Three-dimensional memory device with support structures in gate line slits and methods for forming same

Abstract

To provide a three-dimensional memory device with support structures in gate line slits and methods for forming the same.SOLUTION: Embodiments of a structure and methods for forming a three-dimensional (3D) memory device are provided. In an example, the 3D memory device includes a memory stack having a plurality of conductor layers and a plurality of insulating layers being interleaved and extending laterally in the memory stack. The 3D memory device also includes a plurality of channel structures extending vertically through the memory stack into a substrate. The 3D memory device further includes at least one slit structure extending vertically and laterally in the memory stack and dividing a plurality of memory cells into at least one memory block, the at least one slit structure each including a plurality of slit openings and a support structure between adjacent slit openings. The support structure may be in contact with adjacent memory blocks and contact the substrate.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority to Chinese Patent Application No. 201910522007.2, filed on June 17, 2019, the contents of which are incorporated herein by reference in their entirety.

[0002] SUMMARY Embodiments of the present disclosure relate to three-dimensional (3D) memory devices with support structures for gate line slits (GLS) and methods for forming 3D memory devices. [Background technology]

[0003] Planar memory cells are being scaled to smaller and smaller dimensions through improvements in process technology, circuit design, programming algorithms, and fabrication processes. However, as memory cell feature sizes approach lower limits, planar processes and fabrication techniques become more difficult and costly. As a result, storage densities for planar memory cells are approaching upper limits.

[0004] 3D memory architectures can address the density limitations of planar memory cells and include a memory array and peripheral devices for controlling signals to and from the memory array. Summary of the Invention [Means for solving the problem]

[0005] Embodiments of a 3D memory device and methods for forming a 3D memory device are provided.

[0006] In one example, a 3D memory device includes a memory stack having alternating conductive layers and insulating layers extending laterally in the memory stack. The 3D memory device also includes a plurality of channel structures extending vertically through the memory stack to a substrate, the channel structures and the conductive layers intersecting each other to form a plurality of memory cells. The 3D memory device further includes at least one slit structure extending vertically and laterally in the memory stack, dividing the plurality of memory cells into at least one memory block, each slit structure including a plurality of slit openings and a support structure between adjacent slit openings. The support structure contacts adjacent block structures and contacts the substrate. The 3D memory device further includes a source structure having an insulating spacer at each of the slit openings and a source contact at each insulating spacer.

[0007] In another example, a method for forming a 3D memory device is provided. The method includes forming a dielectric stack over a substrate, the dielectric stack including alternating initial insulating layers and initial sacrificial layers, and forming at least one slit structure extending vertically and laterally in the dielectric stack to divide the dielectric stack into a plurality of block regions. Each of the at least one slit structure includes a plurality of slit openings exposing the substrate and an initial support structure between adjacent slit openings. Each of the plurality of block regions may include alternating insulating layers and sacrificial layers, and the initial support structure may include alternating insulating portions and sacrificial portions. Each of the plurality of insulating portions and sacrificial portions may contact a respective insulating layer and sacrificial layer at the same height from an adjacent block region. In some embodiments, the method also includes forming a plurality of channel structures extending vertically through the dielectric stack, replacing the plurality of sacrificial layers and sacrificial portions with a plurality of conductor layers and conductor portions through the at least one slit structure, and forming a source structure in each slit structure. The source structure may comprise an insulating spacer at each of the plurality of slit openings and a source contact at each insulating spacer.

[0008] In another example, a method for forming a 3D memory device is provided. The method includes forming a dielectric stack of alternating initial insulating layers and initial sacrificial layers over a substrate, forming a dielectric structure extending laterally in the dielectric stack, the dielectric structure extending vertically into a first initial insulating layer, and patterning the dielectric stack using the dielectric structure as an etch mask to form slit structures extending vertically and laterally in the dielectric stack and dividing the dielectric stack into pairs of block regions. The slit structures may include a plurality of slit openings exposing the substrate and a plurality of initial support structures between adjacent slit openings. Each of the plurality of block regions may include alternating insulating layers and sacrificial layers, and the plurality of initial support structures may include alternating insulating portions and sacrificial portions. Each of the plurality of insulating portions and sacrificial portions may contact a respective insulating layer and sacrificial layer at the same height from an adjacent block region. The method may also include forming a plurality of channel structures extending vertically through the dielectric stack, replacing the plurality of sacrificial layers and sacrificial portions with a plurality of conductor layers and conductor portions through at least one slit structure, and forming a source structure in each slit structure, the source structure may include an insulating spacer at each of the plurality of slit openings and a source contact at each insulating spacer.

[0009] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the disclosure and to enable one skilled in the art to make and use the disclosure. [Brief explanation of the drawings]

[0010] [Figure 1A] 1A and 1B are plan views of an example 3D memory device with support structures in a GLS, according to some embodiments of the present disclosure. [Figure 1B]1B is a cross-sectional view along direction AB of the 3D memory device shown in FIG. 1A according to some embodiments of the present disclosure. [Figure 1C] 1B is a cross-sectional view along the CD of the 3D memory device shown in FIG. 1A according to some embodiments of the present disclosure. [Figure 2A] 1A-1D are plan views of an exemplary 3D memory device at various stages in the fabrication process, according to some embodiments of the present disclosure. [Figure 2B] 2B is a cross-sectional view of the 3D memory device shown in FIG. 2A along direction AB, according to some embodiments of the present disclosure. [Figure 2C] 2B is a cross-sectional view along the CD of the 3D memory device shown in FIG. 2A according to some embodiments of the present disclosure. [Figure 2D] FIG. 2B is a cross-sectional view along the JK direction of the 3D memory device shown in FIG. 2A according to some embodiments of the present disclosure. [Figure 3A] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 3B] 3B is a cross-sectional view of the 3D memory device shown in FIG. 3A along direction AB, according to some embodiments of the present disclosure. [Figure 3C] FIG. 3B is a cross-sectional view along the CD of the 3D memory device shown in FIG. 3A according to some embodiments of the present disclosure. [Figure 3D] FIG. 3B is a cross-sectional view along the G-H direction of the 3D memory device shown in FIG. 3A according to some embodiments of the present disclosure. [Figure 4A] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 4B] 4B is a cross-sectional view along direction AB of the 3D memory device shown in FIG. 4A according to some embodiments of the present disclosure. [Figure 4C] FIG. 4B is a cross-sectional view along the CD of the 3D memory device shown in FIG. 4A according to some embodiments of the present disclosure. [Figure 4D]FIG. 4B is a cross-sectional view along the G-H direction of the 3D memory device shown in FIG. 4A according to some embodiments of the present disclosure. [Figure 5A] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 5B] 5B is a cross-sectional view along direction AB of the 3D memory device shown in FIG. 5A according to some embodiments of the present disclosure. [Figure 5C] FIG. 5B is a cross-sectional view along the CD of the 3D memory device shown in FIG. 5A according to some embodiments of the present disclosure. [Figure 6A] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 6B] 6B is a cross-sectional view along direction AB of the 3D memory device shown in FIG. 6A according to some embodiments of the present disclosure. [Figure 6C] FIG. 6B is a cross-sectional view along the CD of the 3D memory device shown in FIG. 6A according to some embodiments of the present disclosure. [Figure 7A] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 7B] 7B is a cross-sectional view along direction AB of the 3D memory device shown in FIG. 7A according to some embodiments of the present disclosure. [Figure 8A] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 8B] 8B is a cross-sectional view of the 3D memory device shown in FIG. 8A along direction AB, according to some embodiments of the present disclosure. [Figure 9A] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 9B] 9B is a cross-sectional view of the 3D memory device shown in FIG. 9A along direction AB, according to some embodiments of the present disclosure. [Figure 9C]FIG. 9B is a cross-sectional view along the LM direction of the 3D memory device shown in FIG. 9A according to some embodiments of the present disclosure. [Figure 9D] FIG. 9B is a cross-sectional view along the CD of the 3D memory device shown in FIG. 9A according to some embodiments of the present disclosure. [Figure 9E] 9B is a cross-sectional view along the EF direction of the 3D memory device shown in FIG. 9A according to some embodiments of the present disclosure. [Figure 10A] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 10B] 10B is a cross-sectional view along the AB direction of the 3D memory device shown in FIG. 10A according to some embodiments of the present disclosure. [Figure 10C] FIG. 10B is a cross-sectional view along the LM direction of the 3D memory device shown in FIG. 10A according to some embodiments of the present disclosure. [Figure 10D] FIG. 10B is a cross-sectional view along the CD of the 3D memory device shown in FIG. 10A according to some embodiments of the present disclosure. [Figure 10E] FIG. 10B is a cross-sectional view along the EF direction of the 3D memory device shown in FIG. 10A according to some embodiments of the present disclosure. [Figure 11] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 12] 1A-1C are plan views of an exemplary 3D memory device at different stages of the fabrication process, according to some embodiments of the present disclosure. [Figure 13A] 1 is a close-up view of an exemplary initial support structure, according to some embodiments of the present disclosure. [Figure 13B] 1 is a close-up view of an example support structure according to some embodiments of the present disclosure. [Figure 14A] 1 is a flow diagram of an example fabrication process for forming a 3D memory device with support structures in a slit structure, according to some embodiments of the present disclosure. [Figure 14B]10 is a flow diagram of another example fabrication process for forming a 3D memory device with support structures in a slit structure, according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0011] Embodiments of the present disclosure will now be described with reference to the accompanying drawings.

[0012] While specific configurations and arrangements are discussed, it should be understood that this is done for illustrative purposes only. Those skilled in the art will recognize that other configurations and arrangements can be used without departing from the spirit and scope of the present disclosure. It will be apparent to those skilled in the art that the present disclosure can be employed in a variety of other applications.

[0013] It should be noted that references herein to "one embodiment," "embodiment," "example embodiment," "some embodiments," etc., indicate that the described embodiment may include a particular feature, structure, or characteristic, but not all embodiments may necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in the context of an embodiment, it is within the knowledge of one of ordinary skill in the art to affect such feature, structure, or characteristic in the context of other embodiments, whether or not explicitly stated.

[0014] Generally, terminology can be understood, at least in part, from usage in context. For example, the term "one or more," as used herein, can be used to describe any feature, structure, or characteristic in the singular sense, or can be used to describe a combination of features, structures, or characteristics in the plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" can be understood to convey singular use or to convey plural use, again depending, at least in part, on the context. Also, the term "based on" can be understood as not necessarily intended to convey an exclusive collection of factors, but instead may allow for the presence of additional factors not necessarily explicitly recited, again depending, at least in part, on the context.

[0015] As used herein, the term "rated" refers to the value of a characteristic or parameter for a component or process step established during the design phase of a product or process, along with a range of values ​​above and / or below a desired or intended value. The range of values ​​may be due to slight variations or tolerances in the manufacturing process. As used herein, the term "about" indicates a value of a given quantity that may vary based on a specific technology node associated with the subject semiconductor device. Based on a specific technology node, the term "about" can indicate a value of a given quantity that varies, for example, within 10-30% of the value (e.g., ±10%, ±20%, or ±30% of the value).

[0016] As used herein, a staircase structure refers to a collection of surfaces including at least two horizontal planes (e.g., along the x-y plane) and at least two (e.g., first and second) vertical planes (e.g., along the z-axis), such that each horizontal plane is adjacent to a first vertical plane extending upward from a first edge of the horizontal plane and to a second vertical plane extending downward from a second edge of the horizontal plane. A "step" or "staircase" refers to a vertical offset in height between a collection of adjacent surfaces. In this disclosure, the terms "step" and "step" refer to a height of a staircase structure and are used interchangeably. In this disclosure, a horizontal direction can refer to a direction parallel to a top surface of a substrate (e.g., a substrate that provides a fabrication platform for the formation of structures thereon) (e.g., the x-axis or y-axis), and a vertical direction can refer to a direction perpendicular to the top surface of a structure (e.g., the z-axis).

[0017] NAND flash memory devices, widely used in various electronic products, are nonvolatile, lightweight, low-power, and have good performance. Current planar NAND flash memory devices have reached their storage limits. To further increase storage capacity and lower the cost per bit, 3D NAND memory devices have been proposed. The process for forming existing 3D NAND memory devices often includes the following steps: First, a stack structure of multiple alternating sacrificial and insulating layers is formed over a substrate. A channel hole extending through the stack structure is formed. The bottom of the channel hole is etched to form a recess in the substrate. An epitaxial portion is formed at the bottom of the channel hole by selective epitaxial growth. A semiconductor channel conductively connected to the epitaxial portion is formed in the channel hole. The sacrificial layer may be removed and replaced with a conductive layer. The conductive layer functions as a word line in the 3D NAND memory device.

[0018] Existing 3D NAND memory devices often include multiple memory blocks. Adjacent memory blocks are often separated by a GLS, forming an array common source (ACS). In fabrication methods for forming existing 3D NAND memory devices, the feature dimensions of the GLS are prone to vibration, potentially affecting the performance of the 3D NAND memory device.

[0019] The present disclosure provides a 3D memory device (e.g., a 3D NAND memory device) with a support structure in a slit structure (e.g., GLS), and a method for forming the 3D memory device. The 3D memory device uses one or more support structures that divide the slit structure into multiple slit openings in which source contacts are formed. The support structures each contact adjacent memory blocks and provide support to the entire structure of the 3D memory device during the formation of conductive layers / portions and source contacts. This makes the 3D memory device less susceptible to deformation or damage during the fabrication process. The support structures each include a dividing structure and multiple alternating conductive and insulating portions below the dividing structure. The dividing structure extends across and connects adjacent memory blocks in the top portion of the memory stack, and the multiple alternating conductive and insulating portions can contact the alternating conductive and insulating layers of the adjacent memory blocks, respectively. In some embodiments, the conductive portions of the support structure and the conductive layers of the adjacent memory blocks are formed by the same deposition process. By applying the disclosed structure and method, adjacent memory blocks are connected through the support structure during the formation of the slit structures and source contacts, thus the 3D memory device is less likely to deform during the fabrication process, and the feature dimensions of the slit structures are less susceptible to vibration.

[0020] FIG. 1A illustrates a plan view of an exemplary 3D memory device 150 according to some embodiments. FIG. 1B illustrates a cross-sectional view of the 3D memory device 150 illustrated in FIG. 1A along the AB direction. FIG. 1C illustrates a cross-sectional view of the 3D memory device 150 illustrated in FIG. 1A along the CD direction. As illustrated in FIG. 1A, the 3D memory device 150 may be divided into a core region 31 and a staircase region 32, for example, along the y direction. Channel structures and support pillars may be formed in the core region 31. Steps and electrical connections between conductor layers and external circuits (e.g., contact plugs) may be formed in the staircase region 32. The core region 31 may include one or more first source regions 23, e.g., a pair, extending along the x direction. A first source structure may be formed in each first source region 23. A channel region 41, in which multiple channel structures and memory cells are formed, is located between adjacent first source regions 23. In some embodiments, the channel region 41 may be divided into multiple block regions 21 by one or more second source regions 22 extending along the x-direction. A memory block may be formed in each block region 21, and a second source structure may be formed in each second source region 22.

[0021] 1A-1C, the 3D memory device 150 may include a substrate 100, a buffer oxide layer 101, and a stack structure 11 over the buffer oxide layer 101. In a block region 21, the stack structure 11 may include multiple conductor layers and multiple insulating layers 104 alternating across the buffer oxide layer 101. In some embodiments, the multiple conductor layers may include a top conductor layer 129 having multiple top-select conductor layers, a bottom conductor layer 128 having multiple bottom-select conductor layers, and a control conductor layer 127 between the top conductor layer 129 and the bottom conductor layer 128. The stack structure 11 may also include a dielectric cap layer 105 covering the multiple conductor layers (i.e., 127-129) and the insulating layer 104. In the block region 21, the stack structure 11 may also include multiple channel structures 140 extending from an upper surface of the dielectric cap layer 105 to the substrate 100 along a vertical direction (e.g., the z-direction). Each channel structure 140 may include an epitaxial portion 115 at the bottom, a drain structure 120 at the top, and a semiconductor channel 119 between the epitaxial portion 115 and the drain structure 120. The semiconductor channel 119 may include a memory film 116, a semiconductor layer 117, and a dielectric core 118. The epitaxial portion 115 may be in contact with and conductively connected to the substrate 100, and the semiconductor channel 119 may be in contact with and conductively connected to the drain structure 120 and the epitaxial portion 115. A plurality of memory cells may be formed by the semiconductor channel 119 and the control conductor layer 127. In the staircase region 32, the stack structure 11 may include a plurality of contact plugs 131 in the insulator 130, each contacting a respective conductor layer (e.g., 127, 128, or 129) and peripheral circuitry (not shown). The contact plugs 131 may apply a word line voltage to the connected conductor layer.

[0022] A first source structure may be formed in the first source region 23 to extend along the x-direction in the core region 31 and the staircase region 32. The first source structure may include a source contact 126 to an insulating structure 137. A second source structure may be formed in the second source region 22 to extend along the x-direction in the core region 31 and the staircase region 32. The second source structures may each include multiple source contacts 125 to a respective insulating structure 136. The source contacts 125 formed in one second source region 22 (e.g., of the same second source structure) and the respective insulating structures 136 may be aligned along the x-direction. The first and second source structures may each extend vertically through the stack structure 11 to contact the substrate 100, and a source voltage may be applied to the memory cell through the substrate 100. The 3D memory device 150 may include one or more support structures 152 aligned along the x-direction and dividing the second source structure into each of the plurality of source contacts 125 in the respective insulating structures 136. In some embodiments, the support structure 152 includes a dividing structure 112 connecting adjacent memory blocks (or block regions 21), the plurality of alternating conductor portions (e.g., 127-0 and 128-0), and the insulating portion 104-0 below the dividing structure 112. The support structure 152 may provide support to the 3D memory device 150 during the formation of the second source structures and conductor layers (e.g., 127-129). In some embodiments, one or more disconnection structures 111 may be formed in the channel region 41, extending parallel to the first and second source structures. The disconnection structures 111 may divide the top conductor layer 129 into a plurality of top select conductor layers that function as top select gate electrodes.

[0023] Substrate 100 may comprise silicon (e.g., single crystal silicon), silicon germanium (SiGe), gallium arsenide (GaAs), germanium (Ge), silicon-on-insulator (SOI), germanium-on-insulator (GOI), or any other suitable material. In some embodiments, substrate 100 is a thinned substrate (e.g., a semiconductor layer) that has been thinned by grinding, etching, chemical-mechanical polishing (CMP), or any combination thereof. In some embodiments, substrate 100 comprises silicon.

[0024] The channel structures 140 may form an array and may each extend vertically above the substrate 100. The channel structures 140 may extend through multiple pairs (referred to herein as "conductor / insulator layer pairs"), each including a conductor layer (e.g., 127, 128, or 129) and an insulating layer 104. In some embodiments, a buffer oxide layer 101 is formed between the substrate 100 and the stack structure 11. On at least one side along the horizontal direction (e.g., the x-direction and / or y-direction), the stack structure 11 may have a staircase structure, for example, in the staircase region 32. The number of conductor / insulator layer pairs in the stack structure 11 (e.g., 32, 64, 96, or 128) determines the number of memory cells in the 3D memory device 150. In some embodiments, the conductor layers (e.g., 127-129) and the insulating layers 104 in the stack structure 11 are alternately arranged along the vertical direction in the block region 21. The conductor layers (e.g., 127-129) may include conductive materials including, but not limited to, tungsten (W), cobalt (Co), copper (Cu), aluminum (Al), polysilicon, doped silicon, silicide, or any combination thereof. The insulating layer 104 may include a dielectric material including, but not limited to, silicon oxide, silicon nitride, silicon oxynitride, or any combination thereof. In some embodiments, the buffer oxide layer 101 and the dielectric cap layer 105 each include a dielectric material such as silicon oxide. In some embodiments, the top conductor layer 129 includes a plurality of top select conductor layers that function as top select gate electrodes. The control conductor layer 127 can function as a select gate electrode to form memory cells with intersecting channel structures 140. In some embodiments, the bottom conductor layer 128 includes a plurality of bottom select conductor layers that function as bottom select gate electrodes. The top select gate electrode and the bottom select gate electrode can each have a desired voltage applied to select a desired memory block / finger / page.

[0025] As shown in FIG. 1B , the channel structure 140 may include a semiconductor channel 119 extending vertically through the stack structure 11. The semiconductor channel 119 may include a channel hole filled with a channel-forming structure, such as a semiconductor material (e.g., as the semiconductor layer 117) and a dielectric material (e.g., as the memory film 116). In some embodiments, the semiconductor layer 117 includes silicon, such as amorphous silicon, polysilicon, or monocrystalline silicon. In some embodiments, the memory film 116 is a composite layer including a tunnel layer, a memory layer (also known as a “charge trapping layer”), and a blocking layer. The remaining space of the channel hole of the semiconductor channel 119 may be partially or completely filled with a dielectric core 118 including a dielectric material such as silicon oxide. The semiconductor channel 119 may have a cylindrical shape (e.g., a pillar shape). According to some embodiments, the dielectric core 118, the semiconductor layer 117, the tunnel layer, the memory layer, and the blocking layer are arranged in this order radially from the center of the pillar toward the outer surface. The tunnel layer may include silicon oxide, silicon oxynitride, or any combination thereof. The memory layer may include silicon nitride, silicon oxynitride, silicon, or any combination thereof. The block layer may comprise silicon oxide, silicon oxynitride, a high-dielectric-constant (high-k) dielectric, or any combination thereof. In one example, the memory layer may include a composite layer of silicon oxide / silicon oxynitride (or silicon nitride) / silicon oxide (ONO).

[0026] In some embodiments, the channel structure 140 further comprises an epitaxial portion 115 (e.g., a semiconductor plug) at a lower portion (e.g., bottom end) of the channel structure 140. As used herein, the “top end” of a component (e.g., the channel structure 140) is the end that is vertically farther away from the substrate 100, and the “bottom end” of a component (e.g., the channel structure 140) is the end that is vertically closer to the substrate 100 when the substrate 100 is positioned at the lowest plane of the 3D memory device 150. The epitaxial portion 115 may comprise a semiconductor material, such as silicon, that is epitaxially grown from the substrate 100 in any suitable direction. It is understood that in some embodiments, the epitaxial portion 115 comprises monocrystalline silicon, the same material as the substrate 100. Stated differently, the epitaxial portion 115 may comprise an epitaxially grown semiconductor layer that is grown from the substrate 100. Epitaxial portion 115 may comprise a different material than substrate 100. In some embodiments, epitaxial portion 115 comprises at least one of silicon, germanium, and silicon germanium. In some embodiments, a portion of epitaxial portion 115 is above the top surface of substrate 100 and in contact with semiconductor channel 119. Epitaxial portion 115 may be conductively connected to semiconductor channel 119. In some embodiments, the top surface of epitaxial portion 115 is positioned between the top and bottom surfaces of a lowest insulating layer 104 (e.g., an insulating layer at the bottom of stack structure 11).

[0027] In some embodiments, the channel structure 140 further comprises a drain structure 120 (e.g., a channel plug) at an upper portion (e.g., top end) of the channel structure 140. The drain structure 120 can contact the top end of the semiconductor channel 119 and can be conductively connected to the semiconductor channel 119. The drain structure 120 can include a semiconductor material (e.g., polysilicon) or a conductive material (e.g., metal). In some embodiments, the drain structure comprises an opening filled with Ti / TiN or Ta / TaN as an adhesion layer and tungsten as a conductor material. By covering the top end of the semiconductor channel 119 during fabrication of the 3D memory device 150, the drain structure 120 can function as an etch stop layer to prevent etching of dielectrics, such as silicon oxide and silicon nitride, that fill the semiconductor channel 119.

[0028] As shown in FIG. 1A , the first source region 23 and the second source region 22 can divide the channel region 41 into multiple block regions 21, which can be further divided by one or more cutting structures 111 to form multiple memory fingers. Multiple channel structures 140 (e.g., memory cells) can be formed in each memory block / finger. In some embodiments, the first source region 23, the second source region 22, and the cutting structure 111 can extend along the x-direction. In some embodiments, the cutting structure 111 can extend along the x-direction in the channel region 41, and the first source region 23 and the second source region 22 can extend laterally in the core region 31 and the staircase region 32. The number of cutting structures 111 in a block region 21 (i.e., a memory block) can range from 0 to n, where n is a suitable positive integer. The number n should be determined based on the design and / or fabrication of the 3D memory device 150 and should not be limited by the embodiments of the present disclosure. For purposes of illustration, n is equal to 1 in this disclosure.

[0029] In some embodiments, the cutting structure 111 comprises a suitable dielectric material, such as one or more of silicon oxide, silicon nitride, or silicon oxynitride, and divides each block region 21 (or memory block) into pairs of memory fingers. Specifically, the cutting structure 111 may extend vertically (i.e., along the z-direction) into the topmost insulating layer 104 (i.e., the insulating layer 104 below the topmost conductor layer 129). In some embodiments, the bottom surface of the cutting structure 111 is between the top and bottom surfaces of the topmost insulating layer 104. In some embodiments, the cutting structure 111 divides the topmost conductor layer 129 into multiple topmost select conductor layers. A voltage may be applied to one or more topmost select conductor layers to select a desired memory finger / page / block.

[0030] In some embodiments, the first source structure includes a source contact 126 extending along the x-direction in an insulating structure 137. The source contact 126 can contact the substrate 100 to form a conductive connection for applying a source voltage to the memory cell. In some embodiments, the source contact 126 includes one or more of polysilicon, silicide, germanium, silicon germanium, copper, aluminum, cobalt, and tungsten. In some embodiments, the insulating structure 137 includes one or more of silicon oxide, silicon nitride, or silicon oxynitride. In some embodiments, the insulator 130 includes a suitable dielectric material, such as silicon oxide, silicon nitride, and / or silicon oxynitride. In some embodiments, the contact plugs 131 each contact and conductively connect with a respective conductor layer (e.g., 127, 128, or 129). The contact plugs 131 can include one or more of polysilicon, silicide, germanium, silicon germanium, copper, aluminum, cobalt, and tungsten.

[0031] In some embodiments, the second source structure may include multiple source contacts 125, each on a respective insulating structure 136. The materials of the source contacts 125 and the insulating structures 136 may be similar or the same as the source contacts 126 and the insulating structures 137, and therefore will not be repeated here. At least one support structure 152 may be formed between pairs of source contacts 125 (and pairs of insulating structures 136) and contact adjacent block regions 21 (or memory blocks). As shown in FIGS. 1B and 1C , the support structure 152 may include a dividing structure 112 and multiple alternating conductor portions (e.g., 127-0 and 128-0) and insulating portions 104-0 below the dividing structure 112. The conductor portions (e.g., 127-0 and 128-0) and insulating portions 104-0 may contact (e.g., be connected to) the conductor layers (e.g., 127 and 128) and insulating layers 104 at the same height in adjacent block regions 21 (or memory blocks) along the y direction. In some embodiments, the conductor portions (e.g., 127-0 and 128-0) and insulating portions 104-0 are not connected to the conductor layers (e.g., 127 and 128) and insulating layers 104 of any block regions 21 (or memory blocks) in each second source region 22 along the x direction. In some embodiments, the 3D memory device 150 includes one or more support structures 152 aligned along the x direction to divide the second source structures into each of the multiple source contacts 125 in each insulating structure 136. 1A-1C, the plurality of support structures 152 can divide the second source structure along the x-direction into a plurality of unconnected source contacts 125 and insulating structures 136. The plurality of support structures 152 can also connect along the y-direction to the conductor layers (e.g., 127 and 128) and insulating layer 104 of adjacent block regions 21. In some embodiments, the support structures 152 can be formed in the channel region 41.

[0032] In some embodiments, the dividing structure 112 comprises a suitable material with sufficient rigidity and strength to be used as an etch mask for forming the slit structure prior to the formation of the second source structure. The material of the dividing structure 112 can also withstand a gate replacement process for forming the conductor layers (e.g., 127-129) and conductor portions (e.g., 127-0 and 128-0). In some embodiments, the dividing structure 112 comprises one or more of silicon oxide, silicon nitride, and / or silicon oxynitride. In some embodiments, the dividing structure 112 and the cutting structure 111 may comprise the same material, such as silicon oxide. In some embodiments, the conductor portions (e.g., 127-0 and 128-0) and the insulating portion 104-0 may comprise the same material as the respective conductor layers (e.g., 127 and 128) and insulating layers 104 at the same height in adjacent block regions 21 (or memory blocks). In some embodiments, the bottom surface of the dividing structure 112 is between the top and bottom surfaces of the uppermost insulating layer 104. In some embodiments, the depth of the dividing structure 112 and the depth of the cutting structure 111 may be the same along the z-axis, for example, from the top surface of the dielectric cap layer 145 to the same height in the uppermost insulating layer 104 .

[0033] The width of the dividing structure 112 along the y-direction may be equal to or greater than the width of the second source structure along the y-direction. FIG. 13B shows an enlarged plan view 1320 of the dividing structure 112, the adjacent source contact 125, and the adjacent insulating structure 136. As shown in FIG. 13B, the width d2 of the dividing structure 112 along the y-direction is equal to or greater than the width d1 of the second source structure (or insulating structure 136) along the y-direction. In some embodiments, d2 is greater than d1. In some embodiments, d2 being greater than d1 prevents the support structure 152 (or the alternating conductor portions (e.g., 127-0 and 128-0) and insulating portion 104-0) from being disconnected from adjacent memory blocks. Details are described below.

[0034] 3D memory device 150 may be part of a monolithic 3D memory device. The term "monolithic" means that the components of the 3D memory device (e.g., peripheral devices and memory array devices) are formed on a single substrate. For monolithic 3D memory devices, fabrication faces additional constraints due to the overlap of peripheral device processing and memory array device processing. For example, fabrication of memory array devices (e.g., NAND channel structures) is constrained by the thermal budget associated with peripheral devices formed or to be formed on the same substrate.

[0035] Alternatively, 3D memory device 150 may be part of a non-monolithic 3D memory device in which components (e.g., peripheral devices and memory array devices) may be formed separately on different substrates and then bonded, for example, in a face-to-face manner. In some embodiments, the memory array device substrate (e.g., substrate 102) remains as the substrate of the bonded non-monolithic 3D memory device, and the peripheral devices (e.g., including any appropriate digital, analog, and / or mixed-signal peripheral circuitry used to facilitate processing of 3D memory device 150, such as page buffers, decoders, and latches, not shown) are flipped over and oriented toward the memory array devices (e.g., NAND memory strings) for hybrid bonding. It is understood that in some embodiments, the memory array device substrate (e.g., substrate 100) is flipped over and oriented toward the peripheral devices (not shown) for hybrid bonding, such that the memory array devices are above the peripheral devices in the bonded non-monolithic 3D memory device. The memory array device substrate (e.g., substrate 100) can be a thinned substrate (not a bonded non-monolithic 3D memory device substrate), and the back-end line (BEOL) interconnects of the non-monolithic 3D memory device can be formed on the back side of the thinned memory array device substrate.

[0036] According to some embodiments, Figures 2-4, 7, and 9-12 illustrate a fabrication process for forming a 3D memory device 150, and Figure 14A illustrates a flow chart 1400 of the fabrication process.

[0037] At the start of the process, a stack structure of alternating initial insulating layers and initial sacrificial layers is formed (step 1402). Figures 2A-2D show the corresponding structure 200.

[0038] As shown in FIGS. 2A-2D , a stack structure 11 having a dielectric stack of alternating initial insulating layers 104i and initial sacrificial layers 103i is formed over the substrate 100. The initial sacrificial layers 103i may be used for subsequent formation of the control conductor layer 127. The stack structure 11 may also include a top initial sacrificial layer 106i and a bottom initial sacrificial layer 105i for subsequent formation of the top conductor layer 129 and the bottom conductor layer 128, respectively. In some embodiments, the stack structure 11 includes a dielectric cap layer 145 over the initial sacrificial layers (e.g., 103i, 105i, and 106i) and the initial insulating layers 104i. The 3D memory device 150 may include a core region 31 for forming the channel structure 140 and support pillars (not shown), and a stair region 32 for forming the stair and contact plugs (e.g., 131) in the stair. The core region 31 may include a channel region 41 for forming the channel structure 140. In some embodiments, the channel region 41 may be between the first source regions 23. Subsequently, one or more second source regions 22 may be formed between the first source regions 23, and the block regions 21 may be located between the first source region 23 and the second source region 22 or between the second source regions 22, respectively.

[0039] The stack structure 11 may have a staircase structure, as shown in FIG. 2D . The staircase structure may be formed by repeatedly etching a material stack comprising multiple alternating sacrificial and insulating material layers using an etch mask, such as a patterned PR layer across the material stack. The alternating sacrificial and insulating material layers may be formed by alternately depositing layers of sacrificial material and layers of insulating material over a buffer oxide layer 101 until the desired number of layers is reached. In some embodiments, a sacrificial material layer is deposited over the buffer oxide layer 101, an insulating material layer is deposited over the sacrificial material layer, and so on. The sacrificial and insulating material layers may have the same or different thicknesses. In some embodiments, the sacrificial material layer and the underlying insulating material layer are referred to as a dielectric pair 107. In some embodiments, one or more dielectric pairs 107 may form a single level / step. During the formation of the staircase structure, the PR layer is undercut (e.g., etched inward, often in a stepwise fashion from the boundary of the material stack, from all directions) and used as an etch mask to etch exposed portions of the material stack. The amount of PR removed can be directly related to (e.g., can be a determining factor for) the dimensions of the steps. The removal of the PR layer can be achieved using a suitable etch, such as an isotropic dry etch, e.g., a wet etch. One or more PR layers can be sequentially formed and removed to form the step structure. Each dielectric pair 107 can be etched after the removal of the PR layer using a suitable etchant to remove a portion of both the sacrificial material layer and the underlying insulating material layer. The etched sacrificial and insulating material layers can form initial sacrificial layers (e.g., 103i, 105i, and 106i) and initial insulating layer 104i. The PR layer can then be removed.

[0040] The insulating material layer and the sacrificial material layer may have different etch selectivities during a subsequent gate exchange process. In some embodiments, the insulating material layer and the sacrificial material layer comprise different materials. In some embodiments, the insulating material layer comprises silicon oxide, and deposition of the insulating material layer comprises one or more of chemical vapor deposition (CVD), atomic layer deposition (ALD), physical vapor deposition (PVD), and sputtering. In some embodiments, the sacrificial material layer comprises silicon nitride, and deposition of the insulating material layer comprises one or more of CVD, PVD, ALD, and sputtering. In some embodiments, etching the sacrificial material layer and the insulating material layer comprises one or more suitable anisotropic etching processes, such as, for example, dry etching.

[0041] Referring back to Figure 14A, a plurality of support openings are formed in a lateral alignment, with the support openings having a length less than the length of the source structure (step 1404). Optionally, cutting openings are formed in a lateral alignment. Figures 3A-3D show a corresponding structure 300.

[0042] As shown in FIGS. 3A-3D , at least one support opening 109 is formed in the second source region 22. In some embodiments, multiple support openings 109 are formed in each second source region 22 along the x direction, spaced apart from one another. Along the x direction, the length of the support opening 109 may be smaller than the length of the second source structure to be formed (or the length of the second source region 22, or the length of the slit structure in which the second source structure is formed). The multiple support openings 109 may have the same or different dimensions. In some embodiments, the multiple support openings 109 may have the same shape and dimensions along the xy plane and the same depth along the z direction. Along the y direction, the width of the support opening 109 may be equal to or greater than the width of the second source region 22. In some embodiments, the bottom surface of the support opening 109 may be between the top surface and the bottom surface of the uppermost initial insulating layer 104i (e.g., the initial insulating layer 104i below the uppermost initial sacrificial layer 106i). A suitable patterning process, for example an etching process such as dry etching and / or wet etching, may be performed to form the support openings 109.

[0043] In some embodiments, one or more cut openings 108 extending along the x-direction may be formed by the same patterning / etching process that forms the support opening 110. Along the x-direction, the length of the cut opening 108 may be the same as the length of the channel region 41 (e.g., or core region 31) along the x-direction. One or more cut openings 108 may be formed in one block region 21, for example, depending on the number of memory fingers to be formed in the memory block. In some embodiments, the bottom surface of the cut opening 108 may be between the top surface and the bottom surface of the uppermost initial insulating layer 104i (e.g., the initial insulating layer 104i below the uppermost initial sacrificial layer 106i). In some embodiments, the depth of the support opening 109 is the same as the depth of the cut opening 108 along the vertical direction, for example, the bottom surfaces of the support opening 109 and the cut opening 108 are at the same altitude as the uppermost initial insulating layer 104i.

[0044] Referring back to Figure 14A, the support openings are filled with a dielectric material to form dividing structures connecting adjacent block regions (step 1406). Optionally, any cut openings are filled with a dielectric material to form cutting structures in each block region. Figures 4A-4D show the corresponding structure 400.

[0045] As shown in FIGS. 4A-4D , the support opening 109 can be filled with a suitable material to form the dividing structure 112. The dividing structure 112 can have sufficient rigidity and strength to function as an etch mask for the formation of the slit structure prior to the formation of the second source structure. The dividing structure 112 can also withstand a gate replacement process for the formation of the conductor layer (e.g., 127-129) and conductor portions (e.g., 127-0 and 128-0). In some embodiments, the dividing structure 112 can comprise a different material than the sacrificial layer such that it experiences little or no damage during the gate replacement process in which the sacrificial layer is etched away. In some embodiments, the dividing structure 112 comprises one or more of silicon oxide, silicon nitride, and / or silicon oxynitride. The dividing structure 112 can be deposited by a suitable deposition process, such as CVD, ALD, PVD, sputtering, or a combination thereof. Optionally, the cut opening 108 can be filled with the same material as filling the support opening 109 using the same deposition process. Cutting structures 111 may be formed that extend along the x-direction.

[0046] Referring back to Figure 14A, a plurality of channel structures are formed (step 1408). Figures 7A and 7B show the corresponding structure 700.

[0047] As shown in FIGS. 7A and 7B , multiple channel structures 140 can be formed in the channel region 41, for example, in each block region 21. Multiple channel holes extending vertically through the stack structure 11 can be formed. In some embodiments, the multiple channel holes are formed through alternating initial sacrificial layers (e.g., 103i, 105i, and 106i) and initial insulating layers 104i. The multiple channel holes can be formed by performing an anisotropic etching process using an etching mask, such as a patterned PR layer, to remove portions of the stack structure 11 and expose the substrate 100. In some embodiments, at least one channel hole is formed on each side of the dividing structure 112 along the y-direction. In some embodiments, multiple channel holes are formed in each block region 21. A recess region can be formed at the bottom of each channel hole to expose a top portion of the substrate 100 by the same etching process that forms the channel holes above the substrate 100 and / or by a separate recess etching process. In some embodiments, a semiconductor plug is formed at the bottom of each channel hole, for example, over the recess region. The semiconductor plug may be formed by an epitaxial growth process and / or a deposition process. In some embodiments, the semiconductor plug is formed by epitaxial growth and is referred to as epitaxial portion 115. Optionally, recess etching (e.g., dry etching and / or wet etching) may be performed to remove excess semiconductor material on the sidewalls of the channel holes and / or to control the top surface of epitaxial portion 115 at desired locations. In some embodiments, the top surface of epitaxial portion 115 is located between the top surface and bottom surface of the lowest initial insulating layer 104i.

[0048] In some embodiments, the channel hole is formed by performing a suitable etching process, such as, for example, an anisotropic etching process (e.g., dry etching) and / or an isotropic etching process (wet etching). In some embodiments, the epitaxial portion 115 comprises monocrystalline silicon formed by epitaxial growth from the substrate 100. In some embodiments, the epitaxial portion 115 comprises polysilicon formed by a deposition process. The formation of the epitaxially grown epitaxial portion 115 may include, but is not limited to, vapor phase epitaxy (VPE), liquid phase epitaxy (LPE), molecular beam epitaxy (MPE), or any combination thereof. The formation of the deposited epitaxial portion 115 may include, but is not limited to, CVD, PVD, and / or ALD.

[0049] In some embodiments, the semiconductor channel 119 is formed over and in contact with the epitaxial portion 115 in the channel hole. The semiconductor channel may comprise a channel-forming structure having a memory film 116 (e.g., including a blocking layer, a memory layer, and a tunnel layer), a semiconductor layer 117 formed above and connecting with the epitaxial portion 115, and a dielectric core 118 filling the remainder of the channel hole. In some embodiments, the memory film 116 is first deposited to cover the sidewalls of the channel hole and the top surface of the epitaxial portion 115, and then the semiconductor layer 117 is deposited over the memory film 116 and above the epitaxial portion 115. The blocking layer, memory layer, and tunnel layer may then be deposited in this order using one or more thin film deposition processes, such as ALD, CVD, PVD, any other suitable process, or any combination thereof, to form the memory film 116. A semiconductor layer 117 may then be deposited on the tunnel layer using one or more thin film deposition processes, such as ALD, CVD, PVD, any other suitable process, or any combination thereof. In some embodiments, a dielectric core 118 is filled in the remaining space of the channel hole by depositing a dielectric material, such as silicon oxide, after deposition of the semiconductor layer 117.

[0050] In some embodiments, a drain structure 120 is formed in the upper portion of each channel hole. In some embodiments, a portion of the memory film 116, the semiconductor layer 117, and the dielectric core 118 on the top surface of the stack structure 11 and in the upper portion of each channel hole may be removed by CMP, grinding, wet etching, and / or dry etching to form a recess in the upper portion of the channel hole so that the top surface of the semiconductor channel may be between the top and bottom surfaces of the dielectric cap layer 105. Next, the drain structure 120 may be formed by depositing a conductive material, such as a metal, into the recess by one or more thin film deposition processes, such as CVD, PVD, ALD, electroplating, chemical plating, or any combination thereof, thereby forming the channel structure 140. Subsequently, multiple memory cells may be formed by the intersection of the semiconductor channel 119 and the control conductor layer 127. Optionally, a planarization process, such as dry / wet etching and / or CMP, is performed to remove excess material on the top surface of the stack structure 11.

[0051] Referring back to Figure 14A, the multiple dividing structures can be used as an etch mask to form a slit structure with multiple slit openings divided by the multiple dividing structures (step 1410). Figures 9A-9E show the corresponding structure 900.

[0052] As shown in FIGS. 9A to 9E , a slit structure 123 having multiple slit openings may be formed in the second source region 22 extending along the x-direction. Along the x-direction, adjacent slit openings may be separated by a dividing structure 112 and the remaining portions of the stack structure 11 covered by the dividing structure 112. The slit openings may extend vertically through the stack structure 11, exposing the substrate 100. The patterned / etched initial sacrificial layer forms multiple sacrificial layers in the block region 21 and multiple sacrificial portions covered by the dividing structure 112 below. Each sacrificial portion may contact, e.g., be connected to, a sacrificial layer of the same height in an adjacent block region 21 along the y-direction. The patterned / etched initial insulating layer forms multiple insulating layers 104 in the block region 21 and multiple insulating portions 104-0 covered by the dividing structure 112 below. Each insulating portion 104-0 may contact, e.g., be connected to, an insulating layer 104 of the same height in an adjacent block region 21 along the y direction. Multiple insulating portions 104-0 and multiple sacrificial portions extending from under each dividing structure 112 to the substrate 100 may be alternated with one another.

[0053] The width of the dividing structure 112 along the y direction may be equal to or greater than the width of each slit structure 123 (e.g., adjacent slit openings) along the y direction. FIG. 13A shows an enlarged plan view 1310 of the dividing structure 112 and adjacent slit openings. As shown in FIG. 13A , the width d2 of the dividing structure 112 along the y direction is equal to or greater than the width d1 of the slit structure 123 along the y direction. In some embodiments, d2 is greater than d1. In some embodiments, d2 being greater than d1 prevents the alternating sacrificial and insulating portions 104-0 from being disconnected from adjacent block regions 21 during the formation of the slit structures 123. That is, the dividing structure 112 can keep adjacent memory blocks connected through the alternating sacrificial and insulating portions 104-0 during the formation of the slit structures 123. In some embodiments, the dividing structure 112 is used as an etching mask, and an anisotropic etching process, e.g., dry etching, is performed to remove portions of the stack structure 11 in the second source region 22 to form the slit structure 123. The remaining portions of the stack structure 11 in the second source region 22 may form alternating sacrificial and insulating portions. The dividing structure 112 and the underlying alternating sacrificial and insulating portions 104-0 may form an initial support structure.

[0054] 9A-9E , in some embodiments, one or more other slit structures 124 may be formed in the first source region 23 by the same patterning / etching process that forms the slit opening of the slit structure 123. For example, each other slit structure 124 having a single slit opening may extend through the stack structure 11 along the x-direction to expose the substrate 100. In some embodiments, the other slit structures 124 may extend in the core region 31 and the staircase region 32.

[0055] Referring back to Figure 14A, a plurality of conductor layers, a plurality of memory blocks, and a plurality of support structures connecting adjacent memory blocks are formed (step 1412). Figures 9A-9E show the corresponding structures.

[0056] As shown in Figures 9A-9E, the sacrificial layer in the block region 21 and the sacrificial portions in the second source region 22 can be removed to form multiple lateral recesses, and a suitable conductive material can be deposited to fill the lateral recesses, forming multiple conductor layers (e.g., 127-129) in the block region 21 and multiple conductor portions (e.g., 127-0 and 128-0) in the second source region 22. A support structure 152 can be formed having the dividing structure 112, underlying alternating conductor portions (e.g., 127-0 and 128-0), and insulating portion 104-0. The control conductor layer 127 can intersect the semiconductor channel 119 to form multiple memory cells in each block region 21 that form a memory block. In some embodiments, the top sacrificial layer in the block region 21 can form the top conductor layer 129, and the bottom sacrificial layer in the block region 21 can form the bottom conductor layer 128. In some embodiments, the initial support structure may form support structure 152 .

[0057] The conductive material may include one or more of tungsten, aluminum, copper, cobalt, silicide, and polysilicon. A suitable isotropic etching process, such as wet etching, may be performed to remove the sacrificial layer and portions and to form the lateral recesses. A suitable deposition process, such as CVD, PVD, ALD, and / or sputtering, may be performed to deposit conductive material into the lateral recesses to form conductive layers (e.g., 127-129) and conductive portions (e.g., 127-0 and 128-0).

[0058] Referring back to Figure 14A, a source structure is formed in each slit structure (step 1414). Figures 10A-10E show the corresponding structure 1000.

[0059] As shown in FIGS. 10A-10E , an insulating structure 136 can be formed at each slit opening of the slit structures 123, and a source contact 125 can be formed at each insulating structure 136. The insulating structure 136 and the source contact 125 at each second source region 22 can form a second source structure. An insulating structure 137 can be formed at each other slit structure 124, and a source contact 126 can be formed at each other slit structure 124. The insulating structure 137 and each source contact 126 can form a first source structure. Support structure 152 can separate adjacent source contacts 125 and insulating structures 136 along the x-axis and can connect adjacent memory blocks along the y-direction. In some embodiments, insulating structures 136 and 137 comprise silicon oxide and are deposited by one or more of CVD, PVD, ALD, and sputtering. A recess etch may be performed to remove a portion of insulating structures 136 and 137 at the bottom of each slit structure to expose substrate 100. In some embodiments, source contacts 125 and 126 each comprise one or more of tungsten, aluminum, copper, cobalt, silicide, and polysilicon, and a suitable deposition process, such as one or more of VD, PVD, ALD, and sputtering, is performed to deposit source contacts 125 and 126 into each slit structure.

[0060] 14A, an insulator is formed in the staircase region, and one or more contact plugs are formed in the insulator to contact the conductor layer (step 1416). Figures 11 and 12 show corresponding structures 1100 and 1200.

[0061] As shown in FIGS. 11 and 12 , an insulator 130 may be formed in the staircase region 32 to cover the staircases (e.g., conductor layers 127-129) and insulate contact plugs 131 from one another. One or more contact plugs 131 are formed in the insulator 130 to contact the conductor layers 127-129 and form conductive connections. In some embodiments, the insulator 130 comprises silicon oxide and is deposited by one or more of CVD, PVD, ALD, and sputtering. A suitable anisotropic etching process, such as dry etching, may be performed to form one or more plug openings through the insulator 130 and expose one or more conductor layers (e.g., 127, 128, and / or 129). A suitable conductive material, such as tungsten, is deposited to fill the plug openings. In some embodiments, at least one contact plug is formed in one of the conductor layers (e.g., 127, 128, and / or 129). Optionally, a planarization process, such as CMP and / or recess etching, is performed over the stack structure 11 to remove any excess material, such as from the formation of various structures.

[0062] According to some embodiments, Figures 2, 5, 6, and 8-12 illustrate another fabrication process for forming a 3D memory device 150, and Figure 14B illustrates a fabrication process flow diagram 1450. Unlike the fabrication process illustrated in Figures 2-4, 7, and 9-12, one or more initial division structures are formed and etched to form one or more division structures. For ease of illustration, the same or similar steps illustrated in Figures 2-4, 7, and 9-12 will not be described again.

[0063] At the start of the process, a stack structure of alternating initial insulating layers and initial sacrificial layers is formed (step 1452). Figures 2A-2D show the corresponding structure 200. A description of the fabrication process and structure 200 can be found in the description of step 1402 and will not be repeated here.

[0064] Referring back to Figure 14B, a plurality of laterally extending support openings can be formed, with the support openings having a length equal to the length of the source structure (step 1454). Optionally, laterally extending cut openings are formed. Figures 5A-5C show a corresponding structure 500.

[0065] As shown in FIGS. 5A-5C , support openings 110 are formed in the second source regions 22. Along the x direction, the length of the support openings 110 may be equal to the length of the second source structure to be formed (or the length of the second source regions 22, or the length of the slit structure in which the second source structure is formed). Along the y direction, the width of the support openings 109 may be equal to or greater than the width of the second source regions 22. In some embodiments, the bottom surface of the support openings 110 may be between the top and bottom surfaces of the first initial insulating layer 104i (e.g., the initial insulating layer 104i) below the top initial sacrificial layer 106i. Optionally, one or more cutting openings 108 are formed in the block region 21. The fabrication of the support openings 110 and any cutting openings 108 may refer to the fabrication of the support openings 109 and cutting openings 108 depicted in FIGS. 3A-3D , and will not be repeated here. In some embodiments, the depth of the support opening 110 is the same as the depth of the cut opening 108 along the vertical direction, for example, the bottom surfaces of the support opening 110 and the cut opening 108 are at the same elevation as the top initial insulating layer 104i.

[0066] Referring back to Figure 14B, the support openings are filled with a dielectric material to form initial division structures connecting adjacent block regions (step 1456). Optionally, any cut openings are filled with a dielectric material to form cut structures in the block regions. Figures 6A-6C show a corresponding structure 600.

[0067] As shown in FIGS. 6A-6C, a dielectric material may be deposited to fill the support openings 110 and form initial dividing structures 113. In some embodiments, the initial dividing structures 113 are positioned between adjacent block regions 21. In some embodiments, the length of the initial dividing structures 113 is equal to the length of the second source structure or the slit structure to be formed. Any cutting openings may be filled with the dielectric material to form cutting structures 111 in the respective block regions. The deposition of the dielectric material to form the initial dividing structures 113 and any cutting structures 111 may refer to the formation of the dividing structures 112 and cutting structures 111 depicted in FIGS. 4A-4C and will not be repeated here.

[0068] Referring back to Figure 14B, a plurality of channel structures may be formed (step 1458). Figures 8A and 8B show a corresponding structure 800.

[0069] 8A and 8B, a plurality of channel structures 140 can be formed in the channel region 41. In some embodiments, at least one channel structure 140 is formed on each side of the initial dividing structure 113 along the y direction. In some embodiments, a plurality of channel structures 140 are formed in each block region 21. The formation of the channel structures 140 can refer to the formation of the channel structures 140 depicted in FIGS. 7A and 7B, and will not be repeated here.

[0070] Referring back to Figure 14B, an initial support structure having a split structure is formed (step 1460). Portions of the initial split structure can be removed to form the split structures, and the split structures can be used as an etch mask to remove portions of the stack structure and to form the initial support structure. Figures 9A-9E show the corresponding structure 900.

[0071] As shown in FIGS. 9A-9E , portions of the initial dividing structure 113 can be removed to form one or more dividing structures 112 arranged along the x-direction and expose portions of the stack structure 11. In some embodiments, the top initial insulating layer 104i is exposed. The dividing structure 112 can be used as an etching mask to remove portions of the stack structure 11 exposed in the second source regions 22 to form a slit structure 123 with multiple unconnected slit openings that expose the substrate 100. The initial dividing structure 113 and the stack structure 11 can be patterned / etched using the same patterning / etching process or different patterning / etching processes. For example, the initial dividing structure 113 can be first patterned to form the dividing structure 112, and a different etching process can be performed to remove the exposed portions of the stack structure 11 and form the slit openings of the slit structure 123 and one or more initial support structures. Alternatively, the initial dividing structure 113 and a portion of the stack structure 11 below the initial dividing structure 113 may be patterned using the same etching process to form the slit openings of the slit structure 123 and one or more initial support structures. In some embodiments, the initial dividing structure 113 and the stack structure 11 are patterned using the same etching process to reduce the steps and time of the patterning process. The initial dividing structure 113 and the stack structure 11 may be patterned / etched using one or more appropriate etching processes, such as dry etching and / or wet etching. For details of the initial support structure, please refer to the description of the initial support structure depicted in Figures 9A to 9E of the flowchart 1400, and will not be repeated here.

[0072] Referring back to FIG. 14B, multiple conductor layers, multiple memory blocks, and support structures are formed (step 1462), and source structures are formed in each slit structure (step 1464). Insulator and contact plugs are formed in the staircase regions (step 1466). FIGS. 9-12 show corresponding structures 900-1200. A detailed description of steps 1462-1466 can be found in the description of steps 1412-1416 and will not be repeated here.

[0073] In some embodiments, the 3D memory device includes a memory stack having alternating conductive layers and insulating layers extending laterally in the memory stack. The 3D memory device also includes a plurality of channel structures extending vertically through the memory stack to a substrate, the channel structures and the conductive layers intersecting each other to form a plurality of memory cells. The 3D memory device further includes at least one slit structure extending vertically and laterally in the memory stack, dividing the plurality of memory cells into at least one memory block, each slit structure including a plurality of slit openings and a support structure between adjacent slit openings. The support structure contacts adjacent memory blocks and contacts the substrate. The 3D memory device further includes a source structure having an insulating spacer at each of the plurality of slit openings and a source contact at each insulating spacer.

[0074] In some embodiments, the support structures extend vertically through the memory stack to the substrate and are insulated from adjacent source contacts by their respective insulating spacers.

[0075] In some embodiments, the support structure includes a dividing structure across the alternating conductive portions and insulating portions. The dividing structure can extend laterally to connect to adjacent memory blocks and extend vertically to the first insulating layer of the memory stack. The alternating conductive portions and insulating portions each contact a corresponding conductive layer and corresponding insulating layer at the same elevation from the adjacent memory blocks.

[0076] In some embodiments, along another lateral direction perpendicular to the lateral direction along which at least one slit structure extends, the width of the dividing structure is equal to or greater than the width of each of the adjacent slit openings.

[0077] In some embodiments, the dividing structure comprises at least one of silicon oxide, silicon nitride, or silicon oxynitride.

[0078] In some embodiments, the plurality of conductive portions comprises at least one of tungsten, aluminum, copper, cobalt, silicide, or polysilicon, and the plurality of insulating portions comprises at least one of silicon oxide, silicon nitride, or silicon oxynitride.

[0079] In some embodiments, the plurality of conductive portions and the conductive layer of adjacent memory blocks are made from the same material, and the plurality of insulating portions and the insulating layer of adjacent memory blocks are made from the same material.

[0080] In some embodiments, the source contacts each comprise at least one of tungsten, aluminum, copper, cobalt, silicide, or polysilicon.

[0081] In some embodiments, the 3D memory device further comprises cutting structures extending laterally and vertically parallel to the slit structures in the at least one memory block and dividing the at least one memory block into a plurality of memory fingers.

[0082] In some embodiments, the cutting structure extends vertically into the first insulating layer of the memory stack and comprises at least one of silicon oxide, silicon nitride, or silicon oxynitride. The depth of the cutting structure can be the same as the depth of the splitting structure.

[0083] In some embodiments, the plurality of channel structures each comprise an epitaxial portion, a semiconductor channel, and a drain structure, wherein the epitaxial portion is conductively connected to the substrate, the semiconductor channel is conductively connected to the epitaxial portion and the dielectric cap layer, and the drain structure is conductively connected to the semiconductor channel.

[0084] In some embodiments, the top surface of the semiconductor channel is between the top and bottom surfaces of the dielectric cap layer across the alternating conductive and insulating layers, the top surface of the epitaxial portion is between the top and bottom surfaces of the lowest insulating layer, and the semiconductor channel comprises a blocking layer, a memory layer, a tunnel layer, a semiconductor layer, and a dielectric core disposed inward from the sidewalls of the semiconductor channel toward the center.

[0085] In some embodiments, a method for forming a 3D memory device includes forming a dielectric stack over a substrate, the dielectric stack including alternating initial insulating layers and initial sacrificial layers, and forming at least one slit structure extending vertically and laterally in the dielectric stack to divide the dielectric stack into a plurality of block regions. Each of the at least one slit structure includes a plurality of slit openings exposing the substrate and an initial support structure between adjacent slit openings. Each of the plurality of block regions may include alternating insulating layers and sacrificial layers, and the initial support structure may include alternating insulating portions and sacrificial portions. Each of the plurality of insulating portions and sacrificial portions may contact a respective insulating layer and sacrificial layer at the same height from an adjacent block region. In some embodiments, the method also includes forming a plurality of channel structures extending vertically through the dielectric stack, replacing the plurality of sacrificial layers and sacrificial portions with a plurality of conductor layers and conductor portions through the at least one slit structure, and forming a source structure in each slit structure. The source structure may comprise an insulating spacer at each of the plurality of slit openings and a source contact at each insulating spacer.

[0086] In some embodiments, forming the at least one slit structure includes patterning the dielectric stack to form support openings along a lateral direction in which each slit structure extends. The length of the support openings can be smaller than the length of the slit structures along the lateral direction. The bottom of the support openings can be between the top and bottom surfaces of the first initial insulating layer of the dielectric stack. Forming the at least one slit structure also includes depositing a dielectric material to fill the support openings and form dividing structures.

[0087] In some embodiments, forming the at least one slit structure includes removing a portion of the dielectric stack adjacent to the dividing structure along a lateral direction to form a pair of slit openings that expose the substrate. A width of each of the pair of slit openings may be less than or equal to a width of the dividing structure along another lateral direction perpendicular to the lateral direction. In some embodiments, the dividing structure and the remaining alternating sacrificial and insulating portions below the dividing structure form an initial support structure.

[0088] In some embodiments, removing the portion of the dielectric stack comprises etching the portion of the dielectric stack adjacent the dividing structure, using the dividing structure as an etch mask to preserve alternating sacrificial and insulating portions underneath the dividing structure.

[0089] In some embodiments, forming the plurality of channel structures includes forming at least one channel structure on either side of the dividing structure along another lateral direction.

[0090] In some embodiments, forming the at least one slit structure includes patterning the dielectric stack to form support openings along a lateral direction in which each slit structure extends. The length of the support openings may be equal to the length of the slit structure along the lateral direction. The bottom of the support openings may be between the top and bottom surfaces of the first initial insulating layer of the dielectric stack. In some embodiments, forming the at least one slit structure also includes depositing a dielectric material to fill the support openings and form the initial dividing structure.

[0091] In some embodiments, forming at least one slit structure further includes removing a pair of second portions adjacent to a first portion along a lateral direction of the initial dividing structure to expose a portion of the dielectric stack below the second portions. In some embodiments, forming at least one slit structure also includes removing the exposed portion of the dielectric stack to expose the substrate and to form a pair of slit openings. The width of each of the pair of slit openings may be equal to or less than the width of the initial dividing structure along another lateral direction perpendicular to the lateral direction. The remaining first portion of the initial dividing structure may form the dividing structure. The dividing structure and the remaining alternating sacrificial and insulating portions below the dividing structure may form the initial supporting structure.

[0092] In some embodiments, removing the exposed portions of the dielectric stack comprises etching portions of the dielectric stack adjacent the dividing structure, using the dividing structure as an etch mask to preserve alternating conductive and insulating portions underneath the dividing structure.

[0093] In some embodiments, forming the plurality of channel structures includes forming at least one channel structure on either side of the initial dividing structure along another lateral direction.

[0094] In some embodiments, replacing the sacrificial layers and sacrificial portions with the conductor layers and conductor portions through the at least one slit structure includes removing the sacrificial portions of the initial support structure and the sacrificial layers of the block regions in the same etching process to form the lateral recesses. Replacing the sacrificial layers and sacrificial portions may also include depositing a conductor material into the lateral recesses in the same deposition process. The conductor layers and the channel structures can form memory cells. The block regions can form memory blocks. The dividing structure and underlying alternating conductor and insulating portions can form a support structure.

[0095] In some embodiments, the method further includes forming a cutting structure in at least one of the plurality of block regions, the cutting structure extending parallel to the at least one slit structure and dividing at least one of the plurality of memory blocks into a plurality of memory fingers.

[0096] In some embodiments, forming the cutting structure includes forming a cutting opening in at least one of the plurality of block regions in the same patterning step as forming the support opening. The cutting opening can extend parallel to the at least one slit structure. A bottom surface of the cutting opening can be between a top surface and a bottom surface of the first initial insulating layer. In some embodiments, forming the cutting structure also includes depositing a dielectric material to fill the cutting opening in the same deposition step as filling the support opening to form the cutting structure.

[0097] In some embodiments, forming the plurality of channel structures includes forming a plurality of channel holes extending vertically from the dielectric cap layer across the dielectric stack to the substrate, and forming an epitaxial portion in each of the plurality of channel holes. The epitaxial portion may be conductively connected to the substrate. In some embodiments, forming the plurality of channel structures also includes forming a semiconductor channel over the epitaxial portion and forming a drain structure over the semiconductor channel. The drain structure may be conductively connected to the semiconductor channel. The semiconductor may be conductively connected to the epitaxial portion.

[0098] In some embodiments, a method for forming a 3D memory device includes forming a dielectric stack of alternating initial insulating layers and initial sacrificial layers over a substrate; forming a dielectric structure extending laterally in the dielectric stack, the dielectric structure extending vertically into a first initial insulating layer; and patterning the dielectric stack using the dielectric structure as an etch mask to form slit structures extending vertically and laterally in the dielectric stack and dividing the dielectric stack into pairs of block regions. The slit structures may include a plurality of slit openings exposing the substrate and a plurality of initial support structures between adjacent slit openings. Each of the plurality of block regions may include alternating insulating layers and sacrificial layers, and each of the plurality of initial support structures may include alternating insulating portions and sacrificial portions. Each of the plurality of insulating portions and sacrificial portions may contact a respective insulating layer and sacrificial layer at the same height from an adjacent block region. The method may also include forming a plurality of channel structures extending vertically through the dielectric stack, replacing the plurality of sacrificial layers and sacrificial portions with a plurality of conductor layers and conductor portions through at least one slit structure, and forming a source structure in each slit structure, the source structure may include an insulating spacer at each of the plurality of slit openings and a source contact at each insulating spacer.

[0099] In some embodiments, the dielectric structure includes a plurality of segmented structures that are not connected to one another, and forming the dielectric structure includes patterning the dielectric stack to form a plurality of support openings along a lateral direction. A length of each of the plurality of support openings may be less than a length of the slit structure along the lateral direction. The plurality of support openings may be not connected to one another and may have a bottom surface between the top surface and the bottom surface of the first initial insulating layer. In some embodiments, forming the dielectric structure also includes depositing a dielectric material to fill the plurality of support openings to form the plurality of segmented structures.

[0100] In some embodiments, forming the at least one slit structure includes removing a portion of the dielectric stack adjacent each of the plurality of dividing structures along a lateral direction to form a plurality of slit openings, each of which may have a width equal to or less than a width of the dividing structure along another lateral direction perpendicular to the lateral direction. In some embodiments, forming the at least one slit structure also includes a dividing structure, with the remaining alternating sacrificial and insulating portions below the dividing structure forming the initial support structure.

[0101] In some embodiments, removing the portion of the dielectric stack comprises etching the portion of the dielectric stack adjacent the dividing structure, using the dividing structure as an etch mask to preserve alternating sacrificial and insulating portions underneath the dividing structure.

[0102] In some embodiments, forming the plurality of channel structures includes forming at least one channel structure on either side of the dielectric structure along another lateral direction.

[0103] In some embodiments, the dielectric structure comprises one initial dividing structure, and forming the dielectric structure includes patterning the dielectric stack to form a support opening extending along a lateral direction. The length of the support opening can be equal to the length of the slit structure along the lateral direction, and the bottom of the support opening can be between the top and bottom surfaces of the first initial insulating layer of the dielectric stack. In some embodiments, forming the dielectric structure also includes depositing a dielectric material to fill the support opening and form the initial dividing structure.

[0104] In some embodiments, forming at least one slit structure further includes removing a pair of second portions adjacent to a first portion along a lateral direction of the initial dividing structure to expose a portion of the dielectric stack below the second portions. In some embodiments, forming at least one slit structure also includes removing the exposed portion of the dielectric stack to expose the substrate and to form a pair of slit openings. The width of each of the pair of slit openings may be equal to or less than the width of the initial dividing structure along another lateral direction perpendicular to the lateral direction. The remaining first portion of the initial dividing structure may form the dividing structure. The dividing structure and the remaining alternating sacrificial and insulating portions below the dividing structure may form the initial supporting structure.

[0105] In some embodiments, removing the exposed portions of the dielectric stack comprises etching portions of the dielectric stack adjacent the dividing structure, using the dividing structure as an etch mask to preserve alternating conductive and insulating portions underneath the dividing structure.

[0106] In some embodiments, forming the plurality of channel structures includes forming at least one channel structure on either side of the initial dividing structure along another lateral direction.

[0107] In some embodiments, replacing the sacrificial layers and sacrificial portions with the conductor layers and conductor portions includes removing the sacrificial portions of the initial support structure and the sacrificial layers of the block regions in the same etching process to form the lateral recesses. In some embodiments, replacing the sacrificial layers and sacrificial portions with the conductor layers and conductor portions also includes depositing a conductor material into the lateral recesses in the same deposition process. The conductor layers and the channel structures can form memory cells. The block regions can form memory blocks. The dividing structure and underlying alternating conductor and insulating portions can form a support structure.

[0108] In some embodiments, the method further includes forming a cutting structure in at least one of the plurality of block regions, the cutting structure extending parallel to the at least one slit structure and dividing at least one of the plurality of memory blocks into a plurality of memory fingers.

[0109] In some embodiments, forming the cutting structure includes forming a cutting opening in at least one of the plurality of block regions in the same patterning step as forming the support opening. The cutting opening can extend parallel to the at least one slit structure, and a bottom surface of the cutting opening can be between the top surface and the bottom surface of the first initial insulating layer. In some embodiments, forming the cutting structure also includes depositing a dielectric material to fill the cutting opening in the same deposition step as filling the support opening to form the cutting structure.

[0110] In some embodiments, forming the plurality of channel structures includes forming a plurality of channel holes extending vertically from the dielectric cap layer across the dielectric stack to the substrate; forming an epitaxial portion in each of the plurality of channel holes, the epitaxial portion being conductively connected to the substrate; forming a semiconductor channel over the epitaxial portion, the semiconductor being conductively connected to the epitaxial portion; and forming a drain structure over the semiconductor channel, the drain structure being conductively connected to the semiconductor channel.

[0111] The foregoing description of specific embodiments clarifies the general nature of the present disclosure so that others, by applying the knowledge of those skilled in the art, may easily modify and / or adapt such specific embodiments for various applications without undue experimentation and without departing from the broad concepts of the present disclosure. As such, such adaptations and modifications are intended to be within the meaning and range of equivalents of the disclosed embodiments, based on the teaching and guidance provided herein. It is to be understood that the phrases or terms used herein are for purposes of description and not of limitation, as the terms or terms used herein will be understood by those skilled in the art in light of the teachings and guidance provided herein.

[0112] The embodiments of the present disclosure have been described above with the aid of functional building blocks illustrating the implementation of specific functions and relationships thereof. The boundaries of these functional building blocks have been arbitrarily defined herein for the convenience of description. Alternative boundaries may be defined so long as the specified functions and relationships are appropriately implemented.

[0113] The Summary and Abstract sections may set forth one or more example embodiments of the present disclosure that are not all contemplated by the inventors, and therefore are not intended to limit the present disclosure and the appended claims in any way.

[0114] The breadth and scope of the present disclosure should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents. [Explanation of symbols]

[0115] 11 Stack structure 21 Block Area 22 Second Source Region 23 First Source Region 31 Core Areas 32 Stairs area 41 Channel Region 100 boards 101 Buffer oxide layer 102 Circuit Board 103i Initial Sacrificial Layer 104 Insulating layer 104-0 Insulation part 104i Initial insulation layer 105 Dielectric Cap Layer 105i Lowest initial sacrifice layer 106i Top initial sacrifice layer 107 Dielectric Pair 108 Cutting opening 109, 110 Support opening 111 Cutting structure 112 Split structure 113 Initial split structure 115 Epitaxial part 116 Memory Film 117 Semiconductor layer 118 Dielectric Core 119 Semiconductor Channels 120 Drain structure 123, 124 Slit structure 125, 126 Source contacts 127 Control Conductor Layer 127-0, 128-0 Conductor part 128 Bottom conductor layer 129 Top conductor layer 130 Insulator 131 Contact plug 136, 137 Insulation structure 140 channel structure 145 Dielectric Cap Layer 150 3D memory devices 152 Support structure 200, 300, 400, 500, 600, 700, 800, 900, 1000, 1100, 1200 structure 1310 Enlarged floor plan 1320 Enlarged floor plan 1400 Flowchart 1450 Flowchart d1 Width of the second source structure d2 Width of the division structure

Claims

1. a stack comprising a first stack structure and a second stack structure deposited along a first direction, the first stack structure comprising at least one conductive layer and an insulating layer, and the second stack structure comprising alternating conductive and insulating layers; a channel structure extending through the first stack structure and the second stack structure along the first direction; first structures extending in the stack along the first direction and a second direction perpendicular to the first direction, one of the first structures comprising at least two portions arranged along the second direction; a dividing structure between two adjacent portions of the one of the first structures, the dividing structure extending along the first direction through the first stack structure and the second stack structure being on one side of the dividing structure along the first direction; cutting structures extending along a third direction perpendicular to the first and second directions between adjacent first structures and through a portion of the stack; A three-dimensional (3D) memory device comprising:

2. further comprising at least two of the divided structures arranged along the second direction; 10. The 3D memory device of claim 1, wherein each of at least two of the dividing structures is between two adjacent portions of one of the first structures.

3. further comprising at least two divided structures aligned along the third direction; one of the dividing structures is between two adjacent portions of the one of the first structures; 10. The 3D memory device of claim 1, wherein another of the dividing structures is between two adjacent portions of another of the second structures.

4. the one of the first structures comprises a source contact and an insulating spacer surrounding the source contact; 10. The 3D memory device of claim 1, wherein a portion of the insulating spacer is between the source contact and the dividing structure.

5. a substrate located on one side of the stack; The 3D memory device of claim 4 , wherein the source contact is connected to the substrate.

6. a conductive layer located on one side of the stack; 10. The 3D memory device of claim 1, wherein the channel structure comprises an epitaxial portion extending through and in contact with the conductive layer.

7. further comprising a core region and a step region arranged along the second direction; The 3D memory device of claim 1 , wherein the dividing structure is located in the core region.

8. The 3D memory device of claim 1 , wherein the dividing structure and the cutting structure comprise the same material.

9. 10. The 3D memory device of claim 1, wherein the dividing structure and the cutting structure comprise silicon oxide.

10. The 3D memory device of claim 1 , wherein a size of the dividing structure is smaller than a size of the first structure along the second direction.

11. further comprising a peripheral device coupled to the memory array device; 10. The 3D memory device of claim 1, wherein the memory array apparatus comprises the stack, the channel structure, the first structure, the dividing structure, and the cutting structure.

12. 2. The 3D memory device of claim 1, wherein along the third direction, a width of the dividing structure is equal to or greater than a width of one of two adjacent said portions of said one of said first structures.

13. 10. The 3D memory device of claim 1, further comprising a second structure extending through the stack along the first direction and the second direction.

14. 14. The 3D memory device of claim 13, wherein at least one of the first structures is between adjacent second structures along the third direction.

15. The 3D memory device of claim 6 , wherein the epitaxial portion comprises single crystal silicon.

16. 7. The 3D memory device of claim 6, wherein an end of the epitaxial portion extends into a substrate on one side of the conductive layer.

17. a stack comprising alternating conductive and insulating layers along a first direction, the stack comprising two portions; a channel structure extending through the stack along the first direction; first structures extending within the stack along the first direction and a second direction perpendicular to the first direction, one of the first structures comprising at least two portions disposed along the second direction; a connecting portion between two of the portions of the stack along a third direction perpendicular to the first direction and the second direction, the connecting portion being between two adjacent portions of the one of the first structures; and cutting structures extending through a portion of the stack along the first direction and between adjacent first structures along the third direction; Equipped with the connecting portion connects two of the portions of the stack; the one of the first structures comprises a source contact and an insulating spacer surrounding the source contact; A three-dimensional (3D) memory device, wherein a portion of the insulating spacer is between the source contact and the connecting portion.

18. a conductive layer located on one side of the stack along the first direction; 20. The 3D memory device of claim 17, wherein the channel structure comprises an epitaxial portion extending through and in contact with the conductive layer.

19. further comprising a dividing structure between two adjacent portions of said one of said first structures; the dividing structure extends through a portion of the stack along the first direction; The 3D memory device of claim 17 , wherein the dividing structure is located on one side of the connecting portion along the first direction.

20. a substrate located on one side of the stack; 20. The 3D memory device of claim 17, wherein the source contact is connected to the substrate.

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