Polyamide resin composition and film obtained therefrom

Abstract

To provide a polyamide resin composition that enables appropriate resin pressure during molding of the polyamide resin composition and, when formed into a film, ensures superior puncture strength as well as superior pinhole resistance and impact strength.SOLUTION: A polyamide resin composition of the present invention comprises an aliphatic polyamide resin (A) and a metal salt (B) of a fatty acid having 6 to 24 carbon atoms. In 100 mass% of the polyamide resin composition, the content of the aliphatic polyamide resin (A) is 85.00 to 99.75 mass%, and the content of the metal salt (B) of the fatty acid having 6 to 24 carbon atoms is 0.25 to 1.00 mass%. The aliphatic polyamide resin (A) comprises, as a content ratio in 100 mass% of the polyamide resin composition, 70.00 to 95.00 mass% of an aliphatic homopolyamide resin (A1) having a relative viscosity of more than 3.50 and 4.50 or less, 3.00 to 15.00 mass% of an aliphatic homopolyamide resin (A2) having a relative viscosity of more than 2.80 and 3.50 or less, 1.00 to 5.00 mass% of an aliphatic homopolyamide resin (A3) having a relative viscosity of 2.00 or more and 2.80 or less, and 0 to 15.00 mass% of an aliphatic copolyamide resin (A4).SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a polyamide resin composition and a film obtained therefrom. [Background technology]

[0002] Polyamide resins have excellent mechanical strength, thermal properties, chemical properties and moldability, and are therefore widely used in a variety of parts in the automotive and electronic / electrical fields, as well as in films, fibers and monofilaments. Among these applications, polyamide resin films are widely used due to their excellent gas barrier properties and mechanical properties. Polyamide resin films are made from compositions containing polyamide resins as well as lubricants and other additives.

[0003] As a method for producing polyamide resins containing such additives, Patent Document 1 describes a method in which inorganic particles and a portion of a lubricant are prepared as a masterbatch and added to the polyamide resin. Patent Document 2 describes a specific method for producing a film from a polyamide resin composition using different masterbatches for different types of additives. Patent Document 3 describes a method in which a polyamide resin having a specific relative viscosity is used as the main component, and a masterbatch in which a lubricant is blended with a polyamide having a lower relative viscosity than the main component is mixed with the main component polyamide resin to obtain a film. Patent Document 4 describes a film made from a polyamide resin composition in which an antiblocking agent and a lubricant are added to a combination of polyamide resins having different relative viscosity ranges. Patent Document 5 discloses a metal stearate having a hydroxyl group as a lubricant to be added to a polyamide resin. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-131891 [Patent Document 2] Patent Publication No. 2021-88190 [Patent Document 3] Japanese Patent Application Laid-Open No. 2011-126937 [Patent Document 4] International Publication No. 2023 / 149547 [Patent Document 5] Japanese Unexamined Patent Publication No. 62-119267 Summary of the Invention [Problem to be solved by the invention]

[0005] Polyamide resin films are required to be resistant to tearing due to the contents or external contact, and to have high impact resistance. At the same time, the pressure of the resin composition must be such that excessive pressure is not applied to the equipment during film production.

[0006] Patent Documents 1 to 3 confirm transparency and gloss, but do not consider strength or a polyamide resin composition that is easy to manufacture. Patent Document 4 considers puncture resistance and resin pressure, but there is still room for improvement, and impact resistance was not confirmed. Patent Document 5 does not consider a suitable combination of lubricant and polyamide.

[0007] Therefore, an object of the present invention is to provide a polyamide resin composition that has an appropriate resin pressure during molding and that, when formed into a film, has excellent resistance to punctures, pinhole resistance, and impact resistance. [Means for solving the problem]

[0008] The present invention includes, for example, the following [1] to

[12] . [1] A polyamide resin composition comprising an aliphatic polyamide resin (A) and a metal salt of a fatty acid having 6 to 24 carbon atoms (B), The polyamide resin composition contains 85.00 to 99.75 mass% of the aliphatic polyamide resin (A) and 0.25 to 1.00 mass% of the metal salt of the fatty acid having 6 to 24 carbon atoms (B), based on 100 mass% of the polyamide resin composition; The aliphatic polyamide resin composition comprises, as contents per 100 mass% of the polyamide resin composition, 70.00 to 95.00 mass% of an aliphatic homopolyamide resin (A1) having a relative viscosity of more than 3.50 and not more than 4.50, 3.00 to 15.00 mass% of an aliphatic homopolyamide resin (A2) having a relative viscosity of more than 2.80 and not more than 3.50, 1.00 to 5.00 mass% of an aliphatic homopolyamide resin (A3) having a relative viscosity of 2.00 or more and not more than 2.80, and 0 to 15.00 mass% of an aliphatic copolyamide resin (A4). [2] The polyamide resin composition according to [1], further comprising 0.01 to 0.30% by mass of a carboxylic acid amide (C) relative to 100% by mass of the polyamide resin composition. [3] The polyamide resin composition according to [1] or [2], further comprising 0.01 to 0.50 mass% of an antiblocking agent (D) relative to 100 mass% of the polyamide resin composition. [4] The polyamide resin composition according to any one of [1] to [3], wherein the aliphatic homopolyamide resin (A1) is at least one selected from the group consisting of polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612. [5] The polyamide resin composition according to any one of [1] to [4], wherein the aliphatic homopolyamide resin (A2) is at least one selected from the group consisting of polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612. [6] The polyamide resin composition according to any one of [1] to [5], wherein the aliphatic homopolyamide resin (A3) is at least one selected from the group consisting of polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612. [7] The polyamide resin composition according to any one of [1] to [6], wherein the content of the aliphatic copolyamide resin (A4) is 2.00 to 11.00 mass% in 100 mass% of the polyamide resin composition. [8] The polyamide resin composition according to any one of [1] to [7], wherein the aliphatic copolyamide resin (A4) has a relative viscosity of 2.90 or more and 4.70 or less. [9] The polyamide resin composition according to any one of [1] to [8], wherein the aliphatic copolyamide resin (A4) is at least one selected from the group consisting of polyamide 6 / 66, polyamide 6 / 12, and polyamide 6 / 66 / 12.

[10] The polyamide resin composition according to any one of [3] to [9], wherein the antiblocking agent (D) is at least one selected from the group consisting of mica, kaolin, zeolite, talc, and silica.

[11] A film made of the polyamide resin composition of any one of [1] to

[10] .

[12] Films of

[11] with thicknesses of 3 to 15 μm. [Effects of the Invention]

[0009] The polyamide resin composition of the present invention has an appropriate resin pressure during molding, and when formed into a film, has excellent puncture resistance, pinhole resistance, and impact resistance. DETAILED DESCRIPTION OF THE INVENTION

[0010] The present invention provides a polyamide resin composition comprising an aliphatic polyamide resin (A) and a metal salt of a fatty acid having 6 to 24 carbon atoms (B), the polyamide resin composition contains 85.00 to 99.75 mass% of the aliphatic polyamide resin (A) and 0.25 to 1.00 mass% of the metal salt of the fatty acid having 6 to 24 carbon atoms (B), based on 100 mass% of the polyamide resin composition; The aliphatic polyamide resin (A) is a polyamide resin composition containing, as contents per 100 mass% of the polyamide resin composition, 70.00 to 95.00 mass% of an aliphatic homopolyamide resin (A1) having a relative viscosity of more than 3.50 and not more than 4.50, 3.00 to 15.00 mass% of an aliphatic homopolyamide resin (A2) having a relative viscosity of more than 2.80 and not more than 3.50, 1.00 to 5.00 mass% of an aliphatic homopolyamide resin (A3) having a relative viscosity of 2.00 or more and not more than 2.80, and 0 to 15.00 mass% of an aliphatic copolyamide resin (A4). In this specification, the content of each component is a value rounded to two decimal places, except that 0 mass % means that the component is not included.

[0011] <Aliphatic homopolyamide resins (A1), (A2), and (A3)> The polyamide resin composition contains an aliphatic polyamide resin (A), and the aliphatic polyamide resin (A) contains an aliphatic homopolyamide resin (A1) having a relative viscosity of more than 3.50 and not more than 4.50, an aliphatic homopolyamide resin (A2) having a relative viscosity of more than 2.80 and not more than 3.50, and an aliphatic homopolyamide resin (A3) having a relative viscosity of 2.00 or more and not more than 2.80. The aliphatic homopolyamide resins (A1), (A2), and (A3) are polyamide resins composed of one type of structural unit derived from an aliphatic monomer. The aliphatic homopolyamide resins (A1), (A2), and (A3) may each independently comprise at least one type of lactam and an aminocarboxylic acid that is a hydrolyzate of the lactam, or may comprise a combination of one type of aliphatic diamine and one type of aliphatic dicarboxylic acid. The combination of an aliphatic diamine and an aliphatic dicarboxylic acid is a monomer component composed of a condensate of an aliphatic diamine and an aliphatic dicarboxylic acid. Here, the combination of an aliphatic diamine and an aliphatic dicarboxylic acid is considered to be one type of monomer, with the combination of one type of aliphatic diamine and one type of aliphatic dicarboxylic acid being considered to be one type of monomer.

[0012] The aliphatic diamine preferably has 2 to 20 carbon atoms, and more preferably 4 to 12. The aliphatic dicarboxylic acid preferably has 2 to 20 carbon atoms, and more preferably 6 to 12. The lactam preferably has 4 to 12 carbon atoms. The aminocarboxylic acid preferably has 4 to 12 carbon atoms.

[0013] Examples of lactams include ε-caprolactam, enantholactam, undecane lactam, dodecane lactam, α-pyrrolidone, α-piperidone, etc. Among these, from the viewpoint of polymerization productivity, one selected from the group consisting of ε-caprolactam, undecane lactam, and dodecane lactam is preferred.

[0014] Examples of aminocarboxylic acids include 4-aminobutanoic acid, 5-aminopentanoic acid, 6-aminocaproic acid, 7-aminoheptanoic acid, 9-aminononanoic acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid. Among these, from the viewpoint of polymerization productivity, one selected from the group consisting of 6-aminocaproic acid, 11-aminoundecanoic acid, and 12-aminododecanoic acid is preferred.

[0015] Examples of aliphatic diamines include ethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, undecamethylenediamine, dodecamethylenediamine, tridecanediamine, tetradecanediamine, pentadecanediamine, hexadecanediamine, heptadecanediamine, octadecanediamine, nonadecanediamine, eicosanediamine, 2-methyl-1,8-octanediamine, and 2,2,4 / 2,4,4-trimethylhexamethylenediamine. alicyclic diamines such as 1,3- / 1,4-cyclohexyldiamine, bis(4-aminocyclohexyl)methane, bis(4-aminocyclohexyl)propane, bis(3-methyl-4-aminocyclohexyl)methane, (3-methyl-4-aminocyclohexyl)propane, 1,3- / 1,4-bisaminomethylcyclohexane, 5-amino-2,2,4-trimethyl-1-cyclopentanemethylamine, 5-amino-1,3,3-trimethylcyclohexanemethylamine, bis(aminopropyl)piperazine, bis(aminoethyl)piperazine, and norbornanedimethylenediamine.

[0016] Examples of aliphatic dicarboxylic acids include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedionic acid, dodecanedionic acid, tridecanedionic acid, tetradecanedionic acid, pentadecanedioic acid, hexadecanedioic acid, octadecanedioic acid, and eicosanedioic acid; and alicyclic dicarboxylic acids such as 1,3- / 1,4-cyclohexanedicarboxylic acid, dicyclohexanemethane-4,4'-dicarboxylic acid, and norbornanedicarboxylic acid.

[0017] Specific examples of the aliphatic homopolyamide resins (A1), (A2), and (A3) include polybutyrolactam (polyamide 4), polytetramethylene adipamide (polyamide 46), polytetramethylene azelamide (polyamide 49), polytetramethylene sebacamide (polyamide 410), polyvalerolactam (polyamide 5), polycaprolactam (polyamide 6), polyenantholactam (polyamide 7), polyundecane lactam (polyamide 11), polylauryllactam (polyamide 12), polyhexamethylene adipamide (polyamide 66), polytetramethylene adipamide (polyamide 46), polytetramethylene sebacamide (polyamide 410), polytetramethylene dodecamide, and the like. Polyamide 412, Polypentamethylene adipamide (Polyamide 56), Polypentamethylene azelamide (Polyamide 59), Polypentamethylene sebacamide (Polyamide 510), Polypentamethylene dodecamide (Polyamide 512), Polypentamethylene tridecamide (Polyamide 513), Polyhexamethylene azelamide (Polyamide 69), Polyhexamethylene sebacamide Polyamide (Polyamide 610), Polyhexamethylene dodecamide (Polyamide 612), Polynonameethylene adipamide (Polyamide 96), Polynonameethylene azelamide (Polyamide 99), Polynonameethylene sebacamide (Polyamide 910), Polynonameethylene dodecamide (Polyamide 912), Polydecamethylene adipamide (Polyamide 106), Polydecamethylene azelamide (Polyamide Polyamide 109), polydecamethylene decamide (polyamide 1010), polydecamethylene dodecamide (polyamide 1012), polydodecamethylene adipamide (polyamide 126), polydodecamethylene azelamide (polyamide 129), polydodecamethylene sebacamide (polyamide 1210), polydodecamethylene dodecamide (polyamide 1212), polyamide 122, etc. These may be used alone or in combination of two or more. The types of polyamides in the aliphatic homopolyamide resins (A1), (A2), and (A3) are each independent of one another.

[0018] Among these, from the viewpoints of moldability and gas barrier properties, the aliphatic homopolyamide resin (A1) is preferably at least one selected from polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612.

[0019] Among these, from the viewpoints of moldability and gas barrier properties, the aliphatic homopolyamide resin (A2) is preferably at least one selected from polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612.

[0020] Among these, from the viewpoints of moldability and gas barrier properties, the aliphatic homopolyamide resin (A3) is preferably at least one selected from polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612.

[0021] The polyamides in the aliphatic homopolyamide resins (A1), (A2), and (A3) may be the same or different, but are preferably the same from the viewpoint of uniformly dispersing the carboxylic acid amide (C), the antiblocking agent (D), and the additives.

[0022] The aliphatic homopolyamide resin (A1) has a relative viscosity of more than 3.50 and not more than 4.50, preferably 3.60 or more and 4.50 or less, more preferably 3.60 or more and 4.20 or less, and even more preferably 3.80 or more and 4.20 or less. When the relative viscosity is in the above range, molding processability is good.

[0023] The aliphatic homopolyamide resin (A2) has a relative viscosity of more than 2.80 and not more than 3.50, preferably 2.90 or more and not more than 3.50, more preferably 3.00 or more and not more than 3.40, and even more preferably 3.10 or more and not more than 3.40. When the relative viscosity is in the above range, molding processability is good.

[0024] The aliphatic homopolyamide resin (A3) has a relative viscosity of 2.00 or more and 2.80 or less, preferably 2.00 or more and 2.50 or less, and more preferably 2.10 or more and 2.40 or less. When the relative viscosity is in the above range, molding processability is good.

[0025] The relative viscosity is measured in accordance with JIS K-6920 by dissolving 1 g of polyamide resin in 100 ml of 96% concentrated sulfuric acid at 25° C. The relative viscosity is a value rounded to one decimal place. By using the aliphatic homopolyamide resin (A1), the aliphatic homopolyamide resin (A2), and the aliphatic homopolyamide resin (A3) having different relative viscosities in this way, a melt viscosity suitable for molding can be obtained, and a good resin pressure can be achieved, resulting in good film moldability.

[0026] As long as the above relative viscosity is satisfied, the aliphatic homopolyamide resin (A1) may be used alone or in combination of two or more kinds, the aliphatic homopolyamide resin (A2) may be used alone or in combination of two or more kinds, and the aliphatic homopolyamide resin (A3) may be used alone or in combination of two or more kinds.

[0027] When the aliphatic homopolyamide resin (A1) contains two or more polyamide resins with different relative viscosities, it is preferable to measure the relative viscosity of the aliphatic homopolyamide resin (A1), but the relative viscosity of the aliphatic homopolyamide resin (A1) may also be determined by multiplying the relative viscosity of each of the contained polyamide resins by their mixing ratio, and then calculating the average value. The same applies to the aliphatic homopolyamide resins (A2) and (A3).

[0028] Furthermore, in consideration of the terminal group concentration and relative viscosity of each of the aliphatic homopolyamide resins (A1), (A2), and (A3), at least one selected from the group consisting of monoamines, diamines, monocarboxylic acids, and dicarboxylic acids may be added as an end group regulator in appropriate combination. For example, aliphatic monoamines such as methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine, and dibutylamine; alicyclic monoamines such as cyclohexylamine and dicyclohexylamine; aromatic monoamines such as aniline, toluidine, diphenylamine, and naphthylamine; aliphatic diamines such as hexamethylenediamine, decamethylenediamine, and dodecamethylenediamine; alicyclic diamines such as cyclohexanediamine, methylcyclohexanediamine, and isophoronediamine; aromatic diamines such as metaphenylenediamine, paraphenylenediamine, metaxylylenediamine, and paraxylylenediamine; aliphatic monocarboxylic acids such as acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, and isobutyric acid; alicyclic monocarboxylic acids such as cyclohexanecarboxylic acid; benzoic acid; Examples of suitable aromatic monocarboxylic acids include aromatic monocarboxylic acids such as phenylacetic acid, toluic acid, α-naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, and phenylacetic acid; aliphatic dicarboxylic acids such as adipic acid, trimethyladipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedicarboxylic acid, and dodecanedicarboxylic acid; alicyclic dicarboxylic acids such as 1,3-cyclopentanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid; and aromatic dicarboxylic acids such as isophthalic acid and 1,4 / 2,6 / 2,7-naphthalenedicarboxylic acid. These may be used alone or in combination. These may be used in amounts within the range that will achieve the above-mentioned objective.

[0029] From the viewpoint of film strength and moldability, the aliphatic homopolyamide resin (A1) preferably has a terminal amino group concentration of 30 to 39 μmol / g, more preferably 32 to 39 μmol / g.

[0030] The aliphatic homopolyamide resin (A2) preferably has a terminal amino group concentration of 30 to 50 μmol / g, more preferably 35 to 45 μmol / g.

[0031] The aliphatic homopolyamide resin (A3) preferably has a terminal amino group concentration of 30 to 100 μmol / g, more preferably 30 to 40 μmol / g.

[0032] The terminal amino group concentration can be determined by dissolving the compound in a mixed solvent of phenol and methanol and then subjecting it to neutralization titration. When each of the aliphatic homopolyamide resins (A1), (A2) and (A3) has a specific terminal amino group concentration, the strength and moldability of the film are improved.

[0033] When the aliphatic homopolyamide resin (A1) contains two or more polyamide resins with different terminal amino group concentrations, it is preferable to measure the terminal amino group concentration of each aliphatic homopolyamide resin (A1), but the terminal amino group concentration of the aliphatic homopolyamide resin (A1) may also be determined by multiplying the terminal amino group concentration of each contained polyamide resin by their mixing ratio and adding up the values ​​obtained. The same applies to the aliphatic homopolyamide resins (A2) and (A3).

[0034] The content of the aliphatic homopolyamide resin (A1) in 100% by mass of the polyamide resin composition is 70.00 to 95.00% by mass, preferably 70.00 to 90.00% by mass, more preferably 75.00 to 90.00% by mass, and even more preferably 75.00 to 85.00% by mass. When the content of the aliphatic homopolyamide resin (A1) is within this range, the effects of the present invention can be exhibited.

[0035] The content of the aliphatic homopolyamide resin (A2) in 100% by mass of the polyamide resin composition is 3.00 to 15.00% by mass, preferably 4.00 to 15.00% by mass, and more preferably 4.50 to 14.50% by mass. When the content of the aliphatic homopolyamide resin (A2) is within this range, the effects of the present invention can be exhibited.

[0036] The content of the aliphatic homopolyamide resin (A3) in 100% by mass of the polyamide resin composition is 1.00 to 5.00% by mass, preferably 2.00 to 4.00% by mass, and more preferably 2.00 to 3.00% by mass. When the content of the aliphatic homopolyamide resin (A3) is within this range, the effects of the present invention can be exhibited.

[0037] <Aliphatic copolyamide resin (A4)> The polyamide resin composition preferably contains an aliphatic copolyamide resin (A4) as desired. The aliphatic copolyamide resin (A4) is a polyamide resin composed of two or more structural units derived from aliphatic monomers. The aliphatic copolyamide resin (A4) is a copolymer of two or more monomers selected from the group consisting of a combination of an aliphatic diamine and an aliphatic dicarboxylic acid, lactams, and aminocarboxylic acids. Here, the combination of an aliphatic diamine and an aliphatic dicarboxylic acid refers to a monomer component composed of a condensation product of an aliphatic diamine and an aliphatic dicarboxylic acid. The combination of an aliphatic diamine and an aliphatic dicarboxylic acid is considered to be one type of monomer component, with a combination of one type of aliphatic diamine and one type of aliphatic dicarboxylic acid being considered to be one type of monomer component. Aliphatic includes alicyclic.

[0038] Examples of the aliphatic diamine include the same ones as those exemplified as raw materials for the aliphatic homopolyamide.

[0039] Examples of the aliphatic dicarboxylic acid include the same as those exemplified as raw materials for the aliphatic homopolyamide.

[0040] Examples of lactams include those exemplified as raw materials for the aliphatic homopolyamide. As the aminocarboxylic acid, the same compounds as those exemplified as the raw material for the aliphatic homopolyamide can be used.

[0041] In addition, in consideration of the terminal group concentration and relative viscosity, at least one regulator selected from the group consisting of monoamines, diamines, monocarboxylic acids and dicarboxylic acids may be added to the aliphatic copolyamide resin (A4) in appropriate combination. Specific examples include those exemplified in the section on aliphatic homopolyamides.

[0042] Specific examples of the aliphatic copolymer polyamide resin (A4) include caprolactam / tetramethylenediaminoadipic acid copolymer (polyamide 6 / 46), caprolactam / pentamethylenediaminoadipic acid copolymer (polyamide 6 / 56), caprolactam / hexamethylenediaminoadipic acid copolymer (polyamide 6 / 66), caprolactam / hexamethylenediaminoazelaic acid copolymer (polyamide 6 / 69), caprolactam / tetramethylenediaminosebacic acid (polyamide 6 / 410), caprolactam / pentamethylenediaminosebacic acid copolymer (polyamide 6 / 510), caprolactam / hexamethylenediaminosebacic acid copolymer (polyamide 6 / 610), and caprolactam / hexamethylenediaminoundecanedicarboxylic acid copolymer (polyamide 6 / 611). ), caprolactam / hexamethylenediaminododecanedicarboxylic acid copolymer (polyamide 6 / 612), caprolactam / decamethylenediaminosebacic acid copolymer (polyamide 6 / 1010), caprolactam / aminoundecanoic acid copolymer (polyamide 6 / 11), caprolactam / lauryllactam copolymer (polyamide 6 / 12), caprolactam / hexamethylenediaminoadipic acid / lauryllactam copolymer (polyamide 6 / 66 / 12), caprolactam / hexamethylenediaminoadipic acid / hexamethylenediaminosebacic acid copolymer (polyamide 6 / 66 / 610), caprolactam / hexamethylenediaminoadipic acid / hexamethylenediaminododecanedicarboxylic acid copolymer (polyamide 6 / 66 / 612), and other aliphatic copolymer polyamides. The aliphatic copolyamide resin (A4) may be used singly or in combination of two or more kinds.

[0043] Among these aliphatic copolyamide resins (A4), aliphatic copolyamide resins containing caprolactam as one of the monomers constituting the copolymer are preferred, and at least one selected from the group consisting of caprolactam / hexamethylenediaminoadipic acid copolymer (polyamide 6 / 66), caprolactam / lauryllactam copolymer (polyamide 6 / 12), and caprolactam / hexamethylenediaminoadipic acid / lauryllactam copolymer (polyamide 6 / 66 / 12) is more preferred.

[0044] The aliphatic copolyamide resin (A4) has a relative viscosity, measured in accordance with JIS K-6920 by dissolving 1 g of the polyamide resin in 100 ml of 96% concentrated sulfuric acid at 25°C, of ​​preferably 2.90 or more and 4.70 or less, more preferably 3.00 or more and 4.50 or less, and even more preferably 3.00 or more and 4.30 or less, from the viewpoint of film formability.

[0045] When the aliphatic copolyamide resin (A4) contains two or more polyamide resins with different relative viscosities, the relative viscosity is determined by the same method as explained in the section on the aliphatic homopolyamide resin (A1).

[0046] The terminal amino group concentration of the aliphatic copolyamide resin (A4) is preferably 25 to 40 μmol / g, more preferably 28 to 40 μmol / g, and even more preferably 30 to 40 μmol / g, as determined by dissolving the resin in a mixed solvent of phenol and methanol and subjecting it to neutralization titration.

[0047] When the aliphatic copolyamide resin (A4) contains two or more polyamide resins having different terminal amino group concentrations, the terminal amino group concentration can be determined by the same method as described in the section on the aliphatic homopolyamide resin (A1).

[0048] The content of the aliphatic copolyamide resin (A4) in 100% by mass of the polyamide resin composition is 0 to 15.00% by mass, preferably 2.00 to 11.00% by mass, more preferably 4.00 to 12.00% by mass, and even more preferably 5.00 to 10.00% by mass. The content of the aliphatic copolyamide resin (A4) in the above range is desirable from the viewpoint of puncture resistance without impairing the effects of the present invention.

[0049] <Polyamide resin> Examples of polyamide resin production equipment include known polyamide production equipment such as batch-type reaction vessels, single- or multi-vessel continuous reaction vessels, tubular continuous reaction vessels, and kneading reaction extruders such as single-screw kneading extruders and twin-screw kneading extruders. Known polymerization methods, such as melt polymerization, solution polymerization, and solid-state polymerization, can be used, and polymerization can be carried out by repeating operations under normal pressure, reduced pressure, and increased pressure. These polymerization methods can be used alone or in appropriate combination.

[0050] The content of the aliphatic polyamide resin (A) in 100% by mass of the polyamide resin composition is 85.00 to 99.75% by mass, preferably 90.00 to 99.70% by mass, and more preferably 95.00 to 99.60% by mass. When the content of the aliphatic polyamide resin (A) is within the above range, the composition has excellent pinhole resistance and impact strength, and is also excellent in moldability.

[0051] <Metal salts of fatty acids with 6 to 24 carbon atoms (B)> The polyamide resin composition contains (B) a metal salt of a fatty acid having 6 to 24 carbon atoms. Examples of metal salts of fatty acids having 6 to 24 carbon atoms include metal salts of stearic acid, myristic acid, palmitic acid, behenic acid, oleic acid, and arachidic acid, such as magnesium stearate, zinc stearate, lithium stearate, calcium stearate, and aluminum palmitate. The metal salt of a fatty acid having 6 to 24 carbon atoms may have a hydroxyl group. Examples of the metal salt of a fatty acid having 6 to 24 carbon atoms and having a hydroxyl group include metal stearates having a hydroxyl group. The metal salts of fatty acids having 6 to 24 carbon atoms may be used alone or in combination of two or more, but it is preferable to use a combination of two or more from the viewpoint of improving lubricity.

[0052] The content of the metal salt of a fatty acid having 6 to 24 carbon atoms (B) in 100% by mass of the polyamide resin composition is 0.25 to 1.00% by mass, preferably 0.25 to 0.90% by mass, and more preferably 0.25 to 0.80% by mass. When the content of the metal salt of a fatty acid having 6 to 24 carbon atoms (B) is within this range, the load on the extruder screw during film molding can be reduced, and a flowability effect can be exhibited. In addition, it can also be effective in preventing the buildup at the tip (lip) of the die.

[0053] <Carboxylic acid amide (C)> The polyamide resin composition preferably contains a carboxylic acid amide (C) as an optional component. Examples of carboxylic acid amides include aliphatic monocarboxylic acid amides such as lauric acid amide, palmitic acid amide, oleic acid amide, stearic acid amide, erucic acid amide, behenic acid amide, ricinoleic acid amide, and 12-hydroxystearic acid amide; N-lauryl lauric acid amide, N-palmityl palmitic acid amide, N-oleyl palmitic acid amide, N-oleyl oleic acid amide, N-oleyl stearic acid amide, N-stearyl stearic acid amide, N-stearyl oleic acid amide, N-stearyl erucic acid amide, and N-stearyl- N-substituted aliphatic monocarboxylic acid amides such as 12-hydroxystearic acid amide, N-oleyl-12-hydroxystearic acid amide, methylol stearic acid amide, methylol behenic acid amide, and 12-hydroxystearic acid monoethanolamide, methylene bisstearic acid amide, methylene bislauric acid amide, methylene bis-12-hydroxystearic acid amide, ethylene biscapric acid amide, ethylene bislauric acid amide, ethylene bisoleic acid amide, ethylene bisstearic acid amide, ethylene biserucic acid amide, and ethylene aliphatic carboxylic acid bisamides such as N,N'-dioleylsebacic acid amide, N,N'-dioleyl adipic acid amide, N,N'-distearyl adipic acid amide, and N,N'-distearylsebacic acid amide; and N,N'-dioleyl sebacic acid amide, N,N'-dioleyl sebacic acid amide, N,N'-dioleyl sebacic acid amide, N,N'-dioleyl sebacic acid amide, N,N'-distearyl sebacic acid amide. Alicyclic carboxylic acid amides such as N,N'-dicyclohexanecarbonyl-1,4-diaminocyclohexane, 1,4-cyclohexanedicarboxamide, 1,4-cyclohexanedicarboxylic acid diaminocyclohexane, 1,2,3,4-butanetetracarboxylic acid tetracyclohexylamide, N,N'-bis(3-hydroxypropyl)-1,4-cubanedicarboxamide, N,N'-(1,4-cyclohexanediyl)bis(acetamide), tris(methylcyclohexyl)propanetricarboxamide, 1,4-cyclohexanedicarboxylic acid dianilide, 1,Examples of aromatic carboxylic acid amides include 4-cyclohexanedicarboxylic acid dibenzylamide, trimesic acid tris(t-butylamide), trimesic acid tricyclohexylamide, trimesic acid tri(2-methylcyclohexylamide), trimesic acid tri(4-cyclohexylamide), 2,6-naphthalene dicarboxylic acid dicyclohexylamide, N,N'-dibenzylcyclohexane-1,4-dicarboxamide, N,N'-distearylisophthalamide, N,N'-distearylterephthalamide, m-xylylenebisstearamide, and m-xylylenebis-12-hydroxystearamide. Among these, aliphatic carboxylic acid amides selected from the group consisting of aliphatic monocarboxylic acid amides, N-substituted aliphatic monocarboxylic acid amides, and aliphatic carboxylic acid bisamides are preferred, with aliphatic carboxylic acid bisamides being more preferred. The carboxylic acid amide (C) may be used alone or in combination of two or more. The combination of the metal salt of a fatty acid having 6 to 24 carbon atoms (B) and the carboxylic acid amide (C) improves the lubricity.

[0054] The content of the carboxylic acid amide (C) in 100% by mass of the polyamide resin composition is preferably 0.01 to 0.30% by mass, more preferably 0.01 to 0.20% by mass, and even more preferably 0.05 to 0.10% by mass. When the content of the carboxylic acid amide (C) is within this range, the screw load of the extruder during film molding can be reduced, and further, adhesion between films can be effectively suppressed without impairing the properties of the obtained film.

[0055] <Antiblocking agent (D)> The polyamide resin composition preferably contains an antiblocking agent (D) as an optional component. An antiblocking agent is a substance added to impart irregularities to the surface of a film to prevent adhesion between films. The shape of the antiblocking agent is not particularly limited as long as it can form surface protrusions on the film surface and provide slipperiness to the film, and may be in the form of powder, particles, flakes, plates, fibers, needles, cloth, mats, or any other shape, although particles and plates are preferred. Antiblocking agents (D) also include those that function as crystal nucleating agents.

[0056] The average particle size of the antiblocking agent is preferably 0.1 to 20 μm, more preferably 0.3 to 15 μm, and even more preferably 0.5 to 10 μm. It is desirable that the antiblocking agent substantially contains no particles having a particle size exceeding 20 μm. If a large amount of particles having a particle size exceeding 20 μm is contained, fish eye gel may form, impairing the film's appearance. Even if the slippage improvement effect is achieved, the film's transparency may be impaired. On the other hand, if the average particle size is less than 0.1 μm, secondary aggregation may occur, which may instead cause fish eye gel. Even if aggregation can be prevented, it may be difficult to achieve the desired unevenness on the film surface, and slippage may not be improved. Therefore, if the particle size of the antiblocking agent is not suitable for the present invention, it is desirable to perform a pulverization treatment or classification beforehand. In this specification, the average particle size is a value measured by a laser diffraction method, or in the case of a commercially available product, it may be a catalog value.

[0057] Specific examples of these antiblocking agents include silica such as gel-type silica, precipitated silica, dried silica, and colloidal silica, as well as talc, kaolin, montmorillonite, zeolite, mica, glass flakes, wollastonite, potassium titanate, magnesium sulfate, sepiolite, zonolite, aluminum borate, glass beads, calcium silicate, calcium carbonate, titanium oxide, barium sulfate, zinc oxide, and magnesium hydroxide. These may be used alone or in combination of two or more. Among these, mica, kaolin, zeolite, talc, and silica are preferred from the viewpoint of easy dispersibility. These may be used alone or in combination of two or more.

[0058] In particular, it is more preferable to use silica as an antiblocking agent, as the resulting film has excellent transparency and slipperiness. Silica is primarily composed of silicon dioxide, represented by SiO2·nH2O, and can be broadly classified into two types, wet-process silica and dry-process silica, depending on the manufacturing method, but either can be used. In particular, the average particle size of the silica is preferably 0.1 to 20 μm, more preferably 0.3 to 15 μm, and even more preferably 0.5 to 10 μm.

[0059] Primary silica particles have a particle size on the submicron order, but commonly used silicas include soft silica (gel-type silica, precipitated silica, dried silica) in which these primary particles aggregate to form secondary or tertiary particles, and hard silica (colloidal silica) in which the primary particle size is already 1 μm or larger, and soft silica is more preferable when film stretching is to be performed. The above average particle size of silica is the value of primary particles in the case of hard silica, and the value of aggregated particles in the case of soft silica.

[0060] It is possible to use silica that has not been surface-treated, but it is also possible to use surface-treated silica. When an antiblocking agent treated with a silane-based or titanium-based surface treatment agent is used, the dispersibility is further improved, and the transparency of the resulting film is further improved. The surface treatment method is not particularly limited, and for example, the method described in JP-A-63-251460 can be applied, in which a silane coupling agent diluted with water is added to fine silica under heating and stirring.

[0061] The antiblocking agent (D) may be used singly or in combination of two or more kinds. The content of the antiblocking agent (D) in 100% by mass of the polyamide resin composition is preferably 0.01 to 0.50% by mass, more preferably 0.05 to 0.30% by mass, and even more preferably 0.10 to 0.20% by mass, which can effectively prevent adhesion between films without impairing the properties of the resulting film.

[0062] <Additives> The polyamide resin composition may contain, as optional components depending on the purpose, etc., functionality-imparting agents such as dyes, pigments, fibrous reinforcements, particulate reinforcements, plasticizers, antioxidants, heat resistance agents, foaming agents, weather resistance agents, crystallization accelerators, crystal nucleating agents, antistatic agents, flame retardants, flame retardant assistants, colorants, etc. Among these, substances that also function as antiblocking agents (D) are included in the content of the antiblocking agent (D). The content of the optional additives is preferably 1.00% by mass or less, and more preferably 0.50% by mass or less, based on 100% by mass of the polyamide resin composition.

[0063] The polyamide resin composition may contain a thermoplastic resin other than an aliphatic polyamide resin. Examples of thermoplastic resins other than an aliphatic polyamide resin include semi-aromatic polyamide resins, aromatic polyamide resins, polyolefin resins such as low-density, medium-density, and high-density polyethylene, polypropylene, and polybutene, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyester-based elastomers, vinyl aromatic resins such as polystyrene, ABS resin, and AS resin, polyether resins, polyurethane resins, acrylic resins, polyimide resins, polycarbonate resins, polyacetal, polyvinyl alcohol, and rosin-based resins. From the viewpoints of mechanical properties and moldability, the content of thermoplastic resins other than polyamide resins is preferably 2.00% by mass or less, more preferably less than 0.10% by mass, and even more preferably zero, relative to 100% by mass of the polyamide resin composition.

[0064] [Method of producing polyamide resin composition] The method for producing the polyamide resin composition is not particularly limited, and the following method can be applied, for example. The raw materials of each component are mixed using a commonly known melt kneader such as a single-screw or twin-screw extruder, a Banbury mixer, a kneader, a mixing roll, etc. The melt kneading temperature is not particularly limited as long as it is a temperature at which the polyamide resin can be melted, but is preferably 190°C to 280°C. For example, when a twin-screw extruder is used, any of the following methods may be used: a method in which all of the raw materials are blended and then melt-kneaded; a method in which some of the raw materials are blended and then melt-kneaded, and then the remaining raw materials are blended and melt-kneaded; or a method in which some of the raw materials are blended and then the remaining raw materials are mixed using a side feeder while melt-kneading; however, the method in which all of the raw materials are blended and then melt-kneaded is preferred.

[0065] When mixing, each component may be mixed individually, or multiple components may be mixed in advance and then mixed, or a master batch may be used. The order of mixing may be appropriately selected depending on the method and conditions of melt-kneading, etc.

[0066] (Method for producing a film of a polyamide resin composition) The polyamide resin composition is suitably used as a film. Films made of polyamide resin compositions can be produced by known methods. For example, there are known methods, such as a casting method in which a polyamide resin composition is produced, melt-kneaded in an extruder, extruded into a flat film using a T-die or a coat hanger die, and then cast and cooled on the surface of a casting roll to produce a film, and a tubular method in which a tubular product is melt-extruded into a cylindrical shape using a ring die and cooled with air or water to produce a film. The produced film may be in a substantially unoriented, unstretched state, or in a stretched state.

[0067] When stretching an unstretched film, conventionally known industrial methods can be used. Stretched films include uniaxially stretched films, simultaneous biaxially stretched films, and sequentially biaxially stretched films, and these are produced by known stretching methods such as roll-type uniaxial stretching, tenter-type uniaxial stretching, tenter-type sequential biaxial stretching, tenter-type simultaneous biaxial stretching, and tubular stretching. Examples include simultaneous biaxial stretching, in which an unstretched sheet produced by a casting method is stretched simultaneously in the longitudinal and transverse directions using a tenter-type simultaneous biaxial stretching machine; sequential biaxial stretching, in which an unstretched sheet melt-extruded through a T-die is stretched in the longitudinal direction using a roll-type stretching machine and then stretched in the transverse direction using a tenter-type stretching machine; and tubular stretching, in which a tubular sheet formed through a circular die is stretched simultaneously in the longitudinal and transverse directions using an inflation method using gas pressure. The stretching step may be carried out continuously following the production of the film, or the produced film may be temporarily wound up and stretched as a separate step. The stretching temperature is usually 30 to 200° C., preferably 40 to 150° C. The stretching ratio is usually 1.5 to 6 times, preferably 2 to 5 times in each direction.

[0068] When laminating, the film may be subjected to surface treatment such as corona discharge treatment, plasma treatment, flame treatment, acid treatment, etc., to improve printability, lamination, and adhesive application. Furthermore, after lamination, the film may be subjected to secondary processing steps such as printing, lamination, adhesive application, and heat sealing, as necessary, before being used for the intended purpose.

[0069] The thickness of the film is preferably 3 to 15 μm, and more preferably 5 to 15 μm. A film having a thickness within the above range exhibits excellent transparency and gloss. The present invention provides a polyamide resin composition containing a mixture of several types of aliphatic homopolyamide resins having different relative viscosities and a metal salt of a fatty acid having 6 to 24 carbon atoms, thereby enabling a film with high puncture resistance despite its thin thickness. If a thickness greater than this is required depending on the purpose or application, a plurality of films may be laminated.

[0070] The film is not particularly limited, but can be suitably used for food packaging, industrial material packaging, exterior films for lithium ion batteries, and the like. [Example]

[0071] The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples. The physical properties of the examples and comparative examples were measured by the following methods. In each evaluation, ◯ was considered to be a pass, and × was considered to be a fail.

[0072] <Relative viscosity> This value is measured in accordance with JIS K6920, by dissolving 1 g of polyamide resin in 100 ml of 96% concentrated sulfuric acid at 25°C.

[0073] <Terminal amino group concentration> The polyamide resin was dissolved in a mixed solvent of phenol and methanol and the content was determined by neutralization titration.

[0074] <Average particle size> Measurement was carried out by laser diffraction.

[0075] <Piercing test> In accordance with JAS (P-1019), the maximum point load and elongation were measured using a needle with a diameter of 1.0φ and a tip shape of 0.5R. The puncture strength was evaluated according to the following criteria. ○: The maximum point load is 10.0 N or more. ×: The maximum point load is less than 10.0 N.

[0076] <Tensile stress at break, tensile elongation at break, and tensile modulus> Test pieces were prepared using the molding material pellets described below in accordance with ISO 527-1, 2, and subjected to tensile tests at 23°C, 50% relative humidity, and a tensile speed of 300 mm / min. The stress at break, elongation at break, and modulus of elasticity were measured for the test pieces in the MD and TD directions.

[0077] <Gelbo test (pinhole resistance)> A flex test was carried out 1,000 times at -5°C in accordance with MIL-B-131C using a Gelbo Flex Tester with a thermostatic bath manufactured by Tester Sangyo Co., Ltd. After the flex test, the film was placed on a recording paper, and India ink was applied and allowed to penetrate the recording paper, and the number of black dots recorded was counted. The pinhole resistance was evaluated according to the following criteria. ○: The number of pinholes is 0. ×: The number of pinholes is 1 or more.

[0078] <Film impact strength> The puncture resistance of films was evaluated by pendulum impact in accordance with ASTM D 3420. A 30 μm thick film was placed in a jig with a diameter of φ80 mm and an inner diameter of φ60 mm, and the thermostatic chamber was set to -5°C. The amount of work required to create a hole in the test piece by impact was evaluated using a film impact tester (manufactured by Toyo Seiki Co., Ltd.). The impact resistance was evaluated according to the following criteria. ○: 1.40J or more. ×: Less than 1.40J.

[0079] <Motor load> During film formation, the load on the extruder screw of the film forming machine was read from the current value. The motor load was evaluated according to the following criteria: ○: The motor load is 26.5A or less. ×: The motor load is over 26.5A.

[0080] <Resin pressure> During film formation, the value detected by the pressure gauge installed at the tip of the extruder of the film forming device was read. The resin pressure was evaluated according to the following criteria. ○: The resin pressure value is 8.0 MPa or less. ×: The resin pressure value is more than 8.0 MPa.

[0081] [Examples 1 to 7, Comparative Examples 1 to 7] The components listed in Table 1 were individually blended and melt-kneaded in a twin-screw extruder (ZSK32mc, manufactured by Coperion) with a cylinder diameter of 32 mm and L / D of 48 mm at a cylinder temperature of 250°C, a screw rotation of 200 rpm, and a throughput of 50 kg / hr to produce pellets of the desired molding material. These pellets were then molded into unstretched films using a GT-40-A-400 extruder manufactured by Plastics Engineering Research Institute at a molding temperature of 260°C and a chill roll temperature of 30°C. This film was then simultaneously biaxially stretched to a stretch ratio of 3.0x3.0x using an Iwamoto Seisakusho BIX703 biaxial stretching device at a stretching speed of 140 mm / sec and a stretching temperature of 100°C, followed by heat treatment with heated air at 200°C. A 15 μm-thick biaxially stretched film was then produced, and its puncture properties, film impact strength, and pinhole resistance were measured. Motor load and resin pressure were also measured during film molding. The tensile properties were measured using the above-mentioned test specimens. The units of compositions in the tables are mass %, and the entire polyamide resin composition is taken as 100 mass %.

[0082] The raw materials used in the examples are as follows: PA6(1): Polyamide 6, relative viscosity 4.08, terminal amino group concentration 33 μmol / g, manufactured by UBE Corporation PA6(2): Polyamide 6, relative viscosity 3.37, terminal amino group concentration 40 μmol / g, manufactured by UBE Corporation PA6(3): Polyamide 6, relative viscosity 2.20, terminal amino group concentration 36 μmol / g, manufactured by UBE Corporation PA6 / 66: Polyamide 6 / 66, a copolymer of polyamide 6 and polyamide 66, relative viscosity 4.05, terminal amino group concentration 33 μmol / g, manufactured by UBE Corporation PA6 / 12: Polyamide 6 / 12, a copolymer of polyamide 6 and polyamide 12, relative viscosity 4.05, terminal amino group concentration 33 μmol / g, manufactured by UBE Corporation Metal salts of fatty acids having 6 to 24 carbon atoms: (Magnesium stearate, trade name Magnesium Stearate, manufactured by NOF Corporation) Ethylene bisstearic acid amide: Product name EB-FF, manufactured by Kao Corporation Silica: average particle size: 2.0 to 3.5 μm, surface treatment: γ-aminopropyltriethoxysilane, manufactured by Mizusawa Industrial Chemicals Co., Ltd.

[0083] [Table 1]

[0084] From Examples 1 to 8, it can be seen that films obtained from the polyamide resin composition of the present invention have high puncture resistance, good tensile properties, good pinhole resistance, and impact resistance. The resin pressure when melting the polyamide resin composition of the present invention is appropriate, and the load on the motor is small. Comparing Examples 1 to 6 with Example 7, when the polyamide resin composition contains an aliphatic copolyamide, the stretchability of the film is better.

[0085] In Comparative Examples 1 and 4, the aliphatic homopolyamide resin (A2) was not contained and the amount of the metal salt of a fatty acid having 6 to 24 carbon atoms (B) was extremely small, so the resin pressure when the polyamide resin composition was melted was high, placing a load on the motor.In Comparative Example 5, the resin pressure when the polyamide resin composition was melted was high, placing a load on the motor, and pinholes were generated, and impact resistance was poor.

[0086] In Comparative Example 2, the amount of the aliphatic homopolyamide resin (A2) was small and the amount of the metal salt of a fatty acid having 6 to 24 carbon atoms (B) was small, so the resin pressure when the polyamide resin composition was melted was high, putting a load on the motor. In Comparative Example 3, the amount of the aliphatic homopolyamide resin (A2) was large and the amount of the metal salt of a fatty acid having 6 to 24 carbon atoms (B) was large, so the strength against puncture was poor, pinholes were generated, and the impact resistance was poor.

[0087] In Comparative Examples 6 and 7, the amount of metal salt (B) of a fatty acid having 6 to 24 carbon atoms was extremely small, so the resin pressure when the polyamide resin composition was melted was high, which put a strain on the motor, caused pinholes to occur, and the impact resistance was poor.

[0088] From the above, it is clear that the amount of each aliphatic homopolyamide resin with different relative viscosity and the amount of metal salt of fatty acid having 6 to 24 carbon atoms (B) affect the resin pressure when the polyamide resin composition is melted, and that the amount of metal salt of fatty acid having 6 to 24 carbon atoms (B) affects pinhole resistance and impact resistance. [Industrial Applicability]

[0089] The polyamide resin composition of the present invention is suitably used as a film for packaging foods, toiletry products, and the like, packaging industrial products, heavy-duty bags for commercial transport, and further packaging medicines and the like.

Claims

1. A polyamide resin composition comprising an aliphatic polyamide resin (A) and a metal salt of a fatty acid having 6 to 24 carbon atoms (B), the polyamide resin composition contains 85.00 to 99.75 mass% of the aliphatic polyamide resin (A) and 0.25 to 1.00 mass% of the metal salt of the fatty acid having 6 to 24 carbon atoms (B), based on 100 mass% of the polyamide resin composition; The aliphatic polyamide resin composition contains, as contents per 100 mass% of the polyamide resin composition, 70.00 to 95.00 mass% of an aliphatic homopolyamide resin (A1) having a relative viscosity of more than 3.50 and not more than 4.50, 3.00 to 15.00 mass% of an aliphatic homopolyamide resin (A2) having a relative viscosity of more than 2.80 and not more than 3.50, 1.00 to 5.00 mass% of an aliphatic homopolyamide resin (A3) having a relative viscosity of 2.00 or more and not more than 2.80, and 0 to 15.00 mass% of an aliphatic copolyamide resin (A4).

2. The polyamide resin composition according to claim 1, further comprising 0.01 to 0.30 mass% of a carboxylic acid amide (C) based on 100 mass% of the polyamide resin composition.

3. The polyamide resin composition according to claim 1 or 2, further comprising 0.01 to 0.50 mass% of an antiblocking agent (D) relative to 100 mass% of the polyamide resin composition.

4. 3. The polyamide resin composition according to claim 1, wherein the aliphatic homopolyamide resin (A1) is at least one selected from the group consisting of polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612.

5. 3. The polyamide resin composition according to claim 1, wherein the aliphatic homopolyamide resin (A2) is at least one selected from the group consisting of polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612.

6. 3. The polyamide resin composition according to claim 1, wherein the aliphatic homopolyamide resin (A3) is at least one selected from the group consisting of polyamide 6, polyamide 10, polyamide 11, polyamide 12, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 611, and polyamide 612.

7. 3. The polyamide resin composition according to claim 1, wherein the content of the aliphatic copolyamide resin (A4) is 2.00 to 11.00 mass% in 100 mass% of the polyamide resin composition.

8. 3. The polyamide resin composition according to claim 1, wherein the aliphatic copolyamide resin (A4) has a relative viscosity of 2.90 or more and 4.70 or less.

9. 3. The polyamide resin composition according to claim 1, wherein the aliphatic copolyamide resin (A4) is at least one selected from the group consisting of polyamide 6 / 66, polyamide 6 / 12, and polyamide 6 / 66 / 12.

10. 4. The polyamide resin composition according to claim 3, wherein the antiblocking agent (D) is at least one selected from the group consisting of mica, kaolin, zeolite, talc, and silica.

11. A film comprising the polyamide resin composition according to claim 1 or 2.

12. 12. The film of claim 11, having a thickness of 3 to 15 μm.

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