As a result, one of the features of the basic concept, "transporting solidified resin by applying an external force," is realized by using the frame 203. In this way, the feature of this embodiment is that the frame 203 is used to transport solidified resin by applying an external force to it.

[0076] Furthermore, the technical significance of using the frame 203 is that it not only embodies one of the key features of the basic concept, "transporting solidified resin by applying an external force to the solidified resin," but also facilitates another key feature of the basic concept, "cooling the resin while it is placed on a horizontal surface." That is, the frame 203 in this embodiment has a through-hole 203a, as shown in FIG. 15 , for example, and the resin 250 is placed inside the through-hole 203a. Since the through-hole 203a literally has no bottom, the resin 250 placed inside the through-hole 203a is placed on the transport unit 202 exposed through the through-hole 203a. Therefore, by using the frame 203 having the through-hole 203a, it is possible to place the resin 250 on the cooling mechanism 205 provided in the transport unit 202 while containing the resin 250 inside the frame 203. In this way, it can be seen that the frame body 203 having the through portion 203a has the technical significance of realizing the configuration of "applying an external force to the solidified resin to transport it" while also making it easier to realize the configuration of "cooling the resin while it is placed on a horizontal surface."

[0077] Next, a feature of the frame 203 is that, for example, as shown in Fig. 11, a protrusion 204 is provided so as to protrude from the inner wall of a through-hole 203a formed in the frame 203. As a result, for example, as shown in Figs. 15 and 16, even if resin 250 sticks to the surface of the conveying section 202, the protrusion 204 can peel off the resin 250 that has fallen onto the conveying section 202 from the surface of the conveying section 202 when the frame 203 starts to move. In other words, the protrusion 204 has the function of peeling off the resin that has fallen onto the conveying section 202 from the surface of the conveying section 202. In this way, according to this embodiment, it is possible to reliably prevent the resin 250 from sticking.

[0078] <<Characteristics of the conveying unit>> Next, a characteristic feature of the transport unit 202 is that, for example, as shown in FIG. 11 , the transport unit 202 is configured to include a cooling mechanism 205 that cools at least a first region R1 that includes a position where the resin falls. This embodies one of the characteristics of the basic concept, that is, "cooling the resin while it is placed on a horizontal surface." In particular, in this embodiment, while adopting a configuration in which the frame 203 having the through-holes 203 a is placed in the first region R1, the transport unit 202 includes the cooling mechanism 205 that cools the first region R1, thereby simultaneously embodying two characteristics of the basic concept, that is, "cooling the resin while it is placed on a horizontal surface" and "transporting the solidified resin by applying an external force to it."

[0079] Here, in this embodiment, there is a great advantage in that the cooling mechanism 205 need only be provided in the first region R1 including the resin drop position, rather than in the entire transfer section 202.

[0080] For example, Patent Document 1, which is listed in the "Background Art" section, employs a configuration in which molten resin is cooled by sliding it along a slope. For this reason, Patent Document 1 requires a cooling mechanism to be provided on the entire slope. This is because if the cooling mechanism is provided only in a partial area of the slope, the resin will not be able to be cooled if it moves outside the area where the cooling mechanism is provided. In this way, a configuration in which a cooling mechanism is provided on the entire slope has the disadvantage of increasing the size of the cooling mechanism.

[0081] In contrast, this embodiment employs a configuration in which the resin is placed on a horizontal surface rather than an inclined surface and cooled. In this case, it is not necessary to cool the resin by sliding it as in an inclined surface. That is, even if a cooling mechanism is provided only in a localized region including the resin drop position, the resin does not move under its own weight as in an inclined surface, but remains in the drop position, allowing the resin to be cooled until solidified. Thus, according to this embodiment, in order to sufficiently cool the dropped resin until solidification, it is sufficient to provide the cooling mechanism 205 only in the first region R1 including the drop position of the resin, rather than the entire transport section 202. Therefore, this embodiment has the advantage of being able to reduce the size of the cooling mechanism provided in the transport section 202.

[0082] <<Other features>> 11, there are provided a detection sensor 220 for detecting the position of the frame body 203 and a sensor 230 for detecting that the resin 250 has been discharged from the discharge port 206. This makes it possible to accurately grasp the position of the frame body 203 and to reliably grasp that the resin 250 has been discharged from the discharge port 206. On the other hand, this feature makes it possible to detect an abnormal position of the frame body 203 or an abnormal discharge of the resin 250, thereby preventing malfunction of the resin conveying device 200.

[0083] <Need for ingenuity in shooters> As described above, according to the resin conveying device 200 of this embodiment, the resin 250 can be efficiently and reliably discharged from the discharge port 206. The resin 250 discharged from the discharge port 206 is then disposed of, for example, in a dust box via a chute attached as part of the resin conveying device 200. Therefore, in order to reliably dispose of the resin 250 in the dust box, it is important to make it easy for the resin 250 to drop from the chute into the dust box. Therefore, the present inventor has also devised a chute from the perspective of making it easier to discharge the resin 250. The chute with this devise will be described below.

[0084] <Shooter configuration> FIG. 18 is a diagram showing a schematic configuration of the chute 400. As shown in FIG.

[0085] In FIG. 18, chute 400 is disposed opposite discharge port 206 provided in conveying section 202 that conveys resin purged from a nozzle provided in an injection molding machine, for example.

[0086] In particular, as shown in FIG. 18, the chute 400 is attached to the conveying section 202 so as to be positioned opposite the discharge port 206 .

[0087] The chute 400 comprises a base portion 401, a support 402 attached to the base portion 401, a seesaw mechanism 404 attached to the support 402 at a center 403, a counterbalance 405 provided at one end of the seesaw mechanism 404, an extension portion 406 connecting the other end of the seesaw mechanism 404 to the conveying portion 202, and a storage portion 407 provided on the seesaw mechanism 404 so as to be positioned opposite the discharge outlet 206 and capable of storing resin discharged from the discharge outlet 206.

[0088] Although not shown in FIG. 18 , two support columns 402 are attached to the base 401 and arranged side by side in the y direction. The seesaw mechanism 404 is configured to perform seesaw motion using a center 403 as a fulcrum by balancing the weight of a counterbalance 405 provided to the left of the center 403 and a storage unit 407 provided to the right of the center 403. For example, when no resin is stored in the storage unit 407, the counterbalance 405 is heavier, causing the seesaw mechanism 404 to tilt to the left. On the other hand, when a large amount of resin is stored in the storage unit 407, the storage unit 407 containing the resin becomes heavier, causing the seesaw mechanism 404 to tilt to the right. In this way, the seesaw mechanism 404 is configured to perform seesaw motion due to the weight of the resin discharged from the discharge port 206 and stored in the storage unit 407.

[0089] The expansion / contraction section 406 is made up of, for example, a spring, but is not limited to this and can also be made up of a link mechanism or a damper.

[0090] The shooter 400 is configured as described above.

[0091] <Shooter movement> Next, the operation of the shooter 400 will be described.

[0092] First, when no resin is stored in the storage section 407 of the chute 400, the chute 400 is in the state shown in FIG. 18 . Next, when resin falls into the storage section 407 from the discharge port 206, the chute 400 transitions from the state shown in FIG. 18 to the state shown in FIG. 19 . That is, as a result of resin being stored in the storage section 407, the mass of the storage section 407 increases. As a result, as shown in FIG. 19 , the seesaw mechanism 404 tilts to the right with the center 403 as a fulcrum. This causes the extension section 406 to extend to its limit. Thereafter, when more resin is stored in the storage section 407, the chute 400 transitions from the state shown in FIG. 19 to the state shown in FIG. 20 . That is, the center 403 slides upward (in the +z direction), and the tilt angle of the seesaw mechanism 404 increases. As a result, the resin stored in the storage section 407 is discharged from the storage section 407 by its own weight and discarded in a dustbin. This is how the chute 400 operates. A feature of this chute 400 is that the tilt angle of the seesaw mechanism 404 can be adjusted in multiple stages, which has the advantage of making it easier to discharge the resin from the chute 400 into the dust box.

[0093] <Application example> An application example using the resin conveying device 200 according to this embodiment will be described below.

[0094] For example, when purging is performed, resin may drip out and remain at the tip of the nozzle 26. In this state, it is difficult to manufacture a new molded product, so the resin dripping out from the tip of the nozzle 26 must be removed.

[0095] Therefore, in this application example, a resin conveying device 200 will be described that has a function of removing resin dripping from the tip of the nozzle 26. For example, the resin conveying device 200 has a resin cutting unit that cuts the resin purged from the nozzle 26, and the resin cutting unit includes a resin removal plate that has an opening that can come into contact with the tip of the nozzle 26, and a drive unit that moves the resin removal plate.

[0096] <<Configuration of resin removal plate>> FIG. 21 is a plan view showing the configuration of the resin removal plate 600 in this application example.

[0097] 21, resin removal plate 600 has a rectangular shape and is provided with an opening 610 inside. Resin removal plate 600 configured in this manner has the function of cutting off resin that has dripped from the tip of the nozzle by purging. Opening 610 provided in resin removal plate 600 is configured so that the tip of the nozzle can come into contact with it.

[0098] <<Configuration of resin cutting unit>> Next, a resin cutting section 700 that uses the above-described resin removing plate 600 to cut the resin purged from a nozzle provided in an injection molding machine will be described.

[0099] FIG. 22 is a diagram showing a schematic configuration of the resin cutting unit 700. As shown in FIG.

[0100] 22, the resin cutting unit 700 has a resin removal plate 600 provided with an opening 610 that can be contacted by the tip of the nozzle, and a drive unit 710 for moving the resin removal plate 600. For example, as shown in Fig. 22, the drive unit 710 is made up of a motor, and the resin removal plate 600 is connected to this motor. As a result, the resin removal plate 600 is configured to be movable in the up and down direction (z direction) by the drive unit 710 made up of the motor.

[0101] <<Operation of resin cutting unit>> Next, the operation of the resin cutting unit 700 will be described.

[0102] FIG. 23 is a flowchart illustrating the operation of the resin cutting unit 700.

[0103] 23, first, after the molding cycle of the injection molding machine is interrupted, the nozzle in contact with the fixed platen is retracted (S101). Specifically, as shown in FIG. 24, the nozzle 26 is moved in the direction of the arrow. At this time, a resin removal plate 600 is disposed above the nozzle 26, and this resin removal plate 600 has an opening 610.

[0104] Next, in Fig. 23, the resin removal plate is lowered (S102). Specifically, as shown in Fig. 25, the resin removal plate 600 having an opening 610 is moved in the direction of the arrow.

[0105] Next, in Fig. 23, the tip of the nozzle is brought into contact with an opening provided in a resin removal plate (S103). Specifically, as shown in Fig. 26, by moving the nozzle 26 in the direction of the arrow, the tip of the nozzle 26 is brought into contact with an opening 610 provided in a resin removal plate 600 as shown in Fig. 27.

[0106] 23, purging is performed (S104). Specifically, as shown in FIG. 28, when purging is performed, resin 250 discharged by purging drips from the tip of nozzle 26. At this time, in this application example, since the tip of nozzle 26 is in contact with opening 610 provided in resin removal plate 600, resin 250 dripping from the tip of nozzle 26 is discharged to the outside through the inside of opening 610.

[0107] Next, in FIG. 23, the resin removal plate is raised (S105). Specifically, as shown in FIG. 29, the resin 250 dripping from the tip of the nozzle 26 is cut by moving the opening 610 upward. In other words, by moving the resin removal plate 200 in a direction parallel to the fixed platen, the resin 60 dripping from the tip of the nozzle 26 can be cut. As a result, according to this application example, the resin 250 dripping from the tip of the nozzle 26 can be reliably removed from the tip of the nozzle 26 by purging.

[0108] 29 shows a configuration example in which resin 250 dripping from the tip of nozzle 26 is cut by moving opening 610 upward. However, this application example is not limited to this, and for example, as shown in FIG. 30, resin 250 dripping from the tip of nozzle 26 may be cut by moving opening 610 in the horizontal direction (arrow direction).

[0109] In this manner, it is possible to remove the resin dripping from the tip of the nozzle 26. Thereafter, the cut resin 250 falls into the inside of the frame 203 provided in the resin conveying device 200 of this embodiment. Then, as described in the embodiment, the operation of the resin conveying device 200 shown in, for example, FIGS. 15 to 17 is performed.

[0110] The invention made by the inventor has been specifically described above based on the embodiments thereof, but it goes without saying that the present invention is not limited to the above-described embodiments and can be modified in various ways without departing from the spirit of the invention. [Explanation of symbols]

[0111] 1 Mold clamping device 2 Injection device 10 Movable plate 11 Fixed plate 12 Movable type 13 Fixed type 21 Hopper 22 cylinders 23 screw 24 Heater 25 Molten Resin 26 nozzles 30 Closed space 30a resin 31 Purge shutter 32 Resin receiving part 40 Resin raw materials 50 Molded products 100 injection molding machine 110 control section 200 Resin conveying device 201 Purge shutter 202 Conveyor 203 Frame 203a Penetration 204 Protrusion 205 Cooling mechanism 206 Outlet 207 Shooter 208 Frame drive unit 220 Detection sensor 230 Sensors 250 resin 400 Shooter 401 Base 402 Post 403 center 404 Seesaw mechanism 405 Counterbalance 406 Telescopic part 407 Storage section 500 Injection Molding System 600 Resin removal board 610 Opening 700 Resin cutting section 710 Drive unit

Claims

1. A resin conveying device that conveys resin purged from a nozzle provided in an injection molding machine, a conveying section extending horizontally; a frame that is placed on the conveying section and that can contain the dropped resin; a frame driving unit that moves the frame in the horizontal direction; and The resin conveying device, wherein the conveying section has a cooling mechanism that cools a first region including a position where the resin falls.

2. The resin conveying device according to claim 1, The resin conveying device is configured so that the resin, which hits a purge shutter arranged opposite the nozzle and falls in the vertical direction, is received by the frame body and conveyed to a predetermined position.

3. 3. The resin conveying device according to claim 2, The resin conveying device, wherein the purge shutter has a cooling mechanism that cools the surface of the purge shutter.

4. 3. The resin conveying device according to claim 2, The surface of the purge shutter is coated to prevent the resin from sticking to it.

5. The resin conveying device according to claim 1, A resin conveying device in which the frame body is configured to be movable by the frame body drive unit from a first position of the conveying unit arranged to contain the fallen resin to a second position of the conveying unit while containing the resin.

6. 6. The resin conveying device according to claim 5, The resin transport device has a detection sensor that detects the position where the frame is placed.

7. 6. The resin conveying device according to claim 5, The resin conveying device, wherein the conveying section is provided with a discharge outlet that drops the resin below the conveying section when the frame containing the resin is placed at the second position.

8. The resin conveying device according to claim 7, The resin transporting device has a chute arranged at a position opposite the discharge port.

9. The resin conveying device according to claim 1, A resin transport device, wherein a coating is applied to the surface of the first area to prevent the dropped resin from sticking to the surface.

10. The resin conveying device according to claim 1, the resin conveying device has a resin cutting unit that cuts the resin purged from the nozzle, The resin cutting portion is a resin removal plate having an opening that can come into contact with the tip of the nozzle; a drive unit for moving the resin removal plate; A resin conveying device comprising:

11. an injection molding machine that produces a molded product by injecting resin injected from a nozzle into a mold; a resin conveying device that conveys the purged resin purged from the nozzle; An injection molding system comprising: The resin conveying device is a conveying section extending horizontally; a frame that is placed on the conveying section and that can contain the dropped purged resin; a frame driving unit that moves the frame in the horizontal direction; and An injection molding system, wherein the conveying section has a cooling mechanism that cools a first region including a position where the resin falls.

12. A resin conveying method for conveying resin purged from a nozzle provided in an injection molding machine, comprising: (a) purging the resin from the nozzle; (b) containing the dropped resin in a frame disposed on a conveying section, and cooling the resin by a cooling mechanism provided on the conveying section; (c) moving the frame containing the resin in a horizontal direction to a discharge port; A resin conveying method comprising:

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